JP4030973B2 - Development processing equipment - Google Patents

Description

  The present invention relates to a substrate development processing apparatus.

  For example, in the photolithography process in the manufacturing process of a semiconductor device or a reticle, a resist coating process for forming a resist film by applying a resist solution on the substrate, an exposure process for exposing a predetermined pattern to the resist film on the substrate, A developing process is performed in which a developing solution is supplied onto the substrate after the exposure process to develop a resist film on the substrate.

  The development processing described above is usually performed in a development processing apparatus having a nozzle that supplies a developing solution to the substrate. In recent years, the nozzle head moves on the surface of the substrate while moving the nozzle head along the surface of the substrate. There has been proposed a development processing apparatus that sucks the discharged developer while discharging the toner. According to this development processing apparatus, a fresh developer is always supplied onto the substrate, and the dissolved matter generated by the development can be immediately removed from the substrate, so that development is performed under the same conditions on the entire surface of the substrate. The uniformity of development on the surface can be improved (see, for example, Patent Documents 1 and 2).

JP 2003-234286 A JP 2003-243299 A

  However, in the case of the development processing apparatus, since the nozzle head also sucks the developer, so-called bubble biting development may occur in which ambient air is mixed into the developer on the surface of the substrate. When this bubble biting phenomenon occurs, a portion where development is not performed occurs on the surface of the substrate, resulting in development spots. In order to solve such a problem, it can be proposed to attach a run-up stage of the nozzle head to the development processing apparatus on the same plane of the surface of the substrate surrounding the outer periphery of the substrate. For example, before the nozzle head supplies the developer to the surface of the substrate, a liquid film is formed in advance on the same plane composed of the surface of the substrate and the surface of the run-up stage, and the nozzle head is immersed in the liquid film. When the nozzle head supplies and sucks the developer, it is possible to prevent the bubble biting phenomenon during development.

  However, when a running stage surrounding the outer periphery of the substrate is attached, it is necessary to provide a gap between the substrate and the running stage in consideration of delivery of the substrate. For this reason, when a liquid film is formed on the surface of the substrate and the surface of the run-up stage, there is a concern that the liquid flows out from the gap. When the liquid flows out, a continuous liquid film connected between the surface of the substrate and the surface of the run-up stage cannot be formed before supplying the developing solution, and the bubble biting phenomenon cannot be sufficiently prevented. Further, the liquid that has flowed out enters the back surface of the substrate and contaminates the back surface of the substrate, and this contamination can also cause particles.

  The present invention has been made in view of the above points. In a development processing apparatus having a nozzle head for supplying and sucking a developer and an outer peripheral plate such as a run-up stage, the liquid from the gap between the outer peripheral plate and the substrate is provided. It is an object of the present invention to provide a development processing apparatus that can prevent the outflow of water.

To achieve the above object, according to the present invention, a rotatable rotating base, a substrate holding member mounted on the rotating base and supporting an outer peripheral portion of a substrate, and the substrate holding member movable along a holding surface of the substrate in a, the nozzle head for supplying the developing solution against the substrate, rotatable together with the rotary base, and the outer periphery of the substrate held by the substrate holding member An outer peripheral plate for forming a continuous liquid film from the surface of the substrate on the same plane of the surface of the substrate surrounding the portion, and a gap is provided between the substrate and the outer peripheral plate, The substrate holding member closely adheres to the back surface of the outer peripheral portion of the substrate over the entire circumference of the outer peripheral portion of the substrate and sucks and holds the substrate. Further, a part of the substrate holding member is interposed between the outer surface of the substrate and the substrate. It is configured to form a groove for staying open to the gap the liquid, before The substrate holding member has a frame shape along the outer periphery of the substrate, and the inner peripheral surface of the frame-shaped substrate holding member is a horizontal inner peripheral surface that supports and adsorbs the outer periphery of the substrate over the entire circumference. And a vertical inner peripheral surface formed upward from an outer end of the horizontal inner peripheral surface and surrounding the outer surface of the substrate to form the groove, and the substrate holding member is a liquid in the groove The drainage hole is formed so that the liquid in the groove is drained by the centrifugal force generated by the rotation of the rotating base. A development processing apparatus is provided. The nozzle head may simultaneously supply and suck the developer with respect to the substrate.

  According to the present invention, since a part of the substrate holding member forms a groove in which the liquid stays between the outer surface of the substrate, a gap for transferring the substrate is secured between the substrate and the outer peripheral plate. For example, it is possible to prevent the liquid in the liquid film formed on the substrate and the outer peripheral plate from flowing out from the gap between the outer peripheral plate and the substrate. Therefore, a liquid film without a gap can be formed from the surface of the substrate to the surface of the outer peripheral plate before the supply and suction of the developer to the substrate by the nozzle head, for example. It is possible to appropriately prevent the bubble biting development. In addition, since the substrate holding member holds the substrate in close contact with the substrate over the entire circumference of the outer periphery of the substrate, the liquid staying in the groove goes around to the back side of the substrate and contaminates the back side of the substrate. Can also be prevented.

