TW200951530A - Autofocus method and apparatus for wafer scribing - Google Patents

Autofocus method and apparatus for wafer scribing

Info

Publication number
TW200951530A
TW200951530A TW098109704A TW98109704A TW200951530A TW 200951530 A TW200951530 A TW 200951530A TW 098109704 A TW098109704 A TW 098109704A TW 98109704 A TW98109704 A TW 98109704A TW 200951530 A TW200951530 A TW 200951530A
Authority
TW
Taiwan
Prior art keywords
wafer
scribing
laser beam
objective lens
autofocus method
Prior art date
Application number
TW098109704A
Other languages
Chinese (zh)
Other versions
TWI447468B (en
Inventor
xiu-ping Xie
Jun Zhu
Leif Summerfield
Chung-Po Huang
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200951530A publication Critical patent/TW200951530A/en
Application granted granted Critical
Publication of TWI447468B publication Critical patent/TWI447468B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

Landscapes

  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Dicing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automatic Focus Adjustment (AREA)

Abstract

A method and an apparatus perform real time autofocus for a wafer scribing system. The method and apparatus uses polarized light (42) directed to the surface (50) of the wafer (10) directly under the objective lens (26) for the scribing laser beam at a grazing angle. The light reflected from the wafer is filtered (56) to remove light from the scribing laser beam and then focused on a position sensitive device (58) to measure the distance from the objective lens to the wafer surface.
TW098109704A 2008-03-28 2009-03-25 Autofocus method and apparatus for wafer scribing TWI447468B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4042008P 2008-03-28 2008-03-28

Publications (2)

Publication Number Publication Date
TW200951530A true TW200951530A (en) 2009-12-16
TWI447468B TWI447468B (en) 2014-08-01

Family

ID=41114651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098109704A TWI447468B (en) 2008-03-28 2009-03-25 Autofocus method and apparatus for wafer scribing

Country Status (5)

Country Link
JP (1) JP2011517428A (en)
KR (1) KR101666462B1 (en)
CN (1) CN101983420B (en)
TW (1) TWI447468B (en)
WO (1) WO2009120706A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE46672E1 (en) 2006-07-13 2018-01-16 Velodyne Lidar, Inc. High definition LiDAR system
CN102259234A (en) * 2010-05-26 2011-11-30 Ntn株式会社 Laser Patterning Device And Laser Patterning Method
KR20120019649A (en) * 2010-08-26 2012-03-07 삼성엘이디 주식회사 Apprartus and method for laser scribing
CN103217098B (en) * 2012-01-19 2017-05-03 昆山思拓机器有限公司 Focus finding method for multi-spectral photoelectrical focus finding device
CN103212908A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Calibration method for dead-center position of laser spray nozzle
CN103955108A (en) * 2014-05-15 2014-07-30 中国工程物理研究院激光聚变研究中心 Multiple-energy-point spectrum resolution soft-X-ray framing imaging system
US10627490B2 (en) 2016-01-31 2020-04-21 Velodyne Lidar, Inc. Multiple pulse, LIDAR based 3-D imaging
CA3017735C (en) 2016-03-19 2023-03-14 Velodyne Lidar, Inc. Integrated illumination and detection for lidar based 3-d imaging
WO2017210418A1 (en) 2016-06-01 2017-12-07 Velodyne Lidar, Inc. Multiple pixel scanning lidar
JP7290571B2 (en) 2017-03-31 2023-06-13 ベロダイン ライダー ユーエスエー，インコーポレイテッド Integrated LIDAR lighting output control
CN110809704B (en) 2017-05-08 2022-11-01 威力登激光雷达美国有限公司 LIDAR data acquisition and control
KR102551322B1 (en) * 2017-12-08 2023-07-04 주식회사 탑 엔지니어링 Scribing apparatus using laser displacement sensor and operating method thereof
JP6932248B2 (en) * 2018-04-09 2021-09-08 東京エレクトロン株式会社 Laser Machining Equipment, Laser Machining Systems, and Laser Machining Methods
US10712434B2 (en) 2018-09-18 2020-07-14 Velodyne Lidar, Inc. Multi-channel LIDAR illumination driver
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
US11885958B2 (en) 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
CN111940910A (en) 2019-05-16 2020-11-17 松下知识产权经营株式会社 Laser processing device, laser processing method, and correction data generation method
US11556000B1 (en) 2019-08-22 2023-01-17 Red Creamery Llc Distally-actuated scanning mirror

