JP2012059724A - Substrate processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing system capable of identifiably managing device data pieces acquired per main step and per sub-step.SOLUTION: The substrate processing system: acquires device data of a substrate processing device per main step or per sub-step; assigns step identifies for uniquely identifying steps relating to the device data to the acquired device data pieces; transmits the device data pieces to which the step identifiers are assigned to a group management device; receives the device data pieces to which the step identifiers are assigned from the substrate processing device; stores the device data pieces to which the step identifiers are assigned in a storage part; and reads all the device data pieces and step identifiers of a process recipe from the storage part and creates a file which can be output when detecting completion of a final step of the process recipe.

Description

  The present invention relates to a substrate processing system.

  The substrate processing system includes a substrate processing apparatus that executes a substrate processing process, and a group management apparatus connected to the substrate processing apparatus. The substrate processing apparatus executes a substrate processing process based on a process recipe in which processing procedures and processing conditions are defined. This process recipe has a plurality of main steps indicating main processing steps from the start to the completion of the substrate processing process.

  The substrate processing apparatus acquires apparatus data indicating the state of the processing furnace (temperature, pressure, gas flow rate, etc.) for each main step in order to manage processing conditions during the substrate processing process. The acquired device data is transmitted to the group management device after a step identifier for identifying the main step from which the respective device data is acquired is given. The transmitted device data is stored and managed in the group management device in association with the step identifier.

  Until now, when creating a process recipe, the step identifier of the main step and the step identifier of the sub step are set separately, so that the managed device data is stored in either the main step or the sub step. In some cases, it was not possible to determine whether it was acquired with So far, only the device data acquired in the main step has been managed. However, in recent years, in order to accurately grasp the status of the apparatus, only the data acquired in the main step is insufficient, and the data acquired in the sub step has to be managed together.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing system capable of managing the apparatus data acquired in the main step and the sub-step so as to be identifiable. And

  According to one aspect of the present invention, a substrate processing system comprising: a substrate processing apparatus that executes a substrate processing process based on a process recipe having a plurality of main steps; and a group management apparatus connected to the substrate processing apparatus. And any one of the plurality of main steps has one or more sub-steps, and the substrate processing apparatus acquires apparatus data of the substrate processing apparatus for each main step or sub-step The device data is provided with a step identifier for uniquely identifying the main step or the sub-step related to the device data, and the device data with the step identifier is transmitted to the group management device, The group management apparatus receives the apparatus data to which the step identifier is assigned from the substrate processing apparatus, and receives the step identification. The device data to which the child is assigned is stored in a storage unit, and when it is detected that the last main step or the sub step of the process recipe is completed, all the device data and the step identifier of the process recipe are stored. There is provided a substrate processing system configured to create a file that can be read out and output from the storage unit.

According to the substrate processing system of the present invention, it is possible to provide a substrate processing system capable of managing the apparatus data acquired in the main step and the sub-step so as to be identifiable.

1 is a schematic configuration diagram of a substrate processing system according to a first embodiment of the present invention. 1 is a block configuration diagram of a substrate processing system and a group management apparatus according to a first embodiment of the present invention. It is a figure which illustrates the step structure of the process recipe which concerns on the 1st Embodiment of this invention. It is a flowchart figure which illustrates operation | movement of the substrate processing system which concerns on the 1st Embodiment of this invention. It is a figure which illustrates the composition of Step ID concerning a 1st embodiment of the present invention. It is a figure which illustrates the structure of the process recipe which concerns on the 3rd Embodiment of this invention. It is a figure which illustrates the structure of step ID which concerns on the 3rd Embodiment of this invention. It is a figure which illustrates the structure of the process recipe which concerns on the 4th Embodiment of this invention. It is a figure which illustrates the structure of step ID which concerns on the 4th Embodiment of this invention. 1 is a perspective view of a substrate processing apparatus according to a first embodiment of the present invention. 1 is a side perspective view of a substrate processing apparatus according to a first embodiment of the present invention. It is a longitudinal cross-sectional view of the processing furnace of the substrate processing apparatus concerning the 1st Embodiment of this invention.

<First Embodiment of the Present Invention>
The first embodiment of the present invention will be described below.

(1) Configuration of Substrate Processing System First, the configuration of the substrate processing system according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic configuration diagram of a substrate processing system according to a first embodiment of the present invention.

  As shown in FIG. 1, the substrate processing system according to this embodiment includes at least one substrate processing apparatus that repeatedly executes a substrate processing process based on a process recipe having a plurality of main steps in which processing procedures and processing conditions are defined. 100 and a group management apparatus 500 connected to the substrate processing apparatus 100 so as to exchange data. The substrate processing apparatus 100 and the group management apparatus 500 are connected by a network 400 such as a local line (LAN) or a wide area line (WAN).

(2) Configuration of Substrate Processing Apparatus Next, the configuration of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS. 10 and 11. FIG. 10 is a perspective view of the substrate processing apparatus according to the first embodiment of the present invention. FIG. 11 is a side perspective view of the substrate processing apparatus according to the first embodiment of the present invention. The substrate processing apparatus 100 according to the present embodiment is configured as a vertical apparatus that performs oxidation, diffusion processing, CVD processing, and the like on a substrate such as a wafer.

As shown in FIGS. 10 and 11, the substrate processing apparatus 100 according to the present embodiment includes a casing 111 configured as a pressure vessel. A front maintenance port 103 serving as an opening provided for maintenance is provided in the front front portion of the front wall 111a of the casing 111. The front maintenance port 103 is provided with a pair of front maintenance doors 104 that open and close the front maintenance port 103. A pod (substrate container) 110 containing a wafer (substrate) 200 such as silicon is used as a carrier for transporting the wafer 200 into and out of the housing 111.

  A pod loading / unloading port (substrate container loading / unloading port) 112 is opened on the front wall 111 a of the housing 111 so as to communicate between the inside and the outside of the housing 111. The pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113. A load port (substrate container delivery table) 114 is installed on the front front side of the pod loading / unloading port 112. On the load port 114, the pod 110 is placed and aligned. The pod 110 is configured to be transferred onto the load port 114 by an in-process transfer device (not shown).

  A rotary pod shelf (substrate container mounting shelf) 105 is installed at an upper portion of the housing 111 at a substantially central portion in the front-rear direction. A plurality of pods 110 are stored on the rotary pod shelf 105. The rotary pod shelf 105 includes a support column 116 that is erected vertically and intermittently rotates in a horizontal plane, and a plurality of shelf plates (substrate container mounting table) that are radially supported by the support column 116 at each of the upper, middle, and lower levels. 117). The plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where they are mounted.

