M340684 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種電子器材外殼，尤指一種具抗電 磁波干擾披覆構造之電子器材外殼。 【先前技術】 按，現今科技蓬勃發展，許多相關於電子方面的產品 相繼問世’同時也早已充斥在我們的生活當中，舉凡電腦、 筆記型電腦、行動電話..等不勝枚舉，但，伴隨著電子產 品的利用開發’相對於使用時產生的高頻電磁波所造成的 人體危害’目前係為各行業所廣泛討論的話題之一。 而為防止各類電子產品所產生的電磁波，以減少對人 體的危害程度，目前許多的產品會在電子產品會在電子產 品的外殼，進行防菽的_ 敝的處理，例如··筆記型電腦、行動電 話等產品的外殼設有防雷法、士 ，防电磁波的披覆裝置，而目前的防蔽 處理所知者有噴導電漆方 夺方式、無電解電鍍方式、以 隔離方式、真空鍍膜方式； 濁枫 其中該喷導電漆方式，係將導電粉末與丙稀酸樹脂 /+y，-/C 氨基甲酸樹脂混合形成之導電漆，將 θ ♦電漆會有磨損、剝落及電阻高等問 題0 另外該無電解電鍍 ^ Jr 七 式，係因電鍍時須將塑膠外殼浸 鍍在含有鹽酸、硫酸鎳、4 辇右主舲所^ 大亞恤酸鈉、曱醛、氫氧化鈉· · 寻有毋物i ，所以電鍍交 入欧美a na 易產生環境汙染的問題，無法符 口 &人吳日寺先進國家的 α ^ ^ 保要未，且當外殼丟棄之後無法 5 M340684 回收’而且具有導電電阻效果不佳’防蔽性弱等缺點。 而以金屬板隔離方式需要另外置設有_金屬板 為進-步的遮蔽，而—般平面式的外殼所置 無形狀之考慮，”她州配合各⑽=， :如：固定電路板、冷卻風扇·.等，常形成為凹凸 ::形狀，此時金屬板报難配合外殼形狀，形成凹凸不規 且不县：且金屬板因為模具及厚度問題’戶斤需的成本極高 電磁波。 名政的封閉二間，無法有效隔離 、”因此’-般的防蔽處理係以真空鍍膜方式為佳，而於 塑膠外殼内側表面鍍上低電阻之銅膜、銀膜、鋁膜或是其 他金屬膜而形成導電層，以提供電磁波屏蔽防制的有效 性’但是此真空鍍膜方式係需先將電子產品之塑膠外殼内 側先進行喷砂表面處理或噴塗料底層來解決附著不良的問 題，但是噴砂表面處理係將表面粗化，故戶斤需銀上導電層 的厚度會增加很多，因而增加製造成本，❿噴塗料底層的 成本增高，亦會有環保問題。 【新型内容】 有鑑於現有電子器材外殼防蔽電磁波處理的真空鍍膜 方法仍有需改進之處，本創作之主要目的在於提供:^具 抗電磁波干擾披覆構造之電子器材外殼，其可降低真空鍍 膜所需之製造成本，減少環保問題。 為達成以上的目的，本創作之具抗電磁波干擾披覆構 造之電子器材外殼係包括： 6 M340684 一殼體； 一附著層，其係設置於該殼體之内側； 一接著層’其係設置於該附著層異於該殼體之一側； 一導電層’其係設置於邊接著層異於該附著層之一 側；以及 一保護層’其係设置於该導電層異於該接著層之一 側。 -較佳的是’該接著層係為一單接著層。 ί 較佳的是，該接著層係為一雙接著層。 本創作可達到的具體功效包括： 1 ·本創作可於殼體内側形成高導電性的導電層，因 而可防蔽電子器材内部所產生的電磁波發散至外界，避免 電磁波對人體所產生的健康危害。由於本創作之導電層係 利用對於導電層具有高接著性的接著層，以及表面易於附 著之附著層而設置，因此導電層可方便地形成於殼體内 側，無須採用噴砂表面處理粗化殼體内側表面，因此可有 •效減少導電層所需之厚度，降低製造成本。 • 2本創作亦不需使用喷塗料底層的方式來結合導電 •層’除了可節省材料成本外，也可有效避免塗料所產生環 境汙染之問題。 、 【實施方式】 請^照第一圖與第二圖所示，本創作之較佳實施例係 包括一殼體（10)、一設置於該殼體（10)上之附著層（20)、 一設置於該附著層（20)上之接著層（30)、_設置於該接著 7 M340684 層（30)上之導電層（4〇)以及 護層（50)，其中； 設置於該導電層（4〇)上之保 該殼體（10)係可為塑膠或非導體材質，其可 器材如筆記型電腦、行動電話等之外殼； 1 4附者層（20)係設置於該殼體（1〇)之内側（11)，复 利用電漿表面處理技術形成於該殼體⑽之内側⑴、异 =該電漿表面處理技術係可藉由直流電源或射頻電源^ —力’利用電漿表面處理技術可對殼體（1〇)内側（11)表 貝及汙染物予以去除清潔，並於内側(⑴表面形成附 ^ 生佳的附著層⑽，當採用直流電源進行電漿表面處理 吟’可使用氣氛為氬氣5一5〇〇 sccm以及氧氣5一5〇〇 s咖， 電壓為1 00 - 5000伏特，當採用射頻電源進行電聚表面處 理日可，可使用軋氛為氬氣W _ s⑽以及氧氣5 — seem，功率為50-3000瓦特； 該接著層（30)係設置於該附著層（2〇)異於該殼體（ι〇) 之一側，其係以濺鍍或蒸鍍方式鍍於該附著層（2〇)，而可 提供對於導電材料的高接著力，該接著層（3〇)係可為單接 -著層（30)或雙接著層（30)，單接著層之材質可為氮化鈦 • (TiN)、鎳鉻（NiCr)、鉻（Cr)、銅鎳（CuNi)、氧化鋁（Al2〇3)、 氮化鉻（CrN)、氧化鉻（Cr〇x)、二氧化鈦（Ti〇2)、二氧化矽 (SiOD以及氧化銅（Cu0)等；雙接著層之材質可為氮化鈦/ 一氧化鈦（TiN/Ti02)、氮化鈦/二氧化矽（TiN/Si〇2)、氮化 鈦/鉻（TiN/Cr)、氮化鈦/鋁（TiN/A1)、氮化鈦/鎳鉻 (TiN/NiCr)、氮化鈦/氧化鋁（TiN/Al2〇3)、氮化鈦/銅鎳 8 M340684 ⑴n/⑽υ、鉻/二氧化紹（Cr/Al2〇3)、鉻/銅錄（c 鉻/氧化銅(c"㈣、絡/二氧化欽(c，、路/二氧化 石夕（Cr/SiOg)以及鉻/氮化鈦（cr/>piN)等； 該導電層(40)係設置於該接著層(3。)異於該附著層 (20)之-側’其係利用減錢或蒸鐘方式鑛於該接著層⑼ 上，該導電層⑽可為導電度高的金屬膜，導電層：阻抗 於殼體内側之對㈣為小於5歐姆，藉此可於殼體（⑻内 側（11)形成高導電性的導電層⑷），因而可防蔽電子哭材 内部所產生的電磁波發散至外界，避免電磁波對人體；產 生的健康危害； 該保護層（50)係設置於該導電層（4〇)異於該接著層 (30)之一側，該保護層（5〇)係可為不銹鋼、鎳、鉻、鎳鉻 等惰性金屬或合金’以及氮化鉻及類鑽碳(dlc)等材料， 其可利用濺鍍或蒸鍍方式附著於該導電層（4〇)上，而可避 免導電層（40)直接暴露於大氣中而造成氧化，進而防止該 導電層（40)的劣化脫落而影響電子器材外殼的外觀與防電 磁波性能。 • 本創作之較佳實施例由於無須進行喷砂表面處理，而 •係利用電漿表面處理形成表面易於附著之附著層（2〇)，以 及對於導電層（40)具有高接著性的接著層（3〇)，因此導電 層（40)可方便地形成於殼體（1〇)内側（11)，可有效減少導 電層（40)所需之厚度，降低製造成本。另外，亦可避免使 用噴塗料底層的方式，可降低材料成本及減少環保問題。 【圖式簡單說明】 9 M340684 第一圖係為本創作較佳實施例之立體圖。 第二圖係為本創作較佳實施例之剖面圖。 