KR20130104981A - The apparatus for stacking the wafer - Google Patents

The apparatus for stacking the wafer Download PDF

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Publication number
KR20130104981A
KR20130104981A KR1020120027003A KR20120027003A KR20130104981A KR 20130104981 A KR20130104981 A KR 20130104981A KR 1020120027003 A KR1020120027003 A KR 1020120027003A KR 20120027003 A KR20120027003 A KR 20120027003A KR 20130104981 A KR20130104981 A KR 20130104981A
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KR
South Korea
Prior art keywords
cassette
wafer
standing
wafers
unit
Prior art date
Application number
KR1020120027003A
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Korean (ko)
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KR101331077B1 (en
Inventor
양상구
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(주)네오텍
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Publication date
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Priority to KR20120027003A priority Critical patent/KR101331077B1/en
Publication of KR20130104981A publication Critical patent/KR20130104981A/en
Application granted granted Critical
Publication of KR101331077B1 publication Critical patent/KR101331077B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: An LED wafer stacking apparatus is provided to continuously output a wafer in an inline state and to automatically stack and heat the wafer. CONSTITUTION: A cassette supply unit (10) horizontally moves a cassette into which a plurality of wafers are vertically inserted in a width direction. A cassette rotating and erecting unit (20) erects the cassette after the cassette is horizontally rotated at 90 degrees in a longitudinal direction. A wafer stacking unit (30) is installed near the cassette rotating and erecting unit and vertically stacks the wafers. A stacked wafer output unit (40) outputs the wafers which are vertically stacked by the wafer stacking unit. A wafer heating unit (50) heats the stacked wafers.

Description

LED wafer laminating device {THE APPARATUS FOR STACKING THE WAFER}

The present invention relates to an LED wafer laminating apparatus, and more particularly, to take out LED wafers continuously supplied from an inline manufacturing line while inserted into a cassette, and stack the wafers to be in a wafer to wafer contact. The present invention relates to an LED wafer laminating apparatus that enables uniform heating.

In general, LED (Lignt Emitting Diode) is manufactured by processing a sapphire wafer. In this case, the sapphire made of an ingot is sliced in the form of a wafer, subjected to a surface treatment process, etc., and finished in an LED through a packaging process.

In the process of sapphire wafer slicing and surface treatment, a process is performed with a plurality of wafers inserted into a cassette for efficiency of work. However, there is an essential process of heating the wafer to a constant temperature in the LED manufacturing line.

Inserting and heating the cassette itself into the heating furnace while the wafer is inserted into the cassette during this process has a problem that the volume occupied by the cassette in the heating furnace is unnecessarily increased and the heating efficiency is lowered. Since they exist in spaced intervals, there is a problem that uniform temperature management for a plurality of wafers is difficult.

Therefore, there is a demand for the development of a technology capable of efficiently discharging and stacking a plurality of wafers inserted into a cassette.

The technical problem to be solved by the present invention is to take out the LED wafers continuously supplied from the in-line manufacturing line while inserted in the cassette to stack the wafers so that the wafer to wafer (wafer to wafer) contact is possible to uniformly heat the wafers It is to provide an LED wafer laminating apparatus.

LED wafer stacking apparatus according to the present invention for achieving the above-described technical problem is a cassette supply unit for horizontally moving the cassette in which the plurality of LED wafers are vertically inserted in the width direction; A cassette rotating standing part installed adjacent to the cassette supply part and rotating the cassette supplied by the cassette supply part 90 degrees horizontally in the longitudinal direction, and standing the cassette; A wafer stacking unit disposed adjacent to the cassette rotating standing unit, and vertically stacking the LED wafers from the standing cassettes to directly contact the wafers; And a stacked wafer discharge unit disposed adjacent to the wafer stacking unit and discharging a plurality of wafers stacked vertically by the wafer stacking unit.

In the present invention, the cassette rotary standing portion, the cassette mounting jig of the open O-shape open the cassette supply direction; A horizontal rotating part installed to be capable of lifting and lowering through the through hole of the cassette seating jig, and horizontally rotating the cassette seated on the cassette seating jig by 90 °; And a cassette standing portion for standing the cassette mounting jig vertically.

The cassette seating jig surface is preferably further provided with an adhesive portion for adhering the back of the cassette.

In addition, in the present invention, the wafer stacking unit may include a wafer adsorption pad for adsorbing an upper surface of the wafer inserted into the cassette, and an adsorption pad driver for vertically driving and horizontally driving the wafer adsorption pad.

The wafer stacking unit may further include a guide for guiding a stacking direction of the wafers stacked vertically.

