JP3591964B2 - Ultrasonic nozzle - Google Patents

Ultrasonic nozzle Download PDF

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Publication number
JP3591964B2
JP3591964B2 JP03292096A JP3292096A JP3591964B2 JP 3591964 B2 JP3591964 B2 JP 3591964B2 JP 03292096 A JP03292096 A JP 03292096A JP 3292096 A JP3292096 A JP 3292096A JP 3591964 B2 JP3591964 B2 JP 3591964B2
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Japan
Prior art keywords
processing liquid
flow path
substrate
liquid flow
oscillating body
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Expired - Fee Related
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JP03292096A
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Japanese (ja)
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JPH09201557A (en
Inventor
正美 大谷
讓一 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Priority to JP03292096A priority Critical patent/JP3591964B2/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0623Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers coupled with a vibrating horn
    • B05B17/063Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers coupled with a vibrating horn having an internal channel for supplying the liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0623Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers coupled with a vibrating horn

Description

【0001】
【発明の属する技術分野】
本発明は、超音波振動を付与した処理液(純水やプリウエット液など)を、半導体ウエハや液晶表示装置用のガラス基板、フォトマスク、光ディスク用の基板などの基板に供給して所定の基板処理(基板洗浄処理や、フォトリソグラフィ工程の露光処理後の現像処理で行なわれるプリウエット処理など)を行なうために用いられる超音波ノズルに係り、特には、処理液に超音波振動を付与する発振体と、発振体の振動面に連結される経路を持つ処理液流路とが設けられている超音波ノズルの改良技術に関する。
【0002】
【従来の技術】
従来のこの種の超音波ノズル100は、図5に示すように、その内部に処理液に超音波振動を付与する発振体101と、発振体101の振動面101aに連結される経路を持つ処理液流路102などが設けられている。
【0003】
なお、図中の符号103は、発振体101を励振させるための高周波電圧を発振体101に印加するためのケーブルを示す。また、符号104は、処理液供給管を示し、この処理液供給管104は、一端側が処理液供給源105に連通接続され、他端側が処理液流路102の入口102aに連通接続されている。
【0004】
この従来装置によれば、処理液供給源105から供給される処理液(純水やプリウエット液など)が処理液供給管104を経て超音波ノズル100内の処理液流路102に供給され、処理液流路102の流路中で、励振された発振体101により処理液に超音波振動が付与された後、その処理液が処理液流路102の出口から基板の表面に供給されて所定の基板処理(洗浄処理など)が行なわれる。
【0005】
【発明が解決しようとする課題】
しかしながら、このような構成を有する従来例の場合には、次のような問題がある。
図5に示すように、従来例に係る超音波ノズル100では、処理液供給管104から処理液流路102への処理液の供給方向Y1と、超音波ノズル100内の発振体101の振動面101aの配置方向とが平行になるように構成されており、処理液流路102の流路中で発振体101の振動面101aに連結させるために、処理液流路102は図5のようにクランク状に構成されている。
【0006】
そのため、処理液流路102に多数の曲がり部が形成されるので、処理液流路102内に流れる処理液の圧力損失が大きくなるなどに起因して、超音波ノズル100から基板へ供給される処理液の流量が減少し、基板処理を好適に行なえないという不都合があった。一方、超音波ノズル100から基板へ充分な流量で処理液を供給するためには、処理液供給源105から処理液供給管104への処理液の送り出し力を高めなければならず、処理液供給源105の負荷が大きくなるという別異の問題があった。
【0007】
また、処理液流路が曲がって形成されているので、その流路が変わる時、流体中に溶在している気体がキャビテーション作用で溶出し、発振体面に気体が作用して発振体を破損することがあった。
【0008】
本発明は、このような事情に鑑みてなされたものであって、処理液供給源の負荷を大きくすることなく、超音波ノズルから基板へ充分な流量で処理液を供給して、基板処理を好適に行なうことができる超音波ノズルを提供することを目的とする。
【0009】
【課題を解決するための手段】
本発明は、このような目的を達成するために、次のような構成をとる。
すなわち、請求項1に記載の発明は、基板に供給するための処理液に超音波振動を付与する発振体と、前記発振体の振動面に連結される経路を持つ処理液流路とが設けられている超音波ノズルにおいて、処理液流路の入口から前記発振体への処理液の供給方向と、前記発振体の振動面の配置方向とが交差し、かつ、処理液流路の入口から前記発振体までの処理液流路部分を水平方向に直線状に構成するとともに、前記発振体から処理液流路の出口までの処理液流路部分を垂直方向に直線状に構成し、さらに、処理液流路の入口から発振体までの処理液流路部分と、発振体から処理液流路の出口までの処理液流路部分とが交わる角部で、発振体は、その振動面の配置方向が前記両処理液流路部分に対してそれぞれ傾斜するように配置されていることを特徴とするものである。
【0011】
【作用】
本発明の作用は次のとおりである。
すなわち、請求項1に記載の発明によれば、処理液流路の入口から前記発振体への処理液の供給方向と、発振体の振動面の配置方向とが交差するように超音波ノズルを構成しているので、処理液流路の入口から発振体までの処理液流路に曲がり部を形成することなく、発振体から処理液に超音波振動を付与させることができる。従って、処理液流路に曲がり部が少なくなり、それだけ、処理液流路内に流れる処理液の圧力損失を減少させることができる。
【0012】
