201028077 六、發明說明： . 【發明所屬之技術領域】 . 本發明涉及一種散熱模組，尤其涉及一種扁平型 熱導管及使用該熱導管的散熱模組。 【先前技術】 隨著電腦產業的迅速發展，CPU追求高速度化， 多功能化及小型化所衍生的散熱問題越來越嚴重， _ 這在筆記型電腦等内部空間狹小的電子設備中更為 突出。如果無法將筆記型電腦内的CPU等電子元件 所產生的熱量及時有效地散發出去，將極大地影響 電子元件的工作性能，同時還會縮減電子元件的使 用壽命’因此必須對電子元件進行散熱。 目前在筆記型電腦等内部空間狹小的電子設備 内，因受限於狹小的空間，其使用的散熱模組通常 採用板型熱導管進行傳熱。圖i為一傳統的板型熱 ❹ 導管70置於一設有發熱電子元件90的電路板8〇上 的情形。該板型熱導管70的上板71和下板72均為 平面且相互平行，該熱導管7〇的蒸氣空腔75的高 度在熱導管70内無變化。該發熱電子元件9〇凸設 於該電路板80的上方，該熱導管7〇的下板72與發 熱電子元件90接觸，從而使熱導管7〇的設計空間 限制在發熱電子元件90的頂平面92以上的空間， 這樣，在狹小的空間内便使該熱導管7〇的蒸氣空腔 3 201028077 75的體積受到限制，進而限制了熱導管7〇的傳熱效 . 率，最終影響散熱模組的散熱效率。 【發明内容】 鑒於此，有必要提供一種在狹小的空間内仍具有 優良的傳熱效率的扁平型熱導管及使用該熱導管的 散熱模組。 一種扁平型熱導管，用於傳導發熱電子元件產生 © 的熱量，該扁平型熱導管包括一内部形成蒸氣空腔 的<體及谷置在該殼體内的毛細結構，該殼體與發 …、電子元件結合的表面上朝向該蒸氣空腔凹陷形成 至少一内凹部，該内凹部用於收容該發熱電子元件。 種散熱模組，用於給發熱電子元件散熱， -扁平型熱導管及一散熱器，該扁平型熱導管包括 一蒸發段及-冷凝段，該蒸發段料與發熱電子元 φ $接觸，該冷凝段與該散熱器連接，該扁平型熱導 官包括一内部形成蒸氣空腔的殼體及容置在該殼體 内的毛細結構，該殼體與發熱電子元件結合的表面 上朝向該蒸氣空腔凹陷形成至少一内凹部，該内凹 部用於收容該發熱電子元件。 上述扁平型熱導管的内凹部將發熱電子元件收 容於其中’該爲平型熱導管充分利用了發熱電子元 ^周圍的空間從而擴大蒸氣空腔的體積。在相同的 空間下，該扁平型熱導管的蒸氣空腔的體積大於傳 201028077 統熱導管的蒸氣空腔的體積’在筆記型電腦等内部 . 狹小的空間内仍能保證較大的蒸氣空腔，從而增大 . 該熱導管的熱傳輸效率。 曰 【實施方式】 請一併參閱圖2及圖3,該散熱模組包括一離心 風扇10、政熱器20及一扁平型熱導管3〇。 該離心風扇10包括一扇框12及一葉輪14。該 • 扇框12内形成一容置空間’該葉輪14收容於該容置 空間内。扇框12的軸向的相對兩侧即頂部與底部分 別形成一第一入風口 12〇及一第二入風口（圖未 示），扇框12的側向形成一出風口 122。 該散熱B 20由複數散熱鰭片堆叠而成。散熱器 20呈長方形’其位於該離心風扇的出風口 處。 請一併參閱圖4，熱導管30呈板形，其包括一 中空殼體37、設置在該殼體37内的一毛細結構％ 以及注入殼體37内的工作液體。該殼體37包括一頂 板32、與頂板32相對的一底板％、及兩侧板％。 該側板34位於頂板32與底板36之間且與該頂板％ 和底板36的周緣相連接。該頂板32、底板％及側 板34合圍使該殼體37形成一中空密封腔室，從而使 該殼體37内部形成一蒸氣空腔。在本實施例中，該 殼體37由上下兩殼體合蓋而成。當然，該殼體37 也可由一中空圓管壓扁形成。 201028077 該熱導管30大致呈“z”形，沿其延伸方向包括一 . L形蒸發段31和一直線形冷凝段33，該冷凝段％ . 與散熱器20連接且形狀相對應。 該熱導管30的蒸發段31的底板36朝向蒸氣空 腔凹陷形成四個内凹部360，用來容設複數發熱電子 元件，該四個内凹部360可以根據不同發熱電子元件 的咼度設置成不同的深度，以便對不同發熱電子元件 ❹ 同時進行導熱。本實施例中僅以一發熱電子元件9〇 與熱導官30的其中一内凹部36〇相結合情況為例。 該等内凹部360大致呈方形或長方形。每一内凹部 360包括一底壁361及四個側壁362。該底壁平 行於底板36並相對底板36朝向蒸氣空腔沉陷一定距 離，該底壁361與頂板32相間隔。該四個侧壁362 圍繞該底壁361的周緣並與内凹部36〇外圍的底板 36相連接。該發熱電子元件9〇具有一頂面％，該頂 ® 面92與該内凹部360的底壁361的外表面相貼合， 發熱電子元件90的側面與内凹部36〇的側壁362相 間隔。 在其他實施方式中，該等内凹部360還可以為其 他形狀，比如圓形、梯形等，其具體形狀應與發熱電 子元件90的形狀相對應並略大於發熱電子元件9〇 的尺寸。此外，該等内凹部36〇凹陷的程度取決於發 熱電子元件90相對電路板8〇凸出的高度，高度較大 6 201028077 时熱電子元件90對應的内凹部360凹陷較深，而 尚度較小的發埶電子元株⑽ …％千件90對應的内凹部360的凹 陷較淺。201028077 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a flat heat pipe and a heat dissipation module using the heat pipe. [Prior Art] With the rapid development of the computer industry, the CPU pursues high speed, and the heat dissipation problem caused by multi-function and miniaturization becomes more and more serious. _ This is more in electronic devices with small internal space such as notebook computers. protruding. If the heat generated by the electronic components such as the CPU in the notebook cannot be dissipated in a timely and effective manner, the performance of the electronic component will be greatly affected, and the life of the electronic component will be reduced. Therefore, the electronic component must be dissipated. In electronic devices such as notebook computers, which are limited in a small space, the heat dissipation modules used in the notebooks usually use a plate type heat pipe for heat transfer. Figure i is a view of a conventional plate type heat exchanger conduit 70 placed on a circuit board 8 having a heat