TW201237339A - Cooling apparatus and electronic apparatus - Google Patents

Abstract

A cooling apparatus includes: an evaporator 1, including a porous body 12, a vapor channel 10 and a liquid channel 11 separated by the porous body, to evaporate a working fluid in liquid phase; a condenser 2 to condense the working fluid in vapor phase; a liquid reservoir tank 3 to reserve the working fluid in the liquid phase; a vapor line connecting 4 an outlet of the vapor channel in the evaporator and an inlet of the condenser; a liquid line 5 connecting an outlet of the condenser and a first inlet 3A of the liquid reservoir tank; a liquid supply line 6 connecting an outlet of the liquid reservoir tank and an inlet of the liquid channel in the evaporator; a liquid return line 7 connecting an outlet of the liquid channel in the evaporator and a second inlet 3B of the liquid reservoir tank; and a liquid transport unit 8 interposed in the liquid supply line.

Description

201237339 ·; VI. Description of the invention: 1. Field of the Invention The present invention relates to a cooling device and an electronic device. [Prior Art] A type of cooling device which is provided in an electronic device such as a computer to cool a heat generating member such as an electronic component is a gas-liquid two-phase flow. This cooling device utilizes the latent heat of vaporization to achieve higher heat dissipation when the liquid phase working fluid (liquid phase working fluid) evaporates into the vapor phase working fluid (vapor phase working fluid). For example, a loop heat pipe (LHP) includes an evaporator, and the evaporator includes a core and a condenser, wherein an outlet of the evaporator and an inlet of the condenser are connected by a vapor line, and an outlet of the condenser and an inlet of the evaporator are connected by a liquid line, and the circuit The heat pipe is filled with working fluid. The loop heat pipe can circulate the working fluid by the capillary force of the core, thereby transferring heat without requiring, for example, a liquid transfer pump. Some cooling units are provided with a liquid transfer pump in the liquid line to ensure the flow of working fluid. The evaporator provided by the loop heat pipe as described above includes the outer casing 101 thermally coupled to the heat generating component 100, and the core 102 closely contacts the inner wall of the outer casing 101, for example, as shown in Fig. 14. The core 102 has a tubular shape with a bore 103 therein. The core 102 has an open end and a closed end, the open end is on the side of the inlet of the outer casing 101 (the right side of Fig. 14), and the closed end is on the side of the outlet of the outer casing 101 (the left side of Fig. 14). A hole 103 in the core 102 communicates with a liquid line 104 connecting the inlet of the outer casing 101, defining a liquid passage through which the liquid phase working fluid 4 323562 201237339 flows. A channel 105 is defined between the inner wall of the outer casing 101 and the core 102. The channel 105 is in communication with a vapor line 106 connecting the outlet of the outer casing 101 defining a vapor passage through which the vaporous phase working fluid flows. In particular, the end of the core 102, i.e., the core 102 on the exit side of the outer casing 101, is closed, defining the end of the hole 103 in the core 102. In other words, the liquid passage in the evaporator is the terminal. In the loop heat pipe configured as described above, the heat generated by the heat generating component 100 is transferred to the liquid phase working fluid by the core 102, thereby heating the liquid phase working fluid, which may result in generation of vapor bubbles in the liquid phase working fluid. This can cause dryness and make it difficult to maintain cooling performance. In particular, the terminal of the core 102 contacts the steam passage. Therefore, the liquid phase working fluid in the liquid passage near the end of the core 102 is heated to a temperature substantially the same as the temperature of the vapor phase working fluid, which may accelerate the formation of vapor bubbles. In addition, the heat generated by the heat generating component 100 is more easily transferred to the liquid phase working fluid through the core 102 in a thin planar evaporator suitable for effective cooling of planar heat generating components that generate a large amount of heat, such as electronic components and printed circuit boards. Therefore, the temperature of the liquid phase working fluid is increased to accelerate the generation of vapor bubbles in the liquid phase working fluid. This often causes dryness, making it difficult to maintain cooling performance. Further, the evaporator having the terminal liquid passage, even if the liquid delivery pump is supplied to the liquid line and the liquid phase working fluid is transported to the evaporator by the liquid transfer pump, the vapor bubbles generated by the liquid phase working fluid cannot be removed. SUMMARY OF THE INVENTION For those skilled in the art, the following detailed description is immediately apparent to 5 323562 201237339. Other advantages and features of the invention. The embodiment described and illustrated is a preferred embodiment for carrying out the invention. The present invention can be modified in various obvious forms without departing from the invention. Accordingly, the drawings are intended to be illustrative and not restrictive. The present invention has been developed in view of the foregoing problems, and even if vapor bubbles are generated in the liquid phase working fluid, these vapor bubbles are easily removed, thereby realizing a cooling device that provides stable heat dissipation performance. The cooling device of the present invention comprises: an evaporator comprising a porous body, a vapor passage and a liquid passage separated by the porous body to evaporate the working fluid in the liquid phase; a condenser to condense the working fluid of the vapor phase; and a liquid storage tank, a working fluid for storing a liquid phase; a vapor line connecting the outlet of the vapor passage of the evaporator and an inlet of the condenser; a liquid line connecting the outlet of the condenser and the first inlet of the liquid storage tank; and a liquid supply line connecting the liquid An inlet of the collection tank and an inlet of the liquid passage of the evaporator; a liquid return line, an outlet connecting the liquid passage of the evaporator and a second inlet of the liquid storage tank; and a liquid delivery unit interposed in the liquid supply line. The electronic device of the present invention comprises: an electronic component 'provided on the circuit board; and a cooling device for cooling the electronic component, the cooling device being configured as described above, wherein the electronic component is thermally connected to the evaporator. Additional features and advantages of the invention will be set forth in part in the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; This advantage and features of the present invention can be realized and obtained by the particulars of the appended claims. 6 323562 201237339 [Embodiment] A cooling device and an electronic device according to an embodiment will be described below with reference to Figs. The cooling device according to the present embodiment is a cooling device that cools a heat generating component such as an electronic component included in an electronic device such as a computer (e.g., a server and a personal computer). Electronic devices are sometimes referred to as electronic devices. Examples of electronic components include, for example, a central processing unit (CPU) and an LSI chip. The cooling device is a cooling device based on the two-phase flow of gas and liquid. This cooling device utilizes the latent heat of vaporization generated to achieve higher heat dissipation performance when the liquid phase working fluid (liquid phase working fluid) evaporates into the vapor phase working fluid (vapor phase working fluid). Here, an embodiment is described in the context of a cooling device comprising a thin planar evaporator suitable for effectively cooling a planar heat generating component that generates a large amount of heat, such as an electronic component and a printed board (circuit board). Please note that thin flat evaporators are sometimes referred to as thin evaporators or flat evaporators. As shown in Fig. 1, the cooling device comprises: an evaporator 1 for evaporating a liquid phase working fluid, a condenser 2 for condensing a vapor phase working fluid, a liquid reservoir 3 for storing a liquid phase working fluid, and a flowing vapor phase working fluid therethrough. The vapor line 4, the liquid line 5 through which the liquid phase working fluid flows, the liquid supply line 6, the liquid return line 7, and the liquid transfer pump 8. Note that the liquid supply and liquid return lines 6 and 7 are simply referred to as "liquid lines" because they are liquid lines in which the liquid phase working fluid flows. Although the liquid delivery pump 8 is used in this embodiment, it is not limited thereto and any 7 323562 201237339 liquid delivery unit (liquid delivery means) that can transport the liquid phase working fluid can be used. At the outlet (steam passage) 10 of the steam passage of the evaporator 1, the inlet of the condenser 2 is connected by a vapor line 4. The outlet of the condenser 2 is connected to the first inlet 3A of the liquid storage tank 3 by a liquid line 5. The outlet 3C of the liquid reservoir 3 is connected to the inlet of the liquid passage 11 of the evaporator 1 by a liquid supply line 6. The outlet of the