  A pod transfer device (substrate container transfer device) 118 is installed between the load port 114 and the rotary pod shelf 105 in the housing 111. The pod transfer device 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transfer mechanism (substrate container transfer mechanism) 118b as a transfer mechanism. The pod transfer device 118 moves the pod 110 between the load port 114, the rotary pod shelf 105, and the pod opener (substrate container lid opening / closing mechanism) 121 by the continuous operation of the pod elevator 118a and the pod transfer mechanism 118b. It is comprised so that it may convey mutually.

  A sub-housing 119 is provided at a lower portion in the housing 111 from a substantially central portion in the front-rear direction in the housing 111 to a rear end. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 that transfer the wafer 200 into and out of the sub-casing 119 are provided on the front wall 119a of the sub-casing 119 so as to be arranged vertically in two stages. Yes. Pod openers 121 are respectively installed at the upper and lower wafer loading / unloading ports 120.

  Each pod opener 121 includes a pair of mounting bases 122 on which the pod 110 is mounted, and a cap attaching / detaching mechanism (lid attaching / detaching mechanism) 123 that attaches / detaches a cap (cover) of the pod 110. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

  In the sub casing 119, a transfer chamber 124 that is fluidly isolated from a space in which the pod transfer device 118, the rotary pod shelf 105, and the like are installed is configured. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124. The wafer transfer mechanism 125 includes a wafer transfer device (substrate transfer device) 125a that can rotate or linearly move the wafer 200 in the horizontal direction, and a wafer transfer device elevator (substrate transfer device) that moves the wafer transfer device 125a up and down. (Elevating mechanism) 125b. As shown in FIG. 10, the wafer transfer device elevator 125 b is installed between the right end of the front area of the transfer chamber 124 of the sub-housing 119 and the right end of the housing 111. The wafer transfer device 125 a includes a tweezer (substrate holding body) 125 c as a mounting portion for the wafer 200. By continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a, the wafer 200 can be loaded (charged) and unloaded (discharged) from the boat (substrate holder) 217. It is configured.

  In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured. A processing furnace 202 serving as a substrate processing system is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 147.

  As shown in FIG. 10, a boat elevator (substrate holder lifting mechanism) 115 for raising and lowering the boat 217 is installed between the right end of the standby section 126 and the right end of the casing 111 of the sub casing 119. ing. An arm 128 as a connecting tool is connected to the elevator platform of the boat elevator 115. A seal cap 219 serving as a lid is horizontally installed on the arm 128. The seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.

  The boat 217 includes a plurality of holding members. The boat 217 is configured to hold a plurality of wafers 200 (for example, about 50 to 125 wafers) horizontally in a state where the centers are aligned in the vertical direction.

  As shown in FIG. 10, clean air 133, which is a cleaned atmosphere or an inert gas, is supplied to the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side. A clean unit 134 composed of a supply fan and a dustproof filter is installed. Although not shown, a notch alignment device as a substrate alignment device for aligning the circumferential position of the wafer is installed between the wafer transfer device 125a and the clean unit 134.

  The clean air 133 blown out from the clean unit 134 flows around the boat 217 in the notch alignment device, wafer transfer device 125a, and standby unit 126 (not shown), and is then sucked in by a duct (not shown) to the outside of the casing 111. Or is circulated to the primary side (supply side) that is the suction side of the clean unit 134 and is blown out again into the transfer chamber 124 by the clean unit 134.

(3) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS.

  As shown in FIGS. 10 and 11, when the pod 110 is supplied to the load port 114, the pod loading / unloading port 112 is opened by the front shutter 113. Then, the pod 110 on the load port 114 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying device 118.

  The pod 110 carried into the housing 111 is automatically transported and temporarily stored on the shelf plate 117 of the rotary pod shelf 105 by the pod transport device 118, and then one of the pods 110 from the shelf plate 117. It is transferred onto the mounting table 122 of the pod opener 121. Note that the pod 110 carried into the housing 111 may be directly transferred onto the mounting table 122 of the pod opener 121 by the pod transfer device 118. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and clean air 133 is circulated and filled in the transfer chamber 124. For example, when the transfer chamber 124 is filled with nitrogen gas as clean air 133, the oxygen concentration in the transfer chamber 124 becomes, for example, 20 ppm or less, which is much lower than the oxygen concentration in the casing 111 that is an atmospheric atmosphere. It is set to be.

  The pod 110 mounted on the mounting table 122 is pressed against the opening edge of the wafer loading / unloading port 120 in the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. Then, the wafer loading / unloading port is opened. Thereafter, the wafer 200 is picked up from the pod 110 through the wafer loading / unloading port by the tweezer 125c of the wafer transfer device 125a, aligned in the notch alignment device, and then in the standby unit 126 at the rear of the transfer chamber 124. Are loaded into the boat 217 (charging). The wafer transfer device 125 a loaded with the wafer 200 in the boat 217 returns to the pod 110 and loads the next wafer 200 into the boat 217.

  During the loading operation of the wafer into the boat 217 by the wafer transfer mechanism 125 in the one (upper or lower) pod opener 121, another pod is placed on the mounting table 122 of the other (lower or upper) pod opener 121. 110 is transferred from the rotary pod shelf 105 by the pod transfer device 118 and transferred, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end portion of the processing furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Subsequently, the boat 217 holding the wafer 200 group is loaded into the processing furnace 202 when the seal cap 219 is lifted by the boat elevator 115.

  After loading, arbitrary processing is performed on the wafer 200 in the processing furnace 202. After the processing, the boat 217 storing the processed wafers 200 is unloaded from the processing chamber 201 in a procedure almost opposite to the above procedure except for the wafer alignment process in the notch aligner 135, and the processed wafers are processed. The pod 110 storing 200 is carried out of the casing 111.

(4) Configuration of Processing Furnace Next, the configuration of the processing furnace 202 according to the present embodiment will be described with reference to FIG. FIG. 12 is a longitudinal sectional view of the processing furnace 202 of the substrate processing apparatus 100 according to the first embodiment of the present invention.

