TWI521003B - Resin composition and uses of the same - Google Patents

Description

Resin composition and its application

The present invention relates to a resin composition and a prepreg and laminate provided by the use of the composition, in particular to a suitable one for preparing a high tear strength, a high dielectric constant (Dk) and a low A resin composition of a dielectric loss laminated board.

A printed circuit board (PCB) is a circuit substrate of an electronic device that carries other electronic components and electrically connects the components to provide a stable circuit working environment. A common printed circuit board substrate is a copper clad laminate (CCL), which is mainly composed of a resin, a reinforcing material and a copper foil. Common resins such as epoxy resin, phenolic resin, polyamine formaldehyde, fluorenone and Teflon; commonly used reinforcing materials such as fiberglass cloth, fiberglass mat, insulating paper, linen and so on.

In general, a PCB can be produced by the following method. A reinforcing material such as a glass fabric is impregnated into a resin such as an epoxy resin, and the glass fabric impregnated with the resin is cured to a semi-hardened state to obtain a prepreg. A predetermined number of prepregs are laminated and a metal foil is laminated on at least one outer side of the laminated prepreg to provide a laminate, and then the laminate is subjected to a hot pressing operation to obtain a metal-clad laminate. Etching the metal foil to cover the surface of the laminate A specific circuit pattern is formed. Then, a plurality of holes are cut in the metal-clad laminate, and conductive materials are plated in the holes to form via holes to complete the preparation of the PCB.

With the miniaturization of electronic instruments, PCBs are also required for thinning and high density. Therefore, the number of passive components and active components in PCBs has also increased significantly. In this case, it is necessary to form components inside the laminated board. Functional blocks for better circuit design freedom. The demand for high density in the field of radio frequency (RF) communication is particularly obvious, because if a laminate with excellent electrical properties (high dielectric constant and low dielectric loss) can be integrated into a conventional PCB, the built-in laminate can be achieved. For the purpose of passive components, general RF modules and digital systems can be integrated on the same PCB. However, the conventional laminates prepared using epoxy resin formulations have high dielectric loss (high Df values) and dielectric constant (Dk) values are not compatible with the requirements for capacitive materials. Therefore, the industry is currently working to develop a dielectric material with excellent electrical properties (high Dk and low Df).

US 2004147658 discloses a composition suitable for embedded capacitance of a circuit board, wherein a dielectric powder having a particle diameter of 0.1 μm to 2 μm, such as BaTiO ₃ , SrTiO ₃ , is added, however, the proposed composition as a whole is still The epoxy resin system was prepared and the dielectric loss value (Df) was still high.

US 7,700,185 discloses an insulating composite material which is composed of a high dielectric constant filler and an insulating resin mainly composed of an epoxy resin, wherein the high dielectric constant filler must have a ceramic powder having a two-peak particle size distribution, and The insulating composite must pass through a dispersant to enhance the dispersion of the powder in the material. As can be seen from the results of the examples, the insulating composite material has a high dielectric constant, but its dielectric loss is still high (Df value is 0.02).

In view of the above, the present invention provides a resin composition which has a high tear strength (>5 lb/inch) and high in addition to various physicochemical properties. Excellent performance of Dk value and low Df value.

An object of the present invention is to provide a resin composition comprising: a thermosetting resin component having a dissipation factor (Df) at 1 gigahertz (GHz) 0.006; and a filler which is obtained by sintering the ceramic powder at a high temperature of 1300 ° C to less than 1400 ° C; and the content of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Another object of the present invention is to provide a prepreg which is obtained by impregnating a substrate with a resin composition as described above and drying it.

Still another object of the present invention is to provide a laminate comprising a composite layer and a metal layer, the composite layer being provided by a prepreg as described above.

The above described objects, technical features and advantages of the present invention will become more apparent from the following detailed description.

The invention will be described in detail below with reference to the specific embodiments of the present invention. The invention may be practiced in various different forms without departing from the spirit and scope of the invention. The person stated. In addition, the terms "a", "an" and "the" And unless otherwise stated herein, the ingredients contained in the solution, mixture or composition are described in this specification as the solid form contained in the ingredient. The calculation, that is, the weight of the solvent is not included.

The present invention provides a resin composition for use in the field of laminate production comprising a thermosetting resin component and a filler. The laminate obtained by the resin composition is excellent in tear strength, and has high dielectric constant (high Dk value) and low dielectric loss (low Df value), and its high dielectric constant property can provide The preferred polarization effect, while its low dielectric loss characteristics at high frequencies, is particularly suitable for use in the formation of passive components (such as capacitive components) in the field of high frequency printed circuit boards (such as the field of radio frequency).

