201038156 六、發明說明： 【發明所屬^^技彳奸領域】 發明領域 本發明關於用以供給可安裝於液晶顯示面板或電路基 板等基板之電子零件之電子零件的供給裝置及供給方法。 【先前4标】 發明背景 要將作為電子零件之TCP(Tape Carrier Package)安裝於 上述基板時，係由承載帶衝壓上述Tcp之後，將該TCp安裝 於基板。於如此的TCP安裝中，若是已由承載帶衝壓tcp， 會有接續著忒衝壓而將上述TCP供給至安裝工程的情形， 及保管由承載帶被衝壓的TCP並因應需要而將上述Tcp供 給至安裝工程的情形。 在不同場所進行衝壓工程與安裝工程的情形下，若是 已由承載帶衝壓TCP，則採用保管該TCP之後者方式。保管 由承載帶被衝壓的TCP的情形下，則使用盤而將於此盤將 被衝壓的TCP收納成行列狀。 但是，僅將TCP收納於盤的話，經過長期間必須保管 TCP時’會有塵埃附著於盤内之Tcp的情形，因此，一旦將 该TCP安裝於基板時，會有導致安裝不良的情形。 特別是，將已由承载帶衝壓的TCP安裝於基板之前， 於該TCP預先附著有黏著性之異方向性導電帶(ACF)的情 形下’由於塵埃易附著於異方向性導電帶，因此僅將TCP 收納於盤的話，則無法確實地保管TCP。 201038156 如此一來，將在衝壓工程已被衝壓的TCP—個一個地 收納於以預定間隔形成複數凹部之零件供給帶之上述凹部 之後，將用以密封上述凹部之開口的覆蓋帶以可剝離地貼 著於該零件供給帶之上述凹部開口的一側面。 以將該零件供給帶捲裝於供給捲筒並予以保管的狀 態，即使該保管經過長期間，塵埃等也不會附著而弄髒已 收納於凹部的TCP。 發明專利文獻1揭示有將電子零件收納於形成在壓花 帶（零件供給帶）的凹部，而以上部帶（覆蓋帶）來密封該凹 部，由上述凹部取出電子零件時剝離上述上部帶以開放凹 部，並以吸著喷嘴由已開放的凹部來吸著的内容。 【發明專利文獻1】 特開平6 — 53274號公報 然而，由壓花帶剝離上部帶時，一旦將上部帶朝剝離 壓花帶之上方拉起時，上部帶因該拉起力而朝上方大幅地 幫*曲。 因此，會有無法確實由墼花帶剝離上部帶的情形，或 是因壓花帶大幅地彎曲而使電子零件從凹部朝外部飛出之 虞。一旦電子零件從凹部飛出，則無法藉由吸著喷嘴取出， 所以，安裝作業會中斷而導致生產性降低。 【發明内容】 發明揭示 本發明之目的在於提供由形成有已收納電子零件之凹 部的零件供給帶剝離覆蓋帶時，不會因覆蓋帶的拉力而使 零件供給帶大幅地彎曲的電子零件之供給裝置及供給方 201038156 法。 Τ- 7·! 丨巧扣甩丁令 置’該電子零件之供給裝Ϊ的特點在於包含有： 零件供給帶，係可預定間隔形成有複數凹部，可於各 凹部收納電子零件，g认， 千且於上述凹部開放之側面貼著有用以 閉塞該等凹部之開Q哺蓋帶者； 供給機構，係供給該零件供給帶者；[Technical Field] The present invention relates to a supply device and a supply method for supplying electronic components that can be mounted on electronic components such as a liquid crystal display panel or a circuit board. [Background 4] Background of the Invention When a TCP (Tape Carrier Package) as an electronic component is mounted on the substrate, the Tcp is pressed by a carrier tape, and then the TCp is mounted on the substrate. In such a TCP installation, if the tcp has been punched by the carrier tape, the TCP may be supplied to the mounting process by the squeezing, and the TCP stamped by the carrier tape may be stored and the Tcp may be supplied to the carrier as needed. The situation of the installation project. In the case of stamping and installation work in different places, if the TCP has been punched by the carrier tape, the method of storing the TCP is adopted. In the case of storing the TCP which is punched by the carrier tape, the disk in which the disk is to be stamped is stored in a matrix using the disk. However, when the TCP is stored in the disk, when TCP is stored for a long period of time, dust may adhere to the Tcp in the disk. Therefore, when the TCP is mounted on the substrate, the mounting failure may occur. In particular, in the case where the TCP which has been stamped by the carrier tape is mounted on the substrate, in the case where the adhesive has an adhesive directional conductive tape (ACF) adhered in advance, the dust is likely to adhere to the anisotropic conductive tape, so that only When TCP is stored in the disk, TCP cannot be reliably stored. 201038156 In this way, after the TCP which has been stamped in the stamping process is housed one by one in the recessed portion of the component supply belt in which the plurality of recesses are formed at predetermined intervals, the cover tape for sealing the opening of the recessed portion is detachably Adhering to one side of the opening of the recess of the part supply belt. In the state in which the component supply tape is wound up in the supply reel and stored, even if the storage period is long, dust or the like does not adhere and the TCP accommodated in the concave portion is soiled. Patent Document 1 discloses that an electronic component is housed in a concave portion formed in an embossed tape (part supply tape), and an upper tape (cover tape) seals the concave portion, and when the electronic component is taken out from the concave portion, the upper tape is peeled off to be opened. The recess and the contents sucked by the open recess by the suction nozzle. [Patent Document 1] However, when the upper belt is peeled off by the embossing belt, when the upper belt is pulled up above the peeling embossing belt, the upper belt is greatly increased upward by the pulling force. Help the land. Therefore, there is a case where the upper belt cannot be peeled off by the embossing belt, or the embossing belt is largely bent to cause the electronic component to fly outward from the concave portion. When the electronic component flies out of the recess, it cannot be taken out by the suction nozzle, so that the mounting work is interrupted and the productivity is lowered. DISCLOSURE OF INVENTION An object of the present invention is to provide an electronic component supply in which a component supply tape is not greatly bent by a tensile force of a cover tape when a component supply tape having a concave portion in which an electronic component is housed is formed. Device and supplier 201038156 method. Τ- 7·! 丨巧扣甩定令' The electronic component supply assembly features: a part supply belt, a plurality of recesses can be formed at predetermined intervals, and electronic components can be stored in each recess. a plurality of open-feeding belts for closing the recesses on the side of the recessed portion; and a supply mechanism for supplying the component supply belt;