generating electronic component 90. The upper plate 71 and the lower plate 72 of the plate type heat pipe 70 are both planar and parallel to each other, and the height of the vapor cavity 75 of the heat pipe 7 is unchanged in the heat pipe 70. The heat-generating electronic component 9 is protruded above the circuit board 80, and the lower plate 72 of the heat pipe 7 is in contact with the heat-generating electronic component 90, so that the design space of the heat pipe 7〇 is limited to the top plane of the heat-generating electronic component 90. The space above 92, so that the volume of the vapor cavity 3 201028077 75 of the heat pipe 7〇 is limited in a small space, thereby limiting the heat transfer efficiency of the heat pipe 7〇, ultimately affecting the heat dissipation module Cooling efficiency. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a flat heat pipe which has excellent heat transfer efficiency in a small space and a heat dissipation module using the heat pipe. A flat type heat pipe for conducting heat generated by a heat generating electronic component, the flat heat pipe comprising a capillary structure in which a body and a valley are formed inside the casing, the casing and the hair The surface of the electronic component is recessed toward the vapor cavity to form at least one inner recess for receiving the heat-generating electronic component. a heat dissipation module for dissipating heat to a heat-generating electronic component, a flat heat pipe and a heat sink, the flat heat pipe comprising an evaporation section and a condensation section, the evaporation section material being in contact with the heating electron element φ $, a condensation section is coupled to the heat sink, the flat type thermal guide comprising a housing internally forming a vapor cavity and a capillary structure housed within the housing, the surface of the housing coupled to the heat generating electronic component facing the vapor The cavity recess forms at least one inner recess for receiving the heat-generating electronic component. The inner concave portion of the flat heat pipe accommodates the heat generating electronic component therein. The flat heat pipe sufficiently utilizes the space around the heat generating electron element to expand the volume of the vapor cavity. In the same space, the volume of the vapor cavity of the flat heat pipe is larger than the volume of the vapor cavity of the 201028077 heat pipe. It is inside the notebook computer, etc. It can still ensure a large vapor cavity in a small space. , thereby increasing the heat transfer efficiency of the heat pipe.曰 [Embodiment] Referring to FIG. 2 and FIG. 3 together, the heat dissipation module includes a centrifugal fan 10, a thermal heater 20, and a flat heat pipe 3〇. The centrifugal fan 10 includes a frame 12 and an impeller 14. An accommodating space is formed in the fan frame 12. The impeller 14 is received in the accommodating space. The axially opposite sides of the frame 12, that is, the top and bottom portions, define a first air inlet 12'' and a second air inlet (not shown), and the fan frame 12 laterally forms an air outlet 122. The heat dissipation B 20 is formed