In particular, the present invention provides a resin composition comprising a thermosetting resin component and a filler, the thermosetting resin component being Df at 1 gigahertz (GHz) 0.006, and the filler is a ceramic powder obtained by sintering at a high temperature of 1300 ° C to less than 1400 ° C. The ratio of the content of the thermosetting resin component to the filler is not particularly limited and may be matched by the needs of the user. In general, the content of the filler is from 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component, preferably from 50 parts by weight to 400 parts by weight per 100 parts by weight of the thermosetting resin component.

One of the technical features of the present invention is that the filler is a ceramic powder obtained by sintering at a high temperature of 1300 ° C to less than 1400 ° C, preferably a ceramic powder obtained by sintering at a high temperature of 1350 ° C to less than 1400 ° C. body. In addition to the above specified sintering temperature conditions, the specific ceramic powder is generally produced in a ceramic material. Since the preparation of general ceramic materials is well known to those skilled in the art, no further details are provided herein, and only relevant examples are provided in the accompanying examples. Under the specified sintering temperature conditions, the resin composition of the present invention can produce a laminate sheet having good overall physicochemical properties, especially high tear strength (>5 lbs/inch), high Dk value and low Df value. If the sintering temperature is lower than the specified range (below 1300 ° C), a laminate with a low Df value cannot be obtained; conversely, if the sintering temperature is higher than the specified range (equal to or higher than 1400 ° C), the sintered ceramic material itself will be produced. It is difficult to grind and agglomerate, and the texture of the obtained powder is too smooth, and the compatibility with other components of the resin composition is not good. Moreover, the laminated board produced also has poor tear strength, low Dk value and appearance. Bad defects. Specific examples of the ceramic powder include a ceramic powder having a lattice structure of perovskite or perovskite such as, but not limited to, titanium oxide (TiO ₂ ), barium titanate (SrTiO ₃ ), and titanic acid. Calcium (CaTiO ₃ ), barium titanate (BaTiO ₃ ), magnesium titanate (MgTiO ₃ ), a co-sinter of two or more of the foregoing, and a combination thereof. The sintered material is, for example, barium titanate (Sr(Ba)TiO ₃ ), calcium barium titanate (Sr(Ca)TiO ₃ ), or the like. Further, as is well known to those skilled in the art, the NPO ceramic powder system is doped with a ceramic powder doped with an element such as bismuth (Si), cobalt (Co), nickel (Ni), manganese (Mn), or a rare earth element. In the subsequent examples of the present invention, barium titanate (SrTiO ₃ ), barium titanate (Sr(Ba)TiO ₃ ), and barium titanate (Sr (Ca) sintered at a high temperature of 1350 ° C or 1300 ° C are used. TiO ₃ ), NPO ceramic powder, or a combination thereof as a filler for the resin composition.

Further, without being bound by theory, a filler having a too small particle size (e.g., less than 0.1 μm) cannot provide a significant Dk-improving effect, and therefore, the average particle diameter of the filler in the resin composition is preferably from 0.1 μm to 10 μm. More preferably from 2 microns to 6 microns. Moreover, the average particle size of the filler preferably has a single peak distribution which provides uniform electrical properties of the resulting product.

It is known that "thermosetting resin" refers to a polymer which can form a network structure after being heated and gradually solidifies. In the resin composition of the present invention, the thermosetting resin component may be provided by a single thermosetting resin or may be provided by mixing a plurality of thermosetting resins. Whether a single thermosetting resin or a mixture of multiple thermosetting resins is used, the final thermosetting resin component must conform to the Df value. Condition of 0.006.

