JPH0822952A - Board rotation developing method and its equipment - Google Patents

Abstract

PURPOSE:To reduce consumption of developing solution and board contamination due to developing solution mist while the developing solution is loaded, by quickly supplying the developing solution over the whole surface of a board and loading the solution. CONSTITUTION:A board W is retained with a spin chuck 1 so as to horizontally rotate around the rotation centor CP. A nozzle 5 for supplying developing solution is arranged at a discharging position above the board W. In a developing solution-spreading process, a diffusion member 8 is retained with a diffusion member displacement mechanism 9, in the direction which intersects the rotating direction of the board W, and at the processing position isolated by a very small interval (d) from the surface of the board W. Developing solution discharged from the nozzle 5 to the board W is spread with the diffusion member 8 and loaded, while the board W is horizontally rotated at a low speed around the rotation centor CP.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter referred to as substrate) while being horizontally rotated and discharged onto the substrate surface. The present invention relates to a substrate rotary development processing method and apparatus for carrying out development processing by pouring a developing solution on the surface of a substrate.

[0002]

2. Description of the Related Art A conventional rotary substrate processing apparatus of this type supports a spin chuck for horizontally supporting and horizontally rotating a substrate, and a spin chuck from above the substrate supported by the spin chuck to near the center of rotation of the substrate surface. And a nozzle for discharging a developing solution.

In the development processing of the substrate surface by this conventional apparatus, a puddle step of spreading the developing solution discharged onto the substrate surface by centrifugal force while piling the developing solution on the substrate surface by surface tension while rotating the substrate, And a developing step of developing the substrate surface in a state where the developing solution is puddle on the substrate surface.

[0004]

However, the prior art having such a structure has the following problems. In the above liquid piling process, for example, when the substrate is horizontally rotated at a low speed, the developing solution spreads slowly, which causes uneven development. Therefore, in order to quickly supply the developing solution to the entire surface of the substrate, a large amount of the developing solution must be discharged onto the substrate surface, resulting in a large consumption of the developing solution and an increase in cost.

On the other hand, when the substrate is horizontally rotated at a high speed in the liquid piling process, the developing solution spreads faster and the developing solution is quickly supplied to the entire surface of the substrate, but the developing solution spills from the edge of the substrate. Or, the mist of the developer is easily scattered. That is, this developer spills or becomes a mist and scatters around the substrate, so that useless developer is discharged onto the substrate surface, resulting in a large consumption of the developer, and in addition, There is also a problem that the substrate is contaminated by the developer mist. Further, due to the centrifugal force, the developer may run short near the center of the substrate.

The present invention has been made in view of the above circumstances, and reduces the consumption of the developing solution and rapidly supplies the developing solution to the entire surface of the substrate to fill the surface with the solution, and further An object of the present invention is to provide a substrate rotary development processing method and apparatus capable of reducing the substrate contamination due to the developer mist in the plate.

[0007]

The present invention has the following constitution in order to achieve such an object. That is, the method invention according to claim 1 is a substrate rotary development processing method, wherein a developing solution discharged onto the surface of the substrate is piled up on the surface of the substrate for development while the substrate is horizontally rotated, The developing solution discharged onto the surface of the rotating substrate is received by a diffusing member arranged at a minute interval from the surface of the substrate, and the developing solution is puddle on the surface of the substrate. is there.

According to a second aspect of the present invention, there is provided a substrate rotation supporting means for supporting and horizontally rotating the substrate, and a developing solution discharge for discharging a developing solution onto the surface of the substrate supported by the substrate rotation supporting means. And a means for rotating the substrate in a horizontal direction, and a developing solution discharged onto the surface of the substrate is puddle on the surface of the substrate to perform development processing. And a diffusing member displacing means for moving the diffusing member between the processing position and a standby position distant from the substrate surface. , Are provided.

According to a third aspect of the present invention, in the substrate rotary development processing apparatus according to the second aspect, a vibrating means for ultrasonically vibrating the diffusing member is provided.

According to a fourth aspect of the present invention, in the substrate rotary development processing apparatus according to the second or third aspect, the diffusion member has a curved portion curved along the substrate surface. The inside of the curved portion is arranged so as to face the upper side in the substrate rotation direction.

[0011]

The operation of the method invention according to claim 1 is as follows. That is, the liquid piling process is performed while the diffusing member, which is arranged with a minute gap from the substrate surface, receives the developing solution discharged onto the substrate surface while the substrate is rotating.

