TWI389247B - Fixing jig of wire bonding machine and window type clamp thereof - Google Patents

Fixing jig of wire bonding machine and window type clamp thereof Download PDF

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Publication number
TWI389247B
TWI389247B TW098125939A TW98125939A TWI389247B TW I389247 B TWI389247 B TW I389247B TW 098125939 A TW098125939 A TW 098125939A TW 98125939 A TW98125939 A TW 98125939A TW I389247 B TWI389247 B TW I389247B
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Taiwan
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window
plate
top abutting
carrier plate
carrier
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TW098125939A
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Chinese (zh)
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TW201013833A (en
Inventor
In-Ho Kim
Hee-Seok Ryu
Dae-Guen Kim
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Advanced Semiconductor Eng
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Publication of TWI389247B publication Critical patent/TWI389247B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a fixing fixture of a throwing machine table and the window-type press board thereof. The window-type press board is used for pressing the upper surface of a bearing board, and comprises a press board body, at least one window hole, and at least one cushion device, wherein the window hole passes through the press plate body for exposing the partial upper surface of the bearing board, the cushion device is arranged outside the window hole and comprises a butting end, when the window-type press board presses the upper surface of the bearing board, the butting end supports against the upper surface of the bearing board; when the window-type press board is lifted up, the butting end pushes the bearing board away downwards to prevent the bearing board from being liftedup along with the window-type press board. Thus, the warping of the bearing board can be avoided, and thereby improving the yield.

Description

打線機台之固定治具及其窗型壓板Fixing fixture for wire machine and window type pressure plate

本發明係關於一種固定治具及其壓板，詳言之，係關於一種打線機台之固定治具及其窗型壓板。The present invention relates to a fixing jig and a pressing plate thereof. More specifically, it relates to a fixing jig of a wire bonding machine and a window type pressing plate thereof.

參考圖1，顯示習知打線機台之固定治具1之分解示意圖。該固定治具1係用以固定一承載板21以利打線製程，該承載板21包括一上表面211及一下表面212，複數個晶片22係黏附於該承載板21。該固定治具1包括一熱板11、二軌道12及一窗型壓板13。該熱板11包括一吸附面111，用以支撐該承載板21之下表面212且提供熱能至該承載板21。該等軌道12係位於該熱板11之二側，以支撐該承載板21之二側。該窗型壓板13係用以壓合該承載板21之上表面211，其包括一壓板本體131、至少一窗孔132及複數個壓條133。該窗孔132貫穿該壓板本體131，用以顯露該承載板21之部分上表面211。部分該等壓條133係位於該窗孔132內，且互相交錯而定義出複數個開口134。該等壓條133更包括複數條側壓條1331，該等側壓條1331係位於該窗型壓板13背面之兩側(如圖2所示)。Referring to Fig. 1, there is shown an exploded view of a fixed jig 1 of a conventional wire splicing machine. The fixing fixture 1 is used for fixing a carrier plate 21 for the wire bonding process. The carrier plate 21 includes an upper surface 211 and a lower surface 212. The plurality of wafers 22 are adhered to the carrier plate 21. The fixture 1 includes a hot plate 11, two rails 12, and a window platen 13. The hot plate 11 includes an adsorption surface 111 for supporting the lower surface 212 of the carrier plate 21 and providing thermal energy to the carrier plate 21. The rails 12 are located on two sides of the hot plate 11 to support the two sides of the carrier plate 21. The window pressing plate 13 is configured to press the upper surface 211 of the carrier plate 21 and includes a pressing plate body 131, at least one window hole 132 and a plurality of pressing strips 133. The window hole 132 extends through the platen body 131 to expose a portion of the upper surface 211 of the carrier plate 21. A portion of the bead 133 is located within the aperture 132 and interdigitated to define a plurality of openings 134. The bead 133 further includes a plurality of side pressing strips 1331 which are located on both sides of the back surface of the window type pressing plate 13 (as shown in FIG. 2).

參考圖3，顯示習知打線機台之固定治具之應用俯視示意圖。在半導體製程之一打線製程中，首先，該承載板21被置於該等軌道12上，且該熱板11之吸附面111支撐該承載板21之下表面212且提供熱能至該承載板21。接著，該窗型壓板13向下壓合於該承載板21，其中每一該等開口134係對應每一該等晶片22，而後進行打線。完成打線後，該窗型壓板13向上提升，以利該承載板21依循運送方向前進，使尚未打線之晶片22前進至一預定位置。之後，該窗型壓板13再向下壓合該承載板21，以進行下一次打線作業。Referring to Figure 3, there is shown a top plan view of the application of the fixed fixture of the conventional wire bonding machine. In one of the wiring processes of the semiconductor process, first, the carrier 21 is placed on the rails 12, and the adsorption surface 111 of the hot plate 11 supports the lower surface 212 of the carrier 21 and provides thermal energy to the carrier 21 . Then, the window platen 13 is pressed down to the carrier plate 21, wherein each of the openings 134 corresponds to each of the wafers 22, and then the wires are wired. After the wire is completed, the window platen 13 is lifted upward to facilitate the carrier plate 21 to advance in the conveying direction, so that the untwisted wafer 22 is advanced to a predetermined position. Thereafter, the window platen 13 presses the carrier plate 21 downward again for the next wire bonding operation.

然而以習知打線機台之固定治具1進行打線之缺點如下。當該窗型壓板13向上提升時，該承載板21因和該窗型壓板13間之表面張力而向上翹曲(如圖4所示)，而不利後續製程。習知解決方法係增加該窗型壓板13向下壓合之壓力，藉此使已翹曲之承載板21被壓平。然而該習知解決方法產生另一缺點，由於該等側壓條1331會壓到該等軌道12與該熱板11間之部分該承載板21，因此當該窗型壓板13增加向下壓合之壓力時，該等側壓條1331會將部分該承載板21壓入該等軌道12與該熱板11間之間隙，而在該承載板21上產生壓痕，且使該承載板21產生翹曲(如圖5所示)。如此，在接續之灌模(Molding)製程中，液態之封膠材料會經由該壓痕而溢出，導致封裝失敗。However, the shortcomings of the conventional jig 1 of the conventional wire-making machine are as follows. When the window platen 13 is lifted upward, the carrier plate 21 is warped upward due to the surface tension between the window platen 13 (as shown in FIG. 4), which is disadvantageous for subsequent processes. The conventional solution is to increase the pressure at which the window-type pressure plate 13 is pressed downward, whereby the warped carrier plate 21 is flattened. However, this conventional solution has another disadvantage in that the side press bars 1331 are pressed against a portion of the carrier plate 21 between the rails 12 and the hot plate 11, so that the window press plate 13 is pressed downwardly. When the pressure is applied, the side pressing strips 1331 press a portion of the carrier plate 21 into the gap between the rails 12 and the hot plate 11, and an indentation is generated on the carrier plate 21, and the carrier plate 21 is warped. (As shown in Figure 5). Thus, in the subsequent molding process, the liquid sealing material overflows through the indentation, resulting in packaging failure.

