TW201013833A - Fixing jig of wire bonding machine and window type clamp thereof - Google Patents

Fixing jig of wire bonding machine and window type clamp thereof Download PDF

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TW201013833A
TW201013833A TW098125939A TW98125939A TW201013833A TW 201013833 A TW201013833 A TW 201013833A TW 098125939 A TW098125939 A TW 098125939A TW 98125939 A TW98125939 A TW 98125939A TW 201013833 A TW201013833 A TW 201013833A
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plate
window
carrier plate
abutting
carrier
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TW098125939A
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Chinese (zh)
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TWI389247B (en
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In-Ho Kim
Hee-Seok Ryu
Dae-Guen Kim
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Advanced Semiconductor Eng
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a fixing jig of wire bonding machine and a window type clamp thereof. The window type clamp is used to press on the upper surface of a carrier, and includes a clamp body, at least one window and at least one buffer device. The window penetrates the clamp body, and is used to expose part of the upper surface of the carrier. The buffer device is disposed outside the window, and includes a pushing end. When the window type clamp presses on the upper surface of the carrier, the pushing end sustains against the upper surface of the carrier. When the window type clamp is lifted, the pushing end pushes the carrier downward so as to prevent the carrier from being lifted along with the window type clamp. whereby, the warpage of the carrier is avoided, and the yield rate is raised.

Description

201013833 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種固定治具及其壓板，詳言之，係關於 一種打線機台之固定治具及其窗型壓板。 【先前技術】 參考圖1，顯示習知打線機台之固定治具1之分解示意 圖。該固定治具1係用以固定一承載板21以利打線製程， 該承載板21包括一上表面211及一下表面212，複數個晶片 22係黏附於該承載板21。該固定治具1包括一熱板丨丨、二 軌道12及一窗型壓板13。該熱板11包括一吸附面in，用 以支標該承載板21之下表面212且提供熱能至該承載板 21。該等軌道12係位於該熱板11之二侧，以支樓該承載板 21之二側。該窗型壓板13係用以壓合該承載板21之上表面 211 ’其包括一壓板本體131、至少一窗孔132及複數個壓 條133。該窗孔132貫穿該壓板本體131，用以顯露該承載 板21之部分上表面211。部分該等壓條133係位於該窗孔 132内’且互相交錯而定義出複數個開口134。該等壓條 133更包括複數條側壓條133 1，該等側壓條133丨係位於該 窗型壓板13背面之兩側（如圖2所示）。 參考圖3，顯示習知打線機台之固定治具之應用俯視示 意圖。在半導體製程之一打線製程中，首先，該承載板21 被置於該等執道12上’且該熱板11之吸附面1丨丨支撐該承 載板21之下表面212且提供熱能至該承載板21。接著，該 窗型壓板13向下壓合於該承载板21，其中每一該等開口 130742.doc 201013833 134係對應每一該等晶片22 ’而後進行打線。完成打線 後，該窗型壓板13向上提升，以利該承載板21依循運送方 向前進，使尚未打線之晶片22前進至一預定位置。之後， 該窗型壓板13再向下壓合該承載板21 ,以進行下一次打線 作業。 — 然而以習知打線機台之固定治具1進行打線之缺點如 下。當該窗型壓板13向上提升時，該承載板21因和該窗型 壓板Π間之表面張力而向上翹曲（如圖4所示），而不利後續 製程。習知解決方法係增加該窗型壓板13向下壓合之壓 力，藉此使已翹曲之承載板21被壓平。然而該習知解決方 法產生另一缺點，由於該等侧壓條1331會壓到該等軌道以 與該熱板11間之部分該承載板21，因此當該窗型壓板13增 加向下壓合之壓力時，該等侧壓條1331會將部分該承載板 21壓入該等軌道12與該熱板丨丨間之間隙，而在該承载板幻 上產生壓痕，且使該承載板21產生翹曲（如圖5所示）。如 此，在接續之灌模（Molding)製程中，液態之封膠材料會經 由該壓痕而溢出’導致封裝失敗。 因此，有必要提供一種創新且具進步性的打線機台之固 定治具及其窗型壓板，以解決上述問題。 【發明内容】 本發月長:供種打線機台之固定治具，用以固定一承載 板以利打線製程，該承載板包括一上表面及一下表面複 數個晶片係黏附於該承載板，該固定治具包括__熱板及一 窗型壓板。該熱板包括_吸附面，用以支律該承載板之下 130742.doc 201013833 * 表面且提供熱能至該承載板。該窗型壓板用以壓合該承載 ~ 板之上表面，包括一壓板本體、至少一窗孔及至少一緩衝 裝置。該窗孔貫穿該壓板本體，用以顯露該承載板之部分 上表面。該緩衝裝置位於該窗孔之外，其包括一頂抵端， 田該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵 該承載板之上表面，當該窗型壓板向上提升時，該頂抵端 向下推開該承載板，以防止該承載板被連同該窗型壓板一 起向上提升。藉此，不需如習知技術增加向下壓合之壓 9 力，如此可避免承載板翹曲之情況，進而提升良率。 在一較佳實施例中，該緩衝裝置包括一彈性體及一頂抵 鬼該彈&體包括-固定端及一自由端，該固定端係固設 於該壓板本體，該頂抵塊之一端連接該彈性體之自由端， 另一端係為該頂抵端。 在一較佳實施例中，該緩衝裝置係為一彈性片體，該彈 性片體之一端係為一固定端，固設於該壓板本體，另一端 • 係為該頂抵端，該彈性片體與該壓板本體具有一角度。 在一較佳實施例中，該緩衝裝置係為一彈性緩衝層，其 具有一上表面及一下表面，該上表面係為一固定端，附著 於該麼板本體’該下表面係為該頂抵端。 在一較佳實施例中，該緩衝裝置係為一活動塊體，該活 動塊體包括-支挣部及一頂抵部，該支撑部係位於該容置 空間内，該支撐部之面積係大於該頂抵開口之面積，以防 t該支撑部掉出該容置空間，該頂抵部之下端係為該頂抵 端，該頂抵部之面積係小於該頂抵開口之面積，使得該頂 130742.doc 201013833 抵部可以於該頂抵開口内移動。 【實施方式】 參考圖6’顯示本發明打線機台之固定治具3A之第一實 施例之分解示意圖。該固定治具3A係用以固定一承載板23 以利打線製程，該承載板23包括一上表面23 1及一下表面 232 ’複數個晶片24係黏附於該承載板23。在本實施例 中’該承載板23係可為一基板條（substrate Strip)或一導線 架（Leadframe)，該等晶片24係黏附於該承載板23之上表面 231。該固定治具3A包括一熱板4及一窗型壓板5。在本實 施例中’該固定治具3 A更包括二條軌道6，該等軌道6係位 於該熱板4之二側，以支撐該承載板23之二侧。該熱板4包 括一吸附面41’用以支撐該承載板23之下表面232且提供 熱能至該承載板23。在其他應用中，該熱板4更包括複數 個吸氣孔’該等吸氣孔連通至該吸附面41。 該窗型壓板5係用以壓合該承載板23之上表面231，其包 括一壓板本體51、至少一窗孔52及至少一緩衝裝置57。在 本實施例中’該窗型壓板5更包括複數條壓條53，該等壓 條53包括複數條侧壓條531(如圖7及圖8所示），該等側壓條 531係位於該窗型壓板5之背面兩側。部分該等壓條53係位 於該窗孔52内，且互相交錯而定義出複數個開口 54，每一 該等開口 54係對應每一該等晶片24(如圖9所示）。該窗孔52 貫穿該壓板本體51，用以顯露該承載板23之部分上表面 23 1。在本實施例中’該窗孔52係顯露該等晶片24。 該緩衝裝置57位於該窗孔52之外，該緩衝裝置57包括一 130742.doc 201013833 頂抵端561(如圖10所示當該窗型壓板5壓合該承載板23 之上表面231時，該頂抵端561係頂抵該承載板23之上表面 231，當該窗型壓板5向上提升時，該頂抵端561向下推開 該承載板23’以防止該承載板23被連同該窗型壓板$一起 向上提升。201013833 VI. Description of the Invention: [Technical Field] The present invention relates to a fixed jig and a press plate thereof, and more particularly to a fixing jig for a wire splicing machine and a window type press plate thereof. [Prior Art] Referring to Fig. 1, an exploded schematic view of a fixing jig 1 of a conventional wire splicing machine is shown. The fixing jig 1 is used for fixing a carrier plate 21 for the wire bonding process. The carrier plate 21 includes an upper surface 211 and a lower surface 212, and a plurality of wafers 22 are adhered to the carrier plate 21. The fixture 1 includes a hot plate, two rails 12, and a window platen 13. The hot plate 11 includes an adsorption surface in for tying the lower surface 212 of the carrier plate 21 and providing thermal energy to the carrier plate 21. The rails 12 are located on two sides of the hot plate 11 to support the two sides of the carrier plate 21. The window platen 13 is for pressing the upper surface 211' of the carrier plate 21, and includes a platen body 131, at least one window hole 132 and a plurality of strips 133. The window 132 extends through the platen body 131 to expose a portion of the upper surface 211 of the carrier plate 21. A portion of the bead 133 is located within the aperture 132 and interdigitated to define a plurality of openings 134. The bead 133 further includes a plurality of side bead 133, and the side bead 133 is located on both sides of the back of the window platen 13 (as shown in Fig. 2). Referring to Fig. 3, there is shown a plan view of the application of the fixed jig of the conventional wire tying machine. In one of the wiring processes of the semiconductor process, first, the carrier 21 is placed on the track 12 and the adsorption surface 1 of the hot plate 11 supports the lower surface 212 of the carrier 21 and provides thermal energy to the Carrier plate 21. Next, the window platen 13 is pressed down to the carrier plate 21, wherein each of the openings 130742.doc 201013833 134 corresponds to each of the wafers 22' and is then wired. After the wire is completed, the window platen 13 is lifted upward to facilitate the carrier plate 21 to advance in the transport direction to advance the untwisted wafer 22 to a predetermined