JP2002124773A - Fire-retardant electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide fire-retardant electronic part which are constituted to practically use the various features a polyvinylbenzyl ether compound originally has and, in addition, to secure high fire retardancy. SOLUTION: A multilayered substrate is constituted by laminating multiple substrates which are formed by mixing at least the polyvinylbenzyl ether compound with functional powder upon another. In the substrate, layers (substrates) 3a mixed with a fire retardant are laminated as at least the lowermost and uppermost layers. Between the layers 3a containing the fire retardant at high percentages, one or more layers 3b and 4b which contain the fire retardant at lower percentages than the layers 3a do or do not contain the fire retardant are laminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductor, a capacitor, or a composite component thereof using a multilayer substrate obtained by laminating a substrate obtained by mixing a resin and a functional powder in multiple layers, and further exhibiting an electrical function. The present invention relates to an electronic component used as a module component.

[0002]

2. Description of the Related Art Polyvinyl benzyl ether compounds are
As disclosed in JP-A-9-31006,
It has electrical characteristics suitable for use in the high frequency range, such as high Q value and low dielectric constant, and has high heat resistance, high reliability, and excellent adhesion to various materials. Application to all kinds of electronic components having a substrate, especially power amplifiers in mobile communication devices and the like is being studied.

[0003]

The polyvinyl benzyl ether compound is used as a prepreg by mixing a flame retardant to make the electronic component flame-retardant. However, the addition of the flame retardant causes the dielectric loss tangent (tan δ) (tan δ) (= Reciprocal of Q value) is deteriorated.

According to the present invention, when an electronic component constituting a multilayer substrate is formed using a polyvinyl benzyl ether compound, the above-mentioned various characteristics inherent in the polyvinyl benzyl ether compound can be utilized, and the flame retardancy can be reduced. It is an object of the present invention to provide a flame-retardant electronic component having a secure configuration.

[0005]

Means for Solving the Problems and Their Functions and Effects The flame-retardant electronic component according to claim 1 is a multilayer structure obtained by laminating a substrate formed by mixing at least a polyvinyl benzyl ether compound and a functional powder. An electronic component using a substrate, wherein at least the lowermost layer and the uppermost layer are provided with a sheet material in which a flame retardant is mixed, and the flame retardant high content layer having these flame retardants is provided between the layers. The content of the flame retardant is made lower than that of the content layer, or one or more layers containing no flame retardant are provided.

As described above, if the content of the flame retardant in at least the lowermost layer and the uppermost layer is increased, the overall flame retardancy is increased even if the content of the flame retardant in the main layer therebetween is reduced. Can be maintained. In addition, the layer of the main part between the lowermost layer and the uppermost layer has a low flame retardant content,
As a whole, the excellent performance inherent to the polyvinyl benzyl ether compound, particularly, a high Q value can be maintained, and an electronic component with less loss can be provided. Further, since the dielectric constant is low, it is possible to provide an electronic component corresponding to a high frequency.

According to a second aspect of the present invention, there is provided the electronic component having the flame retardancy according to the first aspect, wherein at least one of the dielectric powder and the magnetic powder is mixed in some or all of the layers. It is characterized by becoming.

As described above, by mixing the dielectric powder or the magnetic powder with the polyvinyl benzyl ether compound, it is possible to form a layer having an increased dielectric constant or magnetic permeability.
Desired characteristics of the built-in element can be easily obtained while keeping the thickness of the layer small, and the thickness can be reduced.

According to a third aspect of the present invention, there is provided the electronic component having the flame retardancy according to the first or second aspect, wherein the flame retardant high content layer has a flame retardant content of 30 wt% or more and 80 wt%. % Or less, and the flame retardant content of the layer between the flame retardant high content layers is less than 30 wt%.

As described above, if the content of the flame retardant in the lowermost layer and the uppermost layer is set to 30 wt% or more, the highest level of UL94-VO in the flame retardancy standard can be satisfied. When the content of the flame retardant exceeds 80 wt%, the original high Q value of the polyvinyl benzyl ether compound cannot be maintained, so that the content of the flame retardant in the lowermost layer and the uppermost layer is 80 wt%.
% Is preferable. More preferably, 30w
t% to 60 wt%. Further, by setting the content of the flame retardant in the layer between the lowermost layer and the uppermost layer to be less than 30% by weight, it is possible to maintain high electrical performance, adhesiveness and reliability inherent in the polyvinyl benzyl ether compound.

