.201013451 六、發明說明： 【發明所屬之技術領域】 本發明係有關於管理從處理半導體基板或玻璃基板等 之基板處理裝置發送之資訊之資訊管理方法及裝置、或包 含基板處理裝置與資訊管理裝置之基板處理系統、或者是 包含顯示儲存於資訊管理裝置之資訊之方法及此資訊之基 板處理系統。 【先前技術】 〇 一般，此種基板處理系統以對基板施行處理之複數基 板處理裝置、管理此複數基板處理裝置之運作狀態之監視 及生產履歷等資訊（資料）之群管理伺服器（資訊管理裝 ' 置）構成。是故，資訊管理裝置管理從基板處理裝置發送 之溫度、壓力、氣體等測量値或運作狀況等各種資訊。可 以此種資訊管理裝置，謀求半導體生產之效率提高。使用 者使用終端裝置，取得資訊管理裝置所管理之資訊。 【發明内容】 ® 然而，在習知之基板處理系統中，終端裝置爲從資訊 管理裝置取得資訊，需要時間。 本發明即是爲解決上述課題而發明者，其目的爲縮短 終端裝置從資訊管理裝置取得資訊之時間。 本發明之第1資訊管理方法係基於包含從處理基板之 基板處理裝置所發送之裝置資訊或事件資訊之電文而管理 資訊者，其係使在發送包含裝置資訊之電文之時間點的前 述基板處理裝置之裝置資訊記憶於第1裝置資訊記億機 201013451 構，並且於送出包含事件資訊之電文時，比較該事件資訊 與儲存前述裝置資訊之條件，當一致時，使前述裝置資訊 與前述事件資訊產生之時刻具關聯性後，記憶於第2裝置 資訊機構。 本發明之第2資訊管理方法係送出包含有前述事件資 訊之電文時，將該事件資訊與設定有使儲存在第1裝置資 訊記憶機構之裝置資訊移動至第2裝置資訊記憶機構之移 動條件及移動對象之裝置資訊的條件記憶機構比較，當前 Ο 述事件資訊與前述條件一致時，於爲儲存在前述第1裝置 資訊記憶機構之裝置資訊、且爲前述設定的移動對象之裝 置資訊附加前述事件資訊產生之時刻後，記憶於第2裝置 資訊記憶機構。 本發明之資訊顯示方法係於具有操作畫面之操作終端 機顯示資訊者，其係在從處理基板之基板處理裝置送出包 含事件資訊之電文時，前述操作終端機參照該事件資訊、 與設定有使儲存於第1裝置資訊記憶機構之裝置資訊移動 ¥ 至第2裝置資訊記憶機構之移動條件及移動對象之裝置資 訊之條件記億機構，而檢索於前述經設定之移動對象之裝 置資訊附加產生前述事件資訊之時刻而經記憶之第2裝置 資訊記憶機構，並比較該所檢索之結果資訊與前述經設定 之裝置資訊，若一致，便於前述操作畫面顯示前述裝置資 訊。 根據本發明，終端裝置從資訊管理裝置取得資訊時， 可縮短檢索所需之時間。再者，利用以基板處理裝置處理 201013451 基板時生成之各種資訊，可縮短進行資料解析（例如在基 板處理裝置產生之異常之主要原因追究等）及資料加工（例 如從基板處理裝置發送之生產資訊之圖表化等）之時間。 【實施方式】 首先，依第1圖，說明本發明之背景。 第1圖係顯示記憶於習知群管理伺服器之裝置資訊及 其構造、與所記憶之裝置資訊之檢索方法者。 第1(A)圖係例示從基板處理裝置發送之電文者。如 〇 第1(A)圖所例示，各電文具有發送之時刻、發送端之基 板之處理裝置之名稱（裝置名稱）、項目類別及此項目之 ‘ 資訊（測量値等）。群管理伺服器接收從複數基板處理裝 置發送之電文，從此電文取得裝置資訊，記憶裝置資訊。 第1 ( B)圖係模式地顯示記憶裝置資訊之構造者。如 第1 ( B )圖所示，裝置資訊記憶於資料庫（DB ) 。DB具 有項目管理表、測量資料管理表及裝置管理表。項目管理 表係管理對應於項目類別之各項目。裝置管理表係管理各 〇 基板處理裝置。測量資料管理表係管理使項目管理表所管 理之項目與裝置管理表所管理之裝置具關聯性之資訊（測 量値等）及電文所含之時刻（相當於第UA)圖之「時間」）。 此DB構造之優點如下述。即，1)追加項目時’亦不會 影響DB構造（例如必須追加新的表等）；2)追加基板處理 裝置時，亦不會影響DB構造；3)各基板處理裝置具有不 同項目時，裝置資訊亦可依測量資料管理資料表管理，4) 由於在測量資料管理表僅記憶與基板處理裝置所含之項目 201013451 之資訊有關之資訊（測量値等），故不存在不必要之資料 區域。 第1(C)圖顯示記憶於DB之裝置資訊之取得方法。 舉例言之，在確認障礙發生時間點之基板處理裝置（障礙 發生裝置）的狀態之際，作爲操作終端機之終端裝置參照 DB之項目管理表、測量資料管理表及裝置管理表，而將該 等3個表再構成爲第1(C)圖所例示之表，在第1(C) 圖之表中，對障礙發生裝置檢索各時刻之各項目之測量 ® 値。在此，由於在各時刻不一定記憶所有項目之測量値， 故當未於所期望之時刻記憶測量値時，需回溯至記憶測量 * 値之時刻。 具體言之，終端裝置對每項目，從所期望之時刻至記 憶測量値之時刻爲止，需進行測量値之補足作業。舉例言 之，終端裝置在時刻1 2:00:04，可檢索溫度 chi之値 (6 90.0 )，但無法檢索溫度Ch2及氣體chi之値，要檢索 溫度ch2之値及氣體chl之値，需回溯至時刻12:00:02。 胃如此’此DB構造具有以下缺點。即，1)將相關之複數 個表再構成爲資料檢索用之1個表耗時；2)補足測量値將 耗時。 以下’根據背景，說明本發明實施形態之基板處理系 統。 第2圖係顯示本發明實施形態之基板處理系統1之結 構圖。 如第2圖所示，基板處理系統丨具有複數基板處理裝 201013451 置10-1〜10-n、群管理伺服器4及終端裝置6。基板處理裝 置10-1〜10-n、群管理伺服器4及終端裝置6藉由LAN、 WAN等網路12,連接成可相互進行資料之發送及接收。此 外，未特定基板處理裝置10-1 ~l〇-n等複數某構成部份之 任一者時，僅省略記載爲基板處理裝置10等。 基板處理裝置10依製程處方等執行基板之處理。具體 言之，製程處方記載用以處理基板之程序，基板處理裝置 1〇根據此程序，進行裝置內之構成要件之控制。又，基板 〇 處理裝置10藉由網路12，對群管理伺服器4發送包含與 基板處理裝置10之處理相關之資訊的電文，而該電文包含 溫度資訊、壓力資訊、氣體資訊等生產資訊（以下記載爲 「裝置資訊」）。再者，基板處理裝置10對群管理伺服器 4發送如下之電文：該電文包含顯示障礙發生之資訊（錯 誤資訊）或顯示基板處理之預定動作之資訊（運作資訊） 等發生頻率少之資訊或突然發生之資訊（以下記載爲「事 件資訊」）。 _ 基板處理裝置10之一例係構成爲執行半導體裝置 (1C)之製造方法之處理裝置之半導體製造裝置。此外， 在以下之說明中，就基板處理裝置屬適用對基板進行氧 化、擴散處理或CVD等處理之縱型裝置而對實施例作敘 述。此外，關於基板處理裝置10之詳細構造，之後詳述。 群管理伺服器4(資訊管理裝置）接收從基板處理裝 置10發送之電文，保存及管理電文所含之裝置資訊或事件 資訊。又，群管理伺服器4亦可實現爲具有複數資料庫 201013451 (DB)。此外，關於群管理伺服器4之功能及DB構造， 之後詳述》 終端裝置6檢索由群管理伺服器4所儲存之資訊，將 檢索結果顯示於畫面，構成對用戶提供資料之介面。更具 體言之，終端裝置6藉由鍵盤或滑鼠等，受理使用者之要 求’從群管理伺服器4取得資訊，將此資訊顯示於畫面。 此外’終端裝置6不需於配置基板處理裝置10之地點（例 如無麈室）配置，亦可於事務所等與配置基板處理裝置10 ® 之地點不同之地點配置。 接著，說明基板處理裝置10之詳細結構。 第3圖顯示本發明實施形態之基板處理裝置10之立體 圖。第4圖顯示本發明實施形態之基板處理裝置10之側面 透視圖。 如第3圖及第4圖所示，使用箍（基板收容器、以下 稱爲收容盒）110作爲收納有由矽等構成之晶圓（基板） 2〇〇之晶圓載體之本發明實施形態之基板處理裝置1〇具有 ® 框體111。於框體111之正面壁Ilia之正面前方部開設有 作爲被設置成可保養之開口部的正面保養口 103，用以將 此正面保養口 103開閉之正面保養門104、104各自開闔。 收容盒搬入搬出口（基板收容器搬入搬出口）Π2於 框體111之正面壁111a被開設成呈連通框體111內外之狀 態’收容盒搬入搬出口 112呈可藉由前遮門（基板收容器 搬入搬出口開關機構）113而被開關。於收容盒搬入搬出 口 112之正面前方側設置承載埠（l〇adp〇rt)(基板收容器遞 201013451 送台）114，承載埠114被構成爲載置收容盒110並作位置 對準。收容盒110藉由製程內搬送裝置（圖中未示）而被 搬入至承載埠114上，且又從承載埠114上被搬出。 框體111內前後方向之約略中央部之上部設有旋轉式 收容盒架（基板收容器載置架105)，旋轉式收容盒架105 被構成爲保管複數個收容盒110。即，旋轉式收容盒架105 被垂直立設，並具備在水平面內間歇旋轉之支柱116、及 在支柱116上中下段各位置被支撐成放射狀之複數片架板 β (基板收容器載置台）117，複數片架板117被構成爲在各 個架板載置複數個收容盒110之狀態下作保持。 於框體111內之承載埠114與旋轉式收容盒架105間 設有收容盒搬送裝置（基板收容器搬送裝置）118,收容盒 搬送裝置118被構成爲，包含可在保持收容盒110之狀態 下直接作升降之收容盒升降機（基板收容器升降機構） 118a、及作爲搬送機構之收容盒搬送機構（基板收容器搬 送機構）118b;收容盒搬送裝置118被構成爲，藉由收容 _ 盒升降機118a及收容盒搬送機構118b之連續動作，在承 載埠114、旋轉式收容盒架105、收容盒開盒器（基板收容 器蓋體開關機構）121間，搬送收容盒110。 在框體111內前後方向之約中央部之下部，子框體119 被構築於後端。在子框體119之正面壁119a，一對用以將 晶圓200相對於子框體119內搬入搬出之晶圓搬入搬出口 (基板搬入搬出口）120被開設爲於垂直方向排列成上下 二段，於上下段之晶圓搬入搬出口 120、120設有一對收容 201013451 盒開盒器121、121。收容盒開盒器121具有載置收容盒110 之載置台122、122、裝卸收容盒11〇之罩（蓋體）之罩裝 卸機構（蓋體裝卸機構）123、123。收容盒開盒器121被 構成爲，藉由罩裝卸機構123將載置於載置台122之收容 盒110之罩裝卸，藉以開關收容盒110之晶圓出入口。 子框體119構成與收容盒搬送裝置118或旋轉式收容 盒架105之設置空間流體隔絕之移載室124。移載室124 之前側區域設有晶圓移載機構（基板移載機構）125’晶圓 ❹ 移載機構125被構成爲，包含可使晶圓200於水平方向旋 轉或作直線運動之晶圓移載裝置（基板移載裝置）125a、 及用以使晶圓移載裝置125a升降之晶圓移載裝置升降機 (基板移載裝置升降機構）125b。如第4圖模式地顯示’ 晶圓移載裝置升降機125b被設置於耐壓框體111右側端部 與子框體119之移載室124前方區域右端部之間。構成爲’ 藉由該等晶圓移載裝置升降機125b及晶圓移載裝置125a 之連續動作，使晶圓移載裝置125a之鉗子（基板保持體） ¥ 125c作爲晶圓200之載置部，而對晶舟（基板保持件）217 裝塡及卸除晶圓200。 於移載室124之後側區域構成收容晶舟217並使其待 機之待機部126。於待機部126之上方設有處理室202。處 理室202之下端部被構成爲以爐口遮門（爐口開關機構） 147作開關。 如第3圖模式地顯示，於耐壓框體111右側端部與子 框體119之待機部126右端部間設有用以使晶舟217升降 -10- 201013451 之晶舟升降機（基板保持件升降機構）115。作爲蓋體之密 封蓋219被水平地固定於作爲與晶舟升降機115之升降台 連結之連結件之臂128，密封蓋219被構成爲，垂直支撐 晶舟217，並可將處理室202之下端部封閉。晶舟217被 構成爲，具有複數條保持構件，使複數片（例如50〜125片 左右）晶圓2 0 0以中心對齊而於垂直方向排列之狀態保持 水平。 如第3圖模式地顯示，於移載室124之晶圓移載裝置 ® 升降機1 25b側及與晶舟升降機1 1 5側相反之側之左側端部 設置由供給風扇及防塵過濾器構成之清潔單元134，藉以 供給屬已清淨化之氣體環境或惰性氣體之清潔空氣133, 並於晶圓移載裝置125a與清潔單元134間設置圖中未示， 作爲整合晶圓圓周方向之位置之基板整合裝置之刻痕對準 裝置1 35。 從清潔單元134吹出之清潔空氣133在刻痕對準裝置 135及晶圓移載裝置125a、位於待機部126之晶舟217流 _ 通後，以圖中未示之導管吸入，並排出框體111之外部， 或循環至屬清潔單元1 34之吸入側之一次側（供給側）， 並再次由清潔單元134吹進移載室124內" 接著，就被設於基板處理裝置10內，並進行基板處理 裝置1〇內之各裝置之控制之製程模組控制器（PMC ) 14 作說明。 第5圖係顯示以PMC爲中心之基板處理裝置10之功 能結構。 201013451 如第 5 圖所示，PMC14具有 CPU140、ROM142 > R AM 1 44、記憶資料之硬碟驅動器（HDD) 158、在圖中未 示之顯示器等顯示裝置及鍵盤等輸入裝置間進行資料發送 接收之輸入輸出介面（IF) 146、控制經由網路12與群管 理伺服器4等間之資料通信之通信控制部1 56、溫度控制 部150、氣體控制部152、壓力控制部154及進行與溫度控 制部150等之I/O控制之I/O控制部148。該等構成要件經 由匯流排160而相互連接，資料經由匯流排160而在構成 ® 要件間輸入輸出。 在PMC中，CPU140基於預定處方，處理基板◊具體 言之，CPU140對溫度控制部150、氣體控制部152及壓力 控制部154等輸出控制資料（控制指示）。於ROM142、 RAM 144及HDD158中，儲存程序程式、從輸入輸出IF 146 輸入之資料、經由通信控制部156輸入之資料等。 溫度控制部150藉由設置於上述處理室202之外周部 之加熱器3 3 8控制該處理室202內之溫度。氣體控制部152 胃依設置於處理室202之氣體配管340之MFC (質量流量控 制器）3 42之輸出値，控制供給至處理室202內之反應氣 體之供給量等。壓力控制部154依設置於處理室202之排 氣配管344之壓力感測器346之輸出値，藉開關閥348， 控制處理室202內之壓力。搬送控制部159控制收容盒開 盒器121、晶舟升降機115及晶圓搬送機構等搬送系統。 如此’溫度控制部150等基於CPU 140之控制指示，進行 基板處理裝置10之各部（加熱器338、MFC342及閥348 -12- 201013451 等）之控制。 因而，CPU140啓動程序程式，基於該程序程 呼叫處方之命令，而逐次執行設定控制參數之目 步驟，經由I/O控制部148，對溫度控制部150、 部152、壓力控制部154及搬送控制部159發送 基板之控制指示。溫度控制部1 5 0等依控制指示 處理裝置10內之各部（加熱器338、MFC342及g 之控制。藉此，進行晶圓200之處理。 Φ CPU 1 4〇 (發送機構）經由通信控制部156而 伺服器4發送包含具有溫度資訊、壓力資訊、氣 生產資訊之基板處理裝置10之裝置資訊或事件 文。舉例言之，CPU140於任一生產資訊變化時， 反映此變化資訊之裝置資訊的電文。又，CPU140 伺服器4發送包含與基板處理裝置1〇之事件及障 資訊（事件資訊）的電文。事件爲晶舟2 1 7之上升 上升結束時、下降開始時及下降結束時等。發生 ϋ ¥ 時，切換晶舟升降機115之位置感測器之啓動及 發送切換信號。 第6圖係以控制裝置1 6爲中心，顯示終端裝 體結構者。 如第6圖所示，終端裝置6具有包含CPU18 20等之控制裝置16、經由網路12，與外部之電 料之發送及接收之通信介面（IF) 22、硬碟驅動 裝置及具有液晶顯示器等顯示裝置與鍵盤、滑鼠 式，執行 標値等之 氣體控制 用以處理 進行基板 3 348 等） 對群管理 體資訊等 資訊之電 發送包含 對群管理 礙相關之 '開始時、 此種事件 關閉，並 置6之硬 及記憶體 腦進行資 器等記憶 等指向裝 -13- 201013451 置之顯示/輸入裝置24。如此，終端裝置6以個人電腦等通 用電腦來實現。此外，群管理伺服器4具有上述控制裝置 16、通信IF22及記憶裝置26。群管理伺服器4被構成爲， 經由通信IF2 2而連接於終端裝置6之顯示/輸入裝置24。 接著，說明群管理伺服器4之功能、DB構造及終端裝 置6之功能。 第7圖係顯示由群管理伺服器4執行之群管理程式40 及由終端裝置6執行之終端程式60之功能結構者。 ® 如第7圖所示，群管理程式40具有裝置資訊DB400、 現在資訊記憶部402、定義資訊記憶部404、通信部406、 電文受理部408及裝置資訊登錄部410。群管理程式40載 入至群管理伺服器4之記憶體20，並在於控制裝置16上 動作之OS(未圖示）上執行。 在群管理程式40中，現在資訊記憶部402 (第1裝置 資訊記憶機構）記憶各基板處理裝置1 0之最新之裝置資 訊。具體Θ之，現在資訊sS憶部402基於從基板處理裝置 ® 10送出之電文，記憶發送此電文之時間點之裝置資訊。裝 置資訊包含裝置識別資訊、溫度資訊、壓力資訊、氣體資 訊等生產資訊及關於各生產資訊之測量資料。現在資料記 憶部402 (第1裝置資訊記憶機構）針對從電文取得之各 基板處理裝置1 〇之所有裝置資訊，記憶其測量値。現在資 訊記憶部402以記憶體20實現。 裝置資訊DB 400 (第2裝置資訊記憶機構）針對各基 板處理裝置10，使裝置資訊與時刻具關聯性並且進行記 -14- 201013451 億。具體言之，裝置資訊DB4 00將爲裝置資訊之 並以後述定義資訊記憶部404所定義之裝置資訊 生經定義之事件資料之時刻進行記憶。裝置資訊 記億體20及記憶裝置26之至少任一者實現。此 記憶於裝置資訊DB400及現在資訊記憶部402之 之構造，之後詳述。 定義資訊記憶部404記憶有呈可變更之定義 義資訊包含讀取現在資訊記憶部402所記憶之裝 ❹ 儲存於裝置資訊DB400之條件（儲存條件）、及 置6顯示之裝置資訊等。舉例言之，儲存條件包 件之發生。舉例言之，在終端裝置6顯示之裝置 「溫度chi」「溫度ch2」「氣體chi」等生產資 及各生產資訊之測量値。此外，定義資訊記憶部 記憶複數定義資訊，此時，群管理程式40宜依各 具有裝置資訊DB400。 通信部406進行與基板處理裝置10間通信所 ® 處理。具體言之，通信部40 6以預定程序藉由通 取得從基板處理裝置10所送出之電文，並對電 408輸出。 電文受理部408受理從通信部40 6輸入之電 電文包含裝置資訊時，記憶該裝置資訊於現在資 402。具體言之，電文受理部40 8更新經記憶於現 憶部4 02之裝置資訊中，從通信部406輸出之電 裝置資訊之測量値。舉例言之，電文受理部40 8 一部份， 於每當產 DB400 以 外，關於 裝置資訊 資訊。定 置資訊並 在終端裝 含預定事 資訊包含 訊之類別 404亦可 定義資訊 需之通信 信 IF22 ， 文受理部 文，當此 訊記憶部 在資訊記 文所含之 將電文所 201013451 含之裝置資訊之測量値寫入經記憶在現在資訊記憶部402 之測量値。藉此，於現在資訊記憶部402記憶發送電文之 時間點、亦即最新之基板處理裝置10之裝置資訊。 又，電文受理部408於從通信部406所受理之電文包 含事件資訊時，將該事件資訊對裝置資訊登錄部4 1 0輸出。 裝置資訊登錄部4 1 0參照定義資訊記憶部404，依記 憶於定義資訊記憶部404之儲存條件，將記憶於現在資訊 記憶部402之裝置資訊登錄於裝置資訊DB400。具體言之， ® 裝置資訊登錄部410於從電文受理部408所輸出之事件資 訊與作爲儲存條件而經記憶於定義資訊記憶部404之事件 資訊一致時，從現在資訊記憶部4 02讀取爲事件資訊之發 送端之基板處理裝置10的裝置資訊，使所讀取之裝置資訊 之至少一部份與事件發生之時刻對應，並登錄於定義資訊 記憶部404。在此，裝置資訊登錄部4 1 0參照經記憶於定 義資訊記憶部40 4之定義資訊，僅讀取所定義之裝置資 訊’加工成該資訊匯整成預定資料形式後登錄。藉此，在 & 基板處理裝置10每當作爲儲存條件之事件發生時，在發生 時間點之基板處理裝置10之裝置資訊將被儲存於裝置資 訊 DB400 » 終端程式60具有使用者介面（UI )部600、裝置資訊 取得部602及畫面生成部604。終端程式60載入至終端裝 置6之記憶體20，在於控制裝置16上動作之圖中未示之 OS上執行。 在終端程式60中，UI部600(顯示機構）受理藉由顯 -16- 201013451 示/輸入裝置24所輸入之內容，並對裝置資訊取得部602 輸出。舉例言之，UI部600受理基板處理裝置1〇之名稱 或識別子（ID )等識別資訊及時刻。又，UI部600於顯示 /輸入裝置24顯示由畫面生成部6 04所生成之障礙資訊畫 面（後述）等。 