That is, the developing solution discharged onto the substrate surface is
The horizontal rotation of the substrate causes horizontal rotation with the substrate. The developing solution is received by the diffusing member and passes through a minute gap between the substrate surface and the diffusing member, so that the developing solution is widely diffused on the substrate surface as if it were extended by the roller. Therefore, even when the substrate is horizontally rotated at a low speed, the way the developer spreads on the surface of the substrate can be accelerated, and since the substrate is horizontally rotated at a low speed, the developer mist is less likely to occur.

Further, the apparatus invention described in claim 2 is an apparatus which preferably implements the method invention described in claim 1, and its operation is as follows. The substrate is supported by the substrate rotation support means, and the diffusion member is moved from the standby position to the processing position by the diffusion member displacement means. This allows
The diffusing member is separated from the substrate surface by a minute distance, and
It is arranged in a direction intersecting the substrate rotation direction.

Then, while the substrate is horizontally rotated at a low speed, the developing solution is ejected from the developing solution ejecting means onto the surface of the substrate. As a result, similarly to the method of claim 1, the developer discharged onto the substrate surface is received by the diffusing member, passes through the minute gap between the substrate surface and the diffusing member, and is diffused widely and quickly on the substrate surface. It Further, since the substrate is horizontally rotated at a low speed, the developer mist is less likely to occur.

According to the third aspect of the present invention, by ultrasonically vibrating the diffusing member at the processing position, fine bubbles in the developing solution accumulated on the substrate surface are removed.

Further, according to the invention of claim 4, since the inside of the curved portion of the diffusing member faces the upper side in the substrate rotating direction, the developer received by the diffusing member is pushed back to the center side of the substrate. As a result, the developer is less likely to spill on the outside of the substrate, and the developer is less likely to run short near the center of the substrate due to centrifugal force, so that the developer is more effectively diffused to the substrate surface. It

[0017]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of a substrate rotary developing processing apparatus according to the first embodiment of the present invention, and FIG.
FIG. 3 is a vertical cross-sectional view showing a schematic structure of the inside of the diffusion member standby pot.

In the figure, reference numeral 1 indicates a spin chuck that supports a substrate W and rotates it horizontally.
Is provided with a rotary shaft 2 which is rotated around a rotation center CP by a motor (not shown), and a rotary base 3 which is integrally connected to the upper end of the rotary shaft 2. The substrate W is adsorbed and supported on the upper surface of the turntable 3 with its surface facing upward. The spin chuck 1 corresponds to the substrate rotation supporting means in the present invention.

A nozzle 5 for supplying a developing solution is arranged above the substrate W supported by the spin chuck 1. The nozzle 5 is attached to the tip of a support arm 6 which is swung about a swing fulcrum Y1, and the developing solution discharge position above the substrate (FIG. 1, FIG. 2) and a standby position outside the shatterproof cup 7 (a position shown by a chain double-dashed line in FIG. 1) which will be described later. In addition, by raising and lowering the support arm 6 by the raising and lowering means (not shown),
The nozzle 5 is also configured to move up and down. In addition, nozzle 5
Is a cylindrical shape, and its tip (bottom wall 51 on the substrate W side) is closed to form an inversion portion of the developer inside the cylinder, and a plurality of (five in the figure) side walls of the cylinder are provided in the vicinity of the inversion portion. This is a configuration in which the liquid discharge hole 52 is provided. The support arm 6 is internally provided with a liquid supply pipe (not shown) whose base end is connected to a developer supply source (not shown), and the developer supplied through the liquid supply pipe is supplied to the reversing portion of the nozzle 5. After the flow velocity of the liquid is reduced by the
Is slightly deviated from the surface of the substrate) to reduce the impact on the substrate W when the developing solution is discharged. The detailed structure of the nozzle 5 is disclosed in Japanese Examined Patent Publication No. 5-68092. Further, in this embodiment, as shown in FIG. 1, when the nozzle 5 is located at the ejection position, one of the liquid ejection holes 52 is configured to face the rotation center CP of the substrate W. The nozzle 5, the support arm 6 and the like constitute the developing solution discharging means in the present invention.

A scattering prevention cup 7 is provided around the substrate W supported by the spin chuck 1 to prevent the developer mist from scattering. This shatterproof cup 7
It is configured to be able to move up and down with respect to the spin chuck 1, and the scattering prevention cup 7 descends to enable the transfer of the substrate W onto the spin chuck 1 by a transport mechanism (not shown).

