201025487 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種傳輸其中裝有晶片之盒之裝置，更特定 言之，係關於如此一種裝置，即傳輸一晶片處理機中之晶片 盒，用於將自外侧接收之一晶片盒自水平位置轉換成豎^位 置’並傳輸該晶片盒至指定之製程位置。 【先前技術】 在微電子學中，半導體材料晶片用作生產微電子元件之基 片。舉例而言，作為合適之材料，有II/VI化合物半導體，ιιι/γ 化合物半導體及諸如鍺、矽等之元素半導體。 ® 藉由將單個圓柱狀晶體半導體切割成幾釐米或十分之幾 董米長度之娜W㈣製造辭導體“。賴該等錠堪元件 各自被切割成薄晶片。 在將該航蝴成料㊣#之前，該細树可根據製造 目標加工成多邊形狀。舉例而言，為軸單晶剌（pv晶片）， 該錠狀件可被加工成衫邊柱，諸如方減偽方柱。 在由切片該錠链元件而獲得之該等晶片被導入一台晶片 光刻檢驗機’並由該晶片光刻檢驗機器檢驗後，該等晶片被引⑩ ^至電子元件生產製程’諸如半導體封裝或太陽能電池組合 件0 同時’由於傳統之晶片處理機以如此—方式組態，即工人 ，自在機ϋ之指定位置域射放置有複油晶片之晶片 盖’且自該晶片盒中將該等晶片取出，從而實施期望之摔作。 賴存在若干問題，即其生產能力 1下 動協同操作日之_統。)，且不能構建—套與其他晶片設備自 4 201025487 舉例而言’該晶片光刻檢驗機利用晶片取出單元從—裝載 位置處之-直立晶片盒中不斷拉該等晶片，從而檢測該等晶 片。由於自外部晶片處理機傳輸之該晶片盒處於水平位置，因 ，該晶片盒當然不係以自動方式，至該晶片細檢驗機而 =人以手射式將該晶片盒輯至該晶片糾檢驗機之該 裝載位置上，並使其處於豎直位置以供檢測。 【發明内容】 因此，本發明旨在提供一種晶片盒傳輸裝置。 • 、，本發明之目標係提供一種晶片盒傳輸裝置，其中自外側以 水平位置接收之晶片盒轉變成直接自一台外部晶片處理機以 豎直位置接收該晶片盒，從而能構建一與外部機器協 自動系統。 將在隨後之該說明中部分闞述本揭示内容另外之優點、目 標與特徵’-織悉該技藝者藉由搜规後之·或從實踐本 發明中部分瞭解此等優點、目標與特徵。可藉由該書面描述與 其申請專利範圍及該等附圖特別指出之該結構實太 & ㈣之_目標他伽。 传本 騎現此等目標與其他伽且與本發明之目的—致，如此 ，具體表達與大致之描述’―種晶片盒傳輸裝置包括：一晶片 ，裝載平臺’該裝餅臺絲射繞-水報顯雜動一預 定角度，且其上安置有自外部傳輸之晶片盒；一鎖定單元，其 用於固^或釋放該晶片盒裝載平臺上之該晶片 盒：；及一 JL作 $轉單元，其用於使該晶片盒裝载平臺繞該鉸鏈前後轉動一 預定角度，以便使該晶片盒裝載平臺處於豎直位置或水平位 置。 應瞭解前面之描述與隨後本發明之詳細描述皆係作為例 5 201025487 二與解釋’且企圖如申請專利範圍—樣為本發 說明。 【實施方式】 將詳細參考本發明之該具體實施例 ，其實例圖示說明於該 =圖中。在任何可能之情況下，該等侧之元件符號在所有 該等圖中指代相同或相似之部分。 圖1至3說明一種根據本發明之一較佳具體實施例之晶片 益傳輸裝置1GG ’其包括：—水平_塊12()，其以可水平移 動之方式安裝在-基座(财未顯示)上，其藉由_吾人熟知之 具有滾珠絲槓（圖中未顯示）之線性移動單元與一導向元件 180而在X-軸方向上移動；一可轉動塊13〇，其以可轉動之方 式安裝在該水平移動塊12〇上，可繞豎直於該水平移動塊12〇 =一軸（Z-軸）轉動；一升降塊14〇，其以可豎直移動之方式 安裝在該可轉動塊130上，從而可在上下方向上移動；一晶片 盒裝載平臺110，其安裝在該升降塊140之頂部，可繞該鉸鏈 抽113轉動；與一工作平臺迴轉單元，其用於轉動該晶片盒裝 載平臺110。 該晶片盒裝載平臺11〇具有複數個導向突出部m，該等 導向突出部111自該晶片盒裝載平臺110之頂表面突出，^於 固定該晶片盒之兩個側邊。在該晶片盒裝載平臺110之一端部 處，提供有一固定該晶片盒C之一端部之夾具115與一用於^ 後移動該夾具115之氣壓紅116。而在該晶片盒裝載平臺 之另一侧上固定有一用於鎖定該晶片盒C另一端部之鎖定塊 117。該夾具115與該鎖定塊117都具有鎖定突出部115&與 117a，該等鎖定突出部115a與117a分別插入該晶片盒c相對 端之凹槽r中。 201025487 一軸承座122安裝於該水平移動塊12〇上。該可轉動塊 130藉由該軸承座122中提供之一轴承132以可轉動之方式支 撐。該水平移動塊120之一侧提供有一馬達（圖中未顯示）， 經由一動力傳動帶134其可帶動該可轉動塊13〇轉動。轉動該 可轉動塊130用以改變放置於該晶片盒裝載平臺11〇上之該晶 片盒C之方位。201025487 6. Technical Field of the Invention The present invention relates to a device for transporting a cartridge in which a wafer is mounted, and more particularly to a device for transporting a wafer cassette in a wafer handler, For converting one of the wafer cassettes from the outside to the vertical position and transferring the wafer cassette to the specified process position. [Prior Art] In microelectronics, a semiconductor material wafer is used as a substrate for producing microelectronic components. For example, as suitable materials, there are II/VI compound semiconductors, ι ι/γ compound semiconductors, and elemental semiconductors such as ruthenium and osmium. ® by making a single cylindrical crystal semiconductor into a few centimeters or a few tenths of a meter length of the nano W (four) to make the conductor "." These ingots are each cut into thin wafers. Previously, the thin tree could be processed into a polygonal shape according to the manufacturing target. For example, a single crystal 剌 (pv wafer), the ingot can be processed into a hem column, such as a square minus square