201107384 六、發明說明： 【發明所屬之技術領域】 本發明與電子機器所用之基板材_、 應用於尚頻領域之機器中所用之電子兩 '別是適合製造 之預浸體，以及覆鋼笛積層板相關。件以及電路基板 【先前技術】 目前於電子工業、 高頻領域之應用不斷增加。此種所用之頻率， 所用之印刷電路板，其必須介電^頻領域之機器中 實現:路之小型化，其必須是介電率高:::。’並且為了 玻璃纖維布底材中含之㈣板以及於 (4氣化群填充材之聚苯㈣脂 不二曰)積層板等(請參照下列專利文獻i、2)。 不由於上述積層板中使用之氟化樹脂之融點高，一船 板所用之預浸體時及形成編積層“ 之£制成形時需要實施寶C以上之高溫處理，另外，以往 之聚本曝脂對通用之有機溶劑之溶解性差，於製造預浸 體時被溶解作為清漆時，由於利用加熱之甲苯等溶解，進 而於加熱狀態下進行塗布，是故存在作業性、安全性 境性之課題。 < 另f面，亦有於通用之有機溶劑中利用可溶環氧樹 脂之掺混向介電率填充材之預浸體之技術揭示(請參照下列 專利文獻3) ’但由於樹脂本身之介電損耗角正切較氟化樹 月曰、聚苯醚樹脂尚，是故存在不足以用於低介電損耗角正 4/16 201107384 切之目的之問題。 先前技術文獻 專利文獻1 .日本特開2007_123712號公報 專利文獻2.日本特開平5_〇S7852號公報 專利文獻3.曰本特開平7_133359號公報 【發明内容】 率、低介電損耗角正 以及覆鋼羯積層板。 本發明所欲解決之技術問題 本發明之目的在於提供高介電 切'製造時之作業性卓越之預浸體， 解決課題之手段 為解決上述課題，本發明具有下述之結構。 (1)一種預浸體，其特徵在於，其係將—於1GHz之測 量頻率、室溫下之介電率為1〇以上且介電損耗角正切 0.01之高介電率樹脂組成物(B)附著於玻璃布或破璃不織布 而成，所述高介電率樹脂組成物(B)係藉由相對於1〇〇質量 伤之混合樹脂(A)，以成為250〜900質量份之方式择混平 均粒徑D50為0.7//m以上、最大粒徑為10//m以下之高 介電率無機絕緣填充材而成，所述混合樹脂(A)係藉由將末 端已進行苯乙烯改質之數量平均分子量為500〜3000之熱 硬化性聚苯鱗和苯乙烯系彈性體，以所述熱硬化性聚苯喊 和笨乙烯系彈性體之混合比按質量比為60 : 40〜80 : 20加 以捧混而成者。 (2)如（1)之預浸體，其特徵在於，相對於玻璃布或玻璃 不織布之玻璃成分和高介電率樹脂組成物(B)之總量之體積 比，所述玻璃成分為10〜35vol%，所述高介電率樹脂組成 5/16 201107384 物(B)為 90〜65ν〇1ο/0。 ⑺如所曰述⑴或(2)之覆銅_層板，其特徵在於，於 1GHz之測置頻率、室溫下之介電率為6以上，八.:备 正切低於0.01。 ，丨電相耗角 胁_私板_或者 化成電路後之印刷電路板之表面，積層細彡 以上之如所述⑴乃至(3)中任—項之預浸體 ^ 發明之效果 本發明之預浸體及覆銅羯積層才反，餘 特定之組成，是故介f率高、介電㈣^、#如上所24 . ^ kiL %禎耗角正切低，並於製 k日守在作業性、安全性、環境性方面亦有利。 【實施方式】 以下對本發明進一步詳細進行說明。 於本發明中’附著於玻璃布或玻璃不織布之上述高介 電率樹脂組成物⑻之樹脂成分係由一混合樹脂⑷組成，所 述混合樹脂(A)係藉由掺混將末端進行笨乙狀質之數量 平均分子量為，〜3_讀硬紐聚笨和苯乙稀系彈 性體而獲得，混合比按質量比為⑼：4G〜8() : 2q。將末端 進行苯乙稀改質之數量平均分子量漏〜3_之執硬化性 聚苯越，其於f溫下可溶於彻之有機溶劑，可提高製造 時之作業性、安全性、環境性。 〜上述苯乙烯緖性體可舉與上賴硬化性聚苯越之相 生強、介電特性卓越之苯乙烯丁二烯彈性體(SBR)、笨乙 烯彈性體(SBS)、了苯雜郎EBS)及其改質體。 於上述混合樹脂(A)中，上述熱硬化性聚苯醚和上述苯 6/16 201107384 乙婦系彈性體之混合比，須按質量比以6〇: 4〇〜u捧 混(設上述熱硬化性聚苯趟和上述苯乙稀系彈性體之合計^ 100。）。如果上述苯乙烯系彈性體之質量比低於2〇:則樹 脂組成物之流動性過高，於製備積層板之壓制成形時樹脂 易於從積層板端料m發生板厚偏絲圍大之問 題。另外，如果上述苯乙稀系彈性體之質量比超過4〇，則 樹脂組成物之流動性過低，從而產生空泡及空隙。 、、另外’於上述混合樹脂⑷中，上述熱硬化性聚料、 上述苯乙烯系彈性體之每一個亦可混合兩種以上使用。 。於本發明中，與混合樹脂⑷相掺混而構成高介電率樹 脂組成物(B)之高介電率無機絕緣填充材，可舉二氧化鈦、 鈦酸鋇 '鈦酸勰、鈦酸鈣、鈦酸鉛，此等可單獨或者兩種 以上混合使用。 上述高介電率無機絕緣填充材之平均粒徑D5〇必須 0.7以上。如果平均粒徑低於0.7/m，由於樹脂組成 物之搖變性增大導致樹脂流祕τ降，當於電路上進行積 層時將導致電路間之樹脂填充性低於。 ^另外，於本發明中，上述高介電率無機絕緣填充材之 最大粒徑必縣以下。t將高介電率樹脂組成物用 做電容器時，為了於-定面積之2層電路間增加容量就必 須俾絕緣層減薄，但是應俾絕緣層之厚度達到高介電率無 機絕緣填充材之最大粒徑以上，以免高介電率無機絕緣填 充材於2。層電路間發生上下穿透。如果高介電率無機絕緣 填充材之最大粒徑超過l〇#m，則絕緣層之厚度太大，當 用做電容器時可能導致容量低於。 於掺混後，對於1〇〇質量份之所述混合樹脂(A)，上述 7/16 201107384 向介電率無機絕緣填充材必須達到250〜900質量份。如果 南介電率無機絕緣填充材之含量超過9〇〇質量份則樹脂組 成物發生成形困難，如低於250質量份則介電率低，從而 失去南介電率無機填充材之掺混效果。 於本發明中，附著於玻璃布或玻璃不織布之高介電率 树知組成物(B)由於具有如上所述之結構，是故其硬化物之 測1頻率為1GHz之室溫下、介電率可達以上，介電損 耗角正切可低於小於0.01，並且成形積層板時可不產生空 泡及空隙。另外’還可提高製造時之作業性、安全性、 境性。 本發明之預浸體，例如可藉由將組成混合樹脂(A)之上 述熱硬化性聚苯醚和上述苯乙烯系彈性體溶解於溶劑中作 為溶液，於該溶液中添加高介電率無機絕緣填充材並俾其 分散後附著於玻璃布或玻璃不織布，將溶劑乾燥成B_st峨 狀來製造，從而可形成附著有於混合樹脂(A)中分散高介電 率無機絕緣填充材之高介電率樹脂組成物(B)之預浸體。另 外，將向介電率樹脂組成物(B)附著於玻璃布或玻璃不織布 之方法可舉出將上述之高介電率樹脂組成物(B)已溶解、分 散之溶液含浸、吹附、塗布於玻璃布或玻璃不織布等之方 法，其令含浸之方法於生產效率方面卓越。 上述向介電率樹脂組成物(B)中，亦可於不阻礙本發明 作用之範圍内添加阻燃劑、樹脂改質材等之添加劑。 本發明之預浸體，相對於玻璃布或玻璃不織布之玻璃 成分和高介電率樹脂組成物(B)之總量之體積比，所述玻璃 成分為10〜35vo〗％，所述高介電率樹脂組成物(B)為9〇〜 65v〇〗％為較佳者。如果上述玻璃成分低於則樹脂成 8/16 201107384 分過多，將降低玻填布或玻璃不織 璃成分超過35vd%，咖紐之介電率低，i實用如果玻 腿!^^41紅肖度，倾體之於測量頻率 1GHz之至μ下之介電率為6以上 以下為較佳者。於預浸體中，如料丨^耗^切為請 與玻璃布或玻料物目組合成物⑻ 將導致介料τ降，而職體之成之硬化 切可用上述高介電率樹脂組成_，利用玻璃布 織布與南介鲜難組成物⑻之體積比進行調節。 於印刷電路板用銅羯或者形成線路後 表面，可藉由制成形！ Η ㈣板之 以獲得覆銅落，上本發明之預浸體 又^__板。亦即’本發明之覆銅_層板中， 贩體亦可作為2層以上之μ體使用。 財發财，上述覆㈣積層板，於㈣礙本發明作 圍内亦可具有其他層。另外，上述_或者印刷電 路板亦可开Μ於職贼其積層體之單面或者雙面。 „以下藉由λ喊對本發明進行具體綱，但本發明並 非受限於此等實施例。 [實施例1] 將末女而進仃苯乙嫦改質之數量平均分子量U⑻之熱硬 化以苯越70質量份和丁苯乙埽丁稀彈性體(SEBS: tuftechh)4i ’旭化成化學(股)製造)3〇質量份作為混合樹 脂成分’並將其溶解於室溫之甲苯作為樹脂固體濃度乃 重里/〇之/合液，其後’對於1〇〇質量份之混合樹脂⑷成分 添加400質量份之平均粒徑〇5〇為〇 9_之鈦酸錄粉末， 將其作為高介電率無舰緣填充材；攪拌至完全分散為止 9/16 201107384 從而製備出包含尚介電率樹脂組成物(B)之清漆。將該清漆 含浸於玻璃布（#2116,日東紡績(股)製造）中，俾相對於玻 璃布之玻璃成分和高介電率樹脂組成物(B)之總量，按體積 比計算高介電率樹脂組成物(B)達到70vol。/。，俾甲苯乾燥以 獲得預浸體。 積層3張所製備之預浸體，於溫度18〇。(：，壓力40kg/cm2 下壓制成形，獲得厚度為〇3mm之積層板。另外，於 倍之顯微鏡下觀察制板之剖面確認了積層板内部有無空 泡以評價壓制成形性。 &進而，於厚度為35从m之電解銅箱（印刷電路板用銅 v白.JTC，日礦金屬（股)製造)之銅落上積層4張上述預浸體， 於，度180°C ’壓力40kg/cm2下加熱•加壓6〇分鐘獲得覆 鋼名積層板對於從s玄覆銅箔去除積層板銅箔者(預浸體之 積層體），用RF I-V法測量其1GHz之介電率以及介電損 耗角正切。 [實施例2] 匕進行含浸，俾相對於玻璃布之玻璃成分和高介電率樹 =組成物(B)之總量，按體積比計算高介電率樹脂組成物⑼ 與到85vol/〇，除此以外與實施例1相同之條件下獲得預浸 -、及覆銅/自積層板後，與實施例丨 成形之制體之介群、介賴耗肖正切、壓H [貫施例3] 、，對於100質量份之混合樹脂⑷成分添力口 質量份之 =^徑D5G為m之鈦酸婦末，作為高介電率無機 1、’填充材’進行含浸’俾相對於玻璃布之玻璃成分和高 電率奶胃組成物(B)之總量，高介電率翻旨組成物⑻體積 10/16 201107384 i達到65V0i% ;除此以外與實施例！相同之條件下獲得預 二體以及覆銅積層板後，與實施例丨同樣確認了由預浸 肢成形之積層體之介電率、介電損耗角正切、壓制成形性。 [貫施例4] 拼將^合樹脂(A)成分變更為業已將末端進行笨乙烯改 質^數量平均分子量2200之熱硬化性聚笨醚70質量份和 丁苯乙烯丁烯彈性體(SEBS : TUFTECH1041，旭化成化學 (股)製造)30質量份；除此以外與實施例丨相同之條件下獲 得預改體以及覆銅箔積層板後，與實施例〗同樣確認了由 預浸體成狀積層體之介電率、介電損耗肖正切 形性。 [實施例5] 將混合樹脂(A)成分變更為業已將末端進行笨乙烯改 質之數量平均分子量1200之熱硬化性聚苯醚6〇質量份和 丁苯乙烯丁烯彈性體(SEBS : TUFTECH1041，旭化成化學 (股)製造)40質量份；除此以外與實施例1相同之條件下獲 得預浸體以及覆銅H積層板後，與實施例丨同樣確認了: 預浸體成形之積層體之介電率、介電損耗角正切、展制 形性。 土 比較例1 將末端進行苯乙烯改質之數量平均分子量16〇〇〇之熱 硬化性聚苯峻7G質量份和丁苯乙烯丁烯彈性體(sebs : TUFTECH1041，旭化成化學(股)製造)3〇質量份，作為混合 樹脂(A)成分，並將其溶解於8〇。〇之曱苯用做樹脂固體濃度 3—5重量％之溶液’於8(rt下含浸於玻璃布中；除此以外與 實施例1相同之條件下獲得預浸體以及覆銅箔積層板後， 11/16 201107384 與實施例1同樣確認了由預浸體成形之積層體之介電率、 介電損耗角正切、壓制成形性。 比較例2 將末端進行苯乙烯改質之數量平均分子量1200之熱石更 化性聚苯醚50質量份和丁苯乙烯丁烯彈性體(SEbs: TUFTECH1041 ’旭化成化學(股)製造)50質量份’作為混合 樹脂成分(A);除此以外與實施例1相同之條件下獲得預浸 體以及覆銅箔積層板後，與實施例1同樣確認了由預浸體 成形之積層體之介電率、介電損耗角正切、壓制成形性。 比較例3 用30質量份之丁腈彈性體(NBR:Nip〇l 1〇〇丨，曰本 ΖΕΟΝ(股）製造）以替代實施例丨之丁苯乙烯丁稀彈性體 (SEBS : TUFTECH104卜旭化成化學(股)製造）；除此以外 與實施例1相同之條件下獲得預浸體以及覆銅羯積層板 後，與實施例1同樣確認了由預浸體成形之積層體之介電 率、介電損耗角正切、壓制成形性。 比較例4 對於100質1份之混合樹脂(A)成分添加95〇質量份之 平均粒徑D50為0.9/zm之鈦酸勰粉末，作為高介電率無機 絕緣填充材；除此以外與實施例1相同，試圖獲得樹脂薄 膜以及樹脂覆銅箔，但無法成形。 比較例5 對於100質量份之混合樹脂(A)成分添加4〇〇質量份之 平均粒徑D50為0.3 // m之鈦酸锶，作為高介電率無機絕緣 填充材；除此以外與實施例1相同之條件下獲得預浸體以 及覆銅箔積層板後，與實施例1同樣確認了由預浸2成形 12/16 201107384 之積1體之介電率、介電損耗角正切、壓制成形性。 比較例6 均粒之混合，)成分2〇〇質量份添加平 緣填充材；除此^卜末’作為高介電率無機絕 以及覆銅_層板後，、目同之條件下獲得預浸體 形之積層體之介電率、；:::1冋樣確認了由預浸體成 声 貝耗角正切、壓制成形性。 積層體之介電^种確認了 _體成形之 貝耗角正切、壓制成形性之結果。 13/16 201107384 [表i] 倾例 交例 1 2 3 4 5 1 2 3 4 5 6 配 合 比 率 質 量 份 P P E 樹 脂 A 70 70 70 — 60 — 50 70 70 70 70 B 70 C 70 彈 性 體 A 30 30 30 30 40 30 50 — 30 30 30 B 30 無 機 填 充 材 A 400 400 300 400 400 400 400 400 950 — 200 B 400 — 樹腊喊物 之室溫下之 甲笨溶解[± 〇 〇 〇 〇 〇 X 〇 〇 〇 〇 〇 樹脂乡赋物 级積比率 (vol%) 70 85 65 70 70 70 70 70 70 70 70 壓制祕[± (有無空泡） 無 無 無 無 無 無 有 無 無 法 成 形 有 無 介電率 11.6 13.6 85 11.7 11.5 12.4 115 14.6 13.4 5.8 介電損耗角 正切 0.004 0.004 0.005 0.004 0.005 0.006 0.004 0.052 0.005 0.006 混合樹脂成分 PPE樹脂：將末端進行苯乙烯改質之熱硬化性聚苯醚 A :數量平均分子量 1200 B:數量平均分子量 2200 C:數量平均分子量 16000 彈性體201107384 VI. Description of the Invention: [Technical Field] The invention relates to a base plate used in an electronic machine, and an electronic device used in a machine for use in a frequency domain, which is a prepreg suitable for manufacturing, and a steel whistle The laminate is related. Pieces and circuit boards [Prior Art] At present, applications in the electronics industry and high frequency fields are increasing. The frequency used for this kind, the printed circuit board used, must be realized in a machine in the field