As shown in FIG. 12, the processing furnace 202 includes a process tube 203 as a reaction tube. The process tube 203 includes an inner tube 204 as an internal reaction tube and an outer tube 205 as an external reaction tube provided on the outside thereof. The inner tube 204 is made of a heat-resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC), and is formed in a cylindrical shape having upper and lower ends opened. A processing chamber 201 for processing a wafer 200 as a substrate is formed in a hollow cylindrical portion in the inner tube 204. The processing chamber 201 is configured to accommodate a boat 217 described later. The outer tube 205 is provided concentrically with the inner tube 204. The outer tube 205 has an inner diameter larger than the outer diameter of the inner tube 204, is formed in a cylindrical shape with the upper end closed and the lower end opened. The outer tube 205 is made of a heat resistant material such as quartz or silicon carbide.

  A heater 206 as a heating mechanism is provided outside the process tube 203 so as to surround the side wall surface of the process tube 203. The heater 206 has a cylindrical shape and is vertically installed by being supported by a heater base 251 as a holding plate.

A manifold 209 is disposed below the outer tube 205 so as to be concentric with the outer tube 205. The manifold 209 is made of, for example, stainless steel and is formed in a cylindrical shape with an upper end and a lower end opened. The manifold 209 is engaged with the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205, and is provided so as to support them. An O-ring 220a as a seal member is provided between the manifold 209 and the outer tube 205. By supporting the manifold 209 on the heater base 251, the process tube 203 is installed vertically. A reaction vessel is formed by the process tube 203 and the manifold 209.

  A nozzle 230 as a gas introduction unit is connected to a seal cap 219 described later so as to communicate with the inside of the processing chamber 201. A gas supply pipe 232 is connected to the nozzle 230. On the upstream side of the gas supply pipe 232 (on the side opposite to the side connected to the nozzle 230), a processing gas supply source, an inert gas supply source, etc. (not shown) are connected via an MFC (mass flow controller) 241 as a gas flow rate controller. Is connected. A gas flow rate control unit 235 is electrically connected to the MFC 241. The gas flow rate control unit 235 is configured to control the MFC 241 so that the flow rate of the gas supplied into the processing chamber 201 becomes a desired flow rate at a desired timing.

  The manifold 209 is provided with an exhaust pipe 231 that exhausts the atmosphere in the processing chamber 201. The exhaust pipe 231 is disposed at the lower end portion of the cylindrical space 250 formed by the gap between the inner tube 204 and the outer tube 205 and communicates with the cylindrical space 250. On the downstream side of the exhaust pipe 231 (on the side opposite to the connection side with the manifold 209), a pressure sensor 245 as a pressure detector, for example, a pressure adjusting device 242 configured as an APC (Auto Pressure Controller), a vacuum such as a vacuum pump, etc. The exhaust device 246 is connected in order from the upstream side. A pressure controller 236 is electrically connected to the pressure adjusting device 242 and the pressure sensor 245. The pressure control unit 236 is configured to control the pressure adjustment device 242 so that the pressure in the processing chamber 201 becomes a desired pressure at a desired timing based on the pressure value detected by the pressure sensor 245. ing.

  Below the manifold 209, a seal cap 219 is provided as a furnace port lid that can airtightly close the lower end opening of the manifold 209. The seal cap 219 is brought into contact with the lower end of the manifold 209 from the lower side in the vertical direction. The seal cap 219 is made of a metal such as stainless steel and has a disk shape. On the upper surface of the seal cap 219, an O-ring 220b is provided as a seal member that comes into contact with the lower end of the manifold 209. A rotation mechanism 254 for rotating the boat is installed near the center of the seal cap 219 and on the side opposite to the processing chamber 201. The rotation shaft 255 of the rotation mechanism 254 passes through the seal cap 219 and supports the boat 217 from below. The rotation mechanism 254 is configured to rotate the wafer 200 by rotating the boat 217. The seal cap 219 is configured to be lifted and lowered in the vertical direction by a boat elevator 115 as a lifting mechanism vertically installed outside the process tube 203. By moving the seal cap 219 up and down, the boat 217 can be transferred into and out of the processing chamber 201. A mechanical control unit 238 is electrically connected to the rotation mechanism 254 and the boat elevator 115. The mechanical control unit 238 is configured to control the rotation mechanism 254 and the boat elevator 115 so as to perform a desired operation at a desired timing.

  As described above, the boat 217 as a substrate holder is configured to hold a plurality of wafers 200 in a multi-stage by aligning the wafers 200 in a horizontal posture and in a state where their centers are aligned with each other. The boat 217 is made of a heat resistant material such as quartz or silicon carbide. At the bottom of the boat 217, a plurality of heat insulating plates 216 as a disk-shaped heat insulating member made of a heat resistant material such as quartz or silicon carbide are arranged in multiple stages in a horizontal posture. It is configured to be difficult to be transmitted to the manifold 209 side.

  A temperature sensor 263 is installed in the process tube 203 as a temperature detector. A temperature controller 237 is electrically connected to the heater 206 and the temperature sensor 263. Based on the temperature information detected by the temperature sensor 263, the temperature control unit 237 adjusts the power supply to the heater 206 so that the temperature in the processing chamber 201 becomes a desired temperature distribution at a desired timing. It is configured.

  The gas flow rate control unit 235, the pressure control unit 236, the mechanical control unit 238, and the temperature control unit 237 are electrically connected to a display device control unit 239 as a main control unit that controls the entire substrate processing apparatus (hereinafter, referred to as “the control unit 239”). (The gas flow rate control unit 235, the pressure control unit 236, and the temperature control unit 237 are also called I / O control units). The gas flow rate control unit 235, the pressure control unit 236, the mechanical control unit 238, the temperature control unit 237, and the display device control unit 239 as a main control unit are configured as a substrate processing apparatus controller 240. The configuration and operation of the substrate processing apparatus controller 240 will be described later.

(5) Operation of Processing Furnace Subsequently, as one step of the semiconductor device manufacturing process, a method of forming a thin film on the wafer 200 by the CVD method using the processing furnace 202 according to the above configuration will be described with reference to FIG. explain. In the following description, the operation of each part constituting the substrate processing apparatus is controlled by the substrate processing apparatus controller 240.

  When a plurality of wafers 200 are loaded into the boat 217 (wafer charge), the boat 217 holding the plurality of wafers 200 is lifted by the boat elevator 115 and loaded into the processing chamber 201 as shown in FIG. (Boat loading). In this state, the seal cap 219 seals the lower end of the manifold 209 via the O-ring 220b.