position. Thereafter, the window platen 13 presses the carrier plate 21 downward again for the next wire bonding operation. — However, the shortcomings of the fixed jig 1 of the conventional wire-punching machine are as follows. When the window platen 13 is lifted upward, the carrier plate 21 is warped upward due to the surface tension between the window platen (as shown in Fig. 4), which is disadvantageous for subsequent processes. The conventional solution is to increase the pressure at which the window-type pressure plate 13 is pressed downward, whereby the warped carrier plate 21 is flattened. However, this conventional solution produces another disadvantage in that the window press plate 13 is pressed downwardly as the side press bars 1331 press against the portion of the carrier plate 21 between the rails 13 and the hot plate 11. When the pressure is applied, the side pressing strips 1331 press a portion of the carrying plate 21 into the gap between the rails 12 and the hot plate, and an indentation is generated on the carrying plate, and the carrying plate 21 is warped. Song (as shown in Figure 5). Thus, in the subsequent molding process, the liquid sealant material will overflow through the indentation, resulting in a package failure. Therefore, it is necessary to provide an innovative and progressive fixing fixture for a wire-bonding machine and a window-type pressure plate thereof to solve the above problems. [Summary of the Invention] The length of the hair piece is: a fixing jig for the seeding machine, which is used for fixing a carrier plate to facilitate the wire bonding process, and the carrier plate includes an upper surface and a lower surface, and a plurality of wafers are adhered to the carrier plate. The fixture has a __hot plate and a window type platen. The hot plate includes an _adsorption surface for supporting the surface of the carrier plate and providing thermal energy to the carrier plate. The window type pressing plate is used for pressing the upper surface of the bearing plate, and comprises a pressing plate body, at least one window hole and at least one buffering device. The window hole extends through the platen body to expose a portion of the upper surface of the carrier plate. The buffer device is located outside the window hole and includes a top end end. When the window type pressing plate presses the upper surface of the carrying plate, the top abutting end abuts against the upper surface of the carrying plate, when the window type When the pressure plate is lifted upward, the top abutting end pushes the carrier plate downward to prevent the carrier plate from being lifted up together with the window type pressure plate. Therefore, it is not necessary to increase the pressing force of the downward pressing as in the prior art, so that the warpage of the carrier plate can be avoided, thereby improving the yield. In a preferred embodiment, the cushioning device includes an elastic body and a top-to-the-go body. The body includes a fixed end and a free end. The fixed end is fixed to the pressure plate body, and the top is abutting the block. One end is connected to the free end of the elastomer, and the other end is the abutting end. In a preferred embodiment, the cushioning device is an elastic piece, and one end of the elastic piece is a fixed end fixed to the plate body, and the other end is the abutting end, the elastic piece The body has an angle with the platen body. In a preferred embodiment, the buffering device is an elastic buffer layer having an upper surface and a lower surface, the upper surface being a fixed end attached to the bottom plate body. The lower surface is the top surface. Arrival. In a preferred embodiment, the buffer device is a movable block, and the movable block includes a support portion and a top portion. The support portion is located in the accommodating space, and the area of the support portion is The area of the top abutting opening is smaller than the area of the top abutting opening, so that the lower end of the top abutting portion is the abutting end, and the area of the top abutting portion is smaller than the area of the top abutting opening, so that The top 130742.doc 201013833 abutment can move within the top abutment opening. [Embodiment] An exploded view of a first embodiment of a fixing jig 3A of a wire bonding machine of the present invention is shown with reference to Fig. 6'. The fixing fixture 3A is for fixing a carrier plate 23 for the wire bonding process. The carrier plate 23 includes an upper surface 23 1 and a lower surface 232 ′. A plurality of wafers 24 are adhered to the carrier plate 23 . In the present embodiment, the carrier plate 23 can be a substrate strip or a lead frame, and the wafers 24 are adhered to the upper surface 231 of the carrier plate 23. The fixing jig 3A includes a hot plate 4 and a window type pressing plate 5. In the present embodiment, the fixing jig 3A further includes two rails 6 which are located on two sides of the hot plate 4 to support the two sides of the carrier plate 23. The hot plate 4 includes an adsorption surface 41' for supporting the lower surface 232 of the carrier plate 23 and providing thermal energy to the carrier plate 23. In other applications, the hot plate 4 further includes a plurality of suction holes, and the suction holes communicate with the adsorption surface 41. The window platen 5 is for pressing the upper surface 231 of the carrier plate 23, and includes a platen body 51, at least one window hole 52 and at least one buffering device 57. In the present embodiment, the window type pressing plate 5 further includes a plurality of pressing strips 53 including a plurality of side pressing strips 531 (shown in FIGS. 7 and 8), and the side pressing strips 531 are located on the window type pressing plate. 5 on the back sides. A portion of the beading strips 53 are positioned within the apertures 52 and interdigitated to define a plurality of openings 54, each of which corresponds to each of the wafers 24 (shown in Figure 9). The window hole 52 extends through the platen body 51 to expose a portion of the upper surface 23 1 of the carrier plate 23. In the present embodiment, the window 52 exposes the wafers 24. The buffer device 57 is located outside the window 52. The buffer device 57 includes a 130742.doc 201013833 abutting end 561 (as shown in FIG. 10 when the window platen 5 is pressed against the upper surface 231 of the carrier plate 23, The top abutting end 561 is abutted against the upper surface 231 of the carrier plate 23. When the window platen 5 is lifted upward, the abutting end 561 pushes down the carrier plate 23' to prevent the carrier plate 23 from being The window type platen is lifted up together.

