TW201044963A - Method of forming EMI shield on plastic workpiece - Google Patents
Method of forming EMI shield on plastic workpiece Download PDFInfo
- Publication number
- TW201044963A TW201044963A TW99120810A TW99120810A TW201044963A TW 201044963 A TW201044963 A TW 201044963A TW 99120810 A TW99120810 A TW 99120810A TW 99120810 A TW99120810 A TW 99120810A TW 201044963 A TW201044963 A TW 201044963A
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- plastic workpiece
- protection layer
- interference protection
- electromagnetic interference
- Prior art date
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 68
- 229920003023 plastic Polymers 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004140 cleaning Methods 0.000 claims abstract description 39
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 30
- 238000004544 sputter deposition Methods 0.000 claims abstract description 7
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 239000007789 gas Substances 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000012986 modification Methods 0.000 claims description 4
- 230000004048 modification Effects 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 238000005336 cracking Methods 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 4
- 229910052786 argon Inorganic materials 0.000 claims 2
- 238000010616 electrical installation Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000005672 electromagnetic field Effects 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 239000004816 latex Substances 0.000 claims 1
- 229920000126 latex Polymers 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 35
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005488 sandblasting Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99120810A TW201044963A (en) | 2010-06-25 | 2010-06-25 | Method of forming EMI shield on plastic workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99120810A TW201044963A (en) | 2010-06-25 | 2010-06-25 | Method of forming EMI shield on plastic workpiece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201044963A true TW201044963A (en) | 2010-12-16 |
| TWI407900B TWI407900B (OSRAM) | 2013-09-01 |
Family
ID=45001521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99120810A TW201044963A (en) | 2010-06-25 | 2010-06-25 | Method of forming EMI shield on plastic workpiece |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201044963A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050375A (zh) * | 2011-10-14 | 2013-04-17 | 晟铭电子科技股份有限公司 | 屏蔽层制造方法 |
| TWI898368B (zh) * | 2023-12-25 | 2025-09-21 | 啟端光電股份有限公司 | 拼接膜和拼接顯示器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW374741B (en) * | 1997-09-08 | 1999-11-21 | Ind Tech Res Inst | Formation of a plasma-polymerized anti-fogging film and the manufacturing method |
| TWI276397B (en) * | 2003-03-21 | 2007-03-11 | Hon Hai Prec Ind Co Ltd | EMI-shielding assembly and method for the manufacture of same |
| TWM256683U (en) * | 2004-03-01 | 2005-02-01 | Uvat Technology Co Ltd | The device for the reduction of EMI induced by radio frequency source |
| US20050241671A1 (en) * | 2004-04-29 | 2005-11-03 | Dong Chun C | Method for removing a substance from a substrate using electron attachment |
| TW200638105A (en) * | 2006-06-05 | 2006-11-01 | Mikuni Denshi Kk | A forming apparatus for the plasma polymer film |
| TWM340684U (en) * | 2008-05-15 | 2008-09-11 | Dixen Vacuum Technology Co Ltd | Electronic instrument housing with anti-EMI covering structure |
-
2010
- 2010-06-25 TW TW99120810A patent/TW201044963A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050375A (zh) * | 2011-10-14 | 2013-04-17 | 晟铭电子科技股份有限公司 | 屏蔽层制造方法 |
| TWI898368B (zh) * | 2023-12-25 | 2025-09-21 | 啟端光電股份有限公司 | 拼接膜和拼接顯示器 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI407900B (OSRAM) | 2013-09-01 |
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