Further, above the substrate W supported by the spin chuck 1, there is a slight distance d (see FIG. 2) from the surface of the substrate and diffusion in a direction intersecting the rotation direction of the substrate W by the spin chuck 1. The member 8 is arranged. This diffusion member 8 is made of a material that has chemical resistance and does not generate dust, such as
A cylindrical body made of fluorocarbon resin and having a diameter of about 10 mm is curved to form a curved portion as a whole. The diffusing member 8 is supported by a diffusing member displacing mechanism 9, which corresponds to the diffusing member displacing means in the present invention, and is moved up and down, and is swung about a swing fulcrum Y2, above the substrate supported by the spin chuck 1. The processing position (the position shown by the solid line in FIGS. 1 and 2) and the standby position (the position shown by the chain double-dashed line in FIG. 1) housed in the diffusion member standby pot 10 fixed to the outer wall of the scattering prevention cup 7. To be moved between. For this movement, the shatterproof cup 7 is provided with an opening / closing shutter (not shown) (a diffusing member 8;
An opening for moving a vertical shaft 14 described later) is provided.

The diffusing member displacing mechanism 9 is used in the scattering prevention cup 7
A base 11 fixed to the outer wall of the base 1 and a spindle 1 which can be rotated around a swing fulcrum Y2 by a motor (not shown) provided in the base 11 and can be moved up and down by an air cylinder (not shown).
2, and a swing arm 13 whose base end is integrally connected to the upper end of the support shaft 12 and which can swing about a swing fulcrum Y2.
The oscillating arm 13 has a base end portion connected to the front end portion thereof and a vertical shaft 14 that supports the base end portion of the diffusing member 8 at the front end portion.

The processing position of the diffusing member 8 is as follows.
A position for receiving the developing solution discharged onto the surface of the substrate while the substrate is rotating, and in the case of the present embodiment, as shown in FIG.
With the inner part of the curved diffusing member 8 facing the upper side of the substrate rotating direction (counterclockwise in the present embodiment), the longitudinal direction of the diffusing member 8 intersects the substrate rotating direction, and the tip of the diffusing member 8 is crossed. However, the diffusing member 8 is arranged at a position slightly displaced from the rotation center CP of the substrate W to the rear side in the substrate rotation direction, and is so arranged as to be parallel to the entire surface of the diffusing member 8 with a minute distance d from the substrate surface. The diffusing member 8 is supported at this processing position by the diffusing member displacing mechanism 9 during the developing solution filling step described below.

As shown in FIG. 3, the diffusing member standby pot 10 sprays a cleaning liquid such as pure water onto the diffusing member 8 standing by at the standby position to wash the diffusing member 8. Is provided. A drain duct 16 is provided at the bottom of the diffusion member standby pot 10 for draining the waste liquid after cleaning.

Next, the procedure (method) of the developing process by the apparatus having the above-mentioned structure will be described with reference to the operation explanatory diagram shown in FIG. First, as shown in FIG. 4A, the substrate W is placed on the rotary table 3 of the spin chuck 1 with the surface thereof facing upward by a transport mechanism (not shown) in a state where the scattering prevention cup 7 is lowered. The center of W is transferred so as to match the center of rotation CP, is suction-supported by the turntable 3, and the nozzle 5 is moved from the standby position to the ejection position.

Next, as shown in FIG. 4B, the shatterproof cup 7 is raised, the swing arm 13 of the diffusing member displacement mechanism 9 is swung about the swing fulcrum Y2, and the diffusing member 8 is moved.
Is moved above the substrate W from the diffusion member standby pot 10 through the opening 7a, the support shaft 12 of the diffusion member displacement mechanism 9 is lowered, and the diffusion member 8 is separated from the surface of the substrate by a minute distance d.
It is supported by the diffusing member displacement mechanism 9 in a state of being arranged at the processing position.