According to a fourth aspect of the present invention, there is provided the electronic component having the flame retardancy according to any one of the first to third aspects, wherein some of the layers constituting the multilayer substrate include glass cloth. The remaining layers do not contain glass cloth.

As described above, when the glass cloth is included in some layers, the mechanical strength can be increased. Further, since the glass cloth is included only in some layers, an increase in thickness due to the glass cloth can be suppressed, and a decrease in the Q value due to the addition of the glass cloth can be suppressed.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the materials constituting the electronic component of the present invention will be described. (Polyvinyl benzyl ether compound) The electronic component of the present invention contains at least a polyvinyl benzyl ether compound as a resin which is a main material of a substrate constituting each layer of the multilayer substrate.

When a laminated substrate is formed using such a polyvinyl benzyl ether compound or a composite layer in which a dielectric powder or a magnetic powder is dispersed, adhesion to a copper foil can be performed without using an adhesive or the like. Patterning can be realized, and multi-layering can be realized. Such patterning and multi-layer processing can be performed in the same process as a normal substrate manufacturing process, so that cost reduction and improvement in workability can be achieved. Also, electronic components using a multilayer substrate obtained by laminating the substrates obtained in this way,
It has high strength and improved high frequency characteristics.

The polyvinyl benzyl ether compound used in the power amplifier module of the present invention is preferably represented by the following formula 1.

[0016]

Embedded image (Wherein, R ¹ represents a methyl group or an ethyl group; R ² represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms;
³ represents a hydrogen atom or a vinylbenzyl group (provided that the molar ratio of the hydrogen atom to the vinylbenzyl group is 60:40 to
0: 100), and n represents a number of 2 to 4).

[0017]

Embedded image (Wherein, R ¹ represents a methyl group or an ethyl group, R ² represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, n
Is a number of 2 to 4), and a vinylbenzyl halide is obtained by reacting a polyphenol represented by the following formula (1) with vinylbenzyl halide in the presence of an alkali metal hydroxide. Good.

The polyvinyl benzyl ether compound of the formula (1) used in the present invention is obtained by reacting the polyphenol of the formula (2) with vinyl benzyl halide, as described in JP-A-9-31006. Can be synthesized by

As the polyphenol represented by Chemical formula 2, commercially available polyphenols can be used, and examples thereof include PP-700-300 and PP-1000-180 manufactured by Nippon Petrochemical Co., Ltd.

The substitution ratio of the hydroxyl group of the polyphenol to the vinylbenzyl group shown in Chemical formula 2 is 40 to 100 mol%, preferably 60 to 100 mol%. Of course, the higher the substitution rate, the better. This replacement rate is
It can be appropriately adjusted by the blending design of polyphenol and vinylbenzyl halide.

When the presence of polyphenol is not allowed, unreacted raw materials and the like may be removed by a blending design of polyphenol and vinylbenzyl halide and an appropriate means, for example, a reprecipitation purification method using a combination of a solvent / non-solvent system.

The polyvinyl benzyl ether compound used in the present invention can be polymerized and cured by itself or with other copolymerizable monomers to obtain good and constant over a wide frequency range, and to be dependent on temperature and hygroscopicity. It can be used as a resin that shows poor dielectric properties and also has excellent heat resistance.

Table 1 shows the properties of the polyvinyl benzyl ether compound (VB) used in the present invention and those of commercially available materials.

[0024]

[Table 1] Examples of the copolymerizable monomer include styrene, vinyl toluene, divinyl benzene, divinyl benzyl ether, allyl phenol, allyl oxybenzene, diallyl phthalate, acrylate, methacrylate, and vinylpyrrolidone. The mixing ratio of these monomers is about 2 to 50% by weight based on the polyvinyl benzyl ether compound.

The polyvinyl benzyl ether compound of the present invention may be a known thermosetting resin, for example, a vinyl ester resin, an unsaturated polyester resin, a maleimide resin, a polyphenol polycyanate resin, an epoxy resin, a phenol resin, a vinyl benzyl compound, or the like. It is also possible to use in combination with known thermoplastic resins, for example, polyetherimide, polyethersulfone, polyacetal, dicyclopentadiene resin and the like. The compounding ratio is about 5 to 90% by weight based on the polyvinyl benzyl ether compound of the present invention. Among them, preferably,
It is at least one selected from the group consisting of a vinyl ester resin, an unsaturated polyester resin, a maleimide resin, a polyphenol polycyanate resin, an epoxy resin, and a mixture thereof.