f回收機構，係使由該供給機構供給且已由上述凹部 取出上述電子零件之上述零件供給帶行走並予以回收者； I·!離機構’係設於上述供給機構與上述回收機構之 2且:上迹零件供給帶剝離上述覆蓋帶而依順序開放複 數凹部者； Λ 保持機構，係可於藉由該剝離機構由上 ==:時，並保持增件供給帶之剝= 形者；及W阻止上述零件供給帶受上述覆蓋帶拉引變 接受機構，係從藉由上述剝離機構剝離上述覆蓋帶而 開放的上述凹部接受上述電子零件者。讀盍㈣ 又，本發明提供給電子零件之供终 之供給方法係藉φ零件供給〆零件 认也松 π択，，D冤子零件，而該零件供 '，、.帶係以預⑽隔形成有複數凹部，可於各 零::口部開放之側面貼著有用以閉塞該等凹部 ^口的h者，域電子轉之供給枝的特點在於 包含· 5 201038156 供給上述零件供給帶的步驟； 由已被供給之上述零件供給帶剝離上述覆蓋帶並依順 序開放複數凹部的步驟； 由上述零件供給帶剝離上述覆蓋帶時，吸著並保持上 述零件供給帶之剝離上述覆蓋帶部分以阻止上述零件供給 帶變形的步驟；及 由已剝離上述覆蓋帶並已開放之上述凹部接受電子零 件的步驟。 圖式簡單說明 第1圖係顯示本發明之第1實施樣態之電子零件之供給 裝置的概略構成圖。 第2圖係相同保持塊之部分的放大剖面圖。 第3圖係相同零件供給帶的平面圖。 第4圖係顯示本發明之第2實施樣態之零件供給帶的剖 面圖。 第5圖係顯示本發明之第3實施樣態，且係顯示藉由吸 著喷嘴由凹部取出TCP時之變形例的概略構成圖。 第6圖係顯示本發明之第4實施樣態之電子零件之供給 裝置的概略構成圖。 第7圖係顯示本發明之第5實施樣態之顯示零件供給帶 之保持狀態的剖面圖。 第8圖係顯示本發明之第6實施樣態之顯示零件供給帶 之保持狀態的剖面圖。a f-recovery mechanism that causes the component supply belt that is supplied from the supply mechanism and that has taken out the electronic component from the recessed portion to travel and collects the component; the I-! separation mechanism is disposed between the supply mechanism and the recovery mechanism : the upper part supply belt peels off the above-mentioned cover tape and sequentially opens the plurality of recesses; Λ the holding mechanism can be maintained by the peeling mechanism by the upper ==: and keeps the stripping of the add-on supply belt; W is configured to prevent the component supply belt from being subjected to the cover tape pulling and receiving mechanism, and the recessed portion that is opened by peeling off the cover tape by the peeling mechanism receives the electronic component.盍 (4) In addition, the present invention provides a method for supplying the final supply to an electronic component by means of a φ component supply 〆 part 也 択 択 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , A plurality of concave portions are formed, and a side for opening the concave portion can be attached to the side surface of each of the zero:: opening portions, and the supply branch of the domain electrons is characterized by including: 5 201038156 Step of supplying the above-mentioned component supply belt a step of peeling off the cover tape from the supplied component supply tape and sequentially opening a plurality of recesses; and when the cover tape is peeled off by the component supply tape, sucking and holding the component supply tape to peel off the cover tape portion to block a step of deforming the component supply belt; and a step of receiving the electronic component from the recessed portion that has been peeled off from the cover tape and opened. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing a supply device for an electronic component according to a first embodiment of the present invention. Fig. 2 is an enlarged cross-sectional view showing a portion of the same holding block. Figure 3 is a plan view of the same part supply belt. Fig. 4 is a cross-sectional view showing the component supply belt of the second embodiment of the present invention. Fig. 5 is a view showing a schematic configuration of a modification in the case where the TCP is taken out from the concave portion by the suction nozzle, showing a third embodiment of the present invention. Fig. 6 is a schematic block diagram showing a supply device for an electronic component according to a fourth embodiment of the present invention. Fig. 7 is a cross-sectional view showing a state in which the display component supply belt of the fifth embodiment of the present invention is held. Fig. 8 is a cross-sectional view showing a state in which the display component supply belt of the sixth embodiment of the present invention is held.
C實方fe方式]J 201038156 用以實施發明之最佳形態 以下一面參照圖式一面說明本發明之實施樣態。 第1圖至第3圖顯示本發明之第丨實施樣態，第J圖所示 之電子零件之供給裝置包含捲裝有合成樹脂製之零件供給 π1之作為供給機構的供給捲筒2。上述零件供給帶1上如第 2圖與第3圖所示，以預定間距Ρ形成有複數凹部3，各凹部3 收納有例如TCP4作為電子零件。 0 於上述零件供給帶1之凹部3開口的一側面，橫亙全長 貼著有用以閉塞該凹部3之開口的覆蓋帶7。亦即，從未以 圖式顯示之承載帶被衝壓的Tcp4被密封於上述凹部3内。 上述TCP如第3圖所示，於四角形狀之膜4a安裝形成有 半導體晶片4b。上述覆蓋帶7設定成無法閉塞已形成在零件 • 供、帶1之寬度方向兩端之卡合孔5的尺寸，即，設定成較 零件供給帶1之寬度尺寸小的寬度尺寸。 上述構成的零件供給帶丨從上述供給捲筒2朝上方被拉 Ο 引，使卡合孔5卡合第1鏈輪8並將貼著有覆蓋帶7之側面朝 上而將行走方向變換成水平方向。 朝水平方向行走的零件供給帶丨藉由第2鏈輪9而將行 走方向改變成朝下方。上述零件供給帶丨之行走方向改變朝 下方的部分設有帶回收機構10。帶回收機構1〇包含有夹頭 11。此夾頭設於可朝上下方移動的可動板12，藉由設於上 述可動板12之開閉汽缸13而被驅動開閉。上述可動板12藉 由上下汽缸14被朝上下方驅動。 因此，以將上述夾頭11夾著零件供給帶1的狀瘁，藉由 201038156 上述上下汽缸14與可動板12—併朝箭頭Z所示下降方向驅 動的話’可使上述零件供給帶丨被朝第1圖之箭頭X所示方向 行走。如此一來，可建構成上述零件供給帶丨之藉由上述夾 頭11運送的部分被收納於回收容器15。 又，藉由上述夾頭11所造成零件供給帶1之運送長度設 定成與形成在此零件供給帶1之凹部3的間距p相同。 在上述第1鏈輪8與第2鏈輪9之間，作為保持機構之保 持塊16配設成上面與上述零件供給帶丨之下面約相同高 度。此保持塊16的上面如第2圖所示形成有上述零件供給帶 1之凹部3可進入之凹狀的落差部17。 上述落差部17開孔有複數吸取孔18。第2圖中顯示開孔 开/成有3個吸取孔18。零件供給帶1之凹部3的寬度方向， 即’與零件供給帶丨之行走方向交又的方向也開孔形成有複 數列，此實施樣態中，吸取孔18開孔形成有3列。亦即，建 構成保持塊16傾向形成有9個吸取孔18，可吸取全部零件供 給帶1的凹部3。 士又，上述吸取孔18具有由零件供給帶i剝離覆蓋帶7 日守’可將㈣供給帶丨之底面確實押上保持塊⑽功用即 =所以，上述吸取孔18可僅吸取上如則之覆蓋帶％ :。制離側之-端部下面即可’以取代全體地吸取凹部⑽ 此主吸取路19朝上 吸取泵21藉由開閉 複數吸取孔18連通於主吸取路19。 述保持塊丨6之側面開口，如第丨圖所示， 控制閩22而連接於該開口。 201038156 建構成以上述吸取泵21動作的狀態下，當上述開閉控 制閥22開放時，進入上述保持塊16之落差部17之上述零件 供給帶1之凹部3的下面被吸取並保持。 又’建構成藉由兩側面形成有傾斜面之矩形環狀的突 條16a而形成上述落差部17，使零件供給帶1行走時，該凹 部3圓滑順行地進入上述落差部17内。 上述保持塊16的上面側設有剝離機構23。此剝離機構 23具有使軸線沿著上述零件供給帶丨之寬度方向於上下方 向以預定間隔分開且較上述零件供給帶丨之寬度尺寸長的 長形的第1、第2剝離桿24、25。位於下側的第1剝離桿24的 位置係較位於上側之第2剝離桿2 5更靠近零件供給帶1之行 走方向的下游側。 第1、第2剝離桿24、25之由上述零件供給帶1之寬度方 向兩端突出的兩端部分別連結有一對連結板26(僅以圖式 顯不一側）。此連結板26連結有水平汽缸27的桿27a。建構 成若是水平汽缸27作動’則使上述剝離機構23朝水平方向 往返驅動。水平汽虹27所造成剝離機構23的驅動距離設定 成與形成在上述零件供給帶1之相鄰的一對凹部3的間距p 約相等。 即’建構成上述第1、第2剝離桿24、25在第1圖實線表 示的位置與以虛線表示的位置之間往返驅動。 貼著於上述零件供給帶1之一側面即上面的上述覆蓋 π7可藉由上述剝離機構23而剝離。即，使上述覆蓋帶7卡 合第1剝離桿24而使行走方向朝與箭頭X方向反方向變換 201038156 後，使卡合上述第2剝離桿25而被捲取捲筒28所捲取。建構 成此捲取捲筒28藉由旋轉驅動源29而被旋轉驅動· 如此一來，當上述剝離機構23之第1、第2剝離桿24、 25藉由上述水平汽缸27朝與箭頭X表示零件供給帶1之行走 方向反方向驅動時’上述覆蓋帶7依據該移動距離而可由上 述零件供給帶1的上面剝離。 此時’零件供給帶1藉由覆蓋帶7被朝上方拉引，然而， 零件供給帶1之剝離上述覆蓋帶7部分的下面，即，位於保 持塊16之落差部17之凹部3的底面被此落差部π吸著並保 持。 所以’即使上述零件供給帶1之與保持塊16上面對應的 部分藉由覆蓋帶5而被朝上方拉引’也能阻止上述零件供給 帶1朝上方彎曲。 剝離上述覆蓋帶7時，若是零件供給帶1不向上方彎 曲，則依據捲取捲筒28所造成的捲取長度而能從上述零件 供給帶1上面確實地剝離覆蓋帶7。 而且’由於零件供給帶1不會朝上方彎曲，因此以剝離 覆蓋帶7的狀態而使凹部3之上面開口開放，已收納於凹部3 内的TCP4也不會朝外部飛出。 如第2圖所示，當上述覆蓋帶7由上述零件供給帶丨上面 剝離而開放已形成在覆蓋帶7的凹部3時，已收納在該凹部3 之TCP4會露出。此TCP藉由接受機構30被取出。此接受機 構30包含有吸著而吸出上述PCT4的吸著噴嘴31。 建構成上述吸著喷嘴31藉由X. γ. Z驅動源32而朝χ、 201038156 Y及Z方向驅動，如第2圖所示定位於已開放之凹部3上方 後，朝箭頭Z所不下降方向驅動，而由凹部3内吸著而取出 TCP4。 由上面開口開放的凹部3取出TCP4的上述吸著噴嘴^ 將其TCP4暫時安置於未以圖式顯示之基板之貼著有異方 向性導電帶的端子部分。暫時安置於基板之丁⑽藉由未以 圖式顯示之安裝工具而被壓著並安裝。 〇 又，基板也可不貼著異方向性導電帶而於TCP4貼著異 方向性導電帶。 、 依據如此構成之TCP4的供給裝置，使零件供給帶1在 第1鏈輪8與第2鏈輪9之間水平行走，而在水平行走部分的 中途部，以形成在保持塊16上面的落差部17吸著並保持已 • 形成在零件供給帶1之凹部3的下面而剝離覆蓋帶7。 即，為了從凹部3取出TCP4，於開放該凹部3時，以保 持塊16之上面來吸著並保持此零件供給帶〖之與剝離覆蓋 Ο 帶7處對應之凹部3的下面。 所以，即使零件供給帶丨藉由覆蓋帶7而被朝上方拉 弓丨，也能防止此零件供給帶丨朝上方浮起而彎曲因此，不 僅能確實進行剝離覆蓋帶7，且不會使已收納於凹部3⑽ PCT4朝外部飛出。 建構成上述覆蓋帶7藉由水平汽红27而使此覆蓋帶7卡 合之第1、第2剝離桿24、25從第1圖以實線表示的位置水平 行動至以虛線表示的位置，以由零件供給帶1剝離。所以’ 藉由上述第1、第2剝離桿24、25可確實且容易地進行上述 201038156 覆蓋帶7的剝離。 而且藉tx於保持塊16上面的矩形環狀的突條⑹而 支撐零件供給帶1下面之凹部3的周邊部分，因此，能藉由 第1剝離桿24-面將零件供給帶丨押附於突條⑹上面而一 面由零件供給帶1剝離覆蓋帶7。 所以’零件供給帶1之凹部3的下面可被保持塊16之上 面的落差部17確實地吸取，因此，依據此狀態也可防止零 件供給帶1的浮起而能確實進行上述覆蓋帶7的剝離。 