CN102259234A - Laser Patterning Device And Laser Patterning Method - Google Patents
Laser Patterning Device And Laser Patterning Method Download PDFInfo
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- CN102259234A CN102259234A CN2011101465197A CN201110146519A CN102259234A CN 102259234 A CN102259234 A CN 102259234A CN 2011101465197 A CN2011101465197 A CN 2011101465197A CN 201110146519 A CN201110146519 A CN 201110146519A CN 102259234 A CN102259234 A CN 102259234A
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Abstract
The invention relates to a laser patterning device and a laser patterning method capable of shortening the width of patterning line and the gap between lines. The method and the device are used for patterning of electrodes of integral solar cell in film type and the like. The laser patterning device includes an optical head (5) and a moving mechanism (6) relatively to the optical head. The optical head (5) carries a plurality of optical systems (4) used for laser processing. The optical systems irradiate the laser beams respectively. The optical head (5) moves relatively to the moving mechanism (6) along a base plate (1) in two mutually perpendicular axial directions. Automatic focusing mechanisms (7) are arranged in the optical systems (4) used for laser processing. Focusing control mechanisms (32) are also provided in the invention. The focusing control mechanisms (32) start the focusing function of the automatic focusing mechanisms (7) at a processing starting position and close the focusing function at a processing finishing position.
Description
Technical field
The present invention relates to adopt laser to laser patterning device and laser patterning method that the film that is formed on the substrate charts, the laser patterning device and the laser patterning method that in particular, the present invention relates to adopt electrode of being suitable for the integrated thin film solar cell of substrate etc. to chart with light transmission.
Background technology
In the past, in the occasion that is made in the integrated-type solar cell of integrated a plurality of assembly units (cell) on the substrate, must this film that rectangular shape will be stacked and placed on this substrate be cut apart corresponding to each assembly unit (cell), form the drawing of this film being cut apart the groove (being called line below) of usefulness.As the method for this drawing, comprise that by irradiating laser the part of film is burnt decorations (ablation) to form the laser patterning method of line, and people know the laser patterning device (laser processing device) that provides in the patent documentation 1 that this method of employing is arranged.
In the laser processing device of patent documentation 1, raising for the performance of seeking to rule, handle by adopting optical fiber that smooth (flat) carried out in the regular distribution (the strong distribution of the intensity of the centre of laser point (power)) as fundamental strength (power) distribution of laser beam, can in the face that has shone laser, process equably.It has utilized the following characteristic of optical fiber, that is, be in the process of core body inner laser propagation, has along beam diameter to this light intensity distributions being carried out the characteristic that smooth (flat) handles.In addition, visual field aperture is set in the light path of laser optical system, rectangular by making laser beam, as shown in Figure 12, can process the intersection of laser as much as possible.Because to twice irradiating laser of intersection of laser, so process variations takes place easily.As the measure that reduces this area, implement above-mentioned countermeasure.
The prior art document
Patent documentation
Patent documentation 1: Japanese kokai publication sho 62-244592 document
Summary of the invention
Recently, in order to improve the generating efficiency of solar cell, require narrowing down of the narrowing down of line width shown in Figure 13, scribe line pitch.Its reason is: because the part of this line so if reduce its area as much as possible, can increase the effective area of solar panel, then can improve the generating efficiency of solar cell to the not effect of generating of solar cell.
For the width that reduces to rule, must must reduce the variation of the beam diameter of machined surface as much as possible subtly with laser focusing, process.For this reason, in laser optical system, must keep certain and process in the distance that makes substrate surface at ordinary times.But the thickness of substrate has variation, the Level Change of substrate surface.To must process focusing at ordinary times apart from keeping certain in order to follow this situation.But, in the device of patent documentation 1, do not load autofocus mechanism.So, restricted aspect the narrowed width of seeking to rule.
The object of the present invention is to provide the laser patterning device and the laser patterning method of can reduce to rule width and the little spacingization of scribe line pitch.
Specifically, the object of the present invention is to provide a kind of laser patterning device and laser patterning method, wherein, as the conditional countermeasure of little spacingization that in existing apparatus, constitutes problem, load autofocus mechanism, in addition, implement the application method of this autofocus mechanism, thus, by the autofocus mechanism of lower price, can realize narrowing down of above-mentioned line width and narrowing down of spacing.
In addition, can help to improve the generating efficiency of solar panel by the little spacingization of the spacing that narrows down and rule of line width.
Laser patterning device of the present invention is following device, wherein, adopts laser that the film that is formed on the substrate (1) is carried out the disjunction processing of rectangular shape, it is characterized in that this device comprises:
Substrate locking stage (3), this substrate locking stage (3) is placed aforesaid substrate (1); Optical head (5), this optical head (5) and the Laser Processing optical system (4) of having established a plurality of processing of irradiating laser respectively bundles; Optical head relative moving mechanism (6), above-mentioned optical head relative moving mechanism (6) relatively move aforesaid substrate fixed station (3) and optical head (5), moving direction be along two the perpendicular direction of principal axis on the machined surface of aforesaid substrate (1) (X, Y); Machining control mechanism (31), above-mentioned machining control mechanism (31) control: the path that above-mentioned optical head (5) is moved by this optical head relative moving mechanism (6) relative to aforesaid substrate (1), and on this path, carry out the beginning of irradiation of laser of above-mentioned optical head (5) generation and processing starting position (S) and process finishing position (E) of the substrate (1) that stops respectively;
In above-mentioned optical head (5), has autofocus mechanism (7) in above-mentioned each Laser Processing on optical system (4), this mechanism (7) makes this Laser Processing consistent with the focal length of optical system (4) with above-mentioned Laser Processing with the distance between the machined surface of optical system (4) and aforesaid substrate (1), focus function controlling organization (32) is set, this mechanism (32) starts the focus function of the automatic focus function of conduct of autofocus mechanism (7) in the processing starting position of aforesaid substrate (1) (S), finish this focus function in the process finishing position of substrate (1) (E).