Further, according to the present invention , the groove can be formed on the outer surface of the substrate while adsorbing and holding the substrate by the L-shaped step portion formed of the horizontal inner peripheral surface and the vertical inner peripheral surface. Further, the liquid staying in the groove and dirty can be discharged, and for example, contamination around the groove due to the liquid can be prevented.

  A suction port for sucking the substrate may be formed on the horizontal inner peripheral surface, and the suction port may be formed in a slit shape along the frame shape of the substrate holding member.

  The substrate holding member has an upper end horizontal peripheral surface formed along the back surface of the outer peripheral plate in a horizontal direction from an upper end portion of the vertical inner peripheral surface, and the outer peripheral plate includes the upper end horizontal peripheral surface. And a sealing member for preventing the liquid in the groove from leaking from between the upper peripheral horizontal peripheral surface. In such a case, the liquid can be prevented from flowing out from the gap between the upper peripheral horizontal surface of the substrate holding member and the outer peripheral plate.

  The substrate holding member may individually include a suction holding block that has the horizontal inner peripheral surface and sucks and holds the substrate, and a groove forming block that has the vertical peripheral surface and forms the groove. The development processing apparatus may further include a lift pin that supports the substrate and lifts it, and the suction holding block may be formed with a through hole through which the lift pin passes. In such a case, in the development processing apparatus having the substrate holding member, it is possible to suitably raise and lower the substrate for transferring the substrate.

As a reference example, along a rotatable rotating base, a substrate holding member mounted on the rotating base and supporting and holding the outer periphery of the substrate, and the surface of the substrate held by the substrate holding member A nozzle head that is movable and that simultaneously supplies and sucks developer to the substrate, and can rotate with the rotating base, and is flush with the substrate surface surrounding the outer periphery of the substrate held by the substrate holding member. An outer peripheral plate for forming a continuous liquid film on the surface of the substrate, a gap is provided between the substrate and the outer peripheral plate, and the gap covers the gap, A development processing device provided with a flexible sheet-like seal member can be provided.

According to the above reference example , since the gap between the substrate and the outer peripheral plate is covered with the sheet-like sealing member, the liquid film liquid formed on the same plane substrate and the outer peripheral plate is transferred between the outer peripheral plate and the substrate. Can be prevented from flowing out of the gap. Therefore, for example, a liquid film without a gap can be formed on the substrate and the outer peripheral plate before the nozzle head supplies and sucks the developer with respect to the surface of the substrate. Biting phenomenon can be prevented. Further, since the seal member is formed in a sheet shape and has an appropriate property, the seal member is freely deformed by the contact with the substrate W. Therefore, the seal member can suitably transfer the substrate without hindering the transfer of the substrate to the substrate holding member.

The seal member of the reference example may have a frame shape along the gap, and may be formed so that an inner peripheral surface of the seal member contacts an outer surface of the substrate of the substrate holding member. In this case, when the substrate is held by the substrate holding member, the state where the inner peripheral surface of the seal member is in contact with the outer surface of the substrate is maintained. Therefore, the gap between the substrate and the outer peripheral plate is completely closed, and the liquid film liquid formed on the substrate and the outer peripheral plate does not flow out of the gap between the outer peripheral plate and the substrate. The seal member may be attached to the outer peripheral plate.

The substrate holding member of the above reference example has a frame shape along the outer peripheral portion of the substrate, and adheres to the back surface of the outer peripheral portion of the substrate over the entire outer periphery of the substrate so as to suck and hold the substrate. It may be configured. In such a case, since the substrate holding member is in close contact with the substrate over the entire circumference of the outer peripheral portion of the substrate, for example, it is possible to prevent the liquid on the substrate from flowing around the back surface side of the substrate and contaminating the back surface of the substrate.

On the inner side of the substrate holding member of the frame shape of the invention, the cleaning liquid supply part is provided to supply a cleaning liquid to the rear surface of the substrate, the substrate holding member, for discharging the inside of the cleaning liquid of the substrate holding member on the outside The cleaning liquid discharge hole may be provided. In such a case, the cleaning liquid used for cleaning the back surface of the substrate can be suitably discharged.

  The substrate holding member may have a positioning pin that contacts the outer surface of the substrate in order to position the holding position of the substrate.

