JP4034280B2 - Development processing equipment - Google Patents

Description

  The present invention relates to a substrate development processing apparatus.

  For example, in a photolithography process in the manufacturing process of a semiconductor device or a reticle, a resist coating process for applying a resist solution on a substrate to form a resist film, an exposure process for exposing a predetermined pattern to the resist film on the substrate, exposure A developing process for supplying a developing solution to the processed substrate and developing the resist film on the substrate is performed.

  The development processing described above is usually performed in a development processing apparatus having a nozzle for supplying a developing solution to the substrate. In recent years, the nozzle head moves relative to the surface of the substrate while moving the nozzle head along the surface of the substrate. There has been proposed a development processing apparatus that sucks the developer while supplying the developer. According to this development processing apparatus, a fresh developer is always supplied onto the substrate, and the dissolved matter generated by the development is immediately removed from the substrate, so that the entire surface of the substrate is developed without spots. The uniformity of development on the substrate surface can be improved (see, for example, Patent Documents 1 and 2).

JP 2003-234286 A JP 2003-243299 A

  However, in the case of the development processing apparatus, since the nozzle head performs suction simultaneously with the supply of the developer, the suction force may cause the substrate to rise and the position and posture of the substrate to become unstable. When the position and posture of the substrate become unstable, the amount of developer supplied to the substrate varies within the substrate surface, and the uniformity of development is impaired.

  In order to prevent the substrate from being lifted, for example, it can be proposed to provide a suction port for vacuum-sucking the substrate in a substrate holding member that holds the substrate in a development processing apparatus, and directly suck and hold the back surface of the substrate. However, in this case, for example, the liquid that has flowed from the front surface to the back surface of the substrate flows between the substrate holding member and the back surface of the substrate due to the suction force of the suction port, and the suction portion or the substrate holding member on the back surface of the substrate Concern about getting dirty. When the substrate or the substrate holding member becomes dirty as described above, for example, the contamination becomes particles, and the desired substrate processing cannot be performed.

  The present invention has been made in view of the above points, and in a development processing apparatus equipped with a nozzle head for supplying and sucking a developer, development that prevents the substrate from being lifted without directly holding the back surface of the substrate. It is an object of the present invention to provide a processing apparatus.

  In order to achieve the above object, according to the present invention, a base having a recess capable of accommodating a substrate and a surface of the substrate accommodated in the recess of the base are movable, A nozzle head capable of simultaneously supplying and sucking developer to the surface, and a spacer that supports the back surface of the substrate in the recess and forms a gap between the back surface of the substrate and the bottom surface of the recess A development processing apparatus comprising: a member; a liquid supply port that supplies a predetermined liquid to the gap; and a liquid suction port that sucks the liquid supplied to the gap from the bottom surface side of the recess. Provided.

  According to the present invention, when the substrate is accommodated in the recess of the base, the spacer member forms a gap between the back surface of the substrate and the bottom surface of the recess. A predetermined liquid can be supplied to the gap, and the liquid in the gap can be sucked from the bottom surface side of the recess. By sucking the liquid in the gap, a negative pressure is generated in the gap, and a suction force for sucking the back surface of the substrate downward can be generated. As a result, for example, when the nozzle head is simultaneously supplying and sucking the developing solution to the surface of the substrate, a suction force is generated on the back surface side of the substrate, thereby preventing the substrate from being lifted. Further, in this case, since the back surface of the substrate is exposed to the liquid and sucked through the liquid, it is possible to prevent the back surface of the substrate from becoming dirty as in the case where the substrate is directly sucked and held. In addition, the liquid supply from the liquid supply port and the liquid suction from the liquid suction port form a liquid flow in the gap between the back surface of the substrate and the bottom surface of the recess. For example, the back surface of the substrate is actively cleaned. You can also Furthermore, by supplying the liquid from the liquid supply port, the recess can be filled with the liquid. For example, before the developer is supplied, a liquid film can be formed on the surface of the substrate in the recess to pre-wet the substrate. The “predetermined liquid” can be used in combination as, for example, a prewetting liquid for prewetting the surface of the substrate, a stopping liquid for stopping development, a cleaning liquid for cleaning the substrate, or the prewetting liquid, the stopping liquid and the cleaning liquid. Pure water may be used.