by stacking a plurality of heat dissipation fins. The radiator 20 has a rectangular shape which is located at the air outlet of the centrifugal fan. Referring to Fig. 4 together, the heat pipe 30 has a plate shape including a hollow casing 37, a capillary structure % disposed in the casing 37, and a working liquid injected into the casing 37. The housing 37 includes a top plate 32, a bottom plate % opposite the top plate 32, and side plates %. The side panel 34 is located between the top panel 32 and the bottom panel 36 and is connected to the top panel % and the periphery of the bottom panel 36. The top plate 32, the bottom plate % and the side plates 34 are enclosed such that the housing 37 forms a hollow sealed chamber such that a vapor cavity is formed in the interior of the housing 37. In the present embodiment, the casing 37 is formed by closing the upper and lower casings. Of course, the housing 37 can also be formed by flattening a hollow circular tube. 201028077 The heat pipe 30 has a substantially "z" shape and includes an L-shaped evaporation section 31 and a linear condensation section 33 along the extending direction thereof. The condensation section is connected to the heat sink 20 and has a shape corresponding thereto. The bottom plate 36 of the evaporation section 31 of the heat pipe 30 is recessed toward the vapor cavity to form four recesses 360 for accommodating a plurality of heat-generating electronic components, and the four recesses 360 can be set differently according to the twist of different heat-generating electronic components. The depth is such that heat is simultaneously applied to different heat-generating electronic components. In this embodiment, only a heat-generating electronic component 9 is combined with one of the recesses 36 of the thermal guide 30 as an example. The inner recesses 360 are generally square or rectangular. Each recess 360 includes a bottom wall 361 and four side walls 362. The bottom wall is parallel to the bottom plate 36 and is at a distance from the bottom plate 36 toward the vapor cavity, the bottom wall 361 being spaced from the top plate 32. The four side walls 362 surround the circumference of the bottom wall 361 and are connected to the bottom plate 36 at the periphery of the inner recess 36. The heat-generating electronic component 9A has a top surface area 95 which is in contact with the outer surface of the bottom wall 361 of the inner recessed portion 360, and the side surface of the heat-generating electronic component 90 is spaced apart from the side wall 362 of the inner recessed portion 36A. In other embodiments, the inner recesses 360 may have other shapes, such as circular, trapezoidal, etc., which are specifically shaped to correspond to the shape of the heat generating electronic component 90 and slightly larger than the size of the heat generating electronic component 9A. In addition, the degree of depression of the inner recessed portion 36 depends on the height of the heat-generating electronic component 90 protruding from the circuit board 8 , and the height of the recessed portion 360 of the hot electronic component 90 is deeper when the height is greater than 6 201028077. The small hairpin electron element strain (10) ...% of the 90 pieces of the concave portion 360 corresponding to the depression is shallow.