參考圖10及圖11，顯示本發明打線機台之固定治具3八之 作動示意圖，其中圖1〇係沿著圖9之線1〇1〇之剖面示意 圖。圖10顯示該窗型壓板5向下壓合之示意圖。圖n顯示 該窗型壓板5向上提升之示意圖。配合參考圖9,在本實施 例中，該緩衝裝置57位於該等側壓條531上，且該緩衝裝 置57包括一彈性體55及一頂抵塊56，該彈性體55係為一彈 簧，包括一固定端551及一自由端552，該固定端551係固 設於該壓板本體51，該頂抵塊56係為一球體，其一端連接 該彈性體55之自由端552，$ -端係為該頂抵端561。此 外，該壓板本體51更包括至少一凹槽511，該彈性體”之 該固定端551係固定於該凹槽511内，且該頂抵塊％係於該 凹槽511内移動。本實施例之作動方式如下。 參考圖10,當該窗型壓板5壓合該承載板23之上表面231 時，該頂抵塊56之頂抵端561係頂抵該承載板23之上表面 231，該彈性體55係為壓縮狀態。接著參考圖u，當該窗 型壓板5向上提升時，該頂抵端561受該彈性體邱力而向 下推開該承載板23’以防止該承載板23被連同該窗型壓板 5—起向上提升。 參考圖12,顯示本發明打線機台之固定治具把之第二實 130742.doc 201013833 施例之示意圖，其中該窗型壓板7係壓合該承載板23。參 考圖13’顯示本發明打線機台之固定治具3B之第二實施例 之窗型壓板7向上提升之示意圖。本實施例之固定治具把 與該第一實施例之固定治具3A(圖6)大致相同，其中相同 之元件賦予相同之編號。本實施例與該第一實施例之不同 處在於該壓板本體71及該緩衝裝置77之結構不同。在本實 施例中’該壓板本體71不具有任何凹槽，該緩衝裝置π係 為一彈性緩衝層75,其材質係為橡膠，且具有一上表面及 一下表面，該上表面係為一固定端751，附著於該壓板本 體71。該下表面係為一頂抵端752。參考圖12,當該窗型 壓板7壓合該承載板23之上表面231時，該頂抵端752係頂 抵該承載板23之上表面231，該彈性緩衝層75係為壓縮狀 態。參考圖13，當該窗型壓板7向上提升時，該頂抵端752 受該彈性緩衝層75之回復力而向下推開該承載板幻，以防 止該承載板23被連同該窗型壓板7 一起向上提升。 參考圖14，顯示本發明打線機台之固定治具3(：之第三實 施例之示意圖，其中該窗型壓板8係壓合該承載板以。參 考圖15，顯示本發明打線機台之固定治具3C之第三實施例 之窗型壓板8向上提升之示意圖。本實施例之固定治具冗 與該第一實施例之固定治具3A(圖6)大致相同，其中相同 之元件賦予相同之編號。本實施例與該第一實施例之不同 處在於該壓板本體81及該緩衝裝置87之結構不同。在本實 施例中，該壓板本體81不具有任何凹槽，該緩衝裝置”係 為一彈性片體85 ’該彈性片體85之一端係為一固定端 130742.doc -9- 201013833 851 ’固設於該虔板本體81，^一端係為一頂抵端852。參 考圖14，當該窗型壓板8壓合該承載板乃之上表面時， 該頂抵端852係頂抵該承載板23之上表面231，且該彈性片 體85產生形變。參考圖15，當該窗型壓板8向上提升時， 該頂抵端852受該彈性片體85之回復力而向下推開該承載 板23,以防止該承載板23被連同該窗型壓板8 一起向上提 升。此時，該彈性片體85與該壓板本體81具有一角度。 參考圖I6，顯示本發明打線機台之固定治具31)之第四實 施例之示意圖，其中該窗型壓板9係壓合該承载板”。參 考圖17，顯示本發明打線機台之固定治 之窗型壓板9向上提升之示意圖。本實施例之 與該第一實施例之固定治具3A(圖6)大致相同，其中相同 之元件賦予相同之編號。本實施例與該第一實施例之不同 處在於該壓板本體91及該緩衝裝置97之結構不同。在本實 施例中，該壓板本體91更包括至少一容置空間911，該容 置空間911包括一頂抵開口 912。該緩衝裝置97係為一活動 塊體95，該活動塊體95包括一支撐部951及一頂抵部952。 該支撐部951係位於該容置空間911内，該支撐部951之面 積係大於該頂抵開口 912之面積，以防止該支揮部951掉出 該容置空間911。該頂抵部952之下端係為一頂抵端953， 該頂抵部952之面積係小於該頂抵開口 912之面積，使得該 頂抵部952可以於該頂抵開口 912内移動。參考圖16，當該 窗型壓板9壓合該承載板23之上表面231時，該頂抵部952 之該頂抵端953係頂抵該承載板23之上表面23 i。參考圖 130742.doc •10- 201013833 17，當該窗型壓板9向上提升時，由於該活動塊體％之重 力作用，使得該頂抵部952之該頂抵端953向下推開該承载 板23，以防止該承載板23被連同該窗型壓板9—起向上提 升。 藉此，在本發明中，該窗型壓板5,7,8,9之緩衝裝置 57,77,87,97係提供-下推力以推開該承載板23，以防止該 承載板23連同該窗型壓板5,7,8,9一起向上提升。因而不需 如習知技術增加向下壓合之壓力，如此可避免承載板幻翹 曲之情況，進而提升良率。 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此，習於此技術之人士對上述實施例進 行修改及變化仍不脫本發明之精神。本發明之權利範圍應 如後述之申請專利範圍所列。 【圖式簡單說明】 圖1顯不習知打線機台之固定治具之分解示意圖； 圖2顯示習知窗型壓板之背面之透視示意圖； 圖3顯示習知打線機台之固定治具之應用俯視示意圖； 圖4顯示沿著圖3之線4-4之剖面示意圖； 圖5顯示習知窗型壓板壓合承載板之剖面示意圖； 圖6顯示本發明打線機台之固定治具之第一實施例之分 解示意圖； 圖7顯不本發明窗型壓板之第一實施例之背面之透視示 tlSI · 圍， 圖8顯示圖7之局部放大圖； 130742.doc 201013833 圖9顯示本發明打線機台之固定治具之第一實施例之應 用俯視示意圖； 圖10顯示沿著圖9之線10-10之剖面示意圖； 圖11顯示本發明打線機台之固定治具之第一實施例之窗 型壓板向上提升之剖面示意圖； 圖12顯示本發明打線機台之固定治具之第二實施例之窗 型壓板壓合承載板之示意圖； 圖13顯示本發明打線機台之固定治具之第二實施例之窗 型壓板向上提升之示意圖； 圖14顯示本發明打線機台之固定治具之第三實施例之窗 型壓板壓合承載板之示意圖； 圖15顯示本發明打線機台之固定治具之第三實施例之窗 型壓板向上提升之示意圖； 圖16顯示本發明打線機台之固定治具之第四實施例之窗 型壓板壓合承載板之示意圖；及 圖1 7顯示本發明打線機台之固定治具之第四實施例之窗 型壓板向上提升之示意圖。 【主要元件符號說明】 1 習知打線機台之固定治具 3 A 本發明打線機台之固定治具之第一實施例 3B 本發明打線機台之固定治具之第二實施例 3C 本發明打線機台之固定治具之第三實施例 3D 本發明打線機台之固定治具之第四實施例 4 熱板 130742.doc -12· 201013833 5 本發明窗型壓板之第一實施例 6 軌道 7 本發明窗型壓板之第二實施例 8 本發明窗型壓板之第三實施例 9 本發明窗型壓板之第四實施例 11 熱板 12 軌道 13 窗型壓板 21 承載板 22 晶片 23 承載板 24 晶片 41 吸附面 51 壓板本體 52 窗孔 53 壓條 54 開口 55 彈性體 56 頂抵塊 57 緩衝裝置 71 壓板本體 75 彈性緩衝層 77 緩衝裝置 81 壓板本體 130742.doc • 13- 201013833Referring to Fig. 10 and Fig. 11, there is shown a schematic diagram of the operation of the fixing jig 3 of the wire bonding machine of the present invention, wherein Fig. 1 is a schematic cross-sectional view taken along line 1 of Fig. 9. Fig. 10 is a view showing the window type press plate 5 pressed downward. Figure n shows a schematic view of the window type platen 5 being lifted upward. With reference to FIG. 9, in the present embodiment, the buffering device 57 is located on the side bead 531, and the cushioning device 57 includes an elastic body 55 and a top abutting block 56. The elastic body 55 is a spring, including A fixed end 551 and a free end 552 are fixed to the pressure plate body 51. The top abutting block 56 is a ball, and one end of the elastic body 55 is connected to the free end 552 of the elastic body 55. The $-end is The top end 561. In addition, the platen body 51 further includes at least one groove 511. The fixed end 551 of the elastic body is fixed in the groove 511, and the top abutting block is moved in the groove 511. This embodiment The driving manner is as follows: Referring to FIG. 10, when the window pressing plate 5 presses the upper surface 231 of the supporting plate 23, the top abutting end 561 of the top abutting block 56 abuts against the upper surface 231 of the carrying plate 23, The elastic body 55 is in a compressed state. Referring to FIG. u, when the window type pressing plate 5 is lifted upward, the top abutting end 561 is pushed downward by the elastic body force to push the carrying plate 23' to prevent the carrying plate 23 from being pulled down. It is lifted up together with the window type pressing plate 5. Referring to Fig. 12, there is shown a schematic diagram of a second embodiment of the fixing jig of the wire bonding machine of the present invention, wherein the window type pressing plate 7 is pressed. Carrying plate 23. Referring to Fig. 13', a schematic view of the window type pressing plate 7 of the second embodiment of the fixing jig 3B of the wire bonding machine of the present invention is lifted upward. The fixing jig of the embodiment is fixed to the first embodiment. The jig 3A (Fig. 6) is substantially the same, in which the same elements are given the same reference numerals. The