Then, as shown in FIGS. 4 (c) and 4 (d), while the substrate W is horizontally rotated, the developing solution discharged from the nozzle 5 is deposited on the surface of the substrate (fluid deposition step). At this time, the developing solution discharged onto the surface of the substrate is horizontally rotated together with the substrate W by the horizontal rotation of the substrate W.
As shown in FIG. 5A, the developer DL is received by the diffusing member 8 and passes through the minute gap d between the substrate surface and the diffusing member 8. As a result, as shown in FIG.
Are widely spread on the substrate surface as if they were rolled up. When the developer DL is received by the inner side of the curve of the diffusing member 8, a part of the developer DL is along the radius of the inner side of the curve of the diffusing member 8 and the deepest part of the curved part (the deepest part here). Means a portion of the curved portion located on the lower side in the rotation direction of the substrate), and a part of the curved portion further flows toward the center of the substrate W. This reduces the developer spilled on the outside of the substrate, eliminates the lack of developer near the center of the substrate due to centrifugal force, and further promotes the uniform diffusion of the developer DL on the substrate surface. . Therefore, as compared with the conventional apparatus that does not include the diffusing member 8, even when the substrate W is horizontally rotated at a low speed, the developing solution can be spread on the substrate surface quickly and uniformly, and the developing solution consumption amount can be reduced. At the same time, the horizontal rotation of the substrate can be reduced even at a low speed, so that the developer mist is less likely to be generated, and the contamination of the substrate W by the developer mist can be reduced.

When the liquid filling step is completed, the horizontal rotation of the substrate W is stopped, the supporting arm 6 is raised by the elevating means, swivels to move the nozzle 5 to the standby position, and the support shaft of the diffusing member displacement mechanism 9 is supported. 12 is moved up and the diffusing member 8 is moved above the liquid level of the developer DL laid on the substrate surface, and the swing arm 13 of the diffusing member displacement mechanism 9 is swung about the swing fulcrum Y2. Then, the diffusion member 8 is stored in the diffusion member standby pot 10. Then, as shown in FIG. 4E, a predetermined time (for example, 60 seconds) is required until the development of the substrate surface is completed with the developer DL laid on the substrate surface.
Wait for the progress (development process). In the developing process, the diffusing member 8 is retracted to the diffusing member standby pot 10 in order to prevent uneven development. That is,
When the rotation of the substrate W is stopped and a long-time developing process is performed in a state where the diffusing member 8 is disposed at a processing position with a minute gap d from the surface of the substrate, the developing solution in a portion directly below the diffusing member 8 is present. Becomes d, which is smaller than the thickness of the developing solution in other regions, or the developing solution gathers around the diffusing member 8 due to the surface tension and the thickness of the developing solution increases around the diffusing member 8. This is because uneven development such as insufficient development of a portion directly below the diffusion member 8 occurs. When the diffusing member 8 is stored in the diffusing member standby pot 10, the shutter of the opening 7a is closed and the diffusing member 8 is washed.

When the developing process is completed, the scattering prevention cup 7
Is lowered, the rotary table 3 of the spin chuck 1 releases the suction support of the substrate W, and the developed substrate W is unloaded from the apparatus by a transport mechanism (not shown) to prepare for the next substrate W to be loaded.

Next, in the developing process of this embodiment,
Experimental results comparing the case where the diffusion member 8 is used as in the above method and the case where it is not used (corresponding to the conventional example) will be described with reference to FIG.

In FIG. 6, the vertical axis represents the rotation speed of the substrate W,
A graph in which time is plotted on the abscissa shows the progress of the development processing of the present invention (shown by a solid line) and the conventional example (shown by a dotted line). The conditions of this comparative experiment (common conditions between the present invention and the conventional example) are shown below.

<Conditions of Experiment> (1) A positive photoresist film was formed on the surface of a semiconductor wafer having a diameter of 8 inches, and a pattern was exposed on this photoresist film to obtain a substrate W to be processed. (2) The developing solution used is an organic alkaline developing solution containing TMAH (tetramethylammonium hydroxide) as a main component.

In the prior art, when the liquid is piled up, the horizontal rotation speed of the substrate W at the start of the discharge of the developing liquid is relatively high, because the developer is quickly spread over the surface of the substrate and piled up.
It was necessary to decelerate at a constant speed of 0 rpm to 0 rpm (stop rotation) in about 4 to 5 seconds, during which the developer was discharged. The developer consumption was about 45 cc / wafer.

On the other hand, the puddle of the present invention uses the substrate W
The horizontal rotation speed of is decelerated from 500 rpm with a constant acceleration to 0 rpm (rotation is stopped) in about 3 seconds, and the developing solution is discharged during that time, so that the developing solution can be swollen quickly on the substrate surface. It was That is, the discharge time of the developing solution was about 2/3 of that of the conventional example, and the consumption of the developing solution in the case of the present invention was about 30 cc / wafer. The amount of developer discharged from the nozzle 5 per unit time is the same in the case of the present invention and the case of the conventional example.

