JP2873541B2 - Resin composition for molding antenna substrate material of high frequency communication equipment - Google Patents

Resin composition for molding antenna substrate material of high frequency communication equipment

Info

Publication number
JP2873541B2
JP2873541B2 JP6177064A JP17706494A JP2873541B2 JP 2873541 B2 JP2873541 B2 JP 2873541B2 JP 6177064 A JP6177064 A JP 6177064A JP 17706494 A JP17706494 A JP 17706494A JP 2873541 B2 JP2873541 B2 JP 2873541B2
Authority
JP
Japan
Prior art keywords
fibrous
titanate
resin composition
resin
barium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP6177064A
Other languages
Japanese (ja)
Other versions
JPH0841247A (en
Inventor
明 田渕
宏之 門出
好明 石井
あゆみ 楮本
尚吾 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otsuka Chemical Co Ltd
Original Assignee
Otsuka Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Chemical Co Ltd filed Critical Otsuka Chemical Co Ltd
Priority to JP6177064A priority Critical patent/JP2873541B2/en
Publication of JPH0841247A publication Critical patent/JPH0841247A/en
Application granted granted Critical
Publication of JP2873541B2 publication Critical patent/JP2873541B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電子部品用樹脂組成物
に関する。詳しくは、良好な誘電特性及び優れた物理的
特性を兼備し、高周波帯域で使用される電子電気部品の
材料、特に高周波通信機のアンテナ基板材料として有用
な樹脂組成物に関する。
The present invention relates to a resin composition for electronic parts. More specifically, the present invention relates to a resin composition which has both good dielectric properties and excellent physical properties and is useful as a material for electronic / electric parts used in a high frequency band, particularly as an antenna substrate material for a high frequency communication device.

【0002】[0002]

【従来の技術とその課題】最近における、携帯電話、コ
ードレスホン、自動車電話等の移動体通信機の目覚しい
普及、衛星通信機の著しい発達等に伴い、通信信号の周
波数の高周波化及び通信機の一層の小型化が望まれてい
る。
2. Description of the Related Art With the remarkable spread of mobile communication devices such as portable telephones, cordless phones, and automobile telephones and the remarkable development of satellite communication devices, the frequency of communication signals has been increased and the communication devices have been further improved. There is a demand for miniaturization.

【0003】ところで、信号の高周波化及び通信機の小
型化には、通信機内部に組み込まれたアンテナ基板の比
誘電率(ε)と誘電正接(tanδ)という2種の誘電
特性が大きく関与する。比誘電率とは誘電体内の分極の
程度を示すパラメーターであり、アンテナ基板の比誘電
率が高い程、該基板上に形成された回路を伝播する信号
の波長は短くなり、信号は高周波化する。従って、該基
板の比誘電率を高く設定できれば、高周波化ひいては回
路の短縮化及び通信機の小型化を図ることができる。誘
電正接とは、誘電体内を伝播する信号が熱に変換されて
失われる量を表すパラメーターであり、これが低い程信
号の損失が少なくなり、消費エネルギーが減少してバッ
テリーを小型化できるので、通信機自体の小型化をも可
能にし、加えて長時間の連続使用が可能となる。
[0003] By the way, two kinds of dielectric characteristics, that is, relative dielectric constant (ε) and dielectric loss tangent (tan δ) of an antenna board incorporated in a communication device are greatly involved in increasing the signal frequency and reducing the size of the communication device. . Relative permittivity is a parameter indicating the degree of polarization in a dielectric.The higher the relative permittivity of an antenna substrate, the shorter the wavelength of a signal propagating through a circuit formed on the substrate, and the higher the frequency of the signal. . Therefore, if the relative permittivity of the substrate can be set high, it is possible to achieve a higher frequency, a shorter circuit, and a smaller communication device. The dielectric loss tangent is a parameter that represents the amount of a signal propagating in a dielectric that is converted into heat and lost.The lower this value is, the smaller the signal loss is, the lower the energy consumption is, and the smaller the battery can be. This allows the machine itself to be miniaturized, and in addition allows long-term continuous use.

【0004】従来通信機のアンテナ基板には、主に、
(イ)ビスフェノールトリアジン、熱硬化性ポリフェニ
レンエーテル等の熱硬化性樹脂からなる絶縁層と(ロ)
アルミノ・ホウケイ酸ガラス(CaO−Al2 3 −B
2 3 −SiO2 )の繊維布に前記熱硬化性樹脂を含浸
させたプリプレグ層を交互に複数枚ずつ加圧積層し、そ
の両面に銅箔を貼着した銅張積層板が使用されている。
該積層板は、1MHz、25℃における誘電正接が0.
003程度と低いが、比誘電率は6.7程度であり、こ
れでは数百MHzからGHzに及ぶ高周波用には不十分
である。また、絶縁層とプリプレグ層の比誘電率が異な
り、積層する層の数によって積層板自体の比誘電率が大
きく変化するため、周波数の設定が困難である。絶縁層
とプリプレグ層は熱膨脹率も異なるので、長期の使用に
より積層界面でズレが生じて比誘電率が変化し、通信障
害を起こすこともある。更に、非常に薄い絶縁層とプリ
プレグ層を交互に積層するには、極めて煩雑な作業を必
要とする。
[0004] Conventionally, the antenna board of a communication device mainly includes:
(B) an insulating layer made of a thermosetting resin such as bisphenoltriazine or thermosetting polyphenylene ether;
Alumino borosilicate glass (CaO-Al 2 O 3 -B
A copper-clad laminate is used in which a plurality of prepreg layers impregnated with the thermosetting resin are alternately pressure-laminated on a fiber cloth of 2 O 3 —SiO 2 ), and copper foils are adhered on both surfaces thereof. I have.
The laminate has a dielectric loss tangent of 0.1 MHz at 25 ° C. of 0.
Although it is as low as about 003, the relative dielectric constant is about 6.7, which is insufficient for high frequencies ranging from several hundred MHz to GHz. Further, the relative permittivity of the insulating layer and the prepreg layer is different, and the relative permittivity of the laminate itself changes greatly depending on the number of layers to be laminated, so that it is difficult to set the frequency. Since the insulating layer and the prepreg layer also have different coefficients of thermal expansion, a long-term use may cause a shift at the lamination interface, change the relative dielectric constant, and cause communication failure. Further, alternately laminating a very thin insulating layer and a prepreg layer requires an extremely complicated operation.

【0005】また、高誘電性チタニア・ケイ酸ガラス
(SiO2 −BaO2 −TiO2 )の繊維布に熱硬化性
樹脂を含浸させたプリプレグ層と絶縁層とを積層した銅
張積層板も、知られている。この積層板は、従来のもの
と同等の誘電正接値を示し且つ比誘電率が11〜12程
度と高く、高周波用に適したものであるが、周波数の設
定の困難性、長期間使用による通信障害の発生、製造の
煩雑さといった積層板本来の問題点は解消されていな
い。
Further, a copper-clad laminate obtained by laminating a prepreg layer obtained by impregnating a thermosetting resin in a fiber cloth of high dielectric titania-silicate glass (SiO 2 —BaO 2 —TiO 2 ) and an insulating layer, Are known. This laminate has a dielectric loss tangent value equivalent to that of a conventional one and a relative dielectric constant as high as about 11 to 12, and is suitable for high frequency use. The problems inherent in the laminate, such as the occurrence of trouble and the complexity of manufacturing, have not been solved.

【0006】一方、合成樹脂は、その易成形性により、
家電等の一般的な電子電気機器の部品材料として使用さ
れている。更に、合成樹脂の耐熱性、機械的強度、寸法
安定性等を向上させるために、繊維状無機充填材を添加
することも行われている。
On the other hand, a synthetic resin has a
It is used as a component material for general electronic and electrical equipment such as home appliances. Further, in order to improve the heat resistance, mechanical strength, dimensional stability and the like of the synthetic resin, a fibrous inorganic filler has been added.

【0007】例えば特開平3−35585号公報は、ガ
ラス繊維、繊維状チタン酸カリウム等の繊維状充填材に
よって強化された樹脂組成物を開示する。該組成物は、
スイッチ、テープガイド、歯車等の一般的な電子電気部
品に適用することを意図したものであり、高周波帯域で
は繊維状無機充填材に起因する好ましくない性質を示す
ため、高周波用の電子電気部品としては使用できない。
ガラス繊維は誘電正接を増大させ、信号伝達率を低下さ
せる。またガラス繊維は、小さいものでも繊維径5〜1
5μm程度、繊維長100μm程度以上であるため、合
成樹脂と混合して成形すると、成形品の表面に浮き出
し、高周波帯域において信号伝達の障害となる凹凸を生
じる。繊維状チタン酸カリウムは、繊維径0.05〜2
μm程度、繊維長2〜50μm程度とミクロな繊維であ
り、合成樹脂の強化には有効であるが、誘電正接を著し
く増大させるので、信号伝達率の低下をもたらす。しか
も、該繊維に含まれるカリウム等のアルカリ成分は、電
子部品の電極や配線を腐食させたり、断線や電流の漏れ
等を引き起こしたりする。
For example, JP-A-3-35585 discloses a resin composition reinforced by a fibrous filler such as glass fiber or fibrous potassium titanate. The composition comprises:
It is intended to be applied to general electronic and electrical components such as switches, tape guides, and gears, and exhibits undesired properties due to the fibrous inorganic filler in the high frequency band. Cannot be used.
Glass fibers increase the dielectric loss tangent and reduce the signal transmission. In addition, even if the glass fiber is small, the fiber diameter is 5-1.
Since it has a fiber length of about 5 μm and a fiber length of about 100 μm or more, when mixed with a synthetic resin and molded, the mixture emerges on the surface of the molded product, and irregularities which hinder signal transmission in a high frequency band are generated. The fibrous potassium titanate has a fiber diameter of 0.05 to 2
It is a microfiber having a length of about μm and a fiber length of about 2 to 50 μm, which is effective for strengthening the synthetic resin, but significantly increases the dielectric loss tangent, thereby lowering the signal transmission rate. In addition, alkali components such as potassium contained in the fibers corrode electrodes and wirings of electronic components, cause disconnection, current leakage, and the like.