liquid passage 11 of the evaporator 1 is connected to the second inlet 3B of the liquid storage tank 3 by a liquid return line 7. Further, a liquid transfer pump 8 is inserted in the liquid supply line 6. More specifically, with the liquid supply line 6, the outlet 3C of the liquid storage tank 3 is connected to the intake opening 8A of the liquid transfer pump 8, and the discharge opening 8B of the liquid transfer pump 8 is connected to the liquid passage 11 of the evaporator 1. The entrance. In this embodiment, the evaporator 1 includes a core 12, the vapor passage 10 and the liquid passage 11 are separated by a core 12, and a heat generating component 9 (heat source) is thermally connected to the evaporator 1. In this embodiment, the steam passage 10 is provided adjacent to the heat generating assembly 9 of the evaporator 1, and the liquid passage 11 is provided away from the heat generating assembly 9 of the evaporator 1. Such a configuration prevents the heat of the heat generating component 9 from being transferred to the liquid phase working fluid by the core 12, thereby reducing or eliminating the generation of vapor bubbles in the liquid phase working fluid. The core 12 is a porous body. In this embodiment, the core 12 is a porous body having a small thermal conductivity. More specifically, the core 12 is a porous body made of a resin. The porous body preferably has an average pore diameter of about 10 μm or less (preferably about 6 μm or less). The average pore size can be determined using a mercury injection method. In this embodiment, as shown in Fig. 2, for example, the evaporator 1 includes the outer casing 13 thermally coupled to the heat generating component 9, and the core 12 closely contacts the inner wall of the outer casing 13. The core 12 has a tubular shape with a bore 14 therein. The core 12 has an open end on the side of the inlet of the housing 8 323562 201237339 • 13 (on the right side of Fig. 2) and on the side of the outlet (2: left side of the figure). The inner bore 14 of the core 12 communicates with a liquid line 6 connected to the inlet of the outer casing 13 and a liquid line connected to the outlet of the outer casing 13, defining a liquid passage u through which the liquid phase working fluid flows. In this manner, the end of the core 12 on the exit side of the core 12 (i.e., the bore 14 in the core 12) is not terminal and communicates with the liquid official line that is connected to the outlet of the outer casing 13. In other words, the liquid passage in the evaporator 15 is not the end, and is connected to the liquid lines 6 and 7 connecting the population of the evaporator 1 and the side of the outlet. The channel 15 is defined between the inner wall of the outer casing 13 and the core 12. The channel 15 is in communication with a vapor line 4 connected to the outlet of the evaporator 1, defining a vapor channel 1 经 through its mobile phase working fluid. In the mode of screaming, the liquid passage 11 in the evaporator 1 is in communication with the liquid lines 6 and 7 connecting the population of the evaporator 1 and the outlet side. In other words, the liquid passage 11 in the evaporation 11 1 includes the discharge port, and the population, from the second to the outlet, and connects the liquid official lines 6 and 7 on the inlet and outlet sides of the evaporator 1. As shown in Fig. 1, the liquid lines 6 and 7 connected to the sides of the evaporator, the inlet and the outlet are connected to the yam liquid storage tank 3, defining a circulation path (loop) allowing the circulation of the liquid phase working fluid. 2 (4) The liquid phase flow through the evaporator 丨 liquid channel 丄 丄 丄 , , , , , , , , , , , , , , , , 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 、 、 、 、 、 、 、 、 、 、 、 、 "Hot cell leak" transfers 'liquid phase 323562 in the liquid channel U in the core 12 9 201237339 Steam bubbles are generated in the working fluid, which are easily facilitated by the flow of the liquid working fluid from the liquid channel 11 in the core 12 This prevents dryness, thereby maintaining cooling performance and achieving stable heat dissipation performance. In particular, the end of the core 12 contacts the vapor passage 10. Therefore, the liquid phase working fluid in the liquid passage 11 near the end of the core 12 is heated. The formation of vapor bubbles can be accelerated at temperatures substantially the same as the temperature of the vapor phase working fluid. In addition, thin planar evaporators, such as electronic components and printed circuit boards, are suitable for effectively cooling planar heat generating components that generate a significant amount of heat. The heat of the self-heating component 9 is more easily transferred to the liquid phase working fluid through the core 12. Therefore, the temperature of the liquid phase working fluid is increased, thereby accelerating the production of steam bubbles. In particular, for example, in a thinner and wider (longer) evaporator 1, since the height of the liquid passage 11 in the core 12 is reduced, the liquid phase working fluid is often prevented from entering below the vapor bubble, which may result in the core 12 In this case, the vapor bubbles are easily removed from the liquid passage 11 in the core 12, thereby preventing dryness and achieving stable heat dissipation performance. The cooling device configured as above supplies the liquid in the evaporator 1. A portion of the liquid phase working fluid of the passage 11 leaks from the surface of the core 12 facing the vapor passage 10 in the evaporator 1. In other words, a portion of the liquid phase working fluid flowing through the inlet of the liquid passage 11 in the evaporator 1 leaks through the core 12 to The steam passage 10 on the side of the evaporator 1. The liquid phase working fluid leaking from the surface of the core 12 is evaporated (vaporized) by the heat transferred from the heat generating component 9 through the outer casing 13 into a vapor phase working fluid because the partial core 12 is in thermal contact with the evaporator. Part 1 of the outer casing 13. As shown in Fig. 1, the vapor phase working fluid leaking and evaporating flows into the cold by evaporation 10 323562 201237339 •: the steam passage 10 and the vapor line 4 in the vessel 1 2. After this, • the heat of the vapor phase working fluid is removed in the condenser 2, and the vapor phase working fluid is cooled and condensed (flowing) into a liquid phase working fluid. The condensed liquid phase working fluid flows into the liquid reservoir through the liquid line 5. Tank 3. In other words, the liquid phase working fluid from the condenser 2 flows from the first inlet 3A of the liquid reservoir 3 into the liquid reservoir 3. The liquid reservoir 3 retains the liquid phase. The working fluid is passed by the liquid delivery pump 8. The liquid supply line 6 provides the liquid passage 11 of the evaporator 1. Therefore, the working fluid counterflows the liquid distribution tank 3, the liquid supply line 6, the evaporator 1, the vapor line 4, the condenser 2 and the liquid line 5 define the circulation route. In one aspect, the remainder of the liquid phase working fluid providing the liquid passage 11 of the evaporator 1 flows through the outlet of the liquid passage 11 of the evaporator 1, and then returns to the liquid storage tank 3 through the liquid return line 7. More specifically, the remaining portion of the liquid phase working fluid flowing through the inlet of the liquid passage 11 of the evaporator 1 is maintained in the liquid phase or a portion of the liquid phase working fluid is vaporized from the heat of the core 12 into a vapor phase working fluid, thereby forming a mixture. The phase working fluid flows through the outlet of the liquid passage 11 of the evaporator 1 and returns to the liquid reservoir 3 through the liquid return line 7. In this manner, the working fluid countercurrents the liquid reservoir 3, the liquid supply line 6, the evaporator 1 and the liquid return line 7 define the flow path. This cooling device achieves a significantly higher cooling performance (thermal light radiance characteristic) because the heat of the heat generating component 9 can be efficiently transferred by evaporating latent heat and sensible heat. More specifically, when the liquid 11 323562 201237339 of the steam passage 10 leaking out of the core 12 is vaporized by the working fluid, it is transferred from the heat generating component 9 to the portion of the evaporator 1; the heat is stored in the vapor phase working fluid as the latent heat of vaporization (vaporization heat), which is then sent to the condenser 2 through the vapor line 4 for heat radiation. Further, part of the heat transferred from the heat generating unit 9 to the evaporator 1 is sent to the liquid passage 11 through the core 12, and the liquid phase working fluid stored in the liquid passage 11 is used as sensible heat. If the temperature of the liquid phase working fluid exceeds its saturation temperature, part of the liquid phase working fluid phase changes to the vapor phase. In this cooling device, since the working fluid flowing through the liquid passage 11 flows through the liquid transfer pump 8, the liquid phase working fluid at a high temperature is transported to the liquid storage tank 3 through the liquid return line 7. For example, through the liquid return line 7, heat is emitted from the liquid return line 7 surface. In this manner, the liquid phase working fluid at a high temperature is discharged from the evaporator 1 except for the vapor phase working fluid, instead of remaining in the evaporator 1. In other words, the entire heat transferred from the heat generating component 9 to the evaporator 1 is carried out of the evaporator, thereby substantially completely radiating heat. Therefore, it is possible to maintain the evaporator 1 at a lower temperature, thereby achieving significantly higher heat dissipation performance. As previously mentioned, the cooling device is a loop heat pipe (LHP) comprising an evaporator 1, the evaporator 1 comprising a core 12 and a condenser 2, wherein the outlet of the evaporator 1 and the inlet of the condenser 2 are connected to the vapor line 4, and condensed The outlet of the vessel 2 is connected to the inlets of the evaporator 1 to the liquid lines 5 and 6, which are filled with working fluid. This loop heat pipe can be supplied with heat from the circulating working fluid by the capillary 1 providing the capillary force of the core 12 to deliver heat. In other words, heat can be delivered to the condenser 2 by the vapor pressure in the evaporator 1. 