TW201003994A - Manufacturing method for an LED substrate and LED substrate made from said method - Google Patents

Abstract

A method for manufacturing a Light-emitting diode (LED) substrate easily and effectively is provided. The method for manufacturing the LED substrate is characterized in including: a process of hot-pressing wire-shaped conductive material on thermoplastic resin film; and a process of assembling at least two LED to wire-shaped conductive material.

Description

JPGT-02008TW 201003994 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a method for manufacturing an LED substrate and an LED substrate manufactured by the method. [Prior Art] A light-emitting element such as a light-emitting diode (LED) can be miniaturized and lightened in addition to low power consumption and long life. Therefore, it can be used for mobile phones, electro-optical panels, or signals. Especially recently, it is expected to be used as a backlight for a liquid crystal display. [That is, at this stage, a cold cathode tube is mainly used as a backlight of a liquid crystal display. However, in recent years, with the thinness, energy saving and high performance of liquid crystal displays, LEDs have been in a position to replace cold cathode tubes. In some liquid crystal displays, LEDs have been used as backlights. Conventionally, a substrate on which an LED is mounted is manufactured by forming a metal layer on the surface of a glass epoxy substrate and etching the metal layer as a circuit to solder the LED on the circuit. However, since the glass epoxy substrate must be made thick in structure, sufficient heat dissipation cannot be ensured even if a heat dissipation layer is provided on the back surface of the circuit. Therefore, in order to improve heat dissipation, a thinner substrate is used in an LED substrate. For example, Patent Document 1 discloses a technique in which a metal foil layer is bonded to an insulating layer formed of a thermosetting epoxy resin or the like to form a circuit for mounting an LED, and when the insulating layer is further bonded to the heat dissipation substrate, The cost is reduced by placing the insulating layer only at the necessary locations. However, in the technique of Patent Document 1, the circuit is formed by etching, and such a forming method cannot be carried out efficiently and at low cost. That is, in the step of forming a circuit by etching, it is necessary to degrease and clean the metal layer, form a resist photosensitive film, expose, develop, and 3

JPGT-02008TW JPGT-02008TW201003994 Such complicated processing as etching and stripping. In addition, the metal layer removed by etching is wasted. Therefore, if a circuit is formed by etching, the cost due to etching tends to be several times the cost of the substrate itself. Further, gasification iron is generally used in etching, but it is not easy to discard waste liquid containing vaporized iron. Further, when a heat dissipating plate is bonded to an insulating layer formed of a thermosetting resin, a thermosetting adhesive must be used. Therefore, there is a case where heating and pressurization for heat curing requires time, equipment, and more energy, and it is difficult to reduce the cost. Further, in addition to the fact that the substrate is thickened by the adhesive layer, there is a disadvantage that the thermal conductivity is lowered by the adhesive. On the other hand, Patent Document 2 discloses a technique of integrally covering a plurality of wires rolled into a flat shape with a soft insulating resin to produce flexible parallel wires. However, this is a technique for connecting the parallel lines to the substrate or between the circuits, and is not for mounting components. Actually, covering the parallel lines is performed by dipping them in the insulating resin, and it is not easy to expose the parallel lines outside the ends and to mount the components. Further, in Patent Document 2, the type of the insulating resin covering the wire is not determined. Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-220925. Patent Document 2: Japanese Laid-Open Patent Publication No. SHO 57-115714. SUMMARY OF THE INVENTION As described above, a flexible LED substrate is known. However, since etching or the like is required, the manufacturing steps are complicated and it is not easy to manufacture. Accordingly, an object of the present invention is to provide a method for easily and efficiently manufacturing an LED substrate. The inventors conducted intensive studies to solve the above problems. As a result, it has been found that when a thermoplastic resin film such as a liquid crystal polymer film is used as a substrate, and the substrate is thermocompression-bonded to a circuit, it is extremely easy and efficient to manufacture a continuously usable liquid.

201003994 JPGT-02008TW The substrate of an LED such as a backlight of a crystal display, thereby completing the present invention. The method of manufacturing an LED substrate according to the present invention is characterized by comprising the steps of: hot-pressing a wiring-like conductive material on a thermoplastic resin film; and installing at least two LEDs in a linear conductive material. Further, the configuration in which the linear conductive material is provided with the LED includes all the states in which the LED is mounted on the substrate in which the linear conductive material is used as a circuit. For example, the body of the surface mount type LED may be disposed between the broken portion of one linear conductive material or the two linear conductive materials, and the electrodes may be soldered in the form of a linear conductive material; or the die die of the LED bare die may be bonded. A die bond is formed at one of the broken ends of one of the linear conductive materials or one of the two linear conductive materials, with a wire bond at the other broken wire end or another linear conductive material. In the above method, it is preferable that the linear conductive material is pressed into the surface of the thermoplastic resin film when the wiring-shaped conductive material is hot-pressed. For example, when a circuit is formed by a surname or when a circuit is adhered to a substrate with an adhesive, the circuit has a thickness with respect to the surface of the substrate and a smooth circuit cannot be obtained. As a result, as shown in Fig. 1, a space having a circuit thickness is generated between the substrate and the LED. As a result, particularly in the case of mounting a surface mount type LED with a die heat sink, an adhesive having high thermal conductivity such as solder or silver paste enters the space, and a malfunction of the electrode short circuit may occur. Further, when the LED bare wafer is hermetically sealed with a transparent resin, if there is a step between the circuit and the substrate as shown in Fig. 2, the resin may excessively spread along the circuit as shown in Fig. 3. As a result, optical transparency in the formation due to the transparent solid sealing resin not only affects the uniformity of light emission, but may also cause insufficient sealing of the bare wafer. Further, even if a barrier material is used at this time, the transparent resin sometimes flows out from the gap between the substrate and the barrier material. However, if it will become a linear conductive material of the circuit

