201036195 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種LED裝置，特別是關於具有極佳散熱效率之一種模 組化LED。 【先前技術】 由於發光二極體（Light-Emitting Diode，LmD)具有良好的亮度、較長 的使用壽命、省電及環保等諸多優點，被廣泛使用在現今許多電子元件上， 然而，LED發光時會產生大量的熱能，若不能快速的排除熱能，將會降低 LED的使用壽命，甚至造成LED的失效，所以LED散熱性的優劣，是現 今需要探討及克服的重要課題。 習知的LED封裝結構如第一圖所示，主要由一 LED晶片i、一封裝膠 體2 ' —電路板3及兩導線架4、5所構成，該LED晶片放置在其中一導線 架5所形成之碗部空間内，工作時產生的熱能會藉由導線架5傳導至電路 板3上，散發出去，但因其僅利用導線架5進行熱傳導，散熱效率有限， 仍無法迅速有效的排除熱能。綜觀習知之LED聽結構，在使用上仍存有 諸多缺失’因轉義及電路板讀料速率慢且鱗不佳，若，能針對 LED散熱問題進行改良，將能大幅提升LED的使用壽命。 有鑑於此’本發明人潛心研究，並結合從事相關事業之多年經驗，提 出-種模組化LED齡生產枝，_導熱錄熱方歧服胃知之缺點。 【發明内容】 本發明之主要目的’係在提供-機組化LED組合生產方式，其係具 有超導το件’該超導元件之殼體表面具有特電路，與led歡直接接觸 熱傳’知决速排除led所產生之熱能，提升LED使用壽命。 3 201036195 為達上述之目的，本發明為一種模組化LED，由一超導元件及一 LED 模組所組成；超導元件具有殼體，殼體外表面設有印刷電路，殼體内之腔 室並具有毛細結構及工作流體，超導元件進一步為均溫板（Vap〇r Chamber) ’藉由腔室内之卫作流體產生彳目變化，迅速導熱；以及—模 組，包含至少一 LED晶片’封裝於一基座當中，LED模組具有引腳，LED 模組利用安裝於印刷電路上並形成電性連接，本發明在超導元件相對於 LED模組之另一外表面，設有一散熱鰭片，以利於散熱。 〇 纟下藉由具體實施例配合所輯®式詳加說明，當更容易瞭解本發明 之目的、技術内容、特點及其所達成之功效。 【實施方式】 第二圖為本發明之立體組合示意圖，如_示，本剌為—種模組化 LED H)，模組化LED 10主要由一超導元件12及一哪模組14所組成； 超導元件12具有喊體I22，殼體122係為銅材質，殼體122外表面設有印 刷電路124 ’印刷電路124係利用微影钱刻、或化學钱刻等方式成型於殼體 Ο I22上，超導元件12係為均溫板’超導元件12係為一中空腔體，殼體122 内4具有毛細結構及鮮介質，該鱗介質為__種卫作流體，藉由工作流 朗蒸發錄速均自散制健處冷凝，再由賴H赌構回流至熱 源’重複級/冷凝的動作，可把大量的熱能在極短的時間内排除；圖中， led模組Μ係安裝於印刷電路m上，引腳m與印刷電路丨24形成電性 連接’同時LED模組14之基座底面也與超導元件12之殼體122接觸。 第三圖為本發明之立體分解示意圓，如騎示，本發明之咖模組14 進-步包含至少-晶片142，LED晶片142封裝於—基座當中，聊 4 201036195 模組14具有弓I腳144，並與殼體⑵上之印刷電路以相對應，aD模組 並包括一透鏡146，包覆LED晶片142。 第四圖為本剌之實錄_獅意®，如騎示，LED模組14係已 安裝於超導元件12之印刷電路124上，且LED模組14之基座底面並與超 導元件12之-面接觸，由於超導元件12為一均溫板，模組μ所散發 之熱能可藉由超導元件12快速傳導至錄超導元件撕於LED模組14接 觸面之另-外表面之一散熱鰭片16上，藉由超導元件12及散熱縛片，能 〇 快速排除LED模組14所產生之熱能。201036195 VI. Description of the Invention: [Technical Field] The present invention relates to an LED device, and more particularly to an exemplary LED having excellent heat dissipation efficiency. [Prior Art] Light-Emitting Diode (LmD) is widely used in many electronic components today due to its good brightness, long life, power saving and environmental protection. However, LED light-emitting A lot of heat energy will be generated. If the heat energy cannot be quickly eliminated, the service life of the LED will be reduced, and even the LED will be ineffective. Therefore, the heat dissipation of the LED is an important issue that needs to be discussed and overcome today. As shown in the first figure, the conventional LED package structure is mainly composed of an LED chip i, an encapsulant 2', a circuit board 3, and two lead frames 4, 5, and the LED chip is placed in one of the lead frames 5 In the formed bowl space, the heat generated during operation is transmitted to the circuit board 3 through the lead frame 5, and is radiated, but since it uses only the lead frame 5 for heat conduction, the heat dissipation efficiency is limited, and the heat energy cannot be quickly and effectively eliminated. . Looking at the conventional LED listening structure, there are still many shortcomings in use. Because of the slow rate and poor scale of the board reading, the improvement of the LED heat dissipation problem will greatly improve the service life of the LED. In view of the fact that the present inventors have devoted themselves to research and combined with years of experience in related businesses, it has proposed a modular LED-age production branch, which has the disadvantages of heat-dissipating heat. SUMMARY OF THE INVENTION The main object of the present invention is to provide a unit-integrated LED combined production method, which has a superconducting τ ο 'the superconducting element has a special surface on the surface of the casing, and is directly in contact with the LED Speed out the heat generated by led and improve the service life of LED. 3 201036195 For the above purposes, the present invention is a modular LED comprising a superconducting component and an LED module; the superconducting component has a housing, the outer surface of the housing is provided with a printed circuit, and the cavity in the housing The chamber has a capillary structure and a working fluid, and the superconducting element is further a temperature-increasing plate (Vap〇r Chamber), which generates a rapid change in heat by a fluid in the chamber, and a module comprising at least one LED chip. Packaged in a pedestal, the LED module has a lead, and the LED module is mounted on the printed circuit and electrically connected. The present invention has a heat dissipation on the other outer surface of the superconducting element relative to the LED module. Fins for heat dissipation.