1260680 九、發明說明 【發明所屬之技術領域】 本發明係有關於一種基板清洗治具與基板清洗方法，特 — 別有關於一種直接覆蓋住原先承載基板之承載器的基板清 洗治具與基板清洗方法。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning jig and a substrate cleaning method, and particularly to a substrate cleaning jig and substrate cleaning directly covering a carrier of an original carrier substrate. method. [Prior Art]
隨著科技的日新月異，微電子構裝（packaging)技術亦不 _ 斷提昇，對於積體電路（Integrated Circuit，1C)的需求，亦趨 向於咼密度、多功能、高傳輸速度的型態，所以具有良好散 熱度（Heat dissipating)的積體電路之需求亦相伴產生，因此 ’ 構裝技術亦逐漸由早期使用金屬接腳（Lead)，演化至今日大 量使用錫球構裝的方式，以符合積體電路的需求。一種廣為 使用的錫球構裝方法為錫球陣列封裝（BaU BGA)製程，其能有效的增加IC的應用面積，亦能符合降低 成本的要求。在進行錫球陣列封裝製程時，通常需使用助焊 •劑(Flux)來幫助錫球的形成。因而，在完成錫球陣列封装‘ 程後，基板上經常會殘留有助焊劑，必須使用清洗機台加^ 清洗’來去除基板上的助焊劑殘留物。 π參照第1A圖和第1B圖，其分別繪示習知之承載美 板之承載器（Boat)的立體示意圖和俯視示意圖。如第1八圖 和第1B圖所示，承載恭} 〇〇具有複數個承載框架1 π，其 中母個承載框架12 〇的複數個（例如：4個）角落設置有2 數組（例如：4個）固定元件130,每一個固定元件二〇係: 1260680 1=1 ^肖132和134所組成’用以卡住基板14G之頂角的 2。於承载框架120間沿著承载器100之長軸的方向分別 f複㈣連接部分i5G…般，在進行錫球陣列封裝製 私之刖，稷數個基板140已分別置入承100之 中，並與固定元件叫目卡合，其中基請的广!表： 係由承載框架120的開口中暴露出來。 在完成錫球陣列封裝製程（黏著晶粒170至基板140上 而形成封裝體）之後，操作員必須將封裝體（具有晶粒170之 基板140)自之承載@ 1〇〇中一一移出，再分別置入至由清 洗機台製造商所提供之基板承載裝置中。請參照第Μ圖和 第2B圖’其分別緣示f知之基板清洗用之基板承載裝置的 立體示意圖和俯視示意圖。如帛2A圖和帛2B圖所示，習 知之基板清洗用之基板承載裝置2〇〇具有兩個長條凸出部 252a和252b、及複數個承載區域22〇，每一個承載區域 具有4個貫穿孔224，每一個承載區域22〇之貫穿孔224與 其相鄰之承載區域220的貫穿孔分別定義出複數個間隔區 域（未標示）’其中位於基板承載裝置2〇〇之兩端的部分間隔 區域中設置有複數個τ字凸出部分260a，位於承載裝置2〇〇 之内部的部分間隔區域中設置有複數個十字凸~出部分 260b，而與長條凸出部252a和252b相鄰的間隔區域中設置 有短條凸出部260c，短條凸出部26〇c係垂直於長條凸出部 252a和252b，即每一個承載區域22〇的四周角落均設置有 十字凸出部分260b、短條凸出部26〇c和/或τ字凸出部分 260a。當基板140置入至承載區域22〇中時，可被十字凸出 1260680 部分260b、短條凸出部^以和/或τ字凸出部分26〇&卡住 而減少晃動。 明參知第3 A圖和第3 B圖，3 A圖為緣示若干片習知之 基板承載裝置堆疊在一起的側視示意圖，第3B圖為繪示習 知之基板承載裝置的水流流場示意圖。如第3 A圖所示，在 將所有的基板丨4〇全置入習知之基板承載裝置2〇〇後，操作 員將若干裝有基板140的基板承載裝置2〇〇堆疊在一起，再 於最上一層安放一空的基板承載裝置2〇2，其中基板承載裝 置200間均因十字凸出部分26〇b、短條凸出部26〇c和/或丁 子凸出部分260a的緣故，而具有間隙27〇。接著，將所形 成之堆疊結構垂直地（間隙270的開口朝上）放入清洗機台 中，再以水流（如箭頭所示）喷入堆疊結構之複數個間隙 270(流道）中，來去除基板14〇上的助焊劑殘留物。然而， 如第3B圖所示，由於十字凸出部分26〇b、短條凸出部KM 和/或T字凸出部分260a的阻擋效應，造成基板承載裝置 200上的水流流場相當紊亂，加上如第2a圖所示之貫穿孔 224容許水流在每一個基板承載裝置2〇〇之間流動，更加擾 礼了水流流場，因此造成擾流而使水流流速降低，使得清洗 機台的清洗能力無法完全發揮。另一方面，十字凸出部分 260b、短條凸出部260c和/或τ字凸出部分26〇a固定基^ 140的能力不甚理想，使得沖洗時基板14()仍會有晃動㈣ 象’亦會降低清洗機台的清洗效果，i重較會造成基板 140和其上之晶粒170受損，因而影響到生錢良率與效能。 此外’習知技術需將封裝體自承載器中移出，再分別置 7 I26〇68〇 ^至其專用之基板承載裝置中，方能使用清洗機台進行 、V驟，不僅曠日費時，更需要向原廠購買昂貴的 承载裝置’因而增加了許多生產成本。 用基板 因此’非常迫切需要發展一基板清洗治具與基 流流場、減少基板晃動、節省操作時 、購貝基板承載裝置的成本，來克服習知技術的缺點。 【發明内容】 本1月的目的就疋在提供一種基板清洗治具與基板清 :方法，藉以形成優良的水流流場並減少基板晃動，來增加 /月洗機台的清洗效果與生產的良率。 本發明的另一目的就是在提供一種基板清洗治具與基 反清洗方法，#以節省操作時間與購買基板承載裝置 本’來降低生產成本。 ' 、根據本發明之上述目的，提出基板清洗治具與基板清洗 方法’用以覆蓋承載器並固定承載器上之複數個封裝體，其 中此承載器具有複數個承載框架’每一個承載框架的複數個 角落設置有複數個固定元件’封裝體之基板係放置在承載框 架中’而每一個基板的複數個頂角係與固m牛相卡合。於 承載框架間沿著平行流道的方向分別定義出複數個連接部 分。 依照树明之較佳實施例，此基板清洗治具係由蓋板和 設置於此蓋板上之複數個塾塊所組成’其中塾塊係分別對應 於承載器上之連接部分，當此蓋板覆蓋住此承載器而形成結 8With the rapid development of technology, the micro-electronic packaging technology is not improving. The demand for integrated circuits (1C) also tends to be density, multi-function, and high transmission speed. The demand for integrated circuits with good heat dissipating is also accompanied by the fact that the 'construction technology is gradually being used by the early use of metal pins (Lead), and the way to use a large number of