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117254A (en) * 1988-05-13 1992-05-26 Canon Kabushiki Kaisha Projection exposure apparatus
JP2886957B2 (en) * 1990-09-06 1999-04-26 キヤノン株式会社 Automatic focusing device
JPH06297175A (en) * 1993-04-15 1994-10-25 Nippon Steel Corp Gap sensor for laser beam machine
JP3555230B2 (en) * 1994-05-18 2004-08-18 株式会社ニコン Projection exposure equipment
US6031615A (en) * 1997-09-22 2000-02-29 Candela Instruments System and method for simultaneously measuring lubricant thickness and degradation, thin film thickness and wear, and surface roughness
JP2000230802A (en) * 1999-02-10 2000-08-22 Anritsu Corp Displacement measuring instrument
JP4555092B2 (en) * 2005-01-05 2010-09-29 株式会社ディスコ Laser processing equipment
JP5122773B2 (en) * 2006-08-04 2013-01-16 株式会社ディスコ Laser processing machine

Also Published As

Publication number Publication date
KR101666462B1 (en) 2016-10-14
KR20110010693A (en) 2011-02-07
JP2011517428A (en) 2011-06-09
CN101983420B (en) 2013-06-26
WO2009120706A2 (en) 2009-10-01
TWI447468B (en) 2014-08-01
WO2009120706A3 (en) 2010-02-18
CN101983420A (en) 2011-03-02

Similar Documents

Publication Publication Date Title
TW200951530A (en) Autofocus method and apparatus for wafer scribing
MX2009004286A (en) Device for laser-optical eye surgery.
TW200833448A (en) Laser processing device
ATE405860T1 (en) DEVICE AND METHOD FOR REDUCING SPECKLE
TW200707088A (en) Metrology apparatus, lithographic apparatus, process apparatus metrology method and device manufacturing method
NO20024302D0 (en) Microscope for high-throughput screening with an autofocus device
WO2009049834A3 (en) Optical sensor device
ATE516913T1 (en) DEVICE AND METHOD FOR MATERIAL PROCESSING USING A TRANSPARENT CONTACT ELEMENT
ATE469622T1 (en) DEVICE AND METHOD FOR CALIBRATING A LASER SYSTEM
WO2012096847A3 (en) Apparatus for euv imaging and methods of using same
CN102974936A (en) System for laser focus positioning and method for positioning material on laser focus point
WO2014044498A3 (en) Device for position control of a laser machining beam
JP2011510820A5 (en)
SG169987A1 (en) Plane position detecting apparatus, exposure apparatus and device manufacturing method
WO2014056708A3 (en) Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method
JP2010169496A5 (en)
US20140320866A1 (en) Shape Measuring Apparatus
ATE551701T1 (en) X-RAY COMPRESSION METHOD AND APPARATUS WITH PHASE RECOVERY METHOD
ATE451866T1 (en) MEASUREMENT OF SURFACE TOPOGRAPHY AND WAVE ABERRATION OF A LENS SYSTEM
WO2012041461A3 (en) Projection exposure tool for microlithography and method for microlithographic exposure
IN2010KN00855A (en)
ATE546286T1 (en) GENERATION OF A UNIFORM IMAGING SURFACE
ATE403522T1 (en) DEVICE AND METHOD FOR POSITIONING ELECTRONIC CHIPS
CN102478699B (en) Automatic focusing device and method thereof
WO2013189605A3 (en) Laser scribing system

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees