1 201044082 六、發明說明： 【明所屬之技名好領域;1 發明領域 本發明係有關於貼合上基板與下基板之基板貼合裝置 及基板貼合方法。 【先前技名好j 發明背景 .0 於液晶顯示面板之製造中，於真空狀態下經由作為接 著劑之密封劑貼合上下二片基板(玻璃基板)(例如參照專利 文獻1)。 先行技術文獻 專利文獻 - 專利文獻1 :日本特開2000-66163號公報1 201044082 VI. Description of the Invention: [Technical Fields of the Ming Dynasty] 1 Field of the Invention The present invention relates to a substrate bonding apparatus and a substrate bonding method for bonding an upper substrate and a lower substrate. In the manufacture of a liquid crystal display panel, the upper and lower two substrates (glass substrates) are bonded together in a vacuum state via a sealant as an adhesive (for example, refer to Patent Document 1). Advance Technical Literature Patent Literature - Patent Document 1: Japanese Patent Laid-Open Publication No. 2000-66163
I：發明内容:J 發明概要 發明欲解決之課題 於此種貼合裝置中，藉由如下之動作進行上下二片基 板之貼合。 首先，於真空腔室内，對各自之基板保持面相對地上 下配置之上基台與下基台供給上基板與下基板，並使之保 持。於此狀態下，將真空腔室内減壓至特定之真空壓。真 空腔室内減壓後，以攝像照相機拍攝分別形成於上基板及 下基板之定位標記，根據該標記之拍攝圖像算出上下基板 之水平方向的相對位置偏移。接著，為解決算出之位置偏 3 201044082 移而調正上基σ與下基台之水平方向之相對位置後，使上 基台下降’經由塗布於下基板之㈣劑將上基板疊合於下 基板。驗，將真空腔室内返回至大氣壓，對疊合之上下 基板施加㈣壓力差之力σ壓力，貼合上下基板。 於上述先前之基板貼合裝置中，端賴形成於上基板與 下基板兩者之定位標記進行上下基板之位置婦。然而， 於液晶顯示面板巾，由成本肖m之觀點考量，有使用僅於 上丞板與下基板中 , w从心说保圯之液晶顯示面板之 情形。於此情形，因為無法使用攝像照相機進行位置調整， 故有必要提高料料_人對基纟供絲板之位置（供 T竭之精度。但’因搬送機器人之運轉時之晃動等，於 提商供給位置之精度上存有紐，大多超過料之供給位 置之偏移量(通常為G.2mm)。另—方面，雖然考慮使用運轉 時之晃動等較少讀送機器人，但縣會增加。又，藉由 降低搬域器人之搬送速度，雖然、可提高供給位置之精 度，但存有時間效率降低之問題。 本發明係鑑於上述情況而完成者，其目的係提供一種 可適當地進行上基板與下基板之水平方向之位置調整的基 板貼合裝置及基板貼合方法。 用以欲解決課題之手段 本發明之貼合上基板與下基板之基板貼合裝置，係將 顯示面板製造用之呈矩形的上基板與下基板根據各自之 Z資訊於水平方向對位後，經“嫌㈣布於至 乂其中-基板上的密封獅合者’其構成為具有：邊緣檢 201044082 測裝置，係檢測前述上基板與前述下基板中之至少其中一 基板之邊；及控制裝置，係根據藉由前述邊緣檢測裝置所 檢測出之前述其中一基板之邊之位置，求得前述其中一基 板之位置資訊。 根據上述構成’藉由檢測上基板與下基板中之至少其 中-基板之邊’即使於該其中一基板未形成有定位用之標 。己之丨月形，亦可由該邊之位置特定其中一基板之位置資 •Ο οί1進而可根據該特定之位置資訊，適當地進行上基板與 下基板之水平方向之位置調整。 又，本發明之基板貼合裝置中，可構成為：前述邊緣 ^利裝置係檢測刖述基板之—個邊上之分離的二處，且檢 測與檢測前述二處之邊正交之邊上的一處。 根據則述構成，於上基板及下基板之主面為矩形之情 - ^藉由檢職板之-個邊上之分_二處，可檢測該其 中基板之水平方向之旋轉角度，進而檢測與檢測該二處 〇 《邊正又之邊的""處’可由合計三處之位置特定其中-基 板之水平方向之位置。 又於本發明之基板貼合裝置中’可構成為：前述邊 緣檢測裝置係檢測前述上基板與下基板中之其中一基板之 邊t於前述上基板與下基板中之另—基板形成有定位用 之己，且進而具有檢測形成於前述另-基板之前述標記 之標記檢測農置，前述控制裝置係根據藉由前述標記檢測 裝置所檢測出之前述標記之位置，求得前述另一基板之位 置資訊。 5 201044082 又，於本發明之基板貼合裝置中，可構成為：前述邊 緣檢測裝置係檢測前述上基板之邊，前述標記檢測裝置係 檢測形成於前述下基板之定位用標記。 進而，本發明之基板貼合裝置中，可構成為：前述控 制裝置係根據使用前述標記檢測裝置所檢測出之前述邊緣 檢測裝置之水平方向上的位置，修正前述基板之位置資訊。 藉由上述構成，可獲得基板之精度更佳之位置資訊。 本發明之貼合上基板與下基板之基板貼合方法，係將 顯示面板製造用之呈矩形的上基板與下基板，根據各自之 位置資訊於水平方向對位後，經由以框狀之圖案塗布於至 少其中一基板上的密封劑貼合者，其構成為具有：邊緣檢 測步驟，係檢測前述上基板與前述下基板中之至少其中一 基板之邊；及位置調整步驟，係使用根據藉由前述邊緣檢 測步驟檢測出之前述邊之位置所求得之前述其中一基板之 位置資訊，將前述上基板與前述下基板進行對位。 又，本發明之基板貼合方法中，可構成為：前述邊緣 檢測步驟係檢測前述基板之一個邊上之分離的二處，且檢 測與檢測前述二處之邊正交之邊上的一處。 發明效果 根據本發明，藉由檢測上基板與下基板中之至少其中 一基板之邊，即使於該其中一基板未形成有定位用之標記 之情形，亦可由該邊之位置得到其中一基板之位置資訊， 進而可根據該特定之位置資訊，適當地進行上基板與下基 板之水平方向之位置調整。 201044082 圖式簡單說明 第1圖係顯示本發明之實施形態之基板貼合裝置之構 成圖。 第2圖係顯示上基板與下基板之貼合動作之流程圖。 第3圖係顯示上基板搬入時之基板貼合裝置之狀態圖。 第4圖係模式地顯示藉由光學感測器檢測邊之一例圖。 第5圖係顯示上基板及下基板吸著支持時之基板貼合 裝置之狀態圖。 C實施方式3 用以實施發明之最佳形態 以下，就本發明之實施形態使用圖式進行說明。 第1圖係顯示本發明之實施形態之基板貼合裝置之構 成圖。第1圖所示之基板貼合裝置100係貼合玻璃基板之上 基板151與下基板152者。於該下基板152，沿其上面之外緣 附近呈矩形框狀圖案塗布密封劑，於該密封劑所包圍之區 域内滴下液晶。該基板貼合裝置1〇〇係藉由真空腔室1〇1、 基板接收機構102、下基台1〇3、上基台1〇5、支柱1〇6、支 柱108a、支柱108b、搬送機器人U〇、照相機113、光學感 測器114、升降驅動機構13卜水平驅動機構132及控制裝置 140所構成。 真空腔室101係用以於真空中進行上基板151與下基板 152之貼合者’於貼合時藉由未圖示之吸引機構吸引内部之 氣體，成為真空狀態。 201044082 於真空腔室101内，於下方配置有下基台1〇3 ,於上方 配置有上基台105’此等下基台103及上基台1〇5上下對向配 置。下基台103係吸著保持於四個角部分別形成有定位標記 之下基板152，上基台105係吸著保持未形成有定位標記之 上基板151。又，上基台1〇5其上部由支柱1〇6所支撐，該支 柱106係氣密地貫通真空腔室101之上部，並連接於升降驅 動機構13卜藉由升降驅動機構131之驅動，上基台1〇5可上 下移動。下基台103係支撐固定於配置在真空腔室1〇1之底 部的水平驅動機構132上，藉由水平驅動機構132之驅動， 可朝箭頭X方向、與箭頭X方向正交之水平方向之γ方向、 及以與χγ方向正交之軸作為旋轉中心之0 (旋轉）方向移動。 又，於上基台105之下部設有用以吸著保持上基板151 之靜電吸盤等吸著機構107a，於下基台103設有用以吸著保 持下基板152之靜電吸盤等吸著機構1071)。 又，基板接收機構102係於真空腔室1〇1内以貫通上基 σ 105之方式设置。於該基板接收機構1〇2之下部前端，設 有藉由真空力或靜電力等吸著搬入真空腔室1〇1内之上基 板152的吸著墊115。又，基板接收機構102係由安裝於上部 之支柱108a及108b所支撐’進而該支柱1〇8&及1〇此連接於 升降驅動機構131。藉由升降驅動機構131之驅動，安裝於 支柱108a及108b之吸著整115可上下移動。即，升降驅動機 構131可將上基台105與吸著墊115個別或一體地升降。 於真空腔室101之側壁設有蓋部109。該蓋部1〇9係於搬 入上基板151及下基板152之時、或搬出貼合此等上基板151 201044082 及下基板152後所得之貼合基板之時開放。又，蓋部辦係 於貼合上基板151及下基板152時，為維持真空腔室ι〇ι内之 真空狀態而關閉。 於蓋部109之水平方向之延長線上，配置有搬送機器人 110。該搬送機器人110係用以將上基板15遣人真空腔室 101内者，具有於水平方向延伸之二根臂部⑴。於第i圖中 於紙面之垂直方向配置有二根臂部lu。此等臂部ui係於 〇 T部吸著支持上基板151。於上絲151讀人時，臂部ln 以吸著支持上基板151之狀態插入真空腔室1〇1内。此時， 基板接收機構1G2之吸著塾115係朝下方移動，吸著上基板 151 ° 照相機113係拍攝保持於下基㈣3之狀態之下基板 152之定位標記。即’下基台1()3在保持下基板152之狀態 下’於與下基板152之定位標記相對之各位置具有貫通孔， 該貫通孔係具有大於定位標記之開口，且上下地貫通下基 〇 自103。於本實施«巾，定位標為於下基板152之四 個角部分別形成有-個，故貫通孔對應於下基板152之四個 角部設置。又，在真空腔室101之底部、即下基台之各 貫通孔之正下方的位置，設有藉由玻璃等所形成之透明窗 120。照相機113係經由該透明f⑽與下基台1()3之貫通孔 可拍攝下基板152之定位標記地，以與各透明窗⑽相對之 方式配置於真空腔室101之下側。該照相機113係以ccd照 相機為代表之二維（區域)影像感測器等攝像裝置。 光學感測器114係檢測保持於上基台1〇5之狀態之上基 201044082 板m之邊者’具備朝下方照射平行雷射光之照射部與接收 平打雷射光之反射光之受光部，板據藉由受光部接收之光 的強度檢測基板之邊。光學感測器114由於在上基板⑸之 一個邊上的分離之二處與和前述一個邊正交之邊上的一處 合計三處檢測上基板151之邊，故設置有三個。再者，於本 實施形態中，光學感測器114係於上基板151之角部附近， 具體而言係於自上基板151上之與下基板152之標記相對之 位置下垂至成為檢測對象之邊的垂線與該邊相交之位置， 檢測該邊。即，上基台105係於保持上基板151之狀態下， 在與上基板151之成為檢測對象之邊上的三處相對之各位 置具備貫通孔。又，在真空腔室101之上部、即上基台1〇5 之各貫通孔之正上方之位置，設有玻璃等形成之透明窗 121。光學感測器114係可經由該透明窗121與上基台之貫通 孔檢測下基板之邊地配置於真空腔室1〇1上部。該光學感測 器114係以線性感測器為代表之一維（區域)影像感測器，但 亦可為二維影像感測器。 控制裝置14 0係根據藉由照相機丨丨3之攝影所獲得之圖 像資料’檢測形成於下基板152之定位標記。進而，控制裝 置140係根據檢測出之定位標記之位置’算出下基板152之 水平方向之中心位置與旋轉角度。又，控制裝置丨4〇係根據 藉由光學感測器II4所檢測出之上基板151之邊上的三處位 置，算出上基板151之水平方向之中心位置與旋轉角度。進 而，控制裝置140係根據此等算出結果，算出為疊合上基板 151與下基板152所必要之下基台1〇3之水平方向的移動量 201044082 及旋轉角度，並根據該移動量及旋轉角度控制水平驅動機 構132，使下基台1〇3於水平方向移動及旋轉。 又’控制裝置140係為使基板接收機構1〇2或上基台1〇5 上下移動’而控制升降驅動機構131之驅動。於上基台1〇5 吸著支持上基板151、下基台103吸著支持下基板152之狀態 下，若上基台105向下方移動，則上基板151經由密封劑接 觸下基板152，該等被疊合。 以下，一面參照流程圖一面說明上基板〖5丨與下基板 152之貼合動作。第2圖係顯示上基板151與下基板152之貼 合動作之流程圖。再者，於以下中，上基板151及下基板152 係形成為主面為相同形狀之正方形或長方形。 於真空腔室101之蓋部109開放之狀態下，搬送機器人 11〇將於其下面侧吸著保持有上基板151之二根臂部ui朝 真空腔室101内插入。接著，藉由控制裝置14〇之控制，使 升降驅動機構131驅動，將基板接收機構朝下方移動。 基板接收機構102朝下方移動時，前端之吸著墊115經由二 根臂部m之間接觸於上基板15卜吸著該上基板151。之 後，臂部111解除上基板151之吸著且稍向上方移動，進而 朝真空腔室101外退避，成為第3圖所示狀態。接著，藉由 控制裝置14〇之㈣’使升降㈣機構m驅動，將基板接 收機構1G2朝上方移動。當吸著塾115移動至上基台ι〇5之下 面的位置時，藉由該吸著墊出吸著支持之上基板⑸與吸 著機構107a·，由該吸著機獅7a吸著铺(si〇i)。 