KR101331077B1 - The apparatus for stacking the wafer - Google Patents
The apparatus for stacking the wafer Download PDFInfo
- Publication number
- KR101331077B1 KR101331077B1 KR20120027003A KR20120027003A KR101331077B1 KR 101331077 B1 KR101331077 B1 KR 101331077B1 KR 20120027003 A KR20120027003 A KR 20120027003A KR 20120027003 A KR20120027003 A KR 20120027003A KR 101331077 B1 KR101331077 B1 KR 101331077B1
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- KR
- South Korea
- Prior art keywords
- cassette
- wafer
- standing
- wafers
- stacking
- Prior art date
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention is directed to an LED wafer stacking apparatus which allows the wafers to be uniformly heated by stacking the wafers to be in a wafer to wafer contact by taking out LED wafers continuously supplied from an inline manufacturing line while being inserted into a cassette. An LED wafer laminating apparatus according to the present invention includes a cassette supply unit for horizontally moving a cassette in which a plurality of LED wafers are vertically inserted in a width direction; A cassette rotating standing part installed adjacent to the cassette supply part and rotating the cassette supplied by the cassette supply part 90 degrees horizontally in the longitudinal direction, and standing the cassette; A wafer stacking unit disposed adjacent to the cassette rotating standing unit, and vertically stacking the LED wafers from the standing cassettes to directly contact the wafers; And a stacked wafer discharge unit disposed adjacent to the wafer stacking unit and discharging a plurality of wafers stacked vertically by the wafer stacking unit.
Description
The present invention relates to an LED wafer laminating apparatus, and more particularly, to take out LED wafers continuously supplied from an inline manufacturing line while inserted into a cassette, and stack the wafers to be in a wafer to wafer contact. The present invention relates to an LED wafer laminating apparatus that enables uniform heating.
In general, LED (Lignt Emitting Diode) is manufactured by processing a sapphire wafer. In this case, the sapphire made of an ingot is sliced in the form of a wafer, subjected to a surface treatment process, etc., and finished in an LED through a packaging process.
In the process of sapphire wafer slicing and surface treatment, a process is performed with a plurality of wafers inserted into a cassette for efficiency of work. However, there is an essential process of heating the wafer to a constant temperature in the LED manufacturing line.
Inserting and heating the cassette itself into the heating furnace while the wafer is inserted into the cassette during this process has a problem that the volume occupied by the cassette in the heating furnace is unnecessarily increased and the heating efficiency is lowered. Since they exist in spaced intervals, there is a problem that uniform temperature management for a plurality of wafers is difficult.
Therefore, there is a demand for the development of a technology capable of efficiently discharging and stacking a plurality of wafers inserted into a cassette.
The technical problem to be solved by the present invention is to take out the LED wafers continuously supplied from the in-line manufacturing line while inserted in the cassette to stack the wafers so that the wafer to wafer (wafer to wafer) contact is possible to uniformly heat the wafers It is to provide an LED wafer laminating apparatus.
LED wafer stacking apparatus according to the present invention for achieving the above-described technical problem is a cassette supply unit for horizontally moving the cassette in which the plurality of LED wafers are vertically inserted in the width direction; A cassette rotating standing part installed adjacent to the cassette supply part and rotating the cassette supplied by the cassette supply part 90 degrees horizontally in the longitudinal direction, and standing the cassette; A wafer stacking unit disposed adjacent to the cassette rotating standing unit, and vertically stacking the LED wafers from the standing cassettes to directly contact the wafers; And a stacked wafer discharge unit disposed adjacent to the wafer stacking unit and discharging a plurality of wafers stacked vertically by the wafer stacking unit.
In the present invention, the cassette rotary standing portion, the cassette mounting jig of the open O-shape open the cassette supply direction; A horizontal rotating part installed to be capable of lifting and lowering through the through hole of the cassette seating jig, and horizontally rotating the cassette seated on the cassette seating jig by 90 °; And a cassette standing portion for standing the cassette mounting jig vertically.
The cassette seating jig surface is preferably further provided with an adhesive portion for adhering the back of the cassette.
In addition, in the present invention, the wafer stacking unit may include a wafer adsorption pad for adsorbing an upper surface of the wafer inserted into the cassette, and an adsorption pad driver for vertically driving and horizontally driving the wafer adsorption pad.
The wafer stacking unit may further include a guide for guiding a stacking direction of the wafers stacked vertically.