該毛細結構39順著熱導管3〇的延伸方向從 段延伸至冷凝段33,社作液㈣含於該毛㈣吉 構39内。该毛細結構39的底部環繞該内凹部細 的整個内壁的外圍。該毛細結構39底部的中央部分 與内凹部360的底壁361的内表面相接觸，該毛細結 構39底部的外圍部分環繞該内凹部編的側壁地 的内壁並向下延伸至與底板36的内壁接觸該毛細 、’構39的頂部自底部向上延伸至與頂板％的内壁相 接觸。該毛細結構39肖殼體37的側板34相間隔以 形成可供蒸氣通過的蒸氣通道35，該毛細結構％與 内凹4 360的底壁361的内表面接觸保證了該内表面 處有工作液體以保證熱導管30正常工作，該毛細結 構39的底部與底板36的内壁接觸可將因重力作用匯 流至該底板36内壁的工作液體吸收至毛細結構39 内部。此外，該毛細結構39與該殼體37的頂板32 和底板36的内壁接觸，起到支撐該殼體37的作用， 避免頂板32與底板36變形而影響熱導管3〇的性能。 5亥熱導管30的蒸發段31上設有四個上下貫穿該 熱導官30的貫穿孔38 ’該等貫穿孔38的外圍形成 壁部以密封該貫穿孔38周緣的殼體37，從而不影響 201028077 殼體37的密封性。該等貫穿孔38可供固定件（圖未 . 示）穿過以將該熱導管30固定於電路板80上。 - 組裝時，該散熱器20設於該離心風扇10的出風 口 122處，該熱導管30的冷凝段33貼設於散熱器 20上方，該熱導管30的蒸發段31的内凹部360將 發熱電子元件90收容於其中，並使發熱電子元件90 的頂面92與内凹部360的底壁361相貼合，為減小 ©熱阻，可在該發熱電子元件90的頂面92與該底壁 361的外表面之間塗布導熱膏（圖未示），最後利用 固定件穿過熱導管30的貫穿孔38將熱導管30固定 於電路板80上。 散熱模組工作時，該熱導管30的内凹部360的 底壁361從發熱電子元件90吸收熱量並將熱量傳遞 至殼體37的内部，使環繞於該内凹部360内壁外圍 的毛細結構39内所含的工作液體汽化，帶著熱量經 ❿ 由蒸氣通道35運動至冷凝段33，冷凝段33將熱量 傳給位於其下方的散熱器20,離心風扇10的葉輪14 從入風口 110吸入氣流並吹向散熱器20，將鰭片上 的熱量散發出去，從而降低冷凝段33的溫度，使冷 凝段33内的蒸氣液化凝結，並在毛細結構39的作用 下回流至蒸發段31，繼續蒸發汽化及液化凝結，使 工作介質在熱導管30内部循環運動，將發熱電子元 件90產生的熱量源源不斷的散發出去。 201028077 由於該熱導管3〇的内凹部36〇可將凸設於 • 板80的發敎蕾工-.λ, 、 心ΛΛ 牛0收容於其中，相較圖1所示 - 傳=的扁平型熱導管70，本發明的扁平型熱導管3〇 ^刀利用了發熱電子元件90周圍的空間從而擴大蒸 氣空腔的體積，在相同的安裝空間下，本發明的扁^ =熱導管3G的蒸氣空腔的體積大於傳統扁平型熱導 :兀的蒸从氣空腔75㈣積，在狹小的空間内仍能保 戍較大的瘵氣空腔’尤其在筆記型電腦等内部安裝空 $狹小的情況下’更能增大該扁平型熱導管30的熱 傳輸效率，S而提升本發明散熱模組的散熱效率。 圖5所示為本發明第二實施方式的扁平型熱導 管50,該熱導管50與第一實施方式的熱導管3〇的 ，同之處在於：該熱導管5〇的毛細結構59貼設於該 殼體57的頂板52和侧板54的整個内壁。該毛細結 構59設於該頂板52内壁的部分與該内凹部56〇的= ® 壁561的内表面相接觸，從而保證該底壁561的内表 面處有工作液體以保證熱導管50的傳熱性能，而毛 細結構59貼設於該側板54内壁的部分與内凹部56〇 的側壁562相間隔從而留出蒸氣通道55供蒸氣通 過。該毛細結構59設於侧板54内壁的部分順著侧板 54的内壁向下延伸至與底板56的内壁相接觸從而可 吸收該底板56内壁的工作液體。 綜上所述，本發明確已符合發明專利之要件，遂 201028077 依法提出專利申請。惟，以上所述者僅為本發明之較 . 佳實施方式，自不能以此限制本案之申請專利範圍。 舉凡熟悉本案技藝之人士援依本發明之精神所作之 等效修倚或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1為傳統扁平型熱導管置於一設有發熱電子 元件的電路板上的剖面示意圖。 圖2為本發明散熱模組第一實施例的翻轉狀態 參 的立體組合圖。 圖3為圖2的立體分解圖。 圖4為圖2所示扁平型熱導管置於一設有發熱 電子元件的電路板上的剖面示意圖。 圖5為本發明扁平型熱導管第二實施例的剖面 示意圖。 【主要元件符號說明】 離心風扇 10 扇框 12 第一入風口 120 出風口 122 葉輪 14 散熱器 20 扁平型熱導管 30、50 蒸發段 31 頂板 32、52 冷凝段 33 側板 34、54 蒸氣通道 35、55 底板 36、56 内凹部 360、560 底壁 361、561 側壁 362、562 殼體 37、57 貫穿孔 38 毛細結構 39、59 板型熱導管 70 上板 71 下板 72 201028077 蒸氣空腔 75 電路板 電子元件 90 頂面 80 92The capillary structure 39 extends from the section to the condensation section 33 along the extending direction of the heat pipe 3'', and the working fluid (4) is contained in the hair (4). The bottom of the capillary structure 39 surrounds the periphery of the entire inner wall of the inner recess. The central portion of the bottom of the capillary structure 39 is in contact with the inner surface of the bottom wall 361 of the inner recess 360. The peripheral portion of the bottom of the capillary structure 39 surrounds the inner wall of the side wall of the inner recess and extends downward to the inner wall of the bottom plate 36. Contacting the capillary, the top of the '39' extends upwardly from the bottom to contact the inner wall of the top plate%. The side walls 34 of the capillary structure 39 are spaced apart to form a vapor passage 35 through which vapor can pass, the capillary structure % contacting