solder balls has been evolved to match the product. The requirements of the body circuit. A widely used solder ball assembly method is a solder ball array package (BaU BGA) process, which can effectively increase the application area of the IC and meet the requirements of cost reduction. In the solder ball array packaging process, Flux is usually used to help form the solder balls. Therefore, after completing the solder ball array package, the flux often remains on the substrate, and the cleaning machine must be cleaned to remove the flux residue on the substrate. π refers to FIG. 1A and FIG. 1B, which respectively show a perspective view and a top view of a conventional carrier carrying a board. As shown in FIG. 1 and FIG. 1B, the bearer has a plurality of bearer frames 1 π, wherein a plurality of (for example: 4) corners of the parent carrier frame 12 设置 are provided with 2 arrays (for example: 4) The fixing member 130, each of the fixing members, is: 1260680 1 = 1 ^Shaw 132 and 134 are composed of '2' for chucking the top corner of the substrate 14G. Between the load-bearing frames 120 along the long axis of the carrier 100, respectively, four (four) connection portions i5G..., after the solder ball array package is manufactured, a plurality of substrates 140 are respectively placed in the bearing 100, And the fixed component is called, and the base is wide! The table is exposed by the opening of the carrying frame 120. After completing the solder ball array packaging process (applying the die 170 to the substrate 140 to form the package), the operator must remove the package (the substrate 140 having the die 170) from the carrier @1〇〇. They are then placed separately into the substrate carrier provided by the manufacturer of the cleaning machine. Referring to Figure 2 and Figure 2B, respectively, a perspective view and a plan view of a substrate carrying device for substrate cleaning are shown. As shown in FIG. 2A and FIG. 2B, the substrate carrier device 2 for substrate cleaning has two strip projections 252a and 252b and a plurality of carrier regions 22, each having four bearing regions. The through holes 224, the through holes 224 of each of the load-bearing regions 22 and the through-holes of the adjacent load-bearing regions 220 define a plurality of spaced regions (not labeled), respectively, in which a portion of the spacers are located at both ends of the substrate carrying device 2 A plurality of τ-shaped convex portions 260a are disposed, and a plurality of ridge-to-exit portions 260b are disposed in a portion of the spacer portion inside the carrier device 2, and an interval adjacent to the elongated bulging portions 252a and 252b a strip protruding portion 260c is disposed in the region, and the short strip protruding portion 26〇c is perpendicular to the elongated protruding portions 252a and 252b, that is, a corner protruding portion 260b is disposed at a corner of each of the carrying portion 22〇, The strip projections 26〇c and/or the τ-shaped projections 260a. When the substrate 140 is placed into the load-bearing area 22, it can be swayed by the cross-bending