JPGT-02008TW JPGT-02008TW201003994 The material is pressed into the surface of the thermoplastic resin film. As shown in Fig. 4, it is difficult to form a gap between the substrate and the surface mount type LED with the die heat sink. Further, as shown in Fig. 5, if there is no step difference between the linear conductive material and the thermoplastic resin film, as shown in Fig. 6, it is possible to suppress excessive diffusion of the sealing resin to the longitudinal direction of the linear conductive material. Reduce the risk of forming optical distortions. Further, if the substrate provided with the circuit is smooth, the accuracy can be improved when printing a solder paste or a resist. Further, as will be described later, in order to improve heat dissipation or to break the circuit, a hole may be formed in the LED substrate. At this time, the efficiency of forming a plurality of substrates by the production method is relatively south. However, if there is no step difference between the circuit surface and the substrate surface, the substrate is difficult to be staggered at the time of opening, and the opening can be stably performed. Further, in the case of using a thermoplastic film as a circuit board of an insulating layer, it is also conceivable to form a circuit by etching a copper foil on the film, and then heat the circuit to press it into the film. However, in the present invention, since a simple linear conductive material is used as a circuit, it is possible to perform the crimping and press-fitting of the circuit at the same time. More preferably, in the above method, the step of alternately disconnecting the LEDs between the mounted LEDs or the portions where the LEDs should be mounted in order to connect the LEDs disposed between the two linear conductive materials in series . As shown in Fig. 7, if multiple LEDs are connected in parallel, brightness unevenness may occur due to individual differences in LEDs. However, if a plurality of LEDs are connected in series, there is an advantage that uniform brightness can be obtained. Further, when a plurality of LEDs are mounted between two linear conductive materials, as shown in Fig. 8, it is extremely easy to form a circuit in which LEDs are connected in series by alternately disconnecting the LED mounting portions of the circuit. More preferably, the step of thermally crimping at least three linear conductive materials and connecting the portions connected in series with the LEDs in parallel is carried out. As mentioned above, if the LED string 6

201003994 JPGT-02008TW connected, you can get uniform brightness, but if there is a fault in one LED, all the LEDs connected in series will not light. Therefore, as shown in Fig. 9 and Fig. 1 , if the LEDs connected in series are connected in parallel with each other, even if the LEDs connected in series are broken, the other series LEDs are lit, so that the whole is not present. This is not the case. The arrangement of the LEDs can be easily formed by disconnecting the LED mounting portion. More preferably, in the method of the present invention, as shown in the figure, the surface on one side of the thermoplastic resin film is thermocompression bonded to the linear conductive material, and the portion in which the LED is mounted by the porous resin film is performed. Steps outside of or outside the portion where the LED should be installed. Conventionally, when an LED is mounted on a transparent or translucent substrate, in order to improve the light reflection efficiency, it is necessary to add transparency to the substrate or to whiten the titanium oxide. If a large amount of oxidizing agent inorganic substance is mixed, the rate of the base of the emitter is lowered (four degrees). In other respects, if the substrate is covered with a porous resin film to increase the reflectance, the prior art as described above is not brought about. problem. Further, as will be described later, when the (four) bare wafer is hermetically sealed with a transparent resin, a porous resin film can also be used as a barrier material, so that the transparent resin does not flow out to a part of the guest, and the solar resin film can make the light U Extremely high efficiency reflections even with plastic resin _ paste 4 (four) film

Jr ^ also does not know the advantages of flexibility.

2 This wealth of legal towel is more material, and it is very important to use solid sealing in the research of ❹LE transparent resin solid-sealed LED bare wafer. In addition, %, when using an LED bare wafer, when a porous film formed by a resin which covers a circuit surface with a porous resin film and a resin resin which is slightly more than a porous resin film is used, The resin also does not spread the amount of the recessed resin on the porous resin film, and the solid seal is formed into a convex lens shape as shown in Fig. 11

201003994 JPGT-02008TW shape. The convex lens shape of the solid-sealed pepper has a better light-emitting effect. Further, the light in the plane direction of the light emitted from the led bare wafer causes disordered reflection on the side surface of the porous resin film. As a result, it is possible to use p 1 i j for light that cannot be effectively utilized. It is preferable that a heat dissipating layer is provided on the side of the thermocompression-bonded plastic resin film on the side of the thermocompression-bonded linear conductive material or on the side opposite to the side of the hot-pressed metal. The LED matrix is very important. In addition, the rut is a sturdy cymbal, and a through hole for heat dissipation is provided in the thermoplastic resin film, the linear conductive material, and the heat dissipation layer. By providing the through hole, heat generated by the light emission can be more efficiently discharged to the outside of the substrate. Further, the through hole can also be used as a disconnecting unit of a linear conductive material. The LED substrate of the present month is characterized by the above-described method of the present invention. According to the method of the present invention, it is extremely easy and efficient to manufacture a substrate on which a plurality of LEDs are mounted, and more specifically, by using a liquid crystal polymer film or the like. The plastic resin film can be used as an insulating layer, and it is not necessary to form a circuit by simply subtracting and bonding a linear conductive material. Therefore, the present invention is extremely useful industrially as a technique for easily and efficiently producing a substrate having an excellent characteristic and having excellent characteristics in recent years. [Embodiment] The method for manufacturing a LED substrate according to the present invention includes the steps of: thermally pressing a terminal-shaped conductive material in parallel or approximately parallel in a thermoplastic resin thin layer; and installing at least two linear conductive materials Led steps. The conditions for carrying out the invention will now be described. 'Thermal crimping step of linear conductive material 8