12 323562 201237339 • In this embodiment, the loop heat pipe configured as described above further provides a liquid reservoir: the sump 3, the liquid return line 7, and the liquid transfer pump 8. In this embodiment, the '&quot; end of the liquid return line 7 is connected to the outlet of the liquid passage 11 at the evaporator 1, and the other end of the liquid return line 7 is connected to the liquid storage tank 3. More specifically, the outlet of the liquid passage port of the evaporator 1 is connected to the second inlet 3B of the liquid storage tank 3 by the liquid return line 7. Further, the liquid storage tank 3 and the liquid transfer pump 8 are liquid lines 5 and 6 which are inserted in the inlet of the condenser 2 and the inlet of the evaporator 1. More specifically, the liquid line 5 and the liquid supply line 6 are provided as a liquid line connecting the outlet of the condenser 2 and the inlet of the evaporator 1, wherein the outlet of the condenser 2 and the first inlet 3A of the liquid storage tank 3 are liquid The line 5 is connected, and the outlet 3C of the liquid storage tank 3 and the inlet of the liquid passage π of the evaporator 1 are connected to the liquid supply line 6. Further, a liquid transfer pump 8 is inserted in the liquid supply line 6. The loop heat pipe has a route for circulating the working fluid: the first route (first loop) flows through the liquid reservoir 3, the liquid supply line 6, the evaporator 1, the vapor line 4, the condenser 2, and the liquid line 5; And the second route (second loop) is circulated through the liquid reservoir 3, the liquid supply line 6, the evaporator 1, and the liquid return line 7. In this configuration, the working 々IL body flowing through the first route is mainly circulated by the capillary force of the core 12, and the working fluid flowing through the first route is mainly circulated by the liquid transfer pump 8. When the secret element H as the receiving element and the condenser phase f as the heat dissipating unit are far away to define a longer heat transport series, or the #liquid channel is narrower than the thin evaporator, such as a microchannel, the pressure loss in the circulation path will increase. . In this 13 323562 201237339-like configuration, a larger liquid delivery pump would be required (or multiple fluid delivery would be required; fruit). In contrast, in this embodiment, the second route of the liquid phase working fluid flowing by the power of the liquid transfer pump 8 is shorter. Further, since such a cooling device employs latent heat of vaporization, the amount of the liquid phase working fluid supplied by the liquid transfer pump 8 to the evaporator 1 (smaller amount of fluid) is reduced as compared with the sensible heat sink in the single phase. Therefore, since only a small amount of working fluid is required to flow through the shorter circulation path, the pressure loss in the circulation path is reduced and a smaller liquid delivery pump 8 (or a smaller amount of the liquid delivery pump 8) can be used accordingly. In other words, even if the fruit 8 is delivered with a smaller liquid, a sufficient amount of working fluid can be circulated without the need for a larger liquid delivery pump (or no more liquid delivery pump). Further, the thinner and wider thin planar evaporator 1 is difficult to uniformly immerse the liquid phase working fluid across the large-area core 12 to evaporate the liquid phase working fluid. In such an evaporator, for example, due to the partial drying of the core 12, the circulation of the working fluid is unstable. The provision of the liquid transfer pump 8 eliminates these problems and achieves stable heat dissipation performance. Therefore, with the aid of the smaller liquid transporting pump 8, a thin planar evaporator can be used to effectively cool planar heat generating components, such as electronic components and printed circuit boards, which generate a large amount of heat. This means that the plane can be realized by reducing the thickness (height) of the evaporator 1 (reducing the height while increasing the area), and reducing the size of the liquid delivery pump (or using less liquid delivery pump 8, volume reduction and energy saving). Effective cooling of the heating element. Note that a decrease in the size and/or amount of the liquid transfer pump (S) means a decrease in the capacity of the liquid transfer pump 8. 14 323562 201237339 (In addition, even if the evaporator 1 as a dual thermal unit and the condenser as a heat sink - are far apart, thereby increasing the heat transfer distance, a smaller liquid transfer pump 8 can be used. More specifically, even the evaporator 1 and the condenser are far apart, thus increasing the heat transfer distance, heat can be transported to the distant condenser 2 with the assistance of the capillary force of the core 12 provided by the evaporator 1 and the vapor pressure of the evaporator 1. Thus A cooling device for an efficient and high performance thin planar evaporator i. In this embodiment, the liquid reservoir 3 has a liquid electrolyte working fluid and a vapor phase working fluid of sufficient height to separate, as shown in FIG. In other words, the liquid reservoir 3 has a height sufficient to define the space above the liquid working fluid while retaining the liquid phase working fluid of the liquid reservoir 3. In particular, the second inlet 3B of the liquid reservoir 3 preferably provides The outlet 3C of the liquid inlet tank 3 far from the first inlet 3A. More specifically, the liquid reservoir tank 3 preferably includes an outlet 3c connected to the liquid supply line 6, provided near the outlet 3C and connected to the liquid line The first inlet 3A of 5 provides a second inlet 3B further to the outlet 3C and is connected to the liquid return line 7. In this embodiment, the outlet 3C of the liquid reservoir 3 is provided on the wall 3X of the liquid reservoir 3. a lower position, that is, a wall downstream of the flow direction of the working fluid. Further, the second inlet 3B of the liquid reservoir 3 is provided on the other wall 3Y of a wall 3X opposite to the liquid reservoir 3. That is, the wall upstream of the flow direction of the working fluid. Further, the first inlet 3A of the liquid reservoir 3 is provided on the wall 32 perpendicular to one of the liquid reservoirs 3 and the other walls 3X and 3Y. In this embodiment, the liquid line 5 connected to the first inlet 3A of the liquid storage tank 3 extends inside the liquid storage tank 3, 323562 15 201237339 -· one end is provided near the outlet 3C of the liquid storage tank 3. ^ In this manner, the liquid phase working fluid which is not evaporated in the evaporator 1 and flows through the liquid passage 11 in the evaporator 1 and then returned to the liquid storage tank 3 via the liquid return line 7 is introduced into the liquid storage tank 3 as far as possible. At the position of the outlet 3C of the liquid reservoir 3. Thus, if steam is present The air bubbles ensure the removal from the liquid working fluid. On the other hand, the liquid phase working fluid introduced into the condenser 2 and returned to the liquid reservoir 3 via the liquid line 5 is introduced into the liquid reservoir 3 as close as possible to the liquid reservoir. The position of the outlet 3C of the tank 3. Thus, the liquid phase working fluid cooled in the condenser 2 without vapor bubbles is discharged more quickly to the outlet 3C of the liquid storage tank 3, and then supplied to the evaporator 1 by the liquid transfer pump 8. By the outlet 3C of the liquid storage tank 3 being placed at a lower position, even if the liquid phase working fluid containing the vapor bubbles flows into the liquid storage tank 3, the vapor bubbles emerge from the upper position of the tank 3 and are prevented from being introduced into the stream. Working fluid passing through the outlet of the liquid reservoir 3. The cooling device configured above is for cooling the electronic component 21 in the electronic device 20 (such as a computer) (see Fig. 4). In this case, the electronic device 20 includes the electronic component 21 and the cooling device 22 (see FIG. 1) configured as described above to cool the electronic components 21, wherein the electronic component 21 is the evaporator 1 thermally connected to the cooling device 22. . In this case, the electronic component 21 may contact at least one of the front side (top side) and the back side (bottom side) of the evaporator 1 of the cooling device 22 via the circuit board 23 (eg, a printed board) (see FIG. 4). Or the electronic component 21 can directly contact at least one of the front and the back of the evaporator 1 of the cooling device 22. 