【主要元件符號說明】 ， (1 0)殼體 （11)内側 * (20)附著層 (30)接著層 ‘ （40)導電層 • (50)保護層M340684 VIII. New description: [New technical field] This creation is about an electronic equipment casing, especially an electronic equipment casing with anti-electromagnetic interference coating structure. [Previous technology] Press, today's technology is booming, and many products related to electronic products have come out one after another. At the same time, it has already been filled in our lives. Computers, notebook computers, mobile phones, etc. are numerous, but with The use of electronic products to develop 'human hazards caused by high-frequency electromagnetic waves generated during use' is currently one of the topics widely discussed in various industries. In order to prevent electromagnetic waves generated by various electronic products, in order to reduce the degree of harm to the human body, many products are currently processed in the outer casing of electronic products, such as · notebook computers. The outer casing of the products such as mobile phones and the like are provided with lightning protection methods, anti-electromagnetic wave covering devices, and the current anti-blocking treatments are known to be sprayed with conductive paint, electroless plating, isolation, vacuum coating. Mode; turbid maple, which is a conductive paint method, which is a conductive paint formed by mixing conductive powder with acrylic resin/+y,-/C urethane resin, which will cause wear, peeling and high resistance of θ ♦ electropaint. 0 In addition, the electroless plating ^ Jr seven type is required to immerse the plastic case in the plating containing hydrochloric acid, nickel sulfate, 4 辇 right main ^, sodium sulphate, furfural, sodium hydroxide · · There is a stolen object i, so electroplating into Europe and the United States a na is prone to environmental pollution problems, can not be the mouth & people Wuji Temple advanced country's α ^ ^ Baowei, and can not be recycled after the shell is discarded 5 M340684 And it has the disadvantage that the conductive resistance is not good, and the anti-blocking property is weak. In the form of metal plate isolation, it is necessary to additionally provide _ metal plate for the step-by-step shielding, and the general-like outer casing is placed without shape considerations," her state cooperates with each (10) =, such as: fixed circuit board, The cooling fan, etc., is often formed into a concave-convex:: shape. At this time, the metal plate is difficult to match the shape of the outer casing, and irregularities are formed and the county is not: and the metal plate has a very high electromagnetic wave due to the mold and the thickness problem. The two closed rooms cannot be effectively isolated. Therefore, the general anti-mask treatment is preferably vacuum coating, and the inner surface of the plastic casing is coated with a low-resistance copper film, silver film, aluminum film or other metal. The film forms a conductive layer to provide electromagnetic wave shielding effectiveness. However, this vacuum coating method requires the sandblasting surface treatment or the bottom layer of the plastic coating of the electronic product to solve the problem of poor adhesion, but sandblasting. The surface treatment will roughen the surface, so the thickness of the conductive layer on the silver will increase a lot, thus increasing the manufacturing cost, the cost of the bottom layer of the spray coating is increased, and there will be environmental problems. . [New content] In view of the need for improvement in the vacuum coating method for the anti-mask electromagnetic wave treatment of the existing electronic