JPGT-02008TW JPGT-02008TW201003994 In the present invention, the linear conductive material is thermocompression bonded in parallel or approximately parallel to the thermoplastic resin film. The thermoplastic resin constituting the insulating layer in the present invention is widely selected depending on the purpose of use as long as it has high heat resistance to heat required for thermocompression bonding of the linear conductive material, and is not particularly limited. For example, liquid crystal polymers, polyetheretherketone, polyether oxime, polyether quinone imine, polyamine, polyamidamine, polyaryl, polyphenylene sulfide, polyethylene naphthalate can be used. Two or more kinds of resins, a polymer alloy containing these resins as a main component, and the like are mixed. The "main component" herein means that the mass is 50% or more of the polymer alloy, more preferably 70% or more, and still more preferably 80% or more. As the thermoplastic resin constituting the insulating layer, a liquid crystal polymer is preferred. The liquid crystal polymer is preferably heat resistant, and has high heat resistance not only for the heat generated by the LED but also for the heat of the linear conductive material. Further, the metal constituting the linear conductive material is, for example, copper which is widely used as a representative conductive material, and a liquid crystal polymer having a linear expansion ratio close to the copper. If the liquid crystal polymer is used, heat can be reduced. Stress during processing. The liquid crystal polymer is a heat-resistant thermoplastic resin, and is classified into a thermotropic liquid crystal polymer which exhibits liquid crystallinity in a molten state and a lyotropic liquid crystal polymer which exhibits liquid crystallinity in a solution state. As the liquid crystal polymer used in the present invention, a thermotropic liquid crystal polymer is preferable, and more specifically, a thermotropic liquid crystal polyester or a thermotropic liquid crystal polyamine ester is preferable. In the present invention, the thickness of the thermoplastic resin film as the insulating layer is preferably 10 < m or more and 2000 or less. If it is too thin, the strength may be insufficient. On the other hand, if it is too thick, it is difficult to form a film. In addition, a thermoplastic resin film 9

The planar shape and size of the JPGT-02008TW JPGT-02008TW201003994 may be appropriately determined depending on the size of the device in which the completed LED substrate is used. In the above liquid crystal polymer film, the linear expansion coefficient can be adjusted. It is preferable that the coefficient of linear expansion is adjusted to be 30 ppm/°C or less in a direction parallel to the plane of the film. More desirably, it is 25 ppm/°C or less. Further, the coefficient of linear expansion of the liquid crystal polymer film can be adjusted by controlling the molecular orientation. Alternatively, it may be adjusted by adding a filler or the like. However, since the filler sometimes adversely affects the surface smoothness of the liquid crystal polymer film, the coefficient of linear expansion is preferably adjusted in accordance with the elongation conditions. In order to mount a surface mount type LED with a die attach heat sink, it is preferable to open a hole in the thermoplastic resin film in advance in order to connect the die heat sink and the heat dissipation layer with a thermally conductive adhesive. The size of the hole is adjusted to match the size of the LED. The material of the linear conductive material which is thermocompression bonded to the thermoplastic resin film in the present invention is not particularly limited as long as it can be used for a circuit of a circuit board. For example, copper, silver, gold, aluminum, iron, nickel, and an alloy containing the same, and a conductive carbon material such as carbon fiber may be mentioned, and it is preferable to use copper or a copper alloy which is widely used as a raw material of an electronic circuit. . Further, the linear conductive material may be subjected to a metal plating treatment before or after bonding with the thermoplastic resin film. The linear conductive material acts as a circuit in the LED substrate of the present invention. Therefore, a wire having a diameter of about 20 #m or more and a diameter of about 5 mm or less may be used, but it is preferable to easily form a flat plate for LEDs. Alternatively, the mounting portion of the LED may be a flat line. For example, a linear metal foil having a cross-sectional shape of a width of 0.05 to 50 mm and a thickness of about 1 to 500/zm is preferable. In the present invention, the linear conductive material and the thermoplastic resin film are hot pressed