  The processing chamber 201 is evacuated by the evacuation device 246 so that a desired pressure (degree of vacuum) is obtained. At this time, based on the pressure value measured by the pressure sensor 245, the pressure adjusting device 242 (the opening degree of the valve) is feedback-controlled. In addition, the heater 206 is heated so that the inside of the processing chamber 201 has a desired temperature. At this time, the energization amount to the heater 206 is feedback controlled based on the temperature value detected by the temperature sensor 263. Subsequently, the boat 217 and the wafers 200 are rotated by the rotation mechanism 254.

  Next, the gas supplied from the processing gas supply source and controlled to have a desired flow rate by the MFC 241 flows through the gas supply pipe 232 and is introduced into the processing chamber 201 from the nozzle 230. The introduced gas rises in the processing chamber 201, flows out from the upper end opening of the inner tube 204 into the cylindrical space 250, and is exhausted from the exhaust pipe 231. The gas comes into contact with the surface of the wafer 200 when passing through the processing chamber 201, and at this time, a thin film is deposited on the surface of the wafer 200 by a thermal CVD reaction.

  When a preset processing time has passed, an inert gas is supplied from an inert gas supply source, the inside of the processing chamber 201 is replaced with an inert gas, and the pressure in the processing chamber 201 is returned to normal pressure. .

  Thereafter, the seal cap 219 is lowered by the boat elevator 115 to open the lower end of the manifold 209, and the boat 217 holding the processed wafer 200 is carried out from the lower end of the manifold 209 to the outside of the process tube 203 (boat unloading). Loading). Thereafter, the processed wafer 200 is taken out from the boat 217 and stored in the pod 110 (wafer discharge).

(6) Configuration of Substrate Processing Apparatus Controller Next, the configuration of the substrate processing apparatus controller 240 according to the present embodiment will be described with reference to FIG. FIG. 2 is a block configuration diagram of the substrate processing apparatus 100 and the group management apparatus 500 according to an embodiment of the present invention.

  The substrate processing apparatus controller 240 can exchange data with the I / O control unit (gas flow rate control unit 235, pressure control unit 236, temperature control unit 237) that controls the processing furnace 202, and the I / O control unit. And the above-described processing control unit 239a connected in such a manner. The processing control unit 239a is configured to control the operation of the processing furnace 202 via the I / O control unit and to acquire (read) data indicating the state (temperature, gas flow rate, pressure, etc.) of the processing furnace 202. Has been.

  The substrate processing apparatus controller 240 includes a display device control unit 239 as a main control unit connected to the processing control unit 239a so as to exchange data. The display device control unit 239 is configured to be connected to a data display unit 240a such as a display and an input unit 240b such as a keyboard. The display device control unit 239 receives an input (input of an operation command or the like) from the input unit 240b by an operator, and displays a status display screen or an operation input reception screen of the substrate processing apparatus 100 on the data display unit 240a. It is configured.

  Further, the substrate processing apparatus controller 240 is connected to the display device control unit 239 as the main control unit so that data can be exchanged, and is connected to the mechanical control unit 238 so that data can be exchanged. And a mechanical mechanism I / O 238a. Each part (for example, pod elevator 118a, pod transfer mechanism 118b, pod opener 121, wafer transfer mechanism 125, boat elevator 115, etc.) constituting the substrate processing apparatus 100 is connected to the mechanical mechanism I / O 238a. The mechanical control unit 238 controls the operation of each part constituting the substrate processing apparatus 100 via the mechanical mechanism I / O 238a, and the state of each part constituting the substrate processing apparatus 100 (for example, position, open / closed state, and operation). Device data indicating whether the device is in a weighted state or the like).

  Further, the substrate processing apparatus controller 240 includes a data holding unit 239e connected to a display device control unit 239 as a main control unit. The data holding unit 239e includes a program for realizing various functions in the substrate processing apparatus controller 240, a process recipe in which processing procedures and processing conditions of the substrate processing process performed in the processing furnace 202 are defined, The apparatus data read from the O control unit (gas flow rate control unit 235, pressure control unit 236, temperature control unit 237) or mechanical mechanism I / O 238a is held (stored).

  Here, the step configuration of the process recipe will be briefly described with reference to the drawings. FIG. 3 is a diagram illustrating a step configuration of the process recipe according to the first embodiment of the present invention. The process recipe has a plurality of main steps M as illustrated in FIG. One of the plurality of main steps M has one or more sub-steps S. In the process recipe, the process is executed sequentially from the leftmost main step M (step 1) to the rightmost main step M (step 6). That is, according to FIG. 3, in this process recipe, steps 1 and 2 of the main step M, steps 1 to 5 of the sub-step S, and steps 3 to 6 of the main step M are sequentially executed.

Here, the above-described operation of the processing furnace 202 is applied to the main step M and the sub-step S shown in FIG. In the main step M, the main process contents from the start to the completion of the substrate processing process are shown. The wafer loading process into the processing furnace 202, the evacuation and heating process in the processing furnace 202, the thermal CVD processing process, the processing furnace An inert gas supply and atmospheric pressure return process into the 202 and a wafer unloading process from the processing furnace 202 are applied. Among these main steps M, the thermal CVD process includes a gas supply process and a gas exhaust process that are executed under different process conditions. Therefore, a gas supply process and a gas exhaust process are applied to the substep S.

  The substrate processing apparatus controller 240 also has an I / O control unit (a gas flow rate control unit 235, a pressure control unit 236, and a temperature control unit 237) for each step (main step M, sub step S) of the process recipe. And device data is read from the mechanical mechanism I / O 238a. Further, the substrate processing apparatus controller 240 uniquely identifies the main step M or the sub-step S that has acquired the respective apparatus data from the apparatus data read at each step (main step M, sub-step S). An ID (step identifier) is provided.

  Details of the step ID will be described with reference to FIG. FIG. 5 is a diagram illustrating the configuration of the step ID according to the first embodiment of the invention. The block diagram of the step ID in FIG. 5 shows the steps executed in the process recipe arranged sequentially in the order of execution. In FIG. 5, along with the process recipe of FIG. 3, step IDs of the respective steps are sequentially arranged from the left end to the right end. As shown in FIG. 5, each step number (1, 2,..., 6) in FIG. 3 is assigned to the main step M as a step ID. As shown in FIG. 5, numbers (1501, 1502,..., 1505) set so as not to overlap with the step ID of the main step M are assigned to the substeps S as step IDs.

  Further, the substrate processing apparatus controller 240 includes a communication control unit 239b connected to a display device control unit 239 as a main control unit. Although not shown, the above-described I / O control unit (gas flow rate control unit 235, pressure control unit 236, temperature control unit 237) and mechanical control unit 238 do not go through the display device control unit 239 as the main control unit. The communication control unit 239b is also connected so that data can be directly exchanged. The communication control unit 239b is connected so that data can be exchanged via the group management device 500 and the network 400, which will be described later.