But, the occasion of necessity of whole line is all arranged at the edge up to substrate (1), also it doesn't matter in the front side of processing starting position (S) with the irradiation starting position of laser in processing.Again, also it doesn't matter in back, process finishing position (E) to process the irradiation end position of using laser.In this occasion, focus function starts in processing starting position (S) automatically, finishes at process finishing position (E).
According to this scheme, owing to load autofocus mechanism (7) in optical system (4), so can will and process with the distance between the camera lens (4a) as the surface of the substrate (1) of processing object in the processing of ruling of certain at ordinary times state in each Laser Processing.So, the variation of the laser point in when line can be suppressed at less degree, like this, the width that can reduce to rule, so, also can make the little spacingization of spacing of line.In the occasion of processing of ruling, must process at the constant speed state, to accelerating period of constant speed, owing to do not have the substrate (1) that constitutes processing object under with optical system (4) in Laser Processing, so can not adopt common autofocus mechanism.But, because as above-mentioned, focus function controlling organization (32) is set, this mechanism starts the focus function of autofocus mechanism (7) in the processing starting position of aforesaid substrate (1) (S), stop this focus function in the process finishing position of substrate (1) (E), even so, under the situation that the constant speed state begins to process, still can realize the focus function that is fit to quickening from the position of leaving substrate (1).
In the present invention, position-detection sensor (25) can be set in above-mentioned autofocus mechanism (7), it detects as the focusing position of above-mentioned Laser Processing with the position of the focusing direction of optical system (4), and the detection focusing position storing mechanism (36) of the output of the above-mentioned position-detection sensor of storage (25) is set in above-mentioned focus function controlling organization (32); Focusing position retentive control mechanism (37), this mechanism be in the closed condition of above-mentioned focus function, and above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism (36) with the above-mentioned focusing position of optical system (4).
By above-mentioned detection focusing position storing mechanism (36) and focusing position retentive control mechanism (37) are set, make the function of autofocus mechanism (7) additional storage holding position, thus, the difference of focus in the time of can reducing to start autofocus mechanism as much as possible in processing starting position (S).Thus, needn't adopt the high-performance autofocus mechanism, assembling scheme that can low price is realized high-grade line processing.
Also can be in the present invention, in above-mentioned focus function controlling organization (32), the preceding focusing position controlling organization (38) of beginning is set, the location of instruction of this mechanism's storage focusing position, the location of instruction of this focusing position is as the position of the above-mentioned Laser Processing that is positioned at above-mentioned processing starting position (S) with the focusing direction of optical system (4), arrive above-mentioned processing starting position (S) before in above-mentioned Laser Processing with optical system (4), with the above-mentioned Laser Processing location of instruction of the above-mentioned focusing position of optical system (4), keep this position as above-mentioned storage.
Occasion in this scheme, when starting above-mentioned focus function in the processing starting position of aforesaid substrate (1) (S), above-mentioned Laser Processing begins focus function with optical system (4) from the state that is positioned at the above-mentioned location of instruction, can reduce the difference of focus when processing starting position (S) starts automatic focus function as much as possible.
Focusing position controlling organization (38) is being provided with above-mentioned position-detection sensor (25), above-mentioned detection focusing position storing mechanism (36) occasion with above-mentioned focusing position retentive control mechanism (37) before the above-mentioned beginning, such as, be following scheme.
Promptly, the foreprocess gauge that focusing position controlling organization (38) carries out being formed by following action in above-mentioned machining control mechanism (31) before the above-mentioned beginning circulates, this action refers in above-mentioned relatively optical head relative moving mechanism (6), before the relatively moving of the optical head (5) of actual processing usefulness, above-mentioned optical head (5) is moved to processing starting position (S) on the substrate (1) from the home position of the end that breaks away from substrate (1), after moving, this turns back to above-mentioned home position, and the focusing position that will the above-mentioned position-detection sensor (25) when optical head (5) arrives processing starting position (S) in this foreprocess gauge circulation detects is stored in the above-mentioned detection focusing position storing mechanism (36), by above-mentioned focusing position retentive control mechanism (37) above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism (36) with the above-mentioned focusing position of optical system (4).In the occasion of this scheme, the focusing position of above-mentioned position-detection sensor (25) detection by optical head (5) in foreprocess gauge circulation during to processing starting position (S) is the location of instruction of above-mentioned focusing position.In addition, " optical head (5) arrives processing starting position (S) " refers to that Laser Processing arrives processing starting position (S) with optical system (4).
Reduce the control specific implementation of the difference of focus when processing starting position (S) but starting automatic focus function like this, as much as possible.
In addition, focusing position controlling organization (38) also can not necessarily carry out above-mentioned foreprocess gauge circulation before the above-mentioned beginning.Such as, also can not adopt above-mentioned position-detection sensor (25), import the location of instruction of above-mentioned automatic focusing position from suitable input mechanism, also can be the suitable value of determining.In addition, focusing position controlling organization (38) also can detect the circulation of this calibration console (29) in the occasion that calibration console described later (29) are set before the above-mentioned beginning.
