201116945 六、發明說明： 【發明所屬之技術領域】 該發明係關於對例如光柵等之光罩用玻璃基板供給顯 像液而施予處理之顯像處理裝置。 【先前技術】 一般，例如，在半導體裝置或光柵等之基板之製程中 的光微影工程中，在基板上塗布光阻液而形成光阻膜之光 阻塗布處理、在對基板上之光阻膜執行特定之圖案之曝光 的曝光處理、對曝光處理後之基板上供給顯像液而顯像基 板上之光阻膜的顯像處理等。 在以往之該種顯像處理裝置中，因噴嘴頭執行顯像液 之吐出和吸引，故爲了防止所謂吐泡現象，所知的有顯像 處理裝置，該顯像處理裝置具備可與能夠旋轉之旋轉基台 一起旋轉，並且用以在包圍被保持於基板保持構件之基板 之外圍部的基板之表面的相同平面上，形成自基板表面上 連續的液膜的外周板例如助跑台；可對旋轉基台，相對性 升降移動，並且吸附基板而予以保持之基板保持台；和基 板保持台吸附保持基板，並且經密封構件使基板保持台與 外周板密接，並且基板保持台和旋轉基台密接而所形成之 液貯留空間；和朝向被保持於旋轉基台及基板保持台之基 板和液貯留空間供給洗淨液而執行液擴展的洗淨液供給噴 嘴（例如，參照專利文獻1 )。 然而，隨著近年來圖案之微細化，面對現實不久將來 201116945 會使用EUV (超紫外線）基板。該EUV基板相對於以往 之透過型基板在基板背面設置有導電膜（例如，CrN等） ，藉由靜電吸盤吸附背面。因此，可預想由於基板背面之 污染使得定位精度惡化或吸盤污染等。依此，EUV基板 對於背面之污染比起透過型基板非常弱。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2008- 1 7743 6號公報（申請專 利範圍、第1圖） 【發明內容】 [發明所欲解決之課題] 但是，在以往之該種顯像處理裝置中，因在將基板保 持水平之狀態下，於顯像處理前朝向基板和液貯留空間供 給洗淨液而執行液擴展，故不會除去基板之背面的空氣。 因此，有在基板背面殘留氣泡，其氣體則有成爲產生多數 微粒的原因之虞。 該發明係鑑於上述情形而硏究出，其課題爲提供除去 附著於顯像前處理（液擴展）時之基板背面的氣泡，以謀 求降低基板背面之微粒的顯像處理裝置。 [用以解決課題之手段] 爲了達成上述目的，申請專利範圍第1項所記載之發 -6- 201116945 明的特徵爲具備：將基板保持水平狀態之可旋轉的旋轉基 台；和使上述旋轉基台旋轉驅動的旋轉驅動機構；和可與 上述旋轉基台同時旋轉，並且包圍被保持於旋轉基台之基 板的外周部，用以在基板表面之相同平面上形成自基板表 面上連續之液膜的外周板；和 可對上述旋轉基台相對性升降移動，並且吸附保持基 板之同時，密接於上述旋轉基台和外周板而形成液貯留空 間的基板保持台；和朝向上述旋轉基台及被保持於基板保 持台之基板和液貯留空間，供給洗淨液而執行液擴展的洗 淨液供給噴嘴；和同時執行對被保持於上述基板保持台之 基板供給和吸引顯像液的噴嘴頭：和用以在可在上述旋轉 基台之上方移動之基板搬運臂之間執行基板之收授的可升 降之多數支撐銷；用以使上述多數支撐銷升降移動的升降 驅動機構；控制上述旋轉驅動機構和升降驅動機構的控制 手段， 在上述多數支撐銷中之至少一個支撐銷之上端部，形 成支撐水平狀態之基板之下面的第1支撐面，和支撐傾斜 狀態之基板之下端部的第2支撐面，藉由上述旋轉驅動機 構，形成可調整被保持於上述旋轉基台之基板之水平面上 之角度，根據來自上述控制手段之控制訊號，於在上述基 板搬運臂之間收授基板之時，使基板之角度成爲可在上述 支撐銷之第1支撐面將基板支撐成水平狀態之位置，於對 上述基板及液貯留空間內供給洗淨液或供給後，使成爲可 在上述第2支撐面支撐傾斜狀態之基板之下端部的位置， 201116945 並且在上述第2支撐面支撐基板之下端部的傾斜狀態下使 基板下降，除去附著於基板下面之氣泡。 藉由如此構成，於藉由升降驅動機構之驅動升降支撐 銷而在基板搬運臂之間收授基板之時，可以在支撐銷之第 1支撐面將基板支撐成水平狀態而執行基板之收授。再者 ，於對基板及液貯留空間內供給洗淨液之時或洗淨液供給 後，藉由旋轉驅動機構之驅動，將基板在水平方向旋轉特 定角度而在支撐銷之第2支撐面將基板支撐成傾斜狀態， 並且藉由升降驅動機構之驅動使支撐銷下降而在第2支撐 面支撐基板之下端部之傾斜狀態下使基板下降，依此可以 除去附著於基板下面之氣泡。 在該發明中，在上述支撐銷之上端部設置小徑部，該 小徑部之上端面形成第1支撐面，小徑部和大徑部之階段 部形成第2支撐面，並且以合成樹脂製構件或合成橡膠製 構件形成用以形成上述第1支撐面及第2支撐面之支撐銷 之上端部而構成爲佳（申請專利範圍第2項）。 藉由構成如此，可以減少支撐銷和基板之接觸面積， 並且可以使基板之傾斜狀態安定，並且可以抑制因與基板 之支撐銷的接觸導致基板損傷。 再者，在該發明中，即使又具備朝向藉由上述多數支 撐銷而被支撐成傾斜狀之基板的下面供給洗淨液，並對液 貯留空間內之洗淨液賦予流動的第2洗淨液供給噴嘴亦可 (申請專利範圍第3項）。 藉由構成如此，當使支撐成傾斜狀態之基板之下面接 -8- 201116945 觸於貯留於液貯留空間內之洗淨液之時，藉由自第2洗淨 液供給噴嘴被供給之洗淨液使液貯留空間內之洗淨液賦予 流動而可以除去附著於基板下面之氣泡。 再者，在該發明中，在上述基板保持台中之形成有液 貯留空間之底部配設振動子，同時於該振動子連接超音波 振盪器而構成（申請專利範圍第4項）。 藉由構成如此，當使支撐成傾斜狀態之基板之下面接 觸於貯留於液貯留空間內之洗淨液之時，藉由對振動子施 加來自超音波振盪器之適當頻率之高頻電壓而予以激振， 產生超音波振動，其超音波振動傳播至貯留於液貯留空間 內之液體而可以除去附著於基板下面之洗淨液。 [發明效果] 若藉由該發明，因構成上述般，故可以取得下般之優 良效果。 (1 )若藉由申請專利範圍第1項所記載之發明時， 於顯像處理前之洗淨處理時，藉由除去附著於基板下面即 是基板背面之氣泡，因在基板背面不存在界面，故可以謀 求減少基板背面之微粒。 (2 )若藉由申請專利範圍第2項時，除上述（1 )之 外，可以更減少支撐銷和基板之接觸面積，並且可以使基 板之傾斜狀態安定，並且可以抑制因與基板之支撐銷的接 觸導致基板損傷。 (3 )若藉由申請專利範圍第3項所記載之發明時， -9 - 201116945 因當使支撐成傾斜狀態之基板之下面接觸於貯留於液貯留 空間內之洗淨液之時，藉由自第2洗淨液供給噴嘴被供給 之洗淨液使液貯留空間內之洗淨液賦予流動而可以除去附 著於基板下面之氣泡，故除上述（1) 、 （2)之外，又可 以謀求減少基板背面之微粒。 (4 )若藉由申請專利範圍第4項所記載之發明時， 因可以使超音波傳播於貯留於液貯留空間內之洗淨液而除 去附著於基板下面之洗淨液，故除上述（1) 、 （2)之外 ，又可以謀求減少基板背面之微粒。 【實施方式】 以下，針對該發明之實施型態，根據附件圖面，予以 詳細說明。在該實施型態中，針對將該發明所涉及之顯像 處理裝置適用於光罩用之基板，例如對例如光柵用之玻璃 基板施予顯像處理之顯像處理裝置之時予以說明。 該發明所涉及之顯像處理裝置係如第1圖及第2圖所 示般’具有殼體1，在該殼體1內，具有保持成能夠旋轉 玻璃基板G (以下，稱爲基板G)之旋轉基台2，和可與 該旋轉基台2同時旋轉，並且包圍被保持於旋轉基台2之 基板G之外周部，用以在與基板G表面相同之平面上， 形成自基板G之表面上連續之液膜的外周板3 (以下稱爲 助跑台3) ’和能夠對旋轉基台2相對性升降移動，並且 吸附基板G而保持之基板保持台4，和沿著被保持於該基 板保持台4之基板G之表面而能夠移動，同時進行對基 -10- 201116945 板G供給和吸引顯像液之噴嘴頭5，和能夠對旋轉基台2 相對性升降移動，並且能夠在旋轉基台2之上方移動之基 板搬運臂80之間執行基板G之收授的多數例如3個支撐 銷 28a ' 28b、 28c° 再者，上述旋轉基台2、助跑台3及基板保持台4係 形成能夠收容在杯部6內，在杯部6之外方側，配設有朝 向旋轉基台2及被保持於基板保持台4之基板G和後述 之液貯留空間7供給洗淨液（沖洗液）例如純水之洗淨液 供給噴嘴8 (以下稱爲沖洗噴嘴8 )。 此時，上述旋轉基台2係如第4圖所示般，在與旋轉 軸1 〇連結之圓盤形基部1 1之外周4處，延伸有水平支撐 片12，並在水平支撐片12之前端連結環狀水平片13,在 被豎立設置在環狀水平片13之4處的各第1支撐柱片14 之頂部，各豎立設置有用以保持基板G之角部的一對定 位銷15。再者，在與環狀水平片13中之第1支撐柱片14 大約偏斜45度之4處豎立設置第2支撐柱片16，藉由各 第2支撐柱片1 6將助跑台3支撐成水平狀態。該旋轉基 台2經旋轉軸1 0與馬達等之旋轉驅動機構！ 7連結，可以 將旋轉軸1 0視爲中心軸以特定之旋轉速度進行旋轉。 再者’上述助跑台3係如第2圖所示般，俯視觀看係 具有圓形之薄板形狀，在中央部形成有收容基板G之四 角開口部3 a。藉由妇此地將助跑台3之外形形成圓形狀 ’於使助跑台3旋轉之時，防止在助跑台3之外周部附近 ，形成亂流。此時，助跑台3係被固定在與基板G之表 -11 - 201116945 面相同平面上，或是些許低之位置例如低200〜400 v m 之位置。依此，可以在從基板G之表面橫跨助跑台3之 表面之同一平面上形成連續之液膜。助跑台3之開口部 3a形成比基板G些許大，在被基板保持台4保持之基板 G和助跑台3之間，形成有基板G之收授用的間隙9。 再者，上述基板保持台4係如第5圖及第6圖所示般 ，具備具有可旋轉地插入旋轉基台2之旋轉軸10之貫通 孔21的有底圓筒狀之本體20，和豎立於該本體20之底 部22上，在其頂面23a具有吸引基板G之吸引口 23b的 吸附保持部23，在本體20之圓筒狀之側壁24之頂面24a ，設置有嵌合後述之第1環狀密封構件25a之第1周溝 24b，在本體20之底部22中之貫通孔21之緣部，設置有 嵌合後述之第2環狀密封構件25b之第2周溝24c。並且 ，基板保持台4係被形成藉由例如汽缸或馬達機構等之升 降驅動機構4A而可對旋轉基台2作相對性升降移動。升 降驅動機構4A係電性連接屬於控制手段之控制器90，根 據來自控制器90之訊號，使基板保持台4對旋轉基台2 作相對性移動。 被嵌合於上述基板保持台4之第1周溝24b內之第1 環狀密封構件25a，係被形成可在整個助跑台3之背面之 全周密接，嵌合於第2周溝24c內之第2環狀密封構件 2 5b係被形成可在整個旋轉基台2之背面之密接。 此時，上述第1環狀密封構件25a及第2環狀密封構 件25b係使用例如可撓性之PCTFE (聚三氟氯乙烯 •12- 201116945 :Polychlorotrifluor〇ethylene ) 、 PTFE (聚四氣乙嫌 :Polytetrafluoroethylene)等之樹脂，或例如含有砂之耐 藥性優良之橡膠材莽’具備擁有各朝向成爲密接對象之助 跑台3之背面側及旋轉基台2之背面側傾斜狀延伸之可撓 性的密封片（無圖示）。如此一來，藉由在第1及第2環 狀密封構件25a、25b設置具有朝向助跑台3之背面側及 旋轉基台2之背面側傾斜狀延伸之可撓性的密封片，可以 使助跑台3之背面及旋轉基台2之背面之接觸面積變寬， 並且可以容易進行調整。 再者，上述吸附保持部23係如第7圖所示般，爲了 迴避與旋轉基台2之4條水平支撐片12的干擾，被形成 在周方向分成4等分，在各吸附保持部23之頂面23a， 正交狀設置有具有沿著基板G之角部的縫隙狀之吸引孔 23b的兩個吸引口形成部23c。 再者，在基板保持台4之底部22之一處，設置有排 液口 26，底部22之底面22a朝向排液口 26側而被形成 下坡梯度狀。依此，可以使附著於底部22之底面22a之 液的脫液變成良好。 並且，在基板保持台4之底部22之適當位置，設置 有流通自屬於第2洗淨液供給噴嘴之背沖洗噴嘴70噴射 之沖洗液例如純水的通路22b (參照第6圖及第7圖）。 藉由如上述般所形成之基板保持台4，吸附保持基板 G，並且經第1環狀密封構件25a而密接基板保持台4和 助跑台3，並且經第2環狀密封構件25b而密接基板保持 -13- 201116945 台4和旋轉基台2，依此形成液貯留空間7。再者，在解 除依據基板保持台4之吸附保持及解除依據第1及第2環 狀密封構件25a、25b的密接的狀態下，形成旋轉基台2 及助跑台3同時可與基板G旋轉。因此，因不使基板保 持台4旋轉，使旋轉基台2及助跑台3旋轉，固可以縮小 旋轉驅動機構17之動力。 並且，在對應於迴避與基板保持台4中之旋轉基台2 干擾的基板G之外周部的3處，設置有貫通於垂直方向 之貫通孔27。在各貫通孔27內，可升降地插入支撐基板 G升降之支撐銷28a、28b、28c。支撐銷28a、28b、28c 係藉由例如汽缸等之升降驅動機構28A而升降自如，突 出於旋轉基台2上，可以在與基板搬運臂80之間執行對 旋轉基台2收授基板G。 此時，3個支撐銷28a、28b、28c中之至少一個（在 圖面中表示一個之時）之支撐銷28a，係如第7圖（b) 所示般，在支撐銷28a之上端部設置小徑部29a，該小徑 部29a之上端面形成第1支撐面，小徑部29a和大徑部 2 9b之階段部29c，形成第2支撐面，並且形成第1支撐 面及第2支撐面之支撐銷28a之上端部係利用合成樹脂製 構件例如導電性PEEK或合成橡膠構件例如氟橡膠所形成 〇 在如上述般所形成支撐銷2 8 a之小徑部2 9 a之上端面 (第1支撐面）和其他支撐銷28b、29c之上端面支撐基 板G之下面（背面），依此基板G被支撐成水平狀態。 -14 - 201116945 再者’在支撐銷28a之小徑部29a和大徑部29b之 29c (第2支撐面）支撐基板G之端部，在其他 28b、29c之上端面支撐基板G之下面（背面）， 板G被支撐成傾斜狀態。 並且，升降驅動機構28A係電性連接屬於控 之控制器90，形成根據來自控制器90之訊號而能 移動。再者，旋轉驅動機構17也電性連接於屬於 段之控制器90，形成可根據來自控制器90之訊號 旋轉數進行驅動，並且形成以特定角度旋轉而能夠 保持於旋轉基台2之基板G之水平面上之角度。 板G之角度調整之時序，係如後述般，藉由基板 80,基板G被搬入至旋轉基台2之上方，支撐銷 2 8 b、2 8 c上升，在支撐銷2 8 a之小徑部2 9 a之上 第1支撐面）和其他支撐銷28b、29c之上端面支 G之下面（背面）而接收到基板後，支撐銷2 8 a、 2 8 c下降而在旋轉基台保持基板G之狀態下，將旋 機構17及旋轉基台2旋轉特定角度。藉由該角度 板G之一端部（角部之一邊）在支撐銷2 8 a之小徑 和大徑部29b之段部29c (第2支撐面）移動至可 位置，藉由之後的支撐銷28a、28b、28c之上升在 28a之小徑部29a和大徑部29b之階段部29c (第 面）支撐基板G之端部（角部之一邊），在另外 銷2 8b、29c之上端面，支撐基板G之下面（背面 此基板G被支撐成傾斜狀態。 階段部 支撐銷 依此基 制手段 夠升降 控制手 以特定 調整被 執行基 搬運臂 28a ' 端面（ 撐基板 28b ' 轉驅動 調整基 部29a 支撐之 支撐銷 2支撐 之支撐 )，依 -15- 201116945 再者，旋轉基台2和基板保持台4係接受自基板G 飛散或落下之液體，被收容在回收用之杯部6內。杯部6 係以覆蓋旋轉基台2及基板保持台4之側方和下方之方式 ，形成例如下面被閉鎖上面開口之四角形的略筒狀。在杯 部6之下面，連接有與例如工場之排液部連通之排出管 6a，將在杯部6回收到之液體排出至顯像處理裝置之外部 〇 再者，如第2圖所示般，在杯部6之Y方向負方向 (第2圖之左方向）側，設置有第1待機部61。在第1 待機部61，執行顯像液及洗淨液（沖洗液）之供給和吸 引之噴嘴頭5可待機。噴嘴頭5具有例如至少與基板G 之邊的尺寸相同或較長，沿著X方向之略長方體形狀。 噴嘴頭5係被門型之噴頭臂5b支撐，藉由安裝有噴頭臂 5b之例如滾珠螺桿和由其旋轉馬達等所構成之水平移動 機構5 c，形成可自第1待機部61至少水平移動（掃描） 至杯部6之Y方向正方向（第2圖之右方向）側之端部 附近。再者，噴嘴頭5係被形成藉由被安裝於例如噴頭臂 5b之滾珠螺桿和由其旋轉馬達等所構成之升降驅動機構 (無圖示），也可在上下方向移動。 如第3圖所示般，噴嘴頭5之下面5 a，係以與基板G 表面平行之方式，形成水平。在噴嘴頭5之下面5 a中之 噴嘴頭5之行進方向之Y方向之中央部，形成有顯像液 吐出口 30。顯像液吐出口 30係沿著例如噴嘴頭5之長邊 方向（X方向）形成較例如基板G之邊長的縫隙狀，可以 -16- 201116945 將顯像液以帶狀吐出。顯像吐出口 3 0係與形成在噴嘴 5之內部之第1貯留部31連通’第1貯留部3丨係經顯 液供給管3 3而與設置在顯像處理裝置之外部的顯像液 給源32連接。顯像液供給源32係可以通過顯像液供給 3 3而將特定流量之顯像液供給至噴嘴頭5。噴嘴頭5係 被供給之顯像液暫時貯留於第1貯留部31而予以壓力 整，之後成爲可以自顯像液吐出口 30均勻吐出。 在夾著噴嘴頭5之下面5a之顯像液吐出口 30的兩 ，開口設置有吸引基板G上之顯像液的顯像液吸引口 。顯像液吸引口 40係被形成例如與顯像液吐出口 3 0平 之縫隙狀。顯像吐出口 40係與形成在噴嘴頭5之內部 第2貯留部41連通，第2貯留部41係經吸引管43而 設置在顯像處理裝置1之外部的吸引裝置42連接。吸 裝置42可以通過吸引管43而以特定壓力吸引。因此， 以以特定壓力自顯像液吐出口 3 0之兩側之顯像液吸引 40吸引自顯像液吐出口 3 0被供給至基板G上之顯像液 其結果，在基板G之表面上，可以形成從顯像液吐出 3 〇朝向顯像液吸引口 40的顯像液流動。 