A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（丨） 發明領域 本發明係關於一種引腳架和一種測試夾具，可用測試積體電路晶粒， 更仔細地說，係關於一種用來對積體電路元件進行確認良好晶粒 (KGD)、確認良好基板（KGS)和確認良好模組（KGM)等測試的引 腳架和測試夾具。 發明背景 在基體電路晶片的製造過程中，需要對特定的晶粒進行某些測試，舉 例來說，像確認良好晶粒（KGD)、確認良好基板（KGS)和確認良好模 組（KGM)等測試。 傳統1C晶片製造技術中，晶片是從一片晶圓切割成晶粒而形成的。這 些晶片稱爲裸晶，因爲它們尙未封裝(或保護)在塑膠包裝中，所以環境中 的灰塵、水氣、輻射和溫差都很容易傷.害到這些裸晶。而且這些裸晶很 脆，也很小，更是容易受損。爲了避免損害晶片上的電路，裸晶在處理時 不能堆疊，必須小心地拿取。因此幾乎無法在裸晶上進行KGD測試、 在傳統的製造過程中，在切割晶粒之前，會在晶圓背面貼上一層黏性 捲帶，一直到晶粒切割之後，裸晶仍然黏著在黏性捲帶上。這樣就可以避 免切割之後，晶片遠離晶圓可能發生的任何潛在傷害。分割之後’就用真 空裝置將裸晶傳送至引腳架上的附著晶粒之腳座。所以’裸晶需要的任何 測試都要在分割之前，晶片還固定在晶圓上時進行(通稱爲晶圓測試）。有 問題的晶片會打上墨印，在送往晶片接合製程之前再從其他的晶片篩選出 來。這種測試方法的缺點是無法保證裸晶在晶粒切割分離之後仍然良好。 因此，最好能找出一種測試方法，可以在裸晶剛剛自晶圓分離’以及傳送 至附著晶粒之腳座時，進行測試。當然’這需要使晶粒附著腳座自引腳架 中獨立出來。 木紙張纽適用中國國家梯準（CNS )八4鄕_ ( 21()><297公着） 83. 3.10,000 (請先閲讀背面之注意事項再填寫本頁) ---k.1 -----^-------TItTJ-----0i--1------l·---1 經濟部中央標準局員工消費合作社印製 A7 _ B7_.__五、發明説明（2·) 因此本發明的目的是提出一種方法與裝置，可以將吸熱器以可拆卸的 方式固定在引腳架上，這樣一來當安裝ic晶粒之後，就可將吸熱器從引腳 架卸下，以便測試晶粒。 本發明另一個目的是提出一種方法與裝置，可以將吸熱器以可拆卸的 方式固定在引腳架上，然後將1C晶粒安裝在吸熱器上，這樣一來就可以將 1C晶粒連同吸熱器一同從弓圓架卸下，以便進行測試。 發明的簡要說明 本發明提出一種測試板，可將裸晶連接到引腳架上，以便進行晶粒的 測試。這種測試板在底部具有一個導電的表面，可用來啣接並連接到引腳 架上的引腳線（lead finger)。另外還需預備捲帶式自動接合的捲帶，上面 有導電引腳和第一與第二導電凸塊，其中第一導電凸塊位在引腳的頂面， 第二導電凸塊則位在引腳的底面。第一與第二導電凸塊可以透過導電引腳 建立彼此的電性通路。第一導電凸塊同時也連於測試板的導電表面，而第 二導電凸塊則用來啣接I/O銲墊，所以可以透過弓丨腳架來測試裸晶。 本發明另外提出一種測試裸晶的裝置，利用一種引腳架固持片，使引 腳架固定在從引腳架向外延伸的引腳線上。同時，還提出一種測試板，可 以將夾具固持在引腳架固持片的固定位置上。這種固持片可用來固定住測 試板，並可用來調整測試板的X、Y和Z平面的位置。測試板底部有一個導 電的表面，可用來啣接並連接到引腳架上的引腳線（lead finger)，同時也 連於透過黏性裝置黏著了裸晶的吸熱器，此吸熱器的週邊區域則緊鄰於引 腳架固持片。在第一測試板固定夾具還啣接了一種光學或其他裝置，以便 用來調整測試板相對於裸晶的位置。我們也提出一種捲帶式自動接合 (TAB)的捲帶。 <請先閲讀背面之注意事項再填寫本頁) -裝. 〇 11 訂· Θ 4- 木紙張尺度逋用中國國家橾準（CNS )八4规格（21〇><297公瘦） 83. 3.10,000 -4· 一 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（3) 附圖的簡要說明 參考底下的詳細說明與附圖後，可以更加瞭解本發明的其他目的、特 .徵和優點，所附附圖分別是： 圖1是本發明具體實施例的透視圖， 圖2是本發明具體實施例的側視圖， 圖3是測試板的透視圖， 圖4是彈簧板安裝元件的透視圖。 實施例的詳細說明 圖1的元件10，是根據本發明的具體實施例作成的。這個元件10大致 上包含了引腳夾具12、機械支撐14、CCD固持夾具16、CCD頭18、金屬固 持片20、調整螺絲22和晶粒24。晶粒24是由一個引腳固持夾具26固定在位 置上的。金屬固持片20定位後，可以將引腳架28固定在弓丨腳架固持夾具Π 上。在引腳架28周圍環繞著TAB捲帶30 〇另有一個TAB捲帶32則環繞在引 腳架28的內引腳線上。CCD頭18和CCD固持夾具16是用來對準晶粒24，然 後加以定位並固定在引腳架28上。 圖2是元件10的橫剖面圖。其中可以看到機械支撐14正安裝在金屬固 持片20上。機械支撐14的一隻手臂40會對引腳固持夾具26提供一個向下的 壓力，以固定引腳架28。弓丨腳架28有一根引腳線，正位在一個安裝彈簧的 定位塊42上方，這個定位塊在圖4還會更詳細地加以說明。安裝彈簧的定 位塊42會對引腳架28提供一個大致上向上的壓力。 値得注意的是，當形成安裝彈簧的定位塊42時，所用來壓縮成彈簧的 金屬，其硬度或彈性常數都有很多的選擇。在材料上有很大的選擇空間， 所以當製作安裝彈簧的定位塊42時，也有很多種的製作方式，可以針對各 種特定的應用，選擇金屬厚度、金屬種類和金屬的彈性常數等各種參數。 本紙張尺度適用中國國家梂準（CNS ) A4規格（210><297公釐） -'S'- 83. 3. 10,000 C -- ) -----装---------丨訂-------線 U (請先閲讀背面之注意事項再填寫本頁) A7 B7 五、發明説明（个) 在吸熱器44上有一個表面可用來黏著安裝彈簧的定位塊42。此外，晶 粒24也透過暫時的黏性裝置（未畫出）固定在吸熱器44上。這種用來將1C 晶粒24接合在吸熱器44上的黏性裝置可以是一種高導熱的黏著劑。其中一 種適用的黏著劑是帶有錫一類之導電金屬粉末的熱固化高分子。但是，這 種黏著裝置必需使晶粒24在測試後，還可以卸下來。 TAB捲帶46上有第一導電銲錫凸塊48和第二導電銲錫凸塊50。第一凸 塊48位在晶粒24上方，當測試板54以大致向下的方向移動時，可以接觸到 晶粒24。在TAB捲帶46上方有一個彈性塊52，作爲一種彈性的支撐裝置。 測試板54位在彈性塊52上方，作爲黏著TAB捲帶46的裝置。在彈性塊52上 有一個彈性的墊片55。引腳架28有一個導電的凸塊56，所在的位置可以接 觸到測試板58的導電部位。這會從引腳架28、穿過凸塊56、測試板58、凸 塊50、凸塊48、最後到晶粒24，建立起一個電性通路。有了這種電性通 路，毋需將晶粒24永久地固定在吸熱器44或固定在引腳架28上，就可以對 晶粒24進行測試。真空管60會穿過彈性塊52和彈性墊片55，可以對晶粒24 產生一個吸力。 機械支撐14包含微細的調整機構22，可以在X、Y和Z的方向上作微細 的調整。放在XY平面以前，會先參考CCD頭18的透明玻璃上的對 準軸（未^) 〇這個對準軸作爲XY調整的基礎，當晶片或基板接合到吸 熱器44上而產生座標差異時，就可以加以校正。 經濟部中央標準局負工消費合作社印製 現在請參考圖3，這是組裝測試板58的爆炸圖。測試板58位在彈性墊 片52、彈性塊52、彈性墊片55、連接片53。測試板58上有一個孔70 ’使彈 性塊52得以定位。彈性塊52和彈性墊片55各有一個孔60，使我們可以在晶 粒24上產生真空。連接片53上的真空槽會產生出真空孔60。連接片53可以 用來連接CCD安裝夾具16。 測試板58有數個I/O銲墊72，在TAB捲帶46和晶粒24之間形成電性連 接。這些I/O銲墊72也可作爲連接晶粒與外接測試裝置（未畫出）的裝置。 83· 110,000 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS〉A4規格（210X297公釐） 一 *6— A7 B7 五、發明説明（y) 要測試特定的晶粒24時，TAB捲帶46必需特別設計，以便接觸到需要進行 測試之晶粒的各個部位。