16 323562 201237339 For example, a circuit board 23, such as a printed circuit board, including electronic components 21' mounted thereon, may be provided on at least one of the front and back sides of the evaporator 冷却 of the cooling device 22 (see Figure 4). Alternatively, the evaporator 1 of the cooling device 22 can be placed on the front side of the electronic components provided on a circuit board such as a printed circuit board. Alternatively, an electronic component provided on a circuit board such as a printed circuit board may be disposed such that the electronic component directly contacts the front of the evaporator 冷却 of the cooling device 22. A circuit board having electronic components mounted thereon receives heat from the contact of the electronic components as a heat generating component. This board is called a plate heating assembly or a flat (flat) heating assembly because the entire board generates heat and has a plate shape. In the following, the exemplary electronic device will be described with reference to Figures 4 and 5 including a planar evaporator 1 to effectively cool the planar heat generating assembly 24, which is provided on the front and back sides of the planar evaporator 1. As shown in Fig. 5, the evaporator 1 includes a casing 13 (in this embodiment, a metal peripheral). The peripheral 13 includes a liquid inlet 13A, a liquid outlet 13B, and a steam outlet 13C. The core 12 is a porous body made of resin. A liquid inlet side manifold 25' made of resin and a liquid outlet side manifold 26 made of resin. In this embodiment, the core 12 includes a planar portion 12a provided on the front surface and the back surface of the planar portion 12A, a plurality of protruding portions 12β extending in the first direction and arranged in parallel with each other, and formed in the planar portion 12a, in the first portion The plurality of through holes 12C extending in the second direction perpendicular to the direction and arranged in parallel with each other. In this embodiment, as shown in Fig. 4, there are a plurality of protruding portions 12B each having a rectangular cross section on the front side and two resin porous plates having a plurality of grooves 12CX each having a semicircular cross section on the back side. 12AX's 17 323562 201237339

The back sides of J are bonded together to form a core 12 including a flat portion 12A, a protruding portion 12B, and a through hole 12C. Thus, once the core 12 is contained in the outer casing 13, the front surface of the plurality of projecting portions 12B provided on the front surface contacts the upper wall portion of the outer casing 13, and the front surface of the plurality of projecting portions 12B provided on the back surface contacts the bottom wall portion of the outer casing 13. Thus, the plurality of regions around the upper wall of the outer casing 13, the planar portion 12A of the core 12, and the protruding portion 12B define a plurality of through holes extending in the first direction and arranged in parallel with one another to define a vapor passage for the flow of the vapor phase working fluid 10. More specifically, the space defining groove 15 between the plurality of projecting portions 12B provided on the front surface of the core 12, and the upper wall of the outer casing 13 of the upper portion of the plurality of grooves 15 are closed to define the steam passage 10. Similarly, the plurality of regions around the bottom wall of the outer casing 13, the planar portion 12A of the core 12, and the projection 12B define a plurality of through holes extending in the first direction and arranged in parallel with one another to define a vapor passage for the flow of the vapor phase working fluid. 10. More specifically, the space defining groove 15 between the plurality of projecting portions 12B provided on the back surface of the core 12, and the bottom wall of the outer casing 13 of the upper portion of the plurality of grooves 15 are closed to define the steam passage 10. Thus, in this embodiment, the evaporator 1 includes a plurality of vapor passages 10 on opposite sides thereof that sandwich the planar portion 12A of the core 12. Further, a plurality of through holes 12C formed in the planar portion 12A of the core 12 define a liquid passage 11 through which the liquid phase working fluid flows. In other words, the vapor passage 10 provided on the front surface and the back surface of the flat portion 12A of the core 12 and the liquid passage 11 formed in the flat portion 12A of the core 12 are separated by the flat portion 12A of the core 12. The liquid phase working fluid of the liquid passage 18 323562 201237339 11 is supplied by the capillary force of the core 12 to leak to the side of the steam passage 10 through the pores of the core 12. Further, in this embodiment, the plurality of liquid passages 11 extend in the second direction perpendicular to the first direction and are arranged in parallel with each other. In other words, in this embodiment, the liquid passage 11 and the steam passage 10 extend in mutually perpendicular directions. Therefore, as will be described below, the liquid outlet 13B and the steam outlet 13C are provided in the wall of the evaporator 1, which are perpendicular to each other. In other words, the liquid return line 7 and the vapor line 4 are connected to the walls of the mutually perpendicular evaporator 1. Thus, it is ensured that the liquid phase working fluid flowing through the liquid passage 11 and the vapor phase working fluid flowing through the steam passage 10 are separated in a simple configuration, thereby guiding the liquid phase working fluid to the liquid return line 7, and the vapor phase working fluid to the vapor line. 4. Therefore, in this embodiment, the evaporator 1 has a three-layer structure in which the vapor channel layer including the plurality of steam passages 10, the liquid passage layer including the plurality of liquid passages 11, and the vapor passage layer including the plurality of steam passages 10 are stacked. In other words, an inner layer defined between the two outer layer defining vapor channel layers and the two vapor channel layers defines a liquid channel layer. Therefore, the evaporator 1 includes a steam passage 10 (first steam passage) provided at the upper portion of the core 12, a steam passage 10 (second steam passage) provided at the bottom of the core 12, and a liquid passage 11 in the core 12. In this embodiment, for the planar evaporator 1, the outer steam passage layer preferably has a height of about 1 mm or less, and the inner liquid passage layer preferably has a height of about 2 mm or less. Specifically, in this embodiment, the core 12 is a porous body made of polytetrafluoroethylene (PTFE) resin having a porosity of about 40% and an average pore diameter of about 5 μm. Further, the core 12 has a thickness of about 4 mm, which is the thickness from the projection 19 323562 201237339 : 12B on the front side to the end of the projection 12B on the back surface, and the plane of the core 12 is about 110 mm χΐ ιο 亳. Further, the steam passage 10 has a cross section of about 1 mm and XI mm, and the plurality of steam passages 1 排列 are arranged in parallel with each other at a pitch (pitch) of about 2 mm. Further, the liquid passage u has a cross-sectional diameter of about 丨 mm, and the plurality of liquid passages are arranged in parallel with each other at a pitch (pitch) of about 2 mm. Further, the minimum thickness of the flat portion 12A of the core 12 separated between the steam passage 10 and the liquid passage 1} is about 毫米 5 mm. Further, the core 12 configured as described above includes a liquid inlet side manifold 25 attached to one side of the liquid passage u and a liquid outlet side manifold 26' attached to the other side and included in the outer casing 13, as in the fifth The figure shows. More specifically, the outer casing 13 includes a liquid inlet 13A on the wall, a liquid outlet 13B on the wall opposite to the wall, and a steam outlet 13C on the wall perpendicular to the wall. The core 12 having the attached liquid inlet side manifold 25 and the liquid outlet side manifold 26 is contained in the outer casing 13 such that its liquid passage u extends from a wall body toward the wall of a wall body of the opposite outer casing 13. Therefore, the steam passage 1 of the core 12 extends from the wall of the vertical wall to the opposite wall. Further, the opening of the liquid inlet side manifold 25 and the liquid supply line 6 are connected to the liquid inlet 13 A of the outer casing, and the liquid outlet side manifold 26 opening and the liquid return line 7 are connected to the liquid outlet 13B'. Steam outlet i3C. In this manner, the core 12 and the like are contained in the outer casing 13, and the liquid supply line 6 and the like, which are attached to the outer casing 13, so that the liquid supply line 6' liquid inlet side manifold 25' core 12 liquid passage That is, the liquid outlet side manifold 26 and the liquid return line 7 are connected to each other, and the steam passage 10 and the vapor line 4 of the core 12 are connected to each other. 