因此，有必要提供一種創新且具進步性的打線機台之固定治具及其窗型壓板，以解決上述問題。Therefore, it is necessary to provide an innovative and progressive wire fixing machine fixture and its window type pressure plate to solve the above problems.

本發明提供一種打線機台之固定治具，用以固定一承載板以利打線製程，該承載板包括一上表面及一下表面，複數個晶片係黏附於該承載板，該固定治具包括一熱板及一窗型壓板。該熱板包括一吸附面，用以支撐該承載板之下表面且提供熱能至該承載板。該窗型壓板用以壓合該承載板之上表面，包括一壓板本體、至少一窗孔及至少一緩衝裝置。該窗孔貫穿該壓板本體，用以顯露該承載板之部分上表面。該緩衝裝置位於該窗孔之外，其包括一頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵該承載板之上表面，當該窗型壓板向上提升時，該頂抵端向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。藉此，不需如習知技術增加向下壓合之壓力，如此可避免承載板翹曲之情況，進而提升良率。The present invention provides a fixing fixture for a wire bonding machine for fixing a carrier plate for a wire bonding process, the carrier plate includes an upper surface and a lower surface, and a plurality of wafers are adhered to the carrier plate, and the fixing fixture includes a Hot plate and a window type pressure plate. The hot plate includes an adsorption surface for supporting a lower surface of the carrier and providing thermal energy to the carrier. The window type pressing plate is used for pressing the upper surface of the carrying board, and comprises a pressing plate body, at least one window hole and at least one buffering device. The window hole extends through the platen body to expose a portion of the upper surface of the carrier plate. The buffer device is located outside the window, and includes a top end. When the window press plate presses the upper surface of the carrier plate, the top abutting end abuts against the upper surface of the carrier plate when the window type When the pressure plate is lifted upward, the top abutting end pushes the carrier plate downward to prevent the carrier plate from being lifted up together with the window type pressure plate. Thereby, it is not necessary to increase the pressure of the downward pressing as in the prior art, so that the warpage of the carrier plate can be avoided, thereby improving the yield.

在一較佳實施例中，該緩衝裝置包括一彈性體及一頂抵塊，該彈性體包括一固定端及一自由端，該固定端係固設於該壓板本體，該頂抵塊之一端連接該彈性體之自由端，另一端係為該頂抵端。In a preferred embodiment, the cushioning device includes an elastic body and a top abutting block. The elastic body includes a fixed end and a free end. The fixed end is fixed to the pressure plate body, and one end of the top abutting block The free end of the elastomer is attached and the other end is the abutment end.

在一較佳實施例中，該緩衝裝置係為一彈性片體，該彈性片體之一端係為一固定端，固設於該壓板本體，另一端係為該頂抵端，該彈性片體與該壓板本體具有一角度。In a preferred embodiment, the cushioning device is an elastic sheet body, and one end of the elastic sheet body is a fixed end fixed to the pressure plate body, and the other end is the top abutting end, the elastic piece body It has an angle with the platen body.

在一較佳實施例中，該緩衝裝置係為一彈性緩衝層，其具有一上表面及一下表面，該上表面係為一固定端，附著於該壓板本體，該下表面係為該頂抵端。In a preferred embodiment, the buffering device is an elastic buffer layer having an upper surface and a lower surface. The upper surface is a fixed end attached to the pressure plate body, and the lower surface is the top surface. end.

在一較佳實施例中，該緩衝裝置係為一活動塊體，該活動塊體包括一支撐部及一頂抵部，該支撐部係位於該容置空間內，該支撐部之面積係大於該頂抵開口之面積，以防止該支撐部掉出該容置空間，該頂抵部之下端係為該頂抵端，該頂抵部之面積係小於該頂抵開口之面積，使得該頂抵部可以於該頂抵開口內移動。In a preferred embodiment, the buffering device is a movable block. The movable block includes a supporting portion and a top abutting portion. The supporting portion is located in the receiving space, and the supporting portion has an area larger than The top surface of the opening is prevented from falling out of the receiving space, and the lower end of the top abutting portion is the top abutting end, and the area of the top abutting portion is smaller than the area of the top abutting opening, so that the top The abutting portion can move within the top abutting opening.

參考圖6，顯示本發明打線機台之固定治具3A之第一實施例之分解示意圖。該固定治具3A係用以固定一承載板23以利打線製程，該承載板23包括一上表面231及一下表面232，複數個晶片24係黏附於該承載板23。在本實施例中，該承載板23係可為一基板條(Substrate Strip)或一導線架(Leadframe)，該等晶片24係黏附於該承載板23之上表面231。該固定治具3A包括一熱板4及一窗型壓板5。在本實施例中，該固定治具3A更包括二條軌道6，該等軌道6係位於該熱板4之二側，以支撐該承載板23之二側。該熱板4包括一吸附面41，用以支撐該承載板23之下表面232且提供熱能至該承載板23。在其他應用中，該熱板4更包括複數個吸氣孔，該等吸氣孔連通至該吸附面41。Referring to Fig. 6, there is shown an exploded perspective view of the first embodiment of the fixing jig 3A of the wire bonding machine of the present invention. The fixing fixture 3A is used for fixing a carrier plate 23 for the wire bonding process. The carrier plate 23 includes an upper surface 231 and a lower surface 232. The plurality of wafers 24 are adhered to the carrier plate 23. In this embodiment, the carrier 23 can be a substrate strip or a lead frame, and the wafers 24 are adhered to the upper surface 231 of the carrier 23 . The fixing jig 3A includes a hot plate 4 and a window type pressing plate 5. In this embodiment, the fixing jig 3A further includes two rails 6 on the two sides of the hot plate 4 to support the two sides of the carrier plate 23. The hot plate 4 includes an adsorption surface 41 for supporting the lower surface 232 of the carrier plate 23 and providing thermal energy to the carrier plate 23. In other applications, the hot plate 4 further includes a plurality of suction holes that communicate with the adsorption surface 41.