在噴嘴頭5之下面5a之各顯像液吐出口 40的更外 ’各形成有吐出純水等之沖洗液之沖洗液吐出口 50。 洗液吐出口 5 0係形成例如與上述顯像液吐出口 3 0平行 縫隙狀，可以將沖洗液吐出成沿著X方向之帶狀。沖 液吐出口 5 0係與被形成在噴嘴頭5之內部的第3貯留 5 1連通，經沖洗液供給管53而與設置在顯像處理裝置 頭 像 供 管 將 調 側 40 行 之 與 引 可 □ 〇 □ 側 沖 之 洗 部 -17- 201116945 之外部的沖洗液供給源5 2連接。沖洗液供給源5 2係可以 通過沖洗液供給管5 3而將特定流量之顯像液供給至噴嘴 頭5。噴嘴頭5係將被供給之沖洗液暫時貯留於第3貯留 部51而予以壓力調整，之後成爲可以自沖洗液吐出口 50 均勻吐出。 再者，如第2圖所示般，在杯部6之Y方向正方向 側，設置有第2待機部62。成爲在第2待機部62，洗淨 液供給噴嘴之沖洗噴嘴8可待機。沖洗噴嘴8係被支撐於 安裝在例如旋轉驅動軸8a之噴嘴臂8b之前端部，可以藉 由旋轉驅動軸8a之旋轉，從第2待機部62移動至杯部6 內之基板G之中央部上方。沖洗噴嘴8係藉由沖洗液供 給管6 4，連接於設置在例如顯像處理裝置1之外部之沖 洗液供給源63，可以將自沖洗液供給源63所供給之沖洗 液（純水）朝下方吐出。 並且’控制器90除上述旋轉驅動機構17、升降驅動 機構4A、28A之外，電性連接於噴嘴頭5之驅動部、沖 洗噴嘴8之驅動部等，形成可根據事先記憶之程式而控制 旋轉驅動機構17、升降驅動機構4A、28A、噴嘴頭5之 驅動部、沖洗噴嘴8之驅動部等。 接著，針對如上述般構成之顯像處理裝置之顯像處理 ’參照第8圖至第20圖所示之說明圖以及第21圖所示之 流程圖而予以說明。 首先，當藉由顯像處理裝置之外部之基板搬運臂80 而搬運之基板G被搬運至顯像處理裝置時，基板G被轉 -18- 201116945 交至事先上升之支撐銷28a、28b、28c (S-l ;參照第8圖 (a) 、（b))、藉由支撐銷28a、28b、28c之下降而載 置於旋轉基台2上’同時藉由定位銷15進行定位（S-02 ;參照第9圖（a ) 、( b ))。 接著，驅動旋轉驅動機構17而保持基板G之旋轉基 台2旋轉特定角度，調整基板G之水平面上之角度（S-3 ;參照第10圖（a) 、 （b))。藉由該角度調整在基板 G之一端部（角部之一邊）在支撐銷28a之小徑部29a和 大徑部29b之階段部29c (第2支撐面）移動至可支撐之 位置。 接著，升降驅動機構4A驅動，基板保持台4上升， 在吸附保持部2 3抵接於基板G之背面的狀態下，藉由吸 附保持部23之吸引吸附保持基板G，並且經第1環狀密 封構件25a而密接基板保持台4和助跑台3，並且經第2 環狀密封構件2 5b而密接基板保持台4和旋轉基台2，依 此形成液貯留空間7 ( S-4 ;參照第1 1圖（a ) 、 （ b )) 。在該狀態下，沖洗噴嘴8移動至基板G之中心部上方 ，朝向下方吐出純水，在液貯留空間7內貯留沖洗液（純 水），同時在基板G表面和助跑台3表面形成液膜L而 液擴展（S-5;參照第12圖（a) 、（b)、第13圖（a) 、(b))。如此一來，進行提升基板G表面之浸濕性的 預濕處理。於液擴展後，沖洗噴嘴8返回至第2待機部 62 ° 接著，驅動升降驅動機構28A，支撐銷28a、28b、 -19- 201116945 2 8 c上升，在支撐銷2 8 a之小徑部2 9 a和大徑部2 9 b之階 段部29c (第2支撐面）支撐基板G之端部（角部之一邊 )，在其他支撐銷28b、29c之上端面支撐基板G之下面 (背面），依此基板G被支撐成傾斜狀態（S-6 ;參照第 14圖（a ) 、（ b ) 、（ c ))。在該狀態下，驅動升降驅 動機構28A，支撐銷28a、28b、28c上升，將基板G移動 至上方之後，支撐銷28a、28b、28c下降，將存在於基板 G之下面（背面）側之氣泡從基板G之下面（背面）排出 至外部（除去）（S-7;參照第15圖（a) 、( b ))。如 此一來，於除去附著於下面（背面）之氣泡之後，基板G 被吸附保持於基板保持台4之吸附保持部23。 接著，在第1待機部61待機之噴嘴頭5從基板G移 動至Y方向負方向側之助跑台3上，在噴嘴頭5之沖洗 液吐出口 50、顯像液吐出口 30及顯像液吸引口 40的下 面5a則配置在助跑台3上。然後，噴嘴頭5下降，接近 於屬於啓動位置之助跑台3之表面。接著，從沖洗液吐出 口 50吐出沖洗液，從顯像液吐出口 30吐出顯像液，自顯 像液吸引口 40 —面吸引其沖洗液和顯像液，一面移動至 Y方向正方向側（S - 8 :參照第1 6圖）。此時，在噴嘴頭5 之下面5 a和助跑台3之表面之間常充滿沖洗液和和顯像 液，防止對噴嘴頭5之下面5 a吐泡的現象。噴嘴頭5前 進至Y方向正方向側，在基板G之表面上移動時，自顯 像液吐出口 3 0吐出在基板G上之顯像液從位於噴嘴頭5 之行進方向之前方側和後方側之顯像液吸引口 40被吸引 -20- 201116945 ’在基板G之表面之一部分區域形成帶狀之顯像液流動 。藉由該顯像液之流動，基板G之表面被顯像。藉由顯 像產生之溶解生成物立即自顯像液吸引口 4 0被排出。 噴嘴頭5 —面連續執行例如顯像液之供給和吸引，一 面移動（掃描）至助跑台3之Y方向正方向側之端部附 近。藉由如此情形，產生顯像液之流動之區域逐漸移動， 基板G之表全體被顯像。當噴嘴頭5移動至助跑台3之Y 方向正方向側之端部附近時，則停止顯像液及沖洗液之供 給和其吸引，噴嘴頭5則返回至第1待機部61。 如上述般顯像處理結束後，貯留在液貯留空間7內之 液（顯像液和沖洗液之混合液）從排液口 26被排出外部 (S-9;參照第17圖）。接著，解除藉由基板保持台4之 吸附保持，基板保持台4下降，解除基板保持台4和助跑 台3及旋轉基基台2之密接（S-10 ;參照第18圖）。 接著，在第2待機部62待機之沖洗噴嘴8移動至基 板G之中心部上方：藉由旋轉基台2基板G與助跑台3 同時旋轉。自沖洗噴嘴8吐出沖洗液至旋轉之基板G上 而洗淨基板G ( S -1 1 ;參照第1 9圖）。此時，即使也自 例如背沖洗噴嘴70吐出洗淨液，將洗淨液供給至基板G 之背面亦可。於該洗淨處理時，因旋轉基台2及助跑台3 和基板保持台4成爲非接觸，故可以執行藉由基板G背 面之吸附保持部23被吸附之部分的洗淨。 如上述般，於特定時間洗淨基板G之後，基板G高 速旋轉，使基板G乾燥（S-12 ;參照第20圖）。 -21 - 201116945 於基板G之乾燥處理結束後，旋轉驅動機構1 7驅動 使旋轉基台2及基板G成爲以特定角度旋轉至與角度調 整時之旋轉相反方向而可搬出基板G之狀態（S -1 3 )。接 著，升降驅動機構28A驅動，支撐銷28a、28b、28c再次 上升而提起基板G，藉由顯像處理裝置之外部之基板搬運 臂80而被搬出至基板處理裝置之外部（S-14)。 若藉由以上之實施型態時，於顯像處理前，當在液貯 留空間7內貯留液之同時，因在基板G表面及助跑台3 之表面連續形成液膜，故可以防止於藉由噴嘴頭5供給和 吸引顯像液時對顯像液內吐泡。再者，於顯像處理前，使 基板G成爲傾斜狀態使基板G之下面（背面）接觸於貯 留在液貯留空間7內之沖洗液（純水），依此可以除去附 著於基板G之下面（背面）之氣泡。 再者，因在液貯留空間7內貯留（充滿）液之狀態下 ，執行顯像處理，故可以防止基板G上之液體包覆至基 板G之背面側。 而且，於洗淨處理時，因使基板保持台4自基板G 及助跑台3離開之狀態，故可以執行藉由基板G背面之 吸附保持部23被吸附之部分的洗淨。其結果，可以消除 基板G背面之沖洗殘留物或基板污染。再者，可以使吸 引管線或密封部之構造簡單化，並且謀求降低驅動動力。 並且，在上述實施型態中’針對於洗淨液之液擴展後 使基板G傾斜而除去附著於基板G之下面（背面）之氣 泡之時，予以說明，但是如第22圖（a ) 、（ b )所示般 -22- 201116945 ，即使在支撐銷28a之小徑部29a和大徑部29b之階段部 29c (第2支撐面）支撐基板G之端面（角部之一邊）’ 在其他之支撐銷28 b、29c之上端面支撐基板G之下面（ 背面）之基板G之傾斜狀態執行洗淨液之液擴展之同時 ，使基板G下降而除去附著於基板G之下面（背面）之 氣泡亦可。 再者，如第23圖所示般，即使在支撐銷28a之小徑 部29a和大徑部29b之階段部29c (第2支撐面）支撐基 板G之端部（角部之一邊）’在其他支撐銷2 8 b、2 9 c之 上端面支撐基板G之下面（背面）而使基板G傾斜之狀 態下，自被配設在旋轉基台2之底部的第2洗淨液供給噴 嘴之背沖洗噴嘴70朝向傾斜狀之基板之下面吐出（供給 )，使液貯留空間7內之洗淨液賦予流動，依此除去附著 於基板G之下面（背面）之氣泡亦可。 再者，如第24圖所示般，即使設爲在形成基板保持 台4之液貯留空間7之底部22配設振動子101，並且在 該振動子101連接超音波振盪器100之構造亦可。藉由構 成如此，在去泡時即是使基板G成爲傾斜狀態而將基板G 之下面（背面）接觸於貯留於液貯留空間7內之洗淨液之 狀態下，藉由驅動超音波振盪器1 02而自超音波振盪器 1〇〇對振動子101施加適當頻率之高頻電壓而予以激振， 產生超音波振動，其超音波振動傳播貯留於液貯留空間7 內之液體而可以除去附著於基板G背面之氣泡（參照第 25 圖）。 -23- 201116945 並且，在上述實施型態中，雖然針對在一個支 28a設置小徑部29a、大徑部29b及階段部29c，而 第1支撐面和第2支撐面之時予以說明，但是即使與 兩個支撐銷2 8 a、2 8 b相同設置小徑部2 9 a、大徑部 及段部29c，形成第1支撐面和第2支撐面亦可。此 可以藉由在剩下之一條支撐銷28c之上端面支撐基板 下面（背面），在兩條具有階段之支撐銷28a、28b 2支撐面（階段部29c )支撐基板G之端部，使基板 撐成傾斜狀態。 並且，上述實施型態表示該發明之一例，該發明 限定於該例，可採用各種態樣。例如，該發明並不限 光柵、LCD、FPD (平面顯示器）等之方形之基板， 以適用於晶圓等之圓形基板等之其他基板。 【圖式簡單說明】 第1圖爲表示該發明所涉及之顯像處理裝置之第 施型態之槪略縱剖面圖。 第2圖爲上述顯像處理裝置之槪略俯視圖。 第3圖爲表示該發明中之噴嘴頭的剖面圖。 第4圖爲表不該發明中之旋轉基台之俯視圖 (a )之I部的放大斜視圖（b )。 第5圖爲表示該發明中之基板保持台的剖面圖。 第6圖爲沿著第5圖中之線11 -11線之剖面圖。 第7圖爲表示上述顯像處理裝置之重要部位的槪 撐銷 形成 例如 29b 時， G之 之第 G支 並不 定於 亦可 1實 )及 略斜 -24- 201116945 視圖（a )及（a )之III部的放大斜視圖（b )。 第8圖爲表示該發明中之基板之搬入狀態的槪略俯視 圖（a )及（a )之A向視槪略剖面圖（b )。 第9圖爲表示該發明中之支撐銷之下降狀態的槪略俯 視圖（a )及（a )之B向視槪略剖面圖（b )。 第10圖爲表示該發明中之基板之角度調整之狀態的 槪略俯視圖（a )及槪略剖面圖（b )。 第11圖爲表示該發明中之基板保持台之上升狀態的 槪略俯視圖（a )及槪略剖面圖（b ) » 第1 2圖爲表示藉由該發明中之洗淨液供給噴嘴的液 擴展之開始狀態的槪略俯視圖（a )及槪略剖面圖（b )。 第1 3圖爲表示上述液擴展之結束狀態的槪略俯視圖 (a )及槪略剖面圖（b )。 第14圖爲表示藉由該發明中之支撐銷使基板傾斜而 上升之狀態的槪略俯視圖（a )，爲槪略剖面圖（b )及（ b)之IV部放大圖（c)。 第1 5圖爲表示藉由上述支撐銷使基板傾斜而下降， 除去基板下面之氣泡之狀態的槪略俯視圖（a )及槪略剖 面圖（b )。 第1 6圖爲表示該發明中之顯像處理狀態的槪略剖面 圖。 第17圖爲表示該發明中之液體抽出的槪略剖面圖。 第18圖爲表示該發明中之基板保持台之下降及杯部 之上升狀態的槪略剖面圖。 -25- 201116945 第1 9圖爲表示該發明中之洗淨處理狀態的槪略剖面 圖。 第2 0圖爲表示該發明中之乾燥處理狀態的槪略剖面 圖。 第21圖爲表示該發明中之處理工程的流程圖。 第2 2圖爲表示該發明中之液擴展的另外狀態之槪略 剖面圖。 第23圖爲表示除去該發明中之基板下面之氣泡的另 外狀態之槪略剖面圖。 第24圖爲表示該發明所涉及之顯像處理裝置之第2 實施型態之重要部位的槪略剖面圖。 第25圖爲表示除去第2實施型態中之基板下面之氣 泡之狀態的槪略剖面圖。 【主要元件符號說明】 G :玻璃基板（基板） 2 :旋轉基台 3 :助跑台（外周板） 4 :基板保持台 5 :噴嘴頭 7 :液貯留空間 1 7 :旋轉驅動機構 28a、 28b、 28c:支撐銷 28A :升降驅動機構 -26- 201116945 2 9 a :小徑部 2 9 b :大徑部 29c :階段部 70 :背沖洗噴嘴（第2洗淨液供給噴嘴） 8 0 :基板搬運臂 90 :控制器（控制手段） 100 :超音波振盪器 1 〇 1 :振動子 1 〇 2 :超音波驅動電源 -27-201116945 VI. Description of the invention: [Technical Fields of the Invention] The present invention relates to a development processing apparatus that applies a treatment liquid to a glass substrate for a photomask such as a grating. [Prior Art] In general, E.g, In a photolithography project in the process of a substrate such as a semiconductor device or a grating, A photoresist coating process is performed by coating a photoresist on a substrate to form a photoresist film. Exposure treatment for performing exposure of a specific pattern on the photoresist film on the substrate, The development process is performed by supplying a developing solution to the substrate after the exposure processing to develop a photoresist film on the substrate. In the conventional development processing apparatus, Execution and suction of the developing liquid by the nozzle head, Therefore, in order to prevent the so-called bubble phenomenon, Known as a development processing device, The development processing device is provided to be rotatable together with a rotatable rotary base. And on the same plane surrounding the surface of the substrate surrounding the substrate held by the substrate holding member, An outer peripheral plate, such as a running platform, formed from a continuous liquid film on the surface of the substrate; Available for rotating abutments, Relative movement And a substrate holding table that holds the substrate and holds the substrate; And holding the substrate with the substrate holding stage, And the substrate holding table is in close contact with the outer peripheral plate via the sealing member, And a liquid storage space formed by the substrate holding table and the rotating base being closely connected; And a cleaning liquid supply nozzle that performs liquid expansion by supplying a cleaning liquid to the substrate and the liquid storage space of the rotary base and the substrate holding table (for example, Refer to Patent Document 1). however, With the miniaturization of patterns in recent years, In the near future, 201116945 will use EUV (ultraviolet) substrates. The EUV substrate is provided with a conductive film on the back surface of the substrate with respect to the conventional transmission type substrate (for example, CrN, etc.), The back side is adsorbed by an electrostatic chuck. therefore, It is expected that the positioning accuracy is deteriorated or the suction cup is contaminated due to contamination on the back surface of the substrate. Accordingly, The EUV substrate is very weak to the back surface than the transmissive substrate. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2008- 1 7743 No. 6 (Application Patent Range, Fig. 1] SUMMARY OF THE INVENTION [Problems to be solved by the invention] However, In the conventional development processing apparatus, Because the substrate is kept at a level, Performing liquid expansion by supplying a cleaning liquid toward the substrate and the liquid storage space before the development processing, Therefore, the air on the back side of the substrate is not removed. therefore, There are residual bubbles on the back of the substrate, The gas is responsible for the majority of the particles. The invention is studied in view of the above situation, The object of the present invention is to provide a bubble which removes the back surface of the substrate when it is attached to the pre-development treatment (liquid expansion). A development processing apparatus for reducing particles on the back surface of the substrate. [Means to solve the problem] In order to achieve the above objectives, The feature described in the first paragraph of the patent application scope is -6-201116945, which is characterized by: a rotatable rotating base that maintains the substrate in a horizontal state; And a rotary drive mechanism for rotationally driving the rotary base; And can rotate simultaneously with the above rotating base, And surrounding the outer peripheral portion of the substrate held by the rotating base. An outer peripheral plate for forming a continuous liquid film from the surface of the substrate on the same plane of the substrate surface; And can move relative to the above rotating base, And while adsorbing and holding the substrate, a substrate holding table that is in close contact with the rotating base and the outer peripheral plate to form a liquid storage space; And a substrate and a liquid storage space facing the rotating base and held by the substrate holding table, a cleaning liquid supply nozzle that supplies a cleaning liquid and performs liquid expansion; And simultaneously performing a nozzle head for supplying and attracting the developing liquid to the substrate held by the substrate holding table: And a plurality of support pins that are capable of ascending and descending the substrate between the substrate carrying arms movable over the rotating base; a lifting drive mechanism for moving the plurality of support pins up and down; Controlling the above-mentioned rotary drive mechanism and the control means of the lift drive mechanism, At the upper end of at least one of the plurality of support pins, Forming a first support surface below the substrate supporting the horizontal state, And a second support surface supporting the lower end portion of the substrate in the inclined state, With the above rotary drive mechanism, Forming an angle that can be adjusted to be maintained on a horizontal plane of the substrate of the rotating base, According to the control signal from the above control means, When the substrate is transferred between the substrate carrying arms, The angle of the substrate is such that the substrate can be supported in a horizontal state on the first support surface of the support pin. After supplying the cleaning liquid or the supply to the substrate and the liquid storage space, The position at which the lower end portion of the substrate in the inclined state is supported by the second support surface is 201116945 and lowering the substrate in an inclined state of the lower end portion of the second support surface supporting substrate, The bubbles attached to the underside of the substrate are removed. By doing so, When the substrate is transferred between the substrate transfer arms by driving the lift support pins by the lift drive mechanism, The substrate can be supported by supporting the substrate in a horizontal state on the first support surface of the support pin. Again, When the cleaning liquid is supplied to the substrate and the liquid storage space, or after the cleaning liquid is supplied, Driven by a rotary drive mechanism, Rotating the substrate at a specific angle in the horizontal direction and supporting the substrate in a tilted state on the second support surface of the support pin. And the support pin is lowered by the driving of the elevation driving mechanism, and the substrate is lowered in an inclined state of the lower end portion of the second support surface supporting substrate. Thereby, the air bubbles attached to the underside of the substrate can be removed. In the invention, a small diameter portion is disposed at an upper end portion of the support pin, The upper end surface of the small diameter portion forms a first support surface, The second support surface is formed at the stage of the small diameter portion and the large diameter portion. Further, it is preferable to form the upper end portion of the support pin for forming the first support surface and the second support surface by a synthetic resin member or a synthetic rubber member (the second item of the patent application). By constituting this, The contact area between the support pin and the substrate can be reduced, And the tilting state of the substrate can be stabilized, Further, damage to the substrate due to contact with the support pins of the substrate can be suppressed. Furthermore, In the invention, Even if the cleaning liquid is supplied to the lower surface of the substrate supported by the plurality of support pins so as to be inclined, It is also possible to supply a second cleaning liquid supply nozzle to the cleaning liquid in the liquid storage space (Patent No. 3). By constituting this, When the underside of the substrate supported in the inclined state is connected to the cleaning liquid stored in the liquid storage space, -8-201116945 By supplying the cleaning liquid supplied from the second cleaning liquid supply nozzle to the cleaning liquid in the liquid storage space, the air bubbles adhering to the lower surface of the substrate can be removed. Furthermore, In the invention, A vibrator is disposed at a bottom of the substrate holding table where the liquid storage space is formed, At the same time, the vibrator is connected to the ultrasonic oscillator (the fourth item of the patent application). By constituting this, When the underside of the substrate supported in an inclined state is brought into contact with the cleaning liquid stored in the liquid storage space, Exciting by applying a high frequency voltage from an appropriate frequency of the ultrasonic oscillator to the vibrator, Produce ultrasonic vibration, The ultrasonic vibration propagates to the liquid stored in the liquid storage space to remove the cleaning liquid adhering to the underside of the substrate. [Effect of the Invention] According to the invention, Because of the above, Therefore, it is possible to achieve the best