  The communication control unit 239b is a device that indicates the state (temperature, gas flow rate, pressure, etc.) of the processing furnace 202 read out via the I / O control unit (gas flow rate control unit 235, pressure control unit 236, temperature control unit 237). The data to which the step ID is assigned is received via the processing control unit 239a and the display device control unit 239, and can be transmitted to the group management device 500. Further, the communication control unit 239b is a device data indicating the state (position, opening / closing state, operating or weighted state, etc.) of each part constituting the substrate processing apparatus 100 read out via the mechanical mechanism I / O 238a. Are provided with a step ID, and can be received via the mechanical control unit 238 and the display device control unit 239 and transmitted to the group management device 500.

(7) Configuration of Group Management Apparatus Next, the configuration of the group management apparatus 500 according to the present embodiment configured to exchange data with the substrate processing apparatus 100 described above will be described with reference mainly to FIG. .

The group management apparatus 500 includes a control unit 501 configured as a central processing unit (CPU), a memory having a shared memory 502 area therein, and a data holding unit 503 as a storage unit configured as a storage device such as an HDD. The computer includes a data display unit 505 such as a display device, an input unit 506 such as a keyboard, and a communication control unit 504 as a communication unit. The memory, the data holding unit (storage unit) 503, the data display unit 505, the input unit 506, and the communication control unit 504 are configured to exchange data with the control unit 501 through an internal bus or the like. The control unit 501 has a clock function (not shown).

  The data holding unit 503 stores a group management program (not shown), and the group management program is read from the data holding unit 503 to the above-described memory and executed by the control unit 501.

(8) Data Processing Method in Substrate Processing System Next, an example of a data processing method performed in the substrate processing system according to the present embodiment will be described. FIG. 4 is a flowchart illustrating the operation of the substrate processing system according to the first embodiment of the present invention. FIG. 4A shows a processing flow of the substrate processing apparatus 100, and FIG. The processing flow of the group management apparatus 500 is shown.

  As shown in FIGS. 4A and 4B, the data processing method according to the present embodiment includes a process recipe storage step S10, a process recipe execution step S20, a device data acquisition step S30, and device data transmission. Step S40, device data reception step S50, device data storage step S60, determination step S70, device data file creation step S80, and device data file storage step S90.

(Process recipe acceptance process S10)
In the process recipe receiving step S10 shown in FIG. 4A, a process recipe in which a processing procedure and processing conditions of a substrate processing process are defined is received in the substrate processing apparatus 100, and the received process recipe is stored in the data holding unit 239e. It is a process.

  Specifically, a recipe file in which data defined in each step (main step M, sub-step S) for the process recipe processing conditions and processing conditions is associated with the step ID is filed in the data holding unit 239e. Store. The recipe file may be created by inputting each data from the input means 240b, or recipe files created externally in advance may be collectively input to the substrate processing apparatus 100.

  Here, the data of the recipe file will be described. For example, the data corresponding to the processing procedure is the control of the boat 217 or the like when the wafer 200 is carried into or out of the processing furnace 202, or the vacuum exhaust device 246. , Control of the energization amount of the heater 206, and the operation procedure of valve control of the gas supply pipe 232. Further, the data corresponding to the processing conditions include the temperature, pressure, gas flow rate, etc. of the processing furnace 202 for each step (main step M, substep S) of the substrate processing process. In the recipe file, each step (main step M, sub-step S) in the process recipe is associated with data relating to the processing procedure and processing conditions by a step ID.

  When the process recipe receiving step S10 is completed, the process proceeds to the process recipe executing step S20.

(Process recipe execution step S20)
The process recipe execution step S20 is a step in which the substrate processing apparatus 100 receives a process recipe execution command and executes a substrate processing process. Specifically, when receiving the process recipe execution command from the group management apparatus 500, the substrate processing apparatus 100 reads out the process recipe (recipe file) stored in the data holding unit 239e to the display device control unit 239 and executes it. When the process recipe is executed, an I / O control unit (gas flow rate control unit 23) is provided for each step (main step M, sub step S) based on the processing conditions of the process recipe.
5, the pressure control unit 236, the temperature control unit 237) and the mechanical mechanism I / O 238a are driven, and the substrate processing process is executed while controlling the temperature, pressure, gas flow rate and the like in the processing furnace 202.

  When the process recipe execution step S20 is completed, the process proceeds to an apparatus data acquisition step S30.

(Device data acquisition step S30)
In the apparatus data acquisition step S30, the substrate processing apparatus 100 acquires apparatus data of the substrate processing apparatus 100 for each step (main step M, sub-step S) of the substrate processing process, and the step related to the apparatus data in the acquired apparatus data. This is a step of assigning a step ID. Specifically, in the substrate processing apparatus 100, apparatus data indicating the state of the processing furnace 202 is acquired for each main step M and sub-step S while the substrate processing process is executed based on the process recipe. These device data are acquired via the gas flow rate control unit 235, the pressure control unit 236, the temperature control unit 237, and the mechanical mechanism I / O 238a constituting the I / O control unit. The acquired device data is directly passed to the display device control unit 239 via the processing control unit 239a or from the I / O control unit. Examples of the apparatus data acquired here include temperature, pressure, gas flow rate, and the like in the processing furnace 202.

  When the device data is passed to the display device control unit 239, the step ID of the step (main step M, substep S) executed when the device data is acquired is given to the device data. The step ID assigned to the device data may be the step ID defined in the process recipe, or other step IDs associated with the respective steps (main step M, substep S) of the process recipe are set. Or may be granted.

  When the device data acquisition step S30 is completed, the process proceeds to a device data transmission step S40.

(Device data transmission step S40)
The device data transmission step S40 is a step of transmitting the device data assigned with the step ID from the substrate processing apparatus 100 to the group management apparatus 500. Specifically, in the substrate processing apparatus 100, the apparatus data to which the step ID is assigned is transferred from the display apparatus control unit 239 to the communication control unit 239b. The device data to which the step ID is assigned is transmitted from the communication control unit 239b to the group management device 500 via the network 400.

  When the device data transmission step S40 is completed, the operation proceeds to the device data acquisition step S30, and the operation for continuously acquiring the device data is performed.