portion 1260680 portion 260b, the short strip projections, and/or the τ-shaped projections 26〇& 3A and 3B, 3A is a side view showing a plurality of conventional substrate carrying devices stacked together, and FIG. 3B is a schematic view showing a flow field of a conventional substrate carrying device. . As shown in FIG. 3A, after all the substrates are placed in the conventional substrate carrying device 2, the operator stacks a plurality of substrate carrying devices 2 with the substrate 140, and then The substrate carrying device 2〇2 is placed on the uppermost layer, wherein the substrate carrying device 200 has a gap due to the cross protruding portion 26〇b, the short protruding portion 26〇c and/or the butyl protruding portion 260a. 27〇. Next, the formed stacked structure is placed vertically (the opening of the gap 270 upwards) into the washing machine table, and then sprayed into a plurality of gaps 270 (flow paths) of the stacked structure by a water flow (as indicated by an arrow) to remove Flux residue on the substrate 14〇. However, as shown in FIG. 3B, the flow field of the water on the substrate carrying device 200 is quite disordered due to the blocking effect of the cross protruding portion 26〇b, the short strip protruding portion KM, and/or the T-shaped protruding portion 260a. In addition, the through hole 224 as shown in FIG. 2a allows the water flow to flow between each of the substrate carrying devices 2, which further disturbs the flow field of the water, thereby causing a turbulent flow and reducing the flow rate of the water flow, so that the washing machine is The cleaning ability cannot be fully utilized. On the other hand, the ability of the raised portion 260b, the strip projection 260c, and/or the τ-shaped projection portion 26A to fix the base 140 is less than ideal, so that the substrate 14() still sways during the rinsing (four) image 'It will also reduce the cleaning effect of the cleaning machine. The weight of i will cause damage to the substrate 140 and the die 170 thereon, thus affecting the yield and performance of the money. In addition, the conventional technology needs to remove the package from the carrier, and then set 7 I26〇68〇^ to its dedicated substrate carrying device, so that it can be used by the cleaning machine and V-sequence, which is not only time-consuming but also time-consuming. There is a need to purchase expensive carrier equipment from the original factory', thus increasing many production costs. The use of a substrate thus makes it extremely urgent to develop a substrate cleaning jig and a flow field of a substrate, reduce substrate sloshing, save operation, and cost of purchasing a substrate carrier to overcome the disadvantages of the prior art. SUMMARY OF THE INVENTION The purpose of this month is to provide a substrate cleaning jig and a substrate clearing method, thereby forming an excellent water flow field and reducing substrate shaking, thereby increasing the cleaning effect and production of the monthly washing machine. rate. Another object of the present invention is to provide a substrate cleaning jig and