如此一來，若是由零件供給帶1剝離覆蓋帶7而使凹部3 開放，並藉由吸著喷嘴31從該凹部3取出Tcp4，則藉由夾 頭11使零件供給帶1僅行走與間距p對應的尺寸。 此時，藉由水平汽缸27使剝離機構23之上述第1、第2 剝離桿24、25從第1圖以鏈線表示的位置與零件供給帶1之 行走同步驅動至以實線表示的位置。 而且’此時使旋轉驅動源29與上述水平汽缸27之驅動 同步並作動’使由零件供給帶丨剝離之覆蓋帶7被捲取捲筒 28捲取，以防止覆蓋帶7鬆弛。 如此一來’保持塊16上面的落差部17内，TCP4未被取 出之下一個凹部3被定位且被吸著並保持，因此，可如上述 反覆進行覆蓋帶7的剝離與由凹部3取出TCP4。 又’剝離覆蓋帶7時，藉由水平汽缸27使剝離機構23之 連結板26由第1圖以實線表示的位置朝水平方向移動至鏈 線表示的位置，但是，可改變為將剝離機構23之第1、第2 剝離桿24、25預先定位於以鏈線表示的位置。即，先將第1、 12 201038156 第2剝離桿24、25固定地設置於以鏈線表示的位置。 藉由夾頭11使零件供給帶丨朝箭頭χ方向行走時，以對 應戎行走距離的長度將覆蓋帶7捲取於捲取捲筒28的話，可 藉由捲取捲筒28之捲取力而由零件供給帶丨剝離覆蓋帶7。 亦即，即使不將刺離機構23朝水平方向驅動，也能剝離覆 蓋帶7。 4 第4圖顯示本發明之第2實施樣態之零件供給帶丨的剖 面圖。此實施樣態中，收納於凹部3之作為電子零件的了口以 〇 係於被衝壓成預定形狀之膜4a安裝有半導體晶片4b，此半 導體晶片4b被樹脂4C包覆著。即，半導體晶片牝被封裝處 理著。 相對於此，於上述零件供給帶丨之凹部3之底部，形成 - 有在使半導體晶片4b朝下而將TCP4收納於凹部3時，半導 ' 體晶片4b進入之凹狀的定位部la。 因此，已收納凹部3的TCP4以藉由樹脂4c包覆的半導體 晶片4b進入上述定位部la的狀態定位於凹部3内，而被限制 〇 在凹部3内的偏移。所以，藉由吸著喷嘴31能良好精度確實 地取出TCP4。 上述零件供給帶1之凹部3之内側的大小與TCP4之外 側的大小若是有可藉由吸著喷嘴31取出TCP4程度的尺寸 差所造成的間隙’通常為3mm程度之間隙的話，藉由上述 吸著喷嘴31取出時幾乎不會構成問題。 上述凹部3内的TCP4藉由吸著喷嘴31而被取出，並被 暫時安置於可安裝此PCT4之未以圖式顯示的基板上。此 13 201038156 時，TCP4與基板分別被未以圖式顯示之攝像照相機所拍攝 而被辨識位置。所以，要求凹部3内的PCT4要位於不脫離 攝像照相機之視野範圍的範圍内。 例如，攝像照相機之視野範圍為3mm程度的情形下， 藉由吸著噴嘴31從凹部3取出TCP4時，即便是考量到取出 時的偏移量，若是為1mm程度之偏移量可被容許。 所以，為了設成可藉由吸著喷嘴31從凹部3取出 TCP4，即使凹部3與PCT4有3mm的間隙，使TCP4之藉由樹 脂4c所包覆之半導體晶片4b進入凹部3的定位部la的狀 態，能使TCP4相對於凹部3以1mm程度的範圍内的位置偏 移量定位’因此’可藉由吸著喷嘴31以良好精度取出上述 TCP4 ° 如此一來’也可簡略化由凹部3取出TCP4的後工程， 即’可簡略化安裝工程中TCP4之對準（位置修正），因此， 可達到節拍時間（Takt time)的減少與對準設備例如定位機 構與照相機等設備的簡略化。 第5圖顯示本發明之第3實施樣態。此實施樣態建構成 剝離覆蓋帶7時，藉由吸著喷嘴31由零件供給帶丨之凹部3取 出TCP4時，藉由利用上下驅動源35而被上下驅動之後備工 具36來保持凹部3下面的一部分，以取代將第丨實施樣態所 示之保持塊16。 即，建構成藉由零件供給帶1之凹部3來部分地支撐 TCP4之與藉由吸㈣嘴31吸著之上面對應部分的下面。上 述後備具36之吸錢料料供㈣丨之吸祕如形成 14 201038156 朝上面開口，此吸取孔如連接未㈣式顯示的吸取果。 零件供給帶1行走 如此構成的話，使零件供給帶1行走時可使後備工具36 下降而從零件供給帶1的下_開，因此，可圓滑順利地使 於第5圖中’後備工具36支擇零件供給帶1之凹部3 下面全體，吸取孔36a可設置複如構成均—地吸取凹部3 的下面全體。C real mode] J 201038156 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figs. 1 to 3 show a third embodiment of the present invention, and the supply device for an electronic component shown in Fig. J includes a supply reel 2 as a supply mechanism for supplying a component π1 made of synthetic resin. As shown in Figs. 2 and 3, the component supply belt 1 has a plurality of recesses 3 formed at predetermined intervals, and each recess 3 accommodates, for example, TCP4 as an electronic component. 0 is a side surface of the opening of the recessed portion 3 of the component supply belt 1, and a cover tape 7 for closing the opening of the recessed portion 3 is attached to the entire length of the crosspiece. That is, the Tcp 4 which has not been stamped by the carrier tape shown in the figure is sealed in the above-mentioned recessed portion 3. As shown in Fig. 3, the TCP described above is formed by mounting a semiconductor wafer 4b on the film 4a having a quadrangular shape. The cover tape 7 is set such that the size of the engagement hole 5 formed at both ends in the width direction of the component/belt 1 cannot be closed, that is, the width dimension smaller than the width dimension of the component supply tape 1. The component supply tape 上述 having the above configuration is pulled upward from the supply reel 2, and the engagement hole 5 is engaged with the first sprocket 8 and the side surface on which the cover tape 7 is attached is turned upward to convert the traveling direction into horizontal direction. The component supply belt that travels in the horizontal direction changes the traveling direction downward by the second sprocket 9. A belt recovery mechanism 10 is provided in a portion where the traveling direction of the component supply belt 改变 is changed downward. The belt recovery mechanism 1 includes a collet 11. The chuck is provided on the movable plate 12 which is movable upward and downward, and is driven to open and close by the opening and closing cylinder 13 provided in the movable plate 12. The movable plate 12 is driven upward and downward by the upper and lower cylinders 14. Therefore, when the chuck 11 is sandwiched between the component supply belts 1 and the upper and lower cylinders 14 and the movable plate 12 are driven in the downward direction indicated by the arrow Z in 201038156, the component supply belt can be turned toward Walking in the direction indicated by the arrow X in Fig. 1. In this manner, the portion of the component supply belt that is transported by the chuck 11 can be stored in the recovery container 15. Further, the transport length of the component supply belt 1 by the chuck 11 is set to be the same as the pitch p formed in the recess 3 of the component supply belt 1. Between the first sprocket 8 and the second sprocket 9, the holding block 16 as a holding mechanism is disposed such that the upper surface is about the same height as the lower surface of the component supply belt 丨. As shown in Fig. 2, the upper surface of the holding block 16 is formed with a concave portion 17 into which the concave portion 3 of the component supply belt 1 can enter. The step portion 17 has a plurality of suction holes 18 in the opening. In Fig. 2, the opening is opened and the three suction holes 18 are formed. In the width direction of the recessed portion 3 of the component supply belt 1, i.e., the direction in which the direction in which the component supply belt is moved is also formed in a plurality of rows. In this embodiment, the suction holes 18 are formed in three rows. That is, the retaining block 16 is formed to have nine suction holes 18 which can be sucked into the recesses 3 of the entire component supply belt 1. Further, the suction hole 18 has a cover tape 7 peeled off from the component supply belt i. The bottom surface of the supply belt can be held by the holding block (10). Therefore, the suction hole 18 can be sucked only by the upper cover. With % :. The side of the side of the separation side is just below the end portion. Instead of sucking the recess portion (10) as a whole, the main suction path 19 is upward. The suction pump 21 is connected to the main