equipment casing, the main purpose of the creation is to provide: an electronic equipment casing with anti-electromagnetic interference coating structure, which can reduce the vacuum The manufacturing cost required for coating reduces environmental problems. In order to achieve the above objectives, the electronic device housing with the anti-electromagnetic interference coating structure includes: 6 M340684 a housing; an adhesive layer disposed on the inner side of the housing; The adhesion layer is different from one side of the housing; a conductive layer is disposed on a side of the adhesion layer different from the side of the adhesion layer; and a protective layer is disposed on the conductive layer different from the adhesive layer One side. Preferably, the layer is a single layer. Preferably, the adhesive layer is a double layer. The specific effects that can be achieved in this creation include: 1 · This creation can form a highly conductive conductive layer on the inside of the casing, so that the electromagnetic waves generated inside the electronic device can be dissipated to the outside to avoid the health hazard caused by electromagnetic waves to the human body. . Since the conductive layer of the present invention is provided by an adhesive layer having high adhesion to the conductive layer and an adhesion layer to which the surface is easy to adhere, the conductive layer can be conveniently formed on the inner side of the casing without using a sandblasted surface to treat the roughened casing. The inner surface, therefore, can reduce the thickness required for the conductive layer and reduce the manufacturing cost. • 2 The creation does not require the use of a primer layer to bond the conductive layer. In addition to saving material costs, it also effectively avoids the environmental pollution caused by the coating. The preferred embodiment of the present invention includes a casing (10) and an attachment layer (20) disposed on the casing (10). a bonding layer (30) disposed on the adhesion layer (20), a conductive layer (4) disposed on the layer 7 (30), and a cladding layer (50), wherein the conductive layer is disposed on the conductive layer (50) The casing (10) can be made of plastic or non-conductor material, and can be made of a casing such as a notebook computer or a mobile phone; and the attachment layer (20) is disposed on the casing ( The inner side (11) of the 〇) is formed on the inner side of the casing (10) by using a plasma surface treatment technique. (1) The plasma surface treatment technology can utilize the plasma by a DC power source or a radio frequency power source. The surface treatment technology can remove and clean the inside of the casing (1〇) and the contaminants, and form a good adhesion layer (10) on the inner side ((1) surface. When using DC power supply for plasma surface treatment吟'The atmosphere can be argon 5-5 〇〇sccm and oxygen 5 5 〇〇 s coffee, the voltage is 100-5000 volts, when The surface of the electropolymerization can be performed by using a radio frequency power source. The argon atmosphere W _ s (10) and the oxygen gas 5 - seem can be used, and the power is 50-3000 watts; the adhesive layer (30) is disposed on the adhesion layer (2 〇) Different from the side of the casing (1), which is plated or vapor-deposited