また、請求項1に記載の発明によれば、処理液流路の入口から前記発振体までの処理液流路部分を水平方向に直線状に構成するとともに、前記発振体から処理液流路の出口までの処理液流路部分を垂直方向に直線状に構成し、さらに、処理液流路の入口から発振体までの処理液流路部分と、発振体から処理液流路の出口までの処理液流路部分とが交わる角部で、発振体は、その振動面の配置方向が前記両処理液流路部分に対してそれぞれ傾斜するように配置したので、処理液流路の曲がり部が発振体部分の1個所になり、処理液流路内に流れる処理液の圧力損失を減少させることができる。
【0013】
【発明の実施の形態】
本発明の実施の形態を図1を参照して説明する。
図中の符号1は、基板処理装置に備えられる処理液供給機構を示し、この処理液供給機構1は、本発明に係る超音波ノズル2や処理液供給管3、処理液供給源4などを備えている。超音波ノズル2はその内部に、処理液に超音波振動を付与する発振体5と、発振体5の振動面5aに連結(例えば、図示しないパッキンなどを介して連結)される経路を持つ処理液流路6などが設けられている。
【0014】
発振体5にはケーブル7が接続されていて、このケーブル7を介して高周波電圧が発振体5に印加されることで、発振体5は、超音波と呼ばれる周波数で振動されるように励振される。そして、この発振体5の超音波振動が処理液流路6内に流れる処理液に付与され、超音波振動が付与された処理液が処理液流路6の出口6bから基板の表面に供給され所定の基板処理が行なわれる。
【0015】
なお、発振体5は、圧電効果や電気ひずみ効果を有する材料を、所望の機械共振周波数(例えば、1.5MHz程度の超音波と呼ばれる周波数)を得られるような形状に成形したもので、例えば、圧電効果の大きな結晶や、電気ひずみ効果の大きなチタン酸ジルコン酸鉛磁器などのセラミックなどで構成されている。
【0016】
また、処理液供給管3は、一端側が処理液供給源4に連通接続され、他端側が処理液流路6の入口6a側に連通接続されている。なお、処理液供給源4は、処理液貯留タンクからポンプで処理液を送り出すように構成されたり、処理液貯留タンクからガス圧で処理液を圧送するように構成される。
【0017】
さて、本発明では、処理液流路6の入口6aから発振体5への処理液の供給方向Y2と、発振体5の振動面5aの配置方向とが交差するように、超音波ノズル2を、例えば、図1(c)に示すように構成している。なお、図1(a)および(b)は参考例である。
【0018】
図1(a)では、発振体5の振動面5aの配置方向が図のH方向(例えば、水平方向)に平行になるように発振体5が超音波ノズル2内に設けられている。また、処理液供給管3から処理液流路6への処理液の供給方向Y1がH方向に対して斜め下方から斜め上方に向くように処理液供給管3が処理液流路6の入口6a(超音波ノズル2)に連通接続され、処理液流路6の入口6aから発振体5までの処理液流路部分が、処理液供給管3と平行に連なるように配されている。これにより、処理液流路6の入口6aから発振体5への処理液の供給方向Y2と、発振体5の振動面5aの配置方向とを交差させている。
【0019】
図1(b)では、発振体5の振動面5aの配置方向がV方向(例えば、垂直方向)に平行になるように発振体5が超音波ノズル2内に設けられ、処理液供給管3から処理液流路6への処理液の供給方向Y1がH方向になるように処理液供給管3が処理液流路6の入口6aに連通接続され、処理液流路6の入口6aから発振体5までの処理液流路部分を、処理液供給管3と平行に連なるように配させ、これにより、処理液流路6の入口6aから発振体5への処理液の供給方向Y2と、発振体5の振動面5aの配置方向とを交差させている。
【0020】
図1(c)では、発振体5の振動面5aの配置方向がH方向(V方向)に対して傾斜するように発振体5が超音波ノズル2内に設けられ、処理液供給管3から処理液流路6への処理液の供給方向Y1がH方向になるように処理液供給管3が処理液流路6の入口6aに連通接続され、処理液流路6の入口6aから発振体5までの処理液流路部分を、処理液供給管3と平行に連なるように配させ、これにより、処理液流路6の入口6aから発振体5への処理液の供給方向Y2と、発振体5の振動面5aの配置方向とを交差させている。
【0021】
そして、各図の構成においては、処理液流路6の入口6aから発振体5までの処理液流路部分が、処理液供給管3と平行に連なるように配され、その処理液流路部分が直線状になるように構成され、処理液流路6が発振体5部分で折り返され、発振体5から処理液流路6の出口6bまでの処理液流路部分がV方向に平行に連なるように配され、その出口側の処理液流路部分も直線状になるように構成されている。
【0022】
図1に示した構成によれば、処理液流路6の曲がり部が発振体5部分の1個所になり、処理液流路6内に流れる処理液の圧力損失を減少させることができ、処理液供給源4の負荷を大きくすることなく、超音波ノズル2から基板へ充分な流量で処理液を供給することができ、基板処理を好適に行なうことができる。また、処理液流路6の曲がり部が少なくなったので、流体中に溶在する気体の溶出が起き難くなり、発振体5の破損を軽減させることもできるようになった。
【0023】
なお、図1に示した構成は、本発明の一例を示すものであり、その他の構成で実現することも可能である。
【0024】
次に、上記した本発明に係る超音波ノズル2を含む処理液供給機構1を備えた基板処理装置の一実施例を説明する。
【0025】
【実施例】
図2は、基板処理装置の一つである基板洗浄装置の構成を示す縦断面図であり、図3は、その平面図である。なお、この実施例では、基板の一つである半導体ウエハの洗浄装置を例示しているが、その他の基板(液晶表示装置用のガラス基板やフォトマスク、光ディスク用の基板など)を洗浄するための基板洗浄装置にも本発明に係る超音波ノズルは同様に適用することができる。
【0026】
この実施例装置は、図2、図3に示すように、基板(半導体ウエハ)Wを水平姿勢で保持して鉛直軸回りに回転するメカニカルスピンチャック10や、このメカニカルスピンチャック10の上方に位置して水平移動掃引可能に設けられ、メカニカルスピンチャック10に保持された基板Wの上面に超音波振動が付与された処理液(例えば、純水などの洗浄液)を供給する処理液供給機構1、メカニカルスピンチャック10に保持された基板Wを囲うように設けられ、洗浄液を回収するとともに、図示しない強制排気機構に連通され流下気流を形成するように構成された飛散防止カップ11などを備えて構成されている。
【0027】
メカニカルスピンチャック10は、複数個(図では5個)の基板支持部21を略円形に配置して立設した回転台22や、飛散防止カップ11の底壁41の中央部を貫通して回転台22を鉛直軸回りに軸支する支軸23、支軸23を回転駆動する図示しない駆動モーターなどを備えて構成されている。なお、基板支持部21は、基板Wの端部を下面から支持する鉛直支持部21aと、基板Wの水平位置を規制する水平規制部21bとで構成され、水平規制部21bは、基板Wの外周端縁に当接し、回転台22の回転を基板Wに有効に伝達するようにしている。
【0028】
なお、回転台22はカップ11が図に示す上昇位置において基板Wを保持して回転させ、その基板Wの洗浄が行なわれ、一方、図示しないカップ11の下降位置で基板Wを図示しない基板搬送機構との間で受け渡すように構成されている。
【0029】
処理液供給機構1は、例えば、図1で説明した構成のものが用いられている。なお、図2、図3中、図1と共通する部分は図1と同一符号を付してその詳述は省略する。この実施例装置では、処理液供給機構1の超音波ノズル2は、ノズルアーム31の先端部に取り付けられている。ノズルアーム31の基端部はアーム支軸32に水平揺動自在に軸支され、アーム支軸32はロータリーアクチュエータ33により鉛直軸回りに回転可能に構成されている。これにより、超音波ノズル2が、メカニカルスピンチャック10に保持された基板Wの端部から中心部にかけての範囲を往復移動掃引するようになっている。
【0030】
また、図3において、符号12〜14は、超音波振動を付与しない純水などの洗浄液を基板Wに供給して超音波洗浄と異なる方法で洗浄を行なうときに、それぞれ選択的に用いられる副洗浄液ノズルである。
【0031】