suction path 19 by opening and closing the plurality of suction holes 18. The side opening of the holding block 6 is connected to the opening as shown in the figure. In the state in which the suction pump 21 is operated, when the opening and closing control valve 22 is opened, the lower surface of the recessed portion 3 of the component supply belt 1 that has entered the step portion 17 of the holding block 16 is sucked and held. Further, the above-described step portion 17 is formed by a rectangular ring-shaped projecting strip 16a having inclined surfaces formed on both side surfaces, and when the component supply belt 1 is moved, the recessed portion 3 smoothly enters the inside of the step portion 17. A peeling mechanism 23 is provided on the upper surface side of the holding block 16. The peeling mechanism 23 has elongated first and second peeling bars 24 and 25 which are spaced apart from each other at a predetermined interval in the width direction of the component supply tape 且 and which are longer than the width dimension of the component supply tape. The position of the first peeling bar 24 located on the lower side is closer to the downstream side of the traveling direction of the component supply belt 1 than the second peeling bar 25 located on the upper side. A pair of connecting plates 26 (only one side of the drawing) are connected to the both end portions of the first and second peeling bars 24 and 25 which are protruded from both ends in the width direction of the component supply belt 1. This link plate 26 is coupled to the rod 27a of the horizontal cylinder 27. If the horizontal cylinder 27 is actuated, the peeling mechanism 23 is reciprocated in the horizontal direction. The driving distance of the peeling mechanism 23 caused by the horizontal steam rainbow 27 is set to be approximately equal to the pitch p of the pair of concave portions 3 formed adjacent to the component supply belt 1. In other words, the first and second peeling bars 24 and 25 are configured to be reciprocally driven between a position indicated by a solid line in Fig. 1 and a position indicated by a broken line. The cover π7 attached to the upper surface of one of the component supply belts 1 can be peeled off by the peeling mechanism 23. In other words, the cover tape 7 is engaged with the first peeling bar 24, and the traveling direction is reversed in the direction of the arrow X. 201038156. Then, the second peeling bar 25 is engaged and wound up by the take-up reel 28. The winding reel 28 is rotatably driven by the rotation driving source 29. Thus, the first and second peeling bars 24, 25 of the peeling mechanism 23 are indicated by the horizontal cylinder 27 toward the arrow X. When the traveling direction of the component supply belt 1 is driven in the reverse direction, the cover tape 7 can be peeled off from the upper surface of the component supply belt 1 in accordance with the moving distance. At this time, the 'part supply belt 1 is pulled upward by the cover tape 7, however, the part supply belt 1 is peeled off the lower surface of the cover tape 7, that is, the bottom surface of the concave portion 3 located at the falling portion 17 of the holding block 16 is This drop portion π is sucked and held. Therefore, even if the portion of the component supply belt 1 corresponding to the upper surface of the holding block 16 is pulled upward by the cover tape 5, the component supply belt 1 can be prevented from being bent upward. When the cover tape 7 is peeled off, if the component supply tape 1 is not bent upward, the cover tape 7 can be reliably peeled off from the upper surface of the component supply tape 1 in accordance with the winding length caused by the take-up reel 28. Further, since the component supply belt 1 does not bend upward, the upper surface of the recessed portion 3 is opened in a state where the cover tape 7 is peeled off, and the TCP 4 accommodated in the recessed portion 3 does not fly outward. As shown in Fig. 2, when the cover tape 7 is peeled off from the upper surface of the component supply tape, and the concave portion 3 formed in the cover tape 7 is opened, the TCP 4 accommodated in the concave portion 3 is exposed. This TCP is taken out by the receiving mechanism 30. The receiving mechanism 30 includes a suction nozzle 31 that sucks and sucks out the PCT 4. The absorbing nozzle 31 is configured to be driven by the X. γ. Z driving source 32 toward the χ, 201038156 Y and Z directions, and positioned below the opened recess 3 as shown in FIG. 2, does not fall toward the arrow Z. The direction is driven, and the TCP 4 is taken out by the inside of the recess 3. The suction nozzle of the TCP 4 is taken out from the recess 3 in which the upper opening is opened, and the TCP 4 is temporarily placed on the terminal portion of the substrate which is not shown in the figure and which is adhered with the anisotropic conductive tape. The dicing (10) temporarily placed on the substrate is pressed and mounted by an installation tool not shown in the drawings. 〇 Further, the substrate may be attached to the TCP4 with an anisotropic conductive tape without adhering to the opposite-direction conductive tape. According to the TCP 4 supply device configured as described above, the component supply belt 1 is horizontally moved between the first sprocket 8 and the second sprocket 9, and the drop formed on the holding block 16 is formed in the middle portion of the horizontal traveling portion. The portion 17 is sucked and held to be formed under the recess 3 of the component supply belt 1 to peel off the cover tape 7. That is, in order to take out the TCP 4 from the recess 3, when the recess 3 is opened, the lower surface of the recessed portion 3 corresponding to the peeling cover tape 7 is sucked and held by the upper surface of the holding block 16 by the holding block 16. Therefore, even if the component supply tape is pulled upward by the cover