JP2002043841A - Voltage-controlled oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a voltage-controlled oscillator which will not cause cracks or warpage characteristic of a ceramic multilayer board to cracks or warpages, during baking or deviates the positions of through-holes, and can have elements such as capacitor, inductor or resonator built in itself for miniaturization. SOLUTION: A multilayer board 1 is a laminated structure of dielectric layers 11a-11f, having at least a polyvinylbenzyl ether compound, a composite dielectric layer 14, having the polyvinylbenzy ether compound with dielectric power dispersed in this compound and a conductor. In the board 1, a resonator layer 2, an inductance layer 3 and a capacitor layer 4 are formed. Mutual connections for conductors of the contained elements and connections of the elements contained to components mounted on the multilayer board are made by side through-holes being signal terminals 16, 18-22, provided by cutting through-holes formed into conductors. Ground terminals 15a, 15b, 15d are provided between the signal terminal 16, formed by the side through-hole and a power terminal 17 or between the signal terminals 18-22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a voltage controlled oscillator, and more particularly, to a voltage controlled oscillator suitable for a local oscillator of a mobile communication device.

[0002]

2. Description of the Related Art In recent years, digital mobile communication devices such as mobile phones have become widespread, and these devices are equipped with a voltage-controlled oscillator. With the miniaturization of these mobile communication devices, miniaturization of mounted components is also required.

[0003] Originally, as a substrate constituting a voltage controlled oscillator, ceramic multilayer substrates are often used as described in JP-A-5-275925 and JP-A-10-284935, for example, because of the merit that the size can be reduced. In some cases, a glass epoxy substrate such as FR-4 is used. In order to provide a voltage-controlled oscillator that is low in cost, has good processing accuracy, and has a small variation in oscillation frequency due to humidity, Japanese Patent Application Laid-Open No. H10-173439 discloses a multilayer substrate that uses fluorine instead of glass epoxy resin. It has been proposed to use a polytetrafluoroethylene resin as a system resin.

[0004]

However, the ceramic multilayer substrate has a problem of generation of cracks and warpage during sintering. Further, since the ceramic multi-layer substrate is fired in a lump, the ceramic multilayer substrate has a problem such as misalignment of a through hole due to firing. There was a problem. Also,
The formation of through holes in the substrate between the built-in elements of the ceramic multilayer substrate hinders further miniaturization.

On the other hand, when a glass epoxy substrate is used,
Since a sufficient relative dielectric constant cannot be obtained with glass epoxy itself, as shown in the sectional view of FIG.
A resonator 34 comprising a strip line 32, a dielectric layer 31, and a ground electrode 33 is built therein. Most of the passive elements 35 such as capacitors, resistors and inductors and the semiconductor components 36 are mounted on the multilayer substrate 30 as mounting components. It is installed. In addition, the glass epoxy resin has a Q value of about 60, and the loss in a high frequency region of about GHz or more becomes large. This also makes it difficult to form an element in a glass epoxy substrate, and a large number of mounted components It is necessary to secure a mounting area, which hinders miniaturization. Further, in order to shorten the wiring, the connection to the internal conductor is often made by the through hole 37 in the substrate, which hinders miniaturization.

Further, when a fluorine-based resin is used for a multilayer substrate, there is a problem that the resin is difficult to mold.

Accordingly, the present invention is free from cracks or warpage during sintering peculiar to a ceramic multi-layer substrate and displacement during firing of through holes, and can incorporate elements such as capacitors, inductors and resonators. It is an object of the present invention to provide a voltage controlled oscillator that can be downsized. Another object of the present invention is to provide a voltage controlled oscillator that can prevent interference between signal terminals by downsizing even in a high frequency range. Also, the present invention has excellent moldability,
It is an object of the present invention to provide a voltage controlled oscillator having a multilayer substrate that can be easily manufactured.