(Flame retardant) As the flame retardant used in the present invention, a vinylbenzyl ether compound of a halogenated phenol can be used. This is one in which at least one of the hydroxyl groups of the halogenated phenol compound is a vinylbenzyloxy group. The halogenated phenol compound in this case may be a halogenated monophenol having one or more phenolic hydroxyl groups or a halogenated polyphenol having two or more phenolic hydroxyl groups. Various degrees of halogenation can be used depending on the desired degree of flame retardation and the like. When two or more phenolic hydroxyl groups are present, at least 1
It is sufficient that the individual phenolic hydroxyl group is a vinylbenzyloxy group, and when the remaining phenolic hydroxyl group has a bad influence on the dielectric properties, etc., a hydrocarbon halide may be added to the reaction system, and the remaining hydroxyl group may be sealed. .

The vinyl benzyl ether compound of the halogenated phenol can be synthesized, for example, by the method described in JP-A-6-116194. Specifically, a compound having a phenolic hydroxyl group and vinylbenzyl halide in the presence of an alkali in a polar solvent,
Alternatively, it can be synthesized by a method of reacting in a water / organic solvent mixed solution in the presence of a phase transfer catalyst.

As the halogenated phenol compound, a commercially available halogenated phenol compound can be used. Brominated compounds such as pentabromophenol, tetrabromophenol, tetrabromocatechol, tetrabromobisphenol A, and brominated novolak are exemplified.

In the halogenated phenol compound used in the present invention, the higher the halogen content, the higher the effect of the obtained halogen-containing vinyl benzyl ether compound as a flame retardant. The halogen content of the halogenated phenol compound is preferably at least 20 wt%, more preferably at least 40 wt%. The upper limit is not particularly limited, but is about 85% by weight. When the halogen content is low, the flame-retardant effect of the obtained halogen-containing vinyl benzyl ether compound is low, and it is difficult to obtain the expected effect.

The compounding ratio of the vinyl benzyl ether compound of the halogenated phenol to the polyvinyl benzyl ether compound may be appropriately selected according to the flame retardancy to be obtained. Physical properties such as electrical properties are reduced.

In the present invention, together with the above-mentioned reactive flame retardant,
Additive flame retardants can be used. Additive flame retardants are broadly classified into halogenated flame retardants, phosphorus-based flame retardants, nitrogen-based flame retardants, metal salt-based flame retardants, hydrated metal-based flame retardants, and inorganic flame retardants.

The additive type flame retardant to be blended may be selected (one or more) as necessary. Among them, hydrated metal flame retardants and inorganic flame retardants are generally used in combination with the halogenated flame retardant, which act as a dehydrating agent for the resin during combustion and contribute to the formation of a carbonized film. Specific examples of these flame retardants include aluminum hydroxide, magnesium hydroxide, silica, aluminum oxide, iron oxide, titanium oxide, manganese oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, cobalt oxide, and bismuth oxide. Metal oxides, such as chromium oxide, tin oxide, antimony oxide, nickel oxide, copper oxide, tungsten oxide,
Metal powders such as aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, tin, antimony, zinc borate,
Examples include zinc metaborate, barium metaborate, zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate and the like.

The hydrated metal flame retardant and the inorganic flame retardant may be subjected to a surface treatment in order to improve dispersibility and improve the interface state with the polyvinyl benzyl ether compound.
Specifically, surface treatment with a silane compound, a titanate-based, an aluminum-based coupling agent, or the like can be given.

By using the reactive flame retardant and the additive flame retardant together, the mixing ratio of the polyvinyl benzyl ether compound in the composition of the present invention can be increased as compared with the case where the reactive flame retardant is used alone. , The level of the flame retardant effect can be kept equal.

In the present invention, various flame retardants used for making the substrate flame-retardant can be used. Specifically, halides such as halogenated phosphoric acid esters and brominated epoxy resins, organic compounds such as phosphoric acid ester amides, and inorganic materials such as antimony trioxide and aluminum hydride can be used. Of these, halogenated phosphoric acid esters and phosphoric acid ester amides are preferred, and halogenated phosphoric acid esters are particularly preferred.