tape 7, the component supply tape can be prevented from floating upward and bent, so that not only the cover tape 7 can be surely peeled off, but also Stored in the recess 3 (10) PCT4 flies outward. The first and second peeling bars 24 and 25 constituting the cover tape 7 by the horizontal vapor red 27 and engaging the cover tape 7 are horizontally moved from a position indicated by a solid line in FIG. 1 to a position indicated by a broken line. Stripped by the part supply belt 1. Therefore, the peeling of the cover tape 7 of 201038156 described above can be reliably and easily performed by the first and second peeling bars 24 and 25 described above. Further, the peripheral portion of the recess 3 under the component supply belt 1 is supported by the rectangular annular projections (6) on the holding block 16 by tx, so that the component supply belt can be attached to the second peeling rod 24-side. The cover strip 7 is peeled off from the part supply belt 1 while the ridge (6) is on the upper side. Therefore, the lower surface of the recessed portion 3 of the component supply belt 1 can be surely sucked by the falling portion 17 on the upper surface of the holding block 16, and therefore, the floating of the component supply belt 1 can be prevented according to this state, and the above-described cover tape 7 can be surely carried out. Stripped. In this manner, if the cover tape 7 is peeled off by the component supply belt 1 and the recessed portion 3 is opened, and the Tcp 4 is taken out from the recessed portion 3 by the suction nozzle 31, the component supply belt 1 is moved only by the chuck 11 and the pitch p The corresponding size. At this time, the horizontal cylinder 27 causes the first and second peeling bars 24 and 25 of the peeling mechanism 23 to be driven from the position indicated by the chain line in FIG. 1 to the position of the component supply belt 1 to the position indicated by the solid line. . Further, at this time, the rotary drive source 29 is synchronized with the driving of the horizontal cylinder 27 and actuated to cause the cover tape 7 peeled off by the component supply belt to be taken up by the take-up reel 28 to prevent the cover tape 7 from being slack. Thus, in the drop portion 17 above the holding block 16, the TCP 4 is not taken out and the next recess 3 is positioned and sucked and held, so that the peeling of the cover tape 7 and the removal of the TCP 4 by the recess 3 can be repeated as described above. . Further, when the cover tape 7 is peeled off, the horizontal plate 27 moves the connecting plate 26 of the peeling mechanism 23 from the position indicated by the solid line in FIG. 1 to the position indicated by the chain line in the horizontal direction, but can be changed to the peeling mechanism. The first and second peeling bars 24, 25 of 23 are previously positioned at positions indicated by chain lines. That is, the first and second 201038156 second peeling bars 24 and 25 are fixedly disposed at positions indicated by chain lines. When the component supply belt 行走 is moved in the direction of the arrow 藉 by the collet 11, the take-up reel 28 can be taken up by the take-up reel 28 by the length of the 戎 travel distance. The cover tape 7 is peeled off by the part supply tape. That is, the cover tape 7 can be peeled off even if the lancing mechanism 23 is not driven in the horizontal direction. 4 is a cross-sectional view showing a component supply belt 第 according to a second embodiment of the present invention. In this embodiment, the semiconductor wafer 4b is mounted on the film 4a which is housed in the concave portion 3 as an electronic component, and the semiconductor wafer 4b is covered with the resin 4C. That is, the semiconductor wafer cassette is packaged and processed. On the other hand, at the bottom of the recessed portion 3 of the component supply tape, a positioning portion 1a having a concave shape in which the semiconductor wafer 4b enters when the semiconductor wafer 4b faces downward and the TCP 4 is housed in the recess 3 is formed. Therefore, the TCP 4 having the recessed portion 3 is positioned in the recessed portion 3 in a state where the semiconductor wafer 4b covered with the resin 4c enters the positioning portion 1a, and is restricted from being displaced in the recessed portion 3. Therefore, the TCP 4 can be reliably taken out with good precision by the suction nozzle 31. The size of the inner side of the recessed portion 3 of the component supply belt 1 and the size of the outer side of the TCP 4 may be a gap of about 3 mm due to a difference in size of the TCP 4 by the suction nozzle 31. When the nozzle 31 is taken out, it hardly poses a problem. The TCP 4 in the recess 3 is taken out by the suction nozzle 31, and is temporarily placed on a substrate on which the PCT 4 can be mounted. At the time of this 2010 2010156, the TCP4 and the substrate are respectively recognized by the imaging camera not shown in the figure. Therefore, it is required that the PCT 4 in the recess 3 is located within a range that does not deviate from the field of view of the camera. For example, when the field of view of the imaging camera is about 3 mm, when the TCP 4 is taken out from the recess 3 by the suction nozzle 31, even if the amount of shift at the time of taking out is taken into consideration, the amount of shift of about 1 mm can be tolerated. Therefore, in order to provide the TCP 4 from the recess 3 by the suction nozzle 31, even if the recess 3 and the PCT 4 have a gap of 3 mm, the semiconductor wafer 4b covered by the resin 4c of the TCP 4 enters the positioning portion 1a of the recess 3. In the state, the TCP 4 can be positioned with respect to the recess 3 by a positional shift within a range of about 1 mm. Therefore, the TCP 4 ° can be taken out with good precision by the suction nozzle 31. Thus, the recess 3 can be simply removed. The post-engineering of TCP4, that is, the alignment (position correction) of TCP4 in the installation engineering can be simplified, so that the reduction of the takt time and the simplification of the aligning device such as the positioning mechanism and the camera can be achieved. Fig. 5 shows a third embodiment of the present invention. When the embodiment of the embodiment is constructed to peel off the cover tape 7, when the TCP 4 is taken out from the recess 3 of the component supply tape by the suction nozzle 31, the tool 36 is driven up and down by the upper and lower drive source 35 to hold the recess 3 below. Part of it, in place of the holding block 16 shown in the third embodiment. Namely, it is constructed such that the concave portion 3 of the component supply belt 1 partially supports the lower surface of the corresponding portion of the TCP 4 and the upper portion sucked by the suction nozzle. The sucking material of the rearware 36 is provided for (4) the suction of the sputum is formed as follows. 14 201038156 Opening to the top, the suction hole is connected to the suctioned fruit shown by the type (4). When the component supply belt 1 is configured as described above, when the component supply belt 1 is moved, the backup tool 36 can be lowered and the lower portion of the component supply belt 1 can be opened. Therefore, the backup tool 36 can be smoothly and smoothly carried out in FIG. The entire lower portion of the recessed portion 3 of the component supply belt 1 is selected, and the suction hole 36a may be provided so as to constitute the entire lower surface of the uniform suction recess 3.
特別是’形成有凹部3之蹩杜祝 心▽件供給帶1的下面為凹凸 狀’因此糟由將後備工具3 6從愛杜板认* , 攸；件供給帶1下面離開而能圓 滑順行地行走。 又’上述後備工具36的上關σ形成有吸取孔36a，於 剝離覆蓋帶7時’上述後備工具咖著並保持凹部3的外 部，也能防止零件供給帶丨朝上方彎曲變形。 第6圖顯示本發明的第4實施樣態。又，對於與第1實施 樣態相同部分賦與相同記號而省略說明。#，此實施樣態 中，零件供給帶1建構成由供給捲筒2朝下方伸出，被第（鍵 輪8與第2鏈輪9導引而朝水平方向行走。 零件供給帶1將貼著有用以閉塞凹部3之開口之覆蓋帶 7的側面朝下而使其水平行走。建構成較此零件供給帶丄之 第2鏈輪更靠下游側的部分被朝上方導引，而藉由夾頭⑽ 預疋的間距P被運送。 作為吸著並保持零件供給帶！之保持機構的保持塊16 與I件供給帶1之水平行走的部分之中途部上面對向而配 置，剝離機構23與下面側對向而配置。 15 201038156 藉由上述剝離機構23由零件供給帶丨剝離覆蓋帶7而開 放凹部3的開口時，該凹部3内的PCT4藉由作為接受機構的 接受搬送機構40而被接受。又，由零件供給帶1剝離並藉由 夾頭11被朝上方運送的覆蓋帶7,藉由反轉導輥38而朝下方 改變方向益被回收容器15回收。 上述接受搬送機構4 〇包含有沿著零件供給帶丨之行走 方向配置的線性導件41。此線性導件41設有可藉由線性馬 達（未以圖式顯示）而驅動的接受具42。 上述接受具42上面形成有與上述PCT4對應大小之凹 狀的接受部43。此接受部43上面開口形成有複數吸取孔 44。複數吸取孔44與主吸取路45連通。此主吸取路45藉由 開閉控制闊22而與吸取泵21連接。 藉由上述剝離機構23剝離覆蓋帶7時，與剝離機構23之 第1、第2剝離桿24 ' 25的移動同步，上述接受具42被朝與 剝離機構23相同方向驅動。即，建構成以藉由剝離機構23 剝離覆蓋帶7的狀態，與開放凹部3之開口同時，上述接受 具42朝已開口之凹部3的下方移動。 當剝離覆蓋帶7而凹部3之開口全體開放時，凹部3内的 PCT4被交付至上述接受具42。上述接受具42之吸取孔42可 產生吸取力。如此一來，開放凹部3時，已收納在凹部3内 的TCP4藉由吸取力而確實地落至上述接受具42的接受部 43。即，吸取力可增進TCP4由凹部3落下。 已接受T C P 4之接受具4 2沿著線性導件41由被驅動至 離開第2鏈輪9的位置。因此，接受具42所載置之TCP4被吸 16 201038156 著噴嘴（未以圖式顯示）吸著而搬送至基板（未以圖式顯示） 的安裝位置。 如此一來，將凹部3的開口朝下而使零件供給帶1行走 的話，剝離覆蓋帶7而開放凹部3的開口時，PCT4易從凹部 3落下，且使接受TCP4之接受具42的接受部43產生吸取力 的狀態下，能使PCT4確實從凹部3落下並交付至接受具42。 而且，由零件供給帶1剝離覆蓋帶7時，零件供給帶1之 剝離覆蓋帶7的部分與第1實施樣態同樣可藉由保持塊16而 被吸著並保持，因此，可防止零件供給帶1朝下方彎曲變 形。藉此，能藉由剝離機構23確實進行覆蓋帶7的剝離。 再者，使於接受部43已接受TCP4之接受具42沿著線性 導件41移動至下一工程之機械臂（未以圖式顯示）的移動範 圍的狀態下，能將已收納於上述接受具42之接受部43的 TCP4交付至下一工程。 如此一來，可不須要將已收納於上述接受具42之接受 部43的TCP4予以取出並交付至下一工程的取出專用機械 臂。 第7圖顯示本發明之第5實施樣態。此實施樣態建構成 對於使零件供給帶1之凹部3的開口朝下行走的第4實施樣 態，在剝離覆蓋帶7時，藉由導向構件48將零件供給帶1之 寬度方向的兩端支撐成可行走。 如此構成的話，能確實防止在剝離覆蓋帶7時零件供給 帶1因覆蓋帶7接到拉引力而向下方彎曲。 第8圖顯示本發明之第6實施樣態。此實施樣態係對於 17 201038156 第7圖所示第5實施樣態，於零件供給帶1之凹部3形成TCP4 之藉由樹脂4c包覆的半導體晶片4b可進入之凹狀的定位部 la。 如此一來’ TCP4在凹部3内偏移移動受到限制，因此 剝離覆蓋帶7時能使TCP4確實落到接受具42的接受部43。 若是考量於後工程中將PCT4暫時安置於基板上的情 形’上述PCT4在凹部3内偏移移動的量設為最大imm程度 為宜。 又’使PCT4從零件供給帶1落下而交付至接受部43的 狀態下，會擔心於PCT4產生位置偏移。但是’接受部43的 形狀為凹狀。因此’預先相對於上述PCT4設定上述接受部 43之大小’以使上述PCT4在接受部43内為1mm程度之範圍 内之位置偏移量的話，則能藉由吸著喷嘴31以精度良好地 從上述接受部43取出PCT4。 其結果，也可簡略化由接受部43取出TCP4的後工程， 即，可簡略化安裝工程中TCP4之對準（位置修正），因此， 可達到節拍時間的減少與對準設備例如定位機構與照相機 荨設備的簡略化。 又，上述各實施樣態中，已說明舉出TCp之例作為電 子零件，然而，即使是TCP以外的電子零件，例如IC晶片 或其他電子零件也無妨。 又，本發明除了具有上述各實施樣態所說明的作用效 果’更具有以下所述的作用效果。 由承載帶衝壓TCP4時，會產生承載帶的材質即玻璃環 201038156 氧樹脂或聚ϋ亞胺樹脂的屑、引線或配線材之A卜Cu、Ag、 Au等金屬的屑、或是⑪的屑，此等屑會附著於Tcp4而殘 召，於將TCP4安裝於基板時，會有進入TCp4與基板之引線 之間而導致安裝不良之虞。 即便是在將TCP4安裝於基板前去除已附著於TCp4i 屬’若是TCP4露出到大氣中，會有上述屬或空氣中的塵埃 附著於該PCT4而導致安裝不良之虞。 然而，本發明中零件供給帶丨之凹部3的開口在由凹部3 取出TCP4之前細覆蓋帶7職著，因此，在祕覆蓋帶7 之前，上述凹部3内空間之氣密被維持著。 所以’將TCP4收納於凹部3内並將利用覆蓋帶7密封凹 部3之則，以IPA(異丙醇）等洗淨液來洗淨已由承載帶被衝壓 的TCP4以去除各種屑與塵埃之後，並使該pCT4乾燥之後， 收納至凹部3内而利用覆蓋帶7密封該凹部3。 如此構成的話，即使在將TCP4暫時安置於基板之後至 安裝前之間，基板與TCP4之引線間進入各種屑或塵埃等， 或是因電路的細微化而使引線細狹窄化，各種屑或塵埃幾 乎無附著於TCP4的機會，所以，可確實防止相鄰的引線因 各種屑或塵埃而導致短路等安裝不良。 而且，以樹脂帶作為基材的TCP4會有吸收空氣中的水 分而發生延伸的情形。但是，若是將零件供給帶丨之凹部3 内的濕度設成例如0〜20%並利用覆蓋帶7密封凹部3的 話’能防止凹部3内的PCT4發生延伸。 如此一來，一旦由零件供給帶1剝離覆蓋帶7以開放凹 19 201038156 部3的話，若是迅速地將該凹部3内的PCT4暫時安置於基板 之後進行安裝的話，能防止因TCP4的延伸導致安裝精度降 低。 產業之可利用性 依據本發明，建構成由零件供給帶剝離覆蓋帶時，吸 著並保持零件供給帶之剝離覆蓋帶的部分，因此，能防止 於剝離覆蓋帶時零件供給帶大幅地彎曲而使覆蓋帶之剝離 不確實或電子零件由零件供給帶之凹部飛出。 【圖式簡單説明】 第1圖係顯示本發明之第1實施樣態之電子零件之供給 裝置的概略構成圖。 第2圖係相同保持壤之部分的放大剖面圖。 第3圖係相同零件供給帶的平面圖。 第4圖係顯示本發明之第2實施樣態之零件供給帶的剖 面圖。 第圖係顯示本發明之第3實施樣態，且係顯示藉由吸 著喷嘴由凹縣出TCp時之變形例的概略構成圖。 第6圖係顯示本發明之第4實施樣態之電子零件之供給 裝置的概略構成圖。 第7圖係顯不本發明之第5實施樣態之顯示零件供給帶 之保持狀態的剖面圖。 第8圖係顯示本發明之第6實施樣態之顯示零件供給帶 之保持狀態的剖面圖。 【主要兀件符魏說明】 20 201038156In particular, 'the lower surface of the supply belt 1 having the concave portion 3 is formed in a concave-convex shape', so that the backup tool 36 is recognized from the Ai Du board, and the piece is left under the supply belt 1 to be smoothly and smoothly walk. Further, the upper cover σ of the backup tool 36 is formed with the suction hole 36a. When the cover tape 7 is peeled off, the backup tool can hold and hold the outer portion of the concave portion 3, and the component supply tape can be prevented from being bent and deformed upward. Fig. 6 shows a fourth embodiment of the present invention. The same components as those in the first embodiment are denoted by the same reference numerals and will not be described. In this embodiment, the component supply belt 1 is constructed such that the supply reel 2 projects downward, and is guided by the key wheel 8 and the second sprocket 9 to travel in the horizontal direction. The component supply belt 1 will be attached. The side of the cover tape 7 that occludes the opening of the recess 3 is turned downward to be horizontally moved. The portion on the downstream side of the second sprocket that is configured to be larger than the component supply belt is guided upward. The chuck P (10) is transported at a predetermined pitch P. The retaining block 16 as a holding mechanism for sucking and holding the component supply belt is disposed opposite to the upper portion of the horizontal traveling portion of the one-piece supply belt 1, and the peeling mechanism is disposed. 