  According to the present invention, at the time of supplying and sucking the developer onto the substrate surface by the nozzle head, the bubble biting phenomenon does not occur, and the substrate can be properly developed without unevenness.

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is an explanatory view of a longitudinal section showing an outline of the configuration of the development processing apparatus 1 according to the present embodiment, and FIG. 2 is an explanatory view of a transverse section of the development processing apparatus 1.

  As shown in FIG. 1, the development processing apparatus 1 has a casing 1a, and a rotation base 2 for rotating the substrate W is provided at the center of the casing 1a. The rotary base 2 has a disk shape, for example. The rotation base 2 can be rotated at a predetermined rotation speed with the central axis of the rotation base 2 as a rotation axis in conjunction with, for example, a rotation driving unit 3 such as a motor provided below the rotation base 2.

  A substrate holding member 10 to be described later for supporting and holding the outer peripheral portion of the square substrate W is attached on the rotating base 2. On the outside of the substrate held by the substrate holding member 10, a running stage 11 as an outer peripheral plate is provided so as to surround the outer peripheral portion of the substrate W.

  As shown in FIG. 2, the run-up stage 11 has a thin plate shape that is circular when viewed from above, and a square opening 11 a that accommodates the substrate W is formed at the center. Thus, by forming the outer shape of the run-up stage 11 in a circular shape, turbulence is prevented from being formed near the outer periphery of the run-up stage 11 when the run-up stage 11 is rotated. As shown in FIG. 1, the run-up stage 11 is fixed to the rotating base 2 by, for example, a cylindrical fixing member 12. The run-up stage 11 is fixed so as to be located on the same plane as the surface of the substrate W. Thereby, a continuous liquid film can be formed on the same plane extending from the surface of the substrate W to the surface of the run-up stage 11. The opening 11 a of the run-up stage 11 is formed slightly larger than the substrate W, and a gap C for transferring the substrate W is provided between the substrate W held by the substrate holding member 10 and the run-up stage 11. Is formed. As shown in FIG. 2, the gap C is provided with a plurality of positioning pins 13 for contacting the outer surface of the substrate W and positioning the substrate W. A total of eight positioning pins 13 are disposed, for example, two at each corner of the substrate W.

  As shown in FIG. 1, a through hole 14 penetrating in the vertical direction is formed at a position corresponding to the outer periphery of the substrate W of the rotary base 2 and the substrate holding member 10. In the through hole 14, lift pins 15 that support and lift the substrate W are provided. The elevating pins 15 can be moved up and down by, for example, an elevating drive unit 16 such as a cylinder, and can protrude from the rotary base 2 to transfer the substrate W to the substrate holding member 10. Further, a back surface cleaning nozzle 17 as a cleaning liquid supply unit that discharges the cleaning liquid upward and cleans the back surface of the substrate W is provided at the center of the upper surface of the rotary base 2.

  The rotary base 2 is accommodated in a cup 18 for receiving and collecting the liquid scattered or dropped from the substrate W. The cup 18 is formed, for example, in a substantially cylindrical shape having a rectangular shape with the lower surface closed and the upper surface opened so as to cover the side and the lower side of the rotary base 2. For example, a discharge pipe 19 that communicates with a drainage section of a factory is connected to the lower surface of the cup 18, and the liquid collected in the cup 18 can be discharged to the outside of the development processing apparatus 1.

  As shown in FIG. 2, a first standby portion 20 is provided on the Y direction negative direction (left direction in FIG. 2) side of the cup 18. The first standby unit 20 is provided with a nozzle head 21 that supplies and sucks developer and rinse liquid (cleaning liquid). The nozzle head 21 has, for example, a substantially rectangular parallelepiped shape along the X direction that is at least equal to or longer than the dimension of the short side of the substrate W. The nozzle head 21 is supported by the head arm 22. The nozzle head 21 is moved from the first standby unit 20 to at least the positive direction of the cup 18 in the Y direction (right direction in FIG. 2) by a horizontal movement mechanism 23 including, for example, a ball screw and its rotation motor to which the head arm 22 is attached. It can move horizontally to the vicinity of the edge. The nozzle head 21 can also be moved in the vertical direction by an elevating mechanism (not shown) such as a cylinder attached to the head arm 22, for example.

  As shown in FIG. 3, the lower surface 21 a of the nozzle head 21 is formed horizontally so as to be parallel to the surface of the substrate W. A developer discharge port 30 is formed on the lower surface 21 a of the nozzle head 21 at the center in the Y direction, which is the traveling direction of the nozzle head 21. The developer discharge port 30 is formed in a slit shape, for example, longer than the short side of the substrate W along the longitudinal direction (X direction) of the nozzle head 21, and can discharge the developer in a strip shape. The developer discharge port 30 communicates with a first reservoir 31 formed inside the nozzle head 21. The first storage unit 31 communicates with, for example, a developer supply device 32 installed outside the development processing apparatus 1. The nozzle head 21 and the developer supply device 32 are connected by, for example, a developer supply pipe 33. The developer supply device 32 can supply a predetermined flow rate of developer to the nozzle head 21 through the developer supply pipe 33. The nozzle head 21 can temporarily store the supplied developer in the first storage unit 31 to adjust the pressure, and then uniformly discharge it from the developer discharge port 30.

