KR100819157B1 - Apparatus for treating substrates - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention discloses a substrate processing apparatus, wherein in a spin type substrate processing apparatus, a container for preventing scattering of chemical liquid is supported at both ends to move up and down, and a guide member is used to guide the movement of the container up and down. To have.

According to such a structure, the board | substrate processing apparatus which can stably move up and down the container which prevents scattering of a chemical liquid can be provided.

Spin Type Substrate Processing Unit, Catch Cup, Drive Unit, Guide Member

Description

Substrate Processing Unit {APPARATUS FOR TREATING SUBSTRATES}

1 is a schematic configuration diagram showing an example of an inline semiconductor manufacturing apparatus in which a substrate processing apparatus according to the present invention is installed;

2 and 3 are a schematic perspective view and a plan view of the developing apparatus shown in FIG. 1, respectively;

4 is a schematic cross-sectional view taken along the line AA ′ of FIG. 3;

5 is a schematic cross-sectional view shown for explaining the operating state of the substrate processing apparatus according to the present invention.

<Description of Symbols for Main Parts of Drawings>

1 spinner equipment 2 interface unit

3: scanner facility 20: processing unit

100: coating device 200: developing device

210: process chamber 220: substrate support member

230 container 242 first drive unit

244: second drive unit 246: guide member

250: door member 300: baking device

320: carrier robot

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a spin type sheet type substrate processing apparatus for processing a substrate by spraying a chemical liquid on a rotating substrate.

In general, a semiconductor device is manufactured through a plurality of processes such as an ion implantation process, a thin film deposition process, a diffusion process, a photo process, and an etching process, and among these processes, a photo process for forming a predetermined pattern on the surface of a semiconductor wafer. Is an essential step for manufacturing a semiconductor device.

This photo process is largely a coating process for applying a photoresist on a wafer, a photoresist-coated wafer and a predetermined mask are aligned with each other, and then irradiated with a photoresist on the wafer by passing light such as ultraviolet rays through a mask. It is divided into the exposure process which makes it possible, and the development process which forms the pattern on the surface of a wafer by developing the photoresist of the wafer on which the exposure process was completed.

The developing process is an immersion method in which an exposed wafer is placed in a bath containing a developer, waits for a predetermined time, and then discharged. After the wetting, a puddle method for cleaning the developer after a predetermined reaction waiting time, a spray method for rotating the substrate on which the exposure process is performed, and spraying the developer on the upper part thereof.

The dual-spray type photoresist developing apparatus includes a process chamber in which a developing process is performed, a spin chuck installed in the processing chamber and a wafer placed thereon, and waste liquids such as a photoresist disposed around the spin chuck and etched by the developer or the developer are scattered. The catch cup for preventing and the drive part which moves a catch cup to an up-down direction.

However, since the catch cup is connected in the form of a cantilever to the driving unit for moving the catch cup in the up and down direction, there is a problem in that a sag phenomenon occurs due to its own weight.

In addition, since the driving unit for moving the catch cup in the vertical direction is disposed outside the processing chamber, the developer injected onto the wafer flows out of the processing chamber through the connecting member connecting the catch cup and the driving unit to contaminate the semiconductor manufacturing equipment. There was a problem.

Therefore, the present invention was created to solve the problem in view of the problems of the conventional conventional photoresist developing apparatus as described above, and an object of the present invention is to solve the problem of sag of the catch cup and to install the equipment by the outflow of the developing solution. To provide a substrate processing apparatus that can prevent contamination of the.

In order to achieve the above object, the substrate processing apparatus according to the present invention comprises a spin type single wafer type substrate processing apparatus for processing a substrate by spraying a chemical solution on a rotating substrate, the substrate processing step of proceeding; A substrate support member rotatably installed in the processing chamber and on which the substrate is placed; A container disposed to surround a circumference of the substrate supporting member and preventing the chemical liquid sprayed onto the substrate placed on the substrate supporting member from scattering; And a driving unit supporting both ends of the container so as to distribute the load by the weight of the container.

In the substrate processing apparatus according to the present invention having the configuration as described above, the apparatus preferably further comprises a guide member for guiding the vertical movement of the container driven by the drive unit.

According to an aspect of the present invention, it is preferable that the driving unit is installed in the processing chamber to prevent the chemical liquid scattered in the processing chamber from flowing out of the processing chamber through the driving unit.

According to another aspect of the invention, the device is connected to one side of the container, the door member for opening and closing the opening and closing the opening and closing the substrate formed in the side wall of the processing chamber in conjunction with the vertical movement of the container; Do.