飛散防止カップ11は、カップ本体42と上側カップ43とからなり、メカニカルスピンチャック10に保持された基板Wを囲うように設けられている。上側カップ43は上部に外気取入口43aが開口され、周壁に基板Wの回転による洗浄液の飛沫を下方に案内する傾斜面43bを有している。また、カップ本体42は、その周壁の段差部44で上側カップ43を支持し、カップ本体42の底壁41には排気・排液用に複数の開口45が形成されている。これら開口45は、図示しない排気ダクト、排液ドレインを介して強制排気機構や排液回収タンクに連通されている。これにより、洗浄液を回収するとともに、均一な流下気流を形成するようになっている。
【0032】
次に、上記実施例装置の動作を説明する。
上記装置を始動させると、基板Wを保持したメカニカルスピンチャック10が回転駆動され、それとともに、上記処理液供給機構1の超音波ノズル2が、超音波振動を付与した洗浄液を供給しながら基板Wの端部外から基板Wの中心部へ向かって、移動軌跡Rに沿って水平移動し、回転している基板Wの上面を水平移動掃引するように変移する。
【0033】
次に、超音波ノズル2は基板Wの中心部から端部まで、あるいは、端部から端部へ水平移動掃引する。この超音波ノズル2の往復動作が複数回繰り返され、1枚の基板Wの洗浄工程が終了する。洗浄終了後には、カップ11が下降して、図示しない下降位置にて洗浄を終えた基板Wを図示しない基板搬送機構に引渡し、カップ11が別の基板Wを基板搬送機構から受け取った後、図2で示すカップ11が上昇位置まで上昇し、上記洗浄処理をその基板Wに対して行なう。
【0034】
本発明に係る超音波ノズル2を含む処理液供給機構1を備えていれば、上記洗浄工程において、超音波ノズル2から基板Wへ充分な流量で洗浄液を供給することができ、基板洗浄処理を好適に行なうことができる。
【0035】
なお、上記実施例では、メカニカルスピンチャック10を備えて基板Wを水平姿勢で保持するとともに、鉛直軸回りで回転させるように構成しているが、基板Wの下面を真空吸着により保持し、鉛直軸回りで回転させる吸引式スピンチャックを備えた基板洗浄装置(基板処理装置)であっても本発明を適用することは可能である。
【0036】
また、本発明が適用できるその他の実施例としては、フォトリソグラフィ工程の露光処理後の現像処理でプリウエット処理を行なう現像装置を挙げることができる。
【0037】
フォトリソグラフィ工程は、大まかに言って、基板表面にフォトレジストの薄膜を形成するレジスト塗布工程の後、硬化処理(いわゆるソフトベーク)が行なわれ、その後所定パターンの露光が行なわれる。そして、露光処理後に露光されたパターンを得るために現像処理が行なわれる。
【0038】
この現像処理では、フォトレジストの薄膜が形成され、所定のパターンが露光された基板表面に現像液を供給(または、現像液中に基板を浸漬)して行なわれるが、フォトレジストの薄膜が疏水性を示すことが多く、このような場合には、現像液が基板表面(フォトレジストの薄膜表面)で弾かれ均一な現像液の供給などが行なえず、そのため、現像ムラが発生してしまう。そこで、現像液の供給などに先立って基板表面にプリウエット液を供給して、基板表面を疏水性から親水性に改質するプリウエット処理が行なわれることがある。
【0039】
しかしながら、プリウエット液を単に基板表面に供給するだけでは、基板表面にプリウエット液を供給する際に、プリウエット液内に数μm〜数十μm程度の微小気泡が発生してフォトレジストの薄膜表面に付着し、この状態で現像液の供給などを行なうと前記微小気泡付近のフォトレジストの薄膜に現像液が供給されず、その部分に現像不良が発生することがある。そこで、プリウエット処理において、基板表面に供給するプリウエット液に超音波振動を付与することで、前記微小気泡を基板表面に残留させることなく、その表面を親水性に改質する技術が本願出願人によって開発されている。
【0040】
この超音波振動を付与したプリウエット液を供給するプリウエット処理を行なう現像装置に本発明に係る超音波ノズルを含む(例えば、図1に示す)処理液供給機構を採用することができる。
【0041】
この現像装置は、例えば、図4に示すように、基板Wを水平姿勢で保持し、鉛直軸周りに回転可能に構成されたスピンチャック50や、スピンチャック50の周囲に設けられ、現像液やリンス液が周囲へ飛散するのを防止するための現像装置用の飛散防止カップ60、超音波振動を付与したプリウエット液や、現像液、リンス液などを供給する機構70などを備えて構成される。
【0042】
スピンチャック50は、図では吸引式スピンチャックを示しているが、上記基板洗浄装置で説明したのと同様のメカニカルスピンチャックで構成してもよい。
【0043】
また、超音波振動を付与したプリウエット液は、図1などに示す処理液供給機構1によって基板Wの表面に供給される。この装置においては、処理液供給源4(図1参照)は、プリウエット液を超音波ノズル2に供給する。この装置においても、図2の基板洗浄装置と同様に、ロータリーアクチュエータ33で回転される支軸32に水平揺動可能に軸支されたノズルアーム31の先端部に超音波ノズル2が取り付けられ、基板Wの表面上で水平移動され、超音波ノズル2が基板Wの表面の端部外の待機位置と、基板Wの表面の中心部の処理位置との間で変移されるように構成される。また、この装置では、例えば、ノズルアーム31の先端部に現像液やリンス液を選択切替えして供給するためのノズル71も付設される。なお、図中の符号72はノズル71に現像液を供給するための管であり、符号73はノズル71にリンス液(純水など)を供給するための管である。
【0044】
そして、露光処理が終了した基板Wがスピンチャック50に保持されると、基板Wが鉛直軸周りに回転され、超音波ノズル2が基板Wの表面の中心部の処理位置に移動され、その位置で超音波振動が付与されたプリウエット液が基板Wの表面(所定のパターンが露光されたフォトレジストの薄膜表面)に供給され、プリウエット処理が行なわれる。このプリウエット処理においても、充分な流量でプリウエット液が基板Wの表面に供給され、好適にプリウエット処理を行なうことができる。
【0045】
プリウエット処理に続いて現像液を基板Wの表面に供給し、所定の現像処理が行なわれ、現像処理後に基板Wの表面にリンス液が供給され、現像液の洗い流しなどが行なわれる。
【0046】
なお、この種のプリウエット処理に使用されるプリウエット液としては、例えば、純水や、使用する現像液を純水などで希釈して現像能力を低下させた液、その他、例えば、ポジ型フォトレジストの薄膜に対してはアルカリ性の水溶液、界面活性剤などが使用される。
【0047】
また、基板Wの表面に形成された薄膜の膜厚やフォトレジスト液の種類によっては、超音波振動を付与したプリウエット液がその薄膜面に損傷を与える恐れもあるので、その膜厚やフォトレジスト液の種類に応じて適宜の振幅の高周波電圧を発振体5に印加できるように構成することが好ましい。
【0048】
なお、上述した各装置に限らず、超音波振動を付与した処理液を基板に供給して所定の基板処理を行なう基板処理装置に本発明に係る超音波ノズルを用いることができる。
【0049】
【発明の効果】
以上の説明から明らかなように、請求項1に記載の発明によれば、処理液流路の入口から発振体への処理液の供給方向と、発振体の振動面の配置方向とが交差するように構成しているので、処理液流路の入口から発振体までの処理液流路部分に曲がり部を形成する必要がなくなり、処理液流路内に流れる処理液の圧力損失を減少させることができ、超音波ノズルに処理液を供給する処理液供給源の負荷を大きくすることなく、超音波ノズルから基板へ充分な流量で処理液を供給して、基板処理を好適に行なうことができる。さらに、処理液流路部分に曲がり部が少なくなったので、流体中に溶在している気体の溶出が起き難くなり、発振体の破損を軽減することもできる。
【0050】