裝置資訊取得部602依從UI部600所輸出之識別資訊 及時刻，檢索經記憶於裝置資訊DB400之裝置資訊，並取 得由該識別資訊所識別之基板處理裝置1 0之該時刻之裝 © 置資訊。裝置資訊取得部602對畫面生成部604輸出所取 得之裝置資訊。 畫面生成部604參照定義資訊記憶部404，取得所定 義之裝置資訊之類別及各裝置資訊之測量値。畫面生成部 6 04依此裝置資訊之類別，生成障礙資訊畫面之畫面結構。 再者，畫面生成部6 04將由裝置資訊取得部602所取得之 裝置資訊合成於障礙資訊畫面之畫面結構，生成障礙資訊 畫面。畫面生成部604對UI部60 0輸出所生成之障礙資訊 ® 畫面。此外，關於障礙資訊畫面，之後詳述。 第8圖係模式地顯示群管理程式40之現在資訊記憶部 4 02及裝置資訊DB4 00之記憶構造者，（A)係例示現在資 訊記憶部402，（ B )係例示裝置資訊DB400。 如第8 ( A )圖所例示，於現在資訊記億部402中，記 憶有針對各基板處理裝置10包含所有類別及其測量値之 裝置資訊。於現在資訊記憶部402記憶有各基板處理裝置 1〇之各裝置資訊之最新測量値。是故，記憶於現在資訊記 -17- 201013451 憶部402之裝置資訊僅於變更測量値時更新。 此外，於第8圖例示顯示3種類別之情形，實際上顯 示不限於3個之數種類別。 如第8 ( B )圖所例示，裝置資訊DB400記憶有裝置資 訊，其包含就各基板裝置10由定義資訊記憶部402所定義 之類別與其測量値。此裝置資訊每當滿足爲定義資訊記憶 部404所定義之儲存條件時便儲存。各時刻之裝置資訊之 形式爲將複數類別及其測量値匯整成1個資料。舉例言 Ο 之，類別與其測量値以「/」等連結記號連結，如此連結之 資訊包含在1個裝置資訊內。 以下，詳細說明本發明實施形態之基板處理系統1之 動作。 首先，說明基板處理裝置10之基板處理。 如第3圖及第4圖所示，當將收容盒110供給至承載 埠114時，收容盒搬入搬出口 112以前遮門113開放，承 載埠114上之收容盒110以收容盒搬送裝置118從收容盒 ® 搬入搬出口 112搬入框體111之內部。 所搬入之收容盒110以收容盒搬送裝置118自動地搬 送至旋轉式收容盒架105之指定架板17而交遞，暫時保管 後，從架板117搬送至一收容盒開盒器121後交遞，暫時 保管後，從架板117搬送至一收容盒開盒器121，移載至 載置台122，或直接搬送至收容盒開盒器121後，移載至 載置台122。此時，收容盒開盒器121之晶圓搬入搬出口 120由罩裝卸機構123關閉，清潔空氣133流通至移載室 -18 - 201013451 124而充滿其中。舉例言之，於移載室124充滿氮氣作爲 清潔空氣133，藉此，氧濃度設定成20ppm以下，遠低於 框體111之內部（大氣環境）之氧濃度。 載置於載置台122之收容盒110之開口側端面被按壓 至子框體119之正面壁119a之晶圓搬入搬出口 120的開口 緣邊部，同時以罩裝卸機構123卸除其蓋，而將晶圓出入 口開放。 收容盒110由收容盒開盒器121開放時，從收容盒110 ® 以晶圓移載裝置125a之鉗子125c經由晶圓出入口拾取晶 圓200，並以圖中未示之刻痕對準裝置135整合晶圓後， 搬入至位於移載室124後方之待機部126，並裝塡（裝料） 至晶舟2 1 7。已將晶圓200交遞至晶舟2 1 7之晶圓移載裝 置125a將返回收容盒110，並將下個晶圓200裝塡至晶舟 217 > 在此其中之一（上段或下段）收容盒開盒器121之晶 圓移載機構125所進行之晶圓對晶舟217之裝塡作業中， ® 從另一旋轉式收容盒架105由搬送裝置118將另一收容盒 110搬送移載至另一（下段或上段）收容盒121，同時進行 收容盒開盒器121之收容盒110之開放作業。 當將預先指定之片數之晶圓2 00裝塡於晶舟217時， 由爐口遮門147所關閉之處理室202之下端部由爐口遮門 147開放。接著，保持有晶圓200群之晶舟217根據密封 蓋219藉由晶舟升降機115上升，而被搬入（負載）至處 理室202內。 -19- 201013451 負載後，以處理室202依預定處方，對晶圓200執行 處理。處理後，除了在圖中未示之刻痕對準裝置135之晶 圓整合步驟外，以與上述相反之程序，將晶圓200及收容 盒110提取至框體外部。 基板處理裝置10在此基板處理之期間，對群管理伺服 器4發送包含溫度資訊、壓力資訊、氣體資訊等基板處理 裝置10之裝置資訊之電文。進一步，基板處理裝置10每 當事件發生時，將事件資訊對群管理伺服器4發送。 ® 接著，說明本發明實施形態之群管理伺服器4之動作。 第9圖係顯示本發明實施形態之群管理伺服器4之動 作（S 1 0 )之流程圖。 如第9圖所示，在群管理伺服器4(群管理程式40)， 通信部406判定是否從基板處理裝置1〇受理電文。群管理 伺服器4於受理電文時，前進至步驟i〇2(S102)之處理， 若非如此時，則結束處理。 在步驟102(S102)中，通信部406對電文受理部408 輸出電文，電文受理部408判定輸出之電文是否包含事件 資訊》當電文包含事件資訊時，群管理伺服器4前進至步 驟106 ( S106 )之處理，若非如此時，則前進至步驟104 (S104 ) 〇 在步驟104 ( S104 )中，電文受理部408更新記憶於 現在資訊記憶部402之裝置資訊中，該電文所包含之裝置 資訊之資料。資料更新後，群管理伺服器4返回至步驟100 (S100 )之處理。 -20- 201013451 在步驟106(S106)，電文受理部408對裝置資訊登 錄部410輸出電文所含之事件資訊，裝置資訊登錄部410 判定此事件資訊是否被指定爲儲存條件。當該事件資訊被 指定爲儲存條件時，群管理伺服器4前進至步驟108(S108) 之處理，若非如此，則返回步驟100 ( S100 )。 在步驟108 (S108)，裝置資訊登錄部410讀取爲記 憶於現在資訊記憶部402之裝置資訊、且與事件資訊之發 送端基板處理裝置10相關者，使此裝置資訊與事件發生時 © 刻具關聯性，並儲存於裝置資訊DB400。儲存後，群管理 伺服器4返回步驟100(S100)之處理。 以上，說明了在群管理伺服器4中，基板處理裝置10 之裝置資訊中最新之資訊暫時記憶於現在資訊記億部 4 02,而記億於現在資訊記憶部402之資訊中，僅將與由定 義資訊記憶部4 04之定義資訊所定義之事件相關的資訊儲 存於裝置資訊DB400，群管理伺服器4之動作不限於此。 舉例言之，亦可在群管理伺服器4中，首先參照定義 ® 資訊記憶部404之定義資訊，基板處理裝置10之裝置資訊 中，僅將由定義資訊所定義之裝置資訊記憶於現在資訊記 憶部402，記憶於現在資訊記憶部402之資訊中，僅將與 由定義資訊記憶部404之定義資訊所定義之事件相關的資 訊儲存於裝置資訊DB400。 接著，說明與使用終端裝置6之基板處理裝置相關 之資訊之瀏覽。 第10圖係例示於終端裝置6所顯示之障礙資訊畫面。 -21- .201013451 第10(A)圖係於定義資訊記憶部404指定爲定義資 訊之類別與記憶於裝置資訊DB40 0之所期時刻之裝置資訊 之類別一致時之例。如第10(A)圖所例示，障礙資訊畫 面包含障礙內容及障礙發生時之裝置資訊，此裝置資訊包 含由定義資訊記憶部404所定義之類別及障礙發生時之測 量値。在此，顯示對應於經定義之所有類別之測量値。 記憶於定義資訊記憶部404之定義資訊可變更。因 而，變更定義資訊時，有依定義資訊所指定之類別與所期 β 時刻之裝置資訊之類別不一致之情形。 第ίο ( Β )圖係依定義資訊記憶部404所指定爲定義 資訊之類別與記憶於裝置資訊DB4 00之所期時刻之裝置資 訊之類別不一致時之例。如第1 0 ( Β )圖所例示，在檢索 時間點之定義資訊，定義類別「壓力」，而在所期望之時 刻之定義資訊，未定義類別「壓力」時，此時刻之類別「壓 力」之測量値未儲存於裝置資訊DB4 00。此時，於障礙資 訊畫面之類別「壓力」之欄不顯示測量値，該欄維持空白BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information management method and apparatus for managing information transmitted from a substrate processing apparatus such as a semiconductor substrate or a glass substrate, or a substrate processing apparatus and information management. A substrate processing system of the device, or a substrate processing system including a method of displaying information stored in the information management device and the information. [Prior Art] In general, such a substrate processing system is a group management server (information management) that performs processing on a substrate, a plurality of substrate processing apparatuses that manage the operation state of the plurality of substrate processing apparatuses, and a production history (data). Install the 'set'. Therefore, the information management device manages various kinds of information such as temperature, pressure, gas, etc. measured or operating conditions transmitted from the substrate processing device. Such information management devices can be used to improve the efficiency of semiconductor production. The user uses the terminal device to obtain information managed by the information management device. SUMMARY OF THE INVENTION However, in the conventional substrate processing system, it takes time for the terminal device to acquire information from the information management device. The present invention has been made to solve the above problems, and an object of the invention is to shorten the time during which a terminal device acquires information from an information management device. The first information management method of the present invention manages information based on a message including device information or event information transmitted from a substrate processing device of a processing substrate, and the substrate processing is performed at a time point of transmitting a message including device information. The device information of the device is stored in the first device information information machine 201013451, and when the message containing the event information is sent, the event information is compared with the condition for storing the device information, and when the device information is consistent, the device information and the event information are made. After the moment of occurrence is related, it is stored in the second device information organization. In the second information management method of the present invention, when the message including the event information is sent, the event information and the movement condition for moving the device information stored in the first device information storage mechanism to the second device information storage mechanism and Comparing the condition memory mechanism of the device information of the mobile object, when the current event information is consistent with the foregoing condition, the event is added to the device information stored in the first device information memory mechanism and the device information of the mobile object set as described above. After the moment of information generation, it is stored in the second device information memory mechanism. The information display method of the present invention is for displaying an information on an operation terminal having an operation screen, and the operation terminal refers to the event information and the setting when the message containing the event information is sent from the substrate processing device of the processing substrate. The device information stored in the first device information memory mechanism moves to the condition of the movement condition of the second device information storage mechanism and the device information of the mobile device, and the device information retrieved from the set moving object is added to generate the foregoing The second device information storage means, which is memorized at the moment of the event information, compares the retrieved result information with the set device information, and if the device information is consistent, the device screen is displayed on the operation screen. According to the present invention, when the terminal device acquires information from the information management device, the time required for the retrieval can be shortened. Further, by using various information generated when the substrate processing apparatus processes the 201013451 substrate, it is possible to shorten data analysis (for example, the main cause of abnormality in the substrate processing apparatus) and data processing (for example, production information transmitted from the substrate processing apparatus). The time of charting, etc.). [Embodiment] First, the background of the present invention will be described with reference to Fig. 1. Fig. 1 is a diagram showing information on the device information stored in the conventional group management server and its structure and retrieval method of the stored device information. The first (A) diagram illustrates a text message transmitted from the substrate processing apparatus. As exemplified in Figure 1(A), each message has the name of the device to be transmitted, the name of the processing device (device name) of the base of the transmitting end, the item type, and the information (measurement, etc.) of the item. The group management server receives the message transmitted from the plurality of substrate processing devices, and obtains device information and memory device information from the message. The first (B) diagram systematically displays the constructor of the memory device information. As shown in Figure 1 (B), the device information is stored in the database (DB). The DB has a project management table, a measurement data management table, and a device management table. Project Management The table management manages each item corresponding to the project category. The device management table manages each of the substrate processing devices. The measurement data management table manages the information (measurement, etc.) associated with the device managed by the project management table and the device managed by the device management table, and the time (corresponding to the "UA" of the UA). . The advantages of this DB construction are as follows. In other words, 1) when adding a project, 'will not affect the DB structure (for example, a new table must be added); 2) When the substrate processing device is added, the DB structure is not affected; 3) When each substrate processing device has a different item, The device information can also be managed according to the measurement data management data table. 