凸塊5〇都位在測試板58的相同部位上，這樣對各 種晶粒24都可使用同樣的測試板。但是’可以製作特別的TAB捲帶46，以 .便提供凸塊50與晶粒24之間特定的連接。結果，對特定的晶粒24而言，只 有TAB捲帶46需要特別製作。這樣一來，外接的測試元件就可使用同樣的 測試板58，來測試各種不同的晶粒24，使成本大大降低。 圖4將安裝彈簧的定位塊42說明得更淸楚。安裝彈簧的定位塊42位在 吸熱器44內。正如上面與討論圖2時提及的，安裝彈簧的定位塊42可以設 ' 計成具有特別的硬度，以便使弓丨腳架28的弓丨腳線與測試板58之間有適當的 連接。這種連接必需穩固到足以形成固定的電性連接，但又鬆弛到避免元 件10的任何組件受到損害。 本發明的方法與裝置的主要好處是如果需要，晶粒24可以不必永久地 加以接合，就能進行KGD (確認良好晶粒）測試或KGS (確認良好基板） 測試。所有的傳統方法中，吸熱器都是永久地接合在引腳架上，所以不能 將晶粒24叢引腳架上卸下，在對晶粒24進行測試。但對本發明的設計而 言，測試之後如果需要修復晶粒24時’也可進行修復。 以上的說明雖然透過舉例加以說明’但應可瞭解’所用的字彙都是爲 著敘述的目的，而不是爲著限制本發明的範圍。 此外，以上的說明雖然是藉著最佳實施例加以仔細闡述，但可瞭解熟 習本技藝的人士都能f晒這些原理得到本發明的其他變化。 經濟部中央標準局員工消費合作社印製 G P I 1-----^-- (請先閲讀背面之注意事項再填寫本頁) © -線· 底下將以申請專利範圍來聲明本發明之具體實施例’及其專屬之財產 權和專有權。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 83_ 3· 10,000 —/7-A7 B7 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs V. Description of the Invention (丨) Field of the Invention The present invention relates to a lead frame and a test fixture, which can be used to test the integrated circuit die. More specifically, it is about a Lead frames and test fixtures used to test integrated circuit components for good die (KGD), good substrate (KGS), and good module (KGM) tests. BACKGROUND OF THE INVENTION During the manufacturing process of a substrate circuit wafer, certain tests are required on specific die, such as confirming good die (KGD), confirming good substrate (KGS), confirming good module (KGM), etc. test. In the traditional 1C wafer manufacturing technology, a wafer is formed by cutting a wafer into dies. These chips are called bare chips, because they are not packaged (or protected) in plastic packaging, so dust, moisture, radiation, and temperature differences in the environment are easily injured. And these bare crystals are very brittle, very small, and even more vulnerable to damage. To avoid damaging the circuitry on the wafer, bare chips cannot be stacked during processing and must be handled with care. Therefore, it is almost impossible to perform the KGD test on the bare die. In the traditional manufacturing process, before the die is cut, a layer of adhesive tape is pasted on the back of the wafer. After the die is cut, the bare die is still sticking to the adhesive. Sex tape on. This avoids any potential damage that might occur to the wafer after dicing. After the segmentation ', the vacuum die is used to transfer the bare crystals to the die-attach feet on the lead frame. Therefore, any test required for the 'bare die' should be performed before the singulation while the wafer is still fixed on the wafer (commonly known as wafer testing). Distressed wafers are imprinted and screened from other wafers before being sent to the wafer bonding process. The disadvantage of this test method is that there is no guarantee that the bare crystal will still be good after the die is cut and separated. Therefore, it is better to find a test method that can be used to test the bare die just after it has been separated from the wafer 'and transferred to the die holder with the die attached. Of course, this requires that the die attach feet be separated from the lead frame. Wood and paper buttons are applicable to China National Standards of Standards (CNS) 8 4 鄕 _ (21 () > < 297) 83. 