323562 20 201237339 Specifically, in this embodiment, for example, the liquid inlet side manifold 25 and the liquid outlet side manifold 26 are resin manifolds composed of MC nylon. Further, the outer casing 13 is a copper outer casing having a wall thickness of about 0.3 mm. Here, the outer casing 13 is manufactured by making a container made of copper having an opening at the upper portion, and a cover made of copper to cover the upper opening; the core 12 and the like are closed in the container; and the container and the lid are welded to seal the outer casing 13. Then, as shown in Fig. 4, on both sides (i.e., on the top surface and the bottom surface) of the planar casing 13 of the evaporator 1 configured as described above, printing is provided with a plurality of electronic components 21 (heat generating components) mounted thereon. The circuit board 23, that is, the planar heat generating component 24. In other words, the planar heatsink assembly 24 is thermally coupled to both sides of the outer casing 13 of the planar evaporator 1 (i.e., on the top and bottom surfaces). Specifically, the top surface of the outer casing 13 of the planar evaporator 1 and the back surface of the planar heat generating component 24, that is, the back surface of the printed circuit board 23 on which the plurality of electronic components 21 are mounted are in close contact with the thermal conductive stone, so that the planar surface is made flat. The heat of the heat generating component 24 is heated to the planar evaporator 1. Similarly, the bottom surface of the outer casing 13 of the planar evaporator 1 and the back surface of the planar heat generating component 24, that is, the back surface of the printed circuit board 23 on which the plurality of electronic components 21 are mounted are in close contact with the thermal grease, so that the planar heat generating component 24 is Heat to the flat evaporator 1. In this embodiment, for example, the heat generated by the planar heat generating component 24 is approximately 150 watts. In this case, about 150 watts of heat is from each of the top and bottom surfaces to the flat evaporator 1 for a total of about 300 W of heat. The printed circuit board 23 having the plurality of electronic components 21 mounted thereon is provided to the electronic device 20. Therefore, the thermal connection to the planar evaporation 21 323562 201237339 having the printed circuit board 23 on which the plurality of electronic components 21 are mounted is provided in the cooling device 22 included in the electronic device 20 for cooling, including: in the electronic device 20 Electronic component 21. Therefore, the planar evaporator 1 is connected to the condenser 2, the liquid storage tank 3' and the cooling device 22 configured as described above include the liquid delivery system 8 (see Fig. 1). Specifically, the condenser 2 is disposed at a position of about 300 mm outside the evaporator 1. The inlet of the condenser 2 is connected by a vapor line 4 to the steam outlet 13C of the above-mentioned planar evaporator 1. Further, the condenser 2 is manufactured, for example, by four times a copper tube having a length of about 300 mm, a diameter of about 6 mm, an inner diameter of about 5 mm, and a swaging aluminum fin around the copper tube (heat dissipation) Device). In addition, a condensing unit having a condenser and a blowing fan (cooling unit, cooling unit) can be provided to provide high air cooling by blowing air to the fins to improve heat dissipation. The vapor line 4 is a copper tube having an outer diameter of about 6 mm and an inner diameter of about 5 mm. Instead of heat sink fins, other types of heat sinks, such as heat sinks, are available. Alternatively, cooling may be provided by direct blowing to the conduit without providing a heat sink. Although the air-cooled cold unit 7L in this embodiment uses natural air convection or air blowing means, it is not limited thereto, and a water-cooled cooling unit which utilizes water cooling can be used. In other words, the condensing unit can include a water cooled cooling unit. The liquid storage tank 3 is placed at the first inlet 3 of the adjacent flat evaporator evaporator liquid storage tank 3, and is connected to the outlet of the condenser 2 by the liquid line 5; the second inlet 3 of the liquid storage tank 3 The liquid outlet (10) is connected to the above-mentioned planar evaporator i with a liquid return line 7; and the outlet of the liquid (4) tank 3 is connected to the liquid inlet m of the above-mentioned planar evaporator i with a liquid supply line 6 and a liquid delivery fruit 8. The liquid storage tank 3 is a wall made of a steel which is not recorded with 323562 22 201237339 steel and has a thickness of about 0.3 mm, a bottom outer area of about 50 mm χ 35 mm, and a height of about 25 mm. The liquid line 5 is a copper tube having an outer diameter of about 4 mm and an inner diameter of about 3 mm. The liquid supply line 6 is a stainless steel tube having an outer diameter of about 4 mm and an inner diameter of about 3 mm, and the liquid return line 7 is a copper tube having an outer diameter of about 4 mm and an inner diameter of about 3 mm. The liquid transfer pump 8 is, for example, an electromagnetic piston type micro pump (Model PPLP-03060-001, Shinano Kenshi Co., Ltd.). Here, for example, ethanol is used as the working fluid, since ethanol has a latent heat of vaporization of about 855 kJ/kg and a density of about 785 kg/m3, and an amount of heat of about 671 j per 1 ml can be transferred. It is assumed that an amount of heat of about 300 W (= 300 J/s) is transferred from the flat hair unit 24 to the plane evaporator i, requiring a flow rate of about G. 45 ml/sec or . Therefore, the amount of liquid is circulated by the liquid transfer pump 8 adjusted to about 1.25 liters per liter (= about 30 milliliters per minute). Please note that the liquid wheel detailing pump 8 can be a piezoelectric driven diaphragm pump or a centrifugal turbo pump. Therefore, the advantages of the cooling device and the electronic device according to the present embodiment are that even if the liquid phase working fluid generates vapor gas, the α, , and 蒗 蒗 bubbles are easily removed, thereby achieving stable heat dissipation performance. In particular, in the above-described embodiment, the cooling device including the thin flat &amp; oxime evaporator 1 can effectively cool the planar heat generating components that generate large heat, such as electronic components and printed circuit boards (circuits). board). In addition, the mouth horse uses the falling hair snorkeling and steam pressure, and can use the smaller liquid to reverse the charge........ The pump δ realizes the transmission. Can achieve higher performance of electronic devices such as computers ^. ... having the operating electronic component 21 mounted on the eve of the e-Gentle, the printed circuit board 23 (total heat generation of about 300 watts) is actually used in the above-mentioned configuration, the person's order device 22 (see 323562 23 201237339 4th) And 5) cooling, and measuring the temperature of the electronic component 21. As a result, all of the electronic components 21 are maintained at a temperature of about 80 ° C or lower, thus providing satisfactory cooling. It has also been confirmed that as long as the heat generated by the printed circuit board 23 including the electronic component 21 is maintained at up to about 300 W, the core 12 of the evaporator 1 is not dried, and the abnormal high temperature of the electronic component 21 is prevented, providing stable heat dissipation performance. It is to be noted that the present invention is not limited to the configuration of the embodiments described above, and can be modified in various ways, and is within the scope of the present invention. For example, active heat radiation can provide a heat sink in the liquid return line 7, thereby enhancing the performance of the cooling apparatus of the above-described embodiments. For example, a heat sink or heat sink, such as a heat sink, may be provided in a portion of the liquid return line 7. Further, a blowing fan (cooling unit, cooling means) may be provided for blowing to the radiator provided by the liquid return line 7 for providing forced air cooling for cooling. Alternatively, no heat sink may be provided to provide cooling by direct blowing to the liquid return line 7. In this embodiment, the air-cooled cooling unit is used by natural air convection or blowing, and is not limited thereto and a water-cooling type cooling unit using water cooling can be used. In this case, the cooling unit in the liquid return line 7 is individually supplied from the cooling unit in the condensing device. Further, as shown in Fig. 6, the liquid return line 7 portion may be provided in the condensing means including the condenser 2 and the blowing fan (cooling unit, cooling means) for active heat radiation for cooling. For example, if the liquid return line 7 provides a heat sink, a portion of the liquid return line 7 in which the heat sink is disposed may be provided in the condensing unit. In this case, the cooling unit in the condensing unit can also be used as a cooling unit, such as a blowing fan, for cooling the liquid 24 323562 201237339 - return line 7. Thereby, the working fluid flowing through the liquid return line 7 can be advantageously cooled by the cooling capacity of the condensing device. Further, for example, if the liquid return line 7 does not provide a radiator, the liquid return line 7 is directly cooled by the cooling unit of the condensing unit. This causes the vapor bubbles of the liquid phase working fluid flowing through the liquid return line 7 to be actively removed. Further, for example, if a larger amount of heat is conducted to the evaporator 1, the temperature of the liquid phase working fluid flowing through the core 12 tends to increase. Even in this case, the cooling performance can be improved by actively cooling the liquid phase working fluid flowing through the liquid return line 7. Although the above embodiment has described the planar heat generating component 24 provided on the two surfaces of the planar evaporator 1, it is not limited thereto. For example, as shown in Fig. 7, a planar heat generating component 24 is provided