TWI408781B - Apparatus for forming protective tape on chip scale package and method of the same - Google Patents

Abstract

The present invention provides an apparatus for forming protective films on chips. The apparatus includes a housing plate set which comprises a housing plate, at least one guide rod and at least one press bar, wherein the press bar is configured on the guide rod for facilitating moving on the guide rod. A chip tray is provided for loading a plurality of chips. A protective tape is attached on the surface of the housing. A base plate set is applied to support the chip tray and fix the housing plate set, wherein the base plate set comprises a base, at least one clamp and a supporter with at least one elastic unit for supporting the chip tray. The base is used to support the supporter and the clamp, and the clamp is used to tighten the housing plate. A transfer tape is used to attach a plurality of protective film units for facilitating the plurality of protective film units attaching on the plurality of chips.

Description

Device for forming protective film on wafer level package and forming method thereof

This invention relates to a wafer level package and, more particularly, to a method of forming a protective film on a wafer level package.

In the field of semiconductor components, the density of components continues to increase, and the volume gradually decreases. The need for packaging or interconnect technology for high density components is also increasing to meet the above. The functions of the die package include power distribution, signal distribution, heat dissipation, protection and support. Due to the complication of semiconductor structures, conventional technologies such as lead frame packages, flex packages, and rigid package technologies have been unable to achieve small-sized devices with high-density components. Grain. Moreover, since the die-packaging technology is closely related to the development of the integrated circuit, the packaging technology is increasingly required for the size of the electronic component. For the above reasons, today's packaging technologies have gradually adopted ball grid array (BGA), flip chip ball grid array (FC-BGA), chip scale package. , CSP) technology.

The wafer level package can have a wafer area and package area of about 1/3 of the ball grid array package, or 1/6 of the area of the miniaturized package memory chip. Therefore, under the wafer level package, the same volume can be configured with more integrated circuit chips, thereby increasing the unit capacity. In other words, wafer-level packaging in the same space can increase storage capacity by a factor of about three compared to ball array packages. The wafer-level package not only has the advantage of small size, but also has a thinner package thickness. Generally, the most effective heat dissipation path of the metal substrate to the heat sink is only 0.2 mm or less, which greatly improves the reliability of the wafer after long-term operation, and The line impedance is significantly reduced and the operating speed of the components is greatly improved.

Wafer-level packaged packaging units are prone to scratches, static electricity, or contamination of particles during transport. Scratches, static electricity, or dust contamination can affect image capture quality or even electrical failure, so at the wafer level. A protective film is formed over the packaged wafer to prevent dust contamination. However, a conventional method of forming a protective film on a wafer of a wafer level package is to attach a protective film to a wafer by hand by piece. This method does not easily align a single protective film to the wafer accurately, which tends to cause a defective rate of the protective film bonding process, and it takes a lot of time to attach a protective film to a large number of wafer-level packaged wafers.

Therefore, in view of the above-described disadvantages of the conventional protective film formation method on a wafer-level packaged wafer, the present invention provides a method of attaching a conventional protective film to a wafer of a wafer level package to overcome the above disadvantages.

In view of the above, the main object of the present invention is to provide a device for forming a protective film on a wafer size package (CSP) and a method for forming the same, which utilizes a plurality of jigs to improve the adhesion efficiency and assembly of the protective film. The accuracy.

Another object of the present invention is to provide a method for forming a protective film on a wafer, which can easily attach a protective film to a wafer to uniformly and accurately adhere the protective film to the wafer.

It is still another object of the present invention to provide a method of forming a protective film on a wafer which allows the protective film to be placed in a group.

It is still another object of the present invention to provide a method of forming a protective film on a wafer by assembling a protective film on the wafer at a lower cost to save product cost.

In summary, according to one aspect of the present invention, a device for forming a protective film on a wafer is provided, comprising a cover assembly including an outer cover, at least one guiding rod and at least one pressing rod, the guiding rod being disposed on the outer cover On the second side, the pressing rod is coupled to the guiding rod to facilitate sliding on the guiding rod; a wafer disc is used to carry a plurality of wafers having a plurality of recesses therein to facilitate embedding a plurality of wafers therein; The substrate assembly is used for supporting the wafer tray and the fixed cover assembly. The substrate assembly comprises a substrate, at least one clamp and a support plate. The substrate is used for carrying the support plate and the clamp, and the clamp is disposed on two sides of the substrate to facilitate The outer cover assembly is clamped, the support plate has at least one elastic member for supporting the wafer disk, and a transfer film for carrying a plurality of protective film units to facilitate attaching the plurality of protective film units to the plurality of wafers.