於上基台105吸著保持上基板151時，光學感測器ιΐ4係 11 201044082 檢測吸著保持於上基台105之上基板151之邊⑻〇2)。於此， 光學感測純m之—個邊上的二處，且檢 測與該邊正交之邊的-處。各邊緣之_結果魅制裝置 140輸出。 第4圖係模式地顯示藉由光學感測器114檢測邊的-例 圖。第4圖中，檢測上基板151之一個邊(沿χ方向之邊)上的 二處(位置A及B)’且檢測相對於該包含位置a&b之邊成正 交之邊（沿Y方向之邊)上的一處(位置C)。 控制裝置140係根據藉由光學感測器114所檢測出之邊 的位置，算出上基板151之水平方向之中心、位置與相對於基 準位置之水平方向之旋轉角度（S103)。 具體而言，控制裝置140係根據於一個邊所檢測出之二 處A、B之位置與檢測該等位置A、B之光學感測器ιΐ4之間 隔距離，特定通過該位置A、B之直線（第丨直線）。接著栌 制裝置140係根據於與檢測位置a、B之邊正交之邊所檢測 出之一處(位置C)，特定與第1直線正交並通過該位置c之直 線（第2直線）。進而，控制裝置140係根據記憶於内建記憶體 (未圖示）之上基板151之各邊長度、第1直線與第2直線之交 點位置、及第1直線之傾斜度，算出該上基板151之水平方 向之中心位置（第4圖之X)、及相對於基準位置（第4圖之虛 線)之水平方向之旋轉角度（第4圖之0)。 若算出上基板151之中心位置及旋轉角度，則將下基板 152搬入真空腔室1〇1内，將該下基板152吸著支持於下基二 l〇3(S104)。於此，搬送機器人110將下基板152吸著保持於 12 201044082 臂部111之上面，將下基板152搬入真空腔室101内。如此’ 將下基板152供給至下基台103後，如第5圖所示，關閉真空 腔室101之蓋部109。之後，藉由吸引真空腔室1〇1内之氣 體，真空腔室101内成為真空狀態。 真空腔室101内成為真空狀態後、或者在成為真空狀態 之過程，照相機113係經由玻璃窗120及下基台103之貫通孔 拍攝形成於下基板152之定位標記。藉由拍攝所得到之圖像 資料朝控制裝置140輸出。控制裝置140係根據藉由照相機 113之拍攝所得到之圖像資料，檢測形成於下基板152之定 位標記之位置（S105)。進而，控制裝置140根據所檢測出之 定位標記之位置，藉由數學運算方法算出下基板152之水平 方向之中心位置及相對於基準位置之水平方向之旋轉角度 (5106) 。於此’基準位置與S103中算出上基板151之旋轉角 度時所使用之基準位置相同。 若算出下基板152之中心位置及旋轉角度，則控制裝置 140根據上述所算出之上基板151之中心位置及旋轉角度、 以及下基板152之中心位置及旋轉角度’算出為對位上基板 151與下基板152所必要的下基台1〇3之移動量及旋轉角度 (5107) 。具體而言，控制裝置14〇係算出上基板151之中心位 置相對於下基板152之中心位置的朝χ方向及γ方向之位置 偏移’將該位置偏移作為下基台1〇3之修正移動量。進而， 控制裝置140係將上基板151之旋轉角度相對於下基板152 之方疋轉角度的偏移角度作為下基台1〇3之修正旋轉角度。 控制裝置140係根據如上所算出之下基台103之修正移 13 201044082 動量及修正旋㈣度，«水平驅動機構m，使下基台1〇3 移動及旋轉。藉此，下基台10_χγ方向移動對應於所算 出之修正移動量之距離，且旋轉移動所算出之修正旋轉角 度(si〇8)。藉此’ ±基板151與下基板152之中心位置重疊， 且各邊重疊，成為可貼合之狀態。 接著，控制裝置140係驅動升降驅動機構131，使上基 台1〇5向下方移動。藉此，若上基台1G5向下方移動則被 吸著保持m基台105之上基板151經由密制接觸被吸 著保持於下基台103之下基板152，其等疊合(sl〇9)。 之後，解除真空腔室1〇1内之真空狀態使壓力上升時， 於疊合之上下基板151、152之内外產生壓力差’藉由該内 外之壓力差加壓上下基板15卜152，擠扁密封劑進行貼合。 真空腔室101内返回至大氣壓後，開放篕部1〇9，藉由搬送 機器人等將貼合之基板由真空腔室1〇1内搬出（Su〇)。之 後’於存在有成為貼合對象之上下基板151、152之情形， 反覆上述S101〜S110之動作，直至該等基板151、152完成貼 合為止。 如此，本實施形態之基板貼合裝置100中，於僅於下基 板152形成定位標記，而於上基板151未形成定位標記之情 形’藉由檢測上基板151之邊緣而導出該上基板151之水平 方向之中心位置及旋轉角度，進而根據該上基板151之水平 方向之中心位置及旋轉角度、以及下基板152之水平方向之 中心位置及旋轉角度，使下基台103於XY方向移動及旋轉 移動，藉此對準上基板151與下基板152之中心位置，且對 14 201044082 準各邊、以成為可貼合之狀態進行對位。 因此，於上基板151未形成有定位標記之情形，即使不 如先前般使用抑止運轉時之晃動等之高價的搬送機器人、 或降低搬送機器人之搬送速度，亦可特定該上基板i5i之位 置’進而根據該特定之位置適當地調整上基板⑸與下基板 152之水平方向之位置。因此，即使於上基板⑸未形成有 定位標記之情形，亦可高精度地貼合上下基板151、152， 〇 可使貼合基板之品質提升，結果可獲得顯示品質良好之液 晶顯不面板。 再者，於本實施形態中，係根據與光學感測器114之相 對的位置關係鼻出上基板151之位置（中心位置及旋轉角 度）。為此，為正確地算出上基板151之位置，有必要正確 地草握光學感測器114與上基台1〇5之相對的位置關係。因 ' 此，藉由以下順序求得光學感測器114與上基台105之相對 的位置關係。然後，根據所求得之相對的位置關係，調整 Q 光學感測器I14相對於上基台1〇5之安裝位置或修正光學感 測器114之檢測結果’圖謀提高上基板151之位置檢測精度。 於光學感測器114相對於上基台1〇5之位置關係的掌握 上，係利用照相機113。 如上所述，下基台103之貫通孔係配合形成於下基板 152之定位標記而設置。又’上基台1〇5之貫通孔係配合上 基板之邊緣而設置，該上基板之邊緣係對應下基板152之定 位標記而位置。因此，下基台103之貫通孔與上基台1〇5之 貫通孔大致位於同心。因此，令下基台103之貫通孔之開口 15 201044082 :積比上基台105之貫通孔之開口面積大。具體而言，將兩 貫通孔形成為圓筒狀之貫通孔，且使τ基台lG3之貫通孔之 直控大於上基台1G5之貫通孔之直徑。藉此，可經由下基台 則之貫通孔，藉由照相機113拍攝上基台1〇5之貫通孔與光 學感測器114。 因此，首先藉由照相機113經由下基台1〇3之貫通孔拍 攝j基台105之貫通孔與光學感測器114。控制裝置140係根 據藉由照域II3所賴之圖像，以上基纟奶之貫通孔為 基準求得光學感測器114之位置偏移。即，因為上基台105 之貫通孔為®筒狀，故貫通孔之圖像為圓形。光學感測器 114位於該圓之中央之狀態為光學感測器114之理想的配置 位置時控制裝置14〇求得光學感測器i 14相對於圓之中央 的位置偏移。再者’上基台1〇5之貫通孔可藉由機械加工以 咼位置精度形成於上基台。 根據如此所求得之光學感測器114相對於設於上基台 105之貝通孔之位置偏移，算出光學感測器相對於上基 台105之相對位置。然後’如上所述，根據算出之光學感測 器114之相對位置關係，調整光學感測器114相對於上基台 105之安裝位置或修正光學感測⑽彳之檢測結果。藉此， 可藉由光學感測器114高精度地算出上基板151之位置。藉 此’因為可更進—步高精度地貼合上下基板151、152，故 可進而提高製造之顯示面板之品質。 再者，於上述之例中，在下基板152之定位標記與上基 板151之邊上的藉由光學感測器114所檢測之處無接近之位 16 201044082 置關係，且光學感測器114與照相機ιΐ3未配置於相對位置 時’可將照相機113設置成可移動於定位標記之拍攝位置也 光學感測器114之拍攝位置之間，且於分別對應之下基台 105之處δ又置貫通孔。藉由如此構成，於拍攝定位標記時可 經由與定位標記對應形成之貫通孔進行，於拍攝光學感測 器114時’可經由與光學感測器114對應形成之貫通孔進行。 又’光學感測器m相對於上基台1〇5之安裝位置偏移 之修正，亦可如下進行。 即’以上述S101〜S110之順序進行一組或複數組之上下 基板⑸、m之貼合。然後，對貼合完成之貼合基板測定 上下基板151、152間之位置偏移。測定之結果於上下基板 151、152間產生位置偏移時，以該位置偏移程度作為修正 _ 值，添加於上述中為對位上基板151與下基板152之下 . I台103之移動量及旋轉角度。再者，對複數之貼合基板測 定位置偏移時，可以其位置偏移之平均值作為修正值。 Q 再者，於上述實施形態中，雖然為使上基板151與下基 板152成為可貼合之狀態，僅移動下基台1〇3，但亦可僅移 動上基台105、或移動下基台1〇3與上基台1〇5兩者。 又，於上述實施形態中，就僅於下基板152形成定位標 記，於上基板151未形成定位標記之情形進行說明。然而， 即使僅於上基板151形成定位標記，而於下基板152未形成 定位標記之情形，亦同樣地可適用本發明。此情形，於第1 圖中，可將光學感測器配置於照相機113之位置而可檢測下 基板152之邊緣，且將照相機配置於光學感測器ιΐ4之位 17 201044082 置，可檢測形成於上基板151之定位標記。 又，亦可對上下基板151、152兩者藉由檢測邊緣而檢 測各自之位置。此時，可將與上述實施形態中之上基台105 及相對上基台105配置之光學感測器1〇4相同之構成適用於 下基台103。又’分別使用光學感測器114檢測上下基板 151、152之邊緣之情形，於上基台1〇5與下基台103之兩者 保持有各自之基板151、152時，認為因兩基板151、152之 邊緣位置重疊、或接近，而無法正確地檢測各基板15卜152 之邊緣。因此’於各基板151、152之邊緣檢測時，可藉由 水平驅動機構131使下基台1 〇3於水平方向移動，調整上下 基板151、152之相對位置，以使上基板151與下基板152之 邊緣在用以檢測各自之邊緣的光學感測器114之檢測區域 外。又’此時’可將與下基台1〇3對應設置之光學感測器114 於真空腔室101内與下基台103 一體安裝。 又’於上述實施形態中，雖然將光學感測器114配置於 真空腔室101之外侧，但於真空腔室101内與上基台105—體 設置亦可。 又’使用光學感測器114檢測（算出）吸著保持於上基台 105之上基板151之位置後，將下基板152供給於下基台 103 °然而’亦可將各基板151、152分別供給於上下基台 103、105後’依序進行上基板151之位置檢測與下基板152 之位置檢測。此時，藉由光學感測器114檢測上基板151之 邊緣時’可使下基台103移動，以使下基台103上之下基板 152之邊緣避開光學感測器114之檢測區域。 18 201044082 產業之可利用性 地進行 貼合裝 本發明之基板貼合裝置及基板貼合方法可適& 上基板與下基板之水平方向之位置調整，作為義: 置及基板貼合方法係為有用。 【圖式簡單說明】 第1圖係顯示本發明之實施形態之基板貼合裝置之構 成圖。 〇 第2圖係顯示上基板與下基板之貼合動作之流程圖。 第3圖係顯示上基板搬入時之基板貼合裝置之狀態圖。 第4圖係模式地顯示藉由光學感測器檢測邊之一例圖。 第5圖係顯示上基板及下基板吸著支持時之基板貼合 裝置之狀態圖。 【主要元件符號說明】 100…基板貼合裝置 113…照相機 101...真空腔室 114…光學感剛器 102…基板接收機構 115.··吸著塾 103...下基台 120 ’ 121...破瑪窗 105...上基台 131…升降驅動機構 106，108a，108b...