In addition, the LED wafer stacking apparatus of the present invention is preferably provided adjacent to the laminated wafer discharge portion, the wafer heating unit for heating the wafer in a stacked state.

According to the LED wafer stacking apparatus of the present invention, it is possible to automatically stack and heat the wafers by continuously discharging the wafers even in the in-line state with respect to the plurality of LED wafers in the process of being inserted into the cassette.

1 is a view showing the configuration of the LED wafer stacking apparatus according to an embodiment of the present invention.
2 and 3 are views showing the configuration and operating state of the cassette rotating standing portion according to an embodiment of the present invention.
4 is a diagram illustrating a configuration and an operating state of a wafer stack according to an exemplary embodiment of the present invention.

Hereinafter, a specific embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the LED wafer stacking apparatus 1 according to the present embodiment, as shown in FIG. 1, the cassette supply unit 10, the cassette rotating standing unit 20, the wafer stacking unit 30, and the stacked wafer discharge unit 40 are provided. It is configured to include.

First, the cassette supply unit 10 is a component for horizontally moving the cassette 2 in which a plurality of LED wafers are inserted vertically. To this end, in the present embodiment, the cassette supply unit 10 may be configured as a conveyor 12 of various types capable of continuously supplying cassettes at a constant speed in an inline process. And the end of the conveyor 12 is preferably provided with a cassette picker 14 for supplying the cassette (2) one by one to the cassette rotary standing portion 20 to be described later. The cassette picker 14 picks up the cassettes 2 continuously supplied by the conveyor 12 one by one and supplies them to the cassette rotary standing portion 20. Of course, in some cases, the cassette picker may not be provided.

Next, the cassette rotary standing part 20 is installed adjacent to the cassette supply part 10, and rotates the cassette 2 supplied by the cassette supply part 10 in the longitudinal direction by 90 ° horizontally. (2) is a component standing up. That is, as shown in FIG. 1, the cassette rotating standing part 20 rotates the cassette supplied in the width direction vertically in the longitudinal direction and erects the cassette in the rotated state.

To this end, in the present embodiment, the cassette rotating standing part 20 includes a cassette seating jig 22, a horizontal rotating part 24, and a cassette standing part 26, as shown in FIGS. 1 and 2. . First, as shown in FIG. 1, the cassette seating jig 22 has an 'open O-shape' in which the cassette supply part 10 is open, and is actually a component in which the cassette 2 is in contact with and seated. In the present embodiment, the term "open O-shape" refers to a shape in which a part of the ring is opened while having a ring shape as a whole. Therefore, the cassette seating jig 22 has a structure in which a large through hole is formed in the center portion.

The cassette seating jig 22 also has a standing surface 22b which is formed perpendicular to one surface of the seating surface 22a having an open O shape. The standing surface 22b serves to support the bottom surface of the cassette 2 in the state where the cassette 2 is standing.

Next, as shown in FIG. 1, the horizontal rotating part 24 is installed to be lift-driven through the through hole of the cassette seating jig 22 and the cassette seated on the cassette seating jig 22. It is a component that rotates 2) horizontally by 90 °. Therefore, the horizontal rotating part 24 has a contact surface 24a which actually contacts the cassette 2, an up-and-down driving part 24b for vertically driving the contact surface 24a, and a rotating driving part for rotationally driving the contact surface 24a (in the drawing). Not shown).

Next, as shown in FIGS. 2 and 3, the cassette standing portion 26 is a component that vertically stands the cassette seating jig 22. In this embodiment, the cassette standing portion 26 is installed at a portion where the seating surface 22a and the standing surface 22b of the cassette seating jig 22 are coupled to each other so that the seating surface 22a is horizontal to the ground. The cassette mounting jig 22 is repeatedly rotated in a state in which the standing surface 22b is horizontal to the ground.

On the other hand, in the wafer wafer laminating apparatus 1 according to the present embodiment, the cassette mounting jig 22 may be further provided with an adhesive portion 28 for adhering the rear surface of the cassette 2. As described above, the cassette 2 mounted on the cassette seating jig 22 undergoes a process of standing vertically by the cassette standing portion 26. In this process, if the cassette 2 is separated from the cassette seating jig 22 and moved, the wafer W may be damaged, and the position of the cassette 2 may be out of position, resulting in a problem in subsequent processes. Therefore, a portion 28 of the cassette seating jig 22 which the cassette 2 is in contact with is fixed to the cassette 2, but the adhesive portion 28 made of a material which does not leave any trace on the cassette 2 is It is preferable that it is further provided.

Next, as illustrated in FIG. 1, the wafer stacking unit 30 is installed adjacent to the cassette rotating standing unit 20, and discharges the LED wafer W from the standing cassette 2. Are vertically stacked components so that they are in direct contact.