  A developer suction port 40 that sucks the developer on the substrate W is opened on both sides of the lower surface 21 a of the nozzle head 21 across the developer discharge port 30. The developer suction port 40 is formed in, for example, a slit shape parallel to the developer discharge port 30. The developer suction port 40 communicates with, for example, a second storage portion 41 formed inside the nozzle head 21. The second storage unit 41 communicates with, for example, a suction device 42 installed outside the development processing apparatus 1. The nozzle head 21 and the suction device 42 are connected by, for example, a suction pipe 43. The suction device 42 can suck at a predetermined pressure through the suction pipe 43. Therefore, the developer supplied onto the substrate W from the developer discharge port 30 can be sucked at a predetermined pressure from the developer suction ports 40 on both sides of the developer discharge port 30. As a result, on the surface of the substrate W, a developer flow from the developer discharge port 30 toward the developer suction port 40 can be formed.

  A rinsing liquid discharge port 50 for discharging a rinsing liquid such as pure water is formed on the outer surface of each developing solution suction port 40 on the lower surface 21 a of the nozzle head 21. The rinse liquid discharge port 50 is formed in, for example, a slit shape parallel to the developer discharge port 30 and can discharge the rinse liquid in a strip shape along the X direction. The rinse liquid discharge port 50 communicates with a third reservoir 51 formed inside the nozzle head 21. The third reservoir 51 communicates with, for example, a rinsing liquid supply device 52 installed outside the development processing apparatus 1. The nozzle head 21 and the rinse liquid supply device 52 are connected by, for example, a rinse liquid supply pipe 53. The rinsing liquid supply device 52 can supply a rinsing liquid at a predetermined flow rate to the nozzle head 21 through the rinsing liquid supply pipe 53. The nozzle head 21 can temporarily store the supplied rinse liquid in the third storage unit 51 to adjust the pressure, and then uniformly discharge it from the rinse liquid discharge port 50.

  As shown in FIG. 2, a second standby portion 60 is provided on the Y direction positive direction side of the cup 18. The second standby unit 60 is provided with a rinse liquid discharge nozzle 61. The rinse liquid discharge nozzle 61 is supported, for example, at the tip of a nozzle arm 63 attached to the rotary drive shaft 62, and the center of the substrate W in the cup 18 from the second standby portion 60 by the rotation of the rotary drive shaft 62. It can move to the upper part. The rinse liquid discharge nozzle 61 is connected by a rinse liquid supply pipe 64 to, for example, a rinse liquid supply source 65 installed outside the development processing apparatus 1, and the rinse liquid supplied from the rinse liquid supply source 65 is directed downward. Can be discharged toward.

  Next, the configuration of the above-described substrate holding member 10 will be described in detail. The substrate holding member 10 is formed in a square frame shape corresponding to the outer peripheral portion of the substrate W as shown in FIG. The substrate holding member 10 has a step portion inside the frame shape, and can accommodate the substrate W by holding the substrate W in the step portion. FIG. 5 is an explanatory view of a longitudinal section of the substrate holding member 10, and FIG. 6 is a plan view of the substrate holding member 10. The substrate holding member 10 is formed by a combination of a frame-shaped suction holding block 70 and a groove forming block 71, for example.

  As shown in FIG. 5, the suction holding block 70 is located on the inner side of the groove forming block 71. For example, the suction holding block 70 has a substantially L-shaped longitudinal section having a stepped portion on the outer side. The upper end surface of the suction holding block 70 is a horizontal inner peripheral surface 70a that supports the outer peripheral portion of the substrate W over the entire periphery. When the substrate W is supported, the horizontal inner peripheral surface 70 a can be in close contact with the back surface of the substrate W. A suction port 72 for sucking the substrate W is formed in the horizontal inner peripheral surface 70a. The suction port 72 communicates with, for example, a suction path 73 that passes through the inside of the suction holding block 70, and the suction path 73 is connected to a suction device (not shown) by, for example, a suction pipe 74.