該窗型壓板5係用以壓合該承載板23之上表面231，其包括一壓板本體51、至少一窗孔52及至少一緩衝裝置57。在本實施例中，該窗型壓板5更包括複數條壓條53，該等壓條53包括複數條側壓條531(如圖7及圖8所示)，該等側壓條531係位於該窗型壓板5之背面兩側。部分該等壓條53係位於該窗孔52內，且互相交錯而定義出複數個開口54，每一該等開口54係對應每一該等晶片24(如圖9所示)。該窗孔52貫穿該壓板本體51，用以顯露該承載板23之部分上表面231。在本實施例中，該窗孔52係顯露該等晶片24。The window platen 5 is for pressing the upper surface 231 of the carrier plate 23 and includes a platen body 51, at least one window hole 52 and at least one buffering device 57. In this embodiment, the window-type pressure plate 5 further includes a plurality of strips 53 including a plurality of side strips 531 (shown in FIGS. 7 and 8), and the side strips 531 are located on the window-type platen. 5 on the back sides. A portion of the beading strips 53 are located in the apertures 52 and are interleaved to define a plurality of openings 54, each of which corresponds to each of the wafers 24 (as shown in FIG. 9). The window hole 52 extends through the platen body 51 to expose a portion of the upper surface 231 of the carrier plate 23. In the present embodiment, the apertures 52 expose the wafers 24.

該緩衝裝置57位於該窗孔52之外，該緩衝裝置57包括一頂抵端561(如圖10所示)。當該窗型壓板5壓合該承載板23之上表面231時，該頂抵端561係頂抵該承載板23之上表面231，當該窗型壓板5向上提升時，該頂抵端561向下推開該承載板23，以防止該承載板23被連同該窗型壓板5一起向上提升。The cushioning device 57 is located outside the window opening 52. The cushioning device 57 includes a top abutting end 561 (shown in FIG. 10). When the window platen 5 presses the upper surface 231 of the carrier plate 23, the abutting end 561 abuts against the upper surface 231 of the carrier plate 23. When the window platen 5 is lifted upward, the abutting end 561 The carrier plate 23 is pushed down to prevent the carrier plate 23 from being lifted up together with the window platen 5.

參考圖10及圖11，顯示本發明打線機台之固定治具3A之作動示意圖，其中圖10係沿著圖9之線10-10之剖面示意圖。圖10顯示該窗型壓板5向下壓合之示意圖。圖11顯示該窗型壓板5向上提升之示意圖。配合參考圖9，在本實施例中，該緩衝裝置57位於該等側壓條531上，且該緩衝裝置57包括一彈性體55及一頂抵塊56，該彈性體55係為一彈簧，包括一固定端551及一自由端552，該固定端551係固設於該壓板本體51，該頂抵塊56係為一球體，其一端連接該彈性體55之自由端552，另一端係為該頂抵端561。此外，該壓板本體51更包括至少一凹槽511，該彈性體55之該固定端551係固定於該凹槽511內，且該頂抵塊56係於該凹槽511內移動。本實施例之作動方式如下。Referring to Figures 10 and 11, there is shown a schematic diagram of the operation of the fixed fixture 3A of the wire bonding machine of the present invention, wherein Figure 10 is a schematic cross-sectional view taken along line 10-10 of Figure 9. Fig. 10 is a view showing the window type press plate 5 pressed downward. Figure 11 shows a schematic view of the window type platen 5 being lifted upward. With reference to FIG. 9, in the present embodiment, the buffering device 57 is located on the side bead 531, and the cushioning device 57 includes an elastic body 55 and a top abutting block 56. The elastic body 55 is a spring, including A fixed end 551 and a free end 552 are fixed to the platen body 51. The top abutting block 56 is a ball, one end of which is connected to the free end 552 of the elastic body 55, and the other end is the same The top end 561. In addition, the platen body 51 further includes at least one groove 511. The fixed end 551 of the elastic body 55 is fixed in the groove 511, and the top abutting block 56 moves in the groove 511. The mode of operation of this embodiment is as follows.

參考圖10，當該窗型壓板5壓合該承載板23之上表面231時，該頂抵塊56之頂抵端561係頂抵該承載板23之上表面231，該彈性體55係為壓縮狀態。接著參考圖11，當該窗型壓板5向上提升時，該頂抵端561受該彈性體55彈力而向下推開該承載板23，以防止該承載板23被連同該窗型壓板5一起向上提升。Referring to FIG. 10, when the window platen 5 presses the upper surface 231 of the carrier plate 23, the top abutting end 561 of the top abutting block 56 abuts against the upper surface 231 of the carrier plate 23. The elastic body 55 is Compressed state. Referring to FIG. 11, when the window type pressing plate 5 is lifted upward, the top abutting end 561 is elastically biased by the elastic body 55 to push the carrying plate 23 downward to prevent the carrying plate 23 from being together with the window type pressing plate 5. Go up.

參考圖12，顯示本發明打線機台之固定治具3B之第二實施例之示意圖，其中該窗型壓板7係壓合該承載板23。參考圖13，顯示本發明打線機台之固定治具3B之第二實施例之窗型壓板7向上提升之示意圖。本實施例之固定治具3B與該第一實施例之固定治具3A(圖6)大致相同，其中相同之元件賦予相同之編號。本實施例與該第一實施例之不同處在於該壓板本體71及該緩衝裝置77之結構不同。在本實施例中，該壓板本體71不具有任何凹槽，該緩衝裝置77係為一彈性緩衝層75，其材質係為橡膠，且具有一上表面及一下表面，該上表面係為一固定端751，附著於該壓板本體71。該下表面係為一頂抵端752。參考圖12，當該窗型壓板7壓合該承載板23之上表面231時，該頂抵端752係頂抵該承載板23之上表面231，該彈性緩衝層75係為壓縮狀態。參考圖13，當該窗型壓板7向上提升時，該頂抵端752受該彈性緩衝層75之回復力而向下推開該承載板23，以防止該承載板23被連同該窗型壓板7一起向上提升。Referring to Fig. 12, there is shown a schematic view of a second embodiment of the fixing jig 3B of the wire bonding machine of the present invention, wherein the window type pressing plate 7 presses the carrier plate 23. Referring to Fig. 13, there is shown a schematic view showing the upward movement of the window type press plate 7 of the second embodiment of the fixing jig 3B of the wire bonding machine of the present invention. The fixing jig 3B of the present embodiment is substantially the same as the fixing jig 3A (FIG. 6) of the first embodiment, wherein the same elements are given the same reference numerals. The difference between this embodiment and the first embodiment is that the structure of the pressure plate body 71 and the buffer device 77 are different. In this embodiment, the platen body 71 does not have any grooves. The buffer device 77 is an elastic buffer layer 75 made of rubber and has an upper surface and a lower surface. The upper surface is fixed. The end 751 is attached to the platen body 71. The lower surface is a top abutment end 752. Referring to FIG. 12, when the window platen 7 presses the upper surface 231 of the carrier plate 23, the abutting end 752 abuts against the upper surface 231 of the carrier plate 23. The elastic buffer layer 75 is in a compressed state. Referring to FIG. 13, when the window platen 7 is lifted upward, the abutting end 752 is pushed downward by the restoring force of the elastic buffer layer 75 to prevent the carrier plate 23 from being attached to the window platen. 7 lift up together.