the inner surface of the bottom wall 361 of the recess 4 360 to ensure a working liquid at the inner surface In order to ensure the normal operation of the heat pipe 30, the bottom of the capillary structure 39 is in contact with the inner wall of the bottom plate 36 to absorb the working liquid that is converged by gravity to the inner wall of the bottom plate 36 to the inside of the capillary structure 39. Further, the capillary structure 39 is in contact with the inner walls of the top plate 32 and the bottom plate 36 of the casing 37 to support the casing 37, thereby preventing the deformation of the top plate 32 and the bottom plate 36 from affecting the performance of the heat pipe 3. The evaporation section 31 of the 5H heat pipe 30 is provided with four through holes 38 that penetrate the heat guide 30 up and down. The periphery of the through holes 38 forms a wall portion to seal the casing 37 of the periphery of the through hole 38, so that Affects the tightness of the 201028077 housing 37. The through holes 38 are permeable to a fixing member (not shown) to fix the heat pipe 30 to the circuit board 80. - When assembled, the heat sink 20 is disposed at the air outlet 122 of the centrifugal fan 10, and the condensation section 33 of the heat pipe 30 is attached to the heat sink 20, and the concave portion 360 of the evaporation section 31 of the heat pipe 30 is heated. The electronic component 90 is received therein, and the top surface 92 of the heat-generating electronic component 90 is attached to the bottom wall 361 of the recessed portion 360. To reduce the thermal resistance, the top surface 92 of the heat-generating electronic component 90 and the bottom may be A heat conductive paste (not shown) is applied between the outer surfaces of the walls 361, and finally the heat pipes 30 are fixed to the circuit board 80 through the through holes 38 of the heat pipes 30 by the fixing members. When the heat dissipation module is in operation, the bottom wall 361 of the inner recess 360 of the heat pipe 30 absorbs heat from the heat-generating electronic component 90 and transfers heat to the inside of the casing 37 so as to surround the capillary structure 39 around the inner wall of the inner recess 360. The contained working fluid is vaporized, with heat being transferred from the vapor passage 35 to the condensation section 33, and the condensation section 33 transfers heat to the radiator 20 located below it, and the impeller 14 of the centrifugal fan 10 draws in airflow from the inlet 104 The heat is radiated to the heat sink 20, and the heat on the fins is dissipated, thereby reducing the temperature of the condensation section 33, causing the vapor in the condensation section 33 to liquefy and condense, and returning to the evaporation section 31 under the action of the capillary structure 39, and continuing to evaporate and vaporize. The liquefaction condensation causes the working medium to circulate inside the heat pipe 30, and the heat generated by the heat-generating electronic component 90 is continuously emitted. 201028077 The inner concave portion 36〇 of the heat pipe 3〇 can accommodate the hair buds-.