For example, as shown in FIG. 6, the suction port 72 is formed in a slit shape along the horizontal inner peripheral surface 70a. For example, the horizontal inner peripheral surface 70a is formed with the through-hole 14 through which the above-described lifting pin 15 passes, and the suction port 72 is, for example, on the entire circumference of the horizontal inner peripheral surface 70a avoiding the portion of the through-hole 14. It is formed across. Thus, by forming the suction port 72 over substantially the entire circumference of the horizontal inner peripheral surface 70a, the substrate W can be attracted and held evenly over the outer peripheral portion of the substrate W. The suction port 72 is not limited to the slit shape, and may be a shape having a high adsorption effect, and may be formed in a circular shape, for example. In such a case, the suction ports 72 may be evenly arranged at a plurality of locations along the outer periphery of the substrate W.

  A discharge groove 75 for discharging the cleaning liquid used for cleaning the back surface of the substrate W to the outside of the substrate holding member 10 is formed on the lower end surface 70b of the suction holding block 70 as shown in FIG. The discharge groove 75 forms a cleaning liquid discharge hole between the upper surface of the rotary base 2. For example, as shown in FIG. 7, the discharge grooves 75 are formed without unevenness at a plurality of locations along the frame shape of the suction holding block 70. The discharge groove 75 is formed, for example, along the direction in which the centrifugal force acts when the suction holding block 70 rotates, and the cleaning liquid inside the suction holding block 70 can be discharged to the outside during cleaning of the back surface of the substrate accompanying rotation or drying. .

  For example, as shown in FIG. 5, the groove forming block 71 is formed in a substantially rectangular shape in a longitudinal section, and is fitted on a step portion outside the suction holding block 70. Inside the groove forming block 71, a vertical inner peripheral surface 71a is formed. The vertical inner peripheral surface 71 a is formed upward from the outer end of the horizontal inner peripheral surface 70 a of the suction holding block 70. A gap is formed between the vertical inner peripheral surface 71a and the outer surface of the substrate W, and a groove 80 is formed in the gap C between the running stage 11 and the substrate W. In this groove 80, the liquid dripping from the gap C can be retained.

  The upper end horizontal peripheral surface 71b of the groove forming block 71 is, for example, close to the back surface of the run-up stage 11, and the upper end horizontal peripheral surface 71b is provided with a seal member 81 over the entire periphery. The seal member 81 can prevent the liquid in the groove 80 from leaking between the run-up stage 11 and the upper end horizontal peripheral surface 71b.

  In the groove forming block 71, a drain hole 82 for discharging the liquid in the groove 80 is formed. For example, one end of the drainage hole 82 opens to the vertical inner peripheral surface 71a corresponding to the vicinity of the bottom of the groove 80, passes horizontally through the groove forming block 71, and the other end opens to the vertical outer peripheral surface 71c. It is formed to do. The diameter of the drainage hole 82 is such that when the rotary base 2 is stopped, a sealing film that closes the drainage port 82 is obtained by surface tension, and the liquid in the groove 80 is not allowed to flow. For example, the size of the sealing film is set to about 0.8 mm to 1.0 mm so that the sealing film collapses due to the rotational force and allows the liquid to flow only when 2 rotates. For example, as shown in FIG. 8, the drainage holes 82 are formed at a plurality of locations along the frame-shaped groove forming block 71 without deviation. For example, it is formed along the direction in which the centrifugal force acts so as to be easily discharged by the rotation of the rotary base 2.

  A notch 83 is formed in the vertical inner peripheral surface 71 a of the groove forming block 71, and the positioning pin 13 is disposed in the notch 83. Further, the groove forming block 71 and the suction holding block 70 can be removed, for example, by lifting the groove forming block 70 upward as shown in FIG. 9, and replacement and maintenance of the groove forming block 70 and the suction holding block 70 can be performed. It can be easily done.

  Next, the development processing performed in the above-described development processing apparatus 1 will be described. When the substrate W is carried into the development processing apparatus 1, the substrate W is transferred to the lift pins 15 that have been lifted in advance, and placed on the substrate holding member 10 as shown in FIG. Is done. At this time, since a sufficient gap is provided between the mounting position of the substrate W and the substrate holding member 10 and the run-up stage 11, the substrate W is appropriately transferred to the substrate holding member 10. When the substrate W is placed on the substrate holding member 10, the substrate W is sucked and held on the horizontal inner peripheral surface 70 a by suction from the suction port 72.