[0008]

The voltage controlled oscillator according to claim 1 is a composite dielectric having at least a dielectric layer having a polyvinyl benzyl ether compound and a dielectric powder dispersed in the polyvinyl benzyl ether compound. It consists of a multilayer board consisting of a body layer and a laminated structure of a conductor,
A passive element is formed inside the multilayer substrate to form a built-in element, and the connection between the conductors of the built-in element and the connection between the built-in element and the mounting component on the multilayer substrate are made of a conductor of a multi-layered multi-layer substrate material. Performed by cutting through holes formed by side through holes provided, as a terminal formed by the side through holes, a ground terminal, a signal terminal and a power supply terminal,
Further, the ground terminal is provided between the signal terminals or between the signal terminal and the power supply terminal.

As described above, in the present invention, a dielectric layer made of a polyvinyl benzyl ether compound and a composite dielectric layer made of a dispersion of a polyvinyl benzyl ether compound and a dielectric powder are used as the material of the multilayer substrate. Therefore, the relative dielectric constant of the substrate material can be set in a range of about 2.5 to 30. For this reason, a passive element such as a capacitor, an inductor, and a resonator can be built in the multilayer substrate, and compared with a case where a large number of passive elements are mounted on the multilayer substrate,
The mounting area of mounted components can be small, and miniaturization can be achieved.

In addition, since a miniaturized resinous multi-layer board is used and side through holes that also serve as terminal electrodes are used for connecting the conductors of the built-in elements or for connecting the conductors to the mounted parts, the inside of the board is mounted on the component mounting surface. Since there is no need to provide a through-hole, a dead area is eliminated, and further downsizing and high-density mounting become possible.

Further, since the ground terminals are provided between the signal terminals, even if the terminal pitch becomes narrow due to the miniaturization, deterioration of the characteristics can be prevented. Further, the polyvinyl benzyl ether compound has a high Q value of about 300,
Excellent high frequency characteristics, 100MHz or more, 1G
Hz or higher.

As described above, according to the first aspect, the size can be reduced by incorporating the passive element and connecting the side element with the side through hole. In addition, a ground terminal is provided between the signal terminals to eliminate the cause of structural characteristic deterioration, and the use of a polyvinyl benzyl ether compound as the material of the multi-layer substrate makes it possible to reduce the size of the voltage-controlled oscillator that handles high frequencies. Can be provided without deterioration.

Further, when the fluorine-based resin is used for a multilayer substrate, there is a problem that multilayering is difficult. However, the polyvinyl benzyl ether compound of the present invention and its composite material have good moldability, and It can be easily multi-layered by the same process as that of the glass epoxy substrate, and can be manufactured using existing manufacturing equipment, which is extremely useful in terms of manufacturing cost.

According to a second aspect of the present invention, in the voltage controlled oscillator according to the first aspect, a glass cloth material is embedded in at least a part of the dielectric layer of the multilayer substrate.

By embedding the glass cloth material in the multi-layer substrate as described above, the mechanical strength can be improved, and the possibility of substrate damage such as cracks can be eliminated.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention provides a multilayer substrate having at least a dielectric layer containing a polyvinyl benzyl ether compound and a dielectric layer made of a composite material of a polyvinyl benzyl ether compound and a dielectric powder.

When a substrate is formed using such a polyvinyl benzyl ether compound or a composite dielectric layer in which a dielectric powder is dispersed, adhesion and patterning with a copper foil can be realized without using an adhesive or the like. And multilayering can be realized. Such patterning and multi-layer processing can be performed in the same process as a normal substrate manufacturing process, so that cost reduction and improvement in workability can be achieved. The substrate-controlled voltage oscillator thus obtained has high strength and improved high-frequency characteristics.

The polyvinyl benzyl ether compound used in the laminated electronic component of the present invention is preferably one represented by the following formula 1.

[0019]

Embedded image (Wherein, R ¹ represents a methyl group or an ethyl group; R ² represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms;
³ represents a hydrogen atom or a vinylbenzyl group (provided that the molar ratio of the hydrogen atom to the vinylbenzyl group is 60:40 to
0: 100), and n represents a number of 2 to 4).