支柱 132…水平驅動|置 107a，107b···吸著機構 140···控制裝置 109…蓋部 151…上基板 110…搬送機器人 152…下基板 111…臂部 S101⑸10···步驟 19I. SUMMARY OF THE INVENTION: SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION In the above-described bonding apparatus, the bonding of the upper and lower substrates is performed by the following operation. First, in the vacuum chamber, the upper substrate and the lower substrate are supplied to the upper substrate and the lower substrate in a relatively upper and lower substrate holding surface, and are held. In this state, the vacuum chamber is depressurized to a specific vacuum pressure. After decompressing the inside of the cavity, the positioning marks respectively formed on the upper substrate and the lower substrate are taken by the imaging camera, and the relative positional shift of the upper and lower substrates in the horizontal direction is calculated based on the captured image of the mark. Next, in order to solve the calculated positional offset 3 201044082 and adjust the relative position of the upper base σ and the lower base in the horizontal direction, the upper base is lowered. The upper substrate is superposed on the lower substrate via the (four) agent applied to the lower substrate. Substrate. In the test, the vacuum chamber is returned to the atmospheric pressure, and the force σ pressure of the pressure difference (4) is applied to the upper and lower substrates, and the upper and lower substrates are bonded. In the above-described conventional substrate bonding apparatus, the positioning marks formed on both the upper substrate and the lower substrate are positioned to position the upper and lower substrates. However, in the case of the liquid crystal display panel, it is considered from the viewpoint of the cost, and there is a case where the liquid crystal display panel is used only in the upper and lower substrates. In this case, since the position adjustment cannot be performed using the camera camera, it is necessary to increase the position of the material _ person to the base wire supply plate (the accuracy of the T-exhaustion is required. However, the movement of the transfer robot during the operation, etc. There is a difference in the accuracy of the supply position, and most of them exceed the offset of the supply position of the material (usually G.2mm). On the other hand, although it is considered to use less reading robots such as shaking during operation, the county will increase Further, by reducing the transport speed of the transfer unit, the accuracy of the supply position can be improved, but there is a problem that the time efficiency is lowered. The present invention has been made in view of the above circumstances, and an object thereof is to provide an appropriate A substrate bonding apparatus and a substrate bonding method for adjusting the position of the upper substrate and the lower substrate in the horizontal direction. The substrate bonding apparatus for bonding the upper substrate and the lower substrate of the present invention is a display panel After the manufacturing of the rectangular upper substrate and the lower substrate are aligned in the horizontal direction according to the respective Z information, the sealed lion fits on the substrate In order to have: edge detection 201044082 measuring device, detecting the edge of at least one of the upper substrate and the lower substrate; and the control device is based on the edge of the one of the substrates detected by the edge detecting device Positioning, determining the position information of one of the substrates. According to the above configuration 'by detecting at least one of the upper substrate and the lower substrate - the side of the substrate', even if one of the substrates is not formed with a target for positioning. In the shape of the moon, the position of one of the substrates can be specified by the position of the side, and the positional adjustment of the horizontal direction of the upper substrate and the lower substrate can be appropriately performed according to the specific position information. In the device, the edge device can detect two locations on the side of the substrate, and detect and detect one of the sides orthogonal to the two sides. The main surface of the upper substrate and the lower substrate is rectangular--by the position of the edge of the inspection board - the two sides of the inspection board can detect the rotation of the horizontal direction of the substrate In addition, in the substrate bonding apparatus of the present invention, the position of the substrate can be detected and detected by the total position of the three places. The edge detecting device may be configured to detect that the side t of one of the upper substrate and the lower substrate is formed on the other substrate of the upper substrate and the lower substrate, and further has a detection formed on the front side Further, the mark of the substrate is detected by the mark of the substrate, and the control device obtains the position information of the other substrate based on the position of the mark detected by the mark detecting device. 5 201044082 Further, the present invention In the substrate bonding apparatus, the edge detecting device may detect a side of the upper substrate, and the mark detecting device may detect a positioning mark formed on the lower substrate. Further, in the substrate bonding apparatus of the present invention, the control device may correct the position information of the substrate based on a position in a horizontal direction of the edge detecting device detected by the mark detecting device. With the above configuration, positional information with better accuracy of the substrate can be obtained. In the method of bonding the substrate to which the upper substrate and the lower substrate of the present invention are bonded, the upper substrate and the lower substrate which are rectangular in the production of the display panel are aligned in the horizontal direction according to the respective positional information, and then passed through a frame-like pattern. a sealant applicator coated on at least one of the substrates, configured to have an edge detecting step of detecting an edge of at least one of the upper substrate and the lower substrate; and a position adjusting step The position information of the one of the substrates obtained by the position of the edge detected by the edge detecting step is used to align the upper substrate and the lower substrate. Further, in the substrate bonding method of the present invention, the edge detecting step may be configured to detect two separations on one side of the substrate, and detect one of the sides orthogonal to the side where the two points are detected. . According to the present invention, by detecting the side of at least one of the upper substrate and the lower substrate, even if one of the substrates is not formed with a mark for positioning, one of the substrates can be obtained from the position of the side. The position information can further appropriately adjust the position of the upper substrate and the lower substrate in the horizontal direction based on the specific position information. 