In the present invention, focusing position retentive control mechanism (39) when finishing also can be set in above-mentioned focus function controlling organization (32), this mechanism (39) is in above-mentioned process finishing position (E) when closing focus function, the storage focusing position, this focusing position is the position that the focusing direction of optical system (4) is used in the above-mentioned Laser Processing of conduct when the switching that this is closed, and forms above-mentioned Laser Processing is closed focus function with the state that optical system (4) remains in the focusing position of having stored.
Such as, when a plurality of line arranged side by side of processing, in order to shorten process time, adopting and alternately making the machine direction of line is rightabout, shortens the time method that relatively moves that does not directly help the optical head (5) processed.In such occasion, because the distance from process finishing position (E) to next processing starting position (S) is small, if so remain in the focusing position of the Laser Processing of process finishing position (E) when closing focus function with optical system (4), the processing that beginning is next then can reduce in the difference of focus of processing starting position (S) when closing focus function.
In addition, above-mentioned when switching " close " when being not limited to close the moment of switching, its refer to comprise before this switching is during moment to after during.
Focusing position retentive control mechanism (39) is being provided with above-mentioned position-detection sensor (25), is detecting the occasion of focusing position storing mechanism (36) and focusing position retentive control mechanism (37) during above-mentioned end, such as, be following scheme.
Promptly, focusing position retentive control portion (39) is in above-mentioned process finishing position (E) when closing focus function during above-mentioned end, detect focusing position when the switching that this is closed by above-mentioned position-detection sensor (25), it is stored in the above-mentioned detection focusing position storing mechanism (36), above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism (36) with the above-mentioned focusing position of optical system (4) by above-mentioned focusing position retentive control mechanism (37).
Like this, remain in process finishing position (E) but the control specific implementation of focusing position when closing focus function.
In addition, focusing position retentive control mechanism (39) both can not necessarily adopt above-mentioned position-detection sensor (25), detect focusing position storing mechanism (36) etc. during end, also can such as, be process finishing position (E) when closing focus function, only the fixed laser processing focusing position of optical system (4).
In the present invention, Focusing mechanism also can be set position change mechanism (28) is set, this mechanism can make the above-mentioned relatively Laser Processing of above-mentioned autofocus mechanism (7) with optical system (4), in Laser Processing with optical system (4) and and the change installation site, front and back of column direction.
,, arrange the Laser Processing of end and throw off with optical system (4) in relative each Laser Processing with the autofocus mechanism (7) and the substrate (1) of optical system (4) according to the occasion that autofocus mechanism (7) all are set along the mode of equidirectional adjacency pair.In such occasion, by being set by above-mentioned Focusing mechanism, the position changes mechanism (28), change the installation site in the front and back of arranging, the situation of avoiding autofocus mechanism (7) and substrate to throw off.
In the present invention, in above-mentioned autofocus mechanism (7), detect above-mentioned Laser Processing with optical system (4) apart from the focusing of the machined surface of aforesaid substrate from the above-mentioned relatively Laser Processing of focusing sensor (23) with optical system (4) and establish, setting can be adjusted the also sensing station guiding mechanism (27) of column distance of this focusing sensor (23) and above-mentioned Laser Processing usefulness optical system (4).
If this sensing station guiding mechanism (27) is set, then the mode that can not coincide with according to the optical axis of the focusing sensor of autofocus mechanism (7) on the line processing line (La) is adjusted.
Also can the above-mentioned relatively Laser Processing of above-mentioned autofocus mechanism (7) be arranged at the front side of line machine direction (Laa) with optical system (4) in the present invention.
In addition, also can be in the present invention, Focusing mechanism is set the position is set changes mechanism (28B) automatically, its can be automatically with above-mentioned autofocus mechanism (7) the above-mentioned relatively Laser Processing in position is set with optical system (4), be altered to the front side and the rear side of line machine direction (Laa).
This Focusing mechanism is provided with the position and changes mechanism (28B) automatically and have the position and change control part (28Bb), its such as, according to can autofocus mechanism (7) being set around the mode that Laser Processing is rotated with the optical axis (O1) of optical system (4), according to drive source (28Ba) mode of its 180 ° of positive and negative rotations is constituted, the driving direction of control drive source (28Ba) by motor etc.This position change control part (28Bb) such as, instruction according to the moving direction of the mobile controlling organization (33) of the optical head relative moving mechanism (6) in the control above-mentioned machining control mechanism (31), identification line machine direction (Laa), control drive source (28Ba).This control is according to adding man-hour in line, at the front side of line machine direction (Laa) autofocus mechanism (7) is set, and Laser Processing is set at its rear is provided with the mode of optical system (4).
Autofocus mechanism (7) relatively Laser Processing be positioned at the occasion of the front side of line machine direction (Laa) with optical system (4), can on line processing line (La), detect by the autofocus sensor (23) by autofocus mechanism (7).Thus, since according to above-mentioned Laser Processing with optical system (4) and establish, the mode of the occasion of autofocus mechanism (7) is set, the detection position of the line processing line (La) of adjacency and focusing sensor (23) does not overlap, so needn't carry out the position adjustment according to the mode that overlaps with existing line processing line (La).