difference between this embodiment and the first embodiment is that the structure of the pressure plate body 71 and the buffer device 77 are different. In the embodiment, the pressure plate body 71 does not have any groove, and the buffer device π is elastic. The buffer layer 75 is made of rubber and has an upper surface and a lower surface. The upper surface is a fixed end 751 attached to the platen body 71. The lower surface is a top abutting end 752. Referring to FIG. When the window platen 7 presses the upper surface 231 of the carrier plate 23, the abutting end 752 abuts against the upper surface 231 of the carrier plate 23, and the elastic buffer layer 75 is in a compressed state. Referring to FIG. When the window platen 7 is lifted upward, the abutting end 752 is pushed downward by the restoring force of the elastic buffer layer 75 to prevent the carrier plate 23 from being lifted up together with the window platen 7. Referring to FIG. 14, there is shown a schematic view of a third embodiment of the fixing jig 3 of the wire bonding machine of the present invention, wherein the window type pressing plate 8 is pressed against the carrier plate. Referring to FIG. 15, the wire bonding machine of the present invention is shown. Window type pressure plate 8 of the third embodiment of the fixing jig 3C The fixed fixture of the present embodiment is substantially the same as the fixed fixture 3A (FIG. 6) of the first embodiment, wherein the same components are given the same number. This embodiment and the first embodiment The difference is that the structure of the pressure plate body 81 and the buffer device 87 is different. In the embodiment, the pressure plate body 81 does not have any grooves, and the buffer device is an elastic piece 85' One end is a fixed end 130742.doc -9- 201013833 851 ' is fixed on the slab body 81, and one end is a top abutting end 852. Referring to Figure 14, when the window type pressing plate 8 presses the carrying board On the upper surface, the top abutting end 852 is abutted against the upper surface 231 of the carrier plate 23, and the elastic piece 85 is deformed. Referring to FIG. 15, when the window platen 8 is lifted upward, the abutting end 852 is pushed downward by the restoring force of the elastic piece 85 to prevent the carrier plate 23 from being attached to the window platen. 8 Lift up together. At this time, the elastic sheet body 85 has an angle with the platen body 81. Referring to Figure I6, there is shown a schematic view of a fourth embodiment of the fixing jig 31) of the wire bonding machine of the present invention, wherein the window pressing plate 9 is pressed against the carrier plate. Referring to Figure 17, the fixing of the wire bonding machine of the present invention is shown. A schematic view of the window-shaped platen 9 being lifted upwards. The present embodiment is substantially the same as the fixed fixture 3A (FIG. 6) of the first embodiment, wherein the same components are given the same reference numerals. This embodiment and the first embodiment The difference between the structure of the pressure plate body 91 and the buffer device 97 is that the pressure plate body 91 further includes at least one accommodating space 911, and the accommodating space 911 includes a top opening 912. The device 97 is a movable block 95. The movable block 95 includes a supporting portion 951 and a top abutting portion 952. The supporting portion 951 is located in the accommodating space 911, and the area of the supporting portion 951 is larger than the top portion. The area of the opening 912 is prevented from falling out of the accommodating space 911. The lower end of the abutting portion 952 is a top abutting end 953, and the area of the top abutting portion 952 is smaller than the top abutting opening 912. The area of the top abutment portion 952 can Moving in the top abutment opening 912. Referring to FIG. 16, when the window type pressing plate 9 presses the upper surface 231 of the carrying plate 23, the top abutting end 953 of the abutting portion 952 is abutted against the carrying plate 23 The upper surface 23 i. Referring to the figure 130742.doc •10- 201013833 17, when the window type pressing plate 9 is lifted upward, the top abutting end 953 of the abutting portion 952 is downward due to the gravity of the movable block body % The carrier plate 23 is pushed open to prevent the carrier plate 23 from being lifted up together with the window platen 9. Thereby, in the present invention, the window type pressure plate 5, 7, 8, 9 buffer means 57, 77 , 87, 97 provides a lower thrust to push the carrier plate 23 to prevent the carrier plate 23 from being lifted up together with the window platens 5, 7, 8, and 9. Therefore, there is no need to increase the downward pressure as in the prior art. The pressure is combined to avoid the illusion of the bearing plate, thereby improving the yield. However, the above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Modifications and variations of the embodiments described above will not depart from the spirit of the invention. The scope of the invention should be as The scope of the patent application is as follows. [Simplified illustration of the drawing] Fig. 1 is a schematic exploded view of the fixing fixture of the wire bonding machine; Fig. 2 is a schematic perspective view of the back of the conventional window type pressing plate; Figure 4 shows a