  The base may include a flat surface having a height approximately equal to the surface of the substrate housed in the concave portion around the concave portion. In such a case, the liquid is supplied from the liquid supply port to supply the liquid onto the surface of the substrate in the recess and the flat surface around the substrate, thereby forming a liquid film over the entire surface of the substrate and the flat surface. be able to. Therefore, for example, the developer can be supplied and sucked from the nozzle head while the nozzle head is in contact with the liquid film. Therefore, at the time of supplying and sucking the developing solution by the nozzle head, ambient air is not mixed between the nozzle head and the surface of the substrate, and so-called bubble biting phenomenon can be prevented. As a result, development spots in the substrate surface can be prevented. Note that “the same height as the surface of the substrate” includes not only the same height as the surface of the substrate but also the height of a position lower than the surface of the substrate and higher than the back surface of the substrate.

  The recess may be formed such that a gap is formed between the outer surface of the substrate accommodated in the recess and the inner peripheral surface of the recess. In such a case, the liquid supplied from the liquid supply port to the back side of the substrate can be suitably supplied through the gap to the surface or flat surface of the substrate.

  The liquid suction port may be provided at a position facing the central portion of the back surface of the substrate accommodated in the recess. The liquid supply ports may have a plurality of openings at the bottom of the recess, and may be arranged at equal intervals on the same circumference centered on the liquid suction port as viewed from above. In such a case, it is possible to uniformly supply the liquid to the back surface of the substrate and suck the liquid evenly.

  A drainage hole for discharging the liquid in the recess may be formed in the base. In addition, the development processing apparatus according to the present invention further includes a rotation driving unit that rotates the base, and the drainage hole is formed so that the liquid is discharged by a centrifugal force generated by the rotation of the base. May be. In such a case, by rotating the base, the liquid in the recess can be discharged, and for example, the substrate in the recess can be appropriately dried.

  In the recess of the base, a plurality of positioning pins that contact the outer surface of the accommodated substrate and position the substrate may be provided. In such a case, the substrate can be accommodated at a predetermined position in the recess, and the horizontal displacement of the substrate can be prevented.

  The development processing apparatus of the present invention further includes an elevating pin for supporting the substrate to move up and down, and a through hole through which the elevating pin passes is formed at the bottom of the recessed portion, and the through hole has an inside of the recessed portion. A seal member for preventing leakage of liquid may be provided. In such a case, when the substrate is delivered, the liquid in the recess can be prevented from leaking from the bottom of the recess, and contamination in the development processing apparatus can be prevented. The sealing member may have a film shape covering the through-hole, and a notch through which the elevating pin passes may be formed at a central portion. The sealing member has a film shape covering the through-hole, and the elevating pin You may be comprised so that expansion-contraction in the up-down direction is possible by the press by.

  According to the present invention, at the time of supplying and sucking the developing solution to the surface of the substrate by the nozzle head, the substrate does not float up, the amount of development supplied to the substrate can be stabilized, and the development uniformity can be improved. .

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is an explanatory view of a longitudinal section showing an outline of the configuration of the development processing apparatus 1 according to the present embodiment, and FIG. 2 is an explanatory view of a transverse section of the development processing apparatus 1.

  As shown in FIG. 1, the development processing apparatus 1 has a casing 1a, and a rotating base 2 as a base for accommodating a rectangular substrate W is provided at the center of the casing 1a. For example, the outer shape of the rotary base 2 is formed in a substantially disk shape. The rotary base 2 includes a square and thick square board part 3 and an outer peripheral flat part 4 surrounding the square board part 3. The board part 3 is interlocked with a rotary drive part 6 such as a motor via a rod 5, for example. Thereby, the rotation base 2 can rotate at a predetermined rotation speed with the central axis of the rotation base 2 as the rotation axis.

  A concave portion 7 for accommodating the substrate W is formed at the center of the surface of the platen portion 3 in the rotary base 2. As shown in FIG. 3, the recess 7 is formed in a rectangular shape that is the same shape as the substrate W as viewed from above, and is slightly larger than the size of the substrate W. That is, the recess 7 is formed such that a gap C1 is formed between the outer surface of the substrate W and the inner peripheral surface of the recess 7 when the substrate W is accommodated.