  Subsequently, the nozzle head 21 that has been waiting in the first standby unit 20 moves to the Y direction positive direction side, moves from the substrate W to the run-up stage 11 on the Y direction negative direction side, and discharges the rinse liquid from the head 21. A lower surface 21 a having an outlet 50, a developer discharge port 30 and a developer suction port 40 is disposed on the run-up stage 11. Then, the nozzle head 21 descends and approaches the surface of the run-up stage 11 that is the start position. Next, discharge of the rinse liquid from the rinse liquid discharge port 50 of the nozzle head 21 is started. The nozzle head 21 moves in the positive direction in the Y direction with the rinsing liquid being discharged, passes through the surface of the run-up stage 11 and the surface of the substrate W, to the vicinity of the end of the run-up stage 11 on the positive side in the Y direction. Moving. At this time, the rinsing liquid is supplied to the entire surface of the running stage 11 and the surface of the substrate W. For example, a liquid film of the rinsing liquid is formed from the surface of the running stage 11 to the surface of the substrate W. Thus, the pre-wet process for improving the wettability of the surface of the substrate W is performed. At the time of this pre-wetting, the rinsing liquid drips from the gap C between the first run-up stage 11 and the substrate W. However, when the groove 80 is filled with the rinsing liquid as shown in FIG. Will disappear. Therefore, a liquid film without a gap is formed on the surfaces of the substrate W and the run-up stage 11. This pre-wetting process may be performed by moving the rinsing liquid discharge nozzle 61 to above the center of the substrate W and rotating the rotary base 2 while discharging the rinsing liquid onto the substrate W.

  Subsequently, the nozzle head 21 is returned again to the start position of the run-up stage 11 on the Y direction negative direction side. In a state where the lower surface 21a of the nozzle head 21 is in contact with the liquid film of the rinsing liquid, the rinsing liquid is discharged from the rinsing liquid discharge port 50, the developing liquid is discharged from the developing discharge port 30, and the rinsing liquid is discharged from the developing liquid suction port 40. It moves to the positive side in the Y direction while sucking the developer. At this time, the space between the lower surface 21a of the nozzle head 21 and the surface of the run-up stage 11 is always filled with the rinsing liquid and the developer, and the bubble biting phenomenon on the lower surface 21a of the nozzle head 21 is prevented. When the nozzle head 21 moves forward in the Y direction and moves on the surface of the substrate W, the developer discharged from the developer discharge port 30 onto the substrate W is forward of the nozzle head 21 in the traveling direction. The developer is sucked from the developer suction ports 40 on the side and the rear side, and a belt-like developer flow is formed in a partial region of the surface of the substrate W. The surface of the substrate W is developed by the flow of the developing solution. The dissolved product generated by development is immediately discharged from the developer suction port 40. The supply of the developer to the substrate W may be performed when the nozzle head 21 returns to the start position after the rinsing liquid film is formed on the substrate W and the run-up stage 11.

  For example, the nozzle head 21 moves to the vicinity of the end of the run-up stage 11 on the positive side in the Y direction while continuously supplying and sucking the developer. By doing so, the region where the flow of the developing solution gradually moves, and the entire surface of the substrate W is developed. When the nozzle head 21 moves to the vicinity of the end of the run-up stage 11 on the positive side in the Y direction, the supply and suction of the developer and the rinse liquid are stopped, and the nozzle head 21 is returned to the first standby unit 20. Subsequently, the rinse liquid discharge nozzle 61 that has been waiting in the second standby unit 60 moves to above the center of the substrate W, and the substrate W is rotated by the rotary base 2. The rinse liquid is discharged onto the substrate W rotated from the rinse liquid discharge nozzle 61, and the substrate W is cleaned. At this time, for example, the cleaning liquid may be discharged from the back surface cleaning nozzle 17 and supplied to the back surface of the substrate W.

  After the substrate W is cleaned for a predetermined time, the substrate W is rotated at a high speed and the substrate W is dried. At this time, the liquid staying in the groove 80 is discharged through the drain hole 82 of the substrate holding member 10 by centrifugal force. Further, the cleaning liquid on the back surface of the substrate W is also discharged through the discharge groove 75.

  When the substrate W is dried, the suction of the substrate W is released, the substrate W is lifted again by the lift pins 15, and is carried out of the substrate processing apparatus 1 by a transfer arm (not shown).

  According to the above embodiment, the substrate holding member 10 sucks and holds the back surface of the outer peripheral portion of the substrate W over the entire circumference, and further, the groove 80 in which liquid stays is formed between the substrate W and the outer surface. Therefore, it is possible to prevent the liquid from flowing out from the gap C while maintaining the gap C for transferring the substrate W between the substrate W and the running stage 11. As a result, a liquid film without a gap can be formed from the surface of the substrate W to the surface of the run-up stage 11, and as a result, bubbles are introduced into the developer during supply and suction of the developer by the nozzle head 21. Biting can be prevented.

  Since the slit-like suction ports 72 are formed on the horizontal inner peripheral surface 70a of the substrate holding member 10 over almost the entire circumference, the outer periphery of the substrate W is evenly adsorbed and the back surface of the substrate W is completely attached to the substrate holding member 10. It is possible to prevent the liquid on the substrate W from flowing around to the back side of the substrate W.