(Device data receiving step S50)
In the apparatus data receiving step S50 shown in FIG. 4B, the group management apparatus 500 receives the apparatus data to which the step ID transmitted from the substrate processing apparatus 100 is assigned. Specifically, the device data to which the step ID transmitted from the communication control unit 239b of the substrate processing apparatus 100 is given is received by the communication control unit 504 of the group management device 500. The device data to which the received step ID is assigned is passed to the shared memory 502 of the group management device 500. The apparatus data passed to the shared memory 502 includes an apparatus ID that identifies the substrate processing apparatus 100 that is the data generation source, and a recipe ID that identifies the process recipe that the substrate processing apparatus 100 was executing when the data was generated. Further, an elapsed time from the start time of the substrate processing process to the data generation time may be further added.

  When the device data receiving step S50 is completed, the process proceeds to a device data storing step S60.

(Device data storage step S60)
The device data storage step S60 is a step of storing, in the data holding unit 503, the device data to which the step ID received in the device data receiving step S50 is assigned. Specifically, the device data provided with the step ID passed to the shared memory 502 is read from the shared memory 502 to the control unit 501. The device data provided with the step ID read by the control unit 501 is associated with the assigned step ID into a database and stored in the data holding unit 503 so as to be readable. In addition, when the above-mentioned device ID, recipe ID, and elapsed time are added to the device data received by the communication control unit 504, when storing the device data, these device ID, recipe ID, And it may be configured to store in association with the elapsed time.

  When the device data storage step S60 is completed, the process proceeds to the determination step S70.

(Determination step S70)
The determination step S70 is a step of determining whether the process recipe is being executed or completed. Specifically, when the device data stored in the data holding unit 503 in the immediately preceding device data storage step S60 is not related to the last step of the process recipe (step 6 of the main step M in this embodiment). Determines that the process recipe is being executed. On the other hand, when the device data stored in the data holding unit 503 in the immediately preceding device data storage step S60 relates to the last step of the process recipe (step 6 of the main step M in this embodiment). It is determined that the process recipe has been completed.

  If it is determined that the process recipe is being executed (“No” in the determination step S70), the process proceeds from the determination step S70 to the apparatus data reception step S50. Then, the device data receiving step S50 and the device data storing step S60 are sequentially executed. These steps are repeatedly executed until the last step of the process recipe (in this embodiment, the main step M of Step 6) is completed.

  On the other hand, when it is determined that the process recipe is completed (in the case of “Yes” in the determination step S70), that is, according to the last step of the process recipe (main step M of step 6 in the present embodiment). If it is determined that the device data is stored in the data holding unit 503, the process proceeds from the determination step S70 to the device data file creation step S80.

(Device data file creation step S80)
When it is detected that the last step (main step M or sub-step S) of the process recipe is completed, the device data file creation step S80 detects the device data relating to all the steps of the process recipe stored in the data holding unit 503, and This is a step of reading out the corresponding step ID and creating a file that can be output.

  Specifically, the group management apparatus 500 receives from the substrate processing apparatus 100 a process recipe completion signal indicating that all steps of the process recipe have been completed. When the process recipe completion signal is received, apparatus data and step IDs related to all steps (main step M, sub step S) of the process recipe stored in the data holding unit 503 are read out by the control unit 501. The read device data and step ID are made into a file, and an outputable file including these device data and step ID is created.

  When the device data file creation step S80 is completed, the process proceeds to the device data file storage step S90.

(Device data file storage step S90)
The device data file storage step S90 is a step of storing a file including device data and a step ID in the data holding unit 503. Specifically, the file created by the group management apparatus 500 is transferred from the control unit 501 to the data holding unit 503 and stored in the data holding unit 503.

  When the apparatus data file storage step S90 is completed, the substrate processing process according to the present embodiment is completed.

  Next, an example of a method for managing the file created in the device data file creation step S80 will be described. The created file is stored in the data holding unit 503 and is output from the data holding unit 503 to the control unit 501 based on an output request from the input unit 506. The file read to the control unit 501 is transferred to the data display unit 505, and information (device data, step ID) recorded in the file is displayed on the data display unit 505. The operator can search and refer to the device data acquired in the main step M and sub-step S based on the step ID from the information displayed on the data display unit 505.

(9) Effects According to One Embodiment of the Present Invention According to the present embodiment, the following effects can be obtained.

  The substrate processing apparatus 100 of the present embodiment executes a substrate processing process based on a process recipe, and the state (temperature, pressure, gas) of the processing furnace 202 for each step (main step M, substep S) of the process recipe. Device data indicating the flow rate etc. is acquired via the I / O control unit (gas flow rate control unit 235, pressure control unit 236, temperature control unit 237), and each device data is acquired for the acquired device data. A step ID for uniquely identifying the step (main step M, sub-step S) is assigned and transmitted to the group management apparatus 500.

  The group management apparatus 500 stores the apparatus data transmitted from the substrate processing apparatus 100 in the data holding unit 503 in association with the step ID. When these operations are executed until the last step (main step M, substep S) of the process recipe is completed, the group management apparatus 500 is an apparatus related to all the steps (main step M, substep S) of the process recipe. Data and step ID are read from the data holding unit 503 to the control unit 501. The group management device 500 creates a file having all the read device data and step IDs.

  According to such a configuration, the apparatus data acquired by the substrate processing apparatus 100 is given a step ID that uniquely identifies a step (main step M, sub-step S) in the process recipe from which the apparatus data is acquired. Therefore, it is possible to provide a substrate processing system capable of managing the acquired apparatus data so as to be identifiable for each main step and sub-step.

  Further, according to such a configuration, since the acquired device data is filed for each process recipe, it is possible to easily manage device data related to a process recipe executed in the past. And since the acquired apparatus data was made into a file, the acquired apparatus data can be moved easily. Furthermore, the created file can be sent to another place away from the substrate processing system, and the apparatus data can be analyzed at another place, so that the work efficiency can be improved.

Moreover, according to such a structure, since apparatus data can be managed for every step (main step M, substep S) of a process recipe, the apparatus of each step (main step M, substep S) of a process recipe is managed. Abnormality detection becomes easy.

<Second Embodiment of the Present Invention>
Next, a second embodiment of the present invention will be described. The second embodiment is an embodiment exemplifying another setting method different from the first embodiment described above for the step ID assigned to the sub-step S. The following number (1) is an expression showing an example of the setting method of the step ID of the sub-step S according to the present embodiment.