參考圖14，顯示本發明打線機台之固定治具3C之第三實施例之示意圖，其中該窗型壓板8係壓合該承載板23。參考圖15，顯示本發明打線機台之固定治具3C之第三實施例之窗型壓板8向上提升之示意圖。本實施例之固定治具3C與該第一實施例之固定治具3A(圖6)大致相同，其中相同之元件賦予相同之編號。本實施例與該第一實施例之不同處在於該壓板本體81及該緩衝裝置87之結構不同。在本實施例中，該壓板本體81不具有任何凹槽，該緩衝裝置87係為一彈性片體85，該彈性片體85之一端係為一固定端851，固設於該壓板本體81，另一端係為一頂抵端852。參考圖14，當該窗型壓板8壓合該承載板23之上表面231時，該頂抵端852係頂抵該承載板23之上表面231，且該彈性片體85產生形變。參考圖15，當該窗型壓板8向上提升時，該頂抵端852受該彈性片體85之回復力而向下推開該承載板23，以防止該承載板23被連同該窗型壓板8一起向上提升。此時，該彈性片體85與該壓板本體81具有一角度。Referring to Fig. 14, there is shown a schematic view of a third embodiment of the fixing jig 3C of the wire bonding machine of the present invention, wherein the window type pressing plate 8 presses the carrier plate 23. Referring to Fig. 15, there is shown a schematic view showing the upward movement of the window type pressure plate 8 of the third embodiment of the fixing jig 3C of the wire bonding machine of the present invention. The fixing jig 3C of the present embodiment is substantially the same as the fixing jig 3A (FIG. 6) of the first embodiment, wherein the same elements are given the same reference numerals. The difference between this embodiment and the first embodiment is that the structure of the pressure plate body 81 and the buffer device 87 are different. In this embodiment, the pressure plate body 81 does not have any recesses, and the buffering device 87 is an elastic sheet body 85. One end of the elastic sheet body 85 is a fixed end 851, and is fixed to the pressure plate body 81. The other end is a top abutment 852. Referring to FIG. 14, when the window platen 8 presses the upper surface 231 of the carrier plate 23, the abutting end 852 abuts against the upper surface 231 of the carrier plate 23, and the elastic piece 85 is deformed. Referring to FIG. 15, when the window platen 8 is lifted upward, the abutting end 852 is pushed downward by the restoring force of the elastic piece 85 to prevent the carrier plate 23 from being attached to the window platen. 8 lift up together. At this time, the elastic sheet body 85 has an angle with the platen body 81.

參考圖16，顯示本發明打線機台之固定治具3D之第四實施例之示意圖，其中該窗型壓板9係壓合該承載板23。參考圖17，顯示本發明打線機台之固定治具3D之第四實施例之窗型壓板9向上提升之示意圖。本實施例之固定治具3D與該第一實施例之固定治具3A(圖6)大致相同，其中相同之元件賦予相同之編號。本實施例與該第一實施例之不同處在於該壓板本體91及該緩衝裝置97之結構不同。在本實施例中，該壓板本體91更包括至少一容置空間911，該容置空間911包括一頂抵開口912。該緩衝裝置97係為一活動塊體95，該活動塊體95包括一支撐部951及一頂抵部952。該支撐部951係位於該容置空間911內，該支撐部951之面積係大於該頂抵開口912之面積，以防止該支撐部951掉出該容置空間911。該頂抵部952之下端係為一頂抵端953，該頂抵部952之面積係小於該頂抵開口912之面積，使得該頂抵部952可以於該頂抵開口912內移動。參考圖16，當該窗型壓板9壓合該承載板23之上表面231時，該頂抵部952之該頂抵端953係頂抵該承載板23之上表面231。參考圖17，當該窗型壓板9向上提升時，由於該活動塊體95之重力作用，使得該頂抵部952之該頂抵端953向下推開該承載板23，以防止該承載板23被連同該窗型壓板9一起向上提升。Referring to Fig. 16, there is shown a schematic view of a fourth embodiment of the fixing jig 3D of the wire bonding machine of the present invention, wherein the window type pressing plate 9 presses the carrier plate 23. Referring to Fig. 17, there is shown a schematic view showing the upward movement of the window type press plate 9 of the fourth embodiment of the fixing jig 3D of the wire bonding machine of the present invention. The fixing jig 3D of the present embodiment is substantially the same as the fixing jig 3A (Fig. 6) of the first embodiment, wherein the same elements are given the same reference numerals. The difference between this embodiment and the first embodiment is that the structure of the pressure plate body 91 and the buffer device 97 are different. In this embodiment, the platen body 91 further includes at least one accommodating space 911, and the accommodating space 911 includes a top abutting opening 912. The cushioning device 97 is a movable block 95. The movable block 95 includes a supporting portion 951 and a top abutting portion 952. The support portion 951 is located in the accommodating space 911. The area of the support portion 951 is larger than the area of the top abutment opening 912 to prevent the support portion 951 from falling out of the accommodating space 911. The lower end of the abutting portion 952 is a top abutting end 953. The area of the abutting portion 952 is smaller than the area of the abutting opening 912, so that the abutting portion 952 can move within the abutting opening 912. Referring to FIG. 16, when the window platen 9 presses the upper surface 231 of the carrier plate 23, the top abutting end 953 of the abutting portion 952 abuts against the upper surface 231 of the carrier plate 23. Referring to FIG. 17, when the window type pressing plate 9 is lifted upward, the top abutting end 953 of the abutting portion 952 pushes the supporting plate 23 downward to prevent the carrying plate due to the gravity of the movable block 95. 23 is lifted up together with the window type platen 9.