  As shown in FIG. 1, on the bottom surface of the recess 7 of the rotating base 2, that is, on the surface of the bottom 3 a of the side plate portion 3, a support as a spacer member that supports the back surface of the substrate W accommodated in the recess 7 Pins 8 are provided. For example, as shown in FIG. 3, the support pins 8 are provided at a plurality of places, for example, four places corresponding to the back surface of the outer peripheral portion of the substrate W. The support pin 8 has a height of about 0.1 mm, for example, and the substrate W is supported by the support pin 8 so that a gap C2 is formed between the back surface of the substrate W and the bottom 3a as shown in FIG. Can be formed.

  A liquid supply port 9 for supplying a predetermined liquid into the recess 7 and a liquid suction port 10 for sucking the liquid in the recess 7 are formed at the bottom 3 a of the recess 7. In the present embodiment, for the predetermined liquid supplied from the liquid supply port 9, for example, pure water that can be used in combination with pre-wetting performed before development, stop of development, and cleaning of the substrate W is used.

  As shown in FIG. 3, the liquid suction port 10 is provided at a position facing the center of the bottom 3 a, that is, the center of the back surface of the substrate W accommodated in the recess 7. The liquid supply ports 9 are provided at equal intervals at a plurality of locations on the same circumference with the liquid suction port 10 as the center. The liquid supply ports 9 are provided at, for example, four places.

  As shown in FIG. 1, the liquid supply port 9 is connected to a liquid supply device 12 installed, for example, outside the development processing apparatus 1 by a liquid supply pipe 11. The liquid supply device 12 can supply a liquid having a desired flow rate into the recess 7 through the liquid supply pipe 11. The liquid suction port 10 is connected to, for example, a suction device 14 outside the development processing apparatus 1 by a suction tube 13. The suction device 14 can suck the liquid in the recess 7 through the suction pipe 13 at a desired flow rate. By the supply of the liquid from the liquid supply port 9 and the suction of the liquid from the liquid suction port 10, the flow of the liquid flowing along the back surface of the substrate W in the gap C2 between the back surface and the bottom 3a of the substrate W is changed. Can be formed. Further, the suction of the liquid in the gap C2 can create a negative pressure in the gap C2 to generate a suction force against the back surface of the substrate W.

  In the bottom 3a of the recess 7, through holes 20 penetrating in the vertical direction are formed at a plurality of places, for example, three places. In the through hole 20, lift pins 21 that support and lift the substrate W are provided. The elevating pins 21 can be moved up and down by an elevating drive unit 22 such as a cylinder, for example, and can move in and out of the bottom portion 3 a and transfer the substrate W to the recess 7.

  For example, in the vicinity of the upper end portion of each through hole 20, a film-like seal member 23 that covers the through hole 21 is provided as shown in FIG. The seal member 23 is formed, for example, in the form of a thin sheet made of a flexible rubber material, and a cross notch is formed in the center of the seal member 23 to allow the elevating pins 21 to pass therethrough. The seal member 23 closes the through hole 20 to prevent leakage of the liquid in the recess 7 when the elevating pin 21 does not pass. When the elevating pin 21 passes, the seal member 23 is opened from the notch by pressing by the elevating pin 21. 21 can be passed.

  As shown in FIG. 1, a drainage hole 24 for discharging the liquid in the recess 7 is formed in the side surface portion 3 b of the disk portion 3 that forms the inner peripheral surface of the recess 7. The drainage hole 24 is formed so as to penetrate the side surface portion 3b horizontally. The diameter of the drainage hole 24 is such that when the rotating base 2 is stopped, the liquid in the recess 7 does not flow out due to the action of surface tension, and when the rotating base 2 rotates, the liquid flows out due to centrifugal force. Thus, for example, the size is set to about 0.8 to 1.0 mm. For example, as shown in FIG. 5, the drainage holes 24 are formed at a plurality of locations along the frame-like side surface portion 3b so that the liquid in the recesses 7 is discharged by the centrifugal force generated by the rotation of the rotary base 2. Are formed along the direction in which the centrifugal force acts. For example, a plurality of positioning pins 25 for positioning the substrate W in contact with the outer surface of the substrate W accommodated in the recess 7 are provided inside the side surface portion 3b.

  As shown in FIG. 1, the outer peripheral flat part 4 of the rotating base 2 is formed outward from the side surface part 3 b of the disk part 3. The outer peripheral flat portion 4 is provided such that the position of the flat surface of the outer surface is slightly lower than the surface of the substrate W accommodated in the recess 7. As shown in FIGS. 2 and 3, the outer peripheral flat portion 4 is formed to have a circular outer shape. By forming the outer peripheral flat portion 4 in a circular shape in this way, it is possible to prevent turbulence from occurring near the outer peripheral portion of the rotating base 2 when the rotating base 2 is rotated.

  As shown in FIG. 1, the rotary base 2 is accommodated in a cup 30 for receiving and recovering liquid that scatters or drops from the substrate W. The cup 30 is formed, for example, in a substantially cylindrical shape having a rectangular shape with the lower surface closed and the upper surface opened so as to cover the side and the lower side of the rotary base 2. For example, a discharge pipe 31 that communicates with a liquid discharge unit of a factory is connected to the lower surface of the cup 30, and the liquid collected in the cup 30 can be discharged to the outside of the development processing apparatus 1.

  As shown in FIG. 2, a first standby unit 40 is provided on the Y direction negative direction (left direction in FIG. 2) side of the cup 30. The first standby unit 40 is provided with a nozzle head 41 that supplies and sucks developer and rinse liquid (pure water). The nozzle head 41 has, for example, a substantially rectangular parallelepiped shape along the X direction (vertical direction in FIG. 2) that is at least as long as the dimension of the short side of the substrate W or longer. The nozzle head 41 is supported by the head arm 42. The nozzle head 41 is moved from the first standby unit 40 to at least the positive direction in the Y direction (right direction in FIG. 2) of the cup 30 by a horizontal movement mechanism 43 including, for example, a ball screw and its rotation motor to which the head arm 42 is attached. It can move horizontally to the vicinity of the edge. The nozzle head 41 can also be moved in the vertical direction by an elevating mechanism (not shown) such as a cylinder attached to the head arm 42, for example.

  As shown in FIG. 6, the lower surface 41 a of the nozzle head 41 is formed horizontally so as to be parallel to the surface of the substrate W. A developer discharge port 50 is formed at the center of the lower surface 41 a of the nozzle head 41 in the Y direction, which is the traveling direction of the nozzle head 41. The developer discharge port 50 is formed in a slit shape, for example, longer than the short side of the substrate W along the longitudinal direction (X direction) of the nozzle head 41, and can discharge the developer in a strip shape. The developer discharge port 50 communicates with a first reservoir 51 formed inside the nozzle head 41. The first reservoir 51 communicates with, for example, a developer supply device 52 installed outside the development processing apparatus 1. The nozzle head 41 and the developer supply device 52 are connected by, for example, a developer supply pipe 53. The developer supply device 52 can supply a predetermined flow rate of developer to the nozzle head 41 through the developer supply pipe 53. The nozzle head 41 can temporarily store the supplied developer in the first reservoir 51 to adjust the pressure, and then uniformly discharge the developer from the developer discharge port 50.

  On both sides of the lower surface 41a of the nozzle head 41 across the developer discharge port 50, a developer suction port 60 for sucking the developer on the substrate W is opened. The developer suction port 60 is formed in a slit shape parallel to the developer discharge port 50, for example. The developer suction port 60 communicates with, for example, a second storage unit 61 formed inside the nozzle head 41. The second storage unit 61 communicates with, for example, a suction device 62 installed outside the development processing apparatus 1. The nozzle head 41 and the suction device 62 are connected by, for example, a suction pipe 63. The suction device 62 can suck at a predetermined pressure through the suction pipe 63. Therefore, the developer supplied onto the substrate W from the developer discharge port 50 can be sucked at a predetermined pressure from the developer suction ports 60 on both sides of the developer discharge port 50. As a result, on the surface of the substrate W, a developer flow from the developer discharge port 50 toward the developer suction port 60 can be formed.

  A rinsing liquid discharge port 70 for discharging a rinsing liquid such as pure water is formed on the outer surface of each developing solution suction port 60 on the lower surface 41 a of the nozzle head 41. The rinse liquid discharge port 70 is formed in a slit shape parallel to the developer discharge port 50, for example, and can discharge the rinse liquid in a strip shape along the X direction. The rinse liquid discharge port 70 communicates with a third storage part 71 formed inside the nozzle head 41. The third storage unit 71 communicates with, for example, a rinsing liquid supply device 72 installed outside the development processing apparatus 1. The nozzle head 41 and the rinse liquid supply device 72 are connected by, for example, a rinse liquid supply pipe 73. The rinsing liquid supply device 72 can supply a rinsing liquid at a predetermined flow rate to the nozzle head 41 through the rinsing liquid supply pipe 73. The nozzle head 41 can temporarily store the supplied rinsing liquid in the third storage unit 71 to adjust the pressure, and then uniformly discharge it from the rinsing liquid discharge port 70.