纟 纟 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Embodiment] The second figure is a three-dimensional combination diagram of the present invention. As shown in the figure, the present invention is a modular LED H). The modular LED 10 is mainly composed of a superconducting component 12 and a module 14. The superconducting element 12 has a body I22, the casing 122 is made of copper, and the outer surface of the casing 122 is provided with a printed circuit 124. The printed circuit 124 is formed on the casing by means of micro-etching or chemical etching. Ο I22, the superconducting element 12 is a temperature equalizing plate, the superconducting element 12 is a hollow body, and the inner surface of the casing 122 has a capillary structure and a fresh medium, and the scale medium is a kind of fluid. The workflow evaporative recording speed is condensed from the scattered health, and then the flow back to the heat source 'repetition level/condensation action by the gambling H gambling can remove a lot of heat energy in a very short time; in the figure, the led module The lanthanide is mounted on the printed circuit m, and the pin m is electrically connected to the printed circuit 丨 24 while the bottom surface of the pedestal of the LED module 14 is also in contact with the housing 122 of the superconducting element 12. The third figure is a perspective exploded schematic circle of the present invention. For example, the coffee module 14 of the present invention further includes at least a wafer 142, and the LED chip 142 is packaged in the pedestal, and the module 14 has a bow. The I leg 144 corresponds to the printed circuit on the housing (2), and the aD module includes a lens 146 to cover the LED chip 142. The fourth figure is the actual record _ lion®, such as riding, LED module 14 has been mounted on the printed circuit 124 of the superconducting component 12, and the bottom surface of the LED module 14 and the superconducting component 12 In the face-to-face contact, since the superconducting element 12 is a temperature equalizing plate, the thermal energy emitted by the module μ can be quickly transmitted to the recording superconducting element by the superconducting element 12 to be torn on the other surface of the contact surface of the LED module 14 On one of the heat dissipation fins 16, the superconducting element 12 and the heat dissipation tab can quickly eliminate the heat energy generated by the LED module 14.
本發明主要细—超導元件，超導元件之殼體表面具有印刷電路，LED 模組底面直接與超導元件上之印機路觸，能大财效的增加熱傳效 率，相較於習知之通過引聊及電路板或鋼底座進行熱導之方式，可大幅提 升熱傳鱗，«超導元件狀轉㈣及杨結構，可使功流體於腔 室内產生機化並快速流動，朗迅速將咖模組所產生之缝由該接觸 面快速傳導至另-相對接觸面，並藉由散熱縛片，迅絲熱量散逸排除， Ο 進而提升LED壽命。 .惟以上所述者，僅為本發明之較佳實施例而已，其目的在使熟習該項 技藝者能夠瞭解本發明之内容而據以實施，並非用來蚊本發明實施之範 圍；故舉紐本發”請專纖_叙做、構造、職及精神所為之 均等變化與修飾’均應涵蓋在本發明之申請專利範圍内。 【圖式簡單說明】 第一圖為習知之LED封裝結構。 第二圖為本發明之立體組合示意圖。 5 201036195 第三圖為本發明之立體分解示意圖。 第四圖為本發明之實施狀態側視示意圖。 【主要元件符號說明】 10 模組化LED 12 超導元件 122 殼體 124 印刷電路 14 LED模組 142 LED晶片 144 引腳 146 透鏡 16 散熱鰭片The invention is mainly a fine-superconducting element, and the surface of the shell of the superconducting element has a printed circuit, and the bottom surface of the LED module directly touches the printing machine on the superconducting element, which can increase the heat transfer efficiency with great efficiency, compared with the habit Knowing that by means of a chat and a circuit board or a steel base for thermal conduction, the heat transfer scale can be greatly improved. The superconducting element-like (four) and poplar structures can make the working fluid mechanically and rapidly flow in the chamber. The slit produced by the coffee module is quickly transmitted from the contact surface to the other-opposing surface, and by the heat-dissipating tab, the heat dissipation is eliminated, thereby increasing the life of the LED. The above is only the preferred embodiment of the present invention, and its purpose is to enable those skilled in the art to understand the contents of the present invention and to implement it, and not to use the scope of the invention of the present invention; Newborn's "recognition of the syllabus, construction, work and spirit of the same changes and modifications" should be covered by the scope of the patent application of the present invention. [Simplified schematic] The first figure is a conventional LED package structure The second figure is a three-dimensional combination diagram of the present invention. 5 201036195 The third figure is a perspective exploded view of the present invention. The fourth figure is a side view of the implementation state of the present invention. [Main component symbol description] 10 Modular LED 12 Superconducting element 122 housing 124 printed circuit 14 LED module 142 LED chip 144 pin 146 lens 16 heat sink fin