on the adhesion layer (2〇) to provide a high adhesion to the conductive material, the bonding layer (3〇) The material may be a single-layer (30) or a double-layer (30), and the material of the single-layer layer may be titanium nitride (TiN), nickel-chromium (NiCr), chromium (Cr), copper-nickel (CuNi). Alumina (Al2〇3), chromium nitride (CrN), chromium oxide (Cr〇x), titanium dioxide (Ti〇2), cerium oxide (SiOD and copper oxide (Cu0), etc.; Titanium nitride/titanium oxide (TiN/Ti02), titanium nitride/cerium oxide (TiN/Si〇2), titanium nitride/chromium (TiN/Cr), titanium nitride/aluminum (TiN/A1) Titanium nitride/nickel chromium (TiN/NiCr), titanium nitride/alumina (TiN/Al2〇3), titanium nitride/copper nickel 8 M340684 (1)n/(10)υ, chromium/dioxide (Cr/Al2〇3) ), chrome / copper record (c chrome / copper oxide (c " (four), network / dioxide oxidation (c,, road) /Secondary oxide (Cr/SiOg) and chromium/titanium nitride (cr/>piN), etc.; the conductive layer (40) is disposed on the adhesion layer (3) different from the adhesion layer (20) - The side - is deposited on the adhesive layer (9) by means of a money reduction or steaming method. The conductive layer (10) can be a metal film with high conductivity, and the conductive layer: the pair of impedances on the inner side of the casing (4) is less than 5 ohms. This can form a highly conductive conductive layer (4) on the inner side of the casing (11), thereby preventing electromagnetic waves generated inside the electronic crying material from being radiated to the outside, and avoiding electromagnetic waves to the human body; the health hazard; (50) is disposed on the side of the conductive layer (4) different from the side of the adhesive layer (30), and the protective layer (5〇) may be an inert metal or alloy such as stainless steel, nickel, chromium, nickel chrome, and the like Materials such as chromium nitride and diamond-like carbon (dlc) can be attached to the conductive layer by sputtering or evaporation, and the conductive layer (40) can be prevented from being directly exposed to the atmosphere to cause oxidation. Further, the deterioration of the conductive layer (40) is prevented from falling off, which affects the appearance and electromagnetic wave resistance of the electronic device casing. • The preferred embodiment of the present invention utilizes a plasma surface treatment to form an adhesion layer (2〇) which is easy to adhere to the surface, and a bonding layer having a high adhesion to the conductive layer (40), since it is not necessary to perform a sandblasting surface treatment. (3〇), therefore, the conductive layer (40) can be conveniently formed on the inner side (11) of the casing (1), which can effectively reduce the thickness required for the conductive layer (40) and reduce the manufacturing cost. In addition, the use of the primer layer can be avoided, which can reduce material costs and reduce environmental problems. BRIEF DESCRIPTION OF THE DRAWINGS 9 M340684 The first figure is a perspective view of a preferred embodiment of the present invention. The second drawing is a cross-sectional view of a preferred embodiment of the present invention. [Main component symbol description], (1 0) Housing (11) inside * (20) Adhesive layer (30) Adhesive layer ‘ (40) Conductive layer • (50) Protective layer