  As shown in FIG. 2, a second standby portion 80 is provided on the positive side of the cup 30 in the Y direction. The second standby unit 80 is provided with a rinsing liquid discharge nozzle 81 such as pure water. The rinse liquid discharge nozzle 81 is supported, for example, at the tip of a nozzle arm 83 attached to the rotary drive shaft 82, and the center of the substrate W in the cup 30 from the second standby unit 80 by the rotation of the rotary drive shaft 82. It can move to the upper part. The rinse liquid discharge nozzle 81 is connected by a rinse liquid supply pipe 84 to, for example, a rinse liquid supply source 85 installed outside the development processing apparatus 1. The rinse liquid supplied from the rinse liquid supply source 85 is directed downward. Can be discharged toward.

  A transfer port 90 for loading and unloading the wafer W is formed on the side wall on the positive side in the X direction of the casing 1a. The transfer port 90 is provided with a shutter 91 for opening and closing the transfer port 90.

  Next, the development processing performed in the above-described development processing apparatus 1 will be described. When the substrate W is carried into the development processing apparatus 1 from the transport port 90, the substrate W is transferred to the lift pins 21 that have been lifted in advance, and the recesses 7 are moved into the recesses 7 as shown in FIG. And supported by the support pins 8. At this time, a gap C <b> 2 is formed between the back surface of the substrate W and the bottom surface of the recess 7, and a gap C <b> 1 is formed between the outer surface of the substrate W and the inner peripheral surface of the recess 7.

  When the substrate W is accommodated in the recess 7, for example, as shown in FIG. 7, supply of pure water from the liquid supply port 9 and suction from the liquid suction port 10 are started. At this time, for example, the supply amount of pure water is set to be larger than the suction amount. The pure water supplied from the liquid supply port 9 is filled in the gap C2, and a part of the pure water is sucked from the liquid suction port 10. By this suction, pure water around the liquid suction port 10 becomes negative pressure, and a suction force is generated against the back surface of the substrate W. The pure water that has not been sucked into the liquid suction port 10 reaches the outer peripheral flat portion 4 and the surface of the substrate W from the gap C2 through the gap C1. Thus, a liquid film is formed over the entire surface of the substrate W and the outer peripheral flat portion 4, and pre-wetting is performed to improve the wettability of the surface of the substrate W.

  When the liquid film is formed on the substrate W and the outer peripheral flat portion 4, for example, the supply amount of pure water from the liquid supply port 9 is set to be the same as the suction amount of pure water from the liquid suction port 10. . In this way, all pure water supplied from the liquid supply port 9 is sucked from the liquid suction port 10 while maintaining the suction force to the back surface of the substrate W, and the total amount of pure water in the recess 7 is kept constant. Is done.

  Subsequently, the nozzle head 41 that has been waiting in the first standby unit 40 moves to the Y direction positive direction side, and moves to, for example, the outer peripheral flat part 4 located on the front side (Y direction negative direction side) of the substrate W. . Then, the nozzle head 41 is lowered, and the lower surface 41 a of the nozzle head 41 is brought into contact with the liquid film on the surface of the outer peripheral flat portion 4. With the lower surface 41a of the nozzle head 41 in contact with the liquid film, the discharge of the developer starts from the developer discharge port 50 of the nozzle head 41, the suction starts from the developer suction port 60, and the rinse liquid discharge port 70 Then, the discharge of pure water, which is a rinse liquid, is started. Thereafter, the nozzle head 41 starts to move in the Y direction positive direction side. At this time, the space between the lower surface 41a of the nozzle head 41 and the outer peripheral flat portion 4 is always filled with liquid, so that ambient air does not enter the lower surface 41a side of the nozzle head 41, and a so-called bubble biting phenomenon occurs. There is nothing.

  Then, the nozzle head 41 reaches the surface of the substrate W. At this time, the developer is discharged from the developer discharge port 50 onto the surface of the substrate W, and is sucked from the developer suction ports 60 on the front side and the rear side with respect to the traveling direction of the nozzle head 41. A belt-like developer flow is formed on the surface of the substrate W directly below. The belt-like region on the surface of the substrate W is developed by the flow of the developing solution. The dissolved product generated by this development is immediately discharged through the developer suction port 60.