また、請求項に記載の発明によれば、処理液流路の入口から前記発振体までの処理液流路部分を水平方向に直線状に構成するとともに、前記発振体から処理液流路の出口までの処理液流路部分を垂直方向に直線状に構成し、さらに、処理液流路の入口から発振体までの処理液流路部分と、発振体から処理液流路の出口までの処理液流路部分とが交わる角部で、発振体は、その振動面の配置方向が前記両処理液流路部分に対してそれぞれ傾斜するように配置したので、処理液流路の曲がり部が発振体部分の1個所になり、処理液流路内に流れる処理液の圧力損失を減少させることができ、流体中に溶在している気体の溶出が起き難くし、発振体の破損を軽減させることができるようになった。
【図面の簡単な説明】
【図1】(a)、(b)は参考例を示す一部断面図、(c)は本発明の実施の形態を示す一部断面図である。
【図2】本発明に係る超音波ノズルを含む処理液供給機構を用いる基板処理装置の一つである基板洗浄装置の構成を示す縦断面図である。
【図3】図2の装置の平面図である。
【図4】本発明に係る超音波ノズルを含む処理液供給機構を用いる他の基板処理装置の構成を示す縦断面図と平面図である。
【図5】従来例に係る超音波ノズルの構成を示す一部断面図である。
【符号の説明】
1 … 処理液供給機構
2 … 超音波ノズル
3 … 処理液供給管
4 … 処理液供給源
5 … 発振体
5a … 発振体の振動面
6 … 処理液流路
6a … 処理液流路の入口
6b … 処理液流路の出口
Y1 … 処理液供給管から処理液流路への処理液の供給方向
Y2 … 処理液流路の入口から発振体への処理液の供給方向
W … 基板
[0001]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, a processing liquid (such as pure water or a pre-wet liquid) to which ultrasonic vibration is applied is supplied to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a photomask, and a substrate for an optical disk, and The present invention relates to an ultrasonic nozzle used for performing a substrate process (a substrate cleaning process, a pre-wet process performed in a development process after an exposure process in a photolithography process, etc.), and in particular, to apply an ultrasonic vibration to a processing liquid. The present invention relates to an improved technique of an ultrasonic nozzle provided with an oscillating body and a processing liquid flow path having a path connected to a vibration surface of the oscillating body.
[0002]
[Prior art]
As shown in FIG. 5, a conventional ultrasonic nozzle 100 of this type has an oscillating body 101 for internally applying ultrasonic vibration to a processing liquid, and a process having a path connected to a vibration surface 101a of the oscillating body 101. A liquid flow path 102 and the like are provided.
[0003]
Reference numeral 103 in the figure denotes a cable for applying a high-frequency voltage for exciting the oscillator 101 to the oscillator 101. Reference numeral 104 denotes a processing liquid supply pipe. One end of the processing liquid supply pipe 104 is connected to the processing liquid supply source 105, and the other end is connected to the inlet 102a of the processing liquid flow path 102. .
[0004]
According to this conventional apparatus, the processing liquid (pure water, pre-wet liquid, etc.) supplied from the processing liquid supply source 105 is supplied to the processing liquid flow path 102 in the ultrasonic nozzle 100 via the processing liquid supply pipe 104, After an ultrasonic vibration is applied to the processing liquid by the excited oscillating body 101 in the processing liquid flow path 102, the processing liquid is supplied from the outlet of the processing liquid flow path 102 to the surface of the substrate, and (Cleaning processing, etc.) is performed.
[0005]
[Problems to be solved by the invention]
However, the conventional example having such a configuration has the following problem.
As shown in FIG. 5, in the ultrasonic nozzle 100 according to the conventional example, the processing liquid supply direction Y1 from the processing liquid supply pipe 104 to the processing liquid flow path 102 and the vibration surface of the oscillator 101 in the ultrasonic nozzle 100 The arrangement direction of 101a is parallel to the processing liquid flow path 102, and the processing liquid flow path 102 is connected to the vibration surface 101a of the oscillator 101 in the processing liquid flow path 102, as shown in FIG. It is configured in a crank shape.