on one side of the planar evaporator 1, so that the planar evaporator 1 and the planar heat generating component 24 are thermally connected to each other. In this case, the core 12 may be formed as a resin porous plate, and the resin porous plate may be provided on the front side in a rectangular section including the plurality of protruding portions 12B, extending in the first direction and arranged in parallel with each other, and including a plurality of concaves in the semicircular section The grooves 12CX are provided on the back side, extending in a second direction perpendicular to the first direction, and arranged in parallel with each other. In this case, it is configurable that once the core 12 is contained in the outer casing 13, the upper wall body of the surface contacting the outer casing 13 on which the plurality of projecting portions 12B are formed, and the surface on which the plurality of grooves 12CX are formed contact the bottom of the outer casing 13 wall. Thus, the plurality of regions surrounded by the upper wall of the outer casing 13, the side faces between the protruding portions 12β and the bottom surfaces of the plurality of protruding portions 12B are defined in the first direction extension 323562 25 201237339 and the parallel tracks are parallel and mutually defined, defining the flow through the flow phase thereof. The steam channel of the fluid ίο. More specifically, the space provided between the plurality of projecting portions 12B on the front surface of &amp; 12 defines a groove 5, and the upper portion of the plurality of grooves 5 is closed by the upper wall of the outer casing 13, defining a steam passage 1〇. Further, a plurality of regions surrounded by the bottom wall of the outer casing 13 and the recess 12α define a plurality of through holes extending in the first direction and arranged in parallel with each other, defining a liquid passage through which the liquid phase working fluid flows. In this case, the planar heat generating component 24 is thermally connected to the front of the steam passage 1 on which the planar evaporator 1 is provided. In other words, the electronic component 21 is thermally coupled to the side of the vapor passage 1〇 on which the planar evaporator 丨 is provided. In this case, the 'planar evaporator 1 includes a vapor passage 10 on the upper side of the core 12, that is, on the side contacting the planar heat generating component 24, and a liquid passage η included on the bottom side of the core 12, that is, the contact plane is heated. On the side of the opposite side of the assembly 24. In other words, the planar evaporator i has a two-layer structure in which the stack includes a vapor channel layer of a plurality of vapor channels 10 and a liquid channel layer including a plurality of liquid channels 11. In this case, the hairpin i privately flows from the steam passage 1〇 above the core 12 and one of the bottom sides and the liquid passage u provided on the other side of the core u and the bottom side. In this embodiment, the surface evaporator 1, the upper vapor passage layer preferably has a width of about 丨 mm or more, and the lower liquid passage layer preferably has about 1 mm or more and 2 degrees. The planar evaporation H 以上 of the above configuration has a reduced height (thickness; ^, 吏, specifically, the thickness of the core 12, that is, from the end of the protruding portion on the front side to the protruding portion 12β on the back surface, than the above embodiment. The thickness of the end is about 2 mm. Further, 323562 26 201237339. The cross-sectional height of the liquid passage 11 is about 〇5 mm. Note that other sizes are similar to the specific exemplary configuration of the above embodiment. Further, the core 12 is configured as described above. A liquid inlet side manifold 25 attached to one side of the liquid passage u and a liquid outlet side manifold 26 attached to the other side are included and contained in the outer casing 13, as shown in Fig. 8. More specifically, The outer casing 13 includes a liquid inlet 13A on a wall, a liquid outlet 13B on a wall opposite the wall, and a steam outlet 13C on the wall of a vertical wall. The liquid inlet side manifold 25 and the liquid The core 12 to which the outlet-side manifold 26 is attached is included in the outer casing 13 such that the liquid passage n extends from a wall toward a wall of a wall opposite the outer casing 13. Therefore, the steam passage 10 of the core 12 is vertical The wall of the wall extends to the opposite wall Further, the opening of the liquid inlet side manifold 25 and the liquid supply line 6 are connected to the liquid inlet 13A' of the outer casing 13 and the liquid outlet side manifold 26 opening and the liquid return line 7 are connected to the liquid outlet 13B, and the vapor line 4 is connected to the steam outlet 13C. In this manner, the core 12 and the like are contained in the outer casing 13, and the liquid supply official line 6 and the like are attached to the outer casing 13, so that the liquid supply line 6, the liquid inlet side manifold 25, the core 12 The liquid passage π, the liquid outlet side manifold 26 and the liquid return line 7 are connected to each other, and the steam passage 1〇 and the vapor line 4 of the core 12 are connected to each other. Note that specific configurations such as manifolds 25 and 26 and The material and size of the outer casing 13 is similar to the specific exemplary configuration of the above embodiment. Further, as shown in Fig. 7, the top surface of the outer casing 13 of the planar evaporator i and the rear surface of the planar heat generating assembly 24, i.e., The back side of the printed circuit board 23 of the plurality of electronic components 21 is in intimate contact with the thermal grease to transfer heat from the flat surface 323562 27 201237339 • the heat generating component 24 to the planar evaporator 1. In this embodiment, for example, the flat, surface heat generating component 24 is produced. The heat is about 1 watt. The total amount of heat generated by the plurality of electronic components 21 included in the planar heat generating component 24 is about 1 〇〇w. Therefore, this heat is transferred to the planar evaporator 1. Further, similar to the above embodiment, cooling The unit 22 comprises a planar evaporator 1 connected to a condenser 2' liquid reservoir 3, and a liquid transporting fruit 8 (see Fig. 1). Specifically, the condenser 2 is manufactured, for example, by four times with about 3 〇〇 mm length, diameter of about 4 mm, diameter of about 3 mm, and forged aluminum fins (heat sink) around the copper tube. Vapor line 4 has an outer diameter of about 4 mm and about 3 Copper tube with an inner diameter of millimeters. The liquid line 5 is a copper tube having an outer diameter of about 3 mm and an inner diameter of about 2 mm. The liquid supply line 6 is a stainless steel tube having an outer diameter of about 3 mm and an inner diameter of about 2 mm, and the liquid return line 7 is a copper hose having an outer diameter of about 3 mm and an inner diameter of about 2 mm. As shown in Fig. 9, for example, a piezoelectric micropump (the SMp32 crucible of the type of Takasago Electric Industries Co., Ltd., the normal flow rate of 2 〇ml/min, the maximum pumping pressure of 35 kPa, and 33 mm χ33 耄m x 5. 5 mm External dimensions) for the liquid delivery pump 8. Here, ethanol is used as the working fluid, for example, about 671 J per liter of hot 篁' because ethanol has a latent heat of vaporization of about 855 kJ/kg and a density of about 785 kg/m3. It is assumed that about 100 watts (= 1 〇〇 J/s) of heat is transferred from the planar heat generating component 24 to the planar evaporator. A flow rate of about 15 ml/sec or more is required. Therefore, the amount of liquid circulating through the liquid transfer pump 8 was adjusted to 166 ml/sec (= 10 ml/min). Please note that the liquid transfer pump 8 323562 28 201237339 • Can be an electromagnetic piston type micro pump or a centrifugal turbo pump. Note that the other - construction, such as size, is similar to the specific exemplary configuration of the embodiment described above. The printed circuit board 23 (having a total heat generation amount of about 100 watts) on which the electronic component 21 is mounted is actually cooled by such a cooling device 22, and the temperature of the electronic component 21 is measured. As a result, all of the electronic components 21 are maintained at a temperature of about 80 ° C or lower, thus providing satisfactory cooling. It is also confirmed that as long as the heat generated by the printed circuit board 23 included in the electronic component 21 is maintained within at most about 100 watts, the core 12 in the evaporator 1 is not dried, preventing an abnormally high temperature of the electronic component 21, providing stable heat dissipation performance. Further, for example, as shown in Fig. 10, the first planar evaporator IX and the second planar evaporator 1Y may be provided on both sides, i.e., the top and bottom surfaces of the planar heat generating component 24, so that the first and second planar evaporators The IX and 1Y and planar heat generating components 24 are thermally coupled to each other. In other words, as shown in Fig. 7 above, the planar heat generating component 24 can be thermally connected to the planar evaporator 1, and the other planar evaporator 1 can be thermally coupled to the planar heat generating component 24. In this case, the first and second planar evaporators IX and 1Y include a vapor passage 10 on the side contacting the planar heat generating assembly 24, and a liquid passage 11 on the opposite contact planar heat generating assembly 