(Dielectric Powder) In the present invention, a dielectric powder is mixed into a resin in order to increase the dielectric constant of the substrate. The dielectric material used here is not particularly limited, but preferably has a relative magnetic permeability (ε _r ) of 10 or more, more preferably 20 or more, and a dielectric loss tangent of 0.01 or less. Things are good. Considering the kneadability with the resin and the like, the average particle diameter of the dielectric powder is preferably about 0.2 to 10 μm. If the particle diameter is small, kneading with the resin becomes difficult. In addition, when the particle size is large, the powder becomes non-uniform and cannot be uniformly dispersed, and a dense molded body cannot be obtained when molding a composition having a large powder content.

The content of the dielectric powder is 10 to 65 v when the total amount of the polyvinyl benzyl ether compound and the flame retardant is 100 vol% when tetrabromobisphenol A-modified vinylbenzyl resin is used as the flame retardant.
ol%. Here, since the content rate of the dielectric powder is set to 65 vol% or less, 65 vol
%, It is difficult to disperse in a polyvinyl benzyl ether compound, and it is also difficult to apply to a substrate such as a glass cloth at the time of preparing a prepreg. When the content is less than 5 vol%, the dielectric powder whose addition does not effectively control the dielectric constant includes, for example, titanium-barium-neodymium-based ceramics, titanium-barium-tin-based ceramics, lead-calcium-based ceramics, and titanium dioxide-based ceramics. And barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics, calcium titanate ceramics, bismuth titanate ceramics, magnesium titanate ceramics, and the like. Furthermore, CaW
O ₄ ceramics, Ba (Mg, Nb) O ₃ ceramics, Ba (Mg, Ta) O ₃ ceramics, Ba
_{(Co, Mg, Nb) O} 3 based ceramics, Ba (C
o, Mg, Ta) _{O 3} based ceramics, and the like.
These may be used alone or in combination of two or more. Also,
A spherical metal particle whose periphery is covered with a dielectric layer can be used.

(Magnetic Powder) In the electronic component of the present invention, a magnetic powder may be included in the resin constituting the substrate in order to increase the inductance value of the built-in inductor. As the magnetic material powder, a material obtained by covering ferrite or metal magnetic material powder or metal magnetic material particles with an insulating layer is used.

The average particle diameter of the magnetic powder is preferably about 0.2 to 10 μm in consideration of the kneadability with the resin.
If the particle size is small, kneading with the resin becomes difficult. In addition, when the particle size is large, the powder becomes non-uniform and cannot be uniformly dispersed, and a dense molded body cannot be obtained when molding a composition having a large powder content. The content of the magnetic powder is set in the same range as that of the dielectric powder.

(Glass Cloth) The reinforcing fibers such as glass cloth used in the present invention may be of various types depending on the purpose and application, and commercially available products can be used as they are. At this time, the reinforcing fiber is made of E glass cloth (ε = 7, tan δ = 0.003, 1GH) according to the electrical characteristics.
z), D glass cloth (ε = 4, tan δ = 0.001)
3, 1 GHz), H glass cloth (ε = 11, tanδ =
0.003, 1 GHz) or the like. Also,
Coupling treatment or the like may be performed to improve interlayer adhesion. Its thickness is 100 μm or less, especially 20-60 μm.
m is preferred. The cloth weight is 120g / m
² or less, particularly preferably ²⁰ to 70 g / m ² .

(Metal Foil) As the metal foil to be used, gold,
A suitable metal may be used from metals having good conductivity such as silver, copper, and aluminum. Of these, copper is particularly preferred.

As a method for producing a metal foil, various known methods such as an electrolytic method and a rolling method can be used. However, when it is desired to obtain a foil peel strength, an electrolytic foil is used. It is preferable to use a rolled foil which is less affected by the skin effect due to surface irregularities. As the thickness of the metal foil,
It is preferably from 8 to 70 µm, particularly preferably from 12 to 35 µm.

(Manufacturing process) Preparation of prepreg: In the present invention, in order to obtain a prepreg which is the basis of an electronic component, a functional powder (dielectric powder or magnetic powder) having a predetermined compounding ratio, a polyvinyl benzyl ether compound and Including a flame retardant added if necessary,
The process is performed by applying a paste kneaded in a solvent to form a slurry, followed by drying. The solvent used in this case is preferably a volatile solvent, particularly preferably the above-mentioned polar neutral solvent, and is used for the purpose of adjusting the viscosity of the paste to facilitate coating. The kneading may be performed by a known method using a ball mill, stirring, or the like. It can be formed by coating a paste on a metal foil or impregnating on a glass cloth.