a base anti-cleaning method to save operating time and purchase a substrate carrying device to reduce production costs. According to the above object of the present invention, a substrate cleaning jig and a substrate cleaning method are proposed to cover a carrier and fix a plurality of packages on the carrier, wherein the carrier has a plurality of carrier frames 'each carrying frame A plurality of corners are provided with a plurality of fixing elements 'the substrate of the package is placed in the carrying frame' and a plurality of apex angles of each of the substrates are engaged with the solid m. A plurality of connecting portions are respectively defined along the direction of the parallel flow paths between the carrier frames. According to a preferred embodiment of the present invention, the substrate cleaning jig is composed of a cover plate and a plurality of crotch blocks disposed on the cover plate, wherein the crotch block portions respectively correspond to the connecting portions on the carrier, and the cover plate Covering the carrier to form a junction 8
(I 1260680 合體時，墊塊分別頂住連接部分並壓到與連接部分相鄰之基 板，使結合體之蓋板與承載器間具有複數個平行流道，用以 分別通入清潔液。位於平行流道之兩端的部分墊塊為複數個 半圓塊結構，位於平行流道之其他位置的另一部分塾塊為複 數個圓塊結構’這些半圓塊結構與圓塊結構的圓弧均為朝向 或位於蓋板的内部。蓋板具有二個長條凸出部，其分別位於 與平行流道平行的兩邊，藉以與承載器的對應㊉邊相密合。 此外，墊塊彼此間均具有間距。 依π本毛明之較佳實施例，本發明之基板清洗方法至少 包括下列的步·驟··首&，提供複數個封裝Μ，每-個封裝體 係ο §日日粒覆日日接合於一基板上。接著，將複數個封裝體 放置至上述之承載器的承載框架中，其中每一個基板的複數 個頂角與上述之承載器的固定元件相卡合。接著，提供上述 之基板/月洗’口具。然後’將上述之基板清洗治具的蓋板覆蓋 住上述之承載器而形成結合體，其中上述之蓋板的塾塊係分 別頂住上述之承載器的連接部分並壓到與連接部分相鄰之 基板，蓋板與承載H間並具有複數個第—平行流道。然後， 將口口體安置於清洗機台中，並分別通入清潔液於平行流道 中，以去除基板上殘留的助焊劑。 因此’應用本發明，可形成優良的水流流場並減少基板 晃動’可節省操作時間與購買基板承載裝置的成本，因而降 -產成本，並增加清洗機台的清洗效果與生產的良率。 【實施方式】 ⑧ 9 1260680 明參恥第4A圖和第4B圖，其分別繪示根據本發明之 實施例之基板清洗治具的結構示意圖和俯視示意圖。基板清 洗治具则係由蓋板310和設置於蓋板310上之複數個墊塊 3 50所組成。蓋板31〇的相對兩邊具有二長條凸出部μ。 和352b’長條凸出部352a和35沘分別具有複數個壓塊354& 和354b’因而在蓋板310的其餘兩邊形成兩開口。墊塊35〇、 壓塊354a和354b係依序等距（間距D)排列於長條凸出部 352a/352b之間。其中墊塊35〇為複數個圓塊結構。在與如 第1A圖所示之承載器相結合後，上述之開口與間距d會形 成複數條平行流道。蓋板1〇的材質係與如第ia圖所示之 承載器相$，例如：鋁合金、鋁鎳合金等。墊塊35〇係由抗 靜電材料所製成，例如：抗靜電塑膠等。 請參照第5 A圖和第5B圖，其分別繪示根據本發明之 實施例之基板清洗治具與承載器之結合體的爆炸示意圖和 組裝完成示意圖。如第5B圖所示，結合體之基板清洗治具 3〇〇與承載器1〇〇間形成有複數個平行流道36〇。如第 圖所示，承載器1 〇〇具有複數個承載框架i2〇，每一個承載 框架120的複數個角落設置有複數個固定元件13〇，包含有 覆晶接合於基板140之晶粒170的封裝體（未標示）係放置在 承載框架120中，而每一個基板140的複數個 元件η"目卡合。沿著平行流道36。的方向於承載器口二 之承載框架12〇間分別定義出複數個連接部分15〇。應用基 板清洗治具300時，首先將基板清洗治具3〇〇翻轉過來，使 墊塊350朝向承載器100具有基板14〇的表面，再將墊塊 1260680 350對準連接部分150 ;及將長條凸出部352a和352b分別 對準承載器100的對應兩側邊152&和152b。然後，將蓋板 310覆盖住承載器1〇〇而形成結合體，其中墊塊35〇係分別 頂住連接部分15〇並壓到與連接部分150相鄰之基板14〇， 壓塊354a和354b則壓到與側邊152a和152b相鄰的基板 140 〇 請參照第6 A圖和第6B圖，其分別繪示根據本發明之 貝也例之基板/月洗治具與承載器之結合體的堆疊結構示意 圖和其正視示意圖。如第6A圖和第6B所示，實際應用本 ^明時，可將多個基板清洗治具300與承載器1 〇〇的結合體 堆疊在一起，其中每一組結合體均具有複數個平行流道 3 60。然後’將這些結合體的堆疊體安置於清洗機台中，分 別通入清潔液（如清水）於平行流道36〇中，以去除基板14〇 上殘留的助焊劑。請參照第6C圖，其繪示根據本發明之實 鈿例之基板清洗治具與承載器之結合體的流場示意圖。如第 φ 6C圖所不，清潔液（水流）沿著平行流道36〇沖洗每一塊基 板140及其上之晶粒17〇，由於墊塊35〇為圓弧狀，水流得 以平順的流過，而且結合體之間沒有孔洞存在，故沒有任何 ^ 水流會在結合體之間留動。此外，本實施例直接使用原先承 載基板的承載器，其固定基板能力甚佳，加上基板清洗治具 之蓋板的墊塊350，壓塊354a和354b可有效地壓住基板 140,故可將沖洗時基板14〇的晃動減到最低程度。因此， 本實施例的水流具有正確的流向，不會造成亂流，且流速可 藉由調整間隙的尺寸來增加，因而可大幅地增加清洗機台的 1260680 清洗效果，有效地避免基板和其上之晶粒受損，進而提高生 產的良率與效能。 /值侍一提的是，本發明的特徵係在在完成晶粒黏著製程 ^後L直接以本發明之基板清洗治具覆蓋住原先承載基板的 ，載來進行去除殘留助焊劑的步驟。