24. On the side of the side. Therefore, the first planar evaporator IX includes a vapor passage 10 (first steam passage) provided on one of the top and bottom sides of the core 12 (first porous body), and is provided on the top and bottom sides of the core 12 The liquid passage 1K on the other one is the first liquid passage). Further, the second planar evaporator 1Y includes a steam passage 1 (second steam passage) provided above one of the top and bottom sides of the core 12 (second porous body), and is provided at the top and bottom of the core 12. Side 29 323562 201237339 'The other liquid channel ll (second liquid channel). The first flat is provided thereon: the side of the vapor channel 10 in the surface evaporator 1X is thermally connected to the back side of the electronic component 21', on which the side of the vapor channel 10 in the second planar evaporator 1Y is thermally connected to the electronic component 21 front side. Note that the configuration and specific exemplary configuration of the first and second planar evaporators IX and 1Y are similar to the planar evaporator 1 shown in Figs. 7 and 8 described above. Further, as shown in Fig. 10, the top surface of the outer casing 13 of the first planar evaporator IX (i.e., the top surface of the outer casing 13 on the side of the steam passage 1) and the bottom surface of the planar heat generating assembly 24 (i.e., mounted thereon) The back surface of the printed circuit board 23 of the plurality of electronic components 21 is in close contact with the thermal grease. In addition, the second plane evaporates the bottom surface of the outer casing 13 (i.e., the front surface of the outer casing 13 on the side of the steam passage 1) and the top surface of the planar thermal assembly 24 (i.e., the plurality of electric components, the sub-X 21 are mounted thereon) The front side of the printed circuit board 23 is in close contact with the thermal grease. Thereby, the heat from the planar heat generating component 24 is transmitted to the upper and lower first and second planar evaporators 1X and 1?. In this embodiment, for example, the heat generated by the planar heat generating component 24 is approximately 200 watts. The total amount of heat generated by the plurality of electrical components 21 included in the planar heat generating component 24 is about 2 〇 〇 which is transferred to the upper and first and second planar evaporators IX and 1Υ. Further, the first and second planar evaporators IX and 1A are connected to the condenser 2, the liquid storage tank 3, and the liquid delivery pump 8 included in the cooling device 22, as shown in Fig. 11. In this embodiment, the vapor line 4 connected to the condenser 2 is divided into two tubes which are respectively connected to the first and second planes to evaporate g1Χ*1Υ. More specifically, the vapor line 4Υ connected to the second planar evaporator 1Υ is connected to a vapor line 4乂 connecting the condensation 323562 30 201237339 . n 2 and the first-plane evaporator 1x. In addition, the liquid return line 7 connected to the liquid storage tank 3 is divided into two tubes which are respectively connected to the first- and second-plane evaporators ιχ*1γ. More specifically, the liquid return line 7Υ connected to the second planar evaporator 1Υ is connected to the liquid return line 7χ connecting the liquid reservoir 3 and the first planar evaporator. Further, the liquid supply line 6 connected to the liquid storage tank 3 is divided into two tubes which are connected to the first and second plane evaporators ^ and 1γ, respectively. More specifically, the liquid supply line 6γ connected to the second planar evaporator 1γ is connected to the liquid supply line 6Χ connecting the liquid storage tank 3 and the first planar evaporator ι via the liquid transfer pump 8. Therefore, the first planar evaporator 1x and the second planar evaporator 1γ are connected in parallel to each other. In other words, the liquid supply line 6γ, the second planar evaporator 1Υ and the vapor line 4Υ define a route connected in parallel to the liquid reservoir 3, the liquid supply official line 6Χ, the first planar evaporator lx, the vapor line 4χ, the condensation stolen 2 and the route defined by the liquid line 5. Further, the liquid storage tank 3, the liquid supply line 6Χ, the first plane evaporator ι* liquid return line 7乂 defined route is connected in parallel to the liquid supply line 6γ, the second planar evaporator 1Υ, and the liquid return line 7Υ route. Note that the above configuration is not limited thereto, and the first planar evaporator IX and the first planar evaporator 1A may be connected in series. More specifically, the liquid return line 7X connected to the outlet of the liquid passage u in the first plane evaporator IX may be connected to the inlet of the liquid passage n in the second plane evaporator ιγ instead of the liquid supply line βγ The liquid return line VIII to the outlet of the liquid passage 11 in the second planar evaporator 1Υ can be connected to 323562 31 201237339 • Liquid reservoir 3 instead of the liquid return line 7X. In this case, the vapor line 4 (4X and 4Y) connected to the condenser 2 is connected to the first and second planar evaporators 1X and 1Y, respectively. Further, the liquid supply line 6 (6X) connected to the liquid storage tank 3 via the liquid transfer pump 8 is connected to the inlet of the liquid passage 11 in the first planar evaporator IX. Further, the liquid supply line 6 (6Y) connected to the inlet of the liquid passage 11 in the second planar evaporator 1Y is connected to the outlet of the liquid passage 11 in the first planar evaporator IX. Further, a liquid return line 7 (7Y) connected to the outlet of the liquid passage 11 in the second planar evaporator 1Y is connected to the liquid reservoir 3. Thereby, after the liquid storage tank 3 is supplied to the first planar evaporator 1x through the liquid supply line 6Χ, the liquid phase working fluid is supplied to the second planar evaporator 1Υ through the liquid return line 7Χ, and passes through the liquid return line. 7 Υ Return to the liquid reservoir 3. The liquid transporting fruit 8' uses, for example, an electromagnetic piston type miniature chestnut (type PPLP-03060-001 of sh i nano Kenshi Co., Ltd., see Fig. 3). Here, using ethanol as a working fluid, for example, an amount of heat of about 671 J per 1 ml can be delivered because ethanol has a latent heat of vaporization of about 855 kJ/kg and a density of about 785 kg/m3. Assuming that about 200 watts (= 200 J/s) of heat is transferred from the planar heat generating component 24 to the first and second planar evaporators lx and 1 , a flow rate of about 0.3 ml/sec or more is required. Therefore, the amount of liquid flowing through the liquid delivery pump 8 is adjusted to 0.333 ml/sec (= 20 ml/min. Note that the liquid delivery pump 8 can be a piezoelectrically driven diaphragm pump or a centrifugal turbo pump. Please note that 'other specifics The configuration, such as the size 'is similar to the case of the flat evaporator 丨 shown in Figures 7 and 8 of 323562 32 201237339 • In addition, although part of the liquid return line 7 is provided to include the condenser • 2 and blowing In the condensing device of the air fan (cooling unit, cooling mode), the active heat radiation for cooling in Fig. 11 is provided, and the configuration similar to the above embodiment (see Fig. 1) can be used without being limited thereto. The printing circuit board 23 on which the operation electronic component 21 is mounted (having a total heat generation amount of about 200 watts) is actually cooled using the cooling device 22, and the temperature of the electronic component 21 is measured. As a result, all the electronic components 21 remain. A temperature of about 8 ° C or lower, thus providing satisfactory cooling. It has also been confirmed that the heat generated by the printed circuit board 23 including the electronic component 21 is maintained at up to about 200 W 'evaporator lx and 1 The core 12 is not dried, and the abnormal high temperature of the electronic member 70 is prevented, providing stable heat dissipation performance. In particular, since the first and second planar evaporators IX and 1 as described above can be reduced even more than the above-described embodiments. Height (thickness), the first and second planar evaporators lx and can be provided above the top and bottom of the heat generating component 24. Therefore, a heat generating component that generates a large amount of heat (for example, a high-density sealed 3d stacked package) 24 can be effectively cooled. For example, as shown in Figs. 12A and 12B, the 3D stacked package 3A is a three-dimensional stacked package (LSI package) including a plurality of semiconductor chips 31 and 31X (LSI chips) three-dimensionally stacked. As shown in Fig. 12a, even if the planar evaporator 1 of the above-described embodiment is provided on the stacking package 30, it is then mounted on the printed circuit board (circuit board) 23 on the bottom side (i.e., the printed circuit board 23). The sufficient heat generated by the semiconductor chip 31X on the side is difficult. To solve this problem, as shown in Fig. 12B, the fine on the back side of the printed circuit board 23 is provided by 33 323562 201237339. The planar evaporator IX, and the second planar evaporator 1Y on the front side of the three-D stacked package 30, including the heat generated by the semiconductor chips 31 and 31X of the three-D stacked package 30, can be efficiently radiated. In this case, as described above, by using the thinner first and second planar evaporators IX and 1Y, the heat generated by the semiconductor chips 