results. (1) If by applying for the invention described in item 1 of the patent scope, During the cleaning process before the development process, By removing bubbles attached to the back of the substrate, which are the back of the substrate, Because there is no interface on the back of the substrate, Therefore, it is possible to reduce the number of particles on the back surface of the substrate. (2) If by applying for the second item of the patent scope, In addition to (1) above, The contact area between the support pin and the substrate can be further reduced. And it can stabilize the tilting state of the substrate. Further, damage to the substrate due to contact with the support pins of the substrate can be suppressed. (3) If by applying for the invention described in item 3 of the patent scope, -9 - 201116945 When the lower surface of the substrate supported in the inclined state is brought into contact with the cleaning liquid stored in the liquid storage space, By supplying the cleaning liquid supplied from the second cleaning liquid supply nozzle to the flow in the liquid storage space, the air bubbles attached to the lower surface of the substrate can be removed. Therefore, in addition to the above (1), (2), Further, it is possible to reduce the number of particles on the back surface of the substrate. (4) If by applying for the invention described in item 4 of the patent scope, Since the ultrasonic wave can be propagated to the cleaning liquid stored in the liquid storage space, the cleaning liquid adhered to the underside of the substrate can be removed. Therefore, in addition to the above (1), (2) Other than Further, it is possible to reduce the number of particles on the back surface of the substrate. [Embodiment] Hereinafter, For the embodiment of the invention, According to the attached drawings, Explain in detail. In this embodiment, The development processing device according to the invention is applied to a substrate for a photomask, For example, a development processing apparatus for applying a developing process to a glass substrate for a grating will be described. The development processing device according to the present invention has a casing 1 as shown in Figs. 1 and 2 . In the housing 1, Having a glass substrate G that can be rotated (hereinafter, a rotating base 2 called a substrate G), And can rotate simultaneously with the rotating base 2 And the periphery is held on the outer periphery of the substrate G of the rotary base 2, Used on the same plane as the surface of the substrate G, An outer peripheral plate 3 (hereinafter referred to as a running table 3) ′ which is formed as a continuous liquid film on the surface of the substrate G, and a relative liftable movement of the rotary base 2, And holding the substrate G and holding the substrate holding table 4, And being movable along the surface of the substrate G held by the substrate holding table 4, At the same time, the nozzle head 5 for supplying and attracting the developing liquid to the substrate -10- 201116945 is performed. And can move relative to the rotating base 2, Further, for example, a plurality of, for example, three support pins 28a' 28b that can perform the reception of the substrate G between the substrate transfer arms 80 that move above the rotary base 2, 28c° Again, The above rotating base 2 The running platform 3 and the substrate holding table 4 are formed to be housed in the cup portion 6, On the outside of the cup portion 6, A cleaning liquid supply nozzle 8 (hereinafter referred to as a flushing nozzle) for supplying a cleaning liquid (flushing liquid) such as pure water to the substrate G that is held by the substrate holding table 4 and the liquid storage space 7 to be described later is provided. 8 ). at this time, The above rotating base 2 is as shown in Fig. 4, At the outer periphery 4 of the disc-shaped base 1 1 coupled to the rotating shaft 1 ,, Extending the horizontal support piece 12, And connecting the annular horizontal piece 13 at the front end of the horizontal support piece 12, At the top of each of the first support pillars 14 which are erected at 4 of the annular horizontal sheets 13, A pair of positioning pins 15 are provided which are erected to hold the corners of the substrate G. Furthermore, The second support pillar 16 is erected at four places which are inclined by about 45 degrees from the first support pillar 14 in the annular horizontal sheet 13, The running table 3 is supported in a horizontal state by each of the second supporting columns 16 . The rotary base 2 is rotated by a rotary shaft 10 and a motor or the like! 7 links, The rotary axis 10 can be regarded as the central axis to rotate at a specific rotational speed. Furthermore, the above-mentioned running platform 3 is as shown in Fig. 2, The top view system has a circular thin plate shape. A four-corner opening portion 3a for accommodating the substrate G is formed in the center portion. By forming the round shape of the running platform 3 by the woman, when the running console 3 is rotated, Preventing near the periphery of the running platform 3, Form a turbulent flow. at this time, The running platform 3 is fixed on the same plane as the surface of the substrate G -11 - 201116945. Or a slightly lower position such as a position 200 to 400 v m lower. Accordingly, A continuous liquid film can be formed on the same plane across the surface of the running table 3 from the surface of the substrate G. The opening portion 3a of the running platform 3 is formed to be slightly larger than the substrate G, Between the substrate G held by the substrate holding table 4 and the running table 3, A gap 9 for receiving the substrate G is formed. Furthermore, The substrate holding table 4 is as shown in FIGS. 5 and 6 . A bottomed cylindrical body 20 having a through hole 21 rotatably inserted into the rotating shaft 10 of the rotary base 2 is provided. And standing on the bottom 22 of the body 20, The top surface 23a has an adsorption holding portion 23 that attracts the suction port 23b of the substrate G, On the top surface 24a of the cylindrical side wall 24 of the body 20, The first circumferential groove 24b of the first annular sealing member 25a to be described later is fitted, At the edge of the through hole 21 in the bottom portion 22 of the body 20, The second circumferential groove 24c of the second annular sealing member 25b to be described later is provided. And , The substrate holding table 4 is formed to be relatively movable up and down by the tilting drive mechanism 4A such as a cylinder or a motor mechanism. The step-up driving mechanism 4A is electrically connected to the controller 90 belonging to the control means, According to the signal from controller 90, The substrate holding table 4 is relatively moved to the rotary base 2. The first annular seal member 25a fitted into the first circumferential groove 24b of the substrate holding table 4, It is formed to be in close contact with the entire circumference of the back of the entire running platform 3, The second annular seal member 25b fitted in the second circumferential groove 24c is formed to be in close contact with the back surface of the entire rotary base 2. at this time, The first annular sealing member 25a and the second annular sealing member 25b are, for example, flexible PCTFE (polychlorotrifluoroethylene • 12-201116945: Polychlorotrifluor〇ethylene ), PTFE (poly four gas suspicion: Polytetrafluoroethylene), etc. In