因此，應用本發明 日寸，刼作員不必將基板140自之承載器100中移出再置入至 2板承載裝置中，故可大幅地節省操作時間，且不必購買昂 貴的基板承載裝置。以下將綜合敘述本發明之基板清洗方 法·首先，提供如第丨A所示之習知承載器。接著，將複數 個基板放置至習知承載器的承載框架中，其中每一個基板的 複數個頂角與上述之承載器的固定元件相+合。然後，進行 晶粒黏著製程，以分別將複數個晶粒覆晶接合至複數個基板 上，而形成複數個封裝體。接著，提供本發明之基板清洗治 ，。然後’將本發明之基板清洗治具的蓋板覆蓋住習知承載 器而幵y成結合體，其中本發明之蓋板的墊塊係分別頂住習知 2載器的連接部分並壓到與連接部分相鄰之基板，本發明之 1板與習知承載器間並具有複數個第一平行流道。然後，將 結合體安置於清洗機台中，並分別通入清潔液於平行流道 中’以去除基板上殘留的助焊劑。 由上述本發明較佳實施例可知，應用本發明的優點為： 可形成優良的水流流場並大幅地減少基板晃動，·可大幅地節 省操作時間，且不必購買基板承載裝置，因而大幅地降低生 產成本，並增加清洗機台的清洗效果與生產的良率。 雖然本發明已以一較佳實施例揭露如上，然其並非用以 12 !26〇68〇 :2發：，任何熟習此技藝者，在不脫離本發明之精神和 电、，曰可作各種之更動與潤飾，因此本發明之保護範圍 田硯後附之申請專利範圍所界定者為準。 【圖式簡單說明】 _第1A圖和第1B圖為分別繪示習知之承載基板之承載 器（Boat)的立體示意圖和俯視示意圖。 第2A圖和第2B圖為分別繪示習知之基板清洗用之基 板承载裝置的立體示意圖和俯視示意圖。 第3 A圖為繪示若干片習知之基板承載裝置堆疊在一起 的側視示意圖。 第3B圖為緣示習知之基板承載裝置的水流流場示意 第4A圖和第4B圖為分別繪示根據本發明之實施例之 基板清洗治具的結構示意圖和俯視示意圖。 第5 A圖和第5B圖為繪示根據本發明之實施例之基板 /月洗治具與承載器之結合體的爆炸示意圖和組裝完成示意 圖。 第6 A圖和第6B圖為分別繪示根據本發明之實施例之 基板清洗治具與承載器之結合體的堆疊結構示意圖和其正 視示意圖。 第6C圖為繪示根據本發明之實施例之基板清洗治具與 承載器之結合體的流場示意圖。 1260680 【主要元件符號說明】 100 :承載器 120 :承載框架 130 :固定元件 132、134 :固定梢 140 :基板 150 :連接部分 152a、152b ：側邊 1 7 0 ·晶粒 200 :基板承載裝置 220 :承載區域 224 :貫穿孔 252a、252b :長條凸出部 260a : T字凸出部分 260b :十字凸出部分 260c :封閉迴圈 260c :短條凸出部 270 :間隙 300 ··基板清洗治具 3 1 0 :蓋板 350 :墊塊 352a、352b :長條凸出部 3 6 0 :平行流道 D :間距 14(I 1260680 When the body is assembled, the blocks respectively support the connecting portion and are pressed to the substrate adjacent to the connecting portion, so that there are a plurality of parallel flow paths between the cover plate of the combined body and the carrier for respectively feeding the cleaning liquid. A part of the spacers at both ends of the parallel flow path is a plurality of semi-circular block structures, and another part of the block located at the other position of the parallel flow path is a plurality of circular block structures. The arcs of the semi-circular block structure and the circular block structure are oriented toward each other. The cover has two strip projections respectively located on two sides parallel to the parallel flow passages to be in close contact with the corresponding ten sides of the carrier. Further, the spacers are spaced apart from each other. According to a preferred embodiment of the present invention, the substrate cleaning method of the present invention comprises at least the following steps, a first package, and a plurality of package packages, each of which is 日 粒 粒 粒 粒 接合And a plurality of packages are placed in the carrier frame of the carrier, wherein a plurality of apex angles of each of the substrates are engaged with the fixing members of the carrier. Substrate/month wash's mouthpiece. Then, the cover plate of the above-mentioned substrate cleaning jig is covered to cover the above-mentioned carrier to form a combined body, wherein the above-mentioned cover plate blocks respectively support the connecting portion of the above-mentioned carrier And pressing the substrate adjacent to the connecting portion, the cover plate and the bearing H and having a plurality of first-parallel flow paths. Then, the mouth body is disposed in the cleaning machine, and the cleaning liquid is respectively introduced