201044082 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the construction of a substrate bonding apparatus according to an embodiment of the present invention. Fig. 2 is a flow chart showing the bonding operation of the upper substrate and the lower substrate. Fig. 3 is a view showing a state of the substrate bonding apparatus when the upper substrate is loaded. Fig. 4 is a view schematically showing an example of detecting an edge by an optical sensor. Fig. 5 is a view showing a state of the substrate bonding apparatus when the upper substrate and the lower substrate are occluded. C. Embodiment 3 Best Mode for Carrying Out the Invention Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a view showing the construction of a substrate bonding apparatus according to an embodiment of the present invention. The substrate bonding apparatus 100 shown in Fig. 1 is a combination of a substrate 151 and a lower substrate 152 on a glass substrate. On the lower substrate 152, a sealant is applied in a rectangular frame shape along the outer edge of the upper surface thereof, and liquid crystal is dropped in a region surrounded by the sealant. The substrate bonding apparatus 1 is a vacuum chamber 1〇, a substrate receiving mechanism 102, a lower base 1〇3, an upper base 1〇5, a support 1〇6, a support 108a, a support 108b, and a transfer robot. The U 〇, the camera 113, the optical sensor 114, the elevation drive mechanism 13, the horizontal drive mechanism 132, and the control device 140 are constructed. The vacuum chamber 101 is for adhering the upper substrate 151 to the lower substrate 152 in a vacuum. When the bonding is performed, the internal gas is sucked by a suction mechanism (not shown) to be in a vacuum state. 201044082 In the vacuum chamber 101, a lower base 1〇3 is disposed below, and an upper base 105' is disposed above the lower base 103 and the upper base 1〇5. The lower base 103 is absorbing and holding the substrate 152 under the positioning marks, and the upper base 105 sucks and holds the upper substrate 151 on which the positioning marks are not formed. Further, the upper base 1〇5 is supported by the support 1〇6, and the support 106 is airtightly passed through the upper portion of the vacuum chamber 101, and is connected to the elevation drive mechanism 13 by the elevation drive mechanism 131. The upper base 1〇5 can be moved up and down. The lower base 103 is supported and fixed to the horizontal drive mechanism 132 disposed at the bottom of the vacuum chamber 〇1, and is driven by the horizontal drive mechanism 132 so as to be horizontally orthogonal to the direction of the arrow X in the direction of the arrow X. The γ direction and the axis orthogonal to the χγ direction move in the 0 (rotation) direction of the rotation center. Further, a suction mechanism 107a such as an electrostatic chuck for sucking and holding the upper substrate 151 is provided on the lower portion of the upper base 105, and a suction mechanism 1071 such as an electrostatic chuck for sucking and holding the lower substrate 152 is provided on the lower base 103. . Further, the substrate receiving mechanism 102 is provided in the vacuum chamber 1〇1 so as to penetrate the upper base σ 105. At the front end of the lower portion of the substrate receiving mechanism 1A2, a suction pad 115 that is sucked into the upper substrate 152 in the vacuum chamber 1? by a vacuum force or an electrostatic force is provided. Further, the substrate receiving mechanism 102 is supported by the pillars 108a and 108b attached to the upper portion, and the pillars 1〇8& and 1 are connected to the elevation driving mechanism 131. The suction integral 115 attached to the stays 108a and 108b can be moved up and down by the driving of the lift drive mechanism 131. That is, the elevation drive mechanism 131 can raise and lower the upper base 105 and the suction pad 115 individually or integrally. A cover portion 109 is provided on the side wall of the vacuum chamber 101. The lid portion 1〇9 is opened when the upper substrate 151 and the lower substrate 152 are loaded, or when the bonded substrate obtained by bonding the upper substrate 151 201044082 and the lower substrate 152 is bonded. Further, when the upper substrate 151 and the lower substrate 152 are bonded to each other, the lid portion is closed to maintain the vacuum state in the vacuum chamber ι. A transfer robot 110 is disposed on an extension line of the lid portion 109 in the horizontal direction. The transfer robot 110 is for unloading the upper substrate 15 into the vacuum chamber 101, and has two arm portions (1) extending in the horizontal direction. In the i-th diagram, two arm portions lu are arranged in the vertical direction of the paper surface. These arm portions ui are attached to the upper substrate 151 by the 〇T portion. When the upper wire 151 is read, the arm portion ln is inserted into the vacuum chamber 1〇1 in a state of sucking and supporting the upper substrate 151. At this time, the suction port 115 of the substrate receiving mechanism 1G2 moves downward, sucking the upper substrate 151 °. The camera 113 captures the positioning mark of the substrate 152 held in the lower base (4) 3. That is, the lower