To this end, the wafer stacking unit 30 may be configured to include a wafer suction pad 32 and a suction pad driver 34 as shown in FIG. 4. First, the wafer suction pad 32 is a component that sucks the upper surface of the wafer W in a state of being inserted into the cassette 2 by vacuum. In addition, the suction pad driver 34 is a component for vertically driving and horizontally driving the wafer suction pad 32. Therefore, when the suction pad driver 34 moves upward of the wafer W to discharge the suction pad 32, the suction pad driver 32 sucks the wafer W in a vacuum, and then the suction pad driver ( 34 moves the suction pad 32 to the wafer stacking position to stack wafers.

Meanwhile, the wafer stacking unit 30 may further include a guide 36 for guiding the stacking direction of the wafers W stacked vertically. In this embodiment, since the wafers W are stacked in a state in which the wafers W are directly contacted as shown in FIG. 4 without any jig or cassette, the wafers may be stacked out of an accurate position. Thus, the guide 36 guides the wafers to be stacked while maintaining the verticality.

Next, the stacked wafer discharge unit 40 is installed adjacent to the wafer stacking unit 30 and discharges a plurality of wafers W in a vertically stacked state by the wafer stacking unit 30. to be. Specifically, the stacked wafer discharge part 40 horizontally moves the wafer support surface 42 and the wafer support surface 42 which provide the stacked bottom surface of the wafer while waiting on the bottom surface of the position where the wafer W is to be stacked. It may be configured to include a horizontal moving unit 44 to. If necessary, the stacked wafer discharge units 40 may be provided at both sides of the line, respectively.

As shown in FIG. 1, the wafer heating unit 50 may be separately installed adjacent to the stacked wafer discharge unit 40, and heats the wafer W in the stacked state. Therefore, the stacked wafer discharge unit 40 supplies the stacked wafers into the heating unit in the state.

1: LED wafer laminating apparatus according to an embodiment of the present invention
10: cassette supply part 20: cassette rotation standing part
30: wafer stack 40: stack wafer discharge
50: wafer heating part

Claims (5)

A cassette supply unit for horizontally moving a cassette in which a plurality of LED wafers are inserted vertically in a width direction;
A cassette rotating standing part installed adjacent to the cassette supply part and rotating the cassette supplied by the cassette supply part 90 degrees horizontally in the longitudinal direction, and standing the cassette;
A wafer stacking unit disposed adjacent to the cassette rotating standing unit, and vertically stacking the LED wafers from the standing cassettes to directly contact the wafers;
And a stacked wafer discharge unit disposed adjacent to the wafer stacking unit and discharging a plurality of wafers stacked vertically by the wafer stacking unit. The method of claim 1, wherein the cassette rotary standing portion,
An open O-shaped cassette seating jig having the cassette supplying part direction open;
A horizontal rotating unit installed to be capable of lifting and lowering through the through hole of the cassette seating jig, and horizontally rotating the cassette seated on the cassette seating jig by 90 °;
LED wafer laminating apparatus comprising a; a cassette standing portion for standing the cassette mounting jig vertically. The method of claim 2, wherein the cassette seating jig surface,
LED wafer laminating apparatus characterized in that it further comprises an adhesive portion for adhering the back of the cassette. The method of claim 1, wherein the wafer stacking portion,
A wafer adsorption pad for adsorbing an upper surface of the wafer inserted into the cassette;
And an adsorption pad driver for vertically driving and horizontally driving the wafer adsorption pad. The wafer stacking portion of claim 4,
LED wafer stacking apparatus further comprises a guide for guiding the stacking direction of the wafer to be stacked vertically.
KR20120027003A 2012-03-16 2012-03-16 The apparatus for stacking the wafer KR101331077B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20120027003A KR101331077B1 (en) 2012-03-16 2012-03-16 The apparatus for stacking the wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20120027003A KR101331077B1 (en) 2012-03-16 2012-03-16 The apparatus for stacking the wafer

Publications (2)

Publication Number Publication Date
KR20130104981A true KR20130104981A (en) 2013-09-25
KR101331077B1 KR101331077B1 (en) 2013-11-20

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Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100904888B1 (en) * 2003-08-14 2009-06-29 가부시기가이샤 디스코 Cassette for storing a plurality of semiconductor wafers
KR100513421B1 (en) * 2003-08-21 2005-09-09 삼성전자주식회사 The wafer transportation system of heat setting apparatus
KR20100071550A (en) * 2008-12-19 2010-06-29 한미반도체 주식회사 Transfer apparatus for wafer cassette

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