[0006]
Therefore, a large number of bends are formed in the processing liquid flow path 102, and the processing liquid is supplied from the ultrasonic nozzle 100 to the substrate due to an increase in pressure loss of the processing liquid flowing in the processing liquid flow path 102. There has been an inconvenience that the flow rate of the processing liquid is reduced and the substrate processing cannot be performed appropriately. On the other hand, in order to supply the processing liquid from the ultrasonic nozzle 100 to the substrate at a sufficient flow rate, the processing liquid supply force from the processing liquid supply source 105 to the processing liquid supply pipe 104 must be increased. There is another problem that the load on the source 105 is increased.
[0007]
In addition, since the processing liquid flow path is bent, when the flow path changes, the gas dissolved in the fluid elutes due to cavitation action, and the gas acts on the oscillator surface and damages the oscillator There was something to do.
[0008]
The present invention has been made in view of such circumstances, and without increasing the load on a processing liquid supply source, supplies processing liquid at a sufficient flow rate from an ultrasonic nozzle to a substrate to perform substrate processing. It is an object of the present invention to provide an ultrasonic nozzle that can be suitably performed.
[0009]
[Means for Solving the Problems]
The present invention has the following configuration to achieve such an object.
That is, the invention according to claim 1 is provided with an oscillating body for applying ultrasonic vibration to a processing liquid to be supplied to a substrate, and a processing liquid flow path having a path connected to a vibration surface of the oscillating body. In the ultrasonic nozzle, the supply direction of the processing liquid from the inlet of the processing liquid flow path to the oscillating body intersects with the arrangement direction of the vibration surface of the oscillating body , and The processing liquid flow path portion up to the oscillating body is configured to be linear in the horizontal direction, and the processing liquid flow path portion from the oscillating body to the outlet of the processing liquid flow path is configured to be linear in the vertical direction. At the corner where the processing liquid flow path portion from the inlet of the processing liquid flow path to the oscillating body and the processing liquid flow path portion from the oscillating body to the outlet of the processing liquid flow path intersect, the oscillating body are arranged to be inclined respectively to the direction that the two treatment liquid flow path portion And it is characterized in and.
[0011]
[Action]
The operation of the present invention is as follows.
That is, according to the first aspect of the present invention, the ultrasonic nozzle is arranged such that the supply direction of the processing liquid from the inlet of the processing liquid flow path to the oscillating body and the arrangement direction of the vibration surface of the oscillating body intersect. With this configuration, the oscillator can apply ultrasonic vibration to the processing liquid without forming a bent portion in the processing liquid flow path from the inlet of the processing liquid flow path to the oscillator. Therefore, the number of bent portions in the processing liquid flow path is reduced, and the pressure loss of the processing liquid flowing in the processing liquid flow path can be reduced accordingly.
[0012]
According to the first aspect of the present invention, the processing liquid flow path portion from the inlet of the processing liquid flow path to the oscillating body is linearly formed in the horizontal direction, and the processing liquid flow path from the oscillating body to the processing liquid flow path is formed. The processing liquid flow path section up to the outlet is linearly formed in the vertical direction, and the processing liquid flow path section from the inlet of the processing liquid flow path to the oscillator and the processing from the oscillator to the outlet of the processing liquid flow path At the corner where the liquid flow path intersects, the oscillating body is arranged so that the direction of the vibrating surface thereof is inclined with respect to the two processing liquid flow path parts, so that the bent part of the processing liquid flow path oscillates. It is a part of the body part, and the pressure loss of the processing liquid flowing in the processing liquid flow path can be reduced.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to FIG.
Reference numeral 1 in the drawing indicates a processing liquid supply mechanism provided in the substrate processing apparatus. The processing liquid supply mechanism 1 includes an ultrasonic nozzle 2, a processing liquid supply pipe 3, a processing liquid supply source 4, and the like according to the present invention. Have. The ultrasonic nozzle 2 has therein an oscillating body 5 for applying ultrasonic vibration to the processing liquid, and a process having a path connected to the vibration surface 5a of the oscillating body 5 (for example, connected via a packing or the like, not shown). A liquid channel 6 and the like are provided.
[0014]
A cable 7 is connected to the oscillating body 5, and a high-frequency voltage is applied to the oscillating body 5 via the cable 7 so that the oscillating body 5 is excited to vibrate at a frequency called an ultrasonic wave. You. Then, the ultrasonic vibration of the oscillator 5 is applied to the processing liquid flowing into the processing liquid flow path 6, and the processing liquid to which the ultrasonic vibration is applied is supplied from the outlet 6 b of the processing liquid flow path 6 to the surface of the substrate. A predetermined substrate processing is performed.
[0015]
The oscillator 5 is formed by shaping a material having a piezoelectric effect or an electrostriction effect into a shape capable of obtaining a desired mechanical resonance frequency (for example, a frequency called an ultrasonic wave of about 1.5 MHz). And a ceramic such as lead zirconate titanate porcelain having a large piezoelectric effect and a large electric strain effect.
[0016]
The processing liquid supply pipe 3 has one end connected to the processing liquid supply source 4 and the other end connected to the inlet 6 a of the processing liquid flow path 6. The processing liquid supply source 4 is configured to pump out the processing liquid from the processing liquid storage tank by a pump, or to pump the processing liquid from the processing liquid storage tank by gas pressure.
[0017]
Now, in the present invention, the ultrasonic nozzle 2 is set so that the supply direction Y2 of the processing liquid from the inlet 6a of the processing liquid flow path 6 to the oscillator 5 and the arrangement direction of the vibration surface 5a of the oscillator 5 intersect. , for example, it is configured as shown in Figure 1 (c). FIGS. 1A and 1B are reference examples.
[0018]
In FIG. 1A, the oscillator 5 is provided in the ultrasonic nozzle 2 such that the arrangement direction of the vibration surface 5a of the oscillator 5 is parallel to the H direction (for example, the horizontal direction) in the drawing. Further, the processing liquid supply pipe 3 is connected to the inlet 6a of the processing liquid flow path 6 such that the supply direction Y1 of the processing liquid from the processing liquid supply pipe 3 to the processing liquid flow path 6 is directed obliquely downward from the H direction. (Ultrasonic nozzle 2), and the processing liquid flow path portion from the inlet 6 a of the processing liquid flow path 6 to the oscillating body 5 is arranged in parallel with the processing liquid supply pipe 3. Accordingly, the supply direction Y2 of the processing liquid from the inlet 6a of the processing liquid flow path 6 to the oscillator 5 intersects the arrangement direction of the vibration surface 5a of the oscillator 5.