4) Since only the information related to the information of the project 201013451 contained in the substrate processing device (measurement, etc.) is memorized in the measurement data management table, there is no unnecessary data area. . Figure 1(C) shows the method of obtaining device information stored in the DB. For example, when the state of the substrate processing apparatus (obstacle generating apparatus) at the time of occurrence of the obstacle is confirmed, the terminal device as the operating terminal refers to the item management table, the measurement data management table, and the device management table of the DB, and The three tables are further configured as the table illustrated in the first (C) diagram, and in the table of the first (C) chart, the obstacle generation device searches for the measurement of each item at each time. Here, since the measurement parameters of all the items are not necessarily memorized at each time, when the measurement 値 is not memorized at the desired time, it is necessary to trace back to the time of the memory measurement * 値. Specifically, the terminal device performs a measurement operation for each item from the desired time to the time of the memory measurement. For example, the terminal device can retrieve the temperature chi (6 90.0 ) at time 1 2:00:04, but cannot search for the temperature Ch2 and the gas chi. To retrieve the temperature ch2 and the gas chl, Go back to time 12:00:02. The stomach has the following disadvantages. That is, 1) reconstructing the related plurality of tables as one time for data retrieval; 2) making up the measurement time is time consuming. Hereinafter, a substrate processing system according to an embodiment of the present invention will be described based on the background. Fig. 2 is a view showing the configuration of a substrate processing system 1 according to an embodiment of the present invention. As shown in Fig. 2, the substrate processing system 丨 has a plurality of substrate processing apparatuses 201013451, 10-1 to 10-n, a group management server 4, and a terminal device 6. The substrate processing apparatuses 10-1 to 10-n, the group management server 4, and the terminal apparatus 6 are connected by a network 12 such as a LAN or a WAN so that data can be transmitted and received to each other. In addition, when any one of a plurality of constituent parts such as the substrate processing apparatuses 10-1 to 100-n is not specified, only the substrate processing apparatus 10 and the like are omitted. The substrate processing apparatus 10 performs processing of the substrate in accordance with a process recipe or the like. Specifically, the process recipe describes a program for processing a substrate, and the substrate processing apparatus 1 controls the constituent elements in the apparatus according to the program. Further, the substrate processing apparatus 10 transmits, via the network 12, a message including information related to the processing of the substrate processing apparatus 10 to the group management server 4, and the electronic message includes production information such as temperature information, pressure information, and gas information ( The following is described as "device information"). Further, the substrate processing apparatus 10 transmits to the group management server 4 a message including information indicating that the occurrence of the obstacle (error information) or information indicating the predetermined operation of the substrate processing (operation information) is less frequently generated or Suddenly occurring information (hereinafter referred to as "event information"). One example of the substrate processing apparatus 10 is a semiconductor manufacturing apparatus which is a processing apparatus which executes the manufacturing method of the semiconductor device (1C). Further, in the following description, the substrate processing apparatus is a vertical type apparatus to which a substrate is subjected to oxidation, diffusion treatment, or CVD, and the like, and the embodiment will be described. Further, the detailed configuration of the substrate processing apparatus 10 will be described in detail later. The group management server 4 (information management device) receives the message transmitted from the substrate processing device 10, and stores and manages device information or event information contained in the message. Further, the group management server 4 can also be implemented as a complex database 201013451 (DB). Further, the function of the group management server 4 and the DB structure will be described later. The terminal device 6 searches the information stored by the group management server 4, and displays the search result on the screen to form an interface for providing data to the user. More specifically, the terminal device 6 accepts the user's request by keyboard or mouse, etc. 'Get information from the group management server 4, and display the information on the screen. Further, the terminal device 6 is not required to be disposed at a place where the substrate processing apparatus 10 is disposed (e.g., without a chamber), and may be disposed at a place different from the place where the substrate processing apparatus 10® is disposed. Next, the detailed structure of the substrate processing apparatus 10 will be described. Fig. 3 is a perspective view showing a substrate processing apparatus 10 according to an embodiment of the present invention. Fig. 4 is a side perspective view showing the substrate processing apparatus 10 according to the embodiment of the present invention. As shown in FIG. 3 and FIG. 4, an embodiment of the present invention in which a hoop (substrate container, hereinafter referred to as a storage box) 110 is used as a wafer carrier in which a wafer (substrate) composed of tantalum or the like is accommodated is used. The substrate processing apparatus 1 has a ® frame 111. A front maintenance port 103, which is provided as a maintainable opening, is opened in front of the front side of the front wall Ilia of the casing 111, and the front maintenance doors 104 and 104 for opening and closing the front maintenance port 103 are opened. The storage box loading/unloading port (substrate receiving container loading/unloading port) Π2 is opened in the state in which the front wall 111a of the casing 111 is connected to the inside and the outside of the casing 111. The storage box loading/unloading port 112 is formed by the front cover (the substrate is received). The container is moved into and out of the switch mechanism 113 and is turned on and off. A load carrying cassette 114 is disposed on the front side of the front side of the storage box loading/unloading port 112. The load cassette 114 is configured to mount the storage case 110 and position it. The storage box 110 is carried into the magazine 114 by an in-process conveying device (not shown) and is carried out from the carrier 114. A rotary storage box holder (substrate container mounting frame 105) is provided at an upper portion of the frame body 111 in the center portion of the front-rear direction, and the rotary storage box holder 105 is configured to store a plurality of storage boxes 110. That is, the rotary storage cassette holder 105 is vertically erected, and includes a column 116 that intermittently rotates in a horizontal plane, and a plurality of rack plates β that are radially supported at positions in the lower and lower