Specifically, the thermosetting resin component in the resin composition of the present invention can be provided by using a thermosetting resin selected from the group consisting of a polyphenylene ether resin having a reactive functional group and styrene having a reactive functional group. a copolymer or oligomer, and a copolymer or oligomer of butadiene having a reactive functional group; or may be provided by any combination of the foregoing resins; or alternatively, may pass at least the above thermosetting resin One is further provided in combination with other known thermosetting resins (such as epoxy resins), but in this case, care must be taken to maintain the Df value of the resulting thermosetting resin component. 0.006. Examples of the polyphenylene ether resin having a reactive functional group include, but are not limited to, a polyphenylene ether resin having an acrylic group, a polyphenylene ether resin having a vinyl group, a polyphenylene ether resin having a hydroxyl group, and the like; benzene having a reactive functional group; Examples of ethylene copolymers or oligomers include, but are not limited to, styrene maleic anhydride (SMA) copolymers; examples of butadiene copolymers or oligomers having reactive functional groups include, but are not limited to, Polybutadiene, butadiene-styrene, etc.; examples of epoxy resins include, but are not limited to, bisphenol A type novolac epoxy resin, bisphenol F type novolac epoxy resin, brominated epoxy resin, cycloaliphatic ring Oxygen resin, naphthalene containing epoxy resin, bisylene benzene epoxy resin. Further, the "reactive functional group" referred to herein may be any group which is reactively curable, such as a hydroxyl group, a carboxyl group, an alkenyl group, an amine group, an acid anhydride group, a maleic anhydride group, etc., but Not limited to this.

The resin composition of the present invention may further contain other additives such as a hardening accelerator, a dispersing agent, a toughening agent, a flame retardant, a releasing agent and the like as needed, and these additives may be used singly or in combination. For example, a phosphorus-containing flame retardant or a bromine-containing flame retardant (such as decabromodiphenylethane) improves the flame retardancy of the material produced, but is not limited thereto. Alternatively, you can add benzoyl peroxide (BPO), imi Imidazole (MI), 2-methylimidazole (2MI), 2-ethyl-4-methylimidazole (2E4MI), 2-phenylimidazole (2- A hardening accelerator such as phenylimidazole, 2PI) to improve the hardening effect. The amount of the additive used is generally known to those skilled in the art, and may be adjusted as needed according to the general knowledge, and is not particularly limited.

The thermosetting resin component and the filler of the resin composition of the present invention can be uniformly mixed by a stirrer and dissolved or dispersed in a solvent to prepare a varnish for subsequent processing. The solvent may be any inert solvent which can dissolve or disperse the components of the resin composition of the present invention, but does not react with the components. For example, solvents which can be used to dissolve or disperse the resin composition of the present invention include, but are not limited to, methyl ethyl ketone (MEK), γ-butyrolactone, toluene, cyclohexanone, acetone, xylene, methyl iso Butyl ketone, N, N-dimethyl formamide (DMF), N, N-dimethyl acetamide (DMAc), N-methyl N-methyl-pyrolidone (NMP) and mixtures of the foregoing. The amount of the solvent to be used is not particularly limited as long as the components of the resin composition can be uniformly mixed. In the examples after the present invention, a mixture of methyl ethyl ketone and γ-butyrolactone was used as a solvent.

The present invention further provides a prepreg obtained by impregnating a surface of a substrate (reinforcing material) with the above resin composition and drying. Commonly used reinforcing materials include: glass fiber cloth (such as glass fabric, cellophane, glass mat, etc.), kraft paper, short-staple cotton paper, natural fiber cloth, organic fiber cloth, and the like. In some embodiments of the present invention, a 2116 reinforced glass fiber cloth is used as a reinforcing material, a resin composition is applied thereon, and dried by heating at 175 ° C for 2 to 15 minutes to obtain a semi-hardened state. Prepreg.

The aforementioned prepreg can be used to manufacture a laminate. Accordingly, the present invention further provides a laminate comprising a composite layer and a metal layer, the composite layer being provided by the prepreg. Wherein, for example, a plurality of layers of the prepreg may be laminated, and at least one outer surface of the synthetic layer formed by laminating the prepreg is laminated with a metal foil (such as copper foil) to provide a laminate, and the laminate is subjected to a hot pressing The laminate is obtained by operation. Further, a printed circuit board can be produced by further patterning the metal foil on the outer side of the laminate.

The invention is further illustrated by the following specific embodiments, wherein the measuring instruments and methods are as follows: [dip resistance test]: the dried laminated board is immersed in a solder bath at 288 ° C for a certain period of time. After that, it is observed whether or not an appearance abnormality occurs, for example, whether the laminated board is delaminated or expanded.

[Tear Strength Test]: Tear strength refers to the adhesion of the metal foil to the laminated prepreg, where the copper foil with a width of 1/8 inch is vertically torn from the surface of the board. The size of the force is needed to express the strength of the adhesion.

[Glass Transfer Temperature Test]: The glass transition temperature (Tg) was measured using a Differential Scanning Calorimeter (DSC). The test specification for the glass transition temperature is the IPC-TM-650.2.4.25C and 24C detection methods of The Institute for Interconnecting and Packaging Electronic Circuits (IPC).