cross-sectional view along line 4-4 of Figure 3; Figure 5 shows a schematic cross-sectional view of a conventional window-type press-fit carrier plate; Figure 6 shows the wire bonding machine of the present invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 7 is a perspective view showing the back side of the first embodiment of the window type pressure plate of the present invention, and FIG. 8 is a partial enlarged view of FIG. 7; 130742.doc 201013833 Figure 9 is a top plan view showing the application of the first embodiment of the fixing jig of the wire bonding machine of the present invention; Figure 10 is a cross-sectional view taken along line 10-10 of Figure 9; Figure 11 is a view showing the fixing treatment of the wire bonding machine of the present invention; FIG. 12 is a schematic cross-sectional view showing the window type press plate of the second embodiment of the present invention; FIG. 12 is a schematic view showing the window type press plate of the second embodiment of the present invention; FIG. 14 is a schematic view showing a window type press plate pressing support plate of a third embodiment of the fixing jig of the wire bonding machine of the present invention; FIG. FIG. 16 is a schematic view showing the window type press plate of the fourth embodiment of the fixing jig of the wire bonding machine of the present invention; FIG. And FIG. 17 shows a schematic view of the window type pressure plate of the fourth embodiment of the fixing jig of the wire bonding machine of the present invention. [Description of main component symbols] 1 A fixed fixture for a conventional wire bonding machine 3 A A first embodiment of a fixing jig of the wire bonding machine of the present invention 3B A second embodiment of the fixing jig of the wire bonding machine of the present invention 3C Third Embodiment 3D Fixing Fixture of Wire-Making Machine 4D Embodiment 4 of Fixing Fixture of Wire Threading Machine of the Present Invention 4 Hot Plate 130742.doc -12· 201013833 5 First Embodiment 6 of Window Type Press Plate of the Invention 7th Embodiment 8 of the window type press plate of the present invention The third embodiment of the window type press plate of the present invention The fourth embodiment of the window type press plate of the present invention 11 The hot plate 12 The track 13 The window type press plate 21 The carrier plate 22 The wafer 23 The carrier plate 24 Wafer 41 Adsorption surface 51 Platen body 52 Window aperture 53 Bead 54 Opening 55 Elastomer 56 Abutment block 57 Buffer device 71 Platen body 75 Elastic buffer layer 77 Buffer device 81 Platen body 130742.doc • 13- 201013833

85 彈性片體 87 緩衝裝置 91 壓板本體 95 活動塊體 97 緩衝裝置 111 吸附面 131 壓板本體 132 窗孔 133 壓條 134 開口 211 上表面 212 下表面 231 上_表面 232 下表面 511 凹槽 531 側壓條 551 固定端 552 自由端 561 頂抵端 751 固定端 752 頂抵端 851 固定端 852 頂抵端 911 容置空間 130742.doc -14 201013833 912 頂抵開口 951 支撐部 952 頂抵部 953 頂抵端 1331 侧壓條 130742.doc -15-85 Elastic sheet 87 Buffer device 91 Platen body 95 Moving block 97 Buffer device 111 Adsorption surface 131 Platen body 132 Window hole 133 Binder 134 Opening 211 Upper surface 212 Lower surface 231 Upper surface 232 Lower surface 511 Groove 531 Side bead 551 Fixed end 552 free end 561 top end 751 fixed end 752 top abutting end 851 fixed end 852 abutting end 911 accommodating space 130742.doc -14 201013833 912 abutting opening 951 support portion 952 abutting portion 953 abutting end 1331 side Beads 130742.doc -15-

Claims (1)

201013833 七、申請專利範圍： 1- 一種打線機台之固定治具’用以固定一承載板以利打線 製程’該承載板包括一上表面及一下表面，複數個晶片 係黏附於該承載板，該固定治具包括： 一熱板，包括一吸附面，用以支撐該承載板之下表面 且提供熱能至該承載板；及 一窗型壓板，用以壓合該承載板之上表面，包括： 一壓板本體； ❿ 至少一窗孔，貫穿該壓板本體，用以顯露該承載板 之部分上表面；及 至少一緩衝裝置’位於該窗孔之外，該緩衝裝置包 括一頂抵端，當該窗型壓板壓合該承載板之上表面 時’該頂抵端係頂抵該承載板之上表面，當該窗型壓 板向上提升時，該頂抵端向下推開該承載板，以防止 該承載板被連同該窗型壓板一起向上提升。 2·如請求項1之治具’其中該承載板係為一基板條 (Substrate Strip)。 3. 如明求項1之治具，其中該承載板係為一導線架 (Leadframe) 〇 4. 如請求項1之治具，其中該窗型壓板更包括複數條壓 條，部分該等壓條係位於該窗孔内，且互相交錯而定義 出複數個開口，每一該等開口係對應每一該等晶片。 5. 如請求項丨之治具，其中該等晶片係黏附於該承載板之 上表面，該窗型壓板之該窗孔係顯露該等晶片。 130742.doc 201013833 "月求項1之✓〇具，其中該熱板更包括複數個吸氣孔， • 該等吸氣孔連通至該吸附面。 7·如凊求項1之治具，其中該緩衝裝置包括一彈性體及一 頂抵塊，該彈性體包括一固定端及一自由端，該固定端 係固設於該壓板本體，該頂抵塊之一端連接該彈性體之 自由端，另一端係為該頂抵端，當該窗型壓板麼合該承 载板之上表面時，該頂抵塊之頂抵端係頂抵該承載板之 ^ 上表面，該彈性體係為壓縮狀態，當該窗型壓板向上提 升時，該頂抵端受該彈性體之彈力而向下推開該承載 板，以防止該承載板被連同該窗型壓板一起向上提升。 8·如請求項7之治具，其中該壓板本體更包括至少一凹 1彈1±體之該固疋端係固定於該凹槽内且該頂抵 塊係於該凹槽内移動。 9.如凊求項7之治具，其中該彈性體係為一彈簧，該頂抵 塊係為一球體。 • 1〇·如叫求項1之治具，其中該緩衝裝置係為一彈性片體， 〇彈吐片體之一端係為-固定端，固設於該壓板本體， 另一端係為該頂抵端，該彈性片體與該壓板本體具有一 =度，當該窗型壓板壓合該承載板之上表面時，該頂抵 =係頂抵該承載板之上表面，且該彈性片體產生形變， 田〇固型壓板向上提升時，該頂抵端受該彈性片體之回 復力而向下推開該承載板’以防止該承載板被連同該窗 型壓板一起向上提升。 Η.如叫求項丨之治具，其中該緩衝裝置係為一彈性緩衝 130742.doc 201013833 層，其具有一上表面及一下表面，該上表面係為—固定 端，附著於該壓板本體，該下表面係為該頂抵端，當該 函型壓板壓合該承載板之上表面時，該頂抵端係頂抵該 承載板之上表面，該彈性緩衝層係為壓縮狀態，當該窗 型壓板向上提升時，該頂抵端受該彈性緩衝層之回復力 而向下推開該承載板，以防止該承載板被連同該窗型壓 板一起向上提升。 I2·如请求項11之治具，其中該彈性緩衝層之材質係為橡 膠。 13.如請求項1之治具，其中該壓板本體更包括至少一容置 空間，該容置空間包括一頂抵開口，該緩衝裝置係為一 活動塊體，該活動塊體包括一支撐部及一頂抵部，該支 撐部係位於該容置空間内，該支撐部之面積係大於該頂 抵開口之面積，以防止該支撐部掉出該容置空間，該頂 抵部之下端係為該頂抵端，該頂抵部之面積係小於該頂 抵開口之面積’使得該頂抵部可以於該頂抵開口内移 動’當該窗型壓板壓合該承載板之上表面時，該頂抵部 之該頂抵端係頂抵該承載板之上表面，當該窗型壓板向 上提升時，由於該活動塊體之重力作用，使得該頂抵部 之該項抵端向下推開該承載板，以防止該承載板被連同 該窗型壓板一起向上提升。 14. 一種窗型壓板，用以壓合一承載板之上表面，複數個晶 片係黏附於該承載板，包括： —壓板本體； 130742.doc 201013833 至少一窗孔，貫穿該壓板本體，用以顯露該承載板之 部分上表面；及 至少一緩衝裝置，位於該窗孔之外，該緩衝裝置包括 一頂抵端，當該窗型壓板壓合該承載板之上表面時，該 頂抵端係頂抵該承載板之上表面，當該窗型壓板向上提 升時，該頂抵端向下推開該承載板，以防止該承載板被 連同該窗型壓板一起向上提升。 15·如請求項14之窗型壓板，其中該承載板係為一基板條 (Substrate Strip) 〇 16·如請求項14之窗型壓板，其中該承載板係為一導線架 (Leadframe) 〇 17·如請求項14之窗型壓板，更包括複數條壓條，部分該等 壓條係位於該窗孔内，且互相交錯而定義出複數個開 口，每一該等開口係對應每一該等晶片。 18.如請求項14之窗型壓板，其中該等晶片係黏附於該承載 板之上表面，該窗型壓板之該窗孔係顯露該等晶片。 