Hereinafter, a substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

(Example)

In the present embodiment, a developing apparatus for developing a photosensitive material by spraying a developing solution on an upper surface of a substrate on which an exposure process is performed by the substrate processing apparatus will be described as an example. However, the technical idea of the present invention is not limited thereto, and may be applied to other types of spin type substrate processing apparatuses for treating a substrate by spraying a chemical liquid such as a photosensitive liquid or a cleaning liquid on a rotating substrate.

1 is a schematic configuration diagram illustrating an example of an inline semiconductor manufacturing apparatus in which a substrate processing apparatus according to the present invention is installed.

Referring to FIG. 1, a semiconductor manufacturing apparatus according to the present embodiment relates to an in-line apparatus in which a semiconductor photographing process is sequentially performed, and includes a spinner apparatus 1, an interface unit 2, and the like. It includes a scanner facility (3). The spinner installation 1 and the scanner installation 3 are arranged side by side, with an interface 2 for transferring the substrate between the installations 1, 3. The substrate on which the coating process is completed in the spinner facility 1 is transferred to the scanner facility 3 and the exposure process proceeds. The substrate on which the exposure process is completed in the scanner facility 3 is transferred to the spinner facility 1 again to develop the process. Proceed.

The spinner installation 1 has the index part 10 and the processing unit 20. The index unit 10 includes a carrier station 11 on which a carrier (not shown) containing a plurality of substrates is placed, and a carrier station 11 from the carrier station 11 to the processing unit 20 or from the processing unit 20. ) A carrier station arm 12 for transporting the substrate.

The processing unit 20 is provided adjacent to the index portion 10 and has a coating device 100, a developing device 200, and a baking device 300. Each of the apparatuses 100, 200, and 300 may be disposed laterally on both sides of the passage 310 in the center in accordance with the flow of the process. And the passage 310 is provided with a transfer robot 320 for transferring the substrate between each device (100, 200, 300) or between each device (100, 200, 300) and the interface unit (2).

2 and 3 are respectively a schematic perspective view and a plan view of the developing apparatus 200 shown in FIG. 1, FIG. 4 is a schematic sectional view taken along line AA ′ of FIG. 3, and FIG. 5 is a substrate processing according to the present invention. It is a schematic cross-sectional view shown for explaining the operating state of the device.

The developing apparatus 200 forms a pattern by spraying a developing solution on the upper surface of the substrate on which the exposure process is completed, and developing a photosensitive material in an exposed portion or an unexposed portion.

2 to 5, the developing apparatus 200 includes a processing chamber 210 in which a developing process of developing a photosensitive material on a substrate is performed. The substrate support member 220 on which the substrate is placed is installed inside the process chamber 210, and the substrate support member 220 is rotated during the process by the rotation driver 222 connected to the lower portion thereof. As the substrate support member 220, an electrostatic chuck (ESC) that adsorbs and supports the substrate by electrostatic power may be used. Alternatively, the substrate may be fixed to the substrate support member 220 by using a mechanical clamping method, and a vacuum chuck of a method of adsorbing and supporting the substrate by vacuum pressure may be used as the substrate support member 130. have.

Then, one side of the substrate support member 220 is a developer supply nozzle (not shown) for spraying the developer onto the substrate W placed on the substrate support member 220 and a rinse solution such as pure water on the substrate W. A rinse liquid supply nozzle (not shown) for spraying is provided.

When the developer is injected onto the substrate W from the developer supply nozzle (not shown), the injected developer moves from the center portion of the substrate to the edge direction by centrifugal force caused by the rotation of the substrate support member 220, thereby leading to The photosensitive material of the substrate region irradiated with light or the substrate region not irradiated with light is selectively etched by the exposure process.

By the way, the developer injected onto the substrate W is scattered by the rotation of the substrate support member 220. In order to prevent the chemical liquid from scattering in this way, the container 230 is disposed around the substrate support member 220 to surround the substrate support member 220.

The vessel 230 has a generally cylindrical shape with an open top. Specifically, the container 230 has a circular bottom wall 232 and a side wall 234 extending above the bottom wall 232, and an opening having a shape corresponding to the bottom wall 232 at the top of the side wall 234. The plate member 236 is formed is coupled. In addition, an exhaust member (not shown) such as a pump may be connected to the exhaust hole (not shown) formed in the lower wall 232, and the exhaust member (not shown) may include chemical liquid scattered by the rotation of the substrate W. A negative pressure may be provided to exhaust the air inside the container.

