WO2009120706A3 - Autofocus method and apparatus for wafer scribing - Google Patents

Autofocus method and apparatus for wafer scribing Download PDF

Info

Publication number
WO2009120706A3
WO2009120706A3 PCT/US2009/038122 US2009038122W WO2009120706A3 WO 2009120706 A3 WO2009120706 A3 WO 2009120706A3 US 2009038122 W US2009038122 W US 2009038122W WO 2009120706 A3 WO2009120706 A3 WO 2009120706A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
scribing
laser beam
objective lens
autofocus method
Prior art date
Application number
PCT/US2009/038122
Other languages
French (fr)
Other versions
WO2009120706A2 (en
Inventor
Xiuping Xie
Jun Zhu
Leif Summerfield
Chung-Po Huang
Original Assignee
Electro Scientific Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries, Inc. filed Critical Electro Scientific Industries, Inc.
Priority to KR1020107021644A priority Critical patent/KR101666462B1/en
Priority to CN2009801112711A priority patent/CN101983420B/en
Priority to JP2011501985A priority patent/JP2011517428A/en
Publication of WO2009120706A2 publication Critical patent/WO2009120706A2/en
Publication of WO2009120706A3 publication Critical patent/WO2009120706A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Dicing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automatic Focus Adjustment (AREA)

Abstract

A method and an apparatus perform real time autofocus for a wafer scribing system. The method and apparatus uses polarized light (42) directed to the surface (50) of the wafer (10) directly under the objective lens (26) for the scribing laser beam at a grazing angle. The light reflected from the wafer is filtered (56) to remove light from the scribing laser beam and then focused on a position sensitive device (58) to measure the distance from the objective lens to the wafer surface.
PCT/US2009/038122 2008-03-28 2009-03-24 Autofocus method and apparatus for wafer scribing WO2009120706A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107021644A KR101666462B1 (en) 2008-03-28 2009-03-24 Autofocus method and apparatus for wafer scribing
CN2009801112711A CN101983420B (en) 2008-03-28 2009-03-24 Autofocus method and apparatus for wafer scribing
JP2011501985A JP2011517428A (en) 2008-03-28 2009-03-24 Autofocus method and apparatus for wafer scribe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4042008P 2008-03-28 2008-03-28
US61/040,420 2008-03-28

Publications (2)

Publication Number Publication Date
WO2009120706A2 WO2009120706A2 (en) 2009-10-01
WO2009120706A3 true WO2009120706A3 (en) 2010-02-18

Family

ID=41114651

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/038122 WO2009120706A2 (en) 2008-03-28 2009-03-24 Autofocus method and apparatus for wafer scribing

Country Status (5)

Country Link
JP (1) JP2011517428A (en)
KR (1) KR101666462B1 (en)
CN (1) CN101983420B (en)
TW (1) TWI447468B (en)
WO (1) WO2009120706A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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USRE46672E1 (en) 2006-07-13 2018-01-16 Velodyne Lidar, Inc. High definition LiDAR system
CN102259234A (en) * 2010-05-26 2011-11-30 Ntn株式会社 Laser Patterning Device And Laser Patterning Method
KR20120019649A (en) * 2010-08-26 2012-03-07 삼성엘이디 주식회사 Apprartus and method for laser scribing
CN103212908A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Calibration method for dead-center position of laser spray nozzle
CN103217098B (en) * 2012-01-19 2017-05-03 昆山思拓机器有限公司 Focus finding method for multi-spectral photoelectrical focus finding device
CN103955108A (en) * 2014-05-15 2014-07-30 中国工程物理研究院激光聚变研究中心 Multiple-energy-point spectrum resolution soft-X-ray framing imaging system
US10627490B2 (en) 2016-01-31 2020-04-21 Velodyne Lidar, Inc. Multiple pulse, LIDAR based 3-D imaging
EP3430428A4 (en) 2016-03-19 2019-11-20 Velodyne Lidar, Inc. Integrated illumination and detection for lidar based 3-d imaging
WO2017210418A1 (en) 2016-06-01 2017-12-07 Velodyne Lidar, Inc. Multiple pixel scanning lidar
CA3057988A1 (en) 2017-03-31 2018-10-04 Velodyne Lidar, Inc. Integrated lidar illumination power control
CA3062701A1 (en) 2017-05-08 2018-11-15 Velodyne Lidar, Inc. Lidar data acquisition and control
KR102551322B1 (en) * 2017-12-08 2023-07-04 주식회사 탑 엔지니어링 Scribing apparatus using laser displacement sensor and operating method thereof
SG11202008643PA (en) * 2018-04-09 2020-10-29 Tokyo Electron Ltd Laser processing device, laser processing system, and laser processing method
US10712434B2 (en) 2018-09-18 2020-07-14 Velodyne Lidar, Inc. Multi-channel LIDAR illumination driver
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
US11885958B2 (en) 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
CN111940910A (en) * 2019-05-16 2020-11-17 松下知识产权经营株式会社 Laser processing device, laser processing method, and correction data generation method
US11556000B1 (en) 2019-08-22 2023-01-17 Red Creamery Llc Distally-actuated scanning mirror

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117254A (en) * 1988-05-13 1992-05-26 Canon Kabushiki Kaisha Projection exposure apparatus
US6327025B1 (en) * 1994-05-18 2001-12-04 Nikon Corporation Projection exposure apparatus for transferring mask pattern onto photosensitive substrate
US20040160604A1 (en) * 1997-09-22 2004-08-19 Meeks Steven W. System for simultaneously measuring thin file layer thickness, reflectivity, roughness, surface profile and magnetic pattern

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2886957B2 (en) * 1990-09-06 1999-04-26 キヤノン株式会社 Automatic focusing device
JPH06297175A (en) * 1993-04-15 1994-10-25 Nippon Steel Corp Gap sensor for laser beam machine
JP2000230802A (en) * 1999-02-10 2000-08-22 Anritsu Corp Displacement measuring instrument
JP4555092B2 (en) * 2005-01-05 2010-09-29 株式会社ディスコ Laser processing equipment
JP5122773B2 (en) * 2006-08-04 2013-01-16 株式会社ディスコ Laser processing machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117254A (en) * 1988-05-13 1992-05-26 Canon Kabushiki Kaisha Projection exposure apparatus
US6327025B1 (en) * 1994-05-18 2001-12-04 Nikon Corporation Projection exposure apparatus for transferring mask pattern onto photosensitive substrate
US20040160604A1 (en) * 1997-09-22 2004-08-19 Meeks Steven W. System for simultaneously measuring thin file layer thickness, reflectivity, roughness, surface profile and magnetic pattern

Also Published As

Publication number Publication date
KR20110010693A (en) 2011-02-07
TW200951530A (en) 2009-12-16
CN101983420A (en) 2011-03-02
WO2009120706A2 (en) 2009-10-01
KR101666462B1 (en) 2016-10-14
CN101983420B (en) 2013-06-26
JP2011517428A (en) 2011-06-09
TWI447468B (en) 2014-08-01

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