column. The wafers obtained by the spindle component are introduced into a wafer lithography inspection machine and are inspected by the wafer lithography inspection machine, and the wafers are introduced to an electronic component manufacturing process such as a semiconductor package or a solar cell. Assembly 0 simultaneously 'because the conventional wafer handler is configured in such a way that the worker, the wafer cover of the re-oil wafer is placed in the designated position of the free machine, and the wafers are taken out from the wafer cassette, Therefore, the implementation of the desired fall. There are a number of problems, that is, its production capacity is under the coordination of the operation day.), and can not be built - sets and other wafer equipment from 4 201025487 for example 'the wafer The inspecting machine uses the wafer take-out unit to continuously pull the wafers from the upright wafer cassette at the loading position to detect the wafers. Since the wafer cassettes are transferred from the external wafer processing machine in a horizontal position, the wafer cassettes are Of course, it is not automatic to the wafer inspection machine and the person manually assembles the wafer cassette to the loading position of the wafer inspection machine and puts it in a vertical position for detection. Accordingly, the present invention is directed to a wafer cassette transport apparatus. The object of the present invention is to provide a wafer cassette transport apparatus in which a wafer cassette received from a horizontal position at a horizontal position is converted into an external external wafer handler. Receiving the wafer cassette in a vertical position, thereby constructing an automated system in conjunction with an external machine. Additional advantages, objects, and features of the present disclosure will be described in the following description - woven by the artist after searching And/or from the practice of the present invention, some of these advantages, objectives, and features are understood. The written description and the scope of the patent application and such The figure specifically points out that the structure is too too & (4) _ target he gamma. The present is the purpose of this and other gamma and the purpose of the present invention, so, the specific expression and general description '------- The device comprises: a wafer, the loading platform 'the pancake wire-spraying-water report pulsating a predetermined angle, and the wafer cassette is externally disposed thereon; a locking unit for fixing or releasing the wafer The wafer cassette on the wafer cassette loading platform: and a JL as a unit for rotating the wafer cassette loading platform back and forth around the hinge by a predetermined angle so that the wafer cassette loading platform is in an upright position or Horizontal Positions It should be understood that the foregoing description and the following detailed description of the present invention are set forth as example 5, the disclosure of Embodiments, examples of which are illustrated in the figure. Wherever