into the parallel flow channel. In order to remove the flux remaining on the substrate. Therefore, the application of the present invention can form an excellent flow field and reduce substrate sloshing, which can save operation time and cost of purchasing a substrate carrier, thereby reducing production costs and increasing the cleaning machine. The cleaning effect and the yield of the production. [Embodiment] 8 9 1260680 4A and 4B are respectively a schematic structural view and a schematic plan view of a substrate cleaning jig according to an embodiment of the present invention. The cleaning fixture is composed of a cover plate 310 and a plurality of spacers 350 disposed on the cover plate 310. The opposite sides of the cover plate 31 have two long projections μ and 352b' long strips. The upper portions 352a and 35b respectively have a plurality of pressing blocks 354 & 354 and 354b' thus forming two openings on the remaining two sides of the cover plate 310. The spacers 35 〇 and the pressing blocks 354a and 354b are sequentially arranged equidistantly (pitch D). Between the strip projections 352a/352b, wherein the spacer 35 is a plurality of circular block structures. After being combined with the carrier as shown in FIG. 1A, the opening and the spacing d form a plurality of parallel flows. The material of the cover plate 1 is the same as that of the carrier shown in Fig. ia, for example, aluminum alloy, aluminum-nickel alloy, etc. The spacer 35 is made of antistatic material, for example: antistatic plastic. Please refer to FIG. 5A and FIG. 5B , which respectively show an exploded view and an assembled complete schematic view of a combination of a substrate cleaning jig and a carrier according to an embodiment of the present invention. As shown in Fig. 5B, a plurality of parallel flow paths 36A are formed between the substrate cleaning fixture 3〇〇 and the carrier 1〇〇. As shown in the figure, the carrier 1 has a plurality of carrier frames i2, each of which has a plurality of fixing elements 13A disposed thereon, and includes a die 170 bonded to the die 170 of the substrate 140. A package (not shown) is placed in the carrier frame 120, and a plurality of components of each substrate 140 are η" Along the parallel flow path 36. The direction of the carrier frame 12 of the carrier port 2 defines a plurality of connecting portions 15A, respectively. When the substrate cleaning fixture 300 is applied, the substrate cleaning fixture 3 is first turned over, so that the spacer 350 faces the surface of the substrate 100 with the substrate 140, and then the spacer 1260680 350 is aligned with the connecting portion 150; The strip projections 352a and 352b are respectively aligned with the corresponding side edges 152 & 152b of the carrier 100. Then, the cover plate 310 is covered by the carrier 1 to form a combined body, wherein the spacers 35 are respectively pressed against the connecting portion 15A and pressed to the substrate 14A adjacent to the connecting portion 150, the pressing blocks 354a and 354b Then, the substrate 140 adjacent to the side edges 152a and 152b is