In the above experiment, the distance d between the substrate surface and the diffusing member 8 was set to about 0.5 mm. The distance d may be set appropriately by experimentally obtaining the optimum distance under each condition such as the type and size of the substrate W, the type of developing solution, and the rotation speed of the substrate. In this experiment, the surface tension of the developing solution allowed the developing solution to be deposited on the surface of the substrate W in a thickness of about 1 mm.

Further, as is clear from FIG. 6, in the case of the present invention, since the substrate W is rotated at a lower speed than in the conventional example,
The developer mist is less likely to be generated when the solution is piled up, and the contamination of the substrate W by the developer mist is reduced as compared with the conventional example.

Although the diffusing member 8 of the above embodiment is formed of a rod-shaped member, the diffusing member according to the present invention is not limited to this, and for example, as shown in FIG. On the (surface facing the surface of the substrate W), the curved diffusion portion 8 is formed.
Those having a configuration provided with a are also included. It should be noted that this modified example and the following modified examples can be similarly modified and implemented in the following other embodiments.

Further, although the diffusing member 8 of the above embodiment is curved, the curvature of curvature in that case may be set to an optimum size according to the conditions such as the type of substrate and the type of developing solution. . For example, when the substrate W is small, the curvature of the curved portion of the diffusing member 8 is also preferably small. In addition, the diffusion member 8
May have another shape, for example, a straight rod shape, or may be configured in a "dogleg" shape in which a curved portion and a straight rod-shaped portion are combined.

Further, the diffusing member 8 of the above embodiment is constructed so that its cross-sectional shape is round as shown in FIG. 8 (a). For example, its cross-sectional shape is shown in FIG. 8 (b). ), Or as shown in FIG. 8C, the side facing the substrate surface may be formed in a wedge shape. The structure of these diffusing members 8 may be optimal depending on the conditions such as the type of substrate and the type of developing solution.

Further, in the above embodiment, the diffusion member displacement mechanism 9 and the diffusion member standby pot 10 are fixed to the outer wall of the scattering prevention cup 7, and the diffusion member displacement mechanism 9 and the diffusion member standby pot 10 are scattered prevention cup. 7 was lifted up and down integrally with, but as shown in FIG. 9, for example, as shown in FIG.
1) and the diffusing member standby pot 10 may be fixed to the device frame AF without being fixed to the shatterproof cup 7. In this case, since the diffusing member displacement mechanism 9 avoids interference with the scattering prevention cup 7 when the diffusing member 8 is retracted to the diffusing member standby pot 10 after the liquid is piled up, for example, as shown in FIG.
The diffusing member 8 may be moved up and down so that the diffusing member 8 can move on the shatterproof cup 7 when rising. Although the diffusion member standby pot 10 is not shown in FIG. 9, in this modification, the diffusion member standby pot 10 is fixed to the device frame at an appropriate position around the scattering prevention cup 7.

Further, in the above embodiment and the modification of FIG. 9, the swing arm 13 of the diffusing member displacement mechanism 9 is swung about the swing fulcrum Y2 so that the diffusing member is moved between the processing position and the standby position. Although 8 is configured to move, it may be configured to move between the processing position and the standby position in another form.

Next, the configuration of the second embodiment device of the present invention will be described with reference to FIG. FIG. 10 is a diagram showing a main configuration of the second embodiment device.

The second embodiment is characterized in that the ultrasonic oscillator 20 is attached to the base end of the diffusing member 8 so that the diffusing member 8 can vibrate ultrasonically. Other configurations (Fig. 10)
(Including a configuration not shown in FIG. 2) is the same as that of the first embodiment device described above, and thus detailed description thereof is omitted here.

In the second embodiment, after the liquid piling process described in the first embodiment, the diffusing member 8 is ultrasonically vibrated while the diffusing member 8 is placed at the processing position during the liquid piling.
The substrate W is rotated at a low speed for about several seconds, and then the diffusion member 8
And the rotation of the substrate W is stopped to perform the developing process. By ultrasonically vibrating the diffusing member 8 and rotating the substrate W at a low speed for about several seconds, as shown in FIG.
The fine bubbles B (in the developing solution DL) adhering to the substrate W can be removed over the entire surface of the substrate, and the development failure due to the bubbles B can be prevented. Furthermore, this ultrasonic vibration promotes the developing action of the developing solution, which shortens the developing time,
Further, it is possible to effectively prevent the photoresist scum generated during development from adhering to the photoresist pattern formed on the substrate. Further, when the diffusing member 8 is withdrawn into the diffusing member standby pot 10 and washed after completion of the puddle, ultrasonic vibration is applied after washing the diffusing member 8 with pure water to accelerate the drying of the diffusing member 8. Can be made.