possible, the symbols of the components in the figures are the same or the like. 1 to 3 illustrate a wafer transfer device 1GG' according to a preferred embodiment of the present invention comprising: a horizontal block 12 () mounted in a horizontally movable manner on a base (not shown) ), which is moved in the X-axis direction by a linear moving unit having a ball screw (not shown) and a guiding member 180, which is well known to us; a rotatable block 13〇, which is rotatable The method is mounted on the horizontal moving block 12 ,, and is rotatable about the horizontal moving block 12 〇=one axis (Z-axis); a lifting block 14 〇 is mounted on the rotatably vertically movable manner Block 130 so as to be movable in the up and down direction; a wafer cassette loading platform 110 mounted on top of the lifting block 140 for pivoting about the hinge; and a working platform swivel unit for rotating the wafer The cassette loading platform 110. The wafer cassette loading platform 11 has a plurality of guide projections m projecting from the top surface of the wafer cassette loading platform 110 to secure the two side edges of the wafer cassette. At one end of the wafer cassette loading platform 110, a jig 115 for fixing one end of the wafer cassette C and a pressure red 116 for moving the jig 115 are provided. On the other side of the wafer cassette loading platform, a locking block 117 for locking the other end of the wafer cassette C is attached. Both the jig 115 and the locking block 117 have locking projections 115 & 117a which are respectively inserted into the recesses r of the opposite ends of the wafer cassette c. 201025487 A bearing block 122 is mounted on the horizontal moving block 12A. The rotatable block 130 is rotatably supported by a bearing 132 provided in the bearing housing 122. One side of the horizontal moving block 120 is provided with a motor (not shown), which can drive the rotatable block 13 to rotate via a power transmission belt 134. The rotatable block 130 is rotated to change the orientation of the cassette C placed on the wafer cassette loading platform 11A.
藉由安裝於該可轉動塊130上之滚珠絲槓142與驅動該滾 珠絲槓142旋轉之馬達141，該升降塊14〇於豎直方向（z袖 方向）上下移動。 該鉸鏈轴113為該晶片盒裝載平臺11〇之旋轉中心，其藉 由固疋至該升降塊140頂部之一鉸鏈托架114而與該晶片盒 載平臺110之一侧端相連。 根據本發明之雜佳具體實_，該平臺旋轉單元包括： -滾珠絲槓152; _與該滾珠_ 152 _合 移動之螺母153 ;及-連桿154 珠絲槓152 ㈣m知·品甘Γ 其端可轉動之方式與該 =153相聯結’而其另—_可轉動之方式與該 平臺110相聯結。 乃麗展戰 該Z-軸馬達151較佳4一控制該連桿154移動 :連=裝::二::: 相連之升降構件’㈣Ζ姻達⑸ =連杯154 動該螺母—其為升降構件一之_裝| 驅 性馬達可用作該驅動裝置，且藉由以 、，不同，一線 m至該_達之動子，從_^==該連桿 7 201025487 :面將描述晶片盒傳輸裝置之操作。 遂私外部傳送裝置在該晶片盒裝餅臺11G上放置 複數個（在該具體實施例中為兩個）晶片盒c時， f載平臺110之該夾具115由該氣壓缸116驅動，逆著該鎖定 ★ 117擠壓該等晶片盒c之端部。在此情形下，該夹具出 上之該等突出部115&與117a固定於該等晶片盒c中之該、 定凹槽内’從而將該等晶片盒固定至該晶片盒裝載平臺110。 然後’該可轉動塊130轉動90度，從而改變該等晶片盒 C之方位。當由-外部傳送裝置（圖巾未顯示）提供至其上: 該等晶片盒C之方位與該晶片處理機器所傳輸之該等晶片盒 C之方位不啊，則實施該步驟。然而，當由-外部傳送裝^ (圖中未顯示）供給至其上之該等晶#盒C之方位與該晶片處 理機器所傳輸之鱗晶#盒C之方位糊時，或不轉動該可轉 動塊130，或不提供該可轉動塊130，但該升降塊14〇可直接 安裝至該水平移動塊120，用以可在上/下方向上移動。 然後，該水平移動塊120在X-轴方向上移動，直至該裝 載平臺11G達至該晶片處_^之晶片盒賴位置處為止。然 後丄如圖3中所示，該升降塊140向上移動一預定距離，從而 升兩該晶片盒裝載平臺110。此制為該晶片盒裝載平臺ιι〇 轉動90度時’若接受該等晶片盒C處之賴位置高於該等晶 片盒之下端’則該等晶片盒C很可能不麟確放置在該裝載 位置處。 