201004710 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種流體喷射裝置，尤其涉及一種可應用 於基板處理裝置中將液鳢（DIW)和氣體（CDA)的混合流體喷 射到基板上而對基板進行清洗，且容易製作，並可以提高 流體喷射效率的流艎喷射裝置。 【先前技術】 通常，流體喷射裝置可應用於爲清洗基板而對基板喷 射混合流體的過程。這種流體喷射裝置中，形成有氣體腔 室的第一墊板和形成有液體腔室的第二墊板相重疊並藉由 連接部件相互結合。並且，第一墊板和第二墊板之間形成 有用於喷射供給到氣體腔室的氣體（CDA，清潔用乾燥氣體） 的喷射管道。另外，第二墊板上形成有以傾斜狀態設置、 並用於連接液體腔室和喷射管道的多個連接管道。 即’液體腔室的液鱧（DI water，去離子水）依據汽化器 原' $經氣體和連接管道被喷射到喷射管道内而形成混合流 體’然後噴射到基板上。 上述連接管道是通過銑削（milling )作業等工序形成 、細長的孔而製作的。這種現有的流艎喷射裝置在對該連接 管道進行加工時’由於處理基板逐漸大型化，流體喷射裝 置的長度明顯變大，而且連接管道的數增加，從而導致加 工時間和加工成本增加。 而且’向氣體腔室供給氣體的壓力大於向液體腔室供 201004710 給液體的壓力。在氣體從氣體腔室向喷射管道噴射的過程 中’液體腔室侧的連接管道與喷射管道相連接的位置上有 部分氣體沒有喷射到喷射管道外部’而與液體流出的連接 管道的末端壁相撞’從而改變移動方向，反而流入廢力較 弱的液體腔室内’這種現象會降低流體的喷射效率。 而且，現有的流體喷射裝置的底面爲平面形狀，因此 混合流艎喷射到基板上時’喷射的流體周圍會産生負壓， 從而發生基板被吸附到流體喷射裝置上的現象，因此會導 致基板處理不良的問題。 【發明内容】 本發明鑒於上述問題而作’本發明的目的在於提供一 種具有可易於加工的用於連接液體腔室和喷射單元的連接 流道結構，從而減少生産成本並節約生產時間，以此來提 高生産效率的流體喷射裝置。 並且，本發明的又一目的在於提供一種可以防止氣體 向液體腔室逆流的現象，以提高流體喷射效率的流體喷射 裝置。 另外，本發明的另一目的在於提供一種可去除在流體 喷射裝置中因喷射的混合流體周圍産生負壓，導致基板被 吸附到流趙喷射裝置上的現m防止基板處理不良的 流體喷射裝置。 爲了實現上述目的，本發明提供一種流體喷射裝置， 其包括.第一墊板，其用於形成氣體供給單元；第二墊板， 201004710 其用於形錢體供給單元，並與該第—塾板結合而構成主 體；喷射單元，其設置在相互結合的該第一墊板和該第二 墊板的末端，並用於喷射混合流體；以及間隙墊板，其設 置在該第-墊板和該第二墊板之間，並且其下面設有用於 連接該液體供給單元和該噴射單元的連接流道。 該氣體供給單元最好包括氣體腔室；以及氣體供給流 道，其一端與該氣體腔室連接，另一端與該喷射單元連接， 從而使氣體流動。 該液體供給單元最好包括液體腔室；以及液體供給流 道，其一端與該液體腔室連接，另一端與該連接流道連接， 從而使液體流動。 該間隙墊板的下面最好相隔預定距離設置用於形成該 連接流道的多個槽。 該喷射單元的寬度最好大於該氣艎供給流道的寬度。 該第一墊板和該第二墊板之間最好放置該間隙墊板，並且 兩者相面對的側面分別形成有氣鱧腔室和液體腔室。 該第一墊板和第二墊板的前端部最好是傾斜面。 該第一墊板的前端部上最好形成有朝該第一墊板方向 延伸的延伸部。 如上所述的本發明，在間隙塾板的下端部以相同距離 隔開形成連接流道並將其結合到第一墊板和第二塾板之 間，該連接流道由將液鱧輸送到喷射管道上的多個槽組 成。因此其加工容易，生産成本低廉，可提高生產效率。 並且，本發明中喷射單元的寬度大於氣體供給流道的 201004710 間距，因此從氣體供給流道向噴射單元供給的部分氣體不 會流入流體腔室内，而全部被喷射出去，從而提高了流體 的喷射效率。 另外，本發明中流體喷射裝置的第一墊板和第二墊板 的前端部爲傾斜面，因此可以防止從喷射單元噴射的混合 流體的周圍産生負壓，而避免基板被吸附到流體噴射裝置 上的現象，從而防止基板的處理不良。 【實施方式】 以下參照附圖詳細說明本發明的最佳實施例。 圖1是用於說明本發明流體喷射裝置一個實施例的外 觀結構圖。 流體喷射裝置具有較長的狹縫，其可將在處理槽内混 合的液體（DI Water)和氣體（CDA，Clean Dry Air)的混合流 體喷射到基板G上，而對基板G進行清洗。該流體喷射裝 置中第一墊板1和第二墊板3藉由連接部件5相互連接。 如圖2和圖3所示’上述第一墊板1和第二墊板3之間配 置有間隙塾板7。 第一墊板1上形成有氣體供給單元2。氣艎供給單元2 可以包括氣艘腔室la、用於輸送氣體腔室u中氣體的氣體 供給流道lb。氣體腔室ia形成於第一墊板丨上，並可以暫 時存儲從氣體供給裝置（省略圖示;)供給的氣體。 而且’第二塾板3上形成有液體供給單元液體供給 單το 4可以包括液體腔室3a、用於輸送液體腔室3a中液體 201004710 的液體供給流道3b。液體腔室3a形成於第二墊板3上，並 可以暫時存儲從液體供給裝置（省略圖示）供給的液體。 如圖3所示，第一墊板丨和第二墊板3相互結合，並 在其間設置有間隙墊板7,並且第一墊板！和第二墊板3相 互面對的側面分別形成有氣體腔室la和液體腔室3a。 並且，第一墊板1和間隙墊板7之間形成有與氣體腔 室la連接的氣體供給流道lb。另外，第二墊板3和間隙墊 板7之間形成有與液體腔室3a連接的液體供給流道几。 另外’第一塾板1和第二塾板3之間的前端上形成有 供混合流體通過的喷射單元13。即，第一墊板丨和第一墊 板3的前端具有一定間距（gap)，從而形成了可喷射混合流 體的空間，該空間即爲噴射單元13。 換句話說’氣體供給流道lb是由氣體腔室“流出的氣 體通過的區域，喷射單元13是由氣體腔室la流出的氣體和 液體的混合流體通過並噴射到基板G上的區域。201004710 VI. Description of the Invention: The present invention relates to a fluid ejection device, and more particularly to a substrate processing apparatus for spraying a mixed fluid of liquid helium (DIW) and gas (CDA) onto a substrate. A rogue injection device that cleans the substrate and is easy to manufacture and can improve fluid ejection efficiency. [Prior Art] Generally, a fluid ejection device can be applied to a process of spraying a mixed fluid to a substrate for cleaning a substrate. In this fluid ejecting apparatus, the first pad formed with the gas chamber and the second pad formed with the liquid chamber overlap and are coupled to each other by the connecting member. Further, an injection duct for ejecting gas (CDA, cleaning dry gas) supplied to the gas chamber is formed between the first pad and the second pad. Further, the second pad is formed with a plurality of connecting pipes which are disposed in an inclined state and are used for connecting the liquid chamber and the injection pipe. That is, the liquid chamber (DI water) of the liquid chamber is injected into the injection duct through the gas and the connecting pipe to form a mixed fluid, and then sprayed onto the substrate. The connecting pipe is formed by a long hole formed by a milling operation or the like. When the conventional squirting apparatus is processed in the connecting pipe, the length of the fluid ejecting apparatus is significantly increased due to the gradual enlargement of the processing substrate, and the number of connecting pipes is increased, resulting in an increase in processing time and processing cost. Moreover, the pressure at which the gas is supplied to the gas chamber is greater than the pressure at which the liquid is supplied to the liquid chamber at 201004710. In the process of injecting gas from the gas chamber to the injection pipe, a portion of the connecting pipe connecting the liquid chamber side to the injection pipe is not injected to the outside of the injection pipe, and the end wall of the connecting pipe flowing out of the liquid flows. The collision "changes the direction of movement, but instead flows into the liquid chamber where the waste force is weak", which reduces the efficiency of fluid injection. Moreover, the bottom surface of the conventional fluid ejection device has a planar shape, so that when the mixed flow is sprayed onto the substrate, a negative pressure is generated around the injected fluid, so that the substrate is adsorbed onto the fluid ejection device, thereby causing substrate processing. Bad problem. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a connection flow path structure for connecting a liquid chamber and a spray unit which can be easily processed, thereby reducing production cost and saving production time. A fluid ejection device that increases production efficiency. Further, it is still another object of the present invention to provide a fluid ejecting apparatus which can prevent a phenomenon in which a gas flows back to a liquid chamber to improve fluid ejection efficiency. Further, another object of the present invention is to provide a fluid ejecting apparatus which can prevent a substrate from being sucked onto a flow ejection device by a negative pressure generated in the fluid ejecting apparatus, thereby preventing the substrate from being poorly processed. In order to achieve the above object, the present invention provides a fluid ejection device comprising: a first pad for forming a gas supply unit; a second pad, 201004710, which is used for a body supply unit, and with the first The plates are combined to form a body; the spraying unit is disposed at an end of the first pad and the second pad coupled to each other, and is used for spraying a mixed fluid; and a gap pad disposed on the first pad and the A connecting flow path for connecting the liquid supply unit and the injection unit is provided between the second pads. The gas supply unit preferably includes a gas chamber; and a gas supply flow path having one end connected to the gas chamber and the other end connected to the injection unit to allow gas to flow. The liquid supply unit preferably includes a liquid chamber; and a liquid supply flow path having one end connected to the liquid chamber and the other end connected to the connection flow path to allow the liquid to flow. Preferably, the lower surface of the gap pad is provided with a plurality of grooves for forming the connecting flow path at a predetermined distance. The width of the jetting unit is preferably greater than the width of the gas feed channel. Preferably, the gap pad is placed between the first pad and the second pad, and the facing sides of the two pads are respectively formed with a gas chamber and a liquid chamber. The front end portions of the first pad and the second pad are preferably inclined faces. Preferably, the front end portion of the first pad is formed with an extending portion extending in the direction of the first pad. According to the invention as described above, the connecting flow path is formed at the same distance from the lower end portion of the gap jaw and is coupled between the first pad and the second jaw, which connects the liquid helium to the liquid helium It consists of a plurality of grooves on the injection pipe. Therefore, the processing is easy, the production cost is low, and the production efficiency can be improved. Further, in the present invention, the width of the injection unit is larger than the distance of the 201004710 of the gas supply flow path, so that part of the gas supplied from the gas supply flow path to the injection unit does not flow into the fluid chamber, but is completely ejected, thereby improving the ejection of the fluid. effectiveness. Further, in the present invention, the front end portions of the first pad and the second pad of the fluid ejecting apparatus are inclined faces, so that it is possible to prevent a negative pressure from being generated around the mixed fluid ejected from the ejecting unit, and to prevent the substrate from being adsorbed to the fluid ejecting device. The phenomenon on the top prevents the substrate from being processed poorly. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of an embodiment of a fluid ejecting apparatus according to the present invention. The fluid ejecting apparatus has a long slit which ejects a mixed fluid of a liquid (DI Water) and a gas (CDA, Clean Dry Air) mixed in the treatment tank onto the substrate G to clean the substrate G. In the fluid ejecting apparatus, the first pad 1 and the second pad 3 are connected to each other by a connecting member 5. As shown in Figs. 2 and 3, a gap raft 7 is disposed between the first pad 1 and the second pad 3 described above. A gas supply unit 2 is formed on the first pad 1. The gas supply unit 2 may include an air vessel chamber la, a gas supply flow path lb for conveying a gas in the gas chamber u. The gas chamber ia is formed on the first pad ,, and the gas supplied from the gas supply device (not shown) can be temporarily stored. Further, the liquid supply unit liquid supply unit τ4 is formed on the second sill plate 3, and may include a liquid chamber 3a, and a liquid supply flow path 3b for conveying the liquid 201004710 in the liquid chamber 3a. The liquid chamber 3a is formed on the second pad 3, and can temporarily store the liquid supplied from the liquid supply device (not shown). As shown in FIG. 3, the first pad 丨 and the second pad 3 are coupled to each other with a gap pad 7 interposed therebetween, and the