stages of the column 116 (substrate container mounting table) 117, the plurality of shelf plates 117 are configured to be held in a state in which a plurality of storage boxes 110 are placed on the respective shelf plates. A storage box conveying device (substrate container conveying device) 118 is disposed between the carrier 114 and the rotary storage box holder 105 in the housing 111, and the storage box conveying device 118 is configured to be in a state in which the storage box 110 can be held. a storage box elevator (substrate receiving and lowering mechanism) 118a for directly lifting and lowering, and a storage box conveying mechanism (substrate receiving container conveying mechanism) 118b as a conveying mechanism; the storage box conveying device 118 is configured to be housed by a box elevator The continuous operation of the 118a and the storage box transport mechanism 118b transfers the storage case 110 between the load cassette 114, the rotary storage box holder 105, and the storage cassette opener (substrate container cover switch mechanism) 121. The sub-frame 119 is constructed at the rear end of the frame body 111 at a lower portion of the center portion in the front-rear direction. In the front wall 119a of the sub-frame 119, a pair of wafer loading/unloading ports (substrate loading/unloading ports) 120 for loading and unloading the wafers 200 into and out of the sub-frames 119 are arranged in the vertical direction. In the segment, the wafer loading/unloading ports 120 and 120 in the upper and lower stages are provided with a pair of housings 201013451 cassette openers 121 and 121. The storage box opener 121 has a cover attaching and detaching mechanism (cover attaching and detaching mechanism) 123 and 123 on which the mounting tables 122 and 122 of the storage case 110 are placed, and the cover (cover) of the storage case 11 is attached and detached. The storage box opener 121 is configured such that the cover that is placed on the storage case 110 of the mounting table 122 is attached and detached by the cover attaching and detaching mechanism 123, thereby opening and closing the wafer entrance and exit of the storage case 110. The sub-frame 119 constitutes a transfer chamber 124 that is fluidly isolated from the installation space of the storage cassette transport device 118 or the rotary storage cassette holder 105. A wafer transfer mechanism (substrate transfer mechanism) 125' is disposed in the front side region of the transfer chamber 124. The wafer transfer mechanism 125 is configured to include a wafer that can rotate or linearly move the wafer 200 in the horizontal direction. A transfer device (substrate transfer device) 125a and a wafer transfer device lift (substrate transfer device elevating mechanism) 125b for moving the wafer transfer device 125a up and down. As shown in Fig. 4, the wafer transfer device lifter 125b is disposed between the right end portion of the pressure-resistant casing 111 and the right end portion of the front region of the transfer chamber 124 of the sub-frame 119. In the continuous operation of the wafer transfer device lifter 125b and the wafer transfer device 125a, the pliers (substrate holder) of the wafer transfer device 125a is used as the mounting portion of the wafer 200. The wafer boat (substrate holder) 217 is mounted and unloaded. The rear side region of the transfer chamber 124 constitutes a standby portion 126 that houses the wafer boat 217 and causes it to stand by. A processing chamber 202 is provided above the standby unit 126. The lower end of the processing chamber 202 is configured to be a switch with a furnace opening (porting switch mechanism) 147. As shown in FIG. 3, a boat elevator for lifting and lowering the wafer boat 217 to the right end of the standby portion 126 of the sub-frame 119 is provided between the right end portion of the pressure-resistant casing 111 and the right end portion of the standby portion 126 of the sub-frame 119. Agency) 115. The sealing cover 219 as a cover is horizontally fixed to the arm 128 as a coupling member to the lifting platform of the boat elevator 115, and the sealing cover 219 is configured to vertically support the boat 217 and to lower the processing chamber 202 The department is closed. The wafer boat 217 is configured to have a plurality of holding members, and to maintain a plurality of wafers (e.g., about 50 to 125 wafers) in a state in which the wafers are aligned in the center and aligned in the vertical direction. As shown in FIG. 3, the left side end of the wafer transfer device® elevator 1 25b side of the transfer chamber 124 and the side opposite to the side of the boat elevator 1 1 5 is provided with a supply fan and a dust filter. The cleaning unit 134 is configured to supply a clean air 133 which is a cleaned gas atmosphere or an inert gas, and is disposed between the wafer transfer device 125a and the cleaning unit 134 as a substrate integrating the position of the wafer in the circumferential direction. The scoring alignment device 1 35 of the integrated device. The cleaning air 133 blown out from the cleaning unit 134 is sucked by the catheter (not shown) after the flow of the aligning device 135 and the wafer transfer device 125a in the standby unit 126, and is discharged from the frame. The outside of the 111 is circulated to the primary side (supply side) of the suction side of the cleaning unit 134, and is again blown into the transfer chamber 124 by the cleaning unit 134. Then, it is disposed in the substrate processing apparatus 10, A process module controller (PMC) 14 for controlling each device in the substrate processing apparatus 1 is described. Fig. 5 is a view showing the functional configuration of the substrate processing apparatus 10 centered on the PMC. 201013451 As shown in Fig. 5, the PMC 14 has a CPU 140, a ROM 142 > R AM 1 44, a hard disk drive (HDD) 158 for storing data, and a display device such as a display device and a keyboard such as a keyboard. The received input/output interface (IF) 146, the communication control unit 56 for controlling data communication between the network 12 and the group management server 4, the temperature control unit 150, the gas control unit 152, and the pressure control unit 154 The I/O control unit 148 of the I/O control such as the temperature control unit 150. The constituent elements are connected to each other via the bus bar 160, and the data is input and output between the constituents and the components via the bus bar 160. In the PMC, the CPU 140 processes the substrate based on the predetermined prescription. Specifically, the CPU 140 outputs control data (control instruction) to the temperature control unit 150, the gas control unit 152, the pressure control unit 154, and the like. The ROM 142, the RAM 144, and the HDD 158 store program programs, data input from the input/output IF 146, data input via the communication control unit 156, and the like. The temperature control unit 150 controls the temperature in the processing chamber 202 by the heater 3 3 8 provided on the outer peripheral portion of the processing chamber 202. The gas control unit 152 controls the supply amount of the reaction gas supplied to the processing chamber 202 and the like according to the output of the MFC (mass flow controller) 3 42 of the gas pipe 340 provided in the processing chamber 202. The pressure control unit 154 controls the pressure in the processing chamber 202 by means of the on-off valve 348 in accordance with the output 値 of the pressure sensor 346 provided in the exhaust pipe 344 of the processing chamber 202. The conveyance control unit 159 controls a conveyance system such as the storage cassette opener 121, the boat elevator 115, and the wafer transfer mechanism. In this way, the temperature control unit 150 or the like controls the respective units (the heater 338, the MFC 342, the valves 348 -12 to 201013451, and the like) of the substrate processing apparatus 10 based on the control instruction of the CPU 140. Therefore, the CPU 140 starts the program, and sequentially executes the steps of setting the control parameters based on the command to call the prescription, and controls the temperature control unit 150, the unit 152, the pressure control unit 154, and the transport control via the I/O control unit 148. The part 159 sends a control instruction of the substrate. The temperature control unit 150 or the like instructs the control unit 10 to control the respective units (the heaters 338, the MFCs 342, and the g). Thereby, the processing of the wafer 200 is performed. Φ CPU 1 4 (transmission mechanism) via the communication control unit 156. The server 4 transmits device information or an event message including the substrate processing