藉此，在本發明中，該窗型壓板5,7,8,9之緩衝裝置57,77,87,97係提供一下推力以推開該承載板23，以防止該承載板23連同該窗型壓板5,7,8,9一起向上提升。因而不需如習知技術增加向下壓合之壓力，如此可避免承載板23翹曲之情況，進而提升良率。Thereby, in the present invention, the cushioning devices 57, 77, 87, 97 of the window-type pressure plates 5, 7, 8, 9 provide a lower thrust to push the carrier plate 23 to prevent the carrier plate 23 from being attached to the window. The pressure plates 5, 7, 8, and 9 are lifted together. Therefore, it is not necessary to increase the pressure of the downward pressing as in the prior art, so that the warpage of the carrier plate 23 can be avoided, thereby improving the yield.

惟上述實施例僅為說明本發明之原理及其功效，而非用以限制本發明。因此，習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明之權利範圍應如後述之申請專利範圍所列。However, the above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims.

1．．．習知打線機台之固定治具1. . . Conventional fixture for the wire machine

3A．．．本發明打線機台之固定治具之第一實施例3A. . . First embodiment of the fixing fixture of the wire bonding machine of the invention

3B．．．本發明打線機台之固定治具之第二實施例3B. . . Second embodiment of the fixing fixture of the wire bonding machine of the invention

3C．．．本發明打線機台之固定治具之第三實施例3C. . . Third embodiment of the fixing fixture of the wire bonding machine of the invention

3D．．．本發明打線機台之固定治具之第四實施例3D. . . Fourth embodiment of the fixing fixture of the wire bonding machine of the present invention

4．．．熱板4. . . Hot plate

5．．．本發明窗型壓板之第一實施例5. . . First embodiment of window type pressure plate of the invention

6．．．軌道6. . . track

7．．．本發明窗型壓板之第二實施例7. . . Second embodiment of window type pressure plate of the invention

8．．．本發明窗型壓板之第三實施例8. . . Third embodiment of window type pressure plate of the invention

9．．．本發明窗型壓板之第四實施例9. . . Fourth embodiment of the window type pressure plate of the present invention

11．．．熱板11. . . Hot plate

12．．．軌道12. . . track

13．．．窗型壓板13. . . Window platen

21．．．承載板twenty one. . . Carrier board

22．．．晶片twenty two. . . Wafer

23．．．承載板twenty three. . . Carrier board

24．．．晶片twenty four. . . Wafer

41．．．吸附面41. . . Adsorption surface

51．．．壓板本體51. . . Platen body

52．．．窗孔52. . . Window hole

53．．．壓條53. . . Layering

54．．．開口54. . . Opening

55．．．彈性體55. . . Elastomer

56．．．頂抵塊56. . . Topping block

57．．．緩衝裝置57. . . Buffer device

71．．．壓板本體71. . . Platen body

75．．．彈性緩衝層75. . . Elastic buffer layer

77．．．緩衝裝置77. . . Buffer device

81．．．壓板本體81. . . Platen body

85．．．彈性片體85. . . Elastic sheet

87．．．緩衝裝置87. . . Buffer device

91．．．壓板本體91. . . Platen body

95．．．活動塊體95. . . Active block

97．．．緩衝裝置97. . . Buffer device

111．．．吸附面111. . . Adsorption surface

131．．．壓板本體131. . . Platen body

132．．．窗孔132. . . Window hole

133．．．壓條133. . . Layering

134．．．開口134. . . Opening

211．．．上表面211. . . Upper surface

212．．．下表面212. . . lower surface

231．．．上表面231. . . Upper surface

232．．．下表面232. . . lower surface

511．．．凹槽511. . . Groove

531．．．側壓條531. . . Side bead

551．．．固定端551. . . Fixed end

552．．．自由端552. . . Free end

561．．．頂抵端561. . . Top end

751．．．固定端751. . . Fixed end

752．．．頂抵端752. . . Top end

851．．．固定端851. . . Fixed end

852．．．頂抵端852. . . Top end

911．．．容置空間911. . . Housing space

912．．．頂抵開口912. . . Top opening

951．．．支撐部951. . . Support

952．．．頂抵部952. . . Top abutment

953．．．頂抵端953. . . Top end

1331．．．側壓條1331. . . Side bead

圖1顯示習知打線機台之固定治具之分解示意圖；Figure 1 is a schematic exploded view showing a fixed fixture of a conventional wire tying machine;

圖2顯示習知窗型壓板之背面之透視示意圖；Figure 2 is a schematic perspective view showing the back of a conventional window type pressure plate;

圖3顯示習知打線機台之固定治具之應用俯視示意圖；Figure 3 is a top plan view showing the application of the fixed fixture of the conventional wire tying machine;

圖4顯示沿著圖3之線4-4之剖面示意圖；Figure 4 shows a schematic cross-sectional view along line 4-4 of Figure 3;

圖5顯示習知窗型壓板壓合承載板之剖面示意圖；Figure 5 is a cross-sectional view showing a conventional window type press plate pressing carrier plate;

圖6顯示本發明打線機台之固定治具之第一實施例之分解示意圖；Figure 6 is a schematic exploded view showing the first embodiment of the fixing jig of the wire bonding machine of the present invention;

圖7顯示本發明窗型壓板之第一實施例之背面之透視示意圖；Figure 7 is a perspective view showing the back side of the first embodiment of the window type press plate of the present invention;

圖8顯示圖7之局部放大圖；Figure 8 shows a partial enlarged view of Figure 7;

圖9顯示本發明打線機台之固定治具之第一實施例之應用俯視示意圖；Figure 9 is a top plan view showing the application of the first embodiment of the fixing jig of the wire bonding machine of the present invention;

圖10顯示沿著圖9之線10-10之剖面示意圖；Figure 10 is a cross-sectional view taken along line 10-10 of Figure 9;

圖11顯示本發明打線機台之固定治具之第一實施例之窗型壓板向上提升之剖面示意圖；Figure 11 is a cross-sectional view showing the upward movement of the window type pressure plate of the first embodiment of the fixing jig of the wire bonding machine of the present invention;

圖12顯示本發明打線機台之固定治具之第二實施例之窗型壓板壓合承載板之示意圖；Figure 12 is a schematic view showing a window type press plate pressing carrier plate of a second embodiment of the fixing jig of the wire bonding machine of the present invention;

圖13顯示本發明打線機台之固定治具之第二實施例之窗型壓板向上提升之示意圖；Figure 13 is a schematic view showing the upward movement of the window type pressure plate of the second embodiment of the fixing jig of the wire bonding machine of the present invention;

圖14顯示本發明打線機台之固定治具之第三實施例之窗型壓板壓合承載板之示意圖；Figure 14 is a schematic view showing a window type press plate pressing carrier plate of a third embodiment of the fixing jig of the wire bonding machine of the present invention;

圖15顯示本發明打線機台之固定治具之第三實施例之窗型壓板向上提升之示意圖；Figure 15 is a view showing the upward lifting of the window type pressure plate of the third embodiment of the fixing jig of the wire bonding machine of the present invention;

圖16顯示本發明打線機台之固定治具之第四實施例之窗型壓板壓合承載板之示意圖；及Figure 16 is a view showing a window type press plate pressing carrier plate of a fourth embodiment of the fixing jig of the wire bonding machine of the present invention;

圖17顯示本發明打線機台之固定治具之第四實施例之窗型壓板向上提升之示意圖。Fig. 17 is a view showing the upward lifting of the window type pressure plate of the fourth embodiment of the fixing jig of the wire bonding machine of the present invention.