of dielectric frequency: the miniaturization of the road, which must be high dielectric constant:::. In addition, it is a (4) plate which is contained in a glass fiber cloth substrate, and a polyphenylene (4) resin laminated plate of (4 gasification group filler) (refer to the following patent documents i and 2). It is not necessary to carry out the high temperature treatment of the above-mentioned prepreg used for the ship plate and the formation of the braided layer when the fluorinated resin used in the above-mentioned laminated board is high, and the conventional high-temperature treatment is required. The fat is poorly soluble in a common organic solvent, and when it is dissolved as a varnish in the production of a prepreg, it is dissolved in toluene or the like and then coated in a heated state, so that workability and safety are present. In addition, the technique of using a blend of a soluble epoxy resin into a prepreg of a dielectric filler in a general-purpose organic solvent is disclosed (refer to the following Patent Document 3). The dielectric loss tangent of itself is higher than that of fluorinated tree sorghum and polyphenylene ether resin, so there is a problem that it is insufficient for the purpose of low dielectric loss angle. 4 Prior Art Patent Literature 1 . Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 7-133359. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has an object to solve the above problems, and an object of the present invention is to provide a prepreg which is excellent in workability at the time of high dielectric cutting. 1) A prepreg characterized in that it is a high dielectric resin composition (B) having a dielectric constant of 1 〇 or more and a dielectric loss tangent of 0.01 at a measurement frequency of 1 GHz. Adhered to a glass cloth or a non-woven fabric, the high-dielectric-resin composition (B) is selected from the group consisting of a mixed resin (A) having a mass of 1 Å to be 250 to 900 parts by mass. A high dielectric constant inorganic insulating filler having a mixed average particle diameter D50 of 0.7//m or more and a maximum particle diameter of 10/m or less is used, and the mixed resin (A) is modified by styrene at the end. a thermosetting polystyrene scale and a styrene-based elastomer having a number average molecular weight of 500 to 3,000, and a mixing ratio of the thermosetting polystyrene and a stupid vinyl elastomer of 60:40 to 80 by mass ratio : 20 is to be mixed. (2) The prepreg according to (1) is characterized by a volume ratio of the glass component of the glass cloth or the glass non-woven fabric to the total amount of the high dielectric resin composition (B), the glass component is 10 to 35 vol%, and the high dielectric resin composition is 5/16 201107384 ( B) is 90 to 65 〇 ο 1 ο / 0. (7) The copper-clad layer of (1) or (2) is characterized in that the dielectric constant at room temperature and room temperature is 6 or more at a frequency of 1 GHz. 8. The preparation tangent is less than 0.01. The surface of the printed circuit board after the formation of the circuit or the circuit board after the formation of the circuit is as detailed as the above-mentioned (1) or (3) The effect of the invention is that the prepreg and the copper-clad enamel layer of the present invention are reversed, and the specific