addition, for example, a rubber material having excellent resistance to sand is provided with a flexible sealing sheet having a back surface on which the rear side of the running platform 3 and the back side of the rotating base 2 are inclined. ). As a result, By the first and second annular sealing members 25a, 25b is provided with a flexible sealing sheet which extends obliquely toward the back side of the running platform 3 and the back side of the rotating base 2. The contact area between the back surface of the running platform 3 and the back surface of the rotating base 2 can be widened. And it can be easily adjusted. Furthermore, The adsorption holding unit 23 is as shown in Fig. 7, In order to avoid interference with the four horizontal support pieces 12 of the rotating base 2, Formed into 4 equal parts in the circumferential direction, On the top surface 23a of each adsorption holding portion 23, Two suction port forming portions 23c having slit-shaped suction holes 23b along the corner portions of the substrate G are provided in an orthogonal shape. Furthermore, At one of the bottoms 22 of the substrate holding table 4, There is a drain port 26, The bottom surface 22a of the bottom portion 22 is formed to have a downhill gradient shape toward the liquid discharge port 26 side. Accordingly, The deliquoring of the liquid adhering to the bottom surface 22a of the bottom portion 22 can be made good. and, In the proper position of the bottom 22 of the substrate holding table 4, A passage 22b for circulating a flushing liquid such as pure water sprayed from the back flushing nozzle 70 of the second cleaning liquid supply nozzle is provided (see Figs. 6 and 7). By the substrate holding table 4 formed as described above, Adsorption holding substrate G, Further, the substrate holding table 4 and the running table 3 are closely adhered via the first annular sealing member 25a. And the substrate is held in close contact with the second annular sealing member 25b - 13 - 201116945 table 4 and the rotating base 2, Thereby, the liquid storage space 7 is formed. Furthermore, The first and second annular sealing members 25a are removed by the adsorption holding and releasing by the substrate holding table 4, 25b in the state of close contact, The rotating base 2 and the running table 3 are simultaneously rotatable with the substrate G. therefore, Since the substrate holding table 4 is not rotated, Rotating the rotary base 2 and the running table 3, The power of the rotary drive mechanism 17 can be reduced. and, At three places on the outer periphery of the substrate G corresponding to the substrate G which is disturbed from the rotation of the rotating base 2 in the substrate holding table 4, A through hole 27 penetrating in the vertical direction is provided. In each of the through holes 27, The support substrate G can be inserted into the support substrate G up and down, 28b, 28c. Support pin 28a, 28b, 28c is lifted and lowered by a lifting drive mechanism 28A such as a cylinder. Suddenly on the rotating abutment 2, The substrate G can be transferred to the rotary base 2 between the substrate transfer arm 80 and the substrate transfer arm 80. at this time, 3 support pins 28a, 28b, a support pin 28a of at least one of 28c (when one is shown in the drawing), As shown in Figure 7(b), A small diameter portion 29a is provided at an upper end portion of the support pin 28a, The upper end surface of the small diameter portion 29a forms a first support surface. The small diameter portion 29a and the step portion 29c of the large diameter portion 29b, Forming a second support surface, Further, the upper end portion of the support pin 28a forming the first support surface and the second support surface is formed of a synthetic resin member such as a conductive PEEK or a synthetic rubber member such as fluororubber, and the support pin 28 a is formed as described above. The small end portion 2 9 a upper end surface (first support surface) and other support pins 28b, The upper end of the 29c supports the underside of the substrate G (back), According to this, the substrate G is supported in a horizontal state. -14 - 201116945 Further, the small diameter portion 29a of the support pin 28a and the 29c (second support surface) of the large diameter portion 29b support the end portion of the substrate G, In the other 28b, The upper end of the 29c supports the lower surface (back surface) of the substrate G, The plate G is supported in an inclined state. and, The lifting drive mechanism 28A is electrically connected to the control controller 90, The formation is movable in accordance with the signal from the controller 90. Furthermore, The rotary drive mechanism 17 is also electrically connected to the controller 90 belonging to the segment. The formation can be driven according to the number of rotations of the signal from the controller 90, Further, an angle which can be held at a specific angle and which can be held on the horizontal plane of the substrate G of the rotary base 2 is formed. The timing of the angle adjustment of the board G, As described later, With the substrate 80, The substrate G is carried above the rotary base 2, Support pin 2 8 b, 2 8 c rises, Above the small diameter portion 2 9 a of the support pin 28 a, the first support surface) and the other support pins 28b, After the upper surface of the 29c is supported on the lower side (back side) of the G, the substrate is received. Support pin 2 8 a, 2 8 c is lowered while the substrate G is held on the rotating abutment, The rotary mechanism 17 and the rotary base 2 are rotated by a specific angle. One end portion (one side of the corner portion) of the angle plate G is moved to a position at a small diameter of the support pin 28 a and a segment portion 29c (second support surface) of the large diameter portion 29b. With the support pin 28a, 28b, The step 28c of the small diameter portion 29a of the 28a and the step portion 29c (the first surface) of the large diameter portion 29b support the end portion (one side of the corner portion) of the substrate G, In the other pin 2 8b, The end face of 29c, The lower surface of the support substrate G (the back surface of the substrate G is supported in an inclined state). The support portion of the stage portion is configured to elevate and lower the control hand to adjust the position of the base carrying arm 28a' (the support substrate 28b' is driven to support the support pin 2 supported by the support base 29a), -15- 201116945 Again, The rotating base 2 and the substrate holding table 4 receive liquid that is scattered or dropped from the substrate G, It is housed in the cup portion 6 for recycling. The cup portion 6 is configured to cover the side and the lower side of the rotating base 2 and the substrate holding table 4, A slightly cylindrical shape such as a quadrangle in which the upper opening is closed is formed, for example. Below the cup 6, A discharge pipe 6a connected to, for example, a liquid discharge portion of the factory is connected, The liquid recovered in the cup portion 6 is discharged to the outside of the developing treatment device. As shown in Figure 2, In the negative direction of the Y direction of the cup portion 6 (the left direction of Fig. 2), The first standby unit 61 is provided. In the first standby unit 61, The nozzle head 5 for supplying and sucking the developing liquid and the washing liquid (flushing liquid) can stand by. The nozzle head 5 