3A．．．本發明打線機台之固定治具之第一實施例3A. . . First embodiment of the fixing fixture of the wire bonding machine of the invention

4．．．熱板4. . . Hot plate

5．．．本發明窗型壓板之第一實施例5. . . First embodiment of window type pressure plate of the invention

6．．．軌道6. . . track

23．．．承載板twenty three. . . Carrier board

24．．．晶片twenty four. . . Wafer

41．．．吸附面41. . . Adsorption surface

51．．．壓板本體51. . . Platen body

52．．．窗孔52. . . Window hole

53．．．壓條53. . . Layering

54．．．開口54. . . Opening

55．．．彈性體55. . . Elastomer

56．．．頂抵塊56. . . Topping block

57．．．緩衝裝置57. . . Buffer device

231．．．上表面231. . . Upper surface

232．．．下表面232. . . lower surface

511．．．凹槽511. . . Groove

551．．．固定端551. . . Fixed end

552．．．自由端552. . . Free end

561．．．頂抵端561. . . Top end

Claims (32)

一種打線機台之固定治具，用以固定一承載板以利打線製程，該承載板包括一上表面及一下表面，複數個晶片係黏附於該承載板，該固定治具包括：一熱板，包括一吸附面，用以支撐該承載板之下表面且提供熱能至該承載板；及一窗型壓板，用以壓合該承載板之上表面，包括：一壓板本體；至少一窗孔，貫穿該壓板本體，用以顯露該承載板之部分上表面；及至少一緩衝裝置，位於該窗孔之外，該緩衝裝置包括一頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵該承載板之上表面，當該窗型壓板向上提升時，該頂抵端向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。A fixing fixture for a wire bonding machine for fixing a carrier plate for a wire bonding process, the carrier plate comprising an upper surface and a lower surface, wherein a plurality of wafers are adhered to the carrier plate, the fixing fixture comprises: a hot plate The utility model comprises an adsorption surface for supporting a lower surface of the carrier plate and providing thermal energy to the carrier plate, and a window type pressing plate for pressing the upper surface of the carrier plate, comprising: a platen body; at least one window hole a portion of the upper surface of the platen for exposing the platen; and at least one buffering device located outside the window, the buffering device includes a top abutting end, and the window platen presses the carrier plate When the upper surface is abutted against the upper surface of the carrier plate, when the window plate is lifted upward, the abutting end pushes the carrier plate downward to prevent the carrier plate from being coupled with the window platen Lift up together. 如請求項1之治具，其中該承載板係為一基板條(Substrate Strip)。The jig of claim 1, wherein the carrier board is a Substrate Strip. 如請求項1之治具，其中該承載板係為一導線架(Leadframe)。The jig of claim 1, wherein the carrier board is a lead frame. 如請求項1之治具，其中該窗型壓板更包括複數條壓條，部分該等壓條係位於該窗孔內，且互相交錯而定義出複數個開口，每一該等開口係對應每一該等晶片。The jig of claim 1, wherein the window presser further comprises a plurality of strips, wherein the bead is located in the window and interdigitated to define a plurality of openings, each of the openings corresponding to each Wait for the wafer. 如請求項1之治具，其中該等晶片係黏附於該承載板之上表面，該窗型壓板之該窗孔係顯露該等晶片。The jig of claim 1, wherein the wafers are adhered to an upper surface of the carrier plate, and the window of the window platen exposes the wafers. 如請求項1之治具，其中該熱板更包括複數個吸氣孔，該等吸氣孔連通至該吸附面。The jig of claim 1, wherein the hot plate further comprises a plurality of suction holes that communicate with the adsorption surface. 如請求項1之治具，其中該緩衝裝置包括一彈性體及一頂抵塊，該彈性體包括一固定端及一自由端，該固定端係固設於該壓板本體，該頂抵塊之一端連接該彈性體之自由端，另一端係為該頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵塊之頂抵端係頂抵該承載板之上表面，該彈性體係為壓縮狀態，當該窗型壓板向上提升時，該頂抵端受該彈性體之彈力而向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The fixture of claim 1, wherein the cushioning device comprises an elastic body and a top abutting block, the elastic body comprising a fixed end and a free end, the fixed end being fixed to the pressure plate body, the top abutting block One end is connected to the free end of the elastic body, and the other end is the top abutting end. When the window type pressing plate presses the upper surface of the supporting plate, the top abutting end of the top abutting block is topped against the upper surface of the supporting plate The elastic system is in a compressed state. When the window-shaped pressure plate is lifted upward, the top abutting end is pushed downward by the elastic force of the elastic body to prevent the carrier plate from being lifted up together with the window type pressure plate. . 如請求項7之治具，其中該壓板本體更包括至少一凹槽，該彈性體之該固定端係固定於該凹槽內，且該頂抵塊係於該凹槽內移動。The jig of claim 7, wherein the platen body further comprises at least one groove, the fixed end of the elastic body is fixed in the groove, and the top abutting block is moved in the groove. 如請求項7之治具，其中該彈性體係為一彈簧，該頂抵塊係為一球體。The jig of claim 7, wherein the elastic system is a spring, and the top abutting block is a sphere. 如請求項1之治具，其中該緩衝裝置係為一彈性片體，該彈性片體之一端係為一固定端，固設於該壓板本體，另一端係為該頂抵端，該彈性片體與該壓板本體具有一角度，當該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵該承載板之上表面，且該彈性片體產生形變，當該窗型壓板向上提升時，該頂抵端受該彈性片體之回復力而向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The jig of claim 1, wherein the buffer device is an elastic piece, and one end of the elastic piece is a fixed end, and is fixed to the plate body, and the other end is the top end, the elastic piece The body has an angle with the platen body. When the window platen presses the upper surface of the carrier plate, the top abutting end abuts against the upper surface of the carrier plate, and the elastic piece body is deformed when the window type When the pressure plate is lifted upward, the top abutting end is pushed downward by the restoring force of the elastic piece to push the carrier plate upward to prevent the carrier plate from being lifted up together with the window type pressure plate. 如請求項1之治具，其中該緩衝裝置係為一彈性緩衝層，其具有一上表面及一下表面，該上表面係為一固定端，附著於該壓板本體，該下表面係為該頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵該承載板之上表面，該彈性緩衝層係為壓縮狀態，當該窗型壓板向上提升時，該頂抵端受該彈性緩衝層之回復力而向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The jig of claim 1, wherein the buffer device is an elastic buffer layer having an upper surface and a lower surface, the upper surface being a fixed end attached to the platen body, the lower surface being the top When the window pressing plate presses the upper surface of the carrier plate, the top abutting end abuts against the upper surface of the carrier plate, and the elastic buffer layer is in a compressed state. When the window type pressing plate is lifted upward, The top abutting end is pushed downward by the restoring force of the elastic buffer layer to prevent the carrier plate from being lifted up together with the window type pressure plate. 