Instead of specially performing the step of removing the bubbles B after the puddle as described above, the diffusing member 8 is operated so as to be subjected to ultrasonic vibration during the puddle process. The bubbles B may be removed over the entire surface of the substrate.

[0046]

As is apparent from the above description, according to the method invention of claim 1, the developing solution discharged onto the rotating substrate surface is arranged with a minute gap from the substrate surface. Since the diffusing member is used to perform the puddle process, even if the substrate is horizontally rotated at a low speed and the puddle is filled, the developer can be quickly supplied to the surface of the substrate and the developer to be consumed can be reduced, resulting in a quick and even distribution. It is possible to carry out various puddle. Furthermore, since the substrate can be horizontally rotated at a low speed to pour liquid,
The generation of developer mist can be reduced, and the contamination of the substrate by the developer mist can be reduced.

Further, the apparatus invention according to claim 2 can suitably carry out the method invention according to claim 1, wherein the developer to be consumed can be reduced and a rapid and uniform solution piling can be carried out. In addition to the above, it is possible to realize a substrate rotary development processing apparatus that can reduce the generation of developer mist and also reduce the contamination of the substrate by the developer mist.

Further, according to the invention described in claim 3, in addition to the effect of the invention described in claim 2, since fine bubbles in the developing solution accumulated on the substrate can be removed, these bubbles can be removed. It is also possible to prevent the occurrence of defective development due to.

According to the fourth aspect of the invention, since the developing solution received by the diffusing member is pushed back to the center side of the substrate, the amount of the developing solution spilled on the outside of the substrate can be reduced, and the developing force is generated by the centrifugal force. It is possible to reduce the tendency that the liquid tends to be insufficient near the center of the substrate, and it is possible to more effectively diffuse the developer onto the substrate surface.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic configuration of a substrate rotary development processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view of the first embodiment device.

FIG. 3 is a diagram showing a schematic configuration inside a diffusion member standby pot.

FIG. 4 is a diagram for explaining the operation of the first embodiment device.

FIG. 5 is a diagram for explaining the function and effect of using a diffusion member.

FIG. 6 is a diagram for explaining a comparative experiment between the present invention and a conventional example.

FIG. 7 is a diagram showing a schematic configuration of an example of a modified example of the diffusion member of the present invention.

FIG. 8 is a diagram showing a schematic configuration of an example of a modified example of the diffusion member of the present invention.

FIG. 9 is a diagram showing a schematic configuration of a main part of an example of a modification of the diffusing member displacement means of the present invention.

FIG. 10 is a diagram showing a schematic configuration of a main part of a second embodiment device.

FIG. 11 is a diagram for explaining the function and effect of the second embodiment device.

[Explanation of symbols]

 1 ... Spin chuck 5 ... Nozzle 6 ... Nozzle support arm 8 ... Diffusion member 9 ... Diffusion member displacement mechanism W ... Substrate DL ... Developer

Claims (4)

[Claims] 1. A substrate rotary development processing method, wherein a developing solution discharged onto the surface of the substrate is piled up on the surface of the substrate to perform a developing process while the substrate is horizontally rotated. A substrate rotary development processing method, characterized in that the developer discharged onto the substrate surface is received by a diffusing member arranged at a minute distance from the substrate surface, and the developer is puddle on the substrate surface. 2. A substrate rotation support means for supporting and horizontally rotating the substrate, and a developing solution discharge means for discharging a developing solution onto the surface of the substrate supported by the substrate rotation support means, the substrate being horizontally supported. In a substrate rotation type development processing apparatus for performing development processing by piling up a developing solution discharged on the substrate surface on the substrate surface while rotating, a substrate at a processing position with a minute gap from the substrate surface, A substrate comprising: a diffusion member arranged in a direction intersecting the rotation direction; and a diffusion member displacement means for moving the diffusion member between the processing position and a standby position separated from the substrate surface. Rotary development processor. 3. The substrate rotary development processing apparatus according to claim 2, further comprising a vibrating means for ultrasonically vibrating the diffusion member. 4. The substrate rotary development processing apparatus according to claim 2, wherein the diffusion member has a curved portion curved along the surface of the substrate, and the inner side of the curved portion is the upper hand in the substrate rotation direction. A substrate rotation type development processing apparatus, which is arranged toward the side.