The drying of the prepreg may be appropriately adjusted depending on the magnetic powder to be contained and the content of the flame retardant to be added if necessary.
It should be time. The thickness after drying is 50-300μ
m is preferred, and the film thickness may be adjusted to an optimum value according to the application and required characteristics (pattern width and accuracy, DC resistance) and the like.

The prepreg can be manufactured as follows. First, a glass cloth wound into a roll is fed into a coating tank. In the coating tank, the magnetic powder dispersed in the solvent, if necessary, the flame retardant and the polyvinyl benzyl ether compound are adjusted into a slurry, and when the glass cloth passes through the coating tank, the slurry is added to the slurry. It is immersed and coated on the glass cloth, and the gaps therein are filled.

The glass cloth that has passed through the coating tank is introduced into a drying oven via a guide roller. The resin-impregnated glass cloth introduced into the drying oven is dried at a predetermined temperature and time, and is wound around a winding roller.

Then, when cut into a predetermined size, a prepreg is obtained in which ceramic powder and, if necessary, resin containing a flame retardant are arranged on both surfaces of the glass cloth.

Adhesion of metal foil: Further, a metal foil such as a copper foil is placed on both upper and lower surfaces of the obtained prepreg, and is heated and pressed to obtain a substrate with a double-sided metal foil. In the case where no metal foil is provided, heating and pressing may be performed without disposing the metal foil. In the case where the glass cloth is not provided, a resin mixed with a flame retardant or powder is coated on a metal foil by a horizontal coating machine, or is coated on a metal foil by a doctor blade method.

Formation of pattern: The metal foil is patterned to form electrodes such as inductors, capacitors, and resonators, and prepregs containing or not containing powder are laminated in a predetermined order to heat the metal foil. Integrated by pressure. The heating and pressing conditions are preferably a temperature of 100 to 230 ° C. and a pressure of 0.98 to 7.84 MPa for 0.5 to 20 hours.

A via hole for connection between built-in conductors or connection with formation of terminal electrodes is formed in the material of the multi-layered multi-layer substrate by NC processing or the like. Copper (Cu) plating is performed on the formed via hole to form a plating film. Furthermore, patterning for a terminal electrode pattern and a ground electrode is performed on the copper foil on both surfaces. Next, specific manufacturing examples and structural examples will be described.

(Specific Example) To prepare a substrate, a polyvinyl benzyl ether compound was dissolved in a toluene solution so as to be a 55 wt% solution. To this solution, a tetrabromobisphenol A-modified vinylbenzyl resin as a flame retardant and a dielectric powder were mixed by a ball mill for 5 hours. In this case, the mixing ratio of the flame retardant was 0, 5, 10, 20, and 30 wt% based on the polyvinyl benzyl ether compound. As the dielectric powder, a titanium-barium-neodymium-based ceramic having an average particle size of 2 μm was used. The content of the dielectric powder is 4
0 vol%. If it exceeds 40% by volume, the sheet releasability deteriorates and the peel strength deteriorates.

The slurry was applied to a 30 μm glass cloth (manufactured by Asahi Schweve K.K.) using a coating machine.
For 1 hour to obtain a prepreg. The film thickness after drying was 60 μm. Next, press molding was performed using ten prepregs to obtain a substrate. The press conditions were press pressure 1.
30 minutes at 150 ° C. at 96 MPa, 30 minutes at 180 ° C., 2
Heating was sequentially performed at 00 ° C. for 30 minutes. The thickness of the obtained substrate was 0.55 mm. Similarly, a substrate containing no glass cloth was manufactured in the same manner.

The obtained substrate was cut into a test piece 127 mm long, 12.7 mm wide and 1.6 mm thick in accordance with the UL94 standard, and the flame retardancy level was measured. Table 2 shows the results.

[0054]

[Table 2]

As can be seen from these results, when the content of the flame retardant reached 30 wt%, UL94-V0 having the highest flame retardancy level was obtained. The dielectric constants ε and Q were cut out to dimensions of 100 mm length, 1.0 mm width, and 1.2 mm thickness, and the relative dielectric constant and dielectric loss tangent at 2 GHz were obtained by a perturbation method to calculate the Q value. The results are shown in FIGS. As can be seen from FIG. 1, the rate of change of the dielectric constant ε can be suppressed to 1% or less even when the amount of the flame retardant increases in both cases of the glass cloth and the glass clothless.