Because relative Laser Processing optical system (4), the place ahead at line machine direction (Laa) is provided with autofocus mechanism (7), so can detect the change in location of focusing direction in advance, the rich degree that can make the reactivity of following action of autofocus mechanism (7) have this amount.
Also can be in such scheme, can the position be set by Focusing mechanism and change mechanism (28B) automatically, automatically relative Laser Processing optical system (4), change the installation site of autofocus mechanism (7) in the front and back of line machine direction (Laa), but, at front and back two places of Laser Processing, autofocus mechanism (7) is set with optical system (4).
In this occasion, also can be provided with and select to use mechanism (28C), this mechanism is selected and the above-mentioned relatively Laser Processing of use optical system (4), be arranged at line machine direction (Laa) two places, front and back autofocus mechanism (7,7) inside, the machine direction (Laa) of ruling is arranged at the above-mentioned Laser Processing above-mentioned autofocus mechanism (7) with the place ahead of optical system (4) relatively.
Also can be in the present invention, above-mentioned autofocus mechanism (7) comprises position-detection sensor (25), this position-detection sensor (25) detects as the focusing position of above-mentioned Laser Processing with the position of the focusing direction of optical system (4), the calibration console (29) that setting is detected by this position-detection sensor (25), the height of the processing starting position (S) of the machined surface of height of this calibration console (29) and aforesaid substrate (1) is basic identical.
If above-mentioned calibration console (29) is set, then before processing, detect calibration console (29) by position-detection sensor (25), Laser Processing is remained in the position of this detection with optical system (4), thus, can reduce difference of focus when processing starting position (S) starts automatic focus function as much as possible.
Also can be in the present invention, the substrate (1) that is formed with above-mentioned film is a solar panel.In the occasion of solar panel,, require to reduce the width of ruling in order to improve the generating efficiency of solar cell.Thus, performance can realize the narrowing down of line width of the present invention and the effect that narrows down of scribe line pitch effectively.
Laser patterning method of the present invention is carried out the disjunction method for processing for adopting above-mentioned any described laser patterning device of the present invention to the rectangular shape of film that is formed on the substrate (1).According to this processing method, with describe at laser patterning device of the present invention identical, the narrowing down and the little spacingization of scribe line pitch of the width of can realizing ruling.
Another laser patterning method of the present invention is carried out the disjunction method for processing for adopting laser to the rectangular shape of film that is formed on the substrate (1), it is characterized in that:
Adopt the laser patterning device, this device has: substrate locking stage (3), and this substrate locking stage (3) is placed aforesaid substrate (1); Optical head (5), this optical head (5) is according to Laser Processing optical system (4) a plurality of and that established difference irradiating laser processing bundle; Optical head relative moving mechanism (6), above-mentioned optical head relative moving mechanism (6) make aforesaid substrate fixed station (3) and optical head (5) along perpendicular relatively the moving at two direction of principal axis on the machined surface of aforesaid substrate (1);
In above-mentioned optical head (5), use on the optical system (4) in above-mentioned each Laser Processing, has autofocus mechanism (7), this mechanism makes this Laser Processing consistent with the focal length of optical system (4) with above-mentioned Laser Processing with the distance between the machined surface of optical system (4) and aforesaid substrate (1), start the automatic focus function of this automatic focus function mechanism (7) in the processing starting position of aforesaid substrate (1) (S), finish this automatic focus function in the process finishing position of substrate (1) (E).
According to this method, the same with aforementioned laser patterning device of the present invention, the narrowing down and the little spacingization of scribe line pitch of the width of can realizing ruling.
Laser patterning device of the present invention relates to following device, wherein, adopts laser that the rectangular shape of film that is formed on the substrate is carried out disjunction processing, and this device comprises: substrate locking stage, and the aforesaid substrate fixed station is placed aforesaid substrate; Optical head, above-mentioned optical head is provided with the Laser Processing optical system of irradiating laser processing bundle respectively according to a plurality of modes arranged side by side; Optical head relative moving mechanism, above-mentioned optical head relative moving mechanism make aforesaid substrate fixed station and optical head along relatively moving on two the perpendicular direction of principal axis on the machined surface of aforesaid substrate; Machining control mechanism, above-mentioned machining control mechanism controls: by this optical head relative moving mechanism, the path that above-mentioned optical head is moved relative to aforesaid substrate, and on this path, carry out the beginning of irradiation of laser of above-mentioned optical head and the processing starting position and the process finishing position of the substrate that stops respectively, in above-mentioned optical head, has autofocus mechanism in above-mentioned each Laser Processing on optical system, this mechanism makes this Laser Processing consistent with the focal length of optical system with above-mentioned Laser Processing with the distance between the machined surface of optical system and aforesaid substrate, the focus function controlling organization is set, this mechanism starts the focus function of the automatic focus function of conduct of this autofocus mechanism in the processing starting position of aforesaid substrate, this focus function is finished in process finishing position at substrate, thus, loading by above-mentioned autofocus mechanism, can will keep certain state with the distance between the optical system at ordinary times, the processing of ruling as the surface and the Laser Processing of the substrate of processing object.Thus, the variation of the laser point in when line can be suppressed at less degree, can reduce the width of ruling, like this, also can make the little spacingization of scribe line pitch.In addition, in accelerating period to constant speed, be not present in the substrate of Laser Processing with formation processing object under the optical system, but, because as above-mentioned, start the focus function of autofocus mechanism in the processing starting position of aforesaid substrate, close this function in the process finishing position of substrate, so can realize automatic focus function.