【0008】また、特開平3−281574号公報に
は、繊維状チタン酸バリウムを含む高誘電性樹脂組成物
が記載されているが、該組成物はアンテナ基板等とは異
なる用途であるコンデンサの材料として使用されるもの
である。加えて、該組成物は、総じて誘電正接がやや高
いので、高周波用途には適さない。該公報には、特定の
形状及び誘電特性を有する繊維状チタン酸バリウムを用
いることにより、樹脂組成物の高周波適性が著しく改善
されることは示唆されていない。
Japanese Unexamined Patent Publication (Kokai) No. 3-281574 discloses a high dielectric resin composition containing fibrous barium titanate. However, this composition is used for a capacitor which is used for a purpose different from an antenna substrate or the like. It is used as a material. In addition, the composition is generally unsuitable for high frequency applications because of its slightly higher dielectric loss tangent. The publication does not suggest that the use of fibrous barium titanate having a specific shape and dielectric properties significantly improves the high frequency suitability of the resin composition.

【0009】更に、粒状チタン酸バリウム等の粒状の誘
電性無機充填材を使用することも考えられるが、粒状の
誘電性充填材は、樹脂への添加量を増やしても比誘電率
が一定の数値以上には上がらず、所望の比誘電率が得ら
れない。粒状の充填材を添加した樹脂組成物は、寸法安
定性、耐熱性、機械的強度等の点で不十分であり、電子
電気部品の材料としては好ましくない。
Further, it is conceivable to use a granular dielectric inorganic filler such as granular barium titanate, but the granular dielectric filler has a constant relative dielectric constant even when the amount added to the resin is increased. The value does not exceed the value, and the desired relative permittivity cannot be obtained. A resin composition to which a particulate filler is added is insufficient in dimensional stability, heat resistance, mechanical strength, and the like, and is not preferable as a material for electronic / electric parts.

【0010】上述した様に、従来、高周波用アンテナ基
板には、専ら上記の銅張積層板が使用されており、繊維
状無機充填材で強化した合成樹脂をこの様な用途に適用
することは、行われていない。
As described above, conventionally, the above-mentioned copper-clad laminate is exclusively used for a high-frequency antenna substrate, and it is impossible to apply a synthetic resin reinforced with a fibrous inorganic filler to such an application. , Not done.

【0011】[0011]

【課題を解決するための手段】本発明者は、上記従来技
術の課題を解決すべく鋭意研究を重ねた結果、無機充填
材として、特定の寸法及び誘電特性を有する繊維状物を
合成樹脂マトリックスに配合することにより、従来の銅
張積層板と同等又はそれ以上の高誘電率及び低誘電正接
を有し、表面平滑性、寸法安定性、耐熱性等に優れ、機
械的強度も高く、高周波帯域で使用される電子電気部品
の材料、特に高周波通信機のアンテナ基板材料として有
用な樹脂組成物が得られることを見い出し、本発明を完
成した。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies in order to solve the above-mentioned problems of the prior art, and as a result, as an inorganic filler, a fibrous material having a specific size and dielectric properties has been synthesized. By blending it in, it has a high dielectric constant and a low dielectric loss tangent equal to or higher than that of conventional copper-clad laminates, has excellent surface smoothness, dimensional stability, heat resistance, etc., high mechanical strength, and high frequency The present inventors have found that a resin composition useful as a material for electronic and electric components used in a band, particularly a material for an antenna substrate of a high-frequency communication device, has been obtained, and the present invention has been completed.

【0012】即ち、本発明は、合成樹脂マトリックス中
に、繊維径3μm以下、繊維長5μm以下であり、且つ
1GHz以上の高周波帯域における比誘電率が50以
上、誘電正接が0.1以下である繊維状無機充填材を含
有することを特徴とする電子部品用樹脂組成物に係る。
That is, according to the present invention, the synthetic resin matrix has a fiber diameter of 3 μm or less, a fiber length of 5 μm or less, a relative dielectric constant of 50 or more and a dielectric loss tangent of 0.1 or less in a high frequency band of 1 GHz or more. The present invention relates to a resin composition for electronic components, which comprises a fibrous inorganic filler.

【0013】本発明においては、MHz帯における比誘
電率及び誘電正接はJIS K−6911に準じて測定
した。また、GHz帯における比誘電率及び誘電正接
は、ネットワークアナライザー(商品名:8510C、
HEWLET PACKARD社製)を用い、空洞共振
法により測定した。
In the present invention, the relative dielectric constant and the dielectric loss tangent in the MHz band were measured according to JIS K-6911. The relative permittivity and the dielectric loss tangent in the GHz band were measured using a network analyzer (trade name: 8510C,
HEWLET PACKARD Co., Ltd.).

【0014】本発明においては、マトリックスとなる合
成樹脂としては特に制限されず、公知のものを使用でき
る。具体的には、例えば、ポリエチレン、ポリプロピレ
ン、塩素化ポリオレフィン、5−メチルペンテン樹脂、
環状ポリオレフィン、ポリスチレン、変性ポリスチレ
ン、シンジオタクチックポリスチレン、ポリフェニレン
エーテル、ABS樹脂、ポリアミド、アクリル樹脂、メ
チクリル樹脂、ポリアセタール、ポリカーボネート、熱
可塑性ポリイミド、ポリエーテルイミド、ポリアミドイ
ミド、アイオノマー樹脂、ポリエーテルケトン、ポリエ
ーテルニトリル、ポリフェニレンサルファイド、ポリス
ルホン、ポリエステル、芳香族ポリエステル、液晶ポリ
エステル、ポリエチレンテレフタレート、ポリブチレン
テレフタレート、熱溶融性フッ素樹脂等の熱可塑性樹
脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、グア
ナミン樹脂、アミノ樹脂、不飽和ポリエステル樹脂、ジ
アリルフタレート樹脂、エポキシ樹脂、シリコーン樹
脂、ウレタン樹脂、熱硬化性ポリフェニレンエーテル、
トリアジン系樹脂、ポリイミド等の熱硬化性樹脂等を挙
げることができ、熱可塑性樹脂としては、環状ポリオレ
フィン、ポリエーテルイミド、液晶ポリエステル、ポリ
フェニレンエーテル、変性ポリスチレン、熱溶融性フッ
素樹脂、ポリフェニレンサルファイド、熱可塑性ポリイ
ミド、5−メチルペンテン樹脂、シンジオタクチックポ
リスチレン等が好ましく、また熱硬化性樹脂としては、
エポキシ樹脂、熱硬化性ポリフェニレンエーテル、トリ
アジン系樹脂、ポリイミド等が好ましい。これらの中で
も、1GHz以上の高周波帯域における誘電正接が10
-2以下であるものが特に好ましく、具体的には、環状ポ
リオレフィン、ポリエーテルイミド、ポリフェニレンエ
ーテル、シンジオタクチックポリスチレン、5−メチル
ペンテン樹脂、ポリフェニレンサルファイド、液晶ポリ
エステル、熱溶融性フッ素樹脂等を挙げることができ
る。
In the present invention, the synthetic resin serving as the matrix is not particularly limited, and known resins can be used. Specifically, for example, polyethylene, polypropylene, chlorinated polyolefin, 5-methylpentene resin,
Cyclic polyolefin, polystyrene, modified polystyrene, syndiotactic polystyrene, polyphenylene ether, ABS resin, polyamide, acrylic resin, methacrylic resin, polyacetal, polycarbonate, thermoplastic polyimide, polyetherimide, polyamideimide, ionomer resin, polyetherketone, poly Ether nitrile, polyphenylene sulfide, polysulfone, polyester, aromatic polyester, liquid crystal polyester, polyethylene terephthalate, polybutylene terephthalate, thermoplastic resin such as hot-melt fluororesin, phenolic resin, urea resin, melamine resin, guanamine resin, amino resin, Unsaturated polyester resin, diallyl phthalate resin, epoxy resin, silicone resin, urethane resin, thermosetting Sex polyphenylene ether,
Triazine resins, thermosetting resins such as polyimides and the like can be mentioned, as the thermoplastic resin, cyclic polyolefin, polyetherimide, liquid crystal polyester, polyphenylene ether, modified polystyrene, heat-fusible fluororesin, polyphenylene sulfide, heat Plastic polyimide, 5-methylpentene resin, syndiotactic polystyrene and the like are preferable, and as the thermosetting resin,
Epoxy resin, thermosetting polyphenylene ether, triazine resin, polyimide and the like are preferable. Among them, the dielectric loss tangent in the high frequency band of 1 GHz or more is 10
-2 or less are particularly preferable, and specific examples thereof include a cyclic polyolefin, polyetherimide, polyphenylene ether, syndiotactic polystyrene, 5-methylpentene resin, polyphenylene sulfide, liquid crystal polyester, and a heat-meltable fluororesin. be able to.

【0015】合成樹脂は1種を単独で又は2種以上を併
用して使用できる。
One type of synthetic resin can be used alone or two or more types can be used in combination.