pressed. Referring to FIGS. 6A and 6B, respectively, the combination of the substrate/monthly jig and the carrier according to the present invention is shown. Schematic diagram of the stack structure and its front view. As shown in FIG. 6A and FIG. 6B, in the actual application, a plurality of substrate cleaning jigs 300 and a combination of carriers 1 堆叠 can be stacked, wherein each combination has a plurality of parallels. Runner 3 60. Then, the stack of these combined bodies is placed in a washing machine, and a cleaning liquid (e.g., clean water) is introduced into the parallel flow path 36〇 to remove the flux remaining on the substrate 14〇. Please refer to FIG. 6C, which is a flow chart showing the combination of the substrate cleaning jig and the carrier according to the embodiment of the present invention. As shown in the φ 6C figure, the cleaning liquid (water flow) rinses each of the substrate 140 and the crystal grains 17 沿着 along the parallel flow path 36 〇. Since the spacer 35 is arc-shaped, the water flows smoothly. And there are no holes between the combined bodies, so no water flow will remain between the combined bodies. In addition, in this embodiment, the carrier that originally carries the substrate is directly used, and the fixing substrate has a very good ability. With the pad 350 of the cover of the substrate cleaning jig, the pressing blocks 354a and 354b can effectively press the substrate 140, so The sloshing of the substrate 14 冲洗 during rinsing is minimized. Therefore, the water flow of the embodiment has the correct flow direction, does not cause turbulent flow, and the flow rate can be increased by adjusting the size of the gap, thereby greatly increasing the cleaning effect of the washing machine 1260680, effectively avoiding the substrate and the upper portion thereof. The grain is damaged, which in turn increases the yield and performance of the production. It is noted that the feature of the present invention is that after the die attach process is completed, L directly covers the original carrier substrate with the substrate cleaning jig of the present invention, and the step of removing the residual flux is carried. Therefore, by applying the present invention, the player does not have to remove the substrate 140 from the carrier 100 and reinsert it into the 2-plate carrier, so that the operation time can be greatly saved, and it is not necessary to purchase an expensive substrate carrier. The substrate cleaning method of the present invention will be collectively described below. First, a conventional carrier as shown in Fig. A is provided. Next, a plurality of substrates are placed in the carrier frame of the conventional carrier, wherein a plurality of apex angles of each of the substrates are combined with the fixed members of the carrier. Then, a die attach process is performed to respectively bond a plurality of crystal grains to a plurality of substrates to form a plurality of packages. Next, the substrate cleaning treatment of the present invention is provided. Then, the cover plate of the substrate cleaning jig of the present invention is