first pad! A side facing each other with the second pad 3 is formed with a gas chamber 1a and a liquid chamber 3a, respectively. Further, a gas supply flow path lb connected to the gas chamber la is formed between the first pad 1 and the gap pad 7. Further, a liquid supply flow path connected to the liquid chamber 3a is formed between the second pad 3 and the gap pad 7. Further, a jetting unit 13 through which a mixed fluid passes is formed at the front end between the first jaw 1 and the second jaw 3. That is, the front ends of the first pad 丨 and the first pad 3 have a certain gap, thereby forming a space in which the mixed fluid can be ejected, which is the ejection unit 13. In other words, the gas supply flow path lb is a region through which the gas flowing out of the gas chamber passes, and the ejection unit 13 is a region through which the mixed fluid of the gas and the liquid flowing out from the gas chamber la passes and is ejected onto the substrate G.
該噴射單7L 13的寬度b(如圖4所示）最好大於上述氣 體供給流道lb的寬度a (如圖4所示 另外，第二塾板3的前端部朝第—塾板！的方向延伸 而形成突出形狀的延伸部3c。 並且，如圖2所示，間隙墊板7在其下端形成有等距 離隔開的多個槽7a，該槽7a具有朝下的開口部。該多個槽 7a是用於連接液體腔室3a和喷射單元13的連接流道％如 圖4所示），從而向喷射單元13喷射液體腔室㈣的液體。 即’間隙塾板7與第二墊板3相結合後，間隙墊板7下面 201004710 的多個槽7a成爲輸送液艎的連接流道9。 如上所述，間隙塾板7可通過在其下端部以相同間距 隔開形成的多個槽7a來製作使液體流到喷射單元13的連接 流道9。如此，通過對間隙墊板7的下端部進行加工來製作 多個槽而形成連接流道9的方式具有加工性優良、減少生 産成本和時間，從而可提高生產效率的效果。 另外，第一塾板1和第二塾板3的下端部形成有朝兩 側傾斜的傾斜® le、3ee當混合流艘以高壓狀態經喷射單 元Η喷射到基板G上時，該傾斜面le、3e的周圍會形成籲 充分的閒置空間，從而防止喷射的混合流體周圍産生負壓。 下文參照附圖具體說明如上所述的本發明的作用。並 且詳細說明向通過輸送裝置移送到處理槽内部的基板G喷 射混合流體的過程。 通過氣體供給裝置供給到氣髏腔室1&内的氣體經由氣 體供給流it 1Μ〇喷射單元13喷射。此時，液體腔室&内 的液體流過液體供給流道3b，並沿由間隙墊板7的槽、構 成的連接流道9喷射到喷射單元13上。艮p，根據汽化器的❹ 原理，氣體從氣體供給流道lb和喷射單元13流出時，液 體就會與氣體-起通過連接流道9, &時液體和氣體混合的 混合流體被噴射到基板G上。 此時，如圖5所示，氣體從氣體喷射流道11}流過喷射 單元13。並且，隨著噴射單元13的擴充，可防止現有技術 中氣體向液體喷射流道3b逆流的現象。 當然氣體流過喷射單元13時，液體腔室3a的液體流過 201004710 連接流道9的同時成爲混合流體，然後喷射到基板G上。 如上所述’由於第一墊板1和第二墊板3的前端部被 構成爲斜面le、3e，因此喷射到基板g上的混合流體的周 圍會形成充分的空間’從而防止喷射到基板G上的混合流 體的周圍産生負壓。因此，可以避免基板G被吸附到流體 噴射裝置上或者搖晃，從而防止基板處理不良的現象。 【圖式簡單說明】 圖1是本發明流體喷射裝置一個實施例的的外觀結構 圓。 圖2是圖1中主要部分的分解立體圖。 圖3是圖1中Π-ΙΠ向剖面圖。 圖4是圖3中Α部分的放大圖》 圖5是用於說明本發明實施例作用的示意圖。 ❹ 【主要元件符號說明】 1 第一墊板 2 氣體供給單元 3 第二墊板 4 液想供給單元 5 ± 連接部件 7 間隙墊板 9 ± 連接流道 13 ^ 喷射單元 201004710 a 氣體供給流道的寬度 b 喷射單元的寬度 la 氣體腔室 lb 氣體供給流道 le ' 3e 斜面 3a 液體腔室 3b 液體供給流道 3c 延伸部 7a -槽 G 基板The width b of the jet sheet 7L 13 (shown in FIG. 4) is preferably larger than the width a of the gas supply passage lb (as shown in FIG. 4, the front end portion of the second jaw 3 faces the first jaw plate! The extending portion 3c is formed to extend in a direction to form a protruding shape. Further, as shown in Fig. 2, the gap pad 7 is formed at its lower end with a plurality of grooves 7a equally spaced apart, and the groove 7a has a downwardly facing opening portion. The tank 7a is a connection flow passage % for connecting the liquid chamber 3a and the injection unit 13 as shown in Fig. 4), thereby ejecting the liquid of the liquid chamber (4) to the injection unit 13. That is, after the "gap plate 7" is joined to the second pad 3, the plurality of grooves 7a of the lower surface of the gap pad 7 201004710 serve as the connecting flow path 9 for transporting the liquid helium. As described above, the gap rafts 7 can be made to flow to the connection flow path 9 of the ejection unit 13 by a plurality of grooves 7a formed at the lower end portions thereof at the same pitch. By processing the lower end portion of the