  Since the drain hole 82 through which the liquid in the groove 80 is discharged by centrifugal force is formed in the substrate holding member 10, the liquid staying in the groove 80 can be discharged, and the liquid remains in the groove 80. The liquid can be prevented from causing particles.

  Since the sealing member 81 is provided on the upper-end horizontal peripheral surface 71 b of the groove forming block 71, it is possible to prevent liquid in the groove 80 from leaking between the run-up stage 11 and the substrate holding member 10.

  Since the discharge groove 75 is formed in the lower end surface 70 b of the substrate holding member 10, for example, the cleaning liquid used for the back surface cleaning can be appropriately discharged to the outside of the substrate holding member 10.

  In the above embodiment, by forming the groove 80 in which the liquid stays between the substrate holding member 10 and the outer surface of the substrate W, the liquid flows out from the gap C between the running stage 11 and the substrate W. However, the liquid may be prevented from flowing out by attaching an elastic sheet-like seal member in the gap C between the run-up stage 11 and the substrate W. FIG. 10 shows such an example, and the seal member 100 is formed in, for example, a square frame shape that matches the shape of the gap between the running stage 11 and the substrate W. The seal member 100 is formed so that at least the inner periphery thereof covers the gap between the run-up stage 11 and the substrate W. For example, the inner peripheral surface of the seal member 100 is formed so as to slightly contact the outer surface of the substrate W held by the substrate holding member 101. The seal member 100 is formed in a thin sheet shape of, for example, about 0.2 mm or less. For example, the material of the seal member 100 is, for example, flexible PCTFE (polychlorotrifluoroethylene), PTFE (polytetrafluoroethylene). Or a rubber material with excellent chemical resistance containing, for example, silicon. Thereby, the sealing member 100 has elasticity as a whole. For example, the outer peripheral side of the seal member 100 is fixed to the backside of the running stage 11 by a fixing member 102 such as a screw. The substrate holding member 101 has the same configuration as the suction holding block 70 of the above-described embodiment, for example, and has a suction port 103 on the upper surface.

  When the substrate W is placed on the substrate holding member 101, the outer surface of the substrate W comes into contact with the inner peripheral surface of the seal member 100. At this time, since the inner peripheral portion of the seal member 100 has elasticity, it is bent slightly downward as shown in FIG. 10, and the contact between the inner peripheral surface of the seal member 100 and the outer surface of the substrate W is maintained. . By doing so, it is possible to close between the outer surface of the substrate W and the run-up stage 11 while appropriately transferring the substrate W. When a liquid film is formed on the substrate W and the run-up stage 11, no liquid flows out between the substrate W and the run-up stage 11.

  The seal member 100 may be formed slightly larger than the outer shape of the substrate W so that the inner peripheral surface of the sheet 100 and the outer surface of the substrate W do not contact each other. In such a case, even if there is a slight gap between the seal member 100 and the outer surface of the substrate W, the liquid does not flow out of the gap due to the surface tension of the liquid. At this time, the gap between the inner peripheral surface of the sheet 100 and the outer surface of the substrate is desirably 0.1 mm or less.

  Further, instead of the seal member 100 described in the above embodiment, a tube as an expansion / contraction member that expands / contracts with a fluid may be disposed inside the running stage 11. FIG. 11 shows such an example. For example, a square frame-shaped tube housing portion 110 along the gap between the running stage 11 and the substrate W is provided inside the running stage 11. An opening 110 a is formed on the inner peripheral surface of the tube housing part 110. A tube 111 is accommodated in the tube accommodating portion 110 along the frame-shaped tube accommodating portion 110. For example, the tube 111 can be expanded and contracted toward the outer peripheral surface of the substrate W by supplying and exhausting air from the air introduction tube 112.

  When the substrate W is placed on the substrate holding member 101, the tube 111 is reduced, and a gap is formed between the run-up stage 11 and the substrate W. When the substrate W is placed and held on the substrate holding member 101, air is supplied to the tube 111 and the tube 111 is expanded. The expansion of the tube 111 closes the gap between the run-up stage 11 and the substrate W. When the substrate W is carried out, the tube 111 is again reduced, and a gap is formed between the run-up stage 11 and the substrate W. According to such an example, when the substrate W is delivered, a gap is provided between the run-up stage 11 and the substrate W, so that the substrate W can be suitably delivered. Further, when a liquid film is formed on the running stage 11 and the substrate W, the gap between the running stage 11 and the substrate W can be closed to prevent the liquid film from flowing out. Further, the substrate W can be positioned by the expansion of the tube 111.