【0016】本発明においては、繊維状無機充填材とし
て、特定の寸法及び誘電特性を有するものを使用する。
この様な特定の繊維状無機充填材を用いることにより、
合成樹脂に高比誘電率と低誘電正接が付与され、表面平
滑性、寸法安定性、耐熱性が向上し、機械的強度も高
く、高周波帯域での信号の伝達効率が良く、長期間使用
による比誘電率の変化もない。更に、この繊維状無機充
填材を含有する樹脂組成物は、高周波帯域になる程比誘
電率が著しく増大し、信号の伝達効率が一層向上するこ
とが見出されている。この様な顕著な効果が得られる理
由は現時点では十分明らかではないが、特定の寸法と誘
電特性を有する繊維状物であるため、分極が起こり易く
なり、これが関与しているものと推測される。
In the present invention, a fibrous inorganic filler having specific dimensions and dielectric properties is used.
By using such a specific fibrous inorganic filler,
High relative dielectric constant and low dielectric loss tangent are given to synthetic resin, surface smoothness, dimensional stability, heat resistance are improved, mechanical strength is high, signal transmission efficiency in high frequency band is good, and long-term use There is no change in relative dielectric constant. Further, it has been found that the resin composition containing the fibrous inorganic filler has a remarkable increase in the relative dielectric constant in a higher frequency band, and the signal transmission efficiency is further improved. The reason why such a remarkable effect is obtained is not sufficiently clear at present, but since the fibrous material has a specific size and dielectric properties, polarization is likely to occur, and it is presumed that this is involved. .

【0017】繊維状無機充填材の寸法は、繊維径3μm
以下且つ繊維長5μm以上である。繊維径が3μmを越
えると成形品表面に凹凸が生じ、1GHz以上の高周波
帯域(特に12GHz程度又はそれ以上の周波帯域)に
おいて信号の受信を妨げ、信号の伝達効率が悪くなる。
また、繊維長が5μm未満になると、機械的強度及び耐
熱性を向上させる効果が不十分になる。更に、前記の形
状を有する繊維状無機充填材の中でも、アスペクト比が
3以上のものを好ましく使用できる。
The size of the fibrous inorganic filler is 3 μm in fiber diameter.
Or less and a fiber length of 5 μm or more. If the fiber diameter exceeds 3 μm, irregularities occur on the surface of the molded product, which hinders signal reception in a high-frequency band of 1 GHz or more (particularly, a frequency band of about 12 GHz or more), resulting in poor signal transmission efficiency.
When the fiber length is less than 5 μm, the effect of improving the mechanical strength and heat resistance becomes insufficient. Further, among the fibrous inorganic fillers having the above-mentioned shape, those having an aspect ratio of 3 or more can be preferably used.

【0018】繊維状無機充填材の誘電特性は、1GHz
以上の高周波帯域における比誘電率が50以上、好まし
くは100以上、誘電正接が0.1以下、好ましくは
0.05以下である。比誘電率が50を下回ると、例え
ばアンテナ基板として用いる場合の小型化が困難にな
る。また誘電正接が0.1を越えると、信号の伝達効率
が悪くなる。
The dielectric properties of the fibrous inorganic filler are 1 GHz
The relative dielectric constant in the above high frequency band is 50 or more, preferably 100 or more, and the dielectric loss tangent is 0.1 or less, preferably 0.05 or less. When the relative permittivity is less than 50, it becomes difficult to reduce the size of the antenna when used as an antenna substrate, for example. If the dielectric loss tangent exceeds 0.1, the signal transmission efficiency deteriorates.

【0019】尚、繊維状無機充填材の誘電特性の測定方
法は、次の通りである。繊維状無機充填材をプレス金型
内に充填し、500kg〜2t/cm2 の圧力をかけ、
仮成形体を得る。この仮成形体を金型から取り出し、マ
ッフル炉にて1000〜1400℃で焼成する。得られ
る焼結体の比重を測定し、空隙率を算出すると共に、該
焼結体の誘電特性をも測定し、対数の混合則により繊維
状無機充填材自体の誘電特性を決定する。
The method for measuring the dielectric properties of the fibrous inorganic filler is as follows. Filling the press mold with the fibrous inorganic filler, applying a pressure of 500 kg to 2 t / cm 2 ,
Obtain a temporary molded body. The temporary compact is taken out of the mold and fired at 1000 to 1400 ° C. in a muffle furnace. The specific gravity of the obtained sintered body is measured, the porosity is calculated, and the dielectric properties of the sintered body are also measured, and the dielectric properties of the fibrous inorganic filler itself are determined by the logarithmic mixing rule.

【0020】本発明において使用し得る繊維状無機充填
材としては、上記特定の寸法及び誘電特性を兼備するも
のであれば特に制限されないが、例えば、繊維状チタン
酸金属塩が挙げられる。繊維状チタン酸金属塩の具体例
としては、例えば、繊維状チタン酸バリウム、繊維状チ
タン酸カルシウム、繊維状チタン酸マグネシウム、繊維
状チタン酸ストロンチウム、繊維状チタン酸バリウムス
トロンチウム、繊維状チタン酸バリウムカルシウム、繊
維状チタン酸バリウムマグネシウム、繊維状チタン酸カ
ルシウムマグネシウム等の繊維状アルカリ土類金属塩、
繊維状チタン酸バリウムビスマス、繊維状チタン酸バリ
ウムネオジム等のアルカリ土類金属原子の一部が他の金
属に置換した繊維状チタン酸金属塩、繊維状チタン酸ジ
ルコン酸鉛、チタン酸ニオブ酸鉛マグネシウム等のチタ
ン酸の一部が他の金属に置換した繊維状チタン酸金属塩
等を挙げることができ、1種を単独で又は2種以上を併
用して使用できる。
The fibrous inorganic filler which can be used in the present invention is not particularly limited as long as it has the above-mentioned specific dimensions and dielectric properties, and examples thereof include fibrous metal titanate. Specific examples of the fibrous metal titanate include, for example, fibrous barium titanate, fibrous calcium titanate, fibrous magnesium titanate, fibrous strontium titanate, fibrous barium strontium titanate, fibrous barium titanate Calcium, fibrous barium magnesium titanate, fibrous alkaline earth metal salts such as fibrous calcium magnesium titanate,
Fibrous metal titanate salts in which some of the alkaline earth metal atoms are replaced with other metals, such as fibrous barium bismuth titanate and fibrous barium neodymium titanate, fibrous lead zirconate titanate, and lead niobate titanate Examples thereof include fibrous metal titanates in which a part of titanic acid such as magnesium is substituted by another metal, and one kind can be used alone or two or more kinds can be used in combination.

【0021】上記の繊維状チタン酸金属塩の中でも、繊
維状チタン酸アルカリ金属塩が好ましく、更に、繊維状
チタン酸ストロンチウム、繊維状チタン酸バリウムスト
ロンチウム、繊維状チタン酸バリウムカルシウム、繊維
状チタン酸バリウムマグネシウム、繊維状チタン酸カル
シウムマグネシウム等の2種以上のアルカリ土類金属を
含むものが特に好ましい。
Among the above fibrous metal titanates, fibrous alkali metal titanates are preferable, and furthermore, fibrous strontium titanate, fibrous barium strontium, fibrous barium calcium titanate, and fibrous titanate are preferred. Those containing two or more alkaline earth metals such as barium magnesium and fibrous calcium magnesium titanate are particularly preferred.

【0022】上記具体例の中、繊維状チタン酸バリウム
ストロンチウム、繊維状チタン酸バリウムカルシウム、
繊維状チタン酸バリウムマグネシウム、繊維状チタン酸
カルシウムマグネシウム等は新規の繊維物質であり、特
開平3−281574号公報又は特願平5−91781
号に記載の方法に準じて製造できる。例えば、水中に
て、好ましくはpH8〜10程度の弱アルカリ性下に、
(ハ)繊維状チタニア化合物と(ニ)Ba源化合物、S
r源化合物、Ca源化合物及びMg源化合物の少なくと
も1種を混合し、これに炭酸アンモニウム等の炭酸塩の
水溶液を加えて、前記チタニア化合物表面にBa、S
r、Ca及びMgの炭酸塩の少なくとも1種を沈着させ
た後、これを分取し、700〜1100℃程度で加熱処
理することにより製造できる。Ba源化合物、Sr源化
合物、Ca源化合物及びMg源化合物としては公知のも
のが使用でき、例えば酢酸塩、塩化物等を挙げることが
できる。
In the above specific examples, fibrous barium strontium titanate, fibrous barium calcium titanate,
Fibrous barium magnesium titanate, fibrous calcium magnesium titanate and the like are novel fibrous substances, and are disclosed in JP-A-3-281574 or Japanese Patent Application No. 5-91781.
It can be manufactured according to the method described in (1). For example, in water, preferably under weakly alkaline pH 8-10,
(C) fibrous titania compound and (d) Ba source compound, S
At least one of an r source compound, a Ca source compound, and a Mg source compound is mixed, and an aqueous solution of a carbonate such as ammonium carbonate is added thereto.
After depositing at least one of the carbonates of r, Ca and Mg, it can be produced by fractionating and heat-treating it at about 700 to 1100 ° C. As the Ba source compound, the Sr source compound, the Ca source compound and the Mg source compound, known compounds can be used, and examples thereof include acetates and chlorides.