composition is such that the dielectric f rate is high, and the dielectric (four)^, # is as above 24. ^ kiL % 祯 tangent low It is also advantageous in terms of workability, safety and environmental performance in the day of production. [Embodiment] Hereinafter, the present invention will be described in further detail. In the present invention, the resin component of the above high dielectric resin composition (8) adhered to a glass cloth or a glass nonwoven fabric is composed of a mixed resin (4) which is subjected to stupidity by blending. The number average molecular weight of the shape is obtained by reading ~3_reading hard and styrene elastomer, and the mixing ratio is (9): 4G~8(): 2q. The number average molecular weight of the styrene modified at the end is leaked to 3~, and the hardening polyphenylene is soluble in the organic solvent at the temperature of f, which improves the workability, safety, and environmental properties at the time of manufacture. . ～ The above-mentioned styrene body can be styrene butadiene elastomer (SBR), stupid ethylene elastomer (SBS), and Benzene EBS which are superior to the above-mentioned hardening polyphenylene and have excellent dielectric properties. ) and its modified body. In the above mixed resin (A), the mixing ratio of the above thermosetting polyphenylene ether and the above-mentioned benzene 6/16 201107384 ethylene-based elastomer is required to be mixed at a mass ratio of 6 〇: 4 〇 〜 〜 The total of the curable polyphenylene hydrazine and the above styrene-based elastomer is 100.). If the mass ratio of the styrene-based elastomer is less than 2 〇: the fluidity of the resin composition is too high, and the resin tends to have a large thickness of the plate from the end plate m of the laminate when the laminate is formed. . Further, when the mass ratio of the above styrene-based elastomer exceeds 4 Å, the fluidity of the resin composition is too low, and voids and voids are generated. Further, in the above-mentioned mixed resin (4), each of the above-mentioned thermosetting polymer and the above styrene-based elastomer may be used in combination of two or more kinds. . In the present invention, the high dielectric constant inorganic insulating filler which is blended with the mixed resin (4) to form the high dielectric constant resin composition (B) may, for example, be titanium dioxide, barium titanate 'barium titanate, calcium titanate, Lead titanate, these may be used alone or in combination of two or more. The above average particle diameter D5 of the high dielectric constant inorganic insulating filler must be 0.7 or more. If the average particle diameter is less than 0.7/m, the resin flow is reduced due to an increase in the shake denaturation of the resin composition, and when the laminate is formed on the circuit, the resin filling property between the circuits is lowered. Further, in the present invention, the maximum particle diameter of the above high dielectric constant inorganic insulating filler is below the county level. When the high dielectric constant resin composition is used as a capacitor, in order to increase the capacity between the two layers of the fixed area, the insulating layer must be thinned, but the thickness of the insulating layer should be high dielectric constant inorganic insulating filler. The maximum particle