device 10 having temperature information, pressure information, and gas production information. For example, the CPU 140 reflects the device information of the change information when any of the production information changes. Further, the CPU 140 server 4 transmits a message including the event and the obstacle information (event information) of the substrate processing apparatus 1. The event is the end of the rise and fall of the wafer boat 2 17 , the start of the fall, and the end of the fall. When ϋ ¥ occurs, the position sensor of the boat elevator 115 is switched and the switching signal is transmitted. Fig. 6 shows the terminal assembly structure centered on the control device 16. As shown in Fig. 6, the terminal device 6 having a control device 16 including a CPU 18 20 or the like, a communication interface (IF) 22 for transmitting and receiving external and external materials via the network 12, a hard disk drive device, and a liquid crystal display The display device and the keyboard, the mouse type, the gas control for performing the label, etc. are used to process the substrate 3 348, etc.) The electrical transmission of the information such as the group management information includes the group management, and the event is closed at the beginning. , and the display/input device 24 placed on the device 13-201013451 is placed in parallel with the hard memory of the memory and the like. Thus, the terminal device 6 is realized by a general-purpose computer such as a personal computer. Further, the group management server 4 has the above-described control device 16, communication IF 22, and memory device 26. The group management server 4 is configured to be connected to the display/input device 24 of the terminal device 6 via the communication IF 2 2 . Next, the function of the group management server 4, the DB structure, and the functions of the terminal device 6 will be described. Fig. 7 shows the functional configuration of the group management program 40 executed by the group management server 4 and the terminal program 60 executed by the terminal device 6. ® As shown in FIG. 7, the group management program 40 includes a device information DB 400, a current information storage unit 402, a definition information storage unit 404, a communication unit 406, a message receiving unit 408, and a device information registration unit 410. The group management program 40 is loaded into the memory 20 of the group management server 4, and is executed on an OS (not shown) that operates on the control device 16. In the group management program 40, the information storage unit 402 (the first device information storage means) now stores the latest device information of each of the substrate processing apparatuses 10. Specifically, the information sS memory unit 402 now memorizes the device information transmitted at the time of the transmission based on the message sent from the substrate processing apparatus ® 10 . The device information includes production information such as device identification information, temperature information, pressure information, gas information, and measurement information about each production information. The data memory unit 402 (the first device information memory means) now memorizes the measurement information for all the device information of each of the substrate processing apparatuses 1 obtained from the electronic message. The information storage unit 402 is now implemented by the memory 20. The device information DB 400 (second device information memory means) correlates device information with time for each of the substrate processing devices 10 and records -14 - 2010,134.51 billion. Specifically, the device information DB 4 00 will be memorized at the time when the device information and the event information defined by the device information defined by the information storage unit 404 are defined later. The device information is implemented by at least one of the billion body 20 and the memory device 26. This structure is stored in the device information DB 400 and the current information storage unit 402, and will be described in detail later. The definition information storage unit 404 stores the definitions that can be changed. The information includes the conditions stored in the device information DB 400 (storage conditions) and the device information displayed in the device information DB 400. For example, the storage condition package occurs. For example, the measurement information such as the temperature "chi", "temperature ch2", "gas chi", and the measurement information of the production information displayed on the terminal device 6 are displayed. Further, the information memory unit is defined to memorize the plural definition information. At this time, the group management program 40 should each have the device information DB 400. The communication unit 406 performs communication processing with the substrate processing apparatus 10. Specifically, the communication unit 406 obtains the message transmitted from the substrate processing apparatus 10 by a predetermined program, and outputs the message to the battery 408. When receiving the device information from the communication unit 406, the message receiving unit 408 memorizes the device information in the current capital 402. Specifically, the message receiving unit 40 8 updates the measurement information of the device information outputted from the communication unit 406 in the device information stored in the memory unit 406. For example, the message receiving unit 40 8 is part of the device information information in addition to the DB400. Set the information and include the pre-determined information in the terminal. The category 404 of the message can also define the communication information IF22 required by the information. The text accepts the text. When the information is contained in the information message, the device information contained in the message book 201013451 The measurement 値 is written into the measurement 记忆 that is memorized in the current information memory unit 402. Thereby, the current information storage unit 402 memorizes the device information at the time of transmitting the message, that is, the latest substrate processing device 10. Further, when the message received from the communication unit 406 contains the event information, the message receiving unit 408 outputs the event information to the device information registration unit 410. The device information registration unit 401 refers to the definition information storage unit 404, and registers the device information stored in the current information storage unit 402 in the device information DB 400 in accordance with the storage conditions of the definition information storage unit 404. Specifically, when the event information outputted from the message receiving unit 408 matches the event information stored in the definition information storage unit 404 as a storage condition, the device information registration unit 410 reads from the current information storage unit 012 The device information of the substrate processing device 10 at the transmitting end of the event information causes at least a portion of the read device information to correspond to the time at which the event occurred, and is registered in the definition information storage unit 404. Here, the device information registration unit 4 1 0 refers to the definition information stored in the definition information storage unit 40 4 , and reads only the defined device information 'processed into the information to be converted into a predetermined data form and then registered. Thereby, when the event of the substrate processing apparatus 10 as a storage condition occurs, the device information of the substrate processing apparatus 10 at the time of occurrence is stored in the device information DB 400. The terminal program 60 has a user interface (UI). The unit 600, the device information acquisition unit 602, and the screen generation unit 604. The terminal 20 is loaded into the memory 20 of the terminal device 6, and is executed on the OS not shown in the figure of the operation of the control device 16. In the terminal program 60, the UI unit 600 (display means) accepts the content input by the display/input device 24, and outputs it to the device information acquisition unit 602. For example, the UI unit 600 accepts identification information such as the name or identifier (ID) of the substrate processing apparatus 1 and the time. Further, the UI unit 600 displays the obstacle information screen (described later) generated by the screen generating unit 604 on the display/input device 24, and the like. The device information acquisition unit 602 searches for the