201003994 JPGT-02008TW. The number of the linear conductive materials which should be joined is not particularly limited, but it is more desirable to be two or more. If there is only one, only multiple LEds can be connected in series, but not in parallel. Further, when two linear conductive materials are used, [ED may be connected in parallel or may be connected in series as will be described later. If three or more linear conductive materials are used, it is also possible to connect a plurality of LED groups connected in series in parallel. As a result, the LEDs connected in series can emit light substantially uniformly regardless of their quality, and by connecting in parallel, even if a part of the LEDs fails, although the series portion including the LED does not emit light, other series portions also emit light. Therefore, although the overall amount of luminescence will decrease, the risk of total extinction can be reduced. When two or more linear conductive materials are thermocompression bonded, it is preferable to arrange them in parallel or approximately parallel to each other. In some cases, when LEDs are mounted between two linear conductive materials, the spacing between the linear conductive materials is not uniform, which tends to be difficult to automate, and LEDs may not be provided. The distance between the linear conductive materials when two or more linear conductive materials are thermocompression bonded differs depending on the type and size of the LED to be mounted, but is usually 10 or more and 50 mm or less, and more preferably 20 &quot ; m or more, 5mm or less. Further, after bonding a linear conductive material having a wide width, two or more linear conductive materials may be formed by cutting a central portion thereof linearly. The conditions for thermocompression bonding the linear conductive material and the liquid crystal polymer film may be appropriately determined according to a preliminary experiment or the like. For example, a linear conductive material to be thermocompression bonded is disposed on a liquid crystal polymer film, and a release sheet such as a porous PTFE sheet is inserted thereon at a temperature of 200 to 400 ° C and a pressure of 〇.5 to 10 MPa. The thermocompression bonding is performed under the conditions of 3 seconds to 5 minutes. In general, it is known that the method of the present invention is faster and consumes less energy than the case of heating for a few hours required for curing of the thermosetting resin.

201003994 JPGT-02008TW It is also advantageous to approximate the time of the equipment. When the wiring-shaped conductive material is hot-pressed, it is preferable to press the linear conductive material into the surface of the thermoplastic resin film. If there is no step S ′ between the linear conductive material and the thermoplastic resin film, as shown in FIGS. 4 to 6 , it is possible to more reliably suppress the failure of the surface mount type LED of the solder ribbon with the die heat sink, or to fix the LED. Excessive spread of resin in bare wafers. Further, if the substrate on which the circuit is provided is smooth, the accuracy can be improved when printing solder paste or anti-(4). When the linear conductive material is pressed into the surface of the thermoplastic resin film, it is only necessary to adjust the thermocompression bonding conditions. For example, to improve the thermocompression _ temperature and energy, you can extend the time. Further, in the present invention, it is also possible to press the wiring-like conductive material on both sides of the thermoplastic resin film, and to connect the circuit on both sides by a through hole or a conductive bonding method or the like. (2) The wire-breaking step of the linear conductive material is in the present invention. The wire-shaped conductive material which is thermocompression bonded to the thermoplastic resin film is broken as needed. For example, as shown in Fig. 7, when (4) is mounted in parallel between two linear conductive materials, it is not necessary to use a linear conductive material_wire. However, when a plurality of LEDs are mounted in series on the "bar" (four) material, it is necessary to disconnect the portion where the coffee should be installed. Further, as shown in Fig. 8, in order to mount a plurality of (four)' between the two linear conductive materials, it is only necessary to alternately disconnect the portions to be installed. When at least three linear conductive _ are thermocompression bonded, the (4) (four) material (10) @ parts may be connected in parallel according to the requirements. That is, a plurality of LEDs are mounted in series on the strip-shaped conductive material, and between the portions where the linear conductive material or the portion to be mounted is appropriately disconnected 'to make the portions of the two creep lines and to lose them The two wire-shaped conductive materials configured can be connected. In addition, in the case of two linear conductive materials 12

201003994 JPGT-0200STW When connecting in series - LED, as shown in Figure 9 and Figure ι, between the led and disconnection knives, the two lines arranged like two linear conductive materials are read. The conductive material can be connected. The wire breakage of the linear conductive material needs to be somewhat equal to the size of the LED when the LED is mounted at the portion. On the other hand, when the disconnected portion is not installed, there is a special limitation on the large j/ of the broken file. For example, it is also possible to simultaneously break the wire and form the heat dissipation hole by using a method of punching or cutting the thermoplastic film together with the linear conductive material and also using the heat dissipation layer. In order to connect a plurality of linear conductive materials, in addition to the LEDs, other components such as resistors may be used as needed, or only wires may be used. In addition, the disconnection of the linear conductive material can be performed before the LED is mounted, or it can be ordered after 5 mounting. Further, the disconnection of the linear conductive material may be performed by providing a heat dissipation layer or after forming a heat dissipation layer. As described above, as long as the linear conductive materials are thermally bonded in parallel, it is possible to easily manufacture LED substrates which are connected in series or in parallel or in parallel in series. i (3) Step of forming the heat dissipation layer It is preferable to provide a heat dissipation layer on the side of the thermoplastic resin film opposite to the hot-pressed wiring-like conductive material or on the side opposite to the thermocompression-side. In the LED substrate, it is important to reduce the amount of heat generated by the luminescence. The material for forming the heat dissipation layer is not particularly limited as long as it has good thermal conductivity. However, for example, steel, silver, gold, aluminum, iron, nickel, cobalt, and alloys containing the same may be used, and it is also possible to use Jiang Gan _, the material of the town, or the ceramics such as oxidation. The thickness of the heat dissipation layer is not particularly limited, but may be, for example, about 5# m or more. Scatter 13

JPGT-02008TW JPGT-02008TW201003994 If the thermal layer is too thin, the film strength will decrease, and the bonding operation may be difficult to perform. On the other hand, the upper limit of the thickness is not particularly limited. Further, the heat dissipation layer may be formed only on the side opposite to the portion where the LED is mounted or the portion to be mounted. However, since the step is complicated, it is preferably formed on the entire back surface of the thermoplastic resin film. Further, if necessary, the heat dissipation layer may be bonded to the light emitting portion that does not interfere with the LED mounting surface, and the heat dissipation layer may be larger than the thermoplastic resin film. It is also possible to use a binder to adhere the heat-dissipating layer to the thermoplastic resin film. However, there is a disadvantage that the heat dissipation effect is lowered due to the thickness of the binder, and it is necessary to apply the binder and dry. Therefore, it is preferable that the heat dissipation layer is effectively subjected to thermocompression bonding using the characteristics of the thermoplastic film. Further, the thermocompression bonding condition of the heat dissipation layer can be set to be the same as the thermocompression bonding condition of the linear conductive material. The heat dissipation layer may be formed before the thermocompression bonding of the linear conductive material, or may be formed after the thermocompression bonding, or may be performed simultaneously with the thermocompression bonding of the linear conductive material. However, from the viewpoint of protecting the LED, it is preferable to form the heat dissipation layer at least before the LED is mounted. In addition, when the heat dissipation layer cannot sufficiently ensure the area required for heat dissipation due to design reasons, the heat dissipation layer bonded to the thermoplastic film is used as a primary heat dissipation layer, and further combined with other heat dissipation members can be used as a heat dissipation layer. A supplement to the ability. For example, a method of bonding heat-dissipating fins to a primary heat-dissipating layer, or a device with LEDs, can be used as a heat-dissipating component in combination with a primary heat-dissipating layer, and the entire device with LEDs can be used as heat dissipation. Materials and other methods. (4) LED mounting step In the present invention, at least two LEDs are mounted. The fact that only one LED is mounted on the circuit does not require complicated steps, but in the present invention, the object is to easily and efficiently manufacture a substrate on which a plurality of LEDs are mounted. 14

201003994 JPGT-02008TW LED installation method is known as the method. That is, in the case of the surface mount type LED of the solar heat sink, the die heat sink is placed in the thermoplastic resin film (four) hole', and the f (four) heat dissipation layer and the grain axis Hit are soldered to a high thermal conductivity (four). The electrode is divided into a wiring-like conductive material. In the case of a bare wafer, for example, a wafer die is bonded to one of two linear conductive materials, and another linear conductive material is bonded to the wafer by a wire or the like. However, the direction in which the LEDs are mounted is selected according to the purpose. (5) Insulation step In the month of this month, it is preferable to heat the terminal-shaped conductive material and install the LED after the thermal plastic resin is insulated for the purpose of protecting the circuit surface from the outside. The insulation is undoubtedly applied by coating a general insulating coating or a protective film having high light reflectivity, and other commonly known insulating methods can also be used. Alternatively, the thermoplastic resin film may be thermally bonded to the circuit surface. (6) Step of Forming Light-Reflecting Layer In the present invention, it is preferable to form a light-reflecting layer on the outer surface of the thermoplastic resin film on the side of the hot-pressed wiring-like conductive material. Although some thermoplastic resin films have poor light transmittance, they are generally transparent or translucent. Therefore, although the light emitted from the LED is reflected to some extent, a part is transmitted through the thermoplastic resin film or absorbed. However, if a light reflecting layer is formed, light emitted from the LED can be effectively used. The method of forming the light-reflecting layer is not particularly limited, and a conventional technique can be used. However, it is preferable to cover the portion other than the portion where the LED is mounted or the portion to be mounted with the porous resin film. When covered with a porous resin film, light can be efficiently reflected. In addition, 15

JPGT-02008TW JPGT-02008TW201003994 The resin film is also lightweight and flexible. The material of the porous resin film may, for example, be PTFE (polytetrafluoroethylene), PET (polyethylene terephthalate) or PP (polypropylene). Further, the pore diameter of the porous resin film is not particularly limited, but the average value of the diameter may be about 10 #m or less. As the light-reflecting layer of the present invention, it is particularly preferable to use a porous PTFE film. In addition to good light resistance, PTFE also has good photodegradability. The covered porous PTFE can be produced by forming a PTFE powder into a sheet and further forming a porous body in one axial direction or two axial directions. Further, since a porous PET film or a porous PP film which is a light-reflecting material is commercially available, it is sufficient to use them. The thickness of the porous resin film may be appropriately adjusted, but it is preferably 10 μm or more and 2000//m or less. If it is less than 10/m, the light reflection efficiency may decrease. On the other hand, if it exceeds 2000/z m, the cost will increase. The method of covering with the porous resin film is not particularly limited, and conventional techniques can be used. For example, since it is difficult to bond with a thermoplastic resin film only by thermocompression bonding in a porous resin film, a binder formed of an epoxy resin, a phenol resin, a polyimide resin, or a BT resin is used, and it is bonded to thermoplasticity. The resin film can be adhered, and it can also be adhered with a binder. Further, other adhesive sheets in which the above-mentioned binder is impregnated with the porous resin film may be used, and the porous resin film and the thermoplastic resin film which are the reflective layers are bonded. As the light-reflecting film with a binder, there are commercially available FLEXIBOND white light-reflecting films of the company Kortex Co., Ltd., which are commercially available. When the film with a binder is used, the porous resin film and the thermoplastic resin film can be easily adhered. The formation of the light-reflecting layer can be performed as long as it is performed after hot-pressing the wiring-shaped conductive material.

201003994 JPGT-02008TW There are no special restrictions. When the light reflection layer is formed before the heat dissipation hole is formed, it is difficult to form a heat dissipation hole in addition to the light reflection layer, and the reflection efficiency may be lowered if the heat dissipation hole is always provided to the reflection layer. However, in order to improve the heat dissipation efficiency, the heat dissipation holes may be actively opened in the reflective layer. (7) Step of Forming Heat-Transmission Through Hole In the LED substrate of the present invention, it is preferable that a through hole for heat dissipation is provided in the thermoplastic resin film, the linear conductive material, and the heat dissipation layer. The LED generates heat due to light emission, and the light-emitting function of the LED is lowered due to the heat. In recent years, the brightness and power of LEDs have been further developed, and the heat dissipation of LED substrates has become more and more important. Further, in order to extend the life of the substrate, it is also desired to improve the heat dissipation efficiency. Preferably, the hole for heat dissipation penetrates through the thermoplastic resin film, the linear conductive material, and the heat dissipation layer. This is to make the air permeability good, and the heat generated by the heat generated by the LED is radiated to the outside. In addition, in order to effectively dissipate the heat radiated from the LED, it is preferable that the position of the hole is set near the led. Further, in the case of a surface mount type LED having a die heat sink, it is preferable to open the hole of the thermoplastic resin film and connect the die heat sink and the heat dissipation layer with a material having high thermal conductivity. According to this method, the heat dissipation efficiency can be further improved. The size and shape of the through hole for heat dissipation are not particularly limited, but it is preferably 50/zm or more and 50mm or less. However, the number and size of the through holes need to be adjusted appropriately. If the number of through holes is too large or too large, not only the strength of the substrate is lowered, but also the heat dissipation effect may be lowered. Therefore, it is necessary to determine the size, number, and position of the through holes in consideration of the type and number of LEDs. Further, when the heat dissipation hole also serves as the disconnection unit of the linear conductive material, it is necessary to make the size of the heat dissipation hole larger than the width of the linear conductive material. On the other hand, the heat dissipation hole is provided with the disconnection of the linear conductive material 17

JPGT-02008TW JPGT-02008TW201003994 When the outside of the part is outside, the size of the heat dissipation hole must be such that it does not cause disconnection. (8) LED sealing step When using an LED bare chip, it is preferable to mount it on a linear conductive material and then seal it with a transparent resin. Solid sealing is very important when using LED bare wafers. The method of solidifying the LED is not particularly limited, and conventional techniques can be used. For example, the resin for solid sealing can be appropriately selected and used from a transparent or translucent liquid solid sealing resin formed of an epoxy resin or a enamel resin. Conventionally, when a planar substrate is solid-sealed with a liquid resin, it is possible to suppress the resin from spreading from the solid-sealed portion by adjusting the viscosity or thixotropy of the resin or by using a barrier material. However, if the viscosity of the resin is increased, since the bubbles tend to remain in the solid sealing resin, it is difficult to perform the sealing operation. Further, even if a barrier material is used, the viscosity of the transparent resin is lowered at the time of heat curing, and the resin sometimes flows out from the step difference between the substrate and the circuit. Therefore, in the present invention, it is preferable to press the linear conductive material into the surface of the thermoplastic resin film. By eliminating the step difference between the linear conductive material and the thermoplastic resin film, excessive spread of the sealing resin can be suppressed (refer to Figs. 3 and 6). Further, it is preferred that the porous resin film covered as the reflective layer is used as a barrier material as it is. Since the porous resin film has excellent light reflectance, the luminous efficiency of the LED substrate according to the present invention can be improved. Further, by selecting a porous resin film having low affinity with the sealing resin and repelling the sealing resin, a convex resin shape having a convex lens shape as shown in Fig. 11 can be obtained. Further, it is also possible to form a shape other than the shape of the convex lens by adjusting the height of the barrier material and the amount of the sealing resin. 18