[0020]

Embedded image (Wherein, R ¹ represents a methyl group or an ethyl group, R ² represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, n
Is a number from 2 to 4), and a vinylbenzyl halide is obtained by reacting a polyphenol represented by the formula (1) with vinylbenzyl halide in the presence of an alkali metal hydroxide. Good.

The polyvinyl benzyl ether compound of formula 1 of the present invention can be prepared by reacting the polyphenol of formula 2 with vinyl benzyl halide as described in, for example, JP-A-9-31006. Can be synthesized.

Commercially available polyphenols represented by Chemical formula 2 can be used, and examples thereof include PP-700-300 and PP-1000-180 manufactured by Nippon Petrochemical Co., Ltd.

The substitution ratio of the hydroxyl group of the polyphenol to the vinylbenzyl group shown in Chemical formula 2 is 40 to 100 mol%, preferably 60 to 100 mol%. Of course, the higher the substitution rate, the better. This replacement rate is
It can be appropriately adjusted by the blending design of polyphenol and vinylbenzyl halide.

When the presence of polyphenol is not allowed, unreacted raw materials and the like may be removed by a blending design of polyphenol and vinylbenzyl halide and an appropriate means such as a reprecipitation purification method using a combination of a solvent / non-solvent system.

The polyvinyl benzyl ether compound of the present invention is good and constant over a wide frequency range and hardly depends on temperature and moisture absorption by polymerizing and curing with itself or another copolymerizable monomer. It can be used as a resin that shows dielectric properties and has excellent heat resistance.

Examples of the copolymerizable monomer include styrene, vinyl toluene, divinyl benzene, divinyl benzyl ether, allyl phenol, allyl oxybenzene, diallyl phthalate, acrylate, methacrylate, and vinylpyrrolidone. .
The mixing ratio of these monomers is about 2 to 50% by weight based on the polyvinyl benzyl ether compound.

The polyvinyl benzyl ether compound of the present invention may be a known thermosetting resin, for example, a vinyl ester resin, an unsaturated polyester resin, a maleimide resin, a polyphenol polycyanate resin, an epoxy resin, a phenol resin, a vinyl benzyl compound, or the like. It is also possible to use in combination with known thermoplastic resins, for example, polyetherimide, polyethersulfone, polyacetal, dicyclopentadiene resin and the like. The compounding ratio is about 5 to 90% by weight based on the polyvinyl benzyl ether compound of the present invention. Among them, preferably,
It is at least one selected from the group consisting of vinyl ester resins, unsaturated polyester resins, maleimide resins, polyphenol polycyanate resins, epoxide resins, and mixtures thereof.

The voltage controlled oscillator of the present invention has at least one dielectric layer formed of the above-mentioned polyvinyl benzyl ether compound and having a relative dielectric constant of 2.5 to 3.5. Such a dielectric layer is suitable for forming an inductor element such as a coil and as a layer for preventing capacitive coupling between built-in elements, because the distributed capacitance can be reduced.

In the voltage controlled oscillator according to the present invention, the dielectric layer in which the dielectric powder is dispersed in the polyvinyl benzyl ether compound has a dielectric constant of 20 to
It is preferable that the relative dielectric constant is 10,000 and the entire dielectric constant is 5 to 30. The content of the dielectric powder is 15 to 65 vol%.
It is preferred that With such a configuration, an appropriate dielectric constant and a high Q can be obtained, and transmission loss is reduced.