On the other hand, as can be seen from FIG. 2, the Q value decreases as the flame retardant increases. In addition, it can be seen that when a glass cloth is inserted, the Q value is lower than when no glass cloth is inserted. Further, the slurry of the composition was applied so as to obtain a thickness of 50 μm with respect to a copper foil (18 μm).

A power amplifier circuit of a transmission circuit in a portable telephone as shown in FIG.
And was produced by FIG. 4 shows a power amplifier module of a transmission circuit configured as a comparative example, in which 3a is a layer made of a prepreg (substrate) without glass cloth, 4a
Is a layer made of a prepreg (substrate) containing glass cloth. Reference numeral 5 denotes a copper foil pattern formed on each layer, which is formed as an electrode of an inductor or a capacitor or a wiring pattern. Reference numeral 6 denotes an on-board IC (MMIC) shown in FIG. 3, which constitutes a three-stage amplifier circuit. A part 1a of the portion where the layer 3a is laminated has a built-in inductor (L) and a capacitor (C) of the matching circuit of the circuit of FIG. 3, and the other laminated portion 1b has L and L of the bias circuit.
C is built in.

In all of the layers 3a and 4a in FIG. 4, the flame retardant addition amount (content) is 30 wt% and Q is 280.
The thickness of the glass clothless layer 3a is 50 μm, and the thickness of the glass cloth-containing layer 4a is 150 μm.

FIG. 5 shows an embodiment of the present invention. Reference numeral 3a denotes a flame retardant high-content layer disposed on the lowermost layer and the uppermost layer, and a glass clothless layer having the same thickness as the layer 3a of the comparative example. Yes, contains 30 wt% of a flame retardant, and has a Q value of 280. The glass clothless layer 3b and the glass cloth-containing layer 4b between the lowermost layer and the uppermost layer have a flame retardant addition amount (content) of 5 wt% and 0 wt%, respectively. The thickness t of the glass clothless layer 3b is 50 μm, Q = 340, and the thickness is 50 μm. The thickness t of the glass cloth-containing layer 4b is 150 μm, and Q = 290.

With such a layer configuration, the frequency is 900 MHz, the output Pout = 35 dBm, and the input Pin =
A 3.0 dBm GSM mobile phone power amplifier was constructed, and the efficiency α was determined by the following equation. However, in the following equation, Vd is the power supply voltage, and Iin is the input current.

Α = (Pout−Pin) / (Vd · Iin) The efficiency α and the loss obtained by the above equations are shown in FIG.
As shown in (A) and (B), it depends on the Q value of the substrate.
In the case of the configuration of the embodiment of the present invention shown in FIG.
0%. In addition, in the case of the comparative example of FIG.
8.2%, and according to the present invention, the efficiency is improved by 1.8%. As another comparative example, in the case of a commercially available substrate (Q = 100, ε = 10) using a glass epoxy resin, the efficiency is 55% as shown in FIG.
The efficiency α according to the present invention is 5% higher.

On the other hand, the basic configuration is adopted, and the frequency is 1800 MHz.
In the power amplifier for the DCS system for z, the change in the efficiency and the change in the loss with respect to the change in the Q value are shown in FIG.
The result is as shown in FIG. Also in this case, in the case of the embodiment of the present invention, α is about 55%, and the efficiency α = 50% in the case of a substrate (Q = 100, ε = 10) using a glass epoxy resin for a commercial product. Up about 5%.

As described above, if at least the lowermost layer and the uppermost layer have higher flame retardant content layers 3a, even if the flame retardant content of the other layers 3b and 4b therebetween is reduced, the overall flame retardant content is lower. Can maintain high flame retardancy. In addition, the main layers 3b and 4b between the lowermost layer and the uppermost layer 3a have a low flame retardant content, so that the overall excellent performance of the polyvinyl benzyl ether compound, especially a high Q value, is maintained. Thus, an electronic component with less loss can be provided. Further, since the dielectric constant is low, it is possible to provide an electronic component corresponding to a high frequency.

Further, as shown in the examples, by mixing the dielectric powder into the polyvinyl benzyl ether compound, the dielectric constant can be made higher than that of the polyvinyl benzyl ether compound (ε = about 2.6) depending on the purpose. An enhanced layer can be formed, and desired characteristics can be easily obtained for the built-in element while the thickness of the layer is kept small. In other electronic components, a similar reduction in thickness can be achieved by mixing the magnetic powder when forming the inductor layer.