201003994 JPGT-02008TW In general, when an LED substrate is fabricated, it is installed on a circuit after the LED is separately fabricated, so the efficiency is relatively poor. However, when the LED bare wafer is mounted in the present invention, the LED bare wafer can be directly die-bonded on the linear conductive material, and the LED can be hermetically sealed after wire bonding. That is, according to the present invention, the lED substrate can be continuously produced more efficiently by a series of operations from forming a circuit to mounting an LED. According to the method of the present invention, a substrate in which a plurality of LEDs are arranged can be easily and continuously manufactured without an etching step. At present, one reason why LED lighting and coffee backlights are not widely available is that the manufacturing cost of the substrate is high. On the other hand, according to the present invention, the roll-shaped conductive wire is continuously bonded to the roll-shaped liquid crystal polymer film without using an etching step, and the product, that is, the LED circuit board is also formed into a roll shape. The open state is generally referred to as a roll-to-roll (r〇U t〇r〇ll), and because of its high efficiency, it is a continuous manufacturing method that can greatly reduce the production cost, which is suitable for mass production. Needless to say, even when the roll-to-roll is not employed in the method of the present invention, the method of the present invention is efficient and low in cost. Therefore, it is considered that the present invention can contribute to the widespread use of LEDs, which are light sources having high luminous efficiency, long life, and environmental friendliness. In addition, the LED substrate manufactured by the method of the present invention has a good luminous efficiency and a high heat dissipation rate, a high luminance, and a long life. Therefore, the LED substrate according to the present invention can be widely used for backlights, advertisements, and the like of liquid crystal displays. Panel backlights used, residential lighting, automotive lighting, equipment lighting, lighting for entertainment installations, aircraft or space development or rail-related lighting, billboards or street lights. The present invention will be more specifically described by the following examples, but the present invention is not limited to the following examples, and may be appropriately modified and carried out within the scope of the above-mentioned and the following. Within the technical scope of the present invention. 201003994 ^T-OiOOgx^ Embodiment 1 Manufacturing of LED substrate according to the present invention (1) Thermal bonding of a linear conductive material to a liquid crystal polymer film of 25 mm x 300 mm and a thickness of 60 / / m (日太 $ + 戈尔泰克In the case of the product name "BIACBCO60W-NT", a linear copper foil having a width of 2 mm and a thickness of 18/zm is arranged in parallel at intervals of w / M 4 mm (made by Koji Co., Ltd., product name) "GTS-MP-18"). A porous pTFE sheet was placed as a release sheet, and a small vacuum press (manufactured by Imoto Co., Ltd.) was used, and the linear copper foil was pressed at a temperature of 300 ° C and a pressure of IMpa for 3 minutes. Enter the surface of the liquid crystal polymer film. The liquid crystal polymer film of the hot-pressed copper foil was taken out after cooling. Nine holes having a width of 2.5 mm and a length of 6 mm were opened between the two linear copper foils at intervals of 30 mm. (2) Formation of heat-dissipating layer On the entire back surface side of the liquid crystal polymer film, a molten steel plate plated with a thickness of 1.2 mm was thermocompression-bonded under the same conditions as in the above (1). (3) The LED is mounted on the anode and cathode of the white wafer-shaped LED (product name "NS6W083AT" manufactured by Seiya Chemical Co., Ltd.) in the position where the die heat sink is located in the hole opened in the above (1). Welding is performed with each of the linear copper foils, and the heat-dissipating layer, that is, the molten zinc-plated steel sheet and the crystal grain heat sink are welded through the previously opened film holes. (4) Insulation The insulating part of the printed wiring board (product name "Bcl〇〇〇" manufactured by Sakamoto Soda Co., Ltd.) is applied to the exposed portion of the linear copper foil and the soldered portion, and is insulated from the environment. 20

201003994 JPGT-02008TW The above results confirmed that a continuous LED substrate which is light in weight and excellent in heat dissipation can be obtained with high productivity without an etching step. [Example 2] Production of LED substrate according to the present invention (1) Liquid-based polymer film having a width of 10 mm, a length of 120 mm, and a thickness of 60/zm (manufactured by Nippon Kortex Co., Ltd., "BIAC") On one surface of BCO60W-NT"), two linear copper foils (manufactured by Furukawa Electric Co., Ltd., "GTS-MP-18") having a width of i.omm and a thickness of 18/zm are arranged in parallel at intervals of 100/zm. ξ. The porous PTFE was used as a release sheet, and a small vacuum press (manufactured by Imoto Co., Ltd.) was used, and the linear copper foil was pressed into the liquid crystal at a temperature of 30 CTC and a pressure of IMpa for 3 minutes. The surface of the polymer film was taken out after cooling. The surface of the linear copper foil was further subjected to electroplated silver having a thickness of 1/zm. (2) The formation of the heat dissipation layer is the same as the liquid crystal polymer film of the above (1), and the position corresponding to the two linear copper foils is set as a predetermined position of the bare LED chip at 30 mm. A hole having a diameter of 3 mm was opened at three locations. The liquid crystal polymer film was superposed on the surface of the linear copper foil to which the above (1) was pressure-bonded, and an aluminum plate having a thickness of 3 mm of the same size was placed on the back surface thereof, and heated and twisted under the same conditions as the above (1). , make a fit. (3) The light-reflecting layer and the barrier material are made of a porous PTFE sheet with an adhesive layer (a FLEXIBOND white light-reflecting film manufactured by Kortex, Japan) with a diameter of 3 mm at a position corresponding to the LED mounting portion. a hole that aligns the hole with the hole in the linear copper foil, and (2) 21 above