19_如請求項14之窗型壓板，其中該緩衝裝置包括一彈性體 及一了貝抵塊，該彈性體包括一固定端及一自由端，該固 疋端係固設於該壓板本體，該頂抵塊之一端連接該彈性 體之自由端，另一端係為該頂抵端，當該窗型壓板壓合 、承載板之上表面時’該頂抵塊之頂抵端係頂抵該承載 板之上表面，該彈性體係為壓縮狀態，當該窗型壓板向 上提升時’該頂抵端受該彈性體之彈力而向下推開該承 載板’以防止該承載板被連同該窗型壓板一起向上提 130742.doc 201013833 升。 2〇如明求項丨9之窗型壓板其中該壓板本體更包括至少一 凹槽，該彈性體之該固定端係固定於該凹槽内，且該頂 抵塊係於該凹槽内移動。 21·如請求項19之窗型壓板，其中該彈性體係為一彈簧，該 頂抵塊係為一球體。 22.如請求項14之窗型壓板，其中該緩衝裝置係為一彈性片 體該彈性月體之一端係為一固定端，固設於該壓板本 體另一端係為該頂抵端，該彈性片體與該壓板本體具 有一角度，當該窗型壓板壓合該承載板之上表面時，該 頂抵端係頂抵該承載板之上表面，且該彈性片體產生形 變田"亥肉型壓板向上提升時，該頂抵端受該彈性片體 之回復力而向下推開該承載板，以防止該承載板被連同 該窗型壓板一起向上提升。 23_如請求項14之窗型壓板，其中該緩衝裝置係為一彈性緩 衝層其具有一上表面及一下表面，該上表面係為一固 疋端，附著於該壓板本體，該下表面係為該頂抵端，當 該®!壓板壓合該承載板之上表面時，肖頂抵端係頂抵 »亥承載板之上表面，該彈性緩衝層係為壓縮狀態，當該 窗型壓板向上提升時，該頂抵端受該彈性緩衝層之回復 力而向下㈣該承載板，以防止該承載板被制該窗型 壓板一起向上提升。 24.如明求項23之窗型壓板，其中該彈性緩衝層之材質係為 橡膠。 130742.doc 201013833 25. 如請求項14之窗型壓板，其中該壓板本體更包括至少一 容置空間，該容置空間包括一頂抵開口，該緩衝裝置係 為一活動塊體，該活動塊體包括一支撐部及一頂抵部， 該支撐部係位於該容置空間内，該支撐部之面積係大於 該頂抵開口之面積，以防止該支撐部掉出該容置空間， 該頂抵部之下端係為該頂抵端，該頂抵部之面積係小於 該頂抵開口之面積，使得該頂抵部可以於該頂抵開口内 移動，當該窗型壓板壓合該承載板之上表面時，該頂抵 P之該頂抵^係頂抵該承載板之上表面，當該窗型壓板 向上提升時，由於該活動塊體之重力作用，使得該頂抵 部之該頂抵端向下推開該承載板，以防止該承載板被連 同該窗型壓板一起向上提升。 26. —種窗型壓板，用以壓合一承載板之上表面，複數個晶 片係黏附於該承載板，包括： 一壓板本體，包括至少一容置空間，該容置空間包括 一頂抵開口； 至少一窗孔，貫穿該壓板本體，用以顯露該承載板之 部分上表面；及 至少一緩衝裝置，位於該窗孔之外，該緩衝裝置係為 一活動塊體，該活動塊體包括一支撐部及一頂抵部該 支樓部係位於該容置空間内’肖頂抵部之下端係為該頂 抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵 部之該頂抵端係頂抵該承載板之上表面，當該窗型壓板 向上提升時，由於該活動塊體之重力作用，使得該頂抵 130742.doc 201013833 部之該頂抵端向下推開該承載板， n ^ ^ ^ ^ 以防止該承載板被連 同該固型麼板一起向上提升。 27. 如請求項26之窗型壓板，其中 承載板係為一基板條 (Substrate Strip) 〇 28. 如請求項26之窗型壓板，装φ兮 板其中4承載板係為-導線架 (headframe) 〇 29·如請求項26之窗型壓板，更包衽 又0括複數條壓條，部分該等 麼條係位於該窗孔内，且互相 立相父錯而定義出複數個開 口，每一該等開口係對應每一該等晶片。 30.如請求項26之窗型壓板’其中該等晶片係黏附於該承載 板之上表面，該窗型壓板之該窗孔係顯露該等晶片。 3工·如請求項26之窗型壓板，其中該支撐部之面積係大於該 頂抵開口之面積，以防止該支撐部掉出該容置空間。 32.如請求項26之窗型壓板，其中該頂抵部之面積係小於該 頂抵開口之面積，使得該頂抵部可以於該頂抵開口内移 ❿ 動0 130742.doc201013833 VII. Patent application scope: 1- A fixing fixture for a wire-bonding machine is used to fix a carrier plate to facilitate the wire-making process. The carrier plate includes an upper surface and a lower surface, and a plurality of wafers are adhered to the carrier plate. The fixing fixture comprises: a hot plate comprising an adsorption surface for supporting a lower surface of the carrier plate and providing thermal energy to the carrier plate; and a window type pressing plate for pressing the upper surface of the carrier plate, including a pressure plate body; 至少 at least one window hole extending through the pressure plate body for exposing a portion of the upper surface of the carrier plate; and at least one buffer device 'beyond the window hole, the buffer device including a top abutting end When the window-shaped pressure plate presses the upper surface of the carrier plate, the top abutting end is abutted against the upper surface of the carrier plate. When the window-shaped pressure plate is lifted upward, the top abutting end pushes the carrier plate downward to The carrier plate is prevented from being lifted up together with the window platen. 2. The jig of claim 1 wherein the carrier plate is a Substrate Strip. 3. The jig of claim 1, wherein the carrier plate is a lead frame. The jig of claim 1, wherein the window plate further comprises a plurality of beadings, and the beading system is partially Located within the aperture and interleaved to define a plurality of openings, each of which corresponds to each of the wafers. 5. The jig of claim 1, wherein the wafers are adhered to an upper surface of the carrier plate, the window of the window platen exposing the wafers. 130742.doc 201013833 "Monthly item 1 of the cookware, wherein the hot plate further comprises a plurality of suction holes, • the suction holes communicate with the adsorption surface. 7. The jig of claim 1, wherein the cushioning device comprises an elastic body and a top abutting block, the elastic body comprising a fixed end and a free end, the fixed end being fixed to the platen body, the top One end of the abutting block is connected to the free end of the elastic body, and the other end is the top abutting end. When the window type pressing plate fits the upper surface of the supporting plate, the top abutting end of the top abutting block is abutted against the supporting plate The upper surface, the elastic system is in a compressed state, and when the window type pressing plate is lifted upward, the top abutting end is pushed downward by the elastic force of the elastic body to prevent the carrying plate from being combined with the window type The pressure plate is lifted up together. 8. The jig of claim 7, wherein the platen body further comprises at least one concave 1±1 body, the solid end is fixed in the groove and the top abutting block moves in the groove. 9. The jig of claim 7, wherein the elastic system is a spring and the top abutting block is a sphere. 1. The jig of claim 1, wherein the cushioning device is an elastic piece, one end of the squirting body is a fixed end, fixed to the body of the platen, and the other end is the top The elastic piece body has a degree of the plate body, and when the window type pressing plate presses the upper surface of the carrier plate, the top plate abuts against the upper surface of the carrier plate, and the elastic piece body When the deformation is performed, the top abutting end is pushed upward by the restoring force of the elastic piece to push the carrying plate 'downwardly to prevent the carrying plate from being lifted up together with the window type pressing plate.