[0019]
In FIG. 1B, the oscillating body 5 is provided in the ultrasonic nozzle 2 so that the arrangement direction of the vibration surface 5a of the oscillating body 5 is parallel to the V direction (for example, the vertical direction). The processing liquid supply pipe 3 is connected to the inlet 6a of the processing liquid flow path 6 such that the supply direction Y1 of the processing liquid to the processing liquid flow path 6 is in the H direction. The processing liquid flow path portion up to the body 5 is arranged so as to be connected in parallel with the processing liquid supply pipe 3, whereby the processing liquid supply direction Y 2 from the inlet 6 a of the processing liquid flow path 6 to the oscillator 5, The direction in which the vibrating surface 5a of the oscillator 5 is arranged intersects.
[0020]
In FIG. 1C, the oscillator 5 is provided in the ultrasonic nozzle 2 such that the arrangement direction of the vibration surface 5a of the oscillator 5 is inclined with respect to the H direction (V direction). The processing liquid supply pipe 3 is connected to the inlet 6a of the processing liquid flow path 6 so that the supply direction Y1 of the processing liquid to the processing liquid flow path 6 becomes the H direction. The processing liquid flow path portion up to 5 is arranged so as to be continuous in parallel with the processing liquid supply pipe 3, whereby the processing liquid supply direction Y 2 from the inlet 6 a of the processing liquid flow path 6 to the oscillator 5 and the oscillation The direction of arrangement of the vibration surface 5a of the body 5 is crossed.
[0021]
In the configuration shown in each drawing, the processing liquid flow path portion from the inlet 6a of the processing liquid flow path 6 to the oscillator 5 is arranged so as to be continuous with the processing liquid supply pipe 3, and the processing liquid flow path portion Are formed in a straight line, and the processing liquid flow path 6 is folded back at the oscillating body 5, and the processing liquid flow path section from the oscillating body 5 to the outlet 6 b of the processing liquid flow path 6 continues in parallel in the V direction. The processing liquid flow path portion on the outlet side is also configured to be linear.
[0022]
According to the configuration shown in FIG. 1, the bent portion of the processing liquid flow path 6 becomes one portion of the oscillating body 5, and the pressure loss of the processing liquid flowing into the processing liquid flow path 6 can be reduced. The processing liquid can be supplied from the ultrasonic nozzle 2 to the substrate at a sufficient flow rate without increasing the load on the liquid supply source 4, and the substrate processing can be suitably performed. In addition, since the bent portion of the processing liquid flow path 6 is reduced, elution of gas dissolved in the fluid is less likely to occur, and damage to the oscillator 5 can be reduced.
[0023]
Note that the configuration shown in FIG. 1 shows an example of the present invention, and can be realized by other configurations.
[0024]
Next, an embodiment of the substrate processing apparatus provided with the processing liquid supply mechanism 1 including the above-described ultrasonic nozzle 2 according to the present invention will be described.
[0025]
【Example】
FIG. 2 is a longitudinal sectional view showing a configuration of a substrate cleaning apparatus which is one of the substrate processing apparatuses, and FIG. 3 is a plan view thereof. In this embodiment, an apparatus for cleaning a semiconductor wafer, which is one of the substrates, is illustrated. However, the apparatus is used for cleaning other substrates (a glass substrate for a liquid crystal display device, a photomask, a substrate for an optical disk, etc.). The ultrasonic nozzle according to the present invention can be similarly applied to the substrate cleaning apparatus described above.
[0026]
As shown in FIGS. 2 and 3, the apparatus according to the embodiment includes a mechanical spin chuck 10 that holds a substrate (semiconductor wafer) W in a horizontal posture and rotates around a vertical axis, and a position above the mechanical spin chuck 10. A processing liquid supply mechanism 1 for supplying a processing liquid (for example, a cleaning liquid such as pure water), which is provided so as to be capable of horizontal movement and sweep, and to which ultrasonic vibration is applied to the upper surface of the substrate W held by the mechanical spin chuck 10; It is provided so as to surround the substrate W held by the mechanical spin chuck 10, and is provided with a scattering prevention cup 11, which collects a cleaning liquid and is connected to a forced exhaust mechanism (not shown) and is configured to form a downflow airflow. Have been.
[0027]
The mechanical spin chuck 10 rotates through a turntable 22 having a plurality of (five in the figure) substrate support portions 21 arranged in a substantially circular shape and standing upright, and a central portion of a bottom wall 41 of the scattering prevention cup 11. A support shaft 23 that supports the base 22 about a vertical axis, a drive motor (not shown) that rotationally drives the support shaft 23, and the like are provided. The substrate support 21 includes a vertical support 21a that supports the end of the substrate W from below and a horizontal restriction 21b that restricts the horizontal position of the substrate W. The horizontal restriction 21b The rotation of the turntable 22 is effectively transmitted to the substrate W by contacting the outer peripheral edge.
[0028]
The turntable 22 holds and rotates the substrate W when the cup 11 is in the ascending position shown in the figure to clean the substrate W, while transferring the substrate W (not shown) in the lowered position of the cup 11 (not shown). It is configured to be transferred to and from a mechanism.
[0029]
As the processing liquid supply mechanism 1, for example, one having the configuration described with reference to FIG. 1 is used. In FIGS. 2 and 3, the same parts as those in FIG. 1 are denoted by the same reference numerals as those in FIG. In this embodiment, the ultrasonic nozzle 2 of the processing liquid supply mechanism 1 is attached to the tip of a nozzle arm 31. The base end of the nozzle arm 31 is supported by an arm support shaft 32 so as to be horizontally swingable, and the arm support shaft 32 is configured to be rotatable around a vertical axis by a rotary actuator 33. Thereby, the ultrasonic nozzle 2 reciprocates and sweeps the range from the end to the center of the substrate W held by the mechanical spin chuck 10.
[0030]
In FIG. 3, reference numerals 12 to 14 denote sub-elements selectively used when a cleaning liquid such as pure water to which no ultrasonic vibration is applied is supplied to the substrate W to perform cleaning by a method different from ultrasonic cleaning. This is a cleaning liquid nozzle.