size is above, so as to avoid high dielectric constant inorganic insulating filler. Upper and lower penetration occurs between layer circuits. If the maximum particle size of the high dielectric constant inorganic insulating filler exceeds l 〇 #m, the thickness of the insulating layer is too large, and when used as a capacitor, the capacity may be lower. After the blending, the above-mentioned 7/16 201107384 dielectric constant inorganic insulating filler must be 250 to 900 parts by mass for 1 part by mass of the mixed resin (A). If the content of the south dielectric constant inorganic insulating filler exceeds 9 〇〇 mass parts, the resin composition is difficult to form. If the content is less than 250 parts by mass, the dielectric constant is low, thereby losing the blending effect of the south dielectric constant inorganic filler. . In the present invention, the high dielectric constant tree composition (B) adhered to the glass cloth or the glass nonwoven fabric has the structure as described above, so that the cured product is measured at a frequency of 1 GHz at room temperature, dielectric. The rate can be above, the dielectric loss tangent can be less than less than 0.01, and no voids and voids can be formed when forming the laminate. In addition, it can improve the workability, safety and environment at the time of manufacture. In the prepreg of the present invention, for example, the thermosetting polyphenylene ether and the styrene-based elastomer constituting the mixed resin (A) are dissolved in a solvent as a solution, and a high dielectric constant inorganic substance is added to the solution. The insulating filler is dispersed and adhered to a glass cloth or a glass non-woven fabric, and the solvent is dried to a B_st shape to form a high dielectric layer in which the high dielectric constant inorganic insulating filler is adhered to the mixed resin (A). Prepreg of the electrical resin composition (B). In addition, a method of adhering the dielectric constant resin composition (B) to a glass cloth or a glass nonwoven fabric may be carried out by impregnating, blowing, and coating a solution in which the high dielectric resin composition (B) is dissolved or dispersed. In the method of glass cloth or glass non-woven fabric, the method of impregnation is excellent in production efficiency. In the above dielectric constant resin composition (B), an additive such as a flame retardant or a resin modified material may be added to the range which does not inhibit the action of the present invention. The prepreg of the present invention has a volume ratio of the glass component of the glass cloth or the glass nonwoven fabric to the total amount of the high dielectric resin composition (B), and the glass component is 10 to 35 vo%. The electroconductive resin composition (B) is preferably 9 〇 to 65 。. If the above glass composition is lower than the resin is 8/16 201107384 too much, it will reduce the glass filler or glass non-woven glass component more than 35vd%, the dielectric ratio of the coffee is low, i practical if the glass legs! ^^41红肖It is preferable that the dielectric constant of the tilting body at a measurement frequency of 1 GHz to μ is 6 or more. In the prepreg, if the material is cut, the combination with the glass cloth or the glass material (8) will cause the material τ to drop, and the hardening of the body can be made of the above high dielectric resin. _, adjusted by the volume ratio of the glass cloth woven fabric to the Nanshi fresh hard composition (8). The copper plate on the printed circuit board or the rear surface of the line can be formed by shape! Η (4) The board is used to obtain the copper coating, and the prepreg of the present invention is further __ plate. In other words, in the copper-clad laminate of the present invention, the body can be used as a two-layer or more. For the wealth and wealth, the above (4) laminates may have other layers within the scope of the invention. In addition, the above-mentioned _ or printed circuit board can also be opened on one or both sides of the laminated body of the thief. The following is a specific outline of the present invention by λ, but the present invention is not limited to the examples. [Example 1] The amount of average molecular weight U (8) modified by the final female is changed to benzophenone. 70 parts by mass and butyl styrene butadiene elastomer (SEBS: tuftechh) 4i 'made by Asahi Kasei Chemicals Co., Ltd.) 3 parts by mass as a mixed resin component' and dissolved in room temperature toluene as a resin solid concentration </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> No ship edge filler; stir until completely dispersed 9/16 201107384 to prepare a varnish containing the dielectric composition (B) of the dielectric constant. The varnish is impregnated with glass cloth (#2116, manufactured by Nitto Spin Co., Ltd.) In the meantime, the high dielectric constant resin composition (B) was calculated to be 70 vol by volume ratio with respect to the total amount of the glass composition of the glass cloth and the high dielectric resin composition (B), and the toluene was dried to obtain Prepreg. Laminated 3 prepregs prepared at a temperature of 18 〇. : Pressing and forming under a pressure of 40 kg/cm 2 to obtain a laminate having a thickness of 〇 3 mm. Further, observing the cross section of the plate under a microscope to confirm the presence or absence of voids inside the laminate to evaluate press formability. The thickness of 35 from the electrolytic copper box of m (printed circuit board with copper v white. JTC, manufactured by Nissan Metal Co., Ltd.) is covered with 4 sheets of the above prepreg, at a temperature of 180 ° C 'pressure 40 kg / Heating under cm2 and pressurization for 6 minutes to obtain a steel-clad laminate. For the removal of laminated copper foil from s-fold copper foil (the laminate of prepreg), the dielectric constant of 1 GHz is measured by RF IV method. Electric loss tangent. [Example 2] 匕 is impregnated, 俾 is compared with the glass component of the glass cloth and the high dielectric property tree = the total amount of the composition (B), and the high dielectric resin composition is calculated by volume ratio (9) After obtaining the prepreg-, and the copper-clad/self-laminated board under the same conditions as in Example 1 except for 85 vol/〇, the intercalation of the body formed by the example 、, the tangential tangent, and the pressing H [Comprehensive Example 3], for 100 parts by mass of the mixed resin (4) component, the mass of the mass portion is determined by the diameter D5G Mt. titanate, as a high dielectric constant inorganic 1, 'filler' impregnated '俾 relative to the glass component of the glass cloth and the high rate of the milk stomach composition (B), high dielectric turnover The composition (8) volume 10/16 201107384 i reached 65 V0i%; after obtaining the pre-dimer and copper-clad laminate under the same conditions as in Example!, the laminate formed by the pre-impregnation was confirmed in the same manner as in Example 丨. The dielectric constant, the dielectric loss tangent, and the press formability of the body. [Scheme 4] The composition of the resin (A) was changed to a thermosetting property in which the terminal was subjected to stupid ethylene modification and the number average molecular weight was 2,200. 70 parts by mass of polystyrene and 30 parts by mass of butadiene styrene butadiene elastomer (SEBS: TUFTECH 1041, manufactured by Asahi Kasei Chemicals Co., Ltd.); except for the same conditions as in Example 获得, pre-modified and copper-clad laminate were obtained. After the plate, the dielectric constant and the dielectric loss tangential shape of the laminate formed of the prepreg were confirmed in the same manner as in the examples. [Example 5] The mixed resin (A) component was changed to a thermosetting polyphenylene ether having a number average molecular weight of 1200 and a styrene butadiene elastomer (SEBS: TUFTECH1041). 40 parts by mass of the product obtained by Asahi Kasei Chemicals Co., Ltd., except that the prepreg and the copper-clad-H laminated plate were obtained under the same conditions as in Example 1, and the same as in Example :: The prepreg-formed laminate was confirmed. Dielectric rate, dielectric loss tangent, and shape. Soil Comparative Example 1 A thermosetting polyphenylene 7 G mass part and a butadiene styrene elastomer (sebs: TUFTECH 1041, manufactured by Asahi Kasei Chemicals Co., Ltd.) having a number average molecular weight of 16 Å modified with styrene at the end. 〇 parts by mass, as a component of the mixed resin (A), and dissolved in 8 Torr. 〇 曱 曱 benzene was used as a resin solid concentration of 3-5 wt% of the solution 'at 8 (rt) in a glass cloth; except that the prepreg and the copper-clad laminate were obtained under the same conditions as in Example 1. 11/16 201107384 The dielectric constant, dielectric loss tangent, and press formability of the laminate formed by the prepreg were confirmed in the same manner as in Example 1. Comparative Example 2 The number average molecular weight of 1200 at the end of styrene modification was 1200. 50 parts by mass of the hot limpid modified polyphenylene ether and 50 parts by mass of styrene butadiene elastomer (SEbs: manufactured by Asahi Kasei Chemicals Co., Ltd.) as the mixed resin component (A); After the prepreg and the copper-clad laminate were obtained under the same conditions, the dielectric constant, dielectric loss tangent, and press formability of the laminate formed by the prepreg were confirmed in the same manner as in Example 1. Comparative Example 3 30 parts by mass of nitrile elastomer (NBR: Nip® 1〇〇丨, manufactured by 曰本ΖΕΟΝ), in place of the butyl styrene butyl elastomer (SEBS: TUFTECH104, Asahi Kasei Chemicals Co., Ltd.) ))); otherwise the same as in the first embodiment After obtaining the prepreg and the copper-clad laminate, the dielectric constant, dielectric loss tangent, and press formability of the laminate formed