In addition, the LED wafer stacking apparatus of the present invention is preferably provided adjacent to the laminated wafer discharge portion, the wafer heating unit for heating the wafer in a stacked state.
According to the LED wafer stacking apparatus of the present invention, it is possible to automatically stack and heat the wafers by continuously discharging the wafers even in the in-line state with respect to the plurality of LED wafers in the process of being inserted into the cassette.
1 is a view showing the configuration of the LED wafer stacking apparatus according to an embodiment of the present invention.
2 and 3 are views showing the configuration and operating state of the cassette rotating standing portion according to an embodiment of the present invention.
4 is a diagram illustrating a configuration and an operating state of a wafer stack according to an exemplary embodiment of the present invention.
Hereinafter, a specific embodiment of the present invention will be described in detail with reference to the accompanying drawings.
In the LED wafer stacking apparatus 1 according to the present embodiment, as shown in FIG. 1, the
First, the
Next, the cassette rotary standing
To this end, in the present embodiment, the cassette rotating standing
The
Next, as shown in FIG. 1, the horizontal rotating
Next, as shown in FIGS. 2 and 3, the
On the other hand, in the wafer wafer laminating apparatus 1 according to the present embodiment, the
Next, as illustrated in FIG. 1, the
To this end, the
Meanwhile, the
Next, the stacked
As shown in FIG. 1, the
1: LED wafer laminating apparatus according to an embodiment of the present invention
10: cassette supply part 20: cassette rotation standing part
30: wafer stack 40: stack wafer discharge
50: wafer heating part
Claims (5)
A cassette rotating standing part installed adjacent to the cassette supply part and rotating the cassette supplied by the cassette supply part 90 degrees horizontally in the longitudinal direction, and standing the cassette;
A wafer stacking unit disposed adjacent to the cassette rotating standing unit, and vertically stacking the LED wafers from the standing cassettes to directly contact the wafers;
And a stacked wafer discharge unit disposed adjacent to the wafer stacking unit and discharging a plurality of wafers stacked vertically by the wafer stacking unit.
The cassette rotating standing portion,
An open O-shaped cassette seating jig having the cassette supplying part direction open;
A horizontal rotating unit installed to be capable of lifting and lowering through the through hole of the cassette seating jig, and horizontally rotating the cassette seated on the cassette seating jig by 90 °;
LED wafer laminating apparatus comprising a; a cassette standing portion for standing the cassette mounting jig vertically.
LED wafer laminating apparatus characterized in that it further comprises an adhesive portion for adhering the back of the cassette.
A wafer adsorption pad for adsorbing an upper surface of the wafer inserted into the cassette;
And an adsorption pad driver for vertically driving and horizontally driving the wafer adsorption pad.
LED wafer stacking apparatus further comprises a guide for guiding the stacking direction of the wafer to be stacked vertically.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20120027003A KR101331077B1 (en) | 2012-03-16 | 2012-03-16 | The apparatus for stacking the wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20120027003A KR101331077B1 (en) | 2012-03-16 | 2012-03-16 | The apparatus for stacking the wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130104981A KR20130104981A (en) | 2013-09-25 |
KR101331077B1 true KR101331077B1 (en) | 2013-11-20 |
Family
ID=49453723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20120027003A KR101331077B1 (en) | 2012-03-16 | 2012-03-16 | The apparatus for stacking the wafer |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101331077B1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050020128A (en) * | 2003-08-21 | 2005-03-04 | 삼성전자주식회사 | The wafer transportation system of heat setting apparatus |
KR20050090140A (en) * | 2003-08-14 | 2005-09-13 | 가부시기가이샤 디스코 | Cassette for storing a plurality of semiconductor wafers |
KR20100071550A (en) * | 2008-12-19 | 2010-06-29 | 한미반도체 주식회사 | Transfer apparatus for wafer cassette |
-
2012
- 2012-03-16 KR KR20120027003A patent/KR101331077B1/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050090140A (en) * | 2003-08-14 | 2005-09-13 | 가부시기가이샤 디스코 | Cassette for storing a plurality of semiconductor wafers |
KR20050020128A (en) * | 2003-08-21 | 2005-03-04 | 삼성전자주식회사 | The wafer transportation system of heat setting apparatus |
KR20100071550A (en) * | 2008-12-19 | 2010-06-29 | 한미반도체 주식회사 | Transfer apparatus for wafer cassette |
Also Published As
Publication number | Publication date |
---|---|
KR20130104981A (en) | 2013-09-25 |
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