治. For example, the cushioning device is a resilient buffer 130742.doc 201013833 layer having an upper surface and a lower surface, the upper surface being a fixed end attached to the pressure plate body. The lower surface is the abutting end. When the shape pressing plate presses the upper surface of the carrier plate, the top abutting end is abutted against the upper surface of the carrier plate, and the elastic buffer layer is in a compressed state. When the window type pressure plate is lifted upward, the top abutting end is pushed downward by the restoring force of the elastic buffer layer to prevent the carrier board from being lifted up together with the window type pressure plate. I2. The jig of claim 11, wherein the elastic buffer layer is made of a rubber. 13. The jig of claim 1, wherein the platen body further comprises at least one accommodating space, the accommodating space comprises a top abutting opening, the damper device is a movable block body, and the movable block body comprises a supporting portion And a top portion, the support portion is located in the accommodating space, and the area of the support portion is larger than the area of the top abutment opening to prevent the support portion from falling out of the accommodating space, and the lower end portion of the apex portion is For the top abutting end, the area of the abutting portion is smaller than the area of the top abutting opening so that the abutting portion can move within the top abutting opening when the window type pressing plate presses the upper surface of the carrying plate The top abutting end of the abutting portion is abutted against the upper surface of the supporting plate. When the window pressing plate is lifted upward, the abutting portion of the abutting portion is pushed downward due to the gravity of the movable block. The carrier plate is opened to prevent the carrier plate from being lifted up together with the window platen. A window type pressing plate for pressing a top surface of a carrier board, wherein a plurality of wafers are adhered to the carrier board, comprising: a pressure plate body; 130742.doc 201013833 at least one window hole extending through the pressure plate body for Forming a portion of the upper surface of the carrier plate; and at least one buffer device located outside the window hole, the buffer device including a top abutting end, when the window type pressing plate presses the upper surface of the carrier plate, the top abutting end The top of the base plate abuts against the upper surface of the carrier plate. When the window type pressure plate is lifted upward, the top abutting end pushes down the carrier plate to prevent the carrier plate from being lifted up together with the window type pressure plate. 15. The window type pressure plate of claim 14, wherein the carrier plate is a substrate strip 〇16. The window type pressure plate of claim 14, wherein the carrier plate is a lead frame 〇17 The window type platen of claim 14 further comprising a plurality of strips, wherein the strips are located within the aperture and interdigitated to define a plurality of openings, each of the openings corresponding to each of the wafers. 18. The window-type platen of claim 14, wherein the wafers are adhered to an upper surface of the carrier plate, the window of the window-type platen exposing the wafers. The window-type pressure plate of claim 14, wherein the buffering device comprises an elastic body and a shell-butting block, the elastic body comprises a fixed end and a free end, and the fixed end is fixed to the platen body. One end of the top abutting block is connected to the free end of the elastic body, and the other end is the top abutting end. When the window type pressing plate is pressed and the upper surface of the supporting plate is pressed, the top end of the top abutting block is abutted against the top end The upper surface of the carrying plate, the elastic system is in a compressed state, and when the window pressing plate is lifted upward, the top abutting end is pushed downward by the elastic force of the elastic body to prevent the carrying plate from being attached to the window The pressure plate together lifts up 130742.doc 201013833 liters. 2) The window type pressure plate of the present invention, wherein the pressure plate body further comprises at least one groove, the fixed end of the elastic body is fixed in the groove, and the top abutting block is moved in the groove . 21. The window type pressure plate of claim 19, wherein the elastic system is a spring, and the top abutting block is a sphere. 22. The window type pressure plate of claim 14, wherein the cushioning device is an elastic piece body, and one end of the elastic moon body is a fixed end, and the other end of the pressure plate body is fixed to the top end end, the elasticity The sheet body has an angle with the platen body. When the window type pressing plate presses the upper surface of the carrier plate, the top abutting end is abutted against the upper surface of the carrier plate, and the elastic piece body is deformed and deformed. When the meat type platen is lifted upward, the top abutting end is pushed downward by the restoring force of the elastic piece to push the carrier plate upward to prevent the carrier plate from being lifted up together with the window type pressure plate. The window type pressure plate of claim 14, wherein the buffer device is an elastic buffer layer having an upper surface and a lower surface, the upper surface being a solid end attached to the pressure plate body, the lower surface being attached For the top abutting end, when the ®! platen presses the upper surface of the carrier plate, the apex abutting end is attached to the upper surface of the carrier plate, and the elastic buffer layer is in a compressed state, when the window type platen When lifting upward, the top abutting end is subjected to the restoring force of the elastic buffer layer downward (four) to the carrier plate to prevent the carrier plate from being lifted up together with the window platen. 