by the prepreg were confirmed in the same manner as in Example 1. Comparative Example 4 For 100 mass 1 In the mixed resin (A) component, 95 parts by mass of barium titanate powder having an average particle diameter D50 of 0.9/zm was added as a high dielectric constant inorganic insulating filler; otherwise, in the same manner as in Example 1, an attempt was made to obtain a resin. The film and the resin-coated copper foil were not formed. Comparative Example 5 4 parts by mass of a barium titanate having an average particle diameter D50 of 0.3 // m was added as a high dielectric material to 100 parts by mass of the mixed resin (A) component. In the same manner as in Example 1, except that the prepreg and the copper-clad laminate were obtained under the same conditions as in Example 1, it was confirmed that the product of the prepreg 2/12 201107384 was formed in the same manner as in Example 1. Dielectric ratio, dielectric loss tangent, press formability. Comparative Example 6 Mixing of homogenous particles,) Adding a flat edge filler to the component of 2 parts by mass; After the copper_layer, the prepreg is obtained under the same conditions. The dielectric constant of the laminate and the ::::1 sample confirmed the tangential tangent and press formability of the prepreg. The dielectric type of the laminate confirmed the results of the tangential tangent and the press formability of the _ body. 13/16 201107384 [Table i] Example 1 2 3 4 5 1 2 3 4 5 6 Mixing ratio parts by mass PPE Resin A 70 70 70 — 60 — 50 70 70 70 70 B 70 C 70 Elastomer A 30 30 30 30 40 30 50 — 30 30 30 B 30 Inorganic filler A 400 400 300 400 400 400 400 400 950 — 200 B 400 — Stupid dissolved at room temperature at room temperature [± 〇〇〇〇〇X 〇 Resin township proton product ratio (vol%) 70 85 65 70 70 70 70 70 70 70 70 Repression secret [± (with or without cavitation) Nothing, no no no no no no or no formation, no dielectric ratio 11.6 13.6 85 11.7 11.5 12.4 115 14.6 13.4 5.8 Dielectric loss tangent 0.004 0.004 0.005 0.004 0.005 0.006 0.004 0.052 0.005 0.006 Mixed resin component PPE resin: Thermosetting polyphenylene ether A modified with styrene at the end: number average molecular weight 1200 B : number average molecular weight 2200 C: number average molecular weight 16000 elastomer
A： SEBS 14/16 201107384A: SEBS 14/16 201107384
B ： NBR 無機填充材(高介電率無機絕緣填充材） 0.9/z m 5 // m 0.3 β m 1 /zm A :鈦酸錄 平均粒徑D50 最大粒徑 B :鈦酸銷 平均粒徑D50 最大粒徑 產業上利用可能性 > ^發明之預浸體以及覆銅箱積層板，由於1介電率 ::I耗角正切低、成形積層板時無空泡及空隙，另 ’錢時之作業性、安全性、環境性卓越，是故可較佳 地應用於電子機ϋ所用之基板材料、特収應用於高頻領 域之機器中所狀t子料、以及f路基板之^造用途。 圖式簡單說明】 無 【主要元件符號說明 無 15/16B : NBR inorganic filler (high dielectric constant inorganic insulating filler) 0.9/zm 5 // m 0.3 β m 1 /zm A : titanate average particle diameter D50 maximum particle diameter B: titanate pin average particle diameter D50 Maximum particle size industrial utilization possibility> ^Invented prepreg and copper-clad laminate, due to 1 dielectric ratio: II low tangent, no voids and voids when forming laminates, another 'money time It is excellent in workability, safety, and environmental performance, so it can be preferably applied to substrate materials used in electronic devices, t-sub-materials for use in machines for high-frequency applications, and f-substrate use. Simple description of the schema] None [Main component symbol description None 15/16