元成該升降塊140之南度調節後，該工作平臺迴轉單元開 始運轉’使該晶片盒裝載平臺110繞該鉸鏈軸n3向上轉動 9〇度’用以使該等晶片盒C處於豎直位置。 即，當該晶片盒裝載平臺110處於圖2中所示之水平狀維 201025487 施加—錄，若顧雜槓⑸轉動， 螺母153如圖3中所示向上移動 ^ 動該晶片盒裝載平臺11〇，藉此該 ^ ^向上推The lifting block 14 is moved up and down in the vertical direction (z-sleeve direction) by the ball screw 142 attached to the rotatable block 130 and the motor 141 that drives the ball screw 142 to rotate. The hinge shaft 113 is a center of rotation of the wafer cassette loading platform 11A, and is coupled to a side end of the wafer cassette platform 110 by a hinge bracket 114 fixed to the top of the lifting block 140. According to the present invention, the platform rotation unit comprises: - a ball screw 152; a nut 153 that moves with the ball _ 152 _; and a link 154 a ball screw 152 (four) m know · 甘甘Γ The end is rotatably coupled to the =153 and the other is rotatably coupled to the platform 110.乃丽展战 The Z-axis motor 151 preferably 4 controls the movement of the connecting rod 154: even = loaded:: two::: connected lifting member '(four) Ζ 达 (5) = even cup 154 move the nut - it is lifting The component motor can be used as the driving device, and by means of, and different, a line m to the mover, from the _^== the link 7 201025487: the wafer cassette will be described The operation of the transmission device. When the plurality of (in this embodiment, two) wafer cassettes c are placed on the wafer cassette table 11G, the jig 115 of the loading platform 110 is driven by the pneumatic cylinder 116, against the The lock ★ 117 presses the ends of the wafer cassettes c. In this case, the projections 115 & 117a of the jig are fixed in the predetermined recesses in the wafer cassettes c to fix the wafer cassettes to the wafer cassette loading platform 110. Then, the rotatable block 130 is rotated by 90 degrees to change the orientation of the wafer cassettes C. This step is carried out when the orientation of the wafer cassette C is not the same as the orientation of the wafer cassette C transported by the wafer processing machine by the external transfer device (not shown). However, when the orientation of the crystal box C supplied thereto by the external transfer device (not shown) and the orientation of the squama box C transmitted by the wafer processing machine, or not rotating The rotatable block 130 may or may not be provided, but the lifting block 14A may be directly mounted to the horizontal moving block 120 for upward movement in the up/down direction. Then, the horizontal moving block 120 is moved in the X-axis direction until the loading platform 11G reaches the wafer cassette position at the wafer. Then, as shown in Fig. 3, the lifting block 140 is moved upward by a predetermined distance to lift the wafer cassette loading platform 110. When the wafer cassette loading platform is rotated 90 degrees, 'if the position of the wafer cassette C is higher than the lower end of the wafer cassettes', the wafer cassette C is likely to be placed on the loading. Location. After the southward adjustment of the lifting block 140, the working platform rotary unit starts to operate 'the wafer cassette loading platform 110 is rotated upward by 9 degrees around the hinge axis n3' to place the wafer cassette C in a vertical position. . That is, when the wafer cassette loading platform 110 is in the horizontal dimension 201025487 shown in Fig. 2, if the dummy bar (5) is rotated, the nut 153 is moved upward as shown in Fig. 3 to move the wafer cassette loading platform 11 With this ^ ^ push up
St逐漸降 慣性而落;等^盒C轉變·豎直位置時由於轉動St gradually reduces inertia and falls; when ^ box C changes · vertical position due to rotation
成暨該f盒裝載平臺⑽之轉動而轉變 放㈣曰f人^操作該氣壓紅116時該夾具被打開，用以釋 之該1二L，從而該等晶片盒C被放置在該晶片處理機器 ^此狀態下’若在與該先前方向相反之方向上運轉該z_ ;、1M ’以在與該先前方向相反之方向上轉動該滾珠絲槓 验截^吏該螺# 153向下移動，該連桿154向下推該晶片盒 裝載平臺no’雌晶片盒輯平4 UG再她復至水平狀態。 然後，該晶片盒裝載平臺110沿該導向軌180再次水平移 ==座(圓中未顯示)之外側’且為接收下一晶片κ 因此，當藉由該工作平臺迴轉單元該晶片盒裝載平臺11〇 向上/向下轉動90度而傳輸該晶片盒c時，本發明之該晶片盒 傳輸裝置100將該晶片盒C自水平位置轉變為豎直位置。最 後’該晶片盒傳輸裝置100將該晶片盒C裝載至該晶片處理 機器上’非工人手工裝栽’而係從外部機器直接接收該處於水 平位置之晶片盒C ’且將該等晶片盒c裝載至處於豎直位置之 該晶片處理機器上。 9 201025487 =時，即舰雜具體實補建顧轉動 而使該晶片盒裝載平臺no繞一豎直軸轉動 轉^ 30 /下移動該升降塊14〇而上/下而移動—預定 肖度藉由上 而且’映該前述具體實施例建議藉由該升 =2該晶片盒裝載平臺11G向上移動—定_ = ，平fH)轉動90度而將該晶片盒轉變成賢直^^ 同，有可能在該晶片盒裝載平臺110轉動9 f匕^ 定距離。 u工秒勒 同樣，與此獨，有可能_該晶片盒裝載平臺ιι〇轉動 又且該升降塊14〇向上或向下移動一預定距離。 如所述，本發明之晶片盒傳輸裝置具有如下優點： ，於放置在處於水平位置之該⑼盒賴平臺上之該晶 片益在該晶片盒裝載平臺向上/向下轉動9()度 置，不需衫人財財式職⑼錄輕該以處理機器 上而係該晶片益裝載平臺直接於水平位置自一外部機器接收 該晶片盒C，並將該等晶片盒c裝載至該晶片處理機器上藉 此能容易地構建-與外部設備相連之自動系統，從而提高晶片 盒傳輸速率與工作效率。 熟悉該技藝之人將_，在不本㈣之精神與範圍 時了對本發明進行各種修改與變更。因此，若此發明之該等 修改與變更在該等所附申請專利範圍及其等價物之範圍内 時，本發明涵蓋該等修改與變更。 201025487 【圖式簡單說明】 該等關之作帛在於進—步理麟解_容，且為此申請 八不可或缺之部分，其用於說鴨揭示内容之具體實施例，且 與該描述一起用作解釋此揭示内容之原理。 圖1為一橫截面視圖，顯示用於傳輸根據本發明之一較佳 具體實施例之晶片盒。 圖2為一橫截面視圖’顯示用於傳輪圖！中晶片盒之該裝 置，其上水平放置有該晶片盒，沿一基座水平移動。 圖3為一橫截面視圖，顯示傳輸圖】中晶片盒之該裝置， 其裝載平臺轉動度職“盒觀姑直位置。 【主要元件符號說明】 C 晶片盒 r 鎖定凹槽 100 晶片盒傳輸裝置 110 晶片盒裝載平臺 111 複數個導向突出部 113 敍鍵轴 114 鉸鏈托架 115 夾具 115a 鎖定突出部 116 氣壓缸 117 鎖定塊 117a 鎖定突出部 120 水平移動塊 122 轴承座 130 可移動塊 201025487 132 轴承 134 動力傳輸帶 140 升降塊 141 馬達 142 滚珠絲槓 151 Z-軸馬達 152 滾珠絲槓 153 螺母 154 連桿 180 導向構件The yoke of the f-box loading platform (10) is rotated to convert (four) 曰f people ^ when the air pressure red 116 is operated, the jig is opened to release the two L, so that the wafer cassette C is placed on the wafer processing In the state of the machine, if the z_;, 1M' is operated in a direction opposite to the previous direction, the ball screw is rotated in a direction opposite to the previous direction, and the screw #153 moves downward. The link 154 pushes down the wafer cassette loading platform no' female wafer box level 4 UG and then she returns to the horizontal state. Then, the wafer cassette loading platform 110 is horizontally moved along the guide rail 180 again == the seat (not shown in the circle) on the outer side 'and receives the next wafer κ. Therefore, when the wafer cassette loading platform is rotated by the working platform When the wafer cassette c is transported by rotating upward/downward by 90 degrees, the wafer cassette transporting apparatus 100 of the present invention converts the wafer cassette C from a horizontal position to a vertical position. Finally, the wafer cassette transporting device 100 loads the wafer cassette C onto the wafer processing machine, 'non-worker manual loading', and directly receives the wafer cassette C' in the horizontal position from the external machine and the wafer cassettes c Loading onto the wafer processing machine in an upright position. 