has, for example, at least the same size as or longer than the side of the substrate G, A slightly rectangular parallelepiped shape along the X direction. The nozzle head 5 is supported by the gate type nozzle arm 5b. The horizontal moving mechanism 5 c constituted by, for example, a ball screw to which the head arm 5b is mounted, and a rotating motor thereof, The vicinity of the end portion which is horizontally movable (scanned) from the first standby portion 61 to the positive direction (the right direction in the second drawing) of the cup portion 6 is formed. Furthermore, The nozzle head 5 is formed by a ball drive screw attached to, for example, the head arm 5b, and a lift drive mechanism (not shown) including a rotary motor or the like. It can also be moved up and down. As shown in Figure 3, 5 a below the nozzle head 5, In a manner parallel to the surface of the substrate G, Forming level. In the central portion of the Y direction of the traveling direction of the nozzle head 5 in the lower surface 5a of the nozzle head 5, A developing liquid discharge port 30 is formed. The developing liquid discharge port 30 is formed in a slit shape which is longer than, for example, the side of the substrate G in the longitudinal direction (X direction) of the nozzle head 5, for example. You can spit out the imaging solution in a strip shape from -16 to 201116945. The development discharge port 30 is in communication with the first storage portion 31 formed inside the nozzle 5. The first storage portion 3 is passed through the exposure liquid supply tube 3 3 and the developing liquid provided outside the development processing device. Connect to source 32. The developing liquid supply source 32 can supply the developing liquid of a specific flow rate to the nozzle head 5 by the developing liquid supply 3 3 . The nozzle liquid supplied to the nozzle head 5 is temporarily stored in the first storage portion 31 and is pressurized. Then, it is possible to discharge evenly from the developing liquid discharge port 30. Two of the developing liquid discharge ports 30 sandwiching the lower surface 5a of the nozzle head 5 The opening is provided with a developing liquid suction port for attracting the developing liquid on the substrate G. The developing liquid suction port 40 is formed, for example, in a slit shape which is flat with the developing liquid discharge port 30. The development discharge port 40 is connected to the second storage portion 41 formed inside the nozzle head 5, The second storage portion 41 is connected to the suction device 42 provided outside the development processing device 1 via the suction pipe 43. The suction device 42 can be attracted by a suction tube 43 at a specific pressure. therefore, As a result, the developing liquid suction 40 on both sides of the developing liquid discharge port 30 is attracted to the developing liquid on the substrate G from the developing liquid discharge port 30. On the surface of the substrate G, It is possible to form a flow of the developing liquid which is discharged from the developing liquid 3 toward the developing liquid suction port 40. Each of the developing liquid discharge ports 40 of the lower surface 5a of the nozzle head 5 is formed with a rinse liquid discharge port 50 for discharging a flushing liquid such as pure water. The washing liquid discharge port 50 is formed, for example, in a slit shape parallel to the developing liquid discharge port 30. The rinsing liquid can be discharged into a strip shape along the X direction. The liquid discharge port 50 is connected to the third storage 5 1 formed inside the nozzle head 5, The rinsing liquid supply pipe 53 is connected to the rinsing liquid supply source 52 provided outside the washing portion -17-201116945 which is disposed on the side of the image processing unit and which is disposed on the side of the aligning side. The rinsing liquid supply source 52 can supply the developing liquid of a specific flow rate to the nozzle head 5 through the rinsing liquid supply pipe 53. The nozzle head 5 temporarily stores the supplied rinse liquid in the third storage portion 51 and adjusts the pressure. After that, it becomes possible to spit out evenly from the rinse liquid discharge port 50. Furthermore, As shown in Figure 2, In the positive direction side of the cup portion 6 in the Y direction, The second standby unit 62 is provided. In the second standby unit 62, The rinse nozzle 8 of the cleaning liquid supply nozzle can stand by. The flushing nozzle 8 is supported to be mounted at an end portion of the nozzle arm 8b of the rotary drive shaft 8a, for example. It is possible to rotate by rotating the drive shaft 8a, The second standby unit 62 moves to the upper side of the center portion of the substrate G in the cup portion 6. The rinsing nozzle 8 is supplied to the tube 64 by the rinsing liquid. Connected to a flushing liquid supply source 63 provided outside the developing device 1, for example, The rinse liquid (pure water) supplied from the rinse liquid supply source 63 can be discharged downward. And the controller 90 is in addition to the above-described rotary drive mechanism 17, Lift drive mechanism 4A, Beyond 28A, Electrically connected to the driving portion of the nozzle head 5, Washing the driving portion of the nozzle 8, etc. Forming a rotary drive mechanism 17 according to a program that is memorized in advance Lift drive mechanism 4A, 28A, The driving part of the nozzle head 5, The driving portion of the nozzle 8 is flushed. then, The development processing of the development processing apparatus configured as described above will be described with reference to the explanatory drawings shown in Figs. 8 to 20 and the flowchart shown in Fig. 21. First of all, When the substrate G transported by the substrate transfer arm 80 outside the development processing device is transported to the development processing device, The substrate G is transferred to the support pin 28a which is raised in advance, -18- 201116945, 28b, 28c (S-l ; Refer to Figure 8 (a), (b)), By supporting the pin 28a, 28b, 28c is lowered and placed on the rotating base 2' while being positioned by the positioning pin 15 (S-02; Refer to Figure 9 (a), (b)). then, Driving the rotary drive mechanism 17 to keep the rotary base 2 of the substrate G rotated by a specific angle, Adjust the angle of the horizontal plane of the substrate G (S-3; Refer to Figure 10(a), (b)). By the angle adjustment, one end portion (one side of the corner portion) of the substrate G moves to the supportable position at the small-diameter portion 29a of the support pin 28a and the step portion 29c (second support surface) of the large-diameter portion 29b. then, The lifting drive mechanism 4A is driven, The substrate holding table 4 is raised, In a state where the adsorption holding portion 23 abuts against the back surface of the substrate G, The substrate G is held by suction suction by the suction holding portion 23, Further, the substrate holding table 4 and the running table 3 are closely adhered via the first annular sealing member 25a. And the substrate holding stage 4 and the rotating base 2 are closely adhered via the second annular sealing member 25b. Thereby forming a liquid storage space 7 (S-4; Referring to Figure 1 (a), (b)). In this state, The rinsing nozzle 8 moves to the upper portion of the substrate G, Spit pure water downwards, The rinse liquid (pure water) is stored in the liquid storage space 7, At