base 1 () 3 has a through hole at each position opposite to the positioning mark of the lower substrate 152 while holding the lower substrate 152, and the through hole has an opening larger than the positioning mark, and penetrates up and down Based on 103. In the present embodiment, the positioning is marked as four at the four corners of the lower substrate 152, so that the through holes are provided corresponding to the four corners of the lower substrate 152. Further, a transparent window 120 formed of glass or the like is provided at a position directly under the respective through holes of the lower base of the vacuum chamber 101. The camera 113 is capable of photographing the positioning marks of the lower substrate 152 via the through holes of the transparent f (10) and the lower base 1 () 3, and is disposed on the lower side of the vacuum chamber 101 so as to face the respective transparent windows (10). The camera 113 is an imaging device such as a two-dimensional (regional) image sensor typified by a ccd camera. The optical sensor 114 detects that the side of the base 404.482 is on the side of the upper base 1〇5, and the light receiving unit that irradiates the irradiation portion of the parallel laser light downward and the reflected light of the received laser light, The side of the substrate is detected by the intensity of the light received by the light receiving portion. The optical sensor 114 is provided with three sides by detecting the side of the upper substrate 151 at three points on one side of the upper substrate (5) and one side on the side orthogonal to the one side. Furthermore, in the present embodiment, the optical sensor 114 is attached to the vicinity of the corner of the upper substrate 151, specifically, from the position on the upper substrate 151 opposite to the mark of the lower substrate 152, to be the object of detection. The edge of the edge intersects the edge and the edge is detected. In other words, the upper base 105 is provided with through holes at three places facing the detection target on the side of the upper substrate 151 while the upper substrate 151 is held. Further, a transparent window 121 formed of glass or the like is provided at a position directly above the through holes of the upper base 1〇5 at the upper portion of the vacuum chamber 101. The optical sensor 114 is disposed on the upper portion of the vacuum chamber 1〇1 via the transparent window 121 and the through hole of the upper base to detect the side of the lower substrate. The optical sensor 114 is a one-dimensional (area) image sensor represented by a line sensor, but may also be a two-dimensional image sensor. The control device 140 detects the positioning mark formed on the lower substrate 152 based on the image data 'obtained by the photographing of the camera 丨丨3. Further, the control device 140 calculates the center position and the rotation angle of the lower substrate 152 in the horizontal direction based on the position of the detected positioning mark. Further, the control unit 算出4 calculates the center position and the rotation angle of the upper substrate 151 in the horizontal direction based on the three positions on the side of the upper substrate 151 detected by the optical sensor II4. Further, based on the calculation results, the control device 140 calculates the horizontal displacement amount 201044082 and the rotation angle of the base 1 〇 3 required to superimpose the upper substrate 151 and the lower substrate 152, and based on the movement amount and rotation. The angle control horizontal drive mechanism 132 moves and rotates the lower base 1〇3 in the horizontal direction. Further, the control unit 140 controls the driving of the elevation drive mechanism 131 to move the substrate receiving mechanism 1〇2 or the upper base 1〇5 up and down. When the upper substrate 151 and the lower base 103 are sucked and supported by the lower substrate 152, the upper substrate 151 is moved downward, and the upper substrate 151 contacts the lower substrate 152 via a sealant. Wait until they are stacked. Hereinafter, the bonding operation of the upper substrate [5" and the lower substrate 152 will be described with reference to a flowchart. Fig. 2 is a flow chart showing the bonding operation of the upper substrate 151 and the lower substrate 152. Further, in the following, the upper substrate 151 and the lower substrate 152 are formed in a square or a rectangle having the same shape as the main surface. In a state where the lid portion 109 of the vacuum chamber 101 is opened, the transfer robot 11 吸 is inserted into the vacuum chamber 101 by sucking the two arm portions ui holding the upper substrate 151 on the lower side thereof. Next, by the control of the control unit 14, the elevation drive mechanism 131 is driven to move the substrate receiving mechanism downward. When the substrate receiving mechanism 102 moves downward, the suction pad 115 at the tip end contacts the upper substrate 15 via the two arm portions m. Thereafter, the arm portion 111 releases the suction of the upper substrate 151 and moves slightly upward, and further retreats toward the outside of the vacuum chamber 101 to be in the state shown in Fig. 3. Then, the raising/lowering mechanism (4) is driven by the (4)' of the control device 14 to move the substrate receiving mechanism 1G2 upward. When the suction cymbal 115 is moved to a position below the upper base ι〇5, the upper substrate (5) and the absorbing mechanism 107a· are sucked and sucked by the absorbing pad, and are sucked by the absorbing machine lion 7a ( Si〇i). When the upper substrate 105 sucks and holds the upper substrate 151, the optical sensor ι 4 system 11 201044082 detects that the side (8) 〇 2) of the substrate 151 is held by the upper substrate 105. Here, the