The device further includes a guiding rod bracket for supporting the guiding rod and disposed on two sides of the outer cover, and a cushion placed on the supporting plate to support the plurality of wafers.

According to another aspect of the present invention, a method for forming a protective film on a wafer is provided, which comprises first providing a support plate for carrying a wafer disk to fix the position of the wafer disk, and a plurality of wafers can be disposed on the wafer disk; Then, a transfer film is provided, a plurality of protective film units are attached to the bottom surface thereof, and the transfer film is placed on a cover assembly; after that, the cover assembly is placed on the support plate to make the plurality of transfer films The protective film unit is aligned with the plurality of wafers on the wafer tray; next, the outer cover assembly is pressed by a clamp to attach a plurality of protective film units to the surface of the plurality of wafers; and then, using a guide rod a pressing rod is moved from the first end to the second end on the outer cover assembly; one end of the transfer film is pressed between the first pressing rod and the second pressing rod; and the transfer film and the outer cover are separated by using the moving transfer film; The jig is removed, and the cover assembly and the support plate are separated to complete a plurality of protective film units on the transfer transfer film over the plurality of wafers.

The method and apparatus for forming the protective film of the present invention on the wafer not only overcome the disadvantages of the prior art, but also effectively increase the efficiency and reliability of the method for forming the protective film on the wafer, and can greatly reduce the cost.

The invention will be described in detail below in conjunction with its preferred embodiments and the accompanying drawings. It should be understood that all of the preferred embodiments of the invention are intended to be illustrative only and not limiting. Therefore, the invention may be applied to other embodiments in addition to the preferred embodiments. The invention is not limited to any embodiment, but should be determined by the scope of the appended claims and their equivalents.

Hereinafter, preferred embodiments in accordance with the present invention will be described in detail with reference to the accompanying drawings. Further views and advantages of the novel inventive concept will be set forth in the description which follows, and the <RTIgt;

The present invention provides a device and method for forming a protective film on a wafer on a wafer level package, which can be applied to a wafer level package (CSP) wafer, a through-silicon via (TSV) wafer, and a leaded ceramic wafer. Products such as ceramic leaded chip carrier (CLCC) or MiniPak switch diode.

As shown in the first figure, it shows a schematic view of constituent components of a protective tape mounting apparatus for wafer level packaging according to the present invention. This device is merely an embodiment of the present invention and is not intended to limit the present invention. The device includes a housing plate set, a base plate set, a chip tray 104, and a transfer film (transfer). Tape) 110. The cover assembly is used to make the wafer position more precise and to tighten the positional tolerance of the wafer on the plane (X, Y axis). In addition, another function of the housing assembly is to handle the protective film taping process. The cover assembly includes a cover 107, a guide rod 108 and a guide rod holder 106, a press bar 109 and a press bar 111, wherein the cover 107 can be changed for different products. The outer cover 107 has pegs 107b and 107c to facilitate alignment and a plurality of dimples 107a, and the number of dimples 107a is based on the number of wafers allowed on the wafer disc. The guide rod bracket 106 is used to support the guide rod 108 and is disposed (fixed) on both sides of the outer cover 107. The pressing rod 109 and the pressing rod 111 are engaged with the guiding rod 108 to facilitate sliding on the guiding rod 108. The design of the guide rod 108 and the guide rod bracket 106 can be similar to a rail. The pressing rod 109 is used to press the transfer film 110 so that the protective film can be accurately attached to the surface of the wafer; and the pressing rod 111 is placed on the pressing rod 109 before the transfer film 110 is removed, in order to remove The period during which the film 110 is transferred is limited to the degree of freedom of the wafer in the vertical direction (Z-axis) so that the wafer remains in the wafer tray after the transfer film 110 is removed. Based on the design of the pressing rod 109 and the pressing rod 111, the protective film unit can be attached to the surface of the outer cover 107, and the transfer film 110 is quickly removed. The substrate assembly is used to support a tray module and to accurately secure the housing assembly, such as the wafer tray 104 and the wafer 105 thereon. The substrate assembly includes a substrate 100, at least one pair of toggle clamps 103, a support 101, and a cushion 102. The support plate 101 is disposed on the substrate 100 (for example, at the center ( The toggle clamps 103 are disposed on both sides of the substrate 100. During the transfer of the protective film unit, the cover 107 can be clamped onto the support plate 101 by the toggle clamps 103. The cushion 102, such as a rubber 102, is located above the support plate 101 (e.g., in the center (heart) region thereof) having a plurality of raised portions 102a corresponding to the placement of the wafer 104, and The wafer 104 is supported (high) during the protective film unit attachment process, and the wafer 104 is restricted from moving in the vertical direction (Z-axis). The substrate 100 is used to carry and assemble the support plate 101 and the toggle clamp 103.