In the present invention, Zn is used as the dielectric powder.
TiO ₃ [ε = 26, Q = 800], TiO ₂ [ε = 104, Q = 15000], CaTiO
₃ [ε = 170, Q = 1800], SrTiO ₃ [ε = 255, Q = 700], SrZrO
₃ [ε = 30, Q = 1200], BaTi ₂ O ₅ [ε = 42, Q = 5700], BaTi ₄ O
₉ [ε = 38, Q = 9000], Ba ₂ Ti ₉ O ₂₀ [ε = 39, Q = 9000], Ba ₂ (T
i, Sn) ₉ O ₂₀ [ε = 37, Q = 5000], ZrTiO ₄ [ε = 39, Q = 7000],
(Zr, Sn) TiO ₄ [ε = 38, Q = 7000], BaNd ₂ Ti ₅ O ₁₄ [ε = 83, Q = 2
100], BaSm ₂ TiO ₁₄ [ε = 74, Q = 2400], Bi ₂ O ₃ -BaO-Nd ₂ O ₃ -T
iO ₂ system [ε = 88, Q = 2000], PbO-BaO-Nd ₂ O ₃ -TiO ₂ system [ε = 90,
Q = 5200], (Bi ₂ O ₃ , PbO) -BaO-Nd ₂ O ₃ -TiO ₂ system [ε = 105, Q = 2
500], La ₂ Ti ₂ O ₇ [ε = 44, Q = 4000], Nd ₂ Ti ₂ O ₇ [ε = 37, Q = 1
100], (Li, Sm) TiO ₃ [ε = 81, Q = 2050], Ba (Mg _1/3 Ta _2/3 ) O ₃
[ε = 25, Q = 35000], Ba (Zn _1/3 Ta _2/3 ) O ₃ [ε = 30, Q = 1400
_{0], Ba (Zn 1/3 Nb} 2/3) O 3 [ε = 41, Q = 9200], Sr (Zn 1/3 N
b _2/3 ) O ₃ [ε = 40, Q = 4000] or the like can be used.

More preferably, the composition has the following composition as a main component.

TiO_Two, CaTiO_Three, SrTiO_Three, BaO-Nd_TwoO_Three-TiO
_TwoSystem, Bi_TwoO_Three-BaO-Nd_TwoO_Three-TiO_TwoSystem, BaTi_FourO ₉, Ba_TwoTi₉O₂₀, B
a_Two(Ti, Sn)₉O₂₀System, MgO-TiO_TwoSystem, ZnO-TiO_TwoSystem, MgO-SiO_Two
System.

The average particle diameter of the ceramic powder is preferably about 0.2 to 10 μm in consideration of the kneadability with the resin. If the particle diameter is small, kneading with the resin is difficult. In addition, when the particle size is large, the powder becomes non-uniform and cannot be uniformly dispersed, and a dense molded body cannot be obtained when molding a composition having a large powder content. Further, as the dielectric powder, powder obtained by covering metal particles with a dielectric layer can be used.

When the dielectric layer of the present invention is formed,
A flame retardant may be added to the polyvinyl benzyl ether compound. As the flame retardant, there are an addition type and a reaction type, and various flame retardants usually used for making a substrate flame-retardant can be used. Examples of the additive type flame retardant include a halogen type, a phosphorus type, a nitrogen type, a metal salt type, a hydrated metal type, and an inorganic type. Of these, halogen-based flame retardants are preferred from the viewpoint of dielectric properties, and further, brominated aromatic flame retardants are
It is preferable in view of the influence on heat resistance and dielectric properties.
Representative brominated aromatic flame retardants include decabromodiphenyl oxide, octabromodiphenyl oxide, tetrabromobisphenol A, bis (tribromophenoxy) ethane, tetrabromobisphenol A epoxy oligomer, ethylenebistetrabromophthalimide, ethylene Bispentabromodiphenyl, tris (tribromophenoxy) triazine, tetrabromobisphenol A-bis (2,3-dibromopropyl ether), polydibromophenylene ether, brominated polystyrene, hexabromobenzene, tetrabromobisphenol S, octabromotrimethyl Examples include phenylindane and brominated polyphenylene oxide, which can be used properly depending on the required various characteristics.

The reinforcing fibers such as glass cloth used in the present invention may be of various types depending on the purpose and application.
Commercial products can be used as they are. The reinforcing fiber at this time is made of E glass cloth (ε =
7, tan δ = 0.003, 1 GHz, D glass cloth (ε = 4, tan δ = 0.0013, 1 GHz), H glass cloth (ε = 11, tan δ = 0.003, 1 GHz)
Etc. may be properly used. Also, to improve interlayer adhesion,
Coupling treatment or the like may be performed. Its thickness is 10
It is preferably 0 μm or less, particularly preferably 20 to 60 μm. The weight of the fabric is 120 g / m ² or less, especially 20 to 7
0 g / m ² is preferred.