the same time, a liquid film L is formed on the surface of the substrate G and the surface of the running table 3 to expand the liquid (S-5; Refer to Figure 12(a), (b), Figure 13 (a), (b)). As a result, A pre-wet treatment for improving the wettability of the surface of the substrate G is performed. After the liquid is expanded, The flushing nozzle 8 returns to the second standby unit 62 °, then Driving the lifting drive mechanism 28A, Support pin 28a, 28b, -19- 201116945 2 8 c rises, The end portion (one side of the corner) of the substrate G is supported by the step portion 29c (the second support surface) of the small diameter portion 2 9 a of the support pin 28 a and the step portion 29 c (the second support surface) of the large diameter portion 2 9 b, In other support pins 28b, The upper end of the 29c supports the lower surface of the substrate G (back surface), According to this, the substrate G is supported in an inclined state (S-6; Refer to Figure 14 (a), (b), (c)). In this state, Driving the lift drive mechanism 28A, Support pin 28a, 28b, 28c rises, After moving the substrate G to the top, Support pin 28a, 28b, 28c falls, The bubbles existing on the lower (back) side of the substrate G are discharged from the lower surface (back surface) of the substrate G to the outside (removed) (S-7; Refer to Figure 15 (a), (b)). As a result, After removing the bubbles attached to the bottom (back), The substrate G is adsorbed and held by the adsorption holding portion 23 of the substrate holding stage 4. then, The nozzle head 5 that has been in standby at the first standby unit 61 is moved from the substrate G to the running table 3 on the negative side in the Y direction. The rinsing liquid discharge port of the nozzle head 5, The developing liquid discharge port 30 and the lower surface 5a of the developing liquid suction port 40 are disposed on the running platform 3. then, The nozzle head 5 is lowered, It is close to the surface of the running platform 3 belonging to the starting position. then, Squirting the rinse solution from the rinsing liquid discharge port 50, Squeeze out the imaging solution from the developer liquid discharge port 30, The self-image liquid suction port 40 is attracted to the rinsing liquid and the developing liquid. Move to the positive side of the Y direction (S-8: Refer to Figure 16). at this time, The rinse liquid and the developing liquid are often filled between the lower surface 5 a of the nozzle head 5 and the surface of the running table 3, The phenomenon of spitting on the lower surface 5 a of the nozzle head 5 is prevented. The nozzle head 5 advances to the positive side in the Y direction, When moving on the surface of the substrate G, The developing liquid discharged from the developing liquid discharge port 30 on the substrate G is attracted from the developing liquid suction port 40 on the front side and the rear side in the traveling direction of the nozzle head 5 - 20, 2011, 16945 ' on the surface of the substrate G A portion of the area forms a strip of imaging fluid flow. With the flow of the imaging liquid, The surface of the substrate G is developed. The dissolved product generated by the image is immediately discharged from the developing liquid suction port 40. The nozzle head 5 is continuously performing, for example, supply and suction of the developing liquid. One side is moved (scanned) to the end of the positive direction side of the Y direction of the running platform 3. With such a situation, The area where the flow of the developing liquid is generated gradually moves, The entire surface of the substrate G is developed. When the nozzle head 5 moves to the vicinity of the end of the positive running side of the Y-direction, Then stop the supply of the imaging liquid and the rinsing liquid and the attraction thereof. The nozzle head 5 is returned to the first standby unit 61. After the development process as described above, The liquid (the mixture of the developing liquid and the rinsing liquid) stored in the liquid storage space 7 is discharged from the liquid discharge port 26 to the outside (S-9; Refer to Figure 17). then, The adsorption holding by the substrate holding table 4 is released, The substrate holding table 4 is lowered, The substrate holding table 4 and the running table 3 and the rotating base station 2 are closed (S-10; Refer to Figure 18). then, The rinse nozzle 8 that is in standby at the second standby unit 62 moves above the center portion of the substrate G: The base plate G of the rotary base 2 and the running table 3 are simultaneously rotated. Self-flushing nozzle 8 discharges the rinsing liquid onto the rotating substrate G to wash the substrate G (S-11; Refer to Figure 19). at this time, Even if the washing liquid is discharged from, for example, the back flushing nozzle 70, The cleaning liquid may be supplied to the back surface of the substrate G. During the washing process, Since the rotating base 2 and the running table 3 and the substrate holding table 4 are non-contact, Therefore, the portion to be adsorbed by the adsorption holding portion 23 on the back surface of the substrate G can be cleaned. As above, After cleaning the substrate G at a specific time, The substrate G rotates at a high speed, Dry the substrate G (S-12; Refer to Figure 20). -21 - 201116945 After the drying process of the substrate G is completed, The rotation drive mechanism 17 drives the rotation base 2 and the substrate G to rotate in a specific angle to a state opposite to the rotation at the time of the angle adjustment, and the substrate G can be carried out (S - 1 3 ). Then, The lifting drive mechanism 28A is driven, Support pin 28a, 28b, 28c rises again and lifts the substrate G, The substrate transfer arm 80 outside the development processing device is carried out to the outside of the substrate processing apparatus (S-14). If by the above implementation type, Before the development process, While reserving the liquid in the liquid storage space 7, Since a liquid film is continuously formed on the surface of the substrate G and the surface of the running table 3, Therefore, it is possible to prevent the liquid from being ejected into the developing liquid when the developing liquid is supplied and sucked by the nozzle head 5. Furthermore, Before the development process, The substrate G is tilted so that the lower surface (back surface) of the substrate G is in contact with the rinse liquid (pure water) stored in the liquid storage space 7. Thereby, the air bubbles attached to the lower surface (back surface) of the substrate G can be removed. Furthermore, In a state in which the liquid is stored (filled) in the liquid storage space 7, Perform development processing, Therefore, it is possible to prevent the liquid on the substrate G from being coated on the back side of the substrate G. and, During the washing process, Since the substrate holding table 4 is separated from the substrate G and the running table 3, Therefore, the portion to be adsorbed by the adsorption holding portion 23 on the back surface of the substrate G can be cleaned. the result, The rinsing residue or substrate contamination on the back side of the substrate G can be eliminated. Furthermore, The construction of the suction line or the seal can be simplified, And seek to reduce the driving force. and, In the above embodiment, when the liquid of the cleaning liquid is expanded and the substrate G is tilted to remove the bubbles attached to