λ, ΛΛ, ΛΛ 牛 0, which are protruded from the plate 80, as compared with the flat type shown in Fig. 1 The heat pipe 70, the flat type heat pipe of the present invention utilizes the space around the heat-generating electronic component 90 to enlarge the volume of the vapor cavity, and in the same installation space, the vapor of the flat heat pipe 3G of the present invention The volume of the cavity is larger than that of the conventional flat type heat guide: the steaming of the crucible from the gas cavity 75 (four) product can still protect the larger helium cavity in a small space, especially in the interior of a notebook computer. In this case, the heat transfer efficiency of the flat heat pipe 30 can be increased, and the heat dissipation efficiency of the heat dissipation module of the present invention can be improved. Fig. 5 shows a flat type heat pipe 50 according to a second embodiment of the present invention. The heat pipe 50 is the same as the heat pipe 3 of the first embodiment, in that the capillary structure 59 of the heat pipe 5 is attached. The entire inner wall of the top plate 52 and the side plates 54 of the casing 57. The portion of the capillary structure 59 disposed on the inner wall of the top plate 52 is in contact with the inner surface of the inner wall 561 of the inner recess 56 , to ensure a working liquid at the inner surface of the bottom wall 561 to ensure heat transfer of the heat pipe 50. The performance, and the portion of the capillary structure 59 attached to the inner wall of the side panel 54 is spaced from the side wall 562 of the inner recess 56〇 to leave a vapor passage 55 for vapor to pass. The capillary structure 59 is provided on the inner wall of the side plate 54 to extend downwardly along the inner wall of the side plate 54 to be in contact with the inner wall of the bottom plate 56 so as to absorb the working liquid of the inner wall of the bottom plate 56. In summary, the present invention has indeed met the requirements of the invention patent, and 遂 201028077 filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a conventional flat heat pipe placed on a circuit board provided with a heat generating electronic component. 2 is a perspective assembled view of a flip state of the first embodiment of the heat dissipation module of the present invention. Fig. 3 is an exploded perspective view of Fig. 2; Figure 4 is a cross-sectional view showing the flat type heat pipe of Figure 2 placed on a circuit board provided with heat generating electronic components. Fig. 5 is a cross-sectional view showing a second embodiment of the flat heat pipe of the present invention. [Main component symbol description] Centrifugal fan 10 Fan frame 12 First air inlet 120 Air outlet 122 Impeller 14 Radiator 20 Flat heat pipe 30, 50 Evaporation section 31 Top plate 32, 52 Condensation section 33 Side plates 34, 54 Vapor passage 35, 55 bottom plate 36, 56 inner recess 360, 560 bottom wall 361, 561 side wall 362, 562 housing 37, 57 through hole 38 capillary structure 39, 59 plate type heat pipe 70 upper plate 71 lower plate 72 201028077 vapor cavity 75 circuit board Electronic component 90 top surface 80 92
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