Laser patterning method of the present invention with describe at laser patterning device of the present invention identical, the variation of the laser point in when line can be suppressed at less degree, can reduce to rule width, thus, also can make the little spacingization of scribe line pitch.In addition, owing to start the focus function of autofocus mechanism in the processing starting position of aforesaid substrate, finish this function in the process finishing position of substrate, so even quickening from the position left with substrate, under the situation that the constant speed state begins to process, still can realize the focus function that is fit to.
Description of drawings
Fig. 1 is the key diagram of the conception plans of the laser patterning device of expression one embodiment of the present of invention;
Fig. 2 (A), Fig. 2 (B) are respectively an example at the laser patterning apparatus main body of this laser patterning device, state and the stereogram that adds the state in man-hour when the expression substrate is sent into;
Fig. 3 is the stereogram of the relation of expression substrate and optical head;
Fig. 4 (A) is the stereogram of expression Laser Processing with an example of optical system and autofocus mechanism, and Fig. 4 (B) is the stereogram of the example of the installation position of this autofocus mechanism of expression change;
Fig. 5 is the key diagram of the relation of the expression translational speed and the line range of work;
Fig. 6 is the key diagram of initial focus difference;
Fig. 7 (A)～(C) is the key diagram of foreprocess gauge circulation;
Fig. 8 (A)～(D) is the key diagram of processing action;
Fig. 9 is processing camera lens and the key diagram of focusing with the optical aberration of camera lens;
Figure 10 is the key diagram of the calibration console of focusing;
Figure 11 (A), Figure 11 (B) are respectively another example at the laser patterning apparatus main body of this laser patterning device, state and the stereogram that adds the state in man-hour when the expression substrate is sent into;
Figure 12 (A), Figure 12 (B) are the key diagram of the relation of expression laser irradiation spacing and line processing line;
Figure 13 is the part amplification view of solar panel;
Figure 14 (A) is the stereogram of expression Laser Processing with another example of optical system and autofocus mechanism, Figure 14 (B) is provided with the key diagram that the position changes mechanism automatically for the stereogram of the example that the position is set of this autofocus mechanism of expression change, Figure 14 (C) for add Focusing mechanism in Figure 14 (A);
Figure 15 represents to adopt the optical head of example of Figure 14 and the relation of substrate, and Figure 15 (A) is the rule stereogram of occasion of processing of direction in the substrate right side of figure, and Figure 15 (B) is the rule stereogram of occasion of processing of direction in the substrate left side of figure;
Figure 16 is the stereogram of expression Laser Processing with the another example of optical system and autofocus mechanism.
The specific embodiment
According to Fig. 1～Fig. 9, a form of implementation of the present invention is described.This laser patterning device is following device, wherein, the film that is formed on the substrate 1 adopts the rectangular shape of laser that line (scribe) is processed, carry out disjunction processing thus, this device by as the drawing apparatus main body 2 of mechanical part, and the machining control device 30 that this drawing apparatus main body 2 is controlled constitute.
In Fig. 1, drawing apparatus main body 2 comprises: substrate locking stage 3, and aforesaid substrate fixed station 3 is placed substrate 1; Optical head 5, above-mentioned optical head 5 has also been established a plurality of Laser Processings optical system 4 of irradiating laser processing bundle respectively; Optical head relative moving mechanism 6, above-mentioned optical head relative moving mechanism 6 relatively move aforesaid substrate fixed station 3 and optical head 5 along going up in perpendicular two axial (X, Y directions) on the machined surface of aforesaid substrate 1.Autofocus mechanism 7 is set in each Laser Processing on optical system 4, so, autofocus mechanism 7 only according to Laser Processing with the identical quantity of optical system 4 and be provided with.
Fig. 2 represent to chart example of apparatus main body 2.In this example, substrate locking stage 3 is can be along the mobile Y-axis platform of fore-and-aft direction (Y direction), at the rail 9 upper substrate fixed stations 3 of base station 8 according to being provided with along the mobile mode of fore-and-aft direction (Y direction).Substrate locking stage 3 comprises mechanism's (not shown) of the fixing substrate of having sent into 1, by the advance and retreat driving mechanism (not shown) of Y-axis along the fore-and-aft direction driving of advancing and retreat.
Move the front portion of path at the substrate locking stage of rail 9, the substrate that is formed by roller conveyor etc. is set in its left and right sides sends into device 10 and substrate delivery device 11, this substrate is sent into the relative respectively substrate locking stage 3 with substrate delivery device 11 of device 10 and is carried out sending into and sending of substrate 1.
The rear portion of the path of substrate locking stage 3 processes on base station 8, the bearing support 12 of gate-type is set according to the mode across this path, along the rail 13 on this bearing support 12, according to can X-axis platform 14 being set along mode with left and right directions (X-direction) advance and retreat of the perpendicular direction of the advance and retreat direction of substrate locking stage 3.This X-axis platform 14 is advanced and retreat by the advance and retreat driving mechanism 15 that is arranged at the X-axis on the bearing support 12.
On X-axis platform 14, the Z pillow block 16 that loads optical head 5 is advanced and retreat by the advance and retreat driving mechanism (not shown) that is arranged at the Z axle on the X-axis platform 14 along as being arranged on the moving member with the vertical direction of the perpendicular direction of above-mentioned X-axis and Y-axis.The advance and retreat driving mechanism 15 of above-mentioned X-axis is made of servomotor and screw mechanism etc. respectively with the advance and retreat driving mechanism of Y-axis and the advance and retreat driving mechanism of Z axle.