[0031]
The scattering prevention cup 11 includes a cup body 42 and an upper cup 43, and is provided so as to surround the substrate W held by the mechanical spin chuck 10. The upper cup 43 has an open air inlet 43a at the upper part, and has an inclined surface 43b on the peripheral wall for guiding the washing liquid splash caused by the rotation of the substrate W downward. The cup body 42 supports the upper cup 43 at a step portion 44 on the peripheral wall, and a plurality of openings 45 are formed in the bottom wall 41 of the cup body 42 for exhaust / drainage. These openings 45 are connected to a forced exhaust mechanism and a drainage collection tank via an exhaust duct and a drainage drain (not shown). As a result, the cleaning liquid is recovered, and a uniform flowing air flow is formed.
[0032]
Next, the operation of the above-described embodiment will be described.
When the apparatus is started, the mechanical spin chuck 10 holding the substrate W is driven to rotate. At the same time, the ultrasonic nozzle 2 of the processing liquid supply mechanism 1 supplies the substrate W while supplying the cleaning liquid to which the ultrasonic vibration is applied. From the outside of the substrate W toward the center of the substrate W along the movement trajectory R, so that the upper surface of the rotating substrate W is horizontally moved and swept.
[0033]
Next, the ultrasonic nozzle 2 sweeps horizontally from the center to the end of the substrate W, or from end to end. The reciprocating operation of the ultrasonic nozzle 2 is repeated a plurality of times, and the cleaning process for one substrate W is completed. After the cleaning is completed, the cup 11 is lowered, and the cleaned substrate W is transferred to a substrate transport mechanism (not shown) at a lowered position (not shown), and the cup 11 receives another substrate W from the substrate transport mechanism. The cup 11 indicated by 2 is raised to the raised position, and the above-described cleaning process is performed on the substrate W.
[0034]
If the processing liquid supply mechanism 1 including the ultrasonic nozzle 2 according to the present invention is provided, the cleaning liquid can be supplied from the ultrasonic nozzle 2 to the substrate W at a sufficient flow rate in the cleaning step, and the substrate cleaning processing can be performed. It can be suitably performed.
[0035]
In the above embodiment, the mechanical spin chuck 10 is provided to hold the substrate W in a horizontal position and to rotate the substrate W around a vertical axis. However, the lower surface of the substrate W is held by vacuum suction, The present invention can be applied to a substrate cleaning apparatus (substrate processing apparatus) provided with a suction-type spin chuck that rotates around an axis.
[0036]
Further, as another embodiment to which the present invention can be applied, a developing apparatus for performing a pre-wet process in a developing process after an exposure process in a photolithography process can be cited.
[0037]
In the photolithography process, after a resist coating process for forming a photoresist thin film on a substrate surface, a curing process (so-called soft bake) is performed, and then exposure of a predetermined pattern is performed. Then, development processing is performed to obtain an exposed pattern after the exposure processing.
[0038]
In this development process, a photoresist thin film is formed, and a developing solution is supplied (or the substrate is immersed in the developing solution) to the surface of the substrate on which a predetermined pattern has been exposed. In such a case, the developer is repelled on the surface of the substrate (the surface of the thin film of the photoresist), so that a uniform supply of the developer cannot be performed, and therefore, uneven development occurs. Therefore, there is a case where a pre-wet process is performed in which a pre-wet liquid is supplied to the surface of the substrate before the supply of the developing solution and the surface of the substrate is changed from hydrophobic to hydrophilic.
[0039]
However, simply supplying the pre-wet liquid to the substrate surface, when supplying the pre-wet liquid to the substrate surface, generates microbubbles of about several μm to several tens μm in the pre-wet liquid, resulting in a thin photoresist film. When the developer adheres to the surface and the developer is supplied in this state, the developer is not supplied to the photoresist thin film in the vicinity of the microbubbles, and a defective development may occur in that portion. Therefore, in the pre-wetting process, a technique of applying ultrasonic vibration to a pre-wetting liquid supplied to the substrate surface to modify the surface to be hydrophilic without leaving the microbubbles on the substrate surface is disclosed in the present application. Developed by people.
[0040]
The processing liquid supply mechanism including the ultrasonic nozzle according to the present invention (for example, as shown in FIG. 1) can be employed in the developing device for performing the pre-wet processing for supplying the pre-wet liquid to which the ultrasonic vibration is applied.
[0041]
For example, as shown in FIG. 4, the developing device holds the substrate W in a horizontal position, and is configured to be rotatable around a vertical axis. The spin chuck 50 is provided around the spin chuck 50. The apparatus is provided with a scattering prevention cup 60 for a developing device for preventing the rinsing liquid from scattering to the surroundings, a mechanism 70 for supplying a pre-wet liquid to which ultrasonic vibration has been applied, a developing liquid, a rinsing liquid, and the like. You.
[0042]
Although the drawing shows a suction type spin chuck in the drawing, the spin chuck 50 may be constituted by a mechanical spin chuck similar to that described in the above substrate cleaning apparatus.
[0043]
The pre-wet liquid to which the ultrasonic vibration has been applied is supplied to the surface of the substrate W by the processing liquid supply mechanism 1 shown in FIG. In this apparatus, the processing liquid supply source 4 (see FIG. 1) supplies the pre-wet liquid to the ultrasonic nozzle 2. Also in this apparatus, similarly to the substrate cleaning apparatus of FIG. 2, the ultrasonic nozzle 2 is attached to a tip end of a nozzle arm 31 which is pivotally supported on a support shaft 32 rotated by a rotary actuator 33 so as to be horizontally swingable. Horizontally moved on the surface of the substrate W, the ultrasonic nozzle 2 is configured to be displaced between a standby position outside the edge of the surface of the substrate W and a processing position at the center of the surface of the substrate W. . In this apparatus, for example, a nozzle 71 for selectively switching and supplying a developing solution or a rinsing solution is also provided at the tip of the nozzle arm 31. Reference numeral 72 in the drawing denotes a pipe for supplying a developing solution to the nozzle 71, and reference numeral 73 denotes a pipe for supplying a rinsing liquid (pure water or the like) to the nozzle 71.
[0044]
When the substrate W after the exposure processing is held by the spin chuck 50, the substrate W is rotated around a vertical axis, and the ultrasonic nozzle 2 is moved to the processing position at the center of the surface of the substrate W. Is supplied to the surface of the substrate W (the thin film surface of the photoresist on which a predetermined pattern has been exposed), and the pre-wetting process is performed. Also in this pre-wetting process, the pre-wetting liquid is supplied to the surface of the substrate W at a sufficient flow rate, so that the pre-wetting process can be suitably performed.
