TW201115098A - Evaporator for loop heat pipe system - Google Patents

Evaporator for loop heat pipe system Download PDF

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Publication number
TW201115098A
TW201115098A TW099132194A TW99132194A TW201115098A TW 201115098 A TW201115098 A TW 201115098A TW 099132194 A TW099132194 A TW 099132194A TW 99132194 A TW99132194 A TW 99132194A TW 201115098 A TW201115098 A TW 201115098A
Authority
TW
Taiwan
Prior art keywords
evaporator
working fluid
sintered
core
sintered core
Prior art date
Application number
TW099132194A
Other languages
English (en)
Chinese (zh)
Inventor
Jung-Hyun Yoo
Jee-Hoon Choi
Min-Whan Seo
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Publication of TW201115098A publication Critical patent/TW201115098A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW099132194A 2009-09-25 2010-09-23 Evaporator for loop heat pipe system TW201115098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090091141A KR101054092B1 (ko) 2009-09-25 2009-09-25 루프 히트파이프 시스템용 증발기

Publications (1)

Publication Number Publication Date
TW201115098A true TW201115098A (en) 2011-05-01

Family

ID=43778991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099132194A TW201115098A (en) 2009-09-25 2010-09-23 Evaporator for loop heat pipe system

Country Status (3)

Country Link
US (1) US20110073284A1 (ko)
KR (1) KR101054092B1 (ko)
TW (1) TW201115098A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103639559A (zh) * 2013-11-14 2014-03-19 北京航空航天大学 一种环路热管蒸发器大面积软钎焊方法
CN112344569A (zh) * 2019-03-14 2021-02-09 山东大学 一种辅助加热的环路热管
TWI804756B (zh) * 2020-09-25 2023-06-11 奇鋐科技股份有限公司 氣液相流熱交換單元

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2474888C2 (ru) * 2011-04-29 2013-02-10 Общество с ограниченной ответственностью "Видео Интернет Технологии" (ООО "Видео Интернет Технологии") Охлаждающее устройство для электронных компонентов
JP5906607B2 (ja) * 2011-08-17 2016-04-20 富士通株式会社 ループヒートパイプ及び該ループヒートパイプを備えた電子機器
KR101282039B1 (ko) * 2011-08-24 2013-07-04 한국표준과학연구원 압력조절기를 이용하여 온도를 정밀 제어하는 전기로
KR101309588B1 (ko) * 2011-08-24 2013-09-17 한국표준과학연구원 루프 히트파이프 기반 전기로
US20130206369A1 (en) * 2012-02-13 2013-08-15 Wei-I Lin Heat dissipating device
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
WO2013169774A2 (en) 2012-05-07 2013-11-14 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
KR101294939B1 (ko) * 2012-08-28 2013-08-08 한국남부발전 주식회사 써모사이폰 열교환장치
US9547344B2 (en) * 2014-03-05 2017-01-17 Futurewei Technologies, Inc. Support frame with integrated thermal management features
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US9965003B2 (en) * 2015-07-09 2018-05-08 Htc Corporation Electronic assembly and electronic device
CN105403087A (zh) * 2015-12-25 2016-03-16 江苏宏力光电科技股份有限公司 一种热柱结构
CN107687783A (zh) * 2017-07-18 2018-02-13 华南理工大学 一种微型环路热管与方法
KR20190029049A (ko) 2017-09-11 2019-03-20 주식회사 하이낸드 모세관 구조 일체형 열교환기
CN110006282B (zh) * 2018-01-05 2020-12-15 开文热工科技公司 热接地平面
JP7271170B2 (ja) * 2018-12-27 2023-05-11 川崎重工業株式会社 蒸発器及びループ型ヒートパイプ
CN109661156B (zh) * 2019-01-29 2024-01-30 上海微小卫星工程中心 一种双入口蒸发器及环路热管

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000018854A (ja) 1998-06-30 2000-01-18 Showa Alum Corp ヒートパイプ
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US8047268B1 (en) * 2002-10-02 2011-11-01 Alliant Techsystems Inc. Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems
US7004240B1 (en) * 2002-06-24 2006-02-28 Swales & Associates, Inc. Heat transport system
KR200297491Y1 (ko) 2002-08-26 2002-12-11 (주) 대홍기업 평판형 히트파이프와 히트싱크
US6880626B2 (en) * 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
WO2006019219A2 (en) * 2004-08-18 2006-02-23 Thermalforce Cooling apparatus of looped heat pipe structure
WO2007005963A2 (en) * 2005-07-05 2007-01-11 Edwin Langberg Electrodes using two-phase heat transfer and multi-variate algorithms for improved temperature monitoring and control
JP2009115396A (ja) 2007-11-07 2009-05-28 Fujitsu Ltd ループ型ヒートパイプ
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
TW201024648A (en) * 2008-12-26 2010-07-01 Ji-De Jin Flat loop heat pipe

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103639559A (zh) * 2013-11-14 2014-03-19 北京航空航天大学 一种环路热管蒸发器大面积软钎焊方法
CN112344569A (zh) * 2019-03-14 2021-02-09 山东大学 一种辅助加热的环路热管
CN112344569B (zh) * 2019-03-14 2022-05-27 山东大学 一种辅助加热的环路热管
TWI804756B (zh) * 2020-09-25 2023-06-11 奇鋐科技股份有限公司 氣液相流熱交換單元

Also Published As

Publication number Publication date
KR20110033588A (ko) 2011-03-31
KR101054092B1 (ko) 2011-08-03
US20110073284A1 (en) 2011-03-31

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