【0023】繊維状無機充填材には、該充填材の合成樹
脂への分散性を一層高める目的で、表面処理剤による処
理を施してもよい。表面処理剤としては公知のものが使
用でき、例えば、シランカップリング剤、チタネート系
カップリング剤等のカップリング剤を挙げることができ
る。また、表面処理剤の使用量は特に制限されないが、
通常、本発明組成物の誘電特性及び物理的特性を損なわ
れない範囲とすればよい。
The fibrous inorganic filler may be treated with a surface treating agent for the purpose of further improving the dispersibility of the filler in the synthetic resin. Known surface treatment agents can be used, and examples thereof include coupling agents such as a silane coupling agent and a titanate coupling agent. The amount of the surface treatment agent is not particularly limited,
Usually, it may be in a range that does not impair the dielectric properties and physical properties of the composition of the present invention.

【0024】繊維状無機充填材の配合量は特に制限され
ず、比誘電率や誘電正接の設定値、組成物の用途等に応
じて広い範囲から適宜選択できるが、通常組成物全量の
10〜95重量%程度、好ましくは30〜75重量%程
度とすればよい。
The amount of the fibrous inorganic filler is not particularly limited, and can be appropriately selected from a wide range according to the set value of the relative dielectric constant and the dielectric loss tangent, the use of the composition, and the like. It may be about 95% by weight, preferably about 30 to 75% by weight.

【0025】本発明組成物には、その誘電特性及び物理
的特性を損なわない範囲で、公知の樹脂用添加剤を加え
てもよい。該添加剤の具体例としては、例えば、紫外線
吸収剤、帯電防止剤、表面処理剤、相溶化剤、熱伝導改
良剤、潤滑性向上剤、着色剤、染料、酸化防止剤、可塑
剤、界面活性剤、難燃剤、メッキ特性改良剤等を挙げる
ことができる。
Known additives for resins may be added to the composition of the present invention as long as the dielectric properties and physical properties are not impaired. Specific examples of the additive include, for example, an ultraviolet absorber, an antistatic agent, a surface treatment agent, a compatibilizer, a heat conduction improver, a lubricity improver, a colorant, a dye, an antioxidant, a plasticizer, and an interface. Examples include an activator, a flame retardant, and a plating property improving agent.

【0026】本発明組成物は、上記の合成樹脂と繊維状
無機充填材を公知の方法に従って混合することにより製
造できる。
The composition of the present invention can be produced by mixing the above synthetic resin and a fibrous inorganic filler according to a known method.

【0027】本発明組成物においては、例えば繊維状無
機充填材の配合量を適宜変化させることにより、所望の
比誘電率及び誘電正接を設定することができるが、通常
1GHz以上の高周波帯域における比誘電率を7.0以
上、誘電正接を10-2以下とすることが好ましい。この
様な誘電特性を設定することにより、得られる組成物の
高周波帯域における信号伝播速度が一層速くなったり、
或いは信号の損失が少なり、信号の伝達効率が顕著に向
上する。
In the composition of the present invention, the desired relative dielectric constant and dielectric loss tangent can be set, for example, by appropriately changing the amount of the fibrous inorganic filler, but usually the ratio in a high frequency band of 1 GHz or more is high. It is preferable that the dielectric constant is 7.0 or more and the dielectric loss tangent is 10 −2 or less. By setting such dielectric properties, the signal propagation speed in the high frequency band of the obtained composition is further increased,
Alternatively, the signal loss is reduced, and the signal transmission efficiency is significantly improved.

【0028】また、本発明組成物を耐熱性が要求される
用途に適用する場合には、18.5kg/cm2 荷重下
の荷重たわみ温度を130℃以上に設定するのが好まし
い。この設定も、繊維状無機充填剤の添加量を調整する
ことにより、容易に行うことができる。
When the composition of the present invention is applied to applications requiring heat resistance, the deflection temperature under a load of 18.5 kg / cm 2 is preferably set to 130 ° C. or higher. This setting can also be easily performed by adjusting the amount of the fibrous inorganic filler to be added.

【0029】本発明組成物は、例えば、射出成形、押出
成形、圧縮成形、注型成形等の公知の方法に従って、所
望の形状の成形品とすることができる。
The composition of the present invention can be formed into a molded article having a desired shape by a known method such as injection molding, extrusion molding, compression molding, cast molding and the like.

【0030】本発明組成物を用いて例えばアンテナ基板
等の配線板を製造するには、公知の方法が採用できる。
例えば、本発明組成物の成形品に必要に応じてエッチン
グを施した後、必要に応じてその全面又は一部に銅等の
金属の被膜を形成し、次いで配線を印刷すればよい。金
属被膜の形成は、スパッタリング、イオンプレーティン
グ、真空蒸着等の公知の方法により行うことができる。
また、金属箔を適当な接着剤にて接着又は圧着してもよ
い。
For producing a wiring board such as an antenna substrate using the composition of the present invention, a known method can be employed.
For example, after a molded article of the composition of the present invention is etched as required, a metal film such as copper may be formed on the entire surface or a part thereof as necessary, and then wiring may be printed. The formation of the metal film can be performed by a known method such as sputtering, ion plating, and vacuum deposition.
Further, the metal foil may be bonded or pressed with an appropriate adhesive.

【0031】[0031]

【発明の効果】本発明組成物は、比誘電率が高く且つ誘
電正接が低いという良好な誘電特性を有し、表面平滑
性、寸法安定性、耐熱性等に優れ、機械的強度が高い。
The composition of the present invention has good dielectric properties such as a high relative dielectric constant and a low dielectric loss tangent, is excellent in surface smoothness, dimensional stability, heat resistance and the like, and has high mechanical strength.

【0032】本発明組成物は、高周波帯域での信号の伝
達効率が良く、更に高周波になる程伝達効率が一層向上
する。
The composition of the present invention has good signal transmission efficiency in a high frequency band, and the higher the frequency, the more the transmission efficiency is improved.

【0033】本発明組成物は、表面平滑性に優れるの
で、例えばアンテナ基板の材料として使用すれば、極め
て良好な反射特性を発揮し、信号の伝達効率を一層向上
させることができ、加えて回路を印刷するのも極めて容
易である。
Since the composition of the present invention has excellent surface smoothness, if it is used, for example, as a material for an antenna substrate, it can exhibit extremely good reflection characteristics and further improve the signal transmission efficiency. Is also very easy to print.

【0034】本発明組成物は、寸法安定性及び耐熱性に
優れ、機械的強度が高く、加えて繊維状無機充填材が均
一に分散し銅張積層板の様な誘電特性の部分的な偏りが
ないので、比較的高温になる部位に長期間使用しても誘
電特性の変化が起こらず、信号の伝達効率が低下しな
い。
The composition of the present invention is excellent in dimensional stability and heat resistance, has high mechanical strength, and has a uniform dispersion of the fibrous inorganic filler and partial deviation of the dielectric properties such as a copper-clad laminate. Therefore, even if the device is used for a relatively high temperature for a long period of time, the dielectric characteristics do not change, and the signal transmission efficiency does not decrease.

【0035】本発明組成物は、繊維状無機充填材の配合
量に応じて誘電特性が相関的に変化するので、配合量を
調整することにより容易に周波数を設定することができ
る。
In the composition of the present invention, since the dielectric properties are correlated with the amount of the fibrous inorganic filler, the frequency can be easily set by adjusting the amount.

【0036】本発明組成物は、公知の成形法により一体
成形できるので、成形品の製造は非常に簡単である。
Since the composition of the present invention can be integrally molded by a known molding method, the production of a molded article is very simple.

【0037】本発明組成物は、上述の様な優れた特性を
有することから、通信機のアンテナ基板、通信機以外の
電子電気機器のプリント配線板、電波フィルター等の高
周波帯域で使用される電子電気部品の材料として極めて
好適に使用できる。ここで、通信機以外の電子電気機器
としては、例えば、コンピューターとその端末、事務機
器、計測制御機器、ビデオ機器、自動車、飛行機等の輸
送機器、オーディオ、テレビ、カメラ等を挙げることが
できる。
Since the composition of the present invention has the above-mentioned excellent properties, it can be used in high-frequency bands such as antenna boards of communication devices, printed wiring boards of electronic and electric equipment other than communication devices, and radio wave filters. It can be used very suitably as a material for electrical components. Here, examples of the electronic / electric device other than the communication device include a computer and its terminal, office equipment, measurement and control equipment, video equipment, transportation equipment such as an automobile and an airplane, audio, a television, and a camera.

【0038】[0038]

【実施例】以下に、参考例、実施例及び比較例を挙げ、
本発明を一層明瞭なものとする。尚、ここに示す荷重撓
み温度(18.5kgf/cm2 荷重)はJIS K−
6911、引張強度はJIS K−7113、曲げ強度
及び曲げ弾性率はJISK−7203、アイゾット衝撃
強さ(ノッチ付き)はJIS K−7110の規定によ
りそれぞれ測定した。
EXAMPLES Reference examples, examples and comparative examples are given below.
The invention will be made clearer. The load deflection temperature (18.5 kgf / cm 2 load) shown here is based on JIS K-
6911, tensile strength was measured according to JIS K-7113, bending strength and flexural modulus were measured according to JIS K-7203, and Izod impact strength (with notch) was measured according to JIS K-7110.