optical sensing is performed on two sides of the pure m, and the side of the side orthogonal to the side is detected. The edge of each edge is outputted by the fascinating device 140. Fig. 4 is a view schematically showing an example of detecting an edge by the optical sensor 114. In Fig. 4, two points (positions A and B)' on one side (the side along the χ direction) of the upper substrate 151 are detected and the sides orthogonal to the side of the inclusion position a & b are detected (along the Y) One place on the side of the direction (position C). The control device 140 calculates the rotation angle of the center and the position of the upper substrate 151 in the horizontal direction and the horizontal direction with respect to the reference position based on the position of the side detected by the optical sensor 114 (S103). Specifically, the control device 140 specifies a distance passing through the positions A and B based on the distance between the positions of the two A and B detected on one side and the optical sensors ι 4 detecting the positions A and B. (Dijon line). Next, the tanning device 140 is one of the sides (position C) detected by the side orthogonal to the sides of the detection positions a and B, and a line that is orthogonal to the first line and passes through the position c (the second line) . Further, the control device 140 calculates the upper substrate based on the length of each side of the upper substrate 151 stored in the built-in memory (not shown), the position of the intersection of the first straight line and the second straight line, and the inclination of the first straight line. The center position of the horizontal direction of 151 (X of FIG. 4) and the rotation angle of the horizontal direction with respect to the reference position (dashed line of FIG. 4) (0 of FIG. 4). When the center position and the rotation angle of the upper substrate 151 are calculated, the lower substrate 152 is carried into the vacuum chamber 1〇1, and the lower substrate 152 is sucked and supported by the lower substrate 2〇3 (S104). Here, the transport robot 110 sucks and holds the lower substrate 152 on the upper surface of the arm portion 111 of 12 201044082, and carries the lower substrate 152 into the vacuum chamber 101. Thus, after the lower substrate 152 is supplied to the lower base 103, as shown in Fig. 5, the lid portion 109 of the vacuum chamber 101 is closed. Thereafter, the inside of the vacuum chamber 101 is brought into a vacuum state by sucking the gas in the vacuum chamber 1〇1. After the vacuum chamber 101 is in a vacuum state or in a vacuum state, the camera 113 captures the positioning marks formed on the lower substrate 152 through the through holes of the glass window 120 and the lower base 103. The image data obtained by the shooting is output to the control device 140. The control device 140 detects the position of the positioning mark formed on the lower substrate 152 based on the image data obtained by the shooting by the camera 113 (S105). Further, the control device 140 calculates a rotation angle of the center position of the lower substrate 152 in the horizontal direction and the horizontal direction with respect to the reference position by a mathematical calculation method based on the position of the detected positioning mark (5106). Here, the reference position is the same as the reference position used when calculating the rotation angle of the upper substrate 151 in S103. When the center position and the rotation angle of the lower substrate 152 are calculated, the control device 140 calculates the alignment upper substrate 151 based on the center position and the rotation angle of the upper substrate 151 and the center position and the rotation angle ' of the lower substrate 152. The amount of movement and the angle of rotation of the lower base 1〇3 necessary for the lower substrate 152 (5107). Specifically, the control device 14 calculates a positional shift of the center position of the upper substrate 151 with respect to the center position of the lower substrate 152 in the χ direction and the γ direction, and corrects the position as the correction of the lower base 1 〇 3 The amount of movement. Further, the control device 140 sets the angle of rotation of the rotation angle of the upper substrate 151 with respect to the rotation angle of the lower substrate 152 as the corrected rotation angle of the lower base 1?3. The control unit 140 moves and rotates the lower base unit 1〇3 based on the correction amount of the base 103 and the correction rotation (four degrees) and the horizontal drive mechanism m. Thereby, the lower base 10_χγ direction shifts the distance corresponding to the calculated corrected movement amount, and the calculated corrected rotation angle (si〇8) is rotationally moved. Thereby, the center of the lower substrate 151 and the lower substrate 152 are overlapped, and the respective sides are overlapped to be in a state in which they can be bonded. Next, the control device 140 drives the elevation drive mechanism 131 to move the upper base 1 to 5 downward. Thereby, when the upper base 1G5 moves downward, the upper substrate 151 is sucked and held. The upper substrate 151 is sucked and held by the substrate 152 under the lower base 103 via the dense contact, and is superposed (sl〇9 ). Thereafter, when the vacuum state in the vacuum chamber 1〇1 is released and the pressure is raised, a pressure difference is generated inside and outside the upper and lower substrates 151 and 152, and the upper and lower substrates 15 and 152 are pressed by the pressure difference between the inside and the outside. The sealant is applied. After returning to the atmospheric pressure in the vacuum chamber 101, the crotch portion 1〇9 is opened, and the bonded substrate is