  “Step ID of sub-step S” = “output start number” + “increment setting value 1” × “step number of main step M” + “step number of sub-step S” ... number (1)

  The “output start number” indicated by the above number (1) is set so that the step ID of the sub-step S and the step ID of the main step M do not overlap, and the total number of steps of the main step M A value larger than (6 in the example of FIG. 3) is set. “Increment setting value 1” is a value that is set so that the step IDs of the sub-steps S do not overlap between different main steps M when the sub-steps S are set in a plurality of main steps M. The “increase set value 1” is the number of substeps of the main step M having the largest number of substeps S by comparing the number of substeps set in each main step M (“5” in the example of FIG. 3). ) Is set to a larger value.

  Here, when the number (1) is applied to the process recipe of FIG. 3 with the “output start number” being 500 and the “increment setting value 1” being 500, for example, each step ID of the substep S is “2001, 2002, ..., 2005 ".

  If such a number (1) is used, it becomes possible to easily set the step ID of the sub-step S without overlapping the step IDs of the main step M and the sub-step S.

<Third Embodiment of the Present Invention>
Next, a third embodiment of the present invention will be described. In the first and second embodiments described above, the case where a plurality of sub-steps S are set in the main step M and these sub-steps S are executed for only one cycle has been described. In contrast, in the present embodiment, a case where these sub-steps S are set as one cycle and this cycle is executed a plurality of times will be described.

  FIG. 6 is a diagram illustrating the configuration of a process recipe according to the third embodiment of the present invention. Also in FIG. 6, the process recipe is configured such that each step is executed from the left end to the right end in the figure. According to FIG. 6, in this process recipe, steps 1 and 2 of main step M are executed, steps 1 to 5 of sub-step S are repeatedly executed for 100 cycles, and steps 3 to 6 of main step M are sequentially executed. It becomes the composition which is done.

  FIG. 7 is a diagram illustrating the configuration of step IDs according to the third embodiment of the present invention. In FIG. 7, the step IDs of the respective steps are sequentially arranged based on the process recipe of FIG. FIG. 7 also shows the number of repetitions of the sub-step S that is repeatedly executed.

In the present embodiment, a step ID and the number of repetitions are assigned to the apparatus data acquired by the substrate processing apparatus 100. The device data to which the step ID is assigned is transmitted to the group management device 500, and stored in the data holding unit 503 in association with the step ID and the number of repetitions counted by the group management device 500. When the last step of the process recipe (here, step 6 of the main step M) is completed, the device data, step IDs, and number of repetitions of all steps are read from the data holding unit 503 to the control unit 501, A file including the device data, step ID, and number of repetitions is created so as to be output. The created file is stored in the data holding unit 503 so that it can be output. That is, in the present embodiment, the acquired device data is configured to be uniquely identified by the step ID and the number of repetitions.

  According to such a configuration, even when the sub-step S is repeatedly executed a plurality of times, the number of cycle repetitions is given to the acquired device data, so that the device data acquired in each sub-step S is uniquely assigned. It is possible to provide a substrate processing system that can be managed in an identifiable manner. Therefore, the device data acquired in the main step M and the sub step S can be managed so as to be identifiable.

  In the present embodiment, in addition to the step ID and the number of repetitions, the total number of repetitions of the sub-step S may be further added to the acquired device data, as illustrated in FIG. With such a configuration, it is possible to quickly and easily grasp the total number of repetitions of the substep S when searching for data in the created file. That is, it is possible to omit work for checking how much the number of repetitions of the sub-step S is increased, thereby improving work efficiency.

<Fourth Embodiment of the Present Invention>
In the present embodiment, a case will be described in which the sub-step S is composed of, for example, two layers. That is, one substep S is further provided with one or more ministeps SS. FIG. 8 is a diagram illustrating a configuration of a process recipe according to the fourth embodiment of the present invention. According to FIG. 8, in one cycle of sub-step S, steps 1-3 of sub-step S are executed, steps 1-2 of mini-step SS are executed, and sub-steps 4-5 are executed. ing.

  FIG. 9 is a diagram illustrating the configuration of the step ID according to the fourth embodiment of the invention. In FIG. 9, the step IDs of the respective steps are sequentially arranged based on the process recipe of FIG. 8. FIG. 9 shows the number of repetitions of the sub-step S that is repeatedly executed and the total number of repetitions of the sub-step S.

  In the present embodiment, the step ID and the number of repetitions are given to the device data acquired in the main step M and the sub step S, and the device data acquired in the mini step SS The step ID and the number of repetitions are assigned. The device data to which the step ID and the number of repetitions are assigned is transmitted to the group management device 500 and stored in the data holding unit 503 in association with the step ID and the number of repetitions. When the last step of the process recipe (here, step 5 of the main step M) is completed, the device data, step IDs, and number of repetitions of all steps are read from the data holding unit 503 to the control unit 501, A file including the device data, step ID, and number of repetitions is created so as to be output. The created file is stored in the data holding unit 503 so that it can be output. That is, in the present embodiment, the apparatus data acquired at each step including the mini step SS is configured to be uniquely identified by the step ID and the number of repetitions.

  According to such a configuration, even when the sub-step S is composed of two layers, the device data acquired in each step (main step M, sub-step S, mini-step SS) can be uniquely identified. It becomes possible to manage.

<Fifth Embodiment of the Present Invention>
Next, a fifth embodiment of the present invention will be described. The fourth embodiment is an embodiment illustrating another setting method different from the above-described fourth embodiment for the step ID assigned to the sub-step S. The following number (2) is an expression showing an example of the setting method of the step ID of the sub-step S according to the present embodiment.

  “Step ID of mini step SS” = “output start number” + “increment setting value 1” × “step number of main step M” + “increment setting value 2” × “step number of sub step S” + “mini step SS step number "... Number (2)

  The “output start number” and “increase set value 1” indicated by the number (2) are the same as those in the first embodiment, and thus detailed description thereof is omitted. The “increase setting value 2” is a value that is set so that the step IDs of the mini-steps SS set between different sub-steps S do not overlap when the mini-steps SS are set in a plurality of sub-steps S. is there. The “increase set value 2” is the number of ministeps SS of the substep S having the largest number of ministeps SS by comparing the number of ministeps SS set in each substep S (in the example of FIG. 8, “ 2)) is set.

  Here, when the number (2) is applied to the process recipe of FIG. 8 with the “output start number” being 500, the “increase set value 1” being 500, for example, and the “increase set value 2” being 20 for example, the ministep SS Each step ID is set to “2081, 2082”.

  By using such a number (2), it is possible to easily set the step ID of the mini step SS without overlapping the step IDs of the main step M, sub step S, and mini step SS.