如請求項11之治具，其中該彈性緩衝層之材質係為橡膠。The jig of claim 11, wherein the elastic buffer layer is made of rubber. 如請求項1之治具，其中該壓板本體更包括至少一容置空間，該容置空間包括一頂抵開口，該緩衝裝置係為一活動塊體，該活動塊體包括一支撐部及一頂抵部，該支撐部係位於該容置空間內，該支撐部之面積係大於該頂抵開口之面積，以防止該支撐部掉出該容置空間，該頂抵部之下端係為該頂抵端，該頂抵部之面積係小於該頂抵開口之面積，使得該頂抵部可以於該頂抵開口內移動，當該窗型壓板壓合該承載板之上表面時，該頂抵部之該頂抵端係頂抵該承載板之上表面，當該窗型壓板向上提升時，由於該活動塊體之重力作用，使得該頂抵部之該頂抵端向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The fixture of claim 1, wherein the pressure plate body further comprises at least one accommodating space, the accommodating space comprises a top opening, the buffering device is a movable block, and the movable block comprises a supporting portion and a a top abutting portion, the supporting portion is located in the accommodating space, the area of the supporting portion is larger than the area of the abutting opening to prevent the supporting portion from falling out of the accommodating space, and the lower end of the apical abutting portion is the The top abutting portion has an area smaller than an area of the top abutting opening, such that the top abutting portion can move within the top abutting opening, and when the window type pressing plate presses the upper surface of the carrying plate, the top The top abutting end of the abutting portion abuts against the upper surface of the carrying plate. When the window pressing plate is lifted upward, the top abutting end of the abutting portion is pushed downward due to the gravity of the movable block. The carrier is supported to prevent the carrier from being lifted up together with the window platen. 一種窗型壓板，用以壓合一承載板之上表面，複數個晶片係黏附於該承載板，包括：一壓板本體；至少一窗孔，貫穿該壓板本體，用以顯露該承載板之部分上表面；及至少一緩衝裝置，位於該窗孔之外，該緩衝裝置包括一頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵該承載板之上表面，當該窗型壓板向上提升時，該頂抵端向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。A window type pressing plate for pressing a top surface of a carrier board, wherein a plurality of wafers are adhered to the carrier board, comprising: a pressure plate body; at least one window hole extending through the pressure plate body for exposing a part of the carrier board An upper surface; and at least one buffering device is located outside the window hole, the buffering device includes a top abutting end, and when the window type pressing plate presses the upper surface of the carrying plate, the top abutting end is abutted against the supporting plate The upper surface, when the window-type pressure plate is lifted upward, the top abutting end pushes the carrier plate downward to prevent the carrier plate from being lifted up together with the window-shaped pressure plate. 如請求項14之窗型壓板，其中該承載板係為一基板條(Substrate Strip)。The window type pressure plate of claim 14, wherein the carrier plate is a Substrate Strip. 如請求項14之窗型壓板，其中該承載板係為一導線架(Leadframe)。The window type pressure plate of claim 14, wherein the carrier plate is a lead frame. 如請求項14之窗型壓板，更包括複數條壓條，部分該等壓條係位於該窗孔內，且互相交錯而定義出複數個開口，每一該等開口係對應每一該等晶片。The window type platen of claim 14 further comprising a plurality of strips, wherein the strips are located within the aperture and interdigitated to define a plurality of openings, each of the openings corresponding to each of the wafers. 如請求項14之窗型壓板，其中該等晶片係黏附於該承載板之上表面，該窗型壓板之該窗孔係顯露該等晶片。The window-type platen of claim 14, wherein the wafers are adhered to an upper surface of the carrier plate, the window of the window platen exposing the wafers. 如請求項14之窗型壓板，其中該緩衝裝置包括一彈性體及一頂抵塊，該彈性體包括一固定端及一自由端，該固定端係固設於該壓板本體，該頂抵塊之一端連接該彈性體之自由端，另一端係為該頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵塊之頂抵端係頂抵該承載板之上表面，該彈性體係為壓縮狀態，當該窗型壓板向上提升時，該頂抵端受該彈性體之彈力而向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The window-type pressure plate of claim 14, wherein the buffering device comprises an elastic body and a top abutting block, the elastic body comprises a fixed end and a free end, the fixed end is fixed to the pressing plate body, and the top abutting block One end is connected to the free end of the elastic body, and the other end is the top abutting end. When the window type pressing plate presses the upper surface of the supporting plate, the top abutting end of the top abutting block is topped against the supporting plate The surface of the elastic system is in a compressed state. When the window-shaped pressure plate is lifted upward, the top abutting end is pushed downward by the elastic force of the elastic body to prevent the carrier plate from being lifted together with the window type pressure plate. Upgrade. 如請求項19之窗型壓板，其中該壓板本體更包括至少一凹槽，該彈性體之該固定端係固定於該凹槽內，且該頂抵塊係於該凹槽內移動。The window-type pressure plate of claim 19, wherein the pressure plate body further comprises at least one groove, the fixed end of the elastic body is fixed in the groove, and the top abutting block is moved in the groove. 如請求項19之窗型壓板，其中該彈性體係為一彈簧，該頂抵塊係為一球體。The window type pressure plate of claim 19, wherein the elastic system is a spring, and the top abutting block is a sphere. 如請求項14之窗型壓板，其中該緩衝裝置係為一彈性片體，該彈性片體之一端係為一固定端，固設於該壓板本體，另一端係為該頂抵端，該彈性片體與該壓板本體具有一角度，當該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵該承載板之上表面，且該彈性片體產生形變，當該窗型壓板向上提升時，該頂抵端受該彈性片體之回復力而向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The window type pressure plate of claim 14, wherein the buffering device is an elastic piece body, and one end of the elastic piece body is a fixed end fixed to the pressure plate body, and the other end is the top abutting end, the elasticity The sheet body has an angle with the platen body. When the window type pressing plate presses the upper surface of the carrier plate, the top abutting end is abutted against the upper surface of the carrier plate, and the elastic piece body is deformed when the window is When the type pressure plate is lifted upward, the top abutting end is pushed downward by the restoring force of the elastic piece to push the carrier plate upward to prevent the carrier plate from being lifted up together with the window type pressure plate. 