In addition, the structure, use, and purpose of the above-described components will be described together in the underlying assembly method.

As shown in the second figure, it shows a schematic view of a support plate according to the invention. The support plate 101 is used to limit the position of the wafer tray 104 (please refer to the first figure) in the X, Y axis, and at least one suspension pin or elastic member 101a is designed in the support plate for supporting the wafer disk 104. It is located at each corner of the support plate 101. Depending on the operation of the cover panel assembly, and based on the design of the suspension pin 101a, the wafer tray 104 will move smoothly upward and downward. It is noted that the support plate 101 of the present invention includes the accommodating space 101b in a central (heart) region, such as the support plate cavity 101b, to facilitate carrying the rubber pad 102 and the wafer disk 104, and to fix the position of the wafer disk 104.

As shown in the third figure, it shows a schematic view of the design of the wafer disc according to the present invention. The wafer tray 104 is used to carry the wafer 105 (please refer to the first figure), and includes a plurality of recesses 104a for facilitating the embedding of a plurality of wafers 105 therein. The recesses 104a are, for example, lattice recesses, and the recesses 104a The depth allows the wafer 105 to pass over it. The recess 104a of the wafer tray 104 is placed one-to-one to accommodate (corresponding) the wafer 105. The hole 104b in the recess 104a corresponds to the raised portion 102a of the cushion 102 (please refer to the first figure). The wafer 105 is, for example, a wafer of a wafer level package, a twinned via (TSV) wafer, a leaded ceramic chip carrier (CLCC), or a MiniPak switch diode. The wafers 105 are arranged on the wafer disk 104 in an array. When the wafer tray 104 is pressed down, the raised portion 102a of the cushion 102 can pass through the hole 104b in the recess 104a of the wafer tray 104 to raise the wafer 105 in the recess 104a. In other words, the recess 104a of the wafer disc 104 of the present invention includes at least one through hole (hole) 104b through which the raised portion 102a of the cushion 102 can pass the wafer 105 during the pressing of the wafer disc 104. The support is raised so that the surface of the wafer 105 approaches the upper surface of the outer cover 107 (please refer to the first figure).

As shown in the fourth figure, it shows a schematic view of the structure of the transfer film module according to the present invention. In one embodiment, the transfer film assembly is composed of a two-layer material layer, and the first layer is a polyimide layer as a transfer film 110 for carrying a plurality of protective film units (protective film) The first layer 110a is a release film 110d and the transfer film 110 are bonded to each other, and a plurality of protective film units 110a are adhered or bonded between the transfer film 110 and the release film 110d. The transfer film 110, for example, the protective tape 110, has a plurality of protective film units 110a attached to the bottom surface thereof. In the structure of the transfer film 110, the upper and lower ends thereof include the transfer film openings 110b and 110c to facilitate alignment and bonding with the plug portions 107b and 107c (refer to the first figure) on the outer cover 107, respectively, with reference to the sixth drawing. The size of the transfer film 110 depends on the size of the wafer matrix on the wafer tray 104 (or the size of the recess 104a), please refer to the first figure.

Next, a method of forming a protective film on a wafer will be described next. First, the wafer tray 104 is placed on the elastic member 101a on the support plate 101, and the wafer wafer 104 has the wafer 105 placed therein, with reference to the fifth drawing. The wafer disk 104 carrying the wafer 105 is supported on the support plate 101 by the elastic member 101a.

The next step is to take a piece of the transfer film assembly, and remove the release film 110d to leave the transfer film 110 and the plurality of protective film units 110a attached thereto; after that, the transfer film 110 is placed on the cover 107 by The plug portions 107b and 107c on the outer cover 107 are aligned with the film opening 110b and 110c of the transfer film 110 (please refer to the fourth figure), so that the outer cover 107 and the transfer film 110 are bonded to each other, and the plurality of protective film units 110a are attached to each other. The transfer film 110 on the bottom surface is placed on the cover assembly (including the cover 107), with reference to the sixth figure. At this time, the recess 107a on the outer cover 107 is approximately aligned with the protective film unit 110a on the transfer film 110. For example, the size of the recess 107a in the outer cover 107 is approximately equal to the size of the protective film unit 110a, and the arrangement of the plurality of recesses 107a is in one-to-one correspondence with the plurality of protective film units 110a.