carried out from the vacuum chamber 1〇1 by a transfer robot or the like (Su〇). Then, in the case where the lower substrates 151 and 152 are to be bonded, the operations of S101 to S110 are repeated until the substrates 151 and 152 are bonded. As described above, in the substrate bonding apparatus 100 of the present embodiment, the positioning mark is formed only on the lower substrate 152, and the positioning mark is not formed on the upper substrate 151. The upper substrate 151 is derived by detecting the edge of the upper substrate 151. The center position and the rotation angle in the horizontal direction, and further, the lower base 103 is moved and rotated in the XY direction according to the center position and the rotation angle of the horizontal direction of the upper substrate 151 and the center position and the rotation angle of the horizontal direction of the lower substrate 152. Moving, thereby aligning the center positions of the upper substrate 151 and the lower substrate 152, and aligning the sides of the 14 201044082 in a conformable state. Therefore, in the case where the positioning mark is not formed on the upper substrate 151, the position of the upper substrate i5i can be specified even if the high-speed transfer robot such as the sway during operation is suppressed or the transport speed of the transfer robot is lowered. The position of the upper substrate (5) and the lower substrate 152 in the horizontal direction is appropriately adjusted in accordance with the specific position. Therefore, even when the positioning marks are not formed on the upper substrate (5), the upper and lower substrates 151 and 152 can be bonded with high precision, and the quality of the bonded substrate can be improved. As a result, a liquid crystal display panel having good display quality can be obtained. Further, in the present embodiment, the position (center position and rotation angle) of the upper substrate 151 is nosed in accordance with the positional relationship with respect to the optical sensor 114. Therefore, in order to accurately calculate the position of the upper substrate 151, it is necessary to correctly grasp the relative positional relationship between the optical sensor 114 and the upper base 1b. Therefore, the relative positional relationship between the optical sensor 114 and the upper base 105 is obtained by the following procedure. Then, according to the obtained relative positional relationship, the mounting position of the Q optical sensor I14 with respect to the upper base 1b5 or the detection result of the correcting optical sensor 114 is adjusted to improve the position detection accuracy of the upper substrate 151. . The camera 113 is utilized for grasping the positional relationship of the optical sensor 114 with respect to the upper base 1〇5. As described above, the through holes of the lower base 103 are provided in cooperation with the positioning marks formed on the lower substrate 152. Further, the through holes of the upper base 1〇5 are provided to match the edges of the upper substrate, and the edges of the upper substrate correspond to the positioning marks of the lower substrate 152. Therefore, the through hole of the lower base 103 is substantially concentric with the through hole of the upper base 1b. Therefore, the opening 15 of the through hole of the lower base 103 is made larger than the opening area of the through hole of the upper base 105. Specifically, the two through holes are formed into a cylindrical through hole, and the direct control of the through hole of the τ base 1G3 is larger than the diameter of the through hole of the upper base 1G5. Thereby, the through hole of the upper substrate 1〇5 and the optical sensor 114 can be imaged by the camera 113 via the through hole of the lower base. Therefore, first, the through hole of the j base 105 and the optical sensor 114 are taken by the camera 113 through the through holes of the lower base 1〇3. The control device 140 determines the positional shift of the optical sensor 114 based on the image of the base through the through-hole of the image based on the image of the field II3. That is, since the through hole of the upper base 105 is a tubular shape, the image of the through hole is circular. When the state of the optical sensor 114 in the center of the circle is the ideal position of the optical sensor 114, the control device 14 seeks a positional shift of the optical sensor i 14 with respect to the center of the circle. Further, the through holes of the upper base 1〇5 can be formed on the upper base by mechanical machining with the positional accuracy. Based on the positional deviation of the optical sensor 114 thus obtained with respect to the beacon hole provided in the upper base 105, the relative position of the optical sensor with respect to the upper base 105 is calculated. Then, as described above, the detection result of the optical sensor 114 with respect to the mounting position of the upper base 105 or the correction optical sensing (10) is adjusted based on the relative positional relationship of the calculated optical sensor 114. Thereby, the position of the upper substrate 151 can be accurately calculated by the optical sensor 114. By this, since the upper and lower substrates 151 and 152 can be bonded with high precision, the quality of the manufactured display panel can be further improved. Moreover, in the above example, the positioning mark on the lower substrate 152 is related to the position on the side of the upper substrate 151 which is not detected by the optical sensor 114, and the optical sensor 114 is When the camera ΐ3 is not disposed at the relative position, the camera 113 can be set to be movable between the shooting position of the positioning mark and the shooting position of the optical