the lower surface (back surface) of the substrate G, To explain But as shown in Figure 22(a), (b) as shown in -22- 201116945, Even in the small-diameter portion 29a of the support pin 28a and the step portion 29c (second support surface) of the large-diameter portion 29b, the end surface (one side of the corner portion) of the support substrate G is supported by the other support pins 28b, The inclined state of the substrate G on the lower surface (back surface) of the end surface supporting substrate G above the 29c is performed while the liquid of the cleaning liquid is expanded. The substrate G may be lowered to remove air bubbles adhering to the lower surface (back surface) of the substrate G. Furthermore, As shown in Figure 23, Even in the small diameter portion 29a of the support pin 28a and the step portion 29c (second support surface) of the large diameter portion 29b, the end portion (one side of the corner portion) of the support plate G is supported by the other support pins 28b, When the upper end supports the lower surface (back surface) of the substrate G and the substrate G is inclined, The back rinse nozzle 70 of the second cleaning liquid supply nozzle disposed at the bottom of the rotary base 2 is discharged (supplied) toward the lower surface of the inclined substrate. The washing liquid in the liquid storage space 7 is given to the flow, In this way, bubbles adhering to the lower surface (back surface) of the substrate G may be removed. Furthermore, As shown in Figure 24, Even if the vibrator 101 is disposed at the bottom portion 22 of the liquid storage space 7 in which the substrate holding table 4 is formed, Further, the structure in which the vibrator 101 is connected to the ultrasonic oscillator 100 may be employed. By constructing this, In the case of defoaming, the substrate G is tilted and the lower surface (back surface) of the substrate G is brought into contact with the cleaning liquid stored in the liquid storage space 7, By driving the ultrasonic oscillator 102 and exciting the high frequency voltage of the appropriate frequency from the ultrasonic oscillator 1 to the vibrator 101, the excitation is performed. Produce ultrasonic vibration, The ultrasonic vibration propagates the liquid stored in the liquid storage space 7 to remove the air bubbles adhering to the back surface of the substrate G (see Fig. 25). -23- 201116945 Also, In the above embodiment, Although the small diameter portion 29a is provided for one branch 28a, Large diameter portion 29b and phase portion 29c, When the first support surface and the second support surface are described, But even with two support pins 2 8 a, 2 8 b Same setting small diameter part 2 9 a, Large diameter section and section 29c, The first support surface and the second support surface may be formed. This can be supported by the lower surface of the substrate (back surface) by the end surface of the remaining one of the support pins 28c. In two stages of support pins 28a, 28b 2 support surface (stage portion 29c) supports the end of the substrate G, The substrate is tilted. and, The above embodiment shows an example of the invention. The invention is limited to this example, Various aspects can be used. E.g, The invention is not limited to gratings, LCD, a square substrate such as an FPD (flat display), It is applied to other substrates such as a circular substrate such as a wafer. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic longitudinal cross-sectional view showing a first embodiment of a development processing apparatus according to the present invention. Fig. 2 is a schematic plan view of the above development processing apparatus. Fig. 3 is a cross-sectional view showing the nozzle head in the invention. Fig. 4 is an enlarged perspective view (b) showing a portion I of the plan view (a) of the rotary base in the invention. Fig. 5 is a cross-sectional view showing the substrate holding stage in the invention. Figure 6 is a cross-sectional view taken along line 11-11 of Figure 5. Fig. 7 is a view showing the formation of the pin of the important portion of the development processing device, for example, 29b, The Gth branch of G is not fixed at or can be 1) and slightly inclined -24- 201116945 A magnified oblique view (b) of Part III of views (a) and (a). Fig. 8 is a schematic cross-sectional view (b) showing a state in which the substrate is carried in the present invention, and is a schematic cross-sectional view (a) and (a). Fig. 9 is a schematic cross-sectional view (a) showing a descending state of the support pin in the invention, and a cross-sectional view (b) taken along the B direction of (a). Fig. 10 is a schematic plan view (a) and a schematic cross-sectional view (b) showing the state of the angle adjustment of the substrate in the invention. Figure 11 is a schematic plan view (a) and a schematic cross-sectional view (b) showing the ascending state of the substrate holding table in the invention. Fig. 12 is a view showing the liquid supplied to the nozzle by the cleaning liquid in the invention. A schematic top view (a) and a schematic cross-sectional view (b) of the start state of the expansion. Fig. 13 is a schematic plan view (a) and a schematic cross-sectional view (b) showing the end state of the liquid expansion. Figure 14 is a schematic plan view (a) showing a state in which the substrate is tilted by the support pin in the invention. It is a magnified view (c) of the IV part of the cross-sectional views (b) and (b). Fig. 15 is a view showing that the substrate is tilted by the support pin, and is lowered. A schematic top view (a) and a schematic cross-sectional view (b) of the state in which the bubbles under the substrate are removed. Fig. 16 is a schematic cross-sectional view showing the state of development processing in the invention. Fig. 17 is a schematic cross-sectional view showing the liquid extraction in the invention. Fig. 18 is a schematic cross-sectional view showing the lowering of the substrate holding table and the rising state of the cup portion in the invention. -25- 201116945 Fig. 19 is a schematic cross-sectional view showing the state of the washing process in the invention. Fig. 20 is a schematic cross-sectional view showing the state of the drying process in the invention. Fig. 21 is a flow chart showing the processing work in the invention. Fig. 2 is a schematic cross-sectional view showing another state in which the liquid is expanded in the invention. Fig. 23 is a schematic cross-sectional view showing another state in which the bubble under the substrate in the invention is removed. Figure 24 is a schematic cross-sectional view showing an important part of a second embodiment of the development processing device according to the present invention. Fig. 25 is a schematic cross-sectional view showing a state in which the bubble under the substrate in the second embodiment is removed. [Main component symbol description] G : Glass substrate (substrate) 2 : Rotating abutment 3 : Running platform (outer board) 4 : Substrate holding table 5 : Nozzle head 7 : Liquid storage space 1 7 : Rotary drive mechanism 28a, 28b, 28c: Support pin 28A: Lifting drive mechanism -26- 201116945 2 9 a : Small diameter section 2 9 b : Large diameter section 29c : Stage 70: Back rinse nozzle (2nd cleaning liquid supply nozzle) 8 0 : Substrate transfer arm 90 : Controller (control means) 100: Ultrasonic oscillator 1 〇 1 : Vibrator 1 〇 2 : Ultrasonic drive power supply -27-