As the metal foil to be used, any suitable metal having good conductivity such as gold, silver, copper and aluminum may be used. Of these, copper is particularly preferred.

As a method for producing a metal foil, various known methods such as an electrolytic method and a rolling method can be used. However, when it is desired to obtain a foil peel strength, an electrolytic foil is used. It is preferable to use a rolled foil which is less affected by the skin effect due to surface irregularities. As the thickness of the metal foil,
It is preferably from 8 to 70 µm, particularly preferably from 12 to 35 µm.

In the present invention, in order to obtain a prepreg on which a voltage-controlled oscillator is based, a ceramic powder having a predetermined compounding ratio, a polyvinyl benzyl ether compound and, if necessary, a flame retardant are mixed and kneaded with a solvent to form a slurry. Follow the steps of applying the paste and drying. The solvent used in this case is preferably a volatile solvent, particularly preferably the above-mentioned polar neutral solvent, and is used for the purpose of adjusting the viscosity of the paste to facilitate coating. The kneading may be performed by a known method using a ball mill, stirring, or the like. It can be formed by coating a paste on a metal foil or impregnating on a glass cloth.

The drying of the prepreg may be appropriately adjusted depending on the ceramic powder contained and, if necessary, the content of the flame retardant, etc., but is usually 100 to 120 ° C. and 0.5 to 3 hours. The thickness after drying and B-stage is 50
The thickness is preferably about 300 μm, and the film thickness may be adjusted to an optimum value according to the application and required characteristics (pattern width and precision, DC resistance) and the like.

The prepreg can be manufactured as follows. First, a glass cloth wound into a roll is fed into a coating tank. In the coating tank, the ceramic powder dispersed in the solvent, if necessary, the flame retardant and the polyvinyl benzyl ether compound are adjusted in a slurry state, and when the glass cloth passes through the coating tank, it is immersed in the slurry. This is applied to the glass cloth and the gaps in the glass cloth are filled.

The glass cloth that has passed through the coating tank is introduced into a drying oven via a guide roller. The resin-impregnated glass cloth introduced into the drying oven is dried at a predetermined temperature and time, and is wound around a winding roller.

Then, when cut into a predetermined size, a prepreg having ceramic powder on both sides of a glass cloth and, if necessary, a resin containing a flame retardant is obtained.

Further, a metal foil such as a copper foil is placed on the upper and lower surfaces of the obtained prepreg, and the resultant is heated and pressed to obtain a substrate with a double-sided metal foil. If no metal foil is provided, heating and
What is necessary is just to press-press.

As the prepreg as described above, a prepreg containing no dielectric powder can be obtained by using a material that does not contain dielectric powder, such as ceramic powder, as the slurry in the coating tank.

Such a metal foil is patterned to form built-in elements such as capacitors, inductors, and resonators, and prepregs and ceramic powders containing ceramic powder are obtained so that a necessary structure as a voltage controlled oscillator can be obtained. Are laminated in a predetermined order, and are integrated by heating and pressing. The heating and pressing condition is 1
Temperature of 00 to 230 ° C., 9.8 × 10 ^{5 to} 7.84 × 1
It is preferable that the 0 ⁶ Pa 0.5 to 20 hours at a pressure of.

The through holes for connection between the built-in elements, connection between the built-in elements and the mounted components or connection to the ground electrode, and formation of the terminal electrodes are formed by NC processing on the material of the multi-layered multi-layer substrate. And the like.
Copper (Cu) plating is performed on the formed through holes to form a plating film. Furthermore, patterning for component mounting and ground electrode is performed on the copper foil on both sides. The wiring patterns on the front and back surfaces can be formed by etching. Plating on these copper layers is performed by a method of further plating Pd or Au after Ni plating or a method using a solder leveler.