[0045]
After the pre-wet process, a developing solution is supplied to the surface of the substrate W to perform a predetermined developing process. After the developing process, a rinsing liquid is supplied to the surface of the substrate W, and the developing solution is washed away.
[0046]
Examples of the pre-wet liquid used in this type of pre-wet processing include pure water, a liquid obtained by diluting a developing solution to be used with pure water or the like to decrease the developing ability, and other positive-type liquids. For the photoresist thin film, an alkaline aqueous solution, a surfactant or the like is used.
[0047]
Also, depending on the thickness of the thin film formed on the surface of the substrate W and the type of the photoresist solution, the pre-wet solution to which the ultrasonic vibration is applied may damage the thin film surface. It is preferable that a high-frequency voltage having an appropriate amplitude can be applied to the oscillator 5 according to the type of the resist solution.
[0048]
The ultrasonic nozzle according to the present invention can be used not only in the above-described apparatuses but also in a substrate processing apparatus that performs a predetermined substrate processing by supplying a processing liquid to which ultrasonic vibration is applied to a substrate.
[0049]
【The invention's effect】
As is apparent from the above description, according to the first aspect of the invention, the direction in which the processing liquid is supplied from the inlet of the processing liquid flow path to the oscillator and the direction in which the vibration surface of the oscillator is arranged intersect. With such a configuration, it is not necessary to form a bent portion in the processing liquid flow path portion from the inlet of the processing liquid flow path to the oscillator, thereby reducing the pressure loss of the processing liquid flowing in the processing liquid flow path. The processing liquid can be supplied to the substrate from the ultrasonic nozzle at a sufficient flow rate without increasing the load on the processing liquid supply source that supplies the processing liquid to the ultrasonic nozzle, and the substrate processing can be performed appropriately. . Further, since the bent portion is reduced in the processing liquid flow path portion, elution of gas dissolved in the fluid is less likely to occur, and damage to the oscillator can be reduced.
[0050]
According to the first aspect of the present invention, the processing liquid flow path portion from the inlet of the processing liquid flow path to the oscillating body is linearly formed in the horizontal direction, and the processing liquid flow path from the oscillating body to the processing liquid flow path is formed. The processing liquid flow path section up to the outlet is linearly formed in the vertical direction, and the processing liquid flow path section from the inlet of the processing liquid flow path to the oscillator and the processing from the oscillator to the outlet of the processing liquid flow path At the corner where the liquid flow path intersects, the oscillating body is arranged so that the direction of the vibrating surface thereof is inclined with respect to the two processing liquid flow path parts, so that the bent part of the processing liquid flow path oscillates. It is a part of the body part, which can reduce the pressure loss of the processing liquid flowing in the processing liquid flow path, makes it difficult for gas dissolved in the fluid to elute, and reduces damage to the oscillator. Now you can do it.
[Brief description of the drawings]
1A and 1B are partial cross-sectional views showing a reference example, and FIG. 1C is a partial cross-sectional view showing an embodiment of the present invention.
FIG. 2 is a longitudinal sectional view illustrating a configuration of a substrate cleaning apparatus which is one of substrate processing apparatuses using a processing liquid supply mechanism including an ultrasonic nozzle according to the present invention.
FIG. 3 is a plan view of the apparatus of FIG. 2;
FIG. 4 is a longitudinal sectional view and a plan view showing a configuration of another substrate processing apparatus using a processing liquid supply mechanism including an ultrasonic nozzle according to the present invention.
FIG. 5 is a partial sectional view showing a configuration of an ultrasonic nozzle according to a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Processing liquid supply mechanism 2 ... Ultrasonic nozzle 3 ... Processing liquid supply pipe 4 ... Processing liquid supply source 5 ... Oscillator 5a ... Oscillator vibration surface 6 ... Processing liquid flow path 6a ... Processing liquid flow path inlet 6b ... Outlet Y1 of processing liquid flow path ... Supply direction Y2 of processing liquid from processing liquid supply pipe to processing liquid flow path ... Supply direction W of processing liquid from inlet of processing liquid flow path to oscillating body Substrate

Claims (1)

基板に供給するための処理液に超音波振動を付与する発振体と、前記発振体の振動面に連結される経路を持つ処理液流路とが設けられている超音波ノズルにおいて、
処理液流路の入口から前記発振体への処理液の供給方向と、前記発振体の振動面の配置方向とが交差し、
かつ、処理液流路の入口から前記発振体までの処理液流路部分を水平方向に直線状に構成するとともに、前記発振体から処理液流路の出口までの処理液流路部分を垂直方向に直線状に構成し、
さらに、処理液流路の入口から発振体までの処理液流路部分と、発振体から処理液流路の出口までの処理液流路部分とが交わる角部で、発振体は、その振動面の配置方向が前記両処理液流路部分に対してそれぞれ傾斜するように配置されていることを特徴とする超音波ノズル。
In an ultrasonic nozzle provided with an oscillating body that applies ultrasonic vibration to a processing liquid for supplying to a substrate and a processing liquid flow path having a path connected to a vibration surface of the oscillating body,
The supply direction of the processing liquid from the inlet of the processing liquid flow path to the oscillating body intersects the arrangement direction of the vibration surface of the oscillating body ,
Further, the processing liquid flow path portion from the inlet of the processing liquid flow path to the oscillating body is linearly formed in the horizontal direction, and the processing liquid flow path portion from the oscillating body to the processing liquid flow path is vertically extended. Into a straight line,
Furthermore, at the corner where the processing liquid channel portion from the inlet of the processing liquid channel to the oscillator and the processing liquid channel portion from the oscillator to the outlet of the processing liquid channel intersect, the oscillator has its vibration surface The ultrasonic nozzle is arranged so that the arrangement direction of the nozzles is inclined with respect to the two processing liquid flow path portions .
JP03292096A 1996-01-25 1996-01-25 Ultrasonic nozzle Expired - Fee Related JP3591964B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03292096A JP3591964B2 (en) 1996-01-25 1996-01-25 Ultrasonic nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03292096A JP3591964B2 (en) 1996-01-25 1996-01-25 Ultrasonic nozzle

Publications (2)

Publication Number Publication Date
JPH09201557A JPH09201557A (en) 1997-08-05
JP3591964B2 true JP3591964B2 (en) 2004-11-24

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