[Flameability test]: Using the UL94V: vertical burning test method, the printed circuit board is fixed in a vertical position, and burned with a Bunsen burner, and its self-ignition extinguishing and combustion-supporting characteristics are compared.

[Dielectric Constant and Dissipation Factor Measurement]: According to ASTM D150 Fan, at a working frequency of 1 gigahertz (GHz), calculates the dielectric constant (Dk) and the dissipation factor (Df).

[Laminated board appearance test]

The appearance of the laminate was observed by a charge-coupled detector (CCD) for foreign matter, and if it was, it was judged to be defective.

[Preparation of filler]

SrTiO ₃ : The molar numbers such as SrCO ₃ and TiO ₂ are mixed and uniformly ground, and the obtained mixture is respectively at a temperature of 1250 ° C (for comparative use), 1350 ° C (for examples), and 1400 ° C (for comparison). Calcination (high temperature sintering) was carried out for 2 hours, and the obtained product was cooled to room temperature, and subjected to coarse grinding and sanding to obtain a SrTiO ₃ filler having an average particle diameter of less than 10 μm.

Sr(Ba)TiO ₃ : The molar numbers such as SrCO ₃ , TiO ₂ and BaO ₂ are mixed and uniformly ground, and the obtained mixture is respectively subjected to a temperature of 1,250 ° C (for comparative use) and 1350 ° C (for example). Calcination (high temperature sintering), the resulting product was cooled to room temperature over 2 hours, and subjected to coarse grinding and sanding to obtain a Sr(Ba)TiO ₃ filler having an average particle diameter of less than 10 μm.

Sr(Ca)TiO ₃ : The molar numbers such as SrCO ₃ , TiO ₂ and CaO ₂ are mixed and uniformly polished, and the obtained mixture is calcined at a temperature of 1250 ° C (for comparative use) and 1350 ° C (for example). (High temperature sintering), the resulting product was cooled to room temperature over 2 hours, and subjected to coarse grinding and sanding to obtain a Sr(Ca)TiO ₃ filler having an average particle diameter of less than 10 μm.

NPO Ceramic Powder: Purchased by Congchang Ceramics Co., Ltd., which is sintered at 1300 °C.

[Preparation of Resin Composition] <Example 1>

In the ratio shown in Table 1, an epoxy resin (available from Changchun Resin Co., Ltd.) and an SMA resin (available from CRAY VALLEY Co., Ltd.) as a thermosetting resin component, and an imidazole (available from Shikoku Chemical Co., Ltd.) as a catalyst were used as a resist. The fuel decabromodiphenylethane (model SAYTEX 8010, available from Albemarle), and the SrTiO ₃ (sintered at 1350 ° C) powder as a filler were mixed at room temperature for 60 minutes using a stirrer, followed by the addition of methyl ethyl ketone and Gamma-butyrolactone (all purchased from Fluka). After the resulting mixture was stirred at room temperature for 120 minutes, Resin Composition 1 was obtained.

<Example 2>

Resin composition 2 was prepared in the same manner as in Example 1, except that SrTiO ₃ (sintered at 1350 ° C) powder and NPO ceramic powder were mixed as a filler, and the amounts of epoxy resin and SMA resin were adjusted as shown in Table 1. .

<Example 3>

In the ratio shown in Table 1, an epoxy resin (available from Changchun Resin Co., Ltd.) as a thermosetting resin component and a polyphenylene ether resin (acquired from Sabic Co., Ltd.) having an acrylic group as a catalyst, benzammonium peroxide (purchased) From Fluka) mixed with imidazole, decabromodiphenylethane as a flame retardant, and Sr(Ca)TiO ₃ as a filler (sintered at 1350 ° C) for 60 minutes at room temperature using a stirrer, followed by Methyl ethyl ketone and γ-butyrolactone were added. After the resulting mixture was stirred at room temperature for 120 minutes, Resin Composition 3 was obtained.

<Example 4>

Resin composition 4 was prepared in the same manner as in Example 3 except that a mixture of an epoxy resin and a polyphenylene ether resin having a hydroxyl group (available from Sabic Co., Ltd.) was used as a thermosetting resin component, and a phosphorus-containing flame retardant SPB-100 was used. (purchased from Otsuka Chemical Co., Ltd.) as a flame retardant, and adjusted the amount of Sr(Ca)TiO ₃ powder, as shown in Table 1.