31 and 31X included in the three-D stacked package 30 is compared with the structure shown in Fig. 12A. The radiation can be radiated more efficiently without increasing the height of the package. Although the steam passage 10 and the liquid passage 11 in the evaporator 1 extend in mutually perpendicular directions in the above embodiment, it is not limited thereto. For example, as shown in Fig. 13, the steam passage 10 and the liquid passage 11 in the evaporator 1 may be provided to extend in the same direction. The above-described embodiments are intended to illustrate the principles of the invention and its advantages, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the configuration of a cooling device according to the present embodiment; Fig. 2 is a schematic cross-sectional view showing the operation and effect of the cooling device according to the present embodiment; A perspective view of a configuration of a liquid storage tank and a liquid transfer pump provided by the cooling device of the embodiment; FIG. 4 is a specific configuration of the evaporator provided by the cooling device according to the embodiment and a specific configuration of the electronic device including the cooling device A perspective view of the configuration 34 323562 201237339 - Intent; FIG. 5 is a perspective schematic view of a specific configuration of the evaporator provided by the cooling device according to the embodiment; FIG. 6 is a different configuration of the cooling device according to the embodiment For the sake of fluoroscopy, FIG. 7 is a perspective view of a specific configuration of the evaporator provided by the cooling device according to the present embodiment and a specific configuration of the electronic device including the cooling device, and FIG. 8 is a cooling according to the present embodiment. A schematic perspective view of different specific configurations of the evaporator provided by the device; FIG. 9 is a schematic diagram of the cooling device provided according to the embodiment FIG. 10 is a schematic perspective view showing another different configuration of the evaporator provided by the cooling device according to the embodiment and a specific configuration of the electronic device including the cooling device; FIG. 11 is a perspective view of a specific configuration of the evaporator provided by the cooling device according to the embodiment; A schematic diagram of a configuration in which the cooling device according to the present embodiment uses another different specific configuration of the evaporator; FIGS. 12A and 12B are different specific configurations including the evaporator provided in the cooling device according to the present embodiment. A cross-sectional view showing the effect of the electronic device; Fig. 13 is a perspective schematic view showing different specific configurations of the evaporator provided in the cooling device according to the present embodiment; Fig. 14 is a horizontal view of the evaporator provided in the conventional cooling device Schematic diagram of the section. 35 323562 201237339 - [Main component symbol description] 1 evaporator 2 condenser 3 liquid reservoir 3A first inlet 3B second inlet 3C outlet 3X, 3Y, 3Z wall 4 vapor line 5 liquid line 6 liquid supply line 7 liquid Return line 8 Liquid delivery unit 8A Intake opening 8B Discharge opening 9 Heat generating component 10 Steam channel 11 Liquid channel 12 Porous body 12A Planar portion 12AX Perforated plate 12B Projection portion 12C Multi-pass hole 12CX Groove 13 Housing 13A Liquid inlet 13B Liquid outlet 13C Steam outlet 14 Hole 15 Channel 20 Electronics 21 Electronic component 22 Cooling device 23 Printed circuit board 24 Heated component 25 Liquid inlet side manifold 26 Liquid outlet side manifold 30 Stacked package 31 Semiconductor chip 100 Heated component 101 Housing 102 Core 103 Hole 104 liquid line 105 channel 106 vapor line 36 323562

Claims (1)

201237339 - 7. Patent application scope: i. A cooling device comprising: 'evaporator' comprising a porous body and a vapor passage and a liquid passage separated by the porous body, a working fluid for evaporating the liquid phase; a working fluid for condensing a vapor phase; a liquid storage tank 'a working fluid for storing the liquid phase; a vapor line 'connecting an outlet of the steam passage in the evaporator and an inlet of the condenser; a liquid line connecting the An outlet of the condenser and a first inlet of the liquid storage tank; a liquid supply line connecting an outlet of the liquid storage tank and an inlet of the liquid passage in the evaporator; a liquid return line 'connecting to the evaporator An outlet of the liquid passage and a second inlet of the liquid reservoir; and a liquid delivery unit 'plugged into the liquid supply line. 2. The cooling device according to claim 1, wherein the porous body is a porous body formed of a resin. 3. The cooling device of claim 1 or 2, wherein the liquid return line comprises a heat sink. 4. The cooling device of claim 1 or 2, further comprising a condensing device comprising the condenser and a cooling unit, wherein a portion of the liquid return line is disposed within the condensing device. The cooling device of claim 1 or 2, wherein the second inlet of the liquid reservoir is disposed further from the first inlet than the outlet of the liquid reservoir 323562 1 201237339. 6. The cooling device of claim 1 or 2, wherein the vapor passage and the liquid passage extend orthogonally to each other. 7. The cooling device according to claim 1 or 2, wherein the steam passage comprises a first steam passage disposed above a top surface of the porous body and a second steam passage disposed above a bottom surface of the porous body And the liquid passage is provided in a liquid passage in the porous body. 8. The cooling device according to claim 1 or 2, wherein the steam passage is a steam passage provided above one of a top and a bottom surface of the porous body, the liquid passage being provided in the porous body The liquid passage above the other of the top and bottom surfaces ♦. 9. The cooling device according to claim 1 or 2, wherein the porous body has an average pore diameter of 10 μm or less. 10. An electronic device comprising: an electronic component 'located above a circuit board; a cold device for cooling the electronic component, the cooling device comprising: an evaporator comprising a porous body and a vapor passage separated by the porous body And a liquid passage, a steamed Wei phase fluid; a condenser, a working fluid for condensing the vapor phase; a liquid storage tank, a reserve fluid for storing the liquid phase; a vapor line connecting the steam in the evaporator An outlet of the passage and an inlet of the condenser; a liquid line 'connecting the outlet of the condensation II and the liquid storage tank 323562 2 201237339 liquid supply official line 'connecting the outlet of the liquid storage tank and the liquid in the evaporator An inlet of the passage; ...x a liquid return line 'connecting the outlet of the liquid passage in the evaporation|| and a second inlet of the liquid storage tank; and a liquid delivery unit interposed in the liquid supply line, wherein the electron The component is thermally connected to the evaporator. 11. The electronic device of claim 10, wherein the porous body is a porous body formed of a resin. 12. The electronic device of claim 1, wherein the liquid return line comprises a heat sink. 13. The electronic device of claim 10, wherein the condensing device comprises a condenser and a cooling unit, wherein a portion of the liquid returning to the official line is disposed within the condensing device. The electronic device of claim 10, wherein the first inlet of the liquid reservoir is disposed further from the first inlet than the outlet of the liquid reservoir. 15. The electronic device of claim 10, wherein the vapor channel comprises a first vapor channel disposed above a top surface of the porous body and a second vapor channel disposed above a bottom surface of the porous body, And the liquid passage is provided in a liquid passage in the porous body. The electronic device of claim 15, wherein the electronic component comprises a first electronic component thermally coupled to a top surface of the evaporator and a second electronic component thermally coupled to a bottom surface of the evaporator. 17. The electronic device according to claim 10 or 11, wherein the 323562 3 201237339: the money to do the new body! Above the bottom surface of the porous body, the top of the porous body is placed above the other. 18. The electronic 19p piece as described in claim 17 of the patent scope is thermally connected to the evaporator. The electronic device evaporator according to the scope of claim 1 or u includes: first evaporation And a top surface and a bottom surface of the outer hole body above the one of the first top and the bottom surface, and the porous body, the first steam passage disposed on the first porous body and disposed above the first one a first liquid passage; the first evaporator includes a second porous body, a second steam passage disposed above the top and bottom surfaces of the second porous body, and a top and a bottom surface of the first porous body a second liquid passage on the other, wherein a surface of the vapor channel in which the steam passage is provided is thermally connected to the surface of the electronic component (4), and the surface heat of the steam passage is provided during the second evaporation Connected to the front surface of the electronic component. The electronic device according to claim 10, wherein the porous body has an average pore diameter of 10 μm or less. 4 323562