Next, the cover assembly (including the cover 107) to be bonded to the transfer film 110 is placed or fixed on the support plate 101, with reference to the seventh figure. The cover assembly will be supported by the wafer tray 104 (see Figure 5). At this time, the protective film unit 110a on the transfer film 110 is slightly aligned and bonded to the wafer 105 on the wafer wafer 104. The transfer film 110 is disposed below the pressure bar 109.

Thereafter, the cover assembly is first depressed to maintain a certain pressure, and then the at least one pair of toggle clamps 103 on the substrate assembly are pushed down to press the cover assembly such that the protective film unit 110a is attached and covers the surface of the wafer 105 on the wafer tray 104. Refer to the eighth picture.

Then, the pressing rod 109 is pushed (moved) from one end on the outer cover 107 to the other end along the guiding rod 108, and the guiding rod 108 reaches the other end on the outer cover 107, with reference to the ninth drawing. The transfer film 110 is disposed below the pressure bar 109 so that the lower pressure protection film unit 110a is not touched when the pressure bar 109 is pushed (refer to FIG. 8) to prevent the protection film unit 110a from being damaged.

Next, lift one end 110d of the transfer film 110 to contact the upper side of the presser bar 109, refer to the ninth diagram and the tenth diagram. Then, the pressing rod 111 is placed above the pressing rod 109, and the pressing rod opening 111a of the positioning pressing rod 109 is pressed by the pressing rod plug portion 111a (refer to the first figure) below the pressing rod 111, so that the pressing rod 111 is The pressing rods 109 are engaged with each other. At this time, one end of the transfer film 110 is located between the pressing rod 109 and the pressing rod 111, and the transfer film 110 is tightly pressed between the pressing rod 109 and the pressing rod 111, refer to the tenth b diagram.

The next step is to separate the transfer film 110 and the outer cover 107. The tensioning film 110 is pressed between the pressing rod 109 and the pressing rod 111 by the transfer film 110, so that the pressing rod 109 and the pressing rod 111 will be pulled along the guiding rod 108 together with the pulling of the transfer film 110. The transfer film 110 moves at the press-fit. When the pressing rod 109 and the pressing rod 111 are moved from the transfer film 110 to the other end, the transfer film 110 can be removed from the outer cover 107, referring to FIG.

Finally, remove the toggle clamp 103, see Figure 12a. And removing the entire cover assembly to separate the cover assembly and the support plate 101. At this time, the wafer 105 (refer to FIG. 5) is adhered to the clean protective film unit 110a to protect it from dust particles. Twelfth b.

It should be noted that the steps of moving, pushing, pressing, aligning, combining and separating between the above-mentioned parts of the present invention can be accomplished manually or automatically.

The method for forming a conventional protective film on a wafer has many disadvantages. The method for forming a protective film on a wafer of the present invention is superior to the method for forming a conventional protective film on a wafer, and has a method for forming a conventional protective film on a wafer. Unpredictable effects.

From the above, the apparatus for forming a protective film of the present invention on a wafer and a method of forming the same, the features and advantages thereof include:

1. With a variety of fixtures, it can improve the adhesion efficiency and assembly accuracy of the protective film.

2. With the attachment method of the jig, the protective film can be easily attached to the wafer, and the protective film can be uniformly and accurately attached to the wafer.

3. The protective film can be allowed to be placed in a group rather than a conventional single protective tape placed on a single wafer.

4. Attach a protective film to the wafer at a lower cost to save product cost.

The present invention has been described above by way of a preferred example, and is not intended to limit the spirit of the invention. Modifications and similar configurations made within the spirit and scope of the invention are intended to be included within the scope of the appended claims.

100. . . Substrate

101. . . Support plate

101a. . . Suspension bolt

101b. . . Housing space

102. . . Padded

102a. . . Raised portion

103. . . Elbow clamp

104. . . Chip tray

104a. . . pit

104b. . . Hole

105. . . Wafer

106. . . Guide rod bracket

107. . . Cover

107a. . . pit

107b, 107c. . . Bolt

108. . . Guide rod

109, 111. . . Pressure bar

109a. . . Pressure bar opening

110. . . Transfer film

110a. . . Protective film unit

110b, 110c. . . Transfer film opening

111a. . . Pressure bar plug

The above elements, as well as other features and advantages of the present invention, will become more apparent after reading the contents of the embodiments and the drawings thereof:

The first figure is a schematic view of constituent components of a protective tape assembling device for wafer level packaging according to the present invention.

The second figure is a schematic view of a support plate according to the invention.

The third figure is a schematic view of a wafer disk in accordance with the present invention.