24. The window type pressure plate of claim 23, wherein the elastic buffer layer is made of rubber. The system of claim 14, wherein the pressure plate body further comprises at least one accommodating space, the accommodating space comprises a top abutting opening, and the buffering device is a movable block, the movable block The body includes a supporting portion and a top abutting portion, the supporting portion is located in the accommodating space, and the area of the supporting portion is larger than the area of the top abutting opening to prevent the supporting portion from falling out of the accommodating space, the top portion The lower end of the abutting portion is the abutting end, and the area of the abutting portion is smaller than the area of the abutting opening, so that the abutting portion can move in the top abutting opening, when the window type pressing plate presses the supporting plate When the upper surface is pressed, the top of the top against the top of the P is abutted against the upper surface of the carrying plate. When the window pressing plate is lifted upward, the top of the abutting portion is caused by the gravity of the movable block. The abutment plate pushes the carrier plate downward to prevent the carrier plate from being lifted up together with the window type pressure plate. A window type pressing plate for pressing a top surface of a carrier board, wherein a plurality of wafers are adhered to the carrier board, comprising: a platen body comprising at least one receiving space, the receiving space including a topping An opening; at least one window hole extending through the plate body for exposing a portion of the upper surface of the carrier plate; and at least one buffer device located outside the window hole, the buffer device being a movable block, the movable block The support portion and the top portion of the support portion are located in the accommodating space. The lower end of the apex abutting portion is the top abutting end. When the window type pressing plate presses the upper surface of the supporting plate, the The top abutting end of the abutting portion is abutted against the upper surface of the carrier plate. When the window type pressing plate is lifted upward, the top abutting end of the top portion of the cover is 130742.doc 201013833 due to the gravity of the movable block. Push the carrier plate down, n ^ ^ ^ ^ to prevent the carrier plate from being lifted up together with the solid plate. 27. The window type pressure plate of claim 26, wherein the carrier plate is a substrate strip (Substrate Strip) 〇 28. The window type pressure plate of claim 26 is provided with a φ 兮 plate, wherein the 4 carrier plate is a lead frame (headframe) 〇29· The window-type pressure plate of claim 26, further comprising a plurality of embossing strips, and some of the strips are located in the slats, and each other is defined by a plurality of openings, each of which defines a plurality of openings, each The openings correspond to each of the wafers. 30. The window-type platen of claim 26, wherein the wafers are adhered to an upper surface of the carrier plate, the window of the window-type platen exposing the wafers. The window type pressure plate of claim 26, wherein the area of the support portion is larger than the area of the top abutment opening to prevent the support portion from falling out of the accommodating space. 32. The window-type platen of claim 26, wherein the area of the abutting portion is less than the area of the abutting opening such that the abutting portion is movable within the abutting opening.
TW098125939A 2008-09-26 2009-07-31 Fixing jig of wire bonding machine and window type clamp thereof TWI389247B (en)

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TWI405278B (en) * 2010-05-20 2013-08-11 Advanced Semiconductor Eng Fixing fixture and wire bonding machine
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CN102222626B (en) * 2010-04-15 2013-03-20 日月光半导体制造股份有限公司 Machine bench for semiconductor technology
CN102593027B (en) * 2011-11-30 2014-05-28 歌尔声学股份有限公司 Die bonding pressing plate
JP5991133B2 (en) * 2012-10-16 2016-09-14 三星ダイヤモンド工業株式会社 Breaking jig for brittle material substrate and breaking method
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Publication number Priority date Publication date Assignee Title
TWI405278B (en) * 2010-05-20 2013-08-11 Advanced Semiconductor Eng Fixing fixture and wire bonding machine
CN103847033A (en) * 2012-11-30 2014-06-11 三星钻石工业股份有限公司 Scribing jig for brittle material substrate, scribing method and dividing method

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CN101685785A (en) 2010-03-31
TWI389247B (en) 2013-03-11

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