device information stored in the device information DB 400 in accordance with the identification information and time output from the UI unit 600, and acquires the device information of the substrate processing device 10 identified by the identification information. . The device information acquisition unit 602 outputs the acquired device information to the screen generation unit 604. The screen generating unit 604 refers to the definition information storage unit 404, and obtains the type of the determined device information and the measurement information of each device information. The screen generating unit 6 04 generates a screen structure of the obstacle information screen according to the type of the device information. Further, the screen generating unit 604 synthesizes the device information acquired by the device information acquiring unit 602 into the screen structure of the obstacle information screen to generate an obstacle information screen. The screen generation unit 604 outputs the generated obstacle information ® screen to the UI unit 60 0 . In addition, the obstacle information screen will be described later. Fig. 8 schematically shows the memory structure of the current information memory unit 403 and the device information DB4 00 of the group management program 40. (A) shows the current information storage unit 402, and (B) shows the device information DB 400. As exemplified in Fig. 8(A), in the current information recording unit 402, the device information including all the categories and their measurement parameters for each substrate processing apparatus 10 is recorded. The current information storage unit 402 stores the latest measurement information of each device information of each substrate processing apparatus. Therefore, the information stored in the current information record -17- 201013451 memory unit 402 is only updated when the measurement is changed. Further, in the case of showing three types of categories in the eighth drawing, the actual display is not limited to three types. As exemplified in Fig. 8(B), the device information DB 400 memorizes the device information including the category and its measurement parameters defined by the definition information storage unit 402 for each of the substrate devices 10. This device information is stored whenever it meets the storage conditions defined for defining the information memory 404. The device information at each moment is in the form of a collection of plural categories and their measurements into one data. For example, the category and its measurement are linked by a link mark such as "/", and the information thus linked is included in one device information. Hereinafter, the operation of the substrate processing system 1 according to the embodiment of the present invention will be described in detail. First, the substrate processing of the substrate processing apparatus 10 will be described. As shown in FIGS. 3 and 4, when the storage case 110 is supplied to the carrying cassette 114, the storage box 110 is opened before the storage box 112 is opened, and the storage box 110 on the cassette 114 is placed to receive the cassette transporting device 118. The storage box® is carried into the inside of the casing 111. The storage box 110 that has been carried in is automatically transported to the designated shelf 17 of the rotary storage box holder 105 by the storage cassette transport device 118, and is temporarily stored, and then transported from the shelf 117 to a storage box opener 121 and then delivered. After being temporarily stored, it is transported from the shelf 117 to a storage box opener 121, transferred to the mounting table 122, or directly transferred to the storage box opener 121, and then transferred to the mounting table 122. At this time, the wafer loading/unloading port 120 of the storage cassette opener 121 is closed by the cover attaching and detaching mechanism 123, and the cleaning air 133 flows to the transfer chamber -18 - 201013451 124 to be filled therein. For example, the transfer chamber 124 is filled with nitrogen gas as the clean air 133, whereby the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the frame 111 (atmospheric environment). The opening side end surface of the storage case 110 placed on the mounting table 122 is pressed to the opening edge portion of the wafer loading/unloading port 120 of the front wall 119a of the sub-frame 119, and the cover is removed by the cover attaching and detaching mechanism 123. Open the wafer entrance and exit. When the storage box 110 is opened by the storage box opener 121, the wafer 200 is picked up from the storage box 110 ® by the forceps 125c of the wafer transfer device 125a via the wafer inlet and exit, and is aligned with the notch 135 (not shown). After the wafer is integrated, it is carried into the standby portion 126 located behind the transfer chamber 124, and is loaded (charged) to the boat 2 17 . The wafer transfer device 125a that has transferred the wafer 200 to the wafer boat 2 17 will return to the storage box 110 and mount the next wafer 200 to the boat 217 > one of them (upper or lower) In the mounting operation of the wafer-to-wafer 217 by the wafer transfer mechanism 125 of the storage box opener 121, the other storage case 110 is transported by the transfer device 118 from the other rotary storage cassette holder 105. The storage box 121 is transferred to another (lower or upper stage) storage box, and the opening operation of the storage box 110 for accommodating the cassette opener 121 is performed. When the pre-specified number of wafers 200 is mounted on the boat 217, the lower end of the processing chamber 202 closed by the furnace gate 147 is opened by the furnace opening 147. Next, the wafer boat 217 holding the wafer group 200 is lifted (loaded) into the processing chamber 202 by the wafer boat elevator 115 according to the sealing cover 219. -19- 201013451 After the load, the processing chamber 202 performs processing on the wafer 200 in accordance with a predetermined prescription. After the treatment, in addition to the wafer integration step of the score alignment device 135 not shown in the drawing, the wafer 200 and the housing case 110 are extracted to the outside of the housing in a procedure reverse to the above. The substrate processing apparatus 10 transmits a message including device information of the substrate processing apparatus 10 such as temperature information, pressure information, and gas information to the group management server 4 during the substrate processing. Further, the substrate processing apparatus 10 transmits the event information to the group management server 4 every time an event occurs. ® Next, the operation of the group management server 4 according to the embodiment of the present invention will be described. Fig. 9 is a flow chart showing the operation (S 1 0) of the group management server 4 according to the embodiment of the present invention. As shown in Fig. 9, in the group management server 4 (group management program 40), the communication unit 406 determines whether or not the message is received from the substrate processing apparatus 1. When the group management server 4 accepts the message, the process proceeds to step i〇2 (S102), and if not, the process ends. In step 102 (S102), the communication unit 406 outputs a message to the message receiving unit 408, and the message receiving unit 408 determines whether or not the output message includes event information. When the message includes event information, the group management server 4 proceeds to step 106 (S106). If the processing is not the case, the process proceeds to step 104 (S104). In step 104 (S104), the message receiving unit 408 updates the device information stored in the current information storage unit 402, and the device information included in the message is data. After the data is updated, the group management server 4 returns to the process of step 100 (S100). -20- 201013451 In step 106 (S106), the message receiving unit 408 outputs the event information included in the message to the device information registration unit 410, and the device information registration unit 410 determines whether or not the event information is designated as the storage condition. When the event information is designated as the storage condition, the group management server 4 proceeds to the processing of step 108 (S108), and if not, returns to step 100 (S100). In step 108 (S108), the device information registration unit 410 reads the device information stored in the current information storage unit 402 and is associated with the event information substrate processing device 10, so that the device information and events occur. Relevance and