23 is disposed opposite to the lower side. 15 201038156 When the cover tape 7 is peeled off from the component supply tape by the peeling mechanism 23 and the opening of the concave portion 3 is opened, the PCT 4 in the concave portion 3 is received by the transfer mechanism 40 as a receiving mechanism. Further, the cover tape 7 which is peeled off by the component supply belt 1 and conveyed upward by the chuck 11 is retracted downward by the reverse guide roller 38 to be recovered by the recovery container 15. 4 〇 Contains belts along the parts 丨a linear guide 41 disposed in the traveling direction. The linear guide 41 is provided with a receiving member 42 that can be driven by a linear motor (not shown). The receiving member 42 is formed with a concave surface corresponding to the PCT 4 described above. The receiving portion 43 has a plurality of suction holes 44 formed in the upper opening of the receiving portion 43. The plurality of suction holes 44 communicate with the main suction path 45. The main suction path 45 is connected to the suction pump 21 by the opening and closing control width 22. When the peeling mechanism 23 peels off the cover tape 7, the receiving device 42 is driven in the same direction as the peeling mechanism 23 in synchronization with the movement of the first and second peeling bars 24' 25 of the peeling mechanism 23. The peeling mechanism 23 peels off the cover tape 7, and simultaneously moves the receiving member 42 downward of the opened recessed portion 3 together with the opening of the open recessed portion 3. When the cover tape 7 is peeled off and the opening of the recessed portion 3 is entirely open, the inside of the recessed portion 3 is opened. The PCT 4 is delivered to the receiving tool 42. The suction hole 42 of the receiving tool 42 can generate a suction force. When the recess 3 is opened, the TCP 4 accommodated in the recess 3 is surely dropped to the above by the suction force. With 42 The receiving portion 43. That is, the suction force enhances the fall of the TCP 4 by the recess 3. The receiving member 4 that has received the TCP 4 is driven to a position away from the second sprocket 9 along the linear guide 41. Therefore, the receiving member 42 The placed TCP4 is sucked 16 201038156 The nozzle (not shown) is sucked and transported to the mounting position of the substrate (not shown). As a result, the opening of the recess 3 is directed downward to make the component supply belt When the cover tape 7 is peeled off and the opening of the recessed portion 3 is peeled off, the PCT 4 is easily dropped from the recessed portion 3, and the PCT 4 can be surely dropped from the recessed portion 3 while the receiving portion 43 of the receiving member 42 receiving the TCP 4 generates the suction force. And delivered to the acceptance tool 42. Further, when the cover tape 7 is peeled off by the component supply belt 1, the portion of the component supply tape 1 that peels off the cover tape 7 can be sucked and held by the holding block 16 as in the first embodiment, thereby preventing component supply. The belt 1 is bent downwards and deformed. Thereby, peeling of the cover tape 7 can be performed by the peeling mechanism 23. Furthermore, in the state in which the receiving unit 43 has received the movement of the receiving member 42 of the TCP 4 along the linear guide 41 to the movement range of the robot (not shown) of the next project, it can be stored in the above acceptance. The TCP 4 with the accepting unit 43 of 42 is delivered to the next project. In this way, it is not necessary to take out the TCP 4 accommodated in the receiving portion 43 of the receiving device 42 and deliver it to the take-out robot for the next project. Fig. 7 shows a fifth embodiment of the present invention. This embodiment is constructed in a fourth embodiment in which the opening of the recess 3 of the component supply belt 1 is moved downward. When the cover tape 7 is peeled off, the components are supplied to the both ends of the belt 1 in the width direction by the guide member 48. Supported to walk. According to this configuration, it is possible to surely prevent the component supply belt 1 from being bent downward when the cover tape 7 is brought to the pulling force when the cover tape 7 is peeled off. Fig. 8 shows a sixth embodiment of the present invention. This embodiment is a fifth embodiment shown in Fig. 7 of Fig. 7 201038156. The recessed portion 3 of the component supply belt 1 forms a recessed positioning portion la into which the semiconductor wafer 4b covered with the resin 4c can be formed by the resin 4c. As a result, the offset movement of the TCP 4 in the concave portion 3 is restricted. Therefore, when the cover tape 7 is peeled off, the TCP 4 can be surely dropped to the receiving portion 43 of the receiving member 42. In the case where the PCT 4 is temporarily placed on the substrate in the post-engineering process, it is preferable that the amount of the PCT 4 offset movement in the concave portion 3 is set to the maximum imm level. Further, in the state where the PCT 4 is dropped from the component supply belt 1 and delivered to the receiving portion 43, there is a fear that the PCT 4 is displaced. However, the shape of the receiving portion 43 is concave. Therefore, if the size of the receiving portion 43 is set in advance with respect to the PCT 4 so that the position of the PCT 4 in the receiving portion 43 is within a range of about 1 