【0039】参考例1(繊維状チタン酸バリウムストロ
ンチウムの製造) 繊維状チタニア水和物(TiO2 ・1/8H2 O、平均
繊維長15μm、平均繊維径0.3μm)20.0g
(0.244モル)を1リットルの脱イオン水に分散さ
せ、攪拌しながら25%アンモニア水を10ml滴下
し、pH9に調整した後、20.0重量%の酢酸バリウ
ム水溶液153g(0.120モル)及び20.0重量
%の酢酸ストロンチウム水溶液127g(0.123モ
ル)を各々同時に滴下した。滴下は、室温(20℃)で
攪拌しながら30分かけて行った。その後、15重量%
の炭酸アンモニウム水溶液200gを60分間かけて攪
拌しながら滴下した。更に30分間攪拌を続けた後、固
形物を濾取し、水洗及び乾燥し、白色の繊維状物61g
を得た。この繊維状物30gをアルミナ製るつぼに入
れ、大気雰囲気中で970℃にて3時間加熱処理し、2
4.5gの繊維状チタン酸バリウムストロンチウムを得
た。
Reference Example 1 (Production of fibrous barium strontium titanate) 20.0 g of fibrous titania hydrate (TiO 2 1 / H 2 O, average fiber length 15 μm, average fiber diameter 0.3 μm)
(0.244 mol) was dispersed in 1 liter of deionized water, and 10 ml of 25% aqueous ammonia was added dropwise with stirring to adjust the pH to 9, and then 153 g of a 20.0% by weight aqueous barium acetate solution (0.120 mol) was added. ) And 127 g (0.123 mol) of a 20.0% by weight aqueous strontium acetate solution were simultaneously added dropwise. The dropping was performed over 30 minutes while stirring at room temperature (20 ° C.). Then, 15% by weight
200 g of an aqueous ammonium carbonate solution was added dropwise with stirring over 60 minutes. After further stirring for 30 minutes, the solid was collected by filtration, washed with water and dried, and 61 g of a white fibrous material was obtained.
I got 30 g of the fibrous material was placed in an alumina crucible and heat-treated at 970 ° C. for 3 hours in an air atmosphere.
4.5 g of fibrous barium strontium titanate were obtained.

【0040】繊維状チタン酸バリウムストロンチウム
は、平均繊維径0.3μm、平均繊維長8μm、アスペ
クト比27であった。
The fibrous barium strontium titanate had an average fiber diameter of 0.3 μm, an average fiber length of 8 μm, and an aspect ratio of 27.

【0041】繊維状チタン酸バリウムストロンチウム
8.0gをプレス金型内に充填し、1t/cm2 の圧力
をかけ仮成形体を得た。この成形体を取り出し、マッフ
ル炉にて1350℃、2時間焼成し、焼結体を得た。得
られた焼結体の比重を求め、空隙率を算出したところ
3.2%であった。該焼結体の1GHzにおける比誘電
率を測定したところ1110であり、対数の混合則によ
り繊維状チタン酸バリウムストロンチウム自体の比誘電
率を算出すると1400となった。また誘電正接は0.
01であった。以下「BSTW」という。
A press mold was filled with 8.0 g of fibrous barium strontium titanate, and a pressure of 1 t / cm 2 was applied to obtain a temporary molded body. The molded body was taken out and fired in a muffle furnace at 1350 ° C. for 2 hours to obtain a sintered body. The specific gravity of the obtained sintered body was determined, and the porosity was calculated to be 3.2%. The relative dielectric constant of the sintered body at 1 GHz was measured to be 1110, and the relative dielectric constant of fibrous barium strontium titanate itself was calculated to be 1400 by the logarithmic mixing rule. The dielectric loss tangent is 0.
01. Hereinafter, it is referred to as “BSTW”.

【0042】参考例2(繊維状チタン酸バリウムの製
造) 繊維状チタニア水和物(TiO2 ・1/8H2 O、平均
繊維長15μm、平均繊維径0.3μm)20.0g
(0.244モル)を1リットルの脱イオン水に分散さ
せ、攪拌しながら25%アンモニア水を10ml滴下
し、pH9に調整した後、20重量%の酢酸バリウム水
溶液312g(0.244モル)を各々滴下した。滴下
は、室温(20℃)で攪拌しながら30分かけて行っ
た。その後、15重量%の炭酸アンモニウム水溶液20
0gを60分間かけて攪拌しながら滴下した。更に30
分間攪拌を続けた後、固形物を濾取し、水洗及び乾燥し
たところ、白色の繊維状物68gを得た。
Reference Example 2 (Production of fibrous barium titanate) 20.0 g of fibrous titania hydrate (TiO 2 1 / H 2 O, average fiber length 15 μm, average fiber diameter 0.3 μm)
(0.244 mol) was dispersed in 1 liter of deionized water, and 10 ml of 25% aqueous ammonia was added dropwise with stirring to adjust the pH to 9. Then, 312 g (0.244 mol) of a 20% by weight aqueous barium acetate solution was added. Each was dropped. The dropping was performed over 30 minutes while stirring at room temperature (20 ° C.). Thereafter, a 15% by weight aqueous solution of ammonium carbonate 20
0 g was added dropwise with stirring over 60 minutes. 30 more
After stirring was continued for minutes, the solid was collected by filtration, washed with water and dried to obtain 68 g of a white fibrous material.

【0043】この繊維状物30gをアルミナ製るつぼに
入れ、大気雰囲気中で980℃にて2時間加熱処理し、
白色の繊維状チタン酸バリウム24.3gを得た。
30 g of this fibrous material was placed in an alumina crucible and heated at 980 ° C. for 2 hours in an air atmosphere.
24.3 g of a white fibrous barium titanate was obtained.

【0044】この繊維状チタン酸バリウムは、平均繊維
径1μm、平均繊維長10μm、平均アスペクト比10
であった。このものの1GHzにおける比誘電率は10
00、誘電正接は0.02であった。以下BTW(A)
という。
The fibrous barium titanate has an average fiber diameter of 1 μm, an average fiber length of 10 μm, and an average aspect ratio of 10 μm.
Met. Its relative dielectric constant at 1 GHz is 10
00 and the dielectric loss tangent was 0.02. BTW (A)
That.

【0045】比較参考例1 加熱処理温度を1050℃とする以外は、参考例1と同
様に操作し、平均繊維径1μm、平均繊維長2μm、平
均アスペクト比2の繊維状チタン酸バリウムを得た。こ
のものの1GHzにおける比誘電率は850、誘電正接
は0.03であった。以下BTW(B)という。
Comparative Reference Example 1 The procedure of Reference Example 1 was repeated, except that the heat treatment temperature was changed to 1050 ° C., to obtain a fibrous barium titanate having an average fiber diameter of 1 μm, an average fiber length of 2 μm, and an average aspect ratio of 2. . The dielectric constant at 1 GHz was 850 and the dielectric loss tangent was 0.03. Hereinafter, it is referred to as BTW (B).

【0046】参考例3(繊維状チタン酸カルシウムマグ
ネシウムの製造) 酢酸バリウム水溶液及び酢酸ストロンチウム水溶液に代
えて、20重量%の塩化カルシウム水溶液67.7g及
び20重量%の塩化マグネシウム溶液58.1gを用
い、炭酸アンモニウム水溶液の使用量を204gとし、
且つ加熱処理温度を980℃とする以外は、参考例1と
同様に操作し、繊維状チタン酸カルシウムマグネシウム
を得た。
Reference Example 3 (Production of Fibrous Calcium Magnesium Titanate) Instead of barium acetate aqueous solution and strontium acetate aqueous solution, 67.7 g of 20% by weight calcium chloride aqueous solution and 58.1 g of 20% by weight magnesium chloride solution were used. , The amount of the aqueous ammonium carbonate solution to be 204 g,
Except that the heat treatment temperature was 980 ° C., the same operation as in Reference Example 1 was performed to obtain fibrous calcium magnesium titanate.

【0047】繊維状チタン酸カルシウムマグネシウム
は、平均繊維径0.2μm、平均繊維長8μm、平均ア
スペクト比40であった。このものの1GHzにおける
比誘電率は1100、誘電正接は0.008であった。
以下「CMTW」という。
The fibrous calcium magnesium titanate had an average fiber diameter of 0.2 μm, an average fiber length of 8 μm, and an average aspect ratio of 40. The dielectric constant at 1 GHz was 1100 and the dielectric loss tangent was 0.008.
Hereinafter, it is referred to as “CMWT”.

【0048】実施例1 表1に示す配合割合(重量%)で、環状ポリオレフィン
樹脂(商品名:ゼオネックス280、日本ゼオン(株)
製、1GHzにおける比誘電率2.30、誘電正接2.
3×10-4)と繊維状チタン酸バリウム(参考例2のB
TW(A))とを混合し、本組成物のペレットを得た。
Example 1 A cyclic polyolefin resin (trade name: ZEONEX 280, manufactured by Nippon Zeon Co., Ltd.) at the mixing ratio (% by weight) shown in Table 1
1.30, relative dielectric constant at 1 GHz, dielectric loss tangent
3 × 10 −4 ) and fibrous barium titanate (B in Reference Example 2)
TW (A)) to obtain pellets of the present composition.

【0049】混合には、二軸押出機(商品名:PCM4
5、池貝鉄工(株)製)を用い、シリンダー温度300
℃にて環状ポリオレフィン樹脂を溶融した後、チタン酸
バリウム繊維を添加するサイドフィード方式を採用し、
混合後にストランドカットを行って本組成物のペレット
を得た。
For mixing, a twin screw extruder (trade name: PCM4)
5, Ikekai Iron Works Co., Ltd.) and cylinder temperature 300
After melting the cyclic polyolefin resin at ℃, adopt a side feed method of adding barium titanate fiber,
After mixing, strand cutting was performed to obtain pellets of the present composition.

【0050】得られたペレットを用い、下記の条件でJ
IS試験片を射出成形し、誘電特性及び物理的強度を測
定した。結果を表1に示す。
Using the pellets obtained, J
The IS specimen was injection molded and the dielectric properties and physical strength were measured. Table 1 shows the results.