gap pad 7 to form a plurality of grooves and forming the connection flow path 9, the processability is excellent, the production cost and time are reduced, and the production efficiency can be improved. In addition, the lower end portions of the first jaw 1 and the second jaw 3 are formed with inclinations inclined toward both sides, le, 3ee, when the mixed flow boat is sprayed onto the substrate G through the ejection unit in a high pressure state, the inclined surface A sufficient idle space is formed around the 3e to prevent a negative pressure from being generated around the injected mixed fluid. The action of the present invention as described above will be specifically described below with reference to the drawings. The process of spraying the mixed fluid to the substrate G transferred to the inside of the treatment tank by the conveying means will be described in detail. The gas supplied into the air chamber 1 & by the gas supply means is injected through the gas supply flow unit 1 1 to the injection unit 13. At this time, the liquid in the liquid chamber & flows through the liquid supply flow path 3b, and is ejected onto the ejection unit 13 along the connecting flow path 9 constituted by the groove of the gap pad 7.艮p, according to the ❹ principle of the vaporizer, when the gas flows out from the gas supply flow path lb and the ejection unit 13, the liquid is ejected to the substrate together with the gas-mixed liquid mixed with the liquid and the gas through the flow path 9, & G. At this time, as shown in Fig. 5, gas flows from the gas injection flow path 11} through the ejection unit 13. Further, as the ejection unit 13 is expanded, the phenomenon in which the gas in the prior art flows back to the liquid ejection flow path 3b can be prevented. Of course, when the gas flows through the ejection unit 13, the liquid of the liquid chamber 3a flows through the 201004710 to form the mixed fluid while being connected to the flow path 9, and is then ejected onto the substrate G. As described above, since the front end portions of the first shim plate 1 and the second shim plate 3 are configured as the inclined faces le, 3e, a sufficient space is formed around the mixed fluid sprayed onto the substrate g to prevent ejection to the substrate G. A negative pressure is generated around the mixed fluid. Therefore, it is possible to prevent the substrate G from being adsorbed onto the fluid ejecting apparatus or to be shaken, thereby preventing the substrate from being poorly processed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of an outer structure of an embodiment of a fluid ejecting apparatus according to the present invention. Fig. 2 is an exploded perspective view of the main part of Fig. 1. Figure 3 is a cross-sectional view taken along the line ΙΠ-ΙΠ in Figure 1. Figure 4 is an enlarged view of a portion of the portion of Figure 3. Figure 5 is a schematic view for explaining the action of an embodiment of the present invention. ❹ [Main component symbol description] 1 First pad 2 Gas supply unit 3 Second pad 4 Liquid supply unit 5 ± Connection part 7 Gap pad 9 ± Connection flow path 13 ^ Injection unit 201004710 a Gas supply flow path Width b Width of the ejection unit la gas chamber lb gas supply flow path le ' 3e slope 3a liquid chamber 3b liquid supply flow path 3c extension portion 7a - groove G substrate