3.10,000 (Please read the precautions on the back before filling this page) --- k. 1 ----- ^ ------- TItTJ ----- 0i--1 ------ l · --- 1 Printed by A7 _ B7_. __V. Description of the invention (2 ·) Therefore, the object of the present invention is to propose a method and device that can detachably fix the heat sink on the lead frame, so that after the IC die is installed, it can be Remove the heat sink from the lead frame to test the die. Another object of the present invention is to provide a method and device that can detachably fix the heat sink on the lead frame, and then install the 1C die on the heat sink, so that the 1C die can be absorbed together with heat The tester is removed from the bow frame for testing. Brief Description of the Invention The present invention proposes a test board that can connect a bare die to a lead frame for die testing. This test board has a conductive surface at the bottom that can be used to connect and connect to the lead fingers on the leadframe. In addition, it is necessary to prepare a tape-type automatic splicing tape with conductive pins and first and second conductive bumps on it, where the first conductive bump is located on the top surface of the pin and the second conductive bump is located on The underside of the pin. The first and second conductive bumps can establish electrical paths with each other through the conductive pins. The first conductive bump is also connected to the conductive surface of the test board, while the second conductive bump is used to connect the I / O pads, so the bare crystal can be tested through the bow and foot. The invention also proposes a device for testing bare crystals, which uses a lead frame holding piece to fix the lead frame on a pin line extending outward from the lead frame. At the same time, a test board is also proposed, which can hold the fixture in the fixed position of the lead frame holding piece. This holding piece can be used to hold the test board and can be used to adjust the position of the test board's X, Y, and Z planes. The bottom of the test board has a conductive surface that can be used to connect and connect to the lead fingers on the lead frame. It is also connected to a heat sink that has a bare crystal adhered through an adhesive device. The area is next to the lead frame holding piece. An optical or other device is connected to the first test board fixing fixture to adjust the position of the test board relative to the die. We also propose a tape-and-tape (TAB) tape. < Please read the notes on the back before filling in this page) -Packing. 〇11 Order · Θ 4-Wood paper size, using China National Standards (CNS) 8-4 specifications (21〇 > < 297 male thin) 83. 3.10,000 -4 · A7 B7 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (3) Brief description of the drawings After referring to the detailed description and drawings below, you can understand more about other aspects of the present invention. Purpose, features, and advantages, the attached drawings are: Figure 1 is a perspective view of a specific embodiment of the present invention, Figure 2 is a side view of a specific embodiment of the present invention, Figure 3 is a perspective view of a test board, Figure 4 Is a perspective view of the spring plate mounting element. Detailed description of the embodiment The element 10 of Fig. 1 is made according to a specific embodiment of the present invention. This element 10 roughly includes a pin holder 12, a mechanical support 14, a CCD holding holder 16, a CCD head 18, a metal holding piece 20, an adjusting screw 22, and a die 24. The die 24 is held in place by a pin holding jig 26. After the metal holding piece 20 is positioned, the lead frame 28 can be