9 201025487 = When the ship is mixed, the wafer loading platform is rotated around a vertical axis, and the lifting block 14 is moved up/down and moved. From the above and by the foregoing specific embodiment, it is proposed that the wafer cassette loading platform 11G is moved upward by the lift = 2, and the flat fH is rotated by 90 degrees to convert the wafer cassette into a straight line. The wafer cassette loading platform 110 is rotated by a distance of 9 f. Similarly, in this case, it is possible that the wafer cassette loading platform is rotated and the lifting block 14 is moved upward or downward by a predetermined distance. As described, the wafer cassette transporting apparatus of the present invention has the following advantages: the wafer placed on the (9) cassette platform in a horizontal position is turned up/down by 9 () degrees on the wafer cassette loading platform. The wafer cassette C is received from an external machine directly from a horizontal position, and the wafer cassette c is loaded to the wafer processing machine. By this, it is possible to easily construct an automatic system connected to an external device, thereby increasing the transfer rate and work efficiency of the wafer cassette. A person skilled in the art will be able to make various modifications and changes to the present invention without departing from the spirit and scope of the invention. Therefore, the present invention covers such modifications and variations as the scope of the appended claims and the equivalents thereof. 201025487 [Simple description of the schema] The trick is to enter the step-by-step solution, and apply for an indispensable part of this, which is used to describe the specific embodiment of the duck revealing content, and with the description Together they serve as a basis for explaining the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a wafer cassette for transporting a preferred embodiment of the present invention. Figure 2 is a cross-sectional view of the display for the transfer chart! The device of the middle wafer cassette, on which the wafer cassette is placed horizontally, moves horizontally along a pedestal. Figure 3 is a cross-sectional view showing the device of the wafer cassette in the transfer diagram, the loading platform rotation degree is "the position of the box view. [Major component symbol description] C wafer cassette r locking groove 100 wafer cassette transport device 110 wafer cassette loading platform 111 a plurality of guiding protrusions 113 a key shaft 114 hinge bracket 115 clamp 115a locking protrusion 116 pneumatic cylinder 117 locking block 117a locking projection 120 horizontal movement block 122 bearing housing 130 movable block 201025487 132 bearing 134 Power transmission belt 140 lifting block 141 motor 142 ball screw 151 Z-axis motor 152 ball screw 153 nut 154 connecting rod 180 guiding member
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