<Example 5>

In the ratio shown in Table 1, an acrylic-based polyphenylene ether resin as a thermosetting resin component, benzammonium peroxide as a catalyst, decabromodiphenylethane as a flame retardant, and SrTiO ₃ as a filler (Sintering at 1350 ° C) The powder was mixed at room temperature for 60 minutes using a stirrer, followed by the addition of methyl ethyl ketone and γ-butyrolactone. After the resulting mixture was stirred at room temperature for 120 minutes, Resin Composition 5 was obtained.

<Example 6>

A resin composition 6 was prepared in the same manner as in Example 5 except that an acrylic-based polyphenylene ether resin was mixed with an SMA resin as a thermosetting resin component, and SrTiO ₃ (sintered at 1350 ° C) powder and Sr(Ca) were used. A mixture of TiO ₃ (sintered at 1350 ° C) powder was used as a filler, and the amount of the catalyst and the flame retardant was adjusted as shown in Table 1.

<Example 7>

A resin composition 7 was prepared in the same manner as in Example 5 except that a mixture of an acrylic-based polyphenylene ether resin and a butadiene-containing resin (Ricon 100 ^® , available from CRAY VALLEY Co., Ltd.) was used as a thermosetting resin component, and The powder of Sr(Ba)TiO ₃ (sintered at 1350 ° C) was used as a filler, and the amount of the catalyst and the flame retardant was adjusted as shown in Table 1.

<Example 8>

Resin composition 8 was prepared in the same manner as in Example 7, except that SrTiO ₃ (sintered at 1350 ° C) powder was used as a filler, as shown in Table 1.

<Example 9>

A resin composition 9 was prepared in the same manner as in Example 5 except that a vinyl-containing polyphenylene ether resin (available from Sabic Co., Ltd.) was used as a thermosetting resin component, and NPO ceramic powder was used as a filler, and the amount of the catalyst was adjusted. ,As shown in Table 1.

<Comparative Example 1>

Comparative resin composition 1 was prepared in the same manner as in Example 1, except that only epoxy resin was used as the thermosetting resin component, and Sr(Ba)TiO ₃ (sintered at 1350 ° C) powder was used as the filler, as shown in Table 1. Show.

<Comparative Example 2>

Comparative resin composition 2 was prepared in the same manner as in Comparative Example 1, except that a mixture of SrTiO ₃ (sintered at 1350 ° C) powder and Sr(Ba)TiO ₃ (sintered at 1350 ° C) powder was used as a filler. 1 is shown.

<Comparative Example 3>

Comparative resin composition 3 was prepared in the same manner as in Example 1, except that SrTiO ₃ (sintered at 1250 ° C) powder was used as a filler, as shown in Table 1.

<Comparative Example 4>

Comparative resin composition 4 was prepared in the same manner as in Example 7, except that Sr(Ba)TiO ₃ (sintered at 1250 ° C) powder was used as a filler, as shown in Table 1.

<Comparative Example 5>

Comparative resin composition 5 was prepared in the same manner as in Example 4 except that Sr(Ca)TiO ₃ (sintered at 1250 ° C) powder was used as a filler, as shown in Table 1.

<Comparative Example 6>

Comparative resin composition 6 was prepared in the same manner as in Example 1, except that SrTiO ₃ (sintered at 1400 ° C) powder was used as a filler, as shown in Table 1.

[Preparation of laminates]

A laminate was prepared using Resin Compositions 1 to 9 and Comparative Resin Compositions 1 to 6, respectively. These resin compositions were respectively coated on a 2116 reinforced glass fiber cloth by a roll coater, and then placed in a dryer and dried by heating at 175 ° C for 2 to 15 minutes. A semi-cured sheet in a semi-hardened state. The four prepregs were then laminated and a 0.5 oz. copper foil was laminated on each of the outermost layers on either side. Then, it was subjected to hot pressing, whereby laminates 1 to 9 (corresponding to resin compositions 1 to 9 respectively) and comparative laminates 1 to 6 (corresponding to comparative resin compositions 1 to 6 respectively) were obtained. The hot pressing condition is: heating up to 200 ° C to 220 ° C at a heating rate of 1.0 to 3.0 ° C / min, and at this temperature, a total pressure of 15 kg / cm ^ 2 (initial pressure of 8 kg / cm ^ 2) of pressure heat Press for 180 minutes.

The dip resistance, tear strength, glass transition temperature (Tg), flame retardancy, dielectric constant (Dk), and dissipation factor (Df) of the laminates 1 to 9 and the comparative laminates 1 to 6 were measured, and the results were recorded. In Table 2.