  The above embodiment shows an example of the present invention, and the present invention is not limited to this example and can take various forms. For example, the present invention is not limited to a rectangular substrate such as a reticle, LCD, or FPD (flat panel display), but can be applied to other substrates such as a circular substrate such as a wafer.

  INDUSTRIAL APPLICABILITY The present invention is useful for preventing a liquid from flowing out from a gap between an outer peripheral plate and a substrate in a development processing apparatus having a nozzle head that supplies and sucks developer and an outer peripheral plate that surrounds the outer peripheral portion of the substrate. It is.

It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of the image development processing apparatus concerning this Embodiment. It is explanatory drawing of the cross section which shows the outline of a structure of a development processing apparatus. It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of a nozzle head. It is a perspective view which shows the outline of a board | substrate holding member. It is explanatory drawing of the longitudinal cross-section of a board | substrate holding member. It is a top view of a board | substrate holding member. It is a reverse view of the adsorption block of a board | substrate holding member. It is a cross-sectional view of the groove forming block of the substrate holding member. It is a perspective view of the board | substrate holding member which shows the state which removed the groove | channel formation block and the adsorption | suction holding block. It is explanatory drawing of the longitudinal cross-section of a board | substrate holding member periphery at the time of providing a sheet-like sealing member. It is explanatory drawing of the longitudinal cross-section of a board | substrate holding member periphery at the time of providing a tube.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Development processing apparatus 2 Rotating base 10 Substrate holding member 11 Run-up stage 21 Nozzle head 70 Suction holding block 70a Horizontal inner peripheral surface 71 Groove formation block 71a Vertical inner peripheral surface 72 Suction port 80 Groove C Gap W Substrate

Claims (9)

A rotatable base,
A substrate holding member mounted on the rotating base and supporting and holding the outer periphery of the substrate;
Movable along the surface of the substrate held by the substrate holding member, and the nozzle head for supplying the developing solution against the substrate,
An outer peripheral plate capable of rotating together with the rotary base and forming a continuous liquid film from the surface of the substrate on the same plane of the surface of the substrate surrounding the outer peripheral portion of the substrate held by the substrate holding member; , With
A gap is provided between the substrate and the outer peripheral plate,
The substrate holding member is attached to the back surface of the outer peripheral portion of the substrate by adhering to the entire outer periphery of the substrate to suck and hold the substrate, and a part of the substrate holding member is interposed between the outer surface of the substrate and the substrate. It is configured to form a groove that opens in the gap and retains liquid ,
The substrate holding member has a frame shape along the outer periphery of the substrate,
The inner peripheral surface of the frame-shaped substrate holding member is formed in an upward direction from a horizontal inner peripheral surface that supports and adsorbs the outer peripheral portion of the substrate over the entire circumference and an outer end portion of the horizontal inner peripheral surface. A vertical inner peripheral surface forming the groove surrounding the outer surface of the substrate;
The substrate holding member has a drainage hole for discharging the liquid in the groove,
The development processing apparatus, wherein the drainage hole is formed in the vertical inner peripheral surface so that the liquid in the groove is discharged by a centrifugal force generated by the rotation of the rotary base . The development processing apparatus according to claim 1, wherein the nozzle head simultaneously supplies and sucks the developer with respect to the substrate. 3. The development processing apparatus according to claim 1, wherein a suction port for sucking the substrate is formed on the horizontal inner peripheral surface. The development processing apparatus according to claim 3, wherein the suction port is formed in a slit shape along a frame shape of the substrate holding member. The substrate holding member has an upper horizontal peripheral surface formed along the rear surface of the outer peripheral plate from the upper end of the vertical inner peripheral surface in the horizontal direction,
  The seal member for preventing the liquid in the groove from leaking from between the outer peripheral plate and the upper end horizontal peripheral surface is provided on the upper end horizontal peripheral surface. 5. The development processing apparatus according to any one of 4 above. The substrate holding member individually includes a suction holding block that has the horizontal inner peripheral surface and sucks and holds the substrate, and a groove forming block that has the vertical peripheral surface and forms the groove, The development processing apparatus according to claim 1. It further has lifting pins that support and lift the substrate,
  The development processing apparatus according to claim 6, wherein the suction holding block has a through hole through which the elevating pin passes. Inside the frame-shaped substrate holding member, a cleaning liquid supply unit for supplying a cleaning liquid to the back surface of the substrate is provided,
  8. The development processing apparatus according to claim 1, wherein the substrate holding member has a cleaning liquid discharge hole for discharging the cleaning liquid inside the substrate holding member to the outside. The development processing apparatus according to claim 1, wherein the substrate holding member has a positioning pin that abuts on an outer surface of the substrate in order to position a holding position of the substrate.

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