stored in the device information DB400. After the storage, the group management server 4 returns to the processing of step 100 (S100). As described above, in the group management server 4, the latest information in the device information of the substrate processing apparatus 10 is temporarily memorized in the current information, and the information in the current information storage unit 402 is only The event-related information defined by the definition information defining the information memory unit 404 is stored in the device information DB 400, and the operation of the group management server 4 is not limited thereto. For example, in the group management server 4, first, referring to the definition information of the definition® information storage unit 404, in the device information of the substrate processing apparatus 10, only the device information defined by the definition information is memorized in the current information memory unit. 402. In the information of the current information storage unit 402, only the information related to the event defined by the definition information of the definition information storage unit 404 is stored in the device information DB 400. Next, the browsing of information relating to the substrate processing apparatus using the terminal device 6 will be described. Fig. 10 is a diagram showing an obstacle information screen displayed on the terminal device 6. -21-.201013451 The 10th (A) diagram is an example in which the definition information storage unit 404 specifies that the category of the defined information matches the category of the device information stored at the time of the device information DB 40 0. As exemplified in Fig. 10(A), the obstacle information screen includes the obstacle content and device information at the time of occurrence of the obstacle, and the device information includes the category defined by the definition information memory unit 404 and the measurement when the obstacle occurs. Here, the measurement 对应 corresponding to all of the defined categories is displayed. The definition information stored in the definition information storage unit 404 can be changed. Therefore, when the definition information is changed, there is a case where the category specified by the definition information does not match the category of the device information at the time β. The ίο ( Β ) map is an example in which the type of information defined by the definition information storage unit 404 is different from the type of device information stored at the time of the device information DB 4 00. As exemplified in Figure 10 ( Β ), the definition of the information at the point in time is defined, and the category "pressure" is defined. When the information is defined at the desired time, the category "pressure" is not defined. The measurement 値 is not stored in the device information DB4 00. At this time, the measurement 値 is not displayed in the category “Pressure” of the obstacle information screen, and the column remains blank.
如此，變更定義資訊時，終端裝置6亦可顯示基板處 理裝置1 〇之裝置資訊中與經儲存之類別相關之資訊。此 外，由終端裝置6從群管理伺服器4取得（但未顯示於障礙 資訊畫面）與雖經儲存於裝置資訊DB400，但未定義於檢索 時之定義資訊之類別相關之測量値。 如以上說明，本發明之基板處理系統1具有依從基板 處理裝置10發送之電文，而保持基板處理裝置10之最新 -22- 201013451 之裝置資訊，並在基板處理裝置ι〇事件發生之時間，將裝 置資訊中經指定之類別與其測量値儲存於裝置資訊DB400 之群管理伺服器4、及檢索記憶於群管理伺服器4之裝置 資訊DB 40 0之裝置資訊的終端裝置6。因而，由於各時刻 之裝置資訊包含經定義之類別之測量値，故終端裝置6可 依時刻資訊，檢索裝置資訊，而於檢索時，不需回溯時間 以補足類別之測量値。藉此，由於可縮短檢索時間，故可 提高資料解析作業等作業效率。 ❹ 接著，說明群管理程式40之現在資訊記憶部402之記 憶構造之變形例及項目資訊DB4 12之記憶構造。此外，項 目資訊包含裝置資訊及事件資訊。 第1 1圖係顯示群管理程式40之現在資訊記憶部402 之記億構造之變形例及項目資訊DB4 12之記憶構造者，（A ) 例示現在資訊記憶部402，（ B)例示項目資訊DB412。 如第1 1 ( B )圖所例示，項目資訊亦可具有與製程處 方相關之資訊（例如製程處方之名稱）、晶圓圖表、〇2濃 ® 度等。即，項目資訊亦可包含各基板處理裝置10之製程資 訊。舉例言之，在晶舟217之上升開始時及上升結束時， 製程處方之名稱、晶圓圖表、〇2濃度等有變化時，使用者 藉使用終端裝置6取得與晶舟217之上升前後之時刻相關 之資訊，可確認其不同處。此外*晶圓圖表或〇2濃度等僅 爲例示，亦可記憶其他類別。 此外，本發明基板處理裝置10不僅可適用於半導體製 造裝置，亦可適用於LCD裝置等處理玻璃基板之裝置。又， -23- 201013451 本發明之基板處理裝置ι〇亦可適用於其他基板處理裝置 之曝光裝置、塗布裝置、乾燥裝置、加熱裝置等。又，本 發明之基板處理裝置10不限爐內之處理，亦可進行CVD、 PVD、形成氧化膜、氮化膜之處理及包括形成包含金屬之 膜的處理之成膜處理。再者，本發明之基板處理裝置10可 進行退火處理、氧化處理、氮化處理、擴散處理等。 又，本發明亦包含以下實施態樣。 本發明之資訊管理裝置包含有基於從處理基板之基板 ® 處理裝置發送之電文，記憶在該電文送出之時間點之前述 基板處理裝置之裝置資訊之第1裝置資訊記憶機構、使裝 置資訊與時刻具關聯性並且進行記憶之第2裝置資訊記憶 裝置、記憶移動之裝置資訊的設定及儲存該裝置資訊之條 件的條件記憶機構及當滿足記憶於前述條件記憶機構之條 件時，使滿足該條件之時刻及與記憶於前述第1裝置資訊 記憶機構之該設定一致之裝置資訊具關聯性並登錄於前述 第2裝置資訊記憶機構之登錄機構。 ® 本發明之第1基板處理系統係包含有處理基板之複數 基板處理裝置、處理從前述基板處理裝置發送之電文之資 訊管理裝置及連接於前述資訊管理裝置之終端裝置者，前 述基板處理裝置具有將具有裝置資訊或事件資訊之電文發 送至前述資訊管理裝置之發送機構，前述資訊管理裝置具 有基於從前述發送機構送出之電文，記憶在該電文發送之 時間點之前述基板處理裝置之裝置資訊之第1裝置資訊記 億機構、使裝置資訊與時刻具關聯性並且進行記憶之第2 -24- 201013451 裝置資訊記億裝置、記憶儲存裝置資訊之條件的條件記憶 機構、當記憶於前述條件記憶機構之條件與前述事件資訊 一致時，使滿足該條件之時刻及與記憶於前述第1裝置資 訊記憶機構之裝置資訊具關聯性並登錄於前述第2裝置資 訊記憶機構；前述終端裝置具有檢索記憶於前述第2裝置 資訊記憶機構之裝置資訊的檢索機構。 本發明第2基板處理系統係在第1基板處理系統中， 於前述終端機構設置顯示機構，參照記憶於前述條件記憶 ® 機構及前述第2裝置資訊記憶機構之裝置資訊，當該記憶 之裝置資訊與前述條件記憶機構之內容一致時，便於前述 顯示機構顯示 本發明第3基板處理系統係在第1基板處理系統中， 前述基板處理裝置具有檢索儲存於第2裝置資訊記憶機構 之裝置資訊之檢索機構，並且具有顯示以前述檢索機構檢 索之裝置資訊之顯示機構。 本發明第1資料檢索方法係接收預先儲存於儲存從裝 置發送之最新之資料之第1儲存機構、並預先設定之預定 資料時，將儲存在前述第1儲存機構之資料之至少一部份 資料附加前述預定資料發生之時刻，而儲存於第2儲存機 構，並檢索該儲存之資料。 本發明之第2資料檢索方法係在參照預先儲存於儲存 從裝置發送之最新之資料之第1儲存機構、並設定有預定 資料及僅於該預定資料發生時移動至第2儲存機構之資料 的參數’而接收前述預定資料時，將儲存於前述第1儲存 -25- 201013451 機構之資料之至少一部份之資料儲存於第2儲存機構，並 檢索該儲存之資料。 本發明之第1資料檢索系統具有將從處理裝置所發送 之資料寫入而保持之第1儲存機構、依設定有預定資料及 接收該預定資料時，從前述第1儲存機構移動之資料的參 數，儲存儲存在前述第1儲存機構之資料之第2儲存機構 及檢索該儲存之資料之終端機構。 本發明之第2資料檢索系統係在第1資料檢索系統 ® 中，於前述終端機構設置顯示機構，並檢索前述參數與前 述儲存之資料，當該儲存之資料與前述參數之內容一致 時，便於前述顯示機構顯示。 本發明之第3資料檢索系統係在第1資料檢索系統 中，前述處理裝置具有檢索儲存於第2儲存機構之資訊之 檢索機構，並且具有顯示由前述檢索機構所檢索之資料之 顯示機構。 ^ 【圖式簡單說明】 第1圖係顯示記憶於習知群管理伺服器之裝置資訊及 其構造、與所記憶之裝置資訊之檢索方法者。 第2圖係顯示本發明實施形態之基板處理系統1之結 構者。 第3圖顯示本發明實施形態之基板處理裝置10之立體 圖。 第4圖顯示本發明實施形態之基板處理裝置10之側面 -26- 201013451 透視圖。 第5圖顯示以PMC 14爲中心之基板處理裝置1〇之功 能結構。 第6圖係以控制裝置1 6爲中心，顯示終端裝置6之硬 體結構者。 第7圖係顯示以群管理伺服器4執行之群管理程式40 及以終端裝置6執行之終端程式60之功能結構者。 第8圖係模式地顯示群管理程式40之現在資訊記憶部 ® 402及裝置資訊DB400之記憶構造者，（A)係例示現在資 訊記憶部402，（ B)係例示裝置資訊DB40 0。 第9圖係顯示本發明實施形態之群管理伺服器4之動 作（S 1 0 )之流程圖。 第10圖係例示顯示於終端裝置6之障礙資訊畫面者。 第1 1圖係顯示群管理程式40之現在資訊記憶部402 之記憶構造之變形例及項目資訊DB412之記憶構造者，（A ) 例示現在資訊記憶部4 02，（B)例示項目資訊DB412。 〇 【主要元件符號說明】Thus, when the definition information is changed, the terminal device 6 can also display information related to the stored category in the device information of the substrate processing device 1. Further, the terminal device 6 acquires (but does not display the obstacle information screen) from the group management server 4 and the measurement information related to the type of the definition information stored in the device information DB 400 but not defined at the time of the search. As described above, the substrate processing system 1 of the present invention has the device information transmitted by the substrate processing apparatus 10, and holds the latest information of the substrate processing apparatus 10, -22-201013451, and at the time when the substrate processing apparatus ι event occurs, The group information management server 4 stored in the device information DB 400 and the terminal device 6 for retrieving the device information stored in the device information DB 40 0 of the group management server 4 are specified in the device information. Therefore, since the device information at each time includes the measurement information of the defined category, the terminal device 6 can retrieve the device information according to the time information, and at the time of the retrieval, the backtracking time is not required to make up the measurement of the category. As a result, the search time can be shortened, so that work efficiency such as data analysis work can be improved. Next, a modification of the memory structure of the current information storage unit 402 of the group management program 40 and a memory structure of the item information DB 4 12 will be described. In addition, project information includes device information and event information. Fig. 1 shows a modification of the information structure of the current information storage unit 402 of the group management program 40 and a memory structure of the item information DB4 12, (A) exemplifies the current information storage unit 402, and (B) illustrates the item information DB 412. . As illustrated in Figure 1 1 (B), the project information may also have information related to the process location (such as the name of the process recipe), wafer chart, 〇 2 concentration ® degree, and so on. That is, the project information may also include process information of each substrate processing apparatus 10. For example, when the name of the process recipe, the wafer chart, the 〇2 concentration, and the like are changed at the start of the rise of the wafer boat 217 and at the end of the rise, the user obtains the rise and fall of the wafer boat 217 by using the terminal device 6 Information about the moment can confirm the difference. In addition, the *wafer chart or 〇2 concentration is only shown as an example, and other categories can be memorized. Further, the