  As the nozzle head 41 moves on the surface of the substrate W, the belt-like region where the flow of the developing solution gradually moves, and the entire surface of the substrate W is developed. At this time, the suction force acts upward on the substrate W due to the suction by the nozzle head 41, but as described above, the downward suction force acts on the back side of the substrate W due to the suction by the liquid suction port 10. Therefore, the substrate W does not float up.

  When the nozzle head 41 further advances and moves to the outer peripheral flat portion 4, the supply and suction of the developer and pure water by the nozzle head 41 are stopped, and the nozzle head 41 is returned to the first standby unit 40. Subsequently, for example, the rinse liquid discharge nozzle 81 that has been waiting in the second standby unit 80 moves to above the center of the substrate W, and the substrate W is rotated by the rotation base 2. Pure water as a rinsing liquid is discharged onto the substrate W rotated from the rinsing liquid discharge nozzle 81, and the surface of the substrate W is cleaned. At this time, pure water is continuously supplied and sucked by the liquid supply port 9 and the liquid suction port 10 on the back surface of the substrate W, and the back surface side of the substrate W is also cleaned.

  After both surfaces of the substrate W are cleaned for a predetermined time, the supply of pure water from the rinse liquid discharge nozzle 81 and the liquid supply port 9 and the suction from the liquid suction port 10 are stopped, and as shown in FIG. Is rotated at high speed. Due to the centrifugal force caused by the high-speed rotation of the rotary base 2, the liquid on the substrate W and the outer peripheral flat portion 4 scatters outward, and the liquid in the recess 7 is discharged through the drainage hole 24. Thus, the substrate W in the recess 7 is shaken and dried.

  When the substrate W is dried, the substrate W is lifted by the lift pins 21 and is carried out of the substrate processing apparatus 1 by a transfer arm (not shown).

  According to the above embodiment, the support pin 8 having a predetermined height is provided in the recess 7 of the rotary base 2, and the liquid supply port 9 and the liquid suction port 10 are provided on the bottom surface of the recess 7. A gap C2 is formed between the back surface of the substrate W accommodated in the substrate 7 and the bottom surface of the concave portion 7, so that pure water can be supplied and sucked into the gap C2. By suction of pure water in the gap C2, a suction force acts on the back surface of the substrate W, and the substrate W can be prevented from being lifted. In this case, since the suction force indirectly acts on the back surface of the substrate W via the liquid, a part of the back surface of the substrate W is not soiled as when the substrate W is directly sucked and held. Further, since the back side of the substrate W is filled with flowing pure water, the back side of the substrate W is maintained in a clean state.

  Since the outer peripheral flat portion 4 is provided on the rotary base 2, a liquid film can be formed over the entire surface of the substrate W and the outer peripheral flat portion 4. As a result, when supplying and sucking the developing solution by the nozzle head 41, Air can be prevented from being mixed between the lower surface 41a of the nozzle head 41 and the substrate W. Therefore, development spots are suppressed and the uniformity of development is improved.

  Since the gap C2 is formed between the inner peripheral surface of the recess 7 and the outer surface of the substrate W, the pure water supplied from the back side of the substrate W reaches the surface of the substrate W through the gap C2, and the substrate A liquid film can be formed on W. Therefore, the surface of the substrate W can be pre-wet with pure water supplied from the liquid supply port 9.

  Since the liquid suction port 10 is formed in the central portion of the bottom surface of the concave portion 7, the central portion of the substrate W can be sucked through pure water. Therefore, the substrate W can be sucked in a balanced manner. Since the liquid supply ports 9 are formed on the same circumference with the liquid suction port 10 as the center, pure water can be evenly supplied to the back surface of the substrate W. The number of the liquid suction ports 10 and the liquid suction ports 9 is not limited to the above example.

  Since the drainage hole 24 along the direction in which the centrifugal force acts is formed in the side surface part 3b of the base part 3 of the rotating base 2, the liquid in the recess 7 can be easily removed by using the rotation of the rotating base 2. Can be discharged.