【0051】射出成形機…商品名:FS−150、日精
樹脂工業(株)製 シリンダー温度290℃、金型温度130℃、射出圧力
800kg/cm2 比較例1 繊維状充填材として、繊維状チタン酸バリウム(比較参
考例1のBTW(B))又は繊維状チタン酸カリウム
(商品名:ティスモD、大塚化学(株)製、平均繊維径
0.4μm、平均繊維長15μm、平均アスペクト比:
38、1GHzにおける比誘電率:17、誘電正接:
0.13、「PTW(A)」という)を用いる以外は、
実施例1と同様にして試験片を得、物性測定を行った。
結果を表1に示す。
Injection molding machine: trade name: FS-150, manufactured by Nissei Plastics Co., Ltd. Cylinder temperature 290 ° C., mold temperature 130 ° C., injection pressure 800 kg / cm 2 Comparative Example 1 Fibrous titanium as fibrous filler Barium acid (BTW (B) of Comparative Reference Example 1) or fibrous potassium titanate (trade name: Tismo D, manufactured by Otsuka Chemical Co., Ltd., average fiber diameter 0.4 μm, average fiber length 15 μm, average aspect ratio:
38, relative dielectric constant at 1 GHz: 17, dielectric loss tangent:
0.13, referred to as "PTW (A)")
Test pieces were obtained in the same manner as in Example 1, and physical properties were measured.
Table 1 shows the results.

【0052】BTW(B)は、誘電特性は本発明の範囲
にあるが、寸法が本発明の範囲にない繊維状物である。
BTW (B) is a fibrous material whose dielectric properties are within the scope of the present invention but whose dimensions are not within the scope of the present invention.

【0053】PTW(A)は、寸法は本発明の範囲にあ
るが、誘電特性は本発明の範囲ではない繊維状物であ
る。
PTW (A) is a fibrous material whose dimensions are within the scope of the present invention, but whose dielectric properties are not within the scope of the present invention.

【0054】[0054]

【表1】 [Table 1]

【0055】表1から、BTW(A)を含有する本発明
の樹脂組成物(実施例1)が、高い比誘電率及び低い誘
電正接を有し、物理的特性全般についても優れている。
As can be seen from Table 1, the resin composition of the present invention containing BTW (A) (Example 1) has a high relative dielectric constant and a low dielectric loss tangent, and is also excellent in overall physical properties.

【0056】これに対し、BTW(B)を含有する樹脂
組成物(比較例1、No.2、3)は、比誘電率及び誘
電正接の点では本発明の組成物と同程度に優れている
が、熱変形温度や曲げ弾性率が劣っており、電子部品用
としては不向きであることが明らかである。
On the other hand, the resin composition containing BTW (B) (Comparative Example 1, Nos. 2, 3) is as excellent as the composition of the present invention in terms of relative dielectric constant and dielectric loss tangent. However, the heat deformation temperature and flexural modulus are inferior, and it is clear that they are unsuitable for use in electronic components.

【0057】また、PTW(A)を含有する樹脂組成物
(比較例1、No.4)は、物理的強度全般は優れてい
るが、比誘電率は満足の行く程高くなく、且つ誘電正接
がかなり高いので、高周波用のアンテナ基板には不適当
であることも判る。
The resin composition containing PTW (A) (Comparative Example 1, No. 4) is excellent in overall physical strength, but is not sufficiently high in relative dielectric constant and has a dielectric loss tangent. Is considerably high, so that it is not suitable for a high frequency antenna substrate.

【0058】実施例2 マトリックス樹脂としてポリエーテルイミド樹脂(商品
名:ウルテム[1010−1000、日本ジーイープラ
スチック(株)製)を、また繊維状充填材として参考例
2の繊維状チタン酸バリウムストロンチウム(参考例2
のBSTW)をそれぞれ表2の配合割合(重量%)で用
い、シリンダー温度を340℃とする以外は実施例1と
同様にして、本組成物のペレットを得た。
Example 2 A polyetherimide resin (trade name: Ultem [1010-1000, manufactured by Nippon GE Plastics Co., Ltd.]) was used as a matrix resin, and the fibrous barium strontium titanate of Reference Example 2 was used as a fibrous filler. Reference example 2
In the same manner as in Example 1 except that the cylinder temperature was set to 340 ° C. to obtain pellets of the present composition.

【0059】得られたペレットを用い、下記の条件でJ
IS試験片を射出成形し、誘電特性及び物理的強度を測
定した。結果を表2に示す。
Using the obtained pellets, J
The IS specimen was injection molded and the dielectric properties and physical strength were measured. Table 2 shows the results.

【0060】射出成形機(商品名:FS−150、日精
樹脂工業(株)製) シリンダー温度370℃、金型温度120℃、射出圧力
700kg/cm2 比較例2 無機充填材として、粒子状チタン酸バリウムストロンチ
ウム(平均粒径0.8μm、共立窯業(株)製、「BS
T」とする)又は繊維状チタン酸カリウム(商品名:テ
ィスモN、大塚化学(株)製、平均繊維径0.4μm、
平均繊維長15μm、平均アスペクト比:38、1GH
zにおける比誘電率:18、誘電正接:0.11、「P
TW(B)」とする)を用いる以外は、実施例2と同様
にして試験片を得、物性測定を行った。結果を表2に示
す。
Injection molding machine (trade name: FS-150, manufactured by Nissei Plastic Industry Co., Ltd.) Cylinder temperature: 370 ° C., mold temperature: 120 ° C., injection pressure: 700 kg / cm 2 Comparative Example 2 Particulate titanium as inorganic filler Barium strontium acid (average particle size 0.8 μm, manufactured by Kyoritsu Ceramics Co., Ltd., “BS
T ") or fibrous potassium titanate (trade name: Tismo N, manufactured by Otsuka Chemical Co., Ltd., average fiber diameter 0.4 μm,
Average fiber length 15 μm, average aspect ratio: 38, 1GH
relative permittivity at z: 18, dielectric tangent: 0.11, "P
TW (B) ”), a test piece was obtained and physical properties were measured in the same manner as in Example 2. Table 2 shows the results.

【0061】尚、PTW(A)は、寸法は本発明の範囲
にあるが、誘電特性は本発明の範囲ではない繊維状物で
ある。
The PTW (A) is a fibrous material whose dimensions are within the scope of the present invention, but whose dielectric properties are not within the scope of the present invention.

【0062】[0062]

【表2】 [Table 2]

【0063】表2から、BSTWを含有する本発明の樹
脂組成物(実施例2)は、高比誘電率及び低誘電正接を
有し、物理的特性にも優れており、しかも高周波帯域に
なる程低誘電正接を保持したまま比誘電率が増大し、信
号の伝達効率等が向上することが明らかである。
From Table 2, it can be seen that the resin composition of the present invention containing BSTW (Example 2) has a high relative dielectric constant and a low dielectric loss tangent, has excellent physical properties, and has a high frequency band. It is apparent that the lower the dielectric loss tangent is, the higher the relative dielectric constant is, and the higher the signal transmission efficiency is.

【0064】一方、粒状であるBSTを含有する樹脂組
成物(比較例2、No.2、3)は、1MHzにおける
比誘電率及び誘電正は本発明の組成物と同程度である
が、3GHzの高周波帯域でも比誘電率の向上は認めら
れず、加えて、曲げ強度、曲げ弾性率、荷重たわみ温度
等の物理的特性の点で著しく劣っている。
On the other hand, the resin composition containing the granular BST (Comparative Example 2, Nos. 2 and 3) has the same relative dielectric constant and dielectric constant at 1 MHz as the composition of the present invention, but 3 GHz. No improvement in the relative permittivity was observed even in the high-frequency band, and the physical properties such as flexural strength, flexural modulus, and deflection temperature under load were remarkably inferior.

【0065】PTW(B)を含有する樹脂組成物(比較
例2、No.4)は、物理的特性は本発明のものと同程
度であるが、誘電正接が高く好ましくない。
The resin composition containing PTW (B) (Comparative Example 2, No. 4) has physical properties similar to those of the present invention, but has a high dielectric loss tangent and is not preferred.

【0066】実施例3 マトリックス樹脂としてサーモトロピック液晶ポリエス
テル樹脂(商品名:ベクトラC950、ポリプラスチッ
クス(株)製)を、繊維状充填材として参考例1の繊維
状チタン酸カルシウムマグネシウム(参考例3のCMT
W)を、更にエッチング助剤としてピロリン酸カルシウ
ム(平均粒子径約10μm、太平化学産業(株)製)を
それぞれ表3の配合割合(重量%)で用い、シリンダー
温度を310℃とする以外は実施例1と同様にして、本
組成物のペレットを得た。
Example 3 Thermotropic liquid crystal polyester resin (trade name: Vectra C950, manufactured by Polyplastics Co., Ltd.) was used as the matrix resin, and the fibrous calcium magnesium titanate of Reference Example 1 (Reference Example 3) was used as the fibrous filler. CMT
W) was further performed using calcium pyrophosphate (average particle size of about 10 μm, manufactured by Taihei Chemical Industry Co., Ltd.) as an etching aid at the compounding ratio (% by weight) shown in Table 3 and a cylinder temperature of 310 ° C. In the same manner as in Example 1, pellets of the present composition were obtained.

【0067】得られたペレットを用い、下記の条件を採
用する以外は実施例1と同様にしてJIS試験片を射出
成形し、誘電特性及び物理的強度を測定した。結果を表
3に示す。
Using the obtained pellets, JIS test pieces were injection molded in the same manner as in Example 1 except that the following conditions were employed, and the dielectric properties and physical strength were measured. Table 3 shows the results.