In order to load the substrate W to be processed onto the substrate support member 220 or to unload the processed substrate W from the substrate support member 220, the container 230 must be moved in the vertical direction. To this end, the container 230 is connected to the driving unit 240 for moving the container 230 in the vertical direction. The driving unit 240 has a first driving unit 242 and a second driving unit 244, and the first and second driving units 242 and 244, as shown in FIG. 2, the upper plate member 236 of the container 230. Are arranged diagonally to each other. When the container 230 moves up and down by the first and second driving units 242 and 244 disposed as described above, the container 230 is supported by both the first and second driving units 242 and 244 so that the container 230 may be supported. There is an effect that the load due to the self weight is distributed. Here, the first and second drivers 242 and 244 may be provided with various driving sources such as a cylinder mechanism or a driving motor.

The container 230 is provided with a guide member 246 for guiding the vertical movement of the container 230 driven by the driving unit 240. The guide member 246 is connected to the upper plate member 236 of the container 230, and may be connected to any one of corners between the first and second driving units 242 and 244 on the plate member 236. As the container 230 is driven by the first and second driving units 242 and 244 as described above and guided by the guide member 246, the container 230 can move up and down in a stable state of three-point support.

Meanwhile, in order to load / unload the substrate W into the substrate support member 220, a passage through which a transfer robot (not shown) outside the processing chamber 210 may move is required. For this purpose, a sidewall of the processing chamber 210 may be provided. An opening 212 for carrying in and out of the substrate is formed. The opening 212 is formed in the sidewall of the processing chamber 210 to correspond to the height of the substrate supporting member 220. In addition, the opening 212 should be sealed to prevent the developing solution scattered during the development process from flowing out of the processing chamber 210. To this end, a door member 250 for sealing the opening 212 of the processing chamber 210 is provided at one side of the container 230. The door member 250 is an opening and closing member extending in a vertical downward direction from the connecting member 252 and the connecting member 252 which are coupled on the same plane as the plate member 236 on one side of the plate member 236 of the container 230. Has (254). As illustrated in FIG. 5, the door member 250 provided in the container 230 may open and close the substrate opening and opening 212 formed on the sidewall of the processing chamber 210 in association with the vertical movement of the container 230. Open and close.

The development process of developing the photosensitive material on a board | substrate using the image development apparatus which has the above-mentioned structure is as follows.

First, the exposed substrate is placed on a substrate support member. When the substrate on which the exposure process has been performed is seated on the substrate supporting member, the substrate supporting member is rotated at a predetermined speed by driving of the rotation driving unit in a state where the substrate is fixed. The developer supply nozzle injects a predetermined amount of developer onto the substrate. At this time, the developer injected onto the substrate moves from the center portion of the substrate to the edge direction by the centrifugal force caused by the rotation of the substrate supporting member, thereby removing the photosensitive material of the substrate region that is lighted or the substrate region that is not lighted by the exposure process. Etch selectively. After selectively etching the photosensitive material on the substrate, the substrate is rinsed by rotating the substrate while supplying a rinse liquid such as pure water onto the substrate. When the rinse treatment is completed, the supply of the rinse liquid is stopped and spin-dried while rotating the substrate at high speed.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

As described above, according to the present invention, the container for preventing the scattering of the chemical liquid can be stably moved up and down.

And according to this invention, contamination of the semiconductor manufacturing equipment by the outflow of a chemical liquid can be prevented.

Claims (4)

delete In the spin type sheet type substrate processing apparatus which injects a chemical | medical solution on a rotating board | substrate, and processes a board | substrate, A processing chamber in which a substrate processing step is performed; A substrate support member rotatably installed in the processing chamber and on which the substrate is placed; A container disposed to surround a circumference of the substrate supporting member and preventing the chemical liquid sprayed onto the substrate placed on the substrate supporting member from scattering; A driving unit for supporting the container at both ends so as to disperse the load by the weight of the container to move up and down; And And a guide member for guiding the vertical movement of the container driven by the drive unit. The method of claim 2, The driving unit, And the chemical liquid scattered in the processing chamber is installed in the processing chamber to prevent the chemicals from flowing out of the processing chamber through the driving unit. The method of claim 3, wherein The device, And a door member connected to one side of the container, the door member opening and closing an opening for opening and closing the substrate formed on the sidewall of the processing chamber in association with the vertical movement of the container.

Images