201003994 JPGT-02008TW film fit. (4) The LED is mounted on one of two linear copper foils located in the holes of the porous PTFE sheet, and the bare LED chip (C527_MB_29® manufactured by Cree Co., Ltd.) is made of silver paste in each hole. The die bonding is performed by wire bonding from another bare wafer with a gold wire on another linear copper foil. (5) Sealing of the LED into the hole of the porous PTFE sheet containing the bare LED chip. Inject transparent epoxy resin (manufactured by Inagaki Kogyo Co., Ltd., "Main Agent 2 HL2000A, Curing Agent = HL2000B2")" until it is slightly The surface of the porous PTFE sheet was raised above the level and cured by heating at 120 ° C for 60 minutes, followed by heat curing at 150 ° C for 4 hours. As a result, it is possible to obtain a shape in which the solid-sealed shape is a symmetrical shape of the shape of the convex lens. As described above, it is possible to easily manufacture an LED substrate in which LEDs are mounted in parallel on a strip-shaped circuit board having a width of 10 mm at intervals of 30 mm, and a heat dissipation layer is formed on the back surface and sealed by a transparent resin of a convex lens shape. (Embodiment 3) Manufacturing of LED substrate according to the present invention (1) Liquid-based polymer film of 25 mm x 300 mm and thickness 60 " m is thermocompression bonded to a linear conductive material (manufactured by Hitachi, Japan, product name "BIAC BCO60W" On -NT"), two linear copper foils having a width of 1. 〇 mm and a thickness of 18/zm were arranged in parallel at intervals of 1.0 mm. Porous PTFE was placed as a release sheet on the upper and lower sides, and a small vacuum press (manufactured by Imoto Co., Ltd.) was used, and the mixture was heated under pressure at 300 ° C for 1 minute under pressure of IMpa to heat-press the copper foil. The liquid crystal polymer film was taken out after being cooled to room temperature. 22 JP (^T-〇2〇〇gx^v 201003994 (2) The series structure is formed by breaking two linear copper foils with a diameter of 1 1 at intervals of 6 mm per substrate. The disconnection positions of the two linear copper foils are shifted to each other 邛mmUmm (3) The LEDs are mounted and the LED components of the circuit main body shown in Fig. 8 (manufactured by Saiya Chemical Industry Co., Ltd., product name "NssR426eT" It is known that the parallel line circuit which is broken by the hole opened in the above step (2) is connected in series with LEJ). The direction is the premise of the series arrangement. (4) The insulation passes through the exposed portion and the welded portion of the linear copper foil. Coatings for printed circuit boards and coatings (manufactured by Sakamoto Soda Co., Ltd., product name "BC1〇" ''; Insulation. The above results confirm that a continuous ribbon can be obtained without the etching step. As a result of the LED substrate 1, it is understood that the roll-shaped, substrate can be continuously and efficiently produced from the roll-shaped thermoplastic resin film according to the correction method.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a state in which a surface mount type LED having a die heat sink is mounted on a substrate on which a linear conductive material is not pressed onto a surface of a thermoplastic resin film. The figure is a schematic view showing a case where a bare bare wafer is mounted on a substrate on which a linear conductive material is not pressed into a surface of a thermoplastic resin film; and FIG. 3 is a view in which the second figure is rotated by 9 (a linear conductive material) A schematic view of a cross section of a portion of the LED substrate in the longitudinal direction in which the resin propagates along the linear conductive material: FIG. 4 is a view showing the surface 23 in which the linear conductive material is pressed into the thermoplastic resin thin film.

201003994 JPGT-02008TW The case where the surface mount type LED with a die heat sink is mounted on the substrate; Fig. 5 is a view showing the substrate on which the linear conductive material is applied to the surface of the thermoplastic resin film. FIG. 6 is a schematic view showing a cross section of the LED substrate in the longitudinal direction of the linear conductive material when the fifth figure is rotated by 90°; FIG. 7 is a parallel connection between the two linear conductive materials. FIG. 8 is a circuit diagram in which lEd is connected in series between two linear conductive materials; 苐9 is a circuit diagram in which four linear conductive materials are used, and LEDs connected in series are connected in one step and parallel connection; The figure is a plan view of a led substrate having a circuit in which four LED conductive materials are used to further connect the LED groups connected in series; and FIG. 11 is a view showing that the bare bare wafers are arranged in three parallel rows and covered with a porous resin film. A schematic view of the substrate outside the portion and enclosing the LED bare wafer. [Main component symbol description] 1 Thermoplastic resin film 2 Linear conductive material 3 LED with grain heat sink 4 Grain heat sink 5 Thermal conductive horse adhesive 7 Heat dissipation layer 9 LED bare wafer 11 solid sealing resin 6 Electrode 8 The gap between the substrate and the LED

10 wire 12 LED 13 wire-shaped conductive material broken part 14 resistor 15 porous PTFE sheet 24

Claims (1)

« 201003994 JPGT-02008TW VII. Patent application scope: 1. A method for manufacturing an LED substrate, comprising: a step of hot-pressing a conductive material in a thermoplastic resin film; and a step of installing at least two LEDs in a linear conductive material . 2. The manufacturing method according to claim 1, wherein the linear conductive material is pressed into the surface of the thermoplastic resin film when the wiring-shaped conductive material is hot-pressed. 3. The manufacturing method according to claim 1, which comprises, in order to connect the LEDs mounted between the two linear conductive materials in series, between the mounted LEDs or between the portions of the LEDs to be mounted The steps of alternating disconnection. 4. The manufacturing method according to claim 1, which comprises the step of thermally crimping at least three linear conductive materials, and connecting the portions of the LEDs connected in series further in parallel. 5. The manufacturing method according to claim 1, which comprises, on the side of one side of the thermoplastic resin film which is thermocompression bonded to the linear conductive material, the portion to which the LED is mounted or which should be mounted with the porous resin film The step of covering the outside of the LED section. 6. The manufacturing method according to claim 1, wherein when the LED bare wafer is used, the step of solidifying the LED bare wafer with a transparent resin is included. 7. The manufacturing method according to Item 1, which comprises the step of providing a heat dissipating layer on a side of the thermoplastic resin film opposite to the side of the thermocompression-bonded conductive material or on the side opposite to the thermocompression bonding side. 8. The manufacturing method according to claim 7, comprising the step of providing a through hole for heat dissipation in the thermoplastic resin film, the linear conductive material, and the heat dissipation layer. An LED substrate is manufactured by the manufacturing method according to any one of claims 1 to 8. 25