In addition, drawing apparatus main body 2 makes substrate locking stage 3 move along fore-and-aft direction (Y direction) relative to base station 8 in the example of Fig. 2, still, also can such as, as shown in Figure 11, make the relative base station 8 in position of substrate locking stage 3 and fix.In this occasion, the bearing support 12A of above-mentioned gate-type is the Y-axis platform that moves before and after can be on the rail 9A on the base station 8, advances and retreat by the advance and retreat driving mechanism (not shown) of Y-axis.The structure of other in the example of Figure 11 is identical with the example of Fig. 2.
In Fig. 2, in optical head 5,, the Laser Processing optical system 4 of irradiating laser processing bundle respectively is set according to a plurality of modes arranged side by side as aforementioned, also column direction constitutes the left and right directions of being processed (X-direction) line and column direction, can carry out the processing of a plurality of line simultaneously.The laser oscillator 17 that produces laser beam both can be provided with optical system 4 at each Laser Processing, also the laser beam that produces by 1 laser oscillator 17 can be divided into a plurality ofly, distributed to each Laser Processing usefulness optical system 4.In occasion arbitrarily, the part of laser oscillator 17 and the light-guiding mechanism formation optical head 5 that the laser beam direction Laser Processing waited with the speculum 48 (Fig. 1) of optical system 4 from this laser oscillator 17.
In Fig. 4, autofocus mechanism 7 and Laser Processing are described with optical system 4.Laser Processing with optical system 4 by the processing of object lens etc. with camera lens 4a with laser beam direction processing this beam expander 4b as optics with camera lens 4a is constituted, by relative to beam expander 4b processing being moved with camera lens 4a, can carry out the adjustment of Laser Processing with the focal length of optical system 4 along far and near direction.In addition, in this specification, accompanying drawing, will comprise that the part of the shell of camera lens and built-in this camera lens is called processing camera lens 4a.
In the example of Fig. 4, the focusing that contiguous processing is provided with camera lens 4a is loaded on the lifting body 19 with camera lens 4a with processing with camera lens 18, via linear guide 21 lifting body 19 is supported on the optical system base station 20 in liftable mode.The linear actuator 22 that is formed by voice coil motor etc. that the lifting of lifting body 19 drives by being arranged on the optical system base station 20 carries out.Above-mentioned lens displacing mechanism 7a is made of this linear guide 21 and linear actuator 22.Optical system base station 20 is installed on the parts (not shown) of the frame that constitutes optical head 5 for being arranged at the base station on the Laser Processing usefulness optical system 4 separately.
Focusing with camera lens 18 above, focusing sensor 23 is arranged on the optical system base station 20, this focusing sensor 23, detects the focal length of distance processing object face with camera lens 18 via focusing.In the focusing of this focusing sensor 23 detects, such as, middlebrow Astigmatism methord adopted, by the mode of 4 quadrant photodiodes detection.Above-mentioned focusing automechanism 7b is made of with camera lens 18 and signal transduction system 24 focusing sensor 23, focusing, and this signal transduction system 24 is exported to linear actuator 22 by the output signal of focusing sensor 23 with action command.Signal transduction system 24 both can have the function of handling above-mentioned output signal, also can only transmit above-mentioned signal.Above-mentioned focusing automechanism 7b controls in the following manner, this mode is: corresponding to the output signal of focusing sensor 23, drive above-mentioned linear actuator 22, along vertical Z-direction, processing is moved on the end face as the machined surface of substrate 1 with camera lens 18 with camera lens 4a and focusing, at ordinary times, processing is focused with camera lens 4a.
On above-mentioned linear guide 21, the position-detection sensor 25 of loading linear staff etc. can carry out the detection of the position of the mobile side component in the linear guide 21.Thus, detect as the focusing position of processing with the lifting position of camera lens 4a.The above-mentioned signal transduction system 24 of above-mentioned focusing automechanism 7b has by the signal from the outside, the transmission of output signal of sensor 23 stops to focus, stop the function of automatic focus function, above-mentioned linear actuator 22 is stopping the state of automatic focus function, the control that can drive from the input system that is different from above-mentioned signal transduction system 24.At this moment, can adopt the detected value of above-mentioned position-detection sensor 25, in the detectable scope of position-detection sensor 25, make above-mentioned processing move to focusing position arbitrarily, or remain on this place with camera lens 4a.
Comprise that focusing sensor 23 and focusing are loaded into the left side of the Laser Processing of Fig. 4 (A) with the figure of optical system 4 with the autofocus mechanism 7 of camera lens 18, and as shown in Fig. 4 (B), on the right side of Laser Processing with the figure of optical system 4, the Focusing mechanism that setting can change the installation site is provided with position change mechanism 28.This Focusing mechanism is provided with the position and changes mechanism 28 and be made of following installed part, and this installed part is such as being arranged at beam expander 4b and the processing two sides with camera lens 4a, focusing sensor 23 and focusing is installed with camera lens 18 in mode removably respectively.The change of this installation site is according to following reason setting.Promptly, if as Fig. 4 (A), load autofocus mechanism 7 in the left side, then as shown in Figure 3, arrange the occasion of a plurality of Laser Processings with optical system 4, in the autofocus mechanism 7 of the leftmost side of X-direction, add man-hour in the line of the left end side of substrate 1, have the possibility of focusing sensor and substrate 1 disengaging.For this reason, the autofocus mechanism 7 of the left end of arrangement is installed autofocus mechanism 7 in processing with the right side of camera lens 4a as shown in Fig. 3, Fig. 4 (B), thus, avoids situation about breaking away from substrate 1.