The lowermost and uppermost flame retardant content layers 3
If a is set to a content of 30 wt% or more, the highest level of UL94-VO in the flame retardancy standard can be satisfied. Further, if the glass cloth is included in some of the layers 4b, the mechanical strength can be increased. Further, the glass cloth is included only in some of the layers, and the layers 3a and 3
Since the laminated portion b is formed as the main layer, the increase in thickness due to the glass cloth can be suppressed, and the decrease in the Q value due to the addition of the glass cloth can be suppressed.

[Brief description of the drawings]

FIG. 1 is a correlation diagram between a flame retardant content and a dielectric constant of a glass cloth-containing or glass clothless substrate.

FIG. 2 is a correlation diagram between the flame retardant content and the Q value of a glass cloth-containing or glass clothless substrate.

FIG. 3 is an equivalent circuit diagram of a power amplifier for a mobile phone to which the substrate according to the embodiment of the present invention is applied.

FIG. 4 is a diagram illustrating a layer structure of a power amplifier module of a comparative example.

FIG. 5 is a diagram showing a layer structure of an example of the present invention.

6A is a correlation diagram between the Q value of the substrate material and the efficiency in the GSM power amplifier, and FIG. 6B is a graph showing the Q value of the substrate material and the loss of the bias / matching circuit in the GSM power amplifier. It is a correlation diagram.

FIG. 7A is a correlation diagram between the Q value of the substrate material and the efficiency in the DCS power amplifier, and FIG. 7B is a graph showing the relationship between the Q value of the substrate material and the loss of the bias / matching circuit in the DCS power amplifier. It is a correlation diagram. .

[Explanation of symbols]

1a, 1b: L and C built-in layers of matching circuit, 2a, 2b: L and C built-in layers of bias circuit, 3a, 3b: Glass clothless layer, 4a, 4b: Glass cloth containing layer, 6: Mounting I
C (MMIC)

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[Procedure amendment]

[Submission date] October 12, 2001 (2001.10.
12)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

As described above, when the content of the flame retardant in the lowermost layer and the uppermost layer is set to 30 wt% or more, the highest level of UL94- V0 in the flame retardancy standard can be satisfied. When the content of the flame retardant exceeds 80 wt%, the original high Q value of the polyvinyl benzyl ether compound cannot be maintained, so that the content of the flame retardant in the lowermost layer and the uppermost layer is 80 wt%.
% Is preferable. More preferably, 30w
t% to 60 wt%. Further, by setting the content of the flame retardant in the layer between the lowermost layer and the uppermost layer to be less than 30% by weight, it is possible to maintain high electrical performance, adhesiveness and reliability inherent in the polyvinyl benzyl ether compound.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0036

[Correction method] Change

[Correction contents]

(Dielectric Powder) In the present invention, a dielectric powder is mixed into a resin in order to increase the dielectric constant of the substrate. The dielectric material used here is not particularly limited, but preferably has a relative dielectric constant (ε _r ) of 10 or more, more preferably 20 or more, and a dielectric loss tangent of 0.01 or less. Things are good. Considering the kneadability with the resin and the like, the average particle diameter of the dielectric powder is preferably about 0.2 to 10 μm. If the particle diameter is small, kneading with the resin becomes difficult. In addition, when the particle size is large, the powder becomes non-uniform and cannot be uniformly dispersed, and a dense molded body cannot be obtained when molding a composition having a large powder content.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0037

[Correction method] Change

[Correction contents]

The content of the dielectric powder is 10 to 65 v when the total amount of the polyvinyl benzyl ether compound and the flame retardant is 100 vol% when tetrabromobisphenol A-modified vinylbenzyl resin is used as the flame retardant.
ol%. Here, since the content rate of the dielectric powder is set to 65 vol% or less, 65 vol
%, It is difficult to disperse in a polyvinyl benzyl ether compound, and further, it is difficult to apply to a substrate such as a glass cloth at the time of preparing a prepreg. In addition, when the content is less than 5 vol%, the dielectric powder which does not effectively adjust the dielectric constant by addition includes, for example, titanium-barium-neodymium-based ceramics, titanium-barium-tin-based ceramics, lead-calcium-based ceramics, and titanium dioxide-based ceramics. And barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics, calcium titanate ceramics, bismuth titanate ceramics, magnesium titanate ceramics, and the like. Furthermore, CaW
O ₄ ceramics, Ba (Mg, Nb) O ₃ ceramics, Ba (Mg, Ta) O ₃ ceramics, Ba
_{(Co, Mg, Nb) O} 3 based ceramics, Ba (C
o, Mg, Ta) _{O 3} based ceramics, and the like.
These may be used alone or in combination of two or more. Also,
A spherical metal particle whose surface is covered with a dielectric layer can be used.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0045