【0068】シリンダー温度330℃、金型温度120
℃、射出圧力800kg/cm2 比較例3 繊維状無機充填材として、繊維状チタン酸カリウム(テ
ィスモN、PTW(B))を用いる以外は、実施例3と
同様にして成形品を得、物性測定を行った。結果を表3
に示す。
Cylinder temperature 330 ° C., mold temperature 120
° C, injection pressure 800 kg / cm 2 Comparative Example 3 A molded product was obtained in the same manner as in Example 3 except that fibrous potassium titanate (Tismo N, PTW (B)) was used as the fibrous inorganic filler. A measurement was made. Table 3 shows the results
Shown in

【0069】[0069]

【表3】 [Table 3]

【0070】表3から、CMTWを含有する本発明の樹
脂組成物(実施例3)は、物理的特性の点では、PTW
(B)を含有する樹脂組成物(比較例3、No.2、
3)とほぼ同程度であるが、比誘電率は高く、誘電正接
は著しく低いことが判る。また、実施例2のBSTWと
同様、高周波帯域では比誘電率が増大することも判る。
尚、エッチング助剤として配合したピロリン酸カルシウ
ム粉末は、誘電特性を向上させる効果がほとんどないこ
とが確認できる。
From Table 3, it can be seen that the resin composition of the present invention containing CMTW (Example 3) shows PTW in physical properties.
Resin composition containing (B) (Comparative Example 3, No. 2,
Although it is almost the same as 3), it can be seen that the relative dielectric constant is high and the dielectric loss tangent is extremely low. It is also found that the relative dielectric constant increases in the high frequency band, as in the case of the BSTW of Example 2.
In addition, it can be confirmed that the calcium pyrophosphate powder blended as an etching aid has almost no effect of improving the dielectric properties.

【0071】実施例4 マトリックス樹脂として、ポリエーテルイミド樹脂(ウ
ルテム[1010−1000)、PPE樹脂(商品名:
PPE P101L、旭化成工業(株)製、2,6−ジ
メチルフェニレンエーテルのホモポリマー)及びエポキ
シ変性スチレン−スチレングラフト共重合体(商品名:
RESEDA GP−500、東亜合成化学工業(株)
製)を、繊維状充填材として繊維状チタン酸バリウム
(参考例2のBTW(A))又は繊維状チタン酸バリウ
ムストロンチウム(参考例3のBSTW)を表4に示す
配合割合(重量%)で用い、シリンダー温度を340℃
とする以外は実施例1と同様にして、本組成物のペレッ
トを得た。
Example 4 As a matrix resin, a polyetherimide resin (Ultem [1010-1000]) and a PPE resin (trade name:
PPE P101L, manufactured by Asahi Kasei Corporation, 2,6-dimethylphenylene ether homopolymer) and epoxy-modified styrene-styrene graft copolymer (trade name:
RESEDA GP-500, Toa Gosei Chemical Industry Co., Ltd.
) As a fibrous filler in the proportion (% by weight) shown in Table 4 of fibrous barium titanate (BTW (A) of Reference Example 2) or fibrous barium strontium titanate (BSTW of Reference Example 3). Use, cylinder temperature 340 ℃
A pellet of the present composition was obtained in the same manner as in Example 1 except for the above.

【0072】得られたペレットを用い、下記の条件を採
用する以外は実施例1と同様にしてJIS試験片を射出
成形し、誘電特性及び物理的強度を測定した。結果を表
4に示す。
Using the obtained pellets, JIS test pieces were injection molded in the same manner as in Example 1 except that the following conditions were employed, and the dielectric properties and physical strength were measured. Table 4 shows the results.

【0073】射出成形機…商品名:ミニマット26/1
5B、住友重機械工業(株) シリンダー温度340℃、金型温度80℃、射出圧力1
400kg/cm2 比較例4 無機充填材として、粒子状チタン酸バリウム(平均粒
径:0.5μm、富士チタン工業(株)製、「BT」と
する)又は繊維状チタン酸カリウム(ティスモN、PT
W(B))を用いる以外は、実施例4と同様にして試験
片を得、物性測定を行った。結果を表4に示す。
Injection molding machine ... Product name: Minimat 26/1
5B, Sumitomo Heavy Industries, Ltd. Cylinder temperature 340 ° C, mold temperature 80 ° C, injection pressure 1
400 kg / cm 2 Comparative Example 4 As an inorganic filler, particulate barium titanate (average particle size: 0.5 μm, manufactured by Fuji Titanium Co., Ltd., “BT”) or fibrous potassium titanate (Tismo N, PT
Except for using W (B)), a test piece was obtained and physical properties were measured in the same manner as in Example 4. Table 4 shows the results.

【0074】[0074]

【表4】 [Table 4]

【0075】表4から、BTW(A)又はBSTWを含
有する本発明の樹脂組成物は、高比誘電率及び低誘電正
接を有し、機械的物性及び耐熱性(熱変形温度)にも優
れていることが判る。更に、3GHzの高周波帯域では
比誘電率の著しい向上が認められる。
From Table 4, it can be seen that the resin composition of the present invention containing BTW (A) or BSTW has a high relative dielectric constant and a low dielectric loss tangent, and is also excellent in mechanical properties and heat resistance (heat distortion temperature). You can see that Further, in the high frequency band of 3 GHz, a remarkable improvement in the relative permittivity is recognized.

【0076】一方、粒状であるBTを含有する樹脂組成
物(比較例4、No.2)は、1MHzの比誘電率及び
誘電正接は本発明の組成物と同等であるが、3GHzで
はいずれの特性も劣っており、更に機械的強度も著しく
低い。またPTWは、物理的な補強効果は高いが、満足
し得る誘電特性(特に誘電正接)を付与できないことが
判る(比較例4、No.3、4)。
On the other hand, the resin composition containing the granular BT (Comparative Example 4, No. 2) has the same relative dielectric constant and dielectric loss tangent at 1 MHz as the composition of the present invention. The properties are inferior and the mechanical strength is also extremely low. Further, it can be seen that PTW has a high physical reinforcing effect, but cannot provide satisfactory dielectric properties (especially, dielectric loss tangent) (Comparative Examples 4, Nos. 3, 4).

【0077】実施例5 マトリックス樹脂としてフッ素樹脂(商品名:ネオフロ
ンPFA AP−210、ダイキン工業(株))を、繊
維状充填材として繊維状チタン酸バリウムストロンチウ
ム(参考例3のBSTW)を表5に示す配合割合(重量
%)で用い、シリンダー温度を390℃とする以外は実
施例1と同様にして、本発明組成物のペレットを得た。
Example 5 A fluororesin (trade name: Neoflon PFA AP-210, Daikin Industries, Ltd.) was used as the matrix resin, and fibrous barium strontium titanate (BSTW of Reference Example 3) was used as the fibrous filler. And a pellet of the composition of the present invention was obtained in the same manner as in Example 1 except that the cylinder temperature was 390 ° C.

【0078】得られたペレットを用い、下記の条件を採
用する以外は実施例1と同様にしてJIS試験片を射出
成形し、誘電特性及び物理的強度を測定した。結果を表
4に示す。
Using the obtained pellets, JIS test pieces were injection molded in the same manner as in Example 1 except that the following conditions were employed, and the dielectric properties and physical strength were measured. Table 4 shows the results.

【0079】シリンダー温度380℃、金型温度200
℃、射出圧力500kg/cm2 比較例5 無機充填材として、粒子状チタン酸バリウムストロンチ
ウム(BST)又はEガラス短繊維(直径13μm、長
さ1.5mm、アスペクト比約115、日本電気硝子繊
維(株)製)を用いる以外は、実施例5と同様にして試
験片を得、物性測定を行った。結果を表5に示す。
Cylinder temperature 380 ° C., mold temperature 200
C., injection pressure 500 kg / cm 2 Comparative Example 5 As an inorganic filler, barium strontium titanate (BST) or E glass short fiber (diameter 13 μm, length 1.5 mm, aspect ratio about 115, Nippon Electric Glass Fiber ( A test piece was obtained and the physical properties were measured in the same manner as in Example 5 except for using). Table 5 shows the results.

【0080】[0080]

【表5】 [Table 5]

【0081】表5から、BSTWを含有する本発明の樹
脂組成物は、高比誘電率及び低誘電正接を有し、機械的
物性及び耐熱性(熱変形温度)にも優れていることが判
る。更に、3GHz以上の高周波帯域では比誘電率の著
しい向上が認められる。
From Table 5, it can be seen that the resin composition of the present invention containing BSTW has a high relative dielectric constant and a low dielectric loss tangent, and is also excellent in mechanical properties and heat resistance (thermal deformation temperature). . Further, in the high frequency band of 3 GHz or more, a remarkable improvement in the relative permittivity is recognized.

【0082】一方、粒状であるBSTを含有する樹脂組
成物(比較例4、No.2)は、1MHzの比誘電率及
び誘電正接は本発明の組成物と同等であるが、3GHz
以上ではいずれの特性も著しく劣っており、更に機械的
強度も著しく低い。またガラス繊維を含有する樹脂組成
物(比較例5、No.3)は、誘電特性(特に誘電正
接)の付与効果が小さく、その上機械的物性の補強効果
も不十分である。
On the other hand, the resin composition containing BST in a granular form (Comparative Example 4, No. 2) has the same relative dielectric constant and dielectric loss tangent at 1 MHz as the composition of the present invention, but 3 GHz.
In the above, all the characteristics are remarkably inferior and the mechanical strength is remarkably low. Further, the resin composition containing glass fiber (Comparative Example 5, No. 3) has a small effect of imparting dielectric properties (particularly, a dielectric loss tangent), and also has an insufficient effect of reinforcing mechanical properties.