sensor 114, and the δ is further connected to the base 105 at the corresponding lower position. hole. According to this configuration, when the positioning mark is photographed, it can be performed through the through hole formed corresponding to the positioning mark, and when the optical sensor 114 is photographed, it can be performed through the through hole formed corresponding to the optical sensor 114. Further, the correction of the mounting position shift of the optical sensor m with respect to the upper base 1b can also be performed as follows. That is, the bonding of the upper and lower substrates (5) and m is performed in the order of S101 to S110 described above. Then, the positional displacement between the upper and lower substrates 151 and 152 was measured for the bonded substrate to be bonded. When the positional shift occurs between the upper and lower substrates 151 and 152 as a result of the measurement, the degree of the positional shift is used as the correction_value, and is added to the lower side of the upper substrate 151 and the lower substrate 152. And the angle of rotation. Further, when the positional offset is measured for a plurality of bonded substrates, the average value of the positional shift can be used as the correction value. Further, in the above embodiment, the upper substrate 151 and the lower substrate 152 are attached to each other, and only the lower base 1〇3 is moved. However, only the upper base 105 or the lower base may be moved. Both the platform 1〇3 and the upper base station 1〇5. Further, in the above embodiment, the positioning mark is formed only on the lower substrate 152, and the case where the positioning mark is not formed on the upper substrate 151 will be described. However, the present invention is equally applicable even in the case where the positioning mark is formed only on the upper substrate 151 and the positioning mark is not formed on the lower substrate 152. In this case, in the first figure, the optical sensor can be disposed at the position of the camera 113 to detect the edge of the lower substrate 152, and the camera is disposed at the position of the optical sensor ι4, 17 201044082, which can be detected and formed. The positioning mark of the upper substrate 151. Further, the respective positions of the upper and lower substrates 151 and 152 can be detected by detecting the edges. In this case, the same configuration as the optical sensor 1〇4 in which the upper base 105 and the upper base 105 are disposed in the above embodiment can be applied to the lower base 103. Further, when the edges of the upper and lower substrates 151 and 152 are respectively detected by the optical sensor 114, when the respective substrates 151 and 152 are held by the upper base 1〇5 and the lower base 103, it is considered that the two substrates 151 are The edge positions of 152 are overlapped or approached, and the edges of the respective substrates 15 152 cannot be correctly detected. Therefore, when the edges of the substrates 151 and 152 are detected, the lower substrate 1 〇 3 can be moved in the horizontal direction by the horizontal driving mechanism 131, and the relative positions of the upper and lower substrates 151 and 152 are adjusted to make the upper substrate 151 and the lower substrate. The edges of 152 are outside the detection area of optical sensor 114 for detecting the respective edges. Further, at this time, the optical sensor 114 provided corresponding to the lower base 1〇3 can be integrally mounted with the lower base 103 in the vacuum chamber 101. Further, in the above embodiment, the optical sensor 114 is disposed outside the vacuum chamber 101, but may be provided integrally with the upper base 105 in the vacuum chamber 101. Further, after the optical sensor 114 is used to detect (calculate) the position held by the substrate 151 on the upper substrate 105, the lower substrate 152 is supplied to the lower substrate 103. However, each of the substrates 151 and 152 may be separately After being supplied to the upper and lower bases 103 and 105, the position detection of the upper substrate 151 and the position detection of the lower substrate 152 are sequentially performed. At this time, when the edge of the upper substrate 151 is detected by the optical sensor 114, the lower base 103 can be moved so that the edge of the lower substrate 103 above the lower substrate 103 avoids the detection area of the optical sensor 114. 18 201044082 INDUSTRIAL APPLICABILITY The substrate bonding apparatus and the substrate bonding method of the present invention can be adjusted in the horizontal direction of the upper substrate and the lower substrate, and the substrate bonding method is Useful. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the construction of a substrate bonding apparatus according to an embodiment of the present invention. 〇 Fig. 2 is a flow chart showing the bonding operation of the upper substrate and the lower substrate. Fig. 3 is a view showing a state of the substrate bonding apparatus when the upper substrate is loaded. Fig. 4 is a view schematically showing an example of detecting an edge by an optical sensor. Fig. 5 is a view showing a state of the substrate bonding apparatus when the upper substrate and the lower substrate are occluded. [Description of main component symbols] 100...substrate bonding apparatus 113...camera 101...vacuum chamber 114...optical sensor 102...substrate receiving mechanism 115.·· 吸103... lower base 120' 121 ... Broken window 105... Upper base 131... Elevating drive mechanism 106, 108a, 108b... Pillar 132... Horizontal drive | Set 107a, 107b · · Suction mechanism 140 · Control device 109... Cover portion 151...upper substrate 110...transport robot 152...lower substrate 111...arm portion S101(5)10···Step 19