covered with a conventional carrier, and the pad of the cover plate of the present invention is respectively pressed against the connecting portion of the conventional carrier and pressed to The substrate adjacent to the connecting portion has a plurality of first parallel flow paths between the plate of the present invention and the conventional carrier. Then, the bonded body is placed in the washing machine, and the cleaning liquid is introduced into the parallel flow path respectively to remove the residual flux on the substrate. It can be seen from the above preferred embodiments of the present invention that the advantages of the application of the present invention are: an excellent water flow field can be formed and the substrate sloshing can be greatly reduced, the operation time can be greatly saved, and the substrate carrying device does not have to be purchased, thereby greatly reducing Production costs, and increase the cleaning effect of the washing machine and the yield of production. Although the present invention has been disclosed in a preferred embodiment as above, it is not intended to be used in any of the following embodiments: without departing from the spirit and scope of the present invention, The changes and refinements of the present invention are therefore defined in the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are respectively a schematic perspective view and a plan view showing a carrier of a conventional carrier substrate. 2A and 2B are a perspective view and a top plan view, respectively, showing a conventional substrate carrying device for substrate cleaning. Figure 3A is a side elevational view showing a plurality of conventional substrate carrying devices stacked together. Fig. 3B is a schematic view showing the structure of a substrate cleaning device according to an embodiment of the present invention, and a top plan view, respectively, showing a schematic diagram of the water flow field of the conventional substrate carrying device. 5A and 5B are schematic exploded views and an assembled view showing the combination of the substrate/moon cleaning jig and the carrier according to the embodiment of the present invention. 6A and 6B are respectively a schematic view showing a stacking structure of a combination of a substrate cleaning jig and a carrier according to an embodiment of the present invention, and a schematic view thereof. Fig. 6C is a flow chart showing the combination of the substrate cleaning jig and the carrier according to the embodiment of the present invention. 1260680 [Description of main component symbols] 100: Carrier 120: Carrier frame 130: Fixing elements 132, 134: Fixing tip 140: Substrate 150: Connecting portions 152a, 152b: Side 1 7 0 · Die 200: Substrate carrying device 220 : bearing area 224 : through holes 252a, 252b : elongated protrusion 260a : T-shaped convex portion 260b : cross protruding portion 260c : closed loop 260c : short strip protruding portion 270 : gap 300 · · substrate cleaning 3 1 0 : cover plate 350 : spacers 352a, 352b : elongated projections 3 6 0 : parallel flow passage D : spacing 14