As shown in Table 2, the laminates 1 to 9 obtained by using the resin composition of the present invention have a satisfactory degree in various physical and chemical properties (e.g., flame retardancy, Tg), and particularly good. Tear strength, high dielectric constant (Dk) and low dielectric loss (Df), fully meet the dielectric material properties required in the RF field. In particular, Comparative Examples 1 and 2 show that the laminate obtained by simply using an epoxy resin as a thermosetting resin component has a high Df value; Example 1 and Comparative Example 3, Comparative Example 6, Example 7, and Comparative Example 4, And the comparison between Example 4 and Comparative Example 5 shows that the laminate having a high Dk and a low Df value can be obtained only when the filler used meets the sintering temperature specified in the present invention, and further, Comparative Example 6 further shows If the sintering temperature exceeds the specified range of the present invention, the laminated board produced can not only meet the requirements of high Dk and low Df, but the tear strength and appearance of the laminated board will be significantly deteriorated.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are illustrative of the technical features of the present invention and are not intended to limit the scope of the present invention. Any changes or arrangements that can be easily accomplished by those skilled in the art without departing from the technical principles and spirit of the invention are within the scope of the invention. Accordingly, the scope of the invention is set forth in the appended claims.

Claims (14)

A resin composition comprising: a thermosetting resin component having a dissipation factor (Df) at 1 gigahertz (GHz) 0.006; and a filler which is obtained by sintering the ceramic powder at a high temperature of 1300 ° C to less than 1400 ° C, wherein the filler is contained in an amount of 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component. The resin composition according to claim 1, wherein the filler is a ceramic powder obtained by sintering at a high temperature of from 1,350 ° C to less than 1,400 ° C. The resin composition according to claim 1, wherein the ceramic powder system is selected from the group consisting of titanium dioxide (TiO ₂ ), barium titanate (SrTiO ₃ ), calcium titanate (CaTiO ₃ ), barium titanate (BaTiO ₃ ). ), magnesium titanate (MgTiO ₃ ), NPO ceramic powder, a co-sinter of two or more of the foregoing, and a combination thereof. The resin composition according to claim 3, wherein the ceramic powder system is selected from the group consisting of barium titanate (SrTiO ₃ ), barium titanate (Sr(Ba)TiO ₃ ), barium calcium titanate (Sr ( Ca) TiO ₃ ), NPO ceramic powder, co-sinter of two or more of the foregoing, and combinations thereof. The resin composition according to claim 1, wherein the filler is contained in an amount of from 50 parts by weight to 400 parts by weight per 100 parts by weight of the thermosetting resin component. The resin composition according to claim 1, wherein the filler has an average particle diameter (D ₅₀ ) of from 0.1 μm to 10 μm. The resin composition according to claim 1, wherein the thermosetting resin component is a package A thermosetting resin selected from the group consisting of a polyphenylene ether resin having a reactive functional group, a copolymer or oligomer of styrene having a reactive functional group, and a butadiene having a reactive functional group. Copolymer or oligomer, and any combination of the foregoing. The resin composition according to claim 7, wherein the thermosetting resin component comprises a polyphenylene ether resin having a reactive functional group and a thermosetting resin selected from the group consisting of a copolymer of styrene having a reactive functional group. Or an oligomer, a copolymer or oligomer of butadiene having a reactive functional group, and any combination of the foregoing. The resin composition according to claim 7, wherein the thermosetting resin component further comprises an epoxy resin. The resin composition of claim 7, wherein the reactive functional group is selected from the group consisting of hydroxyl, carboxyl, alkenyl, amine, anhydride groups, and maleic anhydride groups. The resin composition according to any one of claims 1 to 10, further comprising an additive selected from the group consisting of a hardening accelerator, a dispersing agent, a toughening agent, a flame retardant, a releasing agent, and the combination thereof . The resin composition according to claim 11, wherein the flame retardant is a bromine-containing flame retardant, a phosphorus-containing flame retardant, or a combination thereof; the hardening accelerator is selected from the group consisting of benzammonium peroxide ( Benzoyl peroxide, BPO), imidazole (MI), 2-methylimidazole (2MI), 2-ethyl-4-methylimidazole (2E4MI), 2- Phenyl imidazole (2PI), and combinations of the foregoing. A prepreg by impregnating a substrate as claimed in claims 1 to 12 A resin composition as described above, which is obtained by drying. A laminate comprising a composite layer and a metal layer provided by a prepreg as claimed in claim 13.