如請求項14之窗型壓板，其中該緩衝裝置係為一彈性緩衝層，其具有一上表面及一下表面，該上表面係為一固定端，附著於該壓板本體，該下表面係為該頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵端係頂抵該承載板之上表面，該彈性緩衝層係為壓縮狀態，當該窗型壓板向上提升時，該頂抵端受該彈性緩衝層之回復力而向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The window type pressure plate of claim 14, wherein the buffering device is an elastic buffer layer having an upper surface and a lower surface, the upper surface being a fixed end attached to the pressure plate body, wherein the lower surface is the same a top abutting end, when the window pressing plate presses the upper surface of the carrier plate, the top abutting end is abutted against the upper surface of the carrier plate, and the elastic buffer layer is in a compressed state, when the window type pressing plate is lifted upward The top abutting end is pushed downward by the restoring force of the elastic buffer layer to prevent the carrier plate from being lifted up together with the window type pressure plate. 如請求項23之窗型壓板，其中該彈性緩衝層之材質係為橡膠。The window type pressure plate of claim 23, wherein the elastic buffer layer is made of rubber. 如請求項14之窗型壓板，其中該壓板本體更包括至少一容置空間，該容置空間包括一頂抵開口，該緩衝裝置係為一活動塊體，該活動塊體包括一支撐部及一頂抵部，該支撐部係位於該容置空間內，該支撐部之面積係大於該頂抵開口之面積，以防止該支撐部掉出該容置空間，該頂抵部之下端係為該頂抵端，該頂抵部之面積係小於該頂抵開口之面積，使得該頂抵部可以於該頂抵開口內移動，當該窗型壓板壓合該承載板之上表面時，該頂抵部之該頂抵端係頂抵該承載板之上表面，當該窗型壓板向上提升時，由於該活動塊體之重力作用，使得該頂抵部之該頂抵端向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。The window-type pressure plate of claim 14, wherein the pressure plate body further comprises at least one accommodating space, the accommodating space comprises a top abutting opening, the buffering device is a movable block body, and the movable block body comprises a supporting portion and a top portion, the support portion is located in the accommodating space, and the area of the support portion is larger than the area of the top abutment opening to prevent the support portion from falling out of the accommodating space, and the lower end of the apex portion is The top abutting end has an area smaller than an area of the top abutting opening, so that the top abutting portion can move within the top abutting opening, when the window type pressing plate presses the upper surface of the carrying plate, The top abutting end of the abutting portion is abutted against the upper surface of the carrying plate. When the window pressing plate is lifted upward, the top end of the abutting portion is pushed downward due to the gravity of the movable block. The carrier plate prevents the carrier board from being lifted up together with the window type pressure plate. 一種窗型壓板，用以壓合一承載板之上表面，複數個晶片係黏附於該承載板，包括：一壓板本體，包括至少一容置空間，該容置空間包括一頂抵開口；至少一窗孔，貫穿該壓板本體，用以顯露該承載板之部分上表面；及至少一緩衝裝置，位於該窗孔之外，該緩衝裝置係為一活動塊體，該活動塊體包括一支撐部及一頂抵部，該支撐部係位於該容置空間內，該頂抵部之下端係為該頂抵端，當該窗型壓板壓合該承載板之上表面時，該頂抵部之該頂抵端係頂抵該承載板之上表面，當該窗型壓板向上提升時，由於該活動塊體之重力作用，使得該頂抵部之該頂抵端向下推開該承載板，以防止該承載板被連同該窗型壓板一起向上提升。A window-type pressure plate for pressing a surface of a carrier plate, wherein a plurality of wafers are adhered to the carrier plate, comprising: a platen body comprising at least one receiving space, the receiving space comprising a top opening; at least a window hole extending through the plate body for exposing a portion of the upper surface of the carrier plate; and at least one buffer device located outside the window hole, the buffer device being a movable block, the movable block including a support And a top portion, the support portion is located in the accommodating space, and the lower end of the top abutting portion is the top abutting end, and the apex portion is pressed when the window type pressing plate presses the upper surface of the carrying plate The top abutting end is abutted against the upper surface of the carrying plate. When the window pressing plate is lifted upward, the top abutting end of the abutting portion pushes the supporting plate downward due to the gravity of the movable block. To prevent the carrier plate from being lifted up together with the window-type pressure plate. 如請求項26之窗型壓板，其中該承載板係為一基板條(Substrate Strip)。The window type pressure plate of claim 26, wherein the carrier plate is a Substrate Strip. 如請求項26之窗型壓板，其中該承載板係為一導線架(Leadframe)。The window type pressure plate of claim 26, wherein the carrier plate is a lead frame. 如請求項26之窗型壓板，更包括複數條壓條，部分該等壓條係位於該窗孔內，且互相交錯而定義出複數個開口，每一該等開口係對應每一該等晶片。The window type platen of claim 26 further includes a plurality of strips, wherein the strips are located within the aperture and interdigitated to define a plurality of openings, each of the openings corresponding to each of the wafers. 如請求項26之窗型壓板，其中該等晶片係黏附於該承載板之上表面，該窗型壓板之該窗孔係顯露該等晶片。The window-type platen of claim 26, wherein the wafers are adhered to an upper surface of the carrier plate, the window of the window-type platen exposing the wafers. 如請求項26之窗型壓板，其中該支撐部之面積係大於該頂抵開口之面積，以防止該支撐部掉出該容置空間。The window type pressure plate of claim 26, wherein the area of the support portion is larger than the area of the top abutment opening to prevent the support portion from falling out of the accommodating space. 如請求項26之窗型壓板，其中該頂抵部之面積係小於該頂抵開口之面積，使得該頂抵部可以於該頂抵開口內移動。The window type pressure plate of claim 26, wherein the area of the abutting portion is smaller than the area of the top abutting opening, such that the abutting portion can move within the top abutting opening.
TW098125939A 2008-09-26 2009-07-31 Fixing jig of wire bonding machine and window type clamp thereof TWI389247B (en)

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