  Since the seal member 23 is provided in the through-hole 20 that penetrates the bottom 3 a of the board part 3, the liquid in the recess 7 can be prevented from leaking from the through-hole 20. In the above embodiment, the seal member 23 is made of a rubber seal and has a cross cut in the center. For example, as shown in FIG. It may be formed in a closed film shape, and may expand and contract in the vertical direction by upward pressing by the lifting pins 21. For example, the seal member 100 may be a bellows or a stretchable bag.

  The above embodiment shows an example of the present invention, and the present invention is not limited to this example and can take various forms. For example, the present invention is not limited to a rectangular substrate such as a reticle, LCD, or FPD (flat panel display), but can be applied to other substrates such as a circular substrate such as a wafer.

  INDUSTRIAL APPLICABILITY The present invention is useful in a development processing apparatus having a nozzle head that supplies and sucks a developing solution when preventing the substrate from being lifted without directly attracting and holding the substrate.

It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of the image development processing apparatus concerning this Embodiment. It is explanatory drawing of the cross section which shows the outline of a structure of a development processing apparatus. It is a top view of a rotation base. It is explanatory drawing of the longitudinal cross-section of the through-hole provided with the sealing member. It is a cross-sectional view of the board part of a rotation base. It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of a nozzle head. It is explanatory drawing of the longitudinal cross-section of the rotation base which shows a mode when a liquid film is formed on a board | substrate and an outer periphery flat part. It is explanatory drawing of the longitudinal cross-section of the rotation base which shows a mode when supplying and attracting | sucking a developing solution with a nozzle head. It is explanatory drawing of the longitudinal cross-section of the rotation base which shows a mode when the liquid in a recessed part is discharged | emitted. It is explanatory drawing of the longitudinal cross-section of the through-hole in which the other sealing member was provided.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Development processing apparatus 2 Rotation base 4 Outer periphery flat part 7 Recessed part 8 Support pin 9 Liquid supply port 10 Liquid suction port 41 Nozzle head C1, C2 Crevice W Substrate

Claims (11)

A base formed with a recess capable of accommodating a substrate;
A nozzle head that is movable along the surface of the substrate accommodated in the recess of the base and capable of simultaneously supplying and sucking the developer to the surface of the substrate;
A spacer member that supports the back surface of the substrate in the recess and forms a gap between the back surface of the substrate and the bottom surface of the recess;
A liquid supply port for supplying a predetermined liquid to the gap;
A development processing apparatus, comprising: a liquid suction port for sucking the liquid supplied to the gap from the bottom side of the recess. 2. The development processing apparatus according to claim 1, wherein the base includes a flat surface having a height substantially equal to a surface of the substrate accommodated in the concave portion around the concave portion. The said recessed part is formed so that a clearance gap may be formed between the outer peripheral surface of the board | substrate accommodated in the said recessed part, and the internal peripheral surface of the said recessed part, The Claim 1 or 2 characterized by the above-mentioned. Development processing equipment. The development processing apparatus according to claim 1, wherein the liquid suction port is provided at a position facing a central portion of the back surface of the substrate accommodated in the recess. 5. The liquid supply port according to claim 4, wherein a plurality of the liquid supply ports are opened at a bottom surface of the recess, and are arranged at equal intervals on the same circumference with the liquid suction port as a center when viewed from above. Development processing equipment. 6. The development processing apparatus according to claim 1, wherein a drainage hole for discharging the liquid in the recess is formed in the base. A rotation drive unit for rotating the base;
7. The development processing apparatus according to claim 6, wherein the drainage hole is formed so that the liquid in the recess is discharged by a centrifugal force generated by the rotation of the base. A plurality of positioning pins for positioning the substrate in contact with the outer surface of the accommodated substrate are provided in the recess of the base. The development processing apparatus according to any one of 6 and 7. Equipped with elevating pins that move up and down while supporting the substrate,
A through hole through which the elevating pin passes is formed at the bottom of the recess,
The sealing material which prevents the leakage of the liquid in the said recessed part is provided in the said through-hole, The any one of the Claims 1, 2, 3, 4, 5, 6, 7 or 8 characterized by the above-mentioned. The development processing apparatus according to the description. The development processing apparatus according to claim 9, wherein the seal member has a film shape that covers the through-hole, and has a notch through which the elevating pin passes in a central portion. The development processing apparatus according to claim 9, wherein the seal member has a film shape that covers the through-hole, and is configured to be vertically expandable and contractable by pressing with the elevating pin.

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