[Correction method] Change

[Correction contents]

The prepreg can be manufactured as follows. First, a glass cloth wound into a roll is fed into a coating tank. In the coating tank , the magnetic substance powder dispersed in the solvent, the flame retardant and the polyvinyl benzyl ether compound as necessary are adjusted to a slurry state, and when the glass cloth passes through the coating tank, the slurry is added to the slurry. To be applied to the glass cloth, and the gaps therein are filled.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0051

[Correction method] Change

[Correction contents]

(Specific Example) To prepare a substrate, a polyvinyl benzyl ether compound was dissolved in a toluene solution so as to be a 55 wt% solution. To this solution, a tetrabromobisphenol A-modified vinylbenzyl resin as a flame retardant and a dielectric powder were mixed by a ball mill for 5 hours. In this case, the mixing ratio of the flame retardant was 0, 5, 10, 20, and 30 wt% based on the polyvinyl benzyl ether compound. As the dielectric powder, a titanium-barium-neodymium-based ceramic having an average particle size of 2 μm was used. The content of the dielectric powder was 40 vol%. If it exceeds 40% by volume, the sheet releasability deteriorates and the peel strength deteriorates.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0059

[Correction method] Change

[Correction contents]

FIG. 5 shows an embodiment of the present invention. Reference numeral 3a denotes a flame retardant high-content layer disposed on the lowermost layer and the uppermost layer, and a glass clothless layer having the same thickness as the layer 3a of the comparative example. Yes, contains 30 wt% of a flame retardant, and has a Q value of 280. The glass clothless layer 3b and the glass cloth-containing layer 4b between the lowermost layer and the uppermost layer have a flame retardant addition amount (content) of 5 wt% and 0 wt%, respectively. The thickness t of the glass clothless layer 3b is Ru Oh <br/> 50 [mu] m, with Q = 34 0. The thickness t of the glass cloth-containing layer 4b is 150 μm, Q
= 290.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0064

[Correction method] Change

[Correction contents]

Further, as shown in Examples, by mixing a dielectric powder into a polyvinyl benzyl ether compound, the polyvinyl benzyl ether compound
The dielectric constant (epsilon = about 2.6) than it is possible to form a layer having an increased dielectric constant, desired properties to the incorporated element while reducing the thickness of the layer is easily obtained, thereby be made thinner. In other electronic components, a similar reduction in thickness can be achieved by mixing the magnetic powder when forming the inductor layer.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0065

[Correction method] Change

[Correction contents]

The lowermost and uppermost flame retardant content layers 3
If a is set to a content of 30 wt% or more, the highest level of UL94- V0 in the flame retardancy standard can be satisfied. Further, if the glass cloth is included in some of the layers 4b, the mechanical strength can be increased. Further, the glass cloth is included only in some of the layers, and the layers 3a and 3
Since the laminated portion b is formed as a main layer, an increase in thickness due to the glass cloth can be suppressed, and a decrease in the Q value due to the addition of the glass cloth can be suppressed.

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Claims (4)

[Claims] An electronic component using a multilayer substrate obtained by laminating at least a substrate made of a polyvinyl benzyl ether compound in a multilayer, wherein a substrate mixed with a flame retardant is disposed at least in a lowermost layer and an uppermost layer. Characterized in that one or more layers having a lower flame retardant content than the flame retardant high content layer or containing no flame retardant are arranged between the flame retardant high content layers having the flame retardant. Electronic parts with flame retardancy. 2. The flame-retardant electronic component according to claim 1, wherein at least one of a dielectric powder and a magnetic powder is mixed in some or all of the layers. Having electronic components. 3. The flame-retardant electronic component according to claim 1, wherein the flame retardant high content layer has a flame retardant content of 30 wt% or more and 80 wt% or less. An electronic component having flame retardancy, characterized in that the layer between layers has a flame retardancy content of less than 30 wt%. 4. The electronic component having flame retardancy according to any one of claims 1 to 3, wherein a part of the layers constituting the multilayer substrate includes a glass cloth, and the remaining layers do not include a glass cloth. Electronic parts with flame retardancy characterized by the following.