In addition, as shown in Figure 9, Laser Processing departs from the optical axis O1 of optical system 4 and the optical axis O2 (the optical axis O2 of focus lens 18) of focusing sensor 23, but this deviation distance does not coincide with the mode of line on the processing line according to the optical axis O2 of focusing sensor 23 and can adjust by sensing station guiding mechanism 27.Its reason is: if the optical axis O2 of line processing line La and focusing sensor 23 overlaps, then because of having carried out the discrepancy in elevation of line processing, have the possibility that skew takes place focus.In sensing station guiding mechanism 27, such as, mutually by screwed part with on two parts 27a, the 27b that can adjust mode at interval and connect, Laser Processing is installed with optical system 4 and focusing sensor 23 respectively.
Figure 14 represents Laser Processing another example with the position relation of optical system 4 and autofocus mechanism 7.In this example, Laser Processing is loaded autofocus mechanism 7 with optical system 4 side by side along the direction identical with the direction of line processing line La relatively.This line processing line La is the line of processing line a (Fig. 1, Figure 15), and the method for carrying out of this processing is called line machine direction Laa.Autofocus mechanism 7 is line machine direction Laa relatively, is loaded into the front side of Laser Processing with optical system 4.Figure 14 (A) expression line machine direction Laa in figure right direction to the occasion of left near own side direction, Figure 14 (B) expression is opposite with Figure 14 (A) rule machine direction Laa from the left of figure near the occasion of own side direction to right interior direction.
In this example, autofocus mechanism 7 can be provided with the position by zoom mechanism and change the switching that the position is set that the 28B of mechanism automatically changes Figure 14 (A) and Figure 14 (B) automatically, and before changing line machine direction Laa the position being set can automatically change.That is, zoom mechanism is set the position is set changes the 28B of mechanism automatically, this mechanism with autofocus mechanism 7 be provided with the position automatically relatively Laser Processing change to front side and the rear side of line machine direction Laa with optical system 4.This zoom mechanism be provided with the position change automatically the 28B of mechanism such as, according to can the mode of autofocus mechanism 7 rotations being provided with around Laser Processing, according to the mode of 180 ° of positive and negative rotations constitutes by the drive source 28Ba of motor etc., the position with driving direction of control drive source 28Ba changes control part 28Bb.In illustrated embodiment, form following structures, wherein use on the lifting body 19 of camera lens 18 in the focusing that Laser Processing usefulness optical system 4 is set, according to centering on the mode of Laser Processing turntable 28Bc is set with the optical axis O1 rotation of optical system 4, autofocus mechanism 7 is loaded on this turntable 28Bc, rotates turntable 28Bc positive and negatively by drive source 28Ba.Above-mentioned position change control part 28Bb such as, be arranged on the focus function controlling organization 32 of above-mentioned machining control device 30, instruction according to the moving direction of the mobile controlling organization 33 of the machining control mechanism 31 of control optical head relative moving mechanism 6, identification line machine direction Laa, control drive source 28Ba.This control is carried out in the following manner, and this mode is: add man-hour in line, at the front side of line machine direction Laa autofocus mechanism 7 is set, Laser Processing is set with optical system 4 at its rear.In addition, in Figure 14, machining control device 30 is except the item that specifies, and is identical with the example of Fig. 1, simplifiedly diagram.
Figure 15 (A) expression is according to rule with the configuration relation of optical system 4 and autofocus mechanism 7 example of occasion of processing of the Laser Processing shown in Figure 14 (A), rule according to the configuration relation shown in Figure 14 (B) example of the occasion of processing of Figure 15 (B) expression.
Figure 16 represents the another example of Laser Processing with the configuration relation of optical system 4 and autofocus mechanism 7.In the present example, relative Laser Processing optical system 4, two places, front and back at line machine direction Laa are provided with autofocus mechanism 7.In addition, be provided with and select to use the 28C of mechanism, its selection and use relative Laser Processing with optical system 4, be arranged in the autofocus mechanism 7,7 at two places, front and back of line machine direction Laa, the machine direction Laa that rules relatively is arranged at the autofocus mechanism 7 of Laser Processing with the place ahead of optical system 4.This selection use the 28C of mechanism be arranged at such as, on the focus function controlling organization 32 of above-mentioned machining control device 30, carry out from the instruction of the moving direction of the mobile controlling organization 33 of control optical head relative moving mechanism 6, identification line machine direction Laa, the control of the autofocus mechanism 7 that selection is adopted.In addition, in Figure 16, machining control device 30 is except the item that specifies, and is identical with the example of Fig. 1, simplifiedly diagram.
In the mechanism that adopts this scheme and the occasion of the processing of ruling, select and adopt following autofocus mechanism 7, it is when the switching of line machine direction Laa, line machine direction Laa is positioned at Laser Processing the place ahead with optical system 4 relatively, thus, as hereinbefore, can tackle in two line machine direction Laa.