FIG. 1 is a perspective view showing an embodiment of a voltage controlled oscillator according to the present invention, and FIG. 2 is a sectional view thereof. 1 and 2, reference numeral 1 denotes a base of a voltage controlled oscillator,
It consists of a multilayer substrate. As shown in FIG. 2, the multilayer substrate 1 includes a resonator 2, an inductor layer 3 including a plurality of inductors,
And a capacitor layer 4 including a plurality of capacitors. 5 is a chip component which is a passive element mounted on the multilayer substrate 1,
Reference numerals 6 and 7 denote transistors and diodes (semiconductor elements), and these components 5 to 7 are mounted components.
Reference numeral 8 denotes a metal shield case that covers these mounted components.

The resonator 2 includes a strip line 9a,
Ground electrodes 10a and 10b are disposed above and below 9b, and dielectric layers 11a and 11b made of a polyvinyl benzyl ether compound and containing no dielectric powder (relative permittivity ε = 2.5 to 3.5) are provided between them. It is configured with intervening.

In the inductor layer 3, ground electrodes 10b and 10c are arranged above and below the inductor electrode 12, and dielectric layers 11c and 11d (made of a polyvinyl benzyl ether compound) which do not contain a dielectric powder between them (relative permittivity ε). =
2.5 to 3.5).

The capacitor layer 4 has a dielectric layer 14 (relative permittivity ε = 10 to 30) made of a mixture of a polyvinyl benzyl ether compound and a dielectric powder interposed between the upper and lower capacitor electrodes 13a and 13b. A dielectric layer 11e made of a polyvinyl benzyl ether compound and containing no dielectric powder is provided between the lower capacitor electrode 13a and the ground electrode 10c and between the upper capacitor electrode 13b and the surface of the multilayer substrate 1, respectively. , 11f
(Relative permittivity ε = 2.5 to 3.5) intervenes.

The prepreg for forming the dielectric layers 11a to 11f is produced, for example, as follows. A 55 wt% toluene solution of a polyvinyl benzyl ether compound (solution A) and ethylenebistetrabromophthalimide (product name: Cytex BT-93) were mixed with a solution A: Cytex BT-93 = 70: 30 (weight ratio of solid content). The mixture was impregnated and coated with a 50 μm-thick glass cloth, and cured at 110 ° C. for 2 hours to obtain a prepreg with a built-in glass cloth. The composition of this prepreg is as follows: polyvinyl benzyl ether compound: glass cloth: flame retardant = 42: 40: 18 (wt.
%). The tan δ of this material is 0.005 (1 GH
z).

For example, the composite dielectric layer 14 is prepared by preparing a 40 wt% toluene solution of a tetrabromobisphenol A modified vinylbenzyl compound as a flame retardant (hereinafter referred to as a solution C). Was mixed with barium titanate-based ceramics at a solid content weight ratio of 70:30, and the resulting ceramic mixed solution was 38 μm
A thick glass cloth was impregnated and coated, and cured at 110 ° C. for 0.5 hour to obtain a prepreg with a built-in glass cloth. The composition of this prepreg is: polyvinyl benzyl ether compound: barium titanate-based ceramics: glass cloth: flame retardant = 14: 55: 25: 6 (wt%). The tan δ of this material is 0.01 (1 GHz).

As described above, by using the polyvinyl benzyl ether compound for all the layers, the value of Q is high, and the relative permittivity is low in the portions of the resonator layer 2 and the inductor layer 3 other than the capacitor. Is 1
A voltage controlled oscillator that can be obtained even at a high frequency of GHz or more can be realized. In addition, by including a dielectric constant powder in the capacitor layer 4, a dielectric constant suitable for forming a capacitor is obtained, so that a capacitor required for the configuration of the voltage controlled oscillator can be formed in the multilayer substrate 1. In addition, a low dielectric constant layer 11 containing no dielectric powder is formed above and below the capacitor layer 4.
By providing e and 11f, the coupling between the capacitor layer and the element in the other layer can be reduced.