substrate processing apparatus 10 of the present invention can be applied not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate such as an LCD apparatus. Further, -23-201013451 The substrate processing apparatus ι of the present invention can also be applied to an exposure apparatus, a coating apparatus, a drying apparatus, a heating apparatus, and the like of another substrate processing apparatus. Further, the substrate processing apparatus 10 of the present invention is not limited to the treatment in the furnace, and may be subjected to CVD, PVD, treatment for forming an oxide film or a nitride film, and film formation treatment including a treatment for forming a film containing a metal. Further, the substrate processing apparatus 10 of the present invention can perform an annealing treatment, an oxidation treatment, a nitriding treatment, a diffusion treatment, and the like. Further, the present invention also encompasses the following embodiments. The information management device of the present invention includes a first device information memory mechanism that stores device information transmitted from a substrate processing device of the processing substrate, and stores device information of the substrate processing device at a time point when the message is sent, and device information and time. a conditional memory mechanism for correlating and memorizing the second device information memory device, the device information for memory movement, and the condition for storing the information of the device, and satisfying the condition when the condition of the memory device is satisfied The time and the device information that is consistent with the setting of the first device information storage means are associated with the registration means of the second device information storage means. The first substrate processing system of the present invention includes a plurality of substrate processing apparatuses for processing a substrate, an information management device for processing a message transmitted from the substrate processing device, and a terminal device connected to the information management device, wherein the substrate processing device has Transmitting a message having device information or event information to a transmitting device of the information management device, wherein the information management device has a device message sent from the transmitting device, and memorizes device information of the substrate processing device at a time point when the message is transmitted. The first device information is recorded in the billions of institutions, and the device information is correlated with the time and stored. 2 -24- 201013451 Device Information The conditional memory mechanism for the conditions of the device and the memory storage device information is stored in the aforementioned condition memory mechanism. When the condition is consistent with the event information, the time at which the condition is satisfied is associated with the device information stored in the first device information storage means and registered in the second device information storage means; the terminal device has a search memory The second device information memory The search agency for the device information of the organization. In the second substrate processing system of the present invention, in the first substrate processing system, the display means is provided in the terminal mechanism, and the device information stored in the condition memory management means and the second device information memory means is referred to, and the device information is stored. When the content of the condition memory device is matched, the display device is configured to display the third substrate processing system of the present invention in the first substrate processing system, and the substrate processing device has a search for the device information stored in the second device information memory mechanism. The institution has a display mechanism that displays device information retrieved by the aforementioned search institution. The first data search method of the present invention receives at least a portion of the data stored in the first storage organization when the first storage means for storing the latest data transmitted from the device and the predetermined data set in advance are received. The moment when the predetermined data is generated is added to the second storage institution, and the stored data is retrieved. The second data search method of the present invention refers to a data stored in advance to the first storage means for storing the latest data transmitted from the device, and the predetermined data is set and the data is moved to the second storage means only when the predetermined data is generated. The data of the at least part of the information stored in the first storage -25 - 201013451 institution is stored in the second storage facility and the stored data is retrieved. The first data search system of the present invention has a first storage means for writing and holding data transmitted from the processing device, and a parameter for moving data from the first storage means when the predetermined data is set and the predetermined data is received. And storing a second storage facility storing the information of the first storage institution and a terminal mechanism for retrieving the stored data. In the first data search system of the present invention, in the first data search system, the display means is provided in the terminal mechanism, and the parameters and the stored data are searched for, and when the stored data matches the contents of the parameters, it is convenient. The aforementioned display mechanism is displayed. The third data search system of the present invention is the first data search system, wherein the processing device has a search means for searching for information stored in the second storage means, and has a display means for displaying the data retrieved by the search means. ^ [Simple description of the diagram] Figure 1 shows the device information and its structure and the retrieval method of the device information stored in the learned group management server. Fig. 2 is a view showing the structure of the substrate processing system 1 according to the embodiment of the present invention. Fig. 3 is a perspective view showing a substrate processing apparatus 10 according to an embodiment of the present invention. Fig. 4 is a perspective view showing the side surface -26-201013451 of the substrate processing apparatus 10 according to the embodiment of the present invention. Fig. 5 shows the functional structure of the substrate processing apparatus 1 centered on the PMC 14. Fig. 6 is a view showing the hardware structure of the terminal device 6 centering on the control device 16. Fig. 7 shows the functional configuration of the group management program 40 executed by the group management server 4 and the terminal program 60 executed by the terminal device 6. Fig. 8 is a diagram showing the memory structure of the current information memory unit 402 and the device information DB 400 of the group management program 40. (A) shows the current information storage unit 402, and (B) shows the device information DB 40 0. Fig. 9 is a flow chart showing the operation (S 1 0) of the group management server 4 according to the embodiment of the present invention. Fig. 10 is a diagram showing an obstacle information screen displayed on the terminal device 6. The first embodiment shows a modification of the memory structure of the current information storage unit 402 of the group management program 40 and a memory structure of the item information DB 412. (A) illustrates the current information storage unit 242, and (B) illustrates the item information DB 412. 〇 [Main component symbol description]
1 基 板 處 理 系 統 4 群 管 理 伺 服 器 6 終 端 裝 置 10 基 板 處 理 裝 置 12 網 路 16 控 制 裝 置 18 CPU -27- 201013451 20 記 憶 體 22 通 信 IF 24 顯 示 /輸入裝置 26 記 憶 裝 置 40 群 管 理 程 式 400 裝 置 資 訊 DB 402 現 在 資 訊 記憶 部 404 定 義 資 訊 記憶 部 406 通 信 部 408 電 文 受 理 部 410 裝 置 資 訊 登錄 部 412 項 巨 資 訊 DB 60 終 端 程 式 600 U1 :部 602 裝 置 資 訊 取得 部 604 畫 面 生 成 部 參 -281 Substrate processing system 4 Group management server 6 Terminal device 10 Substrate processing device 12 Network 16 Control device 18 CPU -27- 201013451 20 Memory 22 Communication IF 24 Display/input device 26 Memory device 40 Group management program 400 Device information DB 402 Current Information Memory Unit 404 Definition Information Memory Unit 406 Communication Unit 408 Message Acceptance Unit 410 Device Information Registration Unit 412 Item Information DB 60 Terminal Program 600 U1: Unit 602 Device Information Acquisition Unit 604 Screen Generation Unit Reference -28