mm, the suction nozzle 31 can accurately pass from the suction nozzle 31. The receiving unit 43 takes out the PCT 4. As a result, the post-engineering of the TCP 4 by the accepting unit 43 can be simplified, that is, the alignment (position correction) of the TCP 4 in the mounting process can be simplified, so that the reduction of the tact time and the alignment device such as the positioning mechanism can be achieved. The camera 荨 device is simplified. Further, in each of the above embodiments, an example of TCp has been described as an electronic component. However, even an electronic component other than TCP, such as an IC chip or other electronic component, may be used. Further, the present invention has the following effects in addition to the effects described above in the respective embodiments. When the TCP4 is punched by the carrier tape, the material of the carrier tape, that is, the glass ring 201038156, the scrap of the oxygen resin or the polyimide resin, the lead of the lead wire or the wiring material, the scrap of metal such as Cu, Ag, Au, or the scrap of 11 These chips will adhere to Tcp4 and will be attached to the substrate. When the TCP 4 is mounted on the substrate, there will be a problem of mounting failure between the TCp4 and the leads of the substrate. Even if TCP4 is attached to the substrate, the TCp4i is removed. If TCP4 is exposed to the atmosphere, dust in the above-mentioned genus or air may adhere to the PCT4, resulting in poor mounting. However, in the present invention, the opening of the recess 3 of the component supply belt 细 is covered by the tape 7 before the TCP 4 is taken out by the recess 3. Therefore, the airtightness of the space inside the recess 3 is maintained before the cover tape 7 is covered. Therefore, after the TCP 4 is housed in the recessed portion 3 and the recessed portion 3 is sealed by the cover tape 7, the TCP 4 which has been punched by the carrier tape is washed with a cleaning liquid such as IPA (isopropyl alcohol) to remove various chips and dust. After the pCT 4 is dried, it is housed in the recess 3 and the recess 3 is sealed by the cover tape 7. According to this configuration, even after the TCP 4 is temporarily placed on the substrate and before the mounting, the chips and the wires of the TCP 4 enter various chips or dust, or the leads are narrowed by the miniaturization of the circuit, and various chips or dust are formed. Since there is almost no chance of adhering to the TCP 4, it is possible to surely prevent the adjacent leads from being defective in mounting due to various chips or dust. Further, the TCP 4 having a resin tape as a base material may absorb water in the air and extend. However, if the humidity in the recessed portion 3 of the component supply tape is set to, for example, 0 to 20% and the recess 3 is sealed by the cover tape 7, the PCT 4 in the recess 3 can be prevented from extending. In this way, once the cover tape 7 is peeled off by the component supply belt 1 to open the recess 19 201038156 3, if the PCT 4 in the recess 3 is temporarily placed on the substrate and then mounted, the installation due to the extension of the TCP 4 can be prevented. Reduced accuracy. INDUSTRIAL APPLICABILITY According to the present invention, when the cover tape is peeled off by the component supply belt, the portion of the component supply tape that peels off the cover tape is sucked and held, so that the component supply belt can be prevented from being greatly bent when the cover tape is peeled off. The peeling of the cover tape is not correct or the electronic component is flying out of the recess of the component supply tape. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing a supply device for an electronic component according to a first embodiment of the present invention. Figure 2 is an enlarged cross-sectional view of the same portion of the soil. Figure 3 is a plan view of the same part supply belt. Fig. 4 is a cross-sectional view showing the component supply belt of the second embodiment of the present invention. In the third embodiment of the present invention, a schematic configuration of a modification in which a TCp is discharged from a concave county by a suction nozzle is shown. Fig. 6 is a schematic block diagram showing a supply device for an electronic component according to a fourth embodiment of the present invention. Fig. 7 is a cross-sectional view showing a state in which the display component supply belt of the fifth embodiment of the present invention is held. Fig. 8 is a cross-sectional view showing a state in which the display component supply belt of the sixth embodiment of the present invention is held. [Main Messages Wei Description] 20 201038156
1···零件供給帶 22…開閉控制閥 la…定位部 23…剝離機構 2…供給捲筒 24…第1剝離桿 3…凹部 25…第2剝離桿 4 …TCP 26…連結板 4a…膜 27···水平汽缸 4b…半導體晶片 27a…桿 4c…樹脂 28…捲取捲筒 5—^合孔 29…旋轉驅動源 7…覆蓋帶 30···接受機構 8…第1鏈輪 31…吸著喷嘴 9..·第2鏈輪 32…X . Y . Z驅動源 10…帶回收機構 35···上下驅動源 11…夾頭 36…後備工具 12…可動板 36a···吸取孔 13…開閉汽缸 38···反轉導輥 14…上下汽缸 40…接受搬送機構 15…回收容器 41…線性導件 16…保持塊 42…接受具 16a…突條 43…接受部 17…落差部 44···吸取孔 18···吸取孔 45···主吸取路 19···主吸取路 48…導向構件 21···吸取泵 211···Part supply belt 22... Opening and closing control valve la... Positioning unit 23... Peeling mechanism 2... Supply spool 24... First peeling lever 3... Concave portion 25... Second peeling bar 4 ... TCP 26... Connecting plate 4a... Film 27···················· Suction nozzle 9..·Second sprocket 32...X.Y. Z drive source 10...Retraction mechanism 35···Up and down drive source 11...Clamp 36...Backup tool 12...Removable plate 36a···Sucking hole 13...opening and closing cylinder 38···reverse guide roller 14...upper and lower cylinder 40...receiving conveying mechanism 15...recycling container 41...linear guide 16...holding block 42...receiving tool 16a...protrusion 43...receiving portion 17...fall portion 44···sucking hole 18···sucking hole 45···main suction path 19···main suction path 48...guide member 21··· suction pump 21