For this reason, in the case of a conventional voltage controlled oscillator using a glass epoxy resin substrate, 13 mounted capacitors, 4 resistors, 2 transistors, and 1 diode are mounted as mounting components, and the vertical length of the multilayer substrate is 5 mm. , 4mm wide,
Although the height was 0.8 mm, according to the present invention, three capacitors, four resistors, two transistors, and one diode
Are mounted, the height of the multilayer board is 3.5 mm and the width is 3.5 m
m and a height of 0.85 mm.

As shown in FIG. 1, ground terminals 15a to 15b are formed at the center of each of four surfaces around the multilayer substrate 1 by side through holes. Ground terminal 1
5a is a signal terminal 16 for applying a control voltage and a power supply terminal 17
And the ground terminal 15b is interposed between the built-in elements or between the signal terminals 18 and 19 for connecting the built-in element and any of the mounted components 5 to 7. Ground terminal 1
5d is also interposed between the signal terminals 20 and 21. However, the ground terminal 15c has a structure interposed between the signal terminal 22 and the ground terminal 15e due to the circuit configuration.

As described above, since the side through holes 18 to 21 also serving as terminal electrodes are used for connecting the conductors of the built-in element or connecting the conductor to the mounted component, there is no dead area on the component mounting surface, and the component can be removed. In addition to miniaturization due to the built-in structure, further miniaturization and high-density mounting are possible.

The ground terminal 15 is provided between the signal terminal 16 and the power supply terminal 17 or between the signal terminals 18 and 21.
Since a, 15b, and 15c are provided, even if the distance between the terminals becomes narrow due to the miniaturization, deterioration of the characteristics can be prevented.

In FIG. 2, the inductor constituted by the inductor layer 3 may be a mounted component, and a capacitor layer may be formed instead.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a voltage controlled oscillator according to the present invention.

FIG. 2 is a sectional view of the embodiment of FIG.

FIG. 3 is a sectional view of a conventional voltage controlled oscillator.

[Explanation of symbols]

1: multilayer substrate, 2: resonator layer, 3: inductor layer, 4:
Capacitor layer, 5 to 7: mounted components, 8: shield case, 9a, 9b: strip line, 10a to 10c:
Ground electrodes, 11a to 11f: dielectric layer not containing dielectric powder, 12: inductor electrode, 13a, 13b: capacitor electrode, 14: dielectric layer containing dielectric powder, 15
a to 15e: ground terminal, 16, 18 to 22: signal terminal, 17: power supply terminal

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 25/18 H05K 3/46 Q H03B 1/00 N 5/18 SH05K 1/11 T 3/46 Z H01L 23/12 L N 23/14 R 25/04 Z F term (reference) 5E317 AA22 BB01 BB04 BB11 CC53 CD31 CD34 GG14 5E346 AA12 AA13 AA15 AA23 AA33 AA36 AA41 BB02 BB03 BB04 BB16 BB20 CC04 CC08 CC21 DD31 DD FF42 FF45 GG17 GG28 HH06 HH11 HH22 5J081 AA11 BB01 DD02 EE02 EE03 EE09 JJ01 JJ04 JJ18 LL01 MM07 MM08

Claims (2)

[Claims] 1. A multilayer substrate having a laminated structure of a dielectric layer having at least a polyvinyl benzyl ether compound and a composite dielectric layer in which a dielectric powder is dispersed in the polyvinyl benzyl ether compound. A passive element is formed as an internal element, and connection between conductors of the internal element and connection between the internal element and a mounted component on the multilayer substrate are formed through a through-hole in which a conductor of a multi-cavity multilayer substrate material is formed. Is performed by a side through hole provided by cutting, and as a terminal formed by the side through hole,
A voltage controlled oscillator having a ground terminal, a signal terminal, and a power terminal, wherein the ground terminal is provided between the signal terminals or between the signal terminal and the power terminal. 2. The voltage controlled oscillator according to claim 1, wherein a glass cloth material is embedded in at least a part of the dielectric layer of the multilayer substrate.