<Other Embodiments of the Present Invention>
In addition to the above-described embodiments, the present invention can be implemented by the following embodiments. In such an embodiment, for example, the step ID can be set by a symbol, a character, or a combination of these and a number instead of a number. Such a step ID only needs to be set so that each step (main step M, sub-step S, mini-step SS) of the process recipe is uniquely identified.

  In the above-described embodiment, the file read from the data holding unit 503 is output to the data display unit 505, and various information in the file is searched. However, the present invention is not limited to this. For example, when a command for reading a file is input by an operator, the device data and step ID stored in the database are directly read from the data holding unit 503 and displayed on the external device 600 shown in FIG. May be.

  In the above-described embodiment, the file stored in the data holding unit 503 may be configured to be output to the external device 600 connected to the group management device 500. Alternatively, the file may be output to a movable storage medium (not shown) and managed by the external device 600. According to this configuration, it is easy to move the created file, and work efficiency can be improved.

The present invention is not limited to the case where the substrate processing apparatus 100 and the group management apparatus 500 are arranged on the same floor (in the same clean room). For example, the substrate processing apparatus 100 is disposed in a clean room, and the group management apparatus 500 is disposed in an office (a floor different from the clean room), and the progress of the substrate processing process and the state of the substrate processing apparatus 100 are remotely monitored. You may do it.

  The present invention is not limited to film formation by CVD (Chemical Vapor Deposition), ALD (Atomic Layer Deposition), PVD (Physical Vapor Deposition), as well as diffusion, annealing, oxidation, nitridation, lithography, etc. It can be suitably applied to the substrate processing. Furthermore, the present invention can be suitably applied to other substrate processing apparatuses such as an annealing processing apparatus, an oxidation processing apparatus, a nitriding processing apparatus, an exposure apparatus, a coating apparatus, a drying apparatus, and a heating apparatus in addition to a thin film forming apparatus.

  The present invention can be suitably applied not only to a substrate processing apparatus that processes a wafer substrate such as a semiconductor manufacturing apparatus according to the present embodiment but also to a substrate processing apparatus that processes a glass substrate such as an LCD (Liquid Crystal Display) manufacturing apparatus. .

  As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, Various changes are possible in the range which does not deviate from the summary.

<Preferred embodiment of the present invention>
Hereinafter, desirable aspects of the present invention will be additionally described.

The first aspect of the present invention is:
A substrate processing system comprising: a substrate processing apparatus that executes a substrate processing process based on a process recipe having a plurality of main steps; and a group management apparatus connected to the substrate processing apparatus,
Any of the plurality of main steps includes one or more sub-steps,
The substrate processing apparatus includes:
The apparatus data of the substrate processing apparatus is acquired for each main step or sub step, and a step identifier for uniquely identifying the main step or the sub step related to the apparatus data is given to the acquired apparatus data. ,
Transmitting the device data to which the step identifier is assigned to the group management device;
The group management device includes:
Receiving the apparatus data provided with the step identifier from the substrate processing apparatus;
Storing the device data with the step identifier in a storage unit;
When it is detected that the last main step or the sub-step of the process recipe has been completed, all the device data and the step identifier of the process recipe are read from the storage unit to create a file that can be output. It is the comprised substrate processing system.

The second aspect of the present invention is:
A substrate processing system comprising: a substrate processing apparatus for defining a processing procedure and processing conditions, and executing a substrate processing process based on a process recipe having a plurality of main steps; and a group management apparatus connected to the substrate processing apparatus Because
Any of the main steps has one or more sub-steps,
The substrate processing apparatus includes:
Receiving and storing the input of the process recipe;
Receiving the process recipe start command and executing the substrate processing process;
The apparatus data of the substrate processing apparatus is acquired for each main step or sub step, and a step identifier for uniquely identifying the main step or the sub step related to the apparatus data is given to the acquired apparatus data. ,
Transmitting the device data to which the step identifier is assigned to the group management device;
The group management device includes:
A device data receiving function for receiving the device data to which the step identifier is assigned;
A device data storage function for storing the device data to which the step identifier is assigned;
A file creation function for creating a file including all the device data and the step identifier of the process recipe so as to be output when it is detected that the last main step or the sub-step of the process recipe is completed. A substrate processing system.

Preferably,
One of the main steps is configured to repeat the cycle with one or more substeps as one cycle,
The substrate processing apparatus includes:
Giving the step identifier to the device data;
Transmitting the device data to which the step identifier is assigned to the group management device;
The device data reception function of the group management device receives the device data provided with the step identifier,
Count the number of repetitions from the step identifier,
The device data storage function of the group management device stores the device data given the step identifier and the number of repetitions,
When the file creation function of the group management device detects that the last main step or the sub-step of the process recipe is completed, all the device data of the process recipe, the step identifier, and the number of repetitions Create a file that contains

Also preferably,
The substrate processing apparatus includes:
Giving the step identifier to the device data;
Transmitting the device data to which the step identifier is assigned to the group management device;
The device data reception function of the group management device receives the device data provided with the step identifier,
Count the number of repetitions and the total number of repetitions from the step identifier,
The device data storage function of the group management device stores the device data to which the step identifier, the repetition count, and the total repetition count are given,
When the file creation function of the group management device detects that the last main step or the sub-step of the process recipe has been completed, all the device data of the process recipe, the step identifier, the number of repetitions, And a file including the total number of repetitions is created to be output.

DESCRIPTION OF SYMBOLS 100 Substrate processing apparatus 500 Group management apparatus 503 Data holding part (storage part)
M Main step S Sub step

Claims (1)

A substrate processing system comprising: a substrate processing apparatus that executes a substrate processing process based on a process recipe having a plurality of main steps; and a group management apparatus connected to the substrate processing apparatus,
Any of the plurality of main steps includes one or more sub-steps,
The substrate processing apparatus includes:
The apparatus data of the substrate processing apparatus is acquired for each main step or sub step, and a step identifier for uniquely identifying the main step or the sub step related to the apparatus data is given to the acquired apparatus data. ,
Transmitting the device data to which the step identifier is assigned to the group management device;
The group management device includes:
Receiving the apparatus data provided with the step identifier from the substrate processing apparatus;
Storing the device data with the step identifier in a storage unit;
When it is detected that the last main step or the sub-step of the process recipe has been completed, all the device data and the step identifier of the process recipe are read from the storage unit to create a file that can be output. A substrate processing system characterized by being configured.