【0083】実施例6 マトリックス樹脂としてフェノール型エポキシ樹脂(商
品名:EPCLON850、大日本インキ化学工業
(株)製)を、繊維状充填材として繊維状チタン酸バリ
ウム(参考例2のBTW(A))又は繊維状チタン酸バ
リウムストロンチウム(参考例3のBSTW)をそれぞ
れ用い、表6の配合割合(重量%)で充分混合した。こ
れに、硬化剤であるメタキシリンジアミンを15phR
(エポキシ樹脂100重量部に対して15重量部)添加
して充分に混合し分散させた後、真空脱泡し、本組成物
を得た。
Example 6 A phenol type epoxy resin (trade name: EPCLON850, manufactured by Dainippon Ink and Chemicals, Inc.) was used as a matrix resin, and fibrous barium titanate (BTW (A) of Reference Example 2) was used as a fibrous filler. ) Or fibrous barium strontium titanate (BSTW of Reference Example 3), respectively, and sufficiently mixed at the blending ratio (% by weight) in Table 6. To this, 15 phr R
(15 parts by weight with respect to 100 parts by weight of the epoxy resin) was added, mixed well and dispersed, and then degassed under vacuum to obtain the present composition.

【0084】テフロンシートの上に厚さ3mmのスペー
サーを周囲に置き、上記本組成物を流延して3時間室温
に放置後、130℃で3時間加熱硬化させ、曲げ強度及
び荷重撓み温度(18.5kgf/cm2 荷重)を測定
した。また、サーフコム300B(商品名、(株)東京
精密製)を用い、表面粗さ(中心平均粗さRa)を測定
した。結果を表6に示す。
A spacer having a thickness of 3 mm was placed around the Teflon sheet, and the composition was cast and allowed to stand at room temperature for 3 hours. The composition was cured by heating at 130 ° C. for 3 hours. 18.5 kgf / cm 2 load) was measured. The surface roughness (center average roughness Ra) was measured using Surfcom 300B (trade name, manufactured by Tokyo Seimitsu Co., Ltd.). Table 6 shows the results.

【0085】比較例6 繊維状充填材として、Eガラス短繊維(直径13μm、
長さ1.5mm、アスペクト比約115、日本電気硝子
繊維(株)製)又は繊維状チタン酸カリウム(ティスモ
D、PTW(A))を用いる以外は、実施例6と同様に
して操作を行い、曲げ強度、荷重撓み温度及び表面粗さ
を測定した。結果を表6に示す。
Comparative Example 6 As a fibrous filler, E glass short fibers (diameter 13 μm,
The same operation as in Example 6 was performed except that 1.5 mm in length, an aspect ratio of about 115, manufactured by Nippon Electric Glass Fiber Co., Ltd. or fibrous potassium titanate (Tismo D, PTW (A)) was used. , Bending strength, load deflection temperature and surface roughness were measured. Table 6 shows the results.

【0086】[0086]

【表6】 [Table 6]

【0087】表6から、いずれの場合も機械的強度の補
強効果は同等であるが、BTW(A)又はBSTWを含
有する樹脂組成物(実施例6)は、ガラス繊維又はPT
Wを含有する樹脂組成物に比し(比較例6)、特に誘電
正接が低く、誘電特性に優れていることが判る。更に、
ガラス繊維を含有すると、組成物の表面平滑性が著しく
低下し、高周波用の電子部品としては使用できないこと
が判る。
From Table 6, it can be seen that the reinforcing effect of the mechanical strength is the same in any case, but the resin composition containing BTW (A) or BSTW (Example 6) is made of glass fiber or PT.
Compared with the resin composition containing W (Comparative Example 6), it is found that the dielectric loss tangent is particularly low and the dielectric properties are excellent. Furthermore,
It is found that when glass fibers are contained, the surface smoothness of the composition is remarkably reduced, and the composition cannot be used as a high-frequency electronic component.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 楮本 あゆみ 徳島県徳島市川内町加賀須野463番地 大塚化学株式会社徳島研究所内 (72)発明者 川上 尚吾 大阪府大阪市中央区大手通3丁目2番27 号 大塚化学株式会社内 (58)調査した分野(Int.Cl.6,DB名) C08K 7/00 - 7/14 H01B 3/00 - 3/48 H01Q 1/38 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ayumi Kuromoto 463 Kagasuno, Kawauchi-cho, Tokushima City, Tokushima Prefecture Inside the Tokushima Research Laboratory, Otsuka Chemical Co., Ltd. No. 27 Otsuka Chemical Co., Ltd. (58) Field surveyed (Int. Cl. 6 , DB name) C08K 7/00-7/14 H01B 3/00-3/48 H01Q 1/38

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 合成樹脂マトリックス中に、繊維径3μ
m以下、繊維長5μm以上、アスペクト比3以上であり
且つ1GHz以上の高周波域における比誘電率が50以
上、誘電正接が0.1以下であるチタン酸アルカリ土類
金属塩の繊維状物を含有させてなる樹脂組成物であっ
て、該樹脂組成物の1GHz以上の高周波域における比
誘電率が7.0以上、誘電正接が10-2以下であること
を特徴とする高周波通信機のアンテナ基板材料成形用樹
脂組成物。
1. A fiber having a fiber diameter of 3 μm in a synthetic resin matrix.
m, a fiber length of 5 μm or more, an aspect ratio of 3 or more, and a fibrous material of an alkaline earth metal titanate salt having a relative dielectric constant of 50 or more and a dielectric loss tangent of 0.1 or less in a high frequency region of 1 GHz or more of 0.1 or less. An antenna substrate for a high-frequency communication device, characterized in that the resin composition has a relative permittivity of 7.0 or more and a dielectric loss tangent of 10 -2 or less in a high-frequency range of 1 GHz or more of the resin composition. A resin composition for material molding.
【請求項2】チタン酸アルカリ土類金属塩の繊維状物
チタン酸ストロンチウムの繊維状物、チタン酸バリウム
ストロンチウムの繊維状物、チタン酸バリウムカルシウ
の繊維状物、チタン酸バリウムマグネシウムの繊維状
及びチタン酸バリウムマグネシウムの繊維状物からな
る群より選ばれた少なくとも1種である請求項1に記載
の樹脂組成物。
2. A fibrous material alkaline earth metal titanate is fibrous material strontium titanate, fibrous materials barium strontium titanate, fibrous material barium calcium titanate, fibrous barium titanate magnesium
The resin composition according to claim 1, wherein the resin composition is at least one selected from the group consisting of a product and a barium magnesium titanate fibrous material.
【請求項3】チタン酸アルカリ土類金属塩の繊維状物
チタン酸バリウムストロンチウムの繊維状物である請求
項1に記載の樹脂組成物。
3. A resin composition according to claim 1 fibrous material alkaline earth metal titanate is a fibrous material barium strontium titanate.
JP6177064A 1994-07-28 1994-07-28 Resin composition for molding antenna substrate material of high frequency communication equipment Expired - Fee Related JP2873541B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6177064A JP2873541B2 (en) 1994-07-28 1994-07-28 Resin composition for molding antenna substrate material of high frequency communication equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6177064A JP2873541B2 (en) 1994-07-28 1994-07-28 Resin composition for molding antenna substrate material of high frequency communication equipment

Publications (2)

Publication Number Publication Date
JPH0841247A JPH0841247A (en) 1996-02-13
JP2873541B2 true JP2873541B2 (en) 1999-03-24

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Country Link
JP (1) JP2873541B2 (en)

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* Cited by examiner, † Cited by third party
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US5962122A (en) * 1995-11-28 1999-10-05 Hoechst Celanese Corporation Liquid crystalline polymer composites having high dielectric constant
EP0902048B1 (en) * 1997-09-11 2005-11-23 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation
AU1648701A (en) 1999-11-30 2001-06-12 Otsuka Chemical Co. Ltd. Resin composition and flexible printed circuit board
WO2002061765A1 (en) * 2001-01-29 2002-08-08 Jsr Corporation Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
JP3960129B2 (en) * 2002-05-28 2007-08-15 松下電工株式会社 Thermoplastic resin composition and molded article
DE602006021155D1 (en) 2005-02-03 2011-05-19 Asahi Kasei Chemicals Corp RESIN COMPOSITION FOR ELECTRONIC AND ELECTRICAL COMPONENTS OF HIGH FREQUENCY APPLICATIONS AND SHAPED PRODUCT THEREOF
EP1970412A4 (en) 2005-12-16 2009-09-16 Polyplastics Co Polyarylene sulfide resin composition
US20090309259A1 (en) * 2008-06-12 2009-12-17 General Electric Company High temperature polymer composites comprising antiferroelectric particles and methods of making the same
JP2011001400A (en) * 2009-06-16 2011-01-06 Risho Kogyo Co Ltd Resin composition with high dielectric constant, and resin sheet with high dielectric constant and copper foil with resin with high dielectric constant obtained by using the same
JP2011001411A (en) * 2009-06-17 2011-01-06 Risho Kogyo Co Ltd Prepreg using high dielectric constant resin composition and copper-clad laminate
WO2012006416A2 (en) * 2010-07-08 2012-01-12 Rensselaer Polytechnic Institute High dielectric constant ceramic filler particles, composites and methods for making same
WO2024029207A1 (en) * 2022-08-03 2024-02-08 株式会社村田製作所 Liquid crystal polymer film and laminate comprising same, and liquid crystal polymer film manufacturing method

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