fixed on the arch holding frame Π. A TAB tape 30 is wrapped around the lead frame 28. Another TAB tape 32 is wrapped around the inner lead of the lead frame 28. The CCD head 18 and the CCD holding jig 16 are used to align the die 24, and then they are positioned and fixed on the lead frame 28. FIG. 2 is a cross-sectional view of the element 10. It can be seen that the mechanical support 14 is being mounted on the metal retaining sheet 20. An arm 40 of the mechanical support 14 provides a downward pressure to the pin holding jig 26 to fix the pin holder 28. The bow pedestal 28 has a pin line and is positioned above a spring-mounted positioning block 42. This positioning block will be described in more detail in FIG. The spring-mounted positioning block 42 provides a substantially upward pressure on the lead frame 28. It should be noted that, when the spring-mounted positioning block 42 is formed, there are many options for the hardness or elastic constant of the metal used to compress the spring. There is a lot of choice in materials, so when manufacturing the spring-mounted positioning block 42, there are also many manufacturing methods. For various specific applications, various parameters such as metal thickness, metal type and metal elastic constant can be selected. This paper size is applicable to China National Standard (CNS) A4 specification (210 > < 297 mm) -'S'- 83. 3. 10,000 C-) ------------------------- -丨 Order ------- Line U (Please read the precautions on the back before filling this page) A7 B7 V. Description of the invention (a) There is a surface on the heat sink 44 which can be used to adhere to the positioning block for the spring 42. In addition, the crystal particles 24 are also fixed to the heat sink 44 by a temporary adhesive device (not shown). The adhesive device for bonding the 1C die 24 to the heat sink 44 may be a highly thermally conductive adhesive. One suitable adhesive is a thermosetting polymer with a conductive metal powder such as tin. However, this adhesive device must allow the die 24 to be removed after testing. The TAB tape 46 has a first conductive solder bump 48 and a second conductive solder bump 50. The first bump 48 is located above the die 24, and when the test plate 54 is moved in a generally downward direction, it can contact the die 24. An elastic block 52 is provided above the TAB tape 46 as an elastic supporting device. The test plate 54 is positioned above the elastic block 52 as a device for adhering the TAB tape 46. An elastic spacer 55 is provided on the elastic block 52. The lead frame 28 has a conductive bump 56 which can be located in contact with the conductive portion of the test board 58. This will establish an electrical path from the lead frame 28, through the bump 56, the test board 58, the bump 50, the bump 48, and finally to the die 24. With this electrical path, the die 24 can be tested without permanently fixing the die 24 to the heat sink 44 or to the lead frame 28. The vacuum tube 60 passes through the elastic block 52 and the elastic gasket 55, and can generate a suction force on the die 24. The mechanical support 14 includes a fine adjustment mechanism 22, which can make fine adjustments in the X, Y, and Z directions. Before placing on the XY plane, the alignment axis (not ^) on the transparent glass of the CCD head 18 will be referred first. This alignment axis is used as the basis for XY adjustment. , You can correct it. Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs Now refer to FIG. 3, which is an exploded view of the assembled test board 58. The test board 58 is located on the elastic pad 52, the elastic block 52, the elastic pad 55, and the connecting piece 53. The test plate 58 has a hole 70 'to allow the elastic block 52 to be positioned. The elastic block 52 and the elastic spacer 55 each have a hole 60 so that we can create a vacuum on the crystal particles 24. The vacuum groove 60 on the connecting piece 53 generates a vacuum hole 60. The connecting piece 53 can be used to connect the CCD mounting jig 16. The test board 58 has a number of I / O pads 72, which form an electrical connection between the TAB tape 46 and the die 24. These I / O pads 72 can also be used as a device for connecting the die to an external test device (not shown). 83 · 110,000 (Please read the precautions on the back before filling in this page) The paper size applies to Chinese national standards (CNS> A4 specification (210X297 mm) One * 6—A7 B7 V. Description of invention (y) To test specific When the die 24, the TAB tape 46 must be specially designed so as to contact the various parts of the die that need to be tested. The bumps 50 are located on the same part of the test board 58, so that all kinds of die 24 can be used The same test board. But 'A special TAB tape 46 can be made to provide a specific connection between the bump 50 and the die 24. As a result, for a specific die 24, only the TAB tape 46 is required Specially made. In this way, the external test component can use the same test board 58 to test a variety of different die 24, which greatly reduces the cost. Figure 4 illustrates the spring-mounted positioning block 42 more clearly. Installation The spring positioning block 42 is located in the heat absorber 44. As mentioned above and in the discussion of FIG. 2, the spring-mounted positioning block 42 may be designed to have a special hardness so that the bow 丨 the foot of the foot 28 There is a suitable distance between the line and the test board 58 This connection must be strong enough to form a fixed electrical connection, but loose enough to avoid damage to any component of the element 10. The main benefit of the method and device of the present invention is that the die 24 need not be permanent if needed After bonding, the KGD (Confirm Good Die) test or the KGS (Confirm Good Substrate) test can be performed. In all conventional methods, the heat sink is permanently bonded to the lead frame, so the die cannot be pulled in a cluster. Remove the tripod and test the die 24. However, for the design of the present invention, if the die 24 needs to be repaired after the test, the repair can also be performed. Although the above description is illustrated by examples, it should be understood 'The vocabulary used is for the purpose of narrative, not to limit the scope of the present invention. In addition, although the above description is explained in detail through the preferred embodiment, anyone skilled in the art can understand Apply these principles to other changes of the present invention. The GPI printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 1 ----- ^-(Please read the note on the back first (Please fill in this page again) © -line · The scope of the patent application will be used to declare the specific embodiments of the invention 'and its exclusive property rights and exclusive rights. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 Cents) 83_ 3 · 10,000 — / 7-