The fourth figure is a schematic view of a transfer film module in accordance with the present invention.

The fifth drawing is a schematic view of a wafer disc placed on a support plate according to the present invention.

Figure 6 is a schematic illustration of a transfer film alignment cover in accordance with the present invention.

The seventh figure is a schematic view of the outer cover assembly placed on the support plate in accordance with the present invention.

The eighth figure is a schematic view of a pusher cover assembly for a toggle clamp in accordance with the present invention.

The ninth drawing is a schematic view of the push (shift) pressure bar to the other end thereof according to the present invention.

The tenth and tenth bth drawings are schematic views of the transfer film according to the present invention being pressed between the two pressure bars.

The eleventh drawing is a schematic view of a separate transfer film and a cover according to the present invention.

The twelfth and a twelfth drawings are schematic views of the separation cover assembly and the support plate according to the present invention.

100. . . Substrate

101. . . Support plate

102. . . Padded

102a. . . Raised portion

103. . . Elbow clamp

104. . . Chip tray

105. . . Wafer

106. . . Guide rod bracket

107. . . Cover

107a. . . pit

107b, 107c. . . Bolt

108. . . Guide rod

109, 111. . . Pressure bar

109a. . . Pressure bar opening

110. . . Transfer film

110a. . . Protective film unit

110b, 110c. . . Transfer film opening

111a. . . Pressure bar plug

Claims (10)

A device for forming a protective film on a wafer, comprising: a cover assembly comprising a cover, at least one guiding rod and at least one pressing rod, the guiding rod being disposed on two sides of the outer cover, the pressing rod being engaged with the guiding a substrate for facilitating sliding on the guiding rod; a wafer tray for carrying a plurality of wafers having a plurality of recesses therein for facilitating insertion of the plurality of wafers therein; a substrate assembly for supporting The substrate assembly includes a substrate, at least one clamp, a cushion, and a support plate. The substrate is used to carry the support plate and the clamp, and the clamp is disposed on the substrate. Above the side to facilitate clamping the outer cover, the cushion is placed on the support plate to support the plurality of wafers; and a transfer film is used to carry a plurality of protective film units to facilitate the plurality of protections A film unit is transferred over the plurality of wafers. The device for forming a protective film on a wafer according to claim 1, further comprising a guiding rod bracket for supporting the guiding rod and disposed on two sides of the outer cover. A device for forming a protective film on a wafer according to claim 1, wherein the support plate has at least one elastic member for supporting the wafer disk. A device for forming a protective film on a wafer according to claim 1, wherein the recess of the wafer tray includes at least one perforation, so that the convex portion of the cushion supports the wafer through the at least one perforation, so that The wafer surface is adjacent to the upper surface of the outer cover. A method of forming a protective film on a wafer, comprising: providing a support plate for carrying a wafer disk to fix a position of the wafer disk; the wafer disk can be configured with a plurality of wafers; and providing a transfer film having a plurality of The protective film unit is attached to the bottom surface thereof, and the transfer film is placed on a cover assembly; the cover assembly is placed on the support plate to align the plurality of protective film units on the transfer film The plurality of wafers on the wafer tray; the outer cover assembly is pressed by a clamp such that the plurality of protective film units are attached to the surface of the plurality of wafers; and a pressing rod is used to make a pressing rod on the outer cover assembly Moving from the first end to the second end; pressing one end of the transfer film between the first pressure bar and the second pressure bar; moving the transfer film to separate the transfer film and the cover; removing the clamp Separating the cover assembly from the support plate to complete transfer of the plurality of protective film units on the transfer film over the plurality of wafers. The method of forming a protective film on a wafer according to claim 5, further comprising providing a guiding rod bracket for supporting the guiding rod and disposed on two sides of the outer cover. The method of forming a protective film on a wafer according to claim 5, further comprising providing a cushion placed on the support plate to support the plurality of wafers. The method of claim 5, wherein the outer cover assembly comprises at least one guiding rod and at least one of the first pressing rod and the second pressing rod, wherein the guiding rod is disposed on On both sides of the cover, the pressing rod is coupled to the guiding rod to facilitate sliding on the guiding rod. The method for forming a protective film on a wafer according to claim 5, further comprising providing a substrate assembly for supporting the wafer tray and fixing the cover assembly, the substrate assembly comprising a substrate, at least one fixture and a support plate, The substrate is used to carry the support plate and the clamp, and the clamp is disposed on two sides of the substrate to facilitate clamping the cover. A method of forming a protective film on a wafer according to claim 5, wherein the support plate has at least one elastic member for supporting the wafer disk.