In addition, above-mentioned autofocus mechanism 7 exemplifies, and focusing obviously also can be the other mode that does not adopt non-Astigmatism methord with sensor 23.In addition, linear actuator 22 can not be a voice coil motor also, obviously also can be other mode.In addition, the mode of the position of detection of straight lines guide 21 also obviously can be the outer mode of linear staff.
In Fig. 1, machining control device 30 is the mechanism of the integral body of control laser patterning apparatus main body 2, has as the function of numerical controller and function as Programmable Logic Controller.In machining control device 30,, constitutes following machining control mechanism 31 and focus function controlling organization 32 by by the computer of personal computer etc. and the procedure (not shown) of in this computer, moving.Machining control mechanism 31 is made of mobile controlling organization 33 and laser output controlling organization 34.
Mobile controlling organization 33 is the instruction according to above-mentioned procedure, each drive source 6a, 6b, the 6c of driving mechanism of optical head relative moving mechanism 6 is exported the mechanism that path that optical head 5 is moved relative to substrate 1 and speed are controlled.The path that optical head 5 moves relative to substrate 1 comprise along be formed on the substrate 1 respectively rule a and make path in the line that optical head 5 relatively moves, path between the line that optical head 5 is relatively moved.Mobile controlling organization 33 has according to drive source 6a, the 6b, the position detector (not shown) on the 6c that are arranged at each or detects drive source 6a, 6b by each, 6c and the detected value of the position detector (not shown) of mobile position component, each axial relative position of detection optical 5, by the detected value of each position detector, carry out the function of FEEDBACK CONTROL.In addition, mobile controlling organization 33 is as its speed control mode, as shown in Figure 5, the line range of work that to process 1 line, or the distance that has affluence slightly in the front and back of this line range of work is as the constant speed scope, acceleration and deceleration scope in its both sides is carried out the certain trapezoidal control of acceleration (deceleration).
Laser output controlling organization 34 is the mechanism of the control of the switching of carrying out laser oscillator 17.The processing starting position S of the startup laser oscillator 17 in the relative position of laser output controlling organization 34 storing optical heads 5 and substrate 1, close the process finishing position E of laser oscillator 17.This processing starting position S and process finishing position E be the end of the line a that processes on substrate 1 and the position of the other end, determine by above-mentioned procedure etc.Optical head 5 is arranged in processing starting position S and process finishing position E this point and discerns by the output of the position detector that is used to control at mobile controlling organization 33.
Focus function controlling organization 32 is the mechanism of the automatic focus function 7 of control, it comprises focus function switching mechanism 35, detects focusing position storing mechanism 36 and focusing position retentive control mechanism 37, in addition, has focusing position retentive control mechanism 39 when focusing position controlling organization 38 is with end before beginning.
Focus function switching mechanism 35 has the focus function that starts the automatic focus function of conduct of autofocus mechanism 7 at the processing starting position of substrate 1 S, closes the function of this focus function at process finishing position E.Optical head 5 is arranged in processing starting position S and process finishing position E this point and discerns by the output of the position detector that is used to control at above-mentioned mobile controlling organization 33.
Detect focusing position storing mechanism 36 and be arranged at the mechanism of each Laser Processing with the detected value of the position-detection sensor 25 on the autofocus mechanism 7 of optical system 4 for storage.
Focusing position retentive control mechanism 37 is for will corresponding each Laser Processing remaining in the mechanism that is stored in the position in the detection focusing position storing mechanism 36 with the focusing position of optical system 4, make the above-mentioned linear actuator 22 of the action of focusing maintain halted state, thus, keep above-mentioned focusing position.Focusing position retentive control mechanism 37 can carry out this function in the closed condition of the focus function of focus function switching mechanism 35.
Focusing position controlling organization 38 be when the processing starting position of substrate 1 S startup focus function before the beginning, and the state that is positioned at the location of instruction with optical system 4 from Laser Processing begins the mechanism of focus function.Promptly, focusing position controlling organization 38 is positioned at the location of instruction of the Laser Processing of processing starting position S with the focusing position of optical system 4 for storage before the beginning, before Laser Processing arrives processing starting position S with optical system 4, with the Laser Processing location of instruction of the focusing position of optical system 4, keep the mechanism of this position as above-mentioned storage.
Focusing position controlling organization 38 specifically before the beginning, the foreprocess gauge of carrying out being formed by following action in machining control mechanism 31 circulates, this action refers to: in relative optical head relative moving mechanism 6, before the relatively moving of the optical head 5 of actual processing usefulness, as described in resembling in conjunction with Fig. 7 in the back, optical head 5 is moved to processing starting position S on the substrate 1 from the home position of the end that breaks away from substrate 1, after this moves, turn back to this home position.And, will be by in this foreprocess gauge circulation, the focusing position that above-mentioned position-detection sensor 25 when optical head 5 arrives processing starting position S detects is stored in as the above-mentioned location of instruction and detects in the focusing position storing mechanism 36, by focusing position retentive control mechanism 37, Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism 36 with the focusing position of optical system 4.
In addition, focusing position controlling organization 38 also can not necessarily carry out above-mentioned foreprocess gauge circulation before the beginning.Such as, both can be under the situation that does not adopt above-mentioned position sensor 25, import the location of instruction of above-mentioned focusing position from the input mechanism that is fit to, also can form the value of suitably determining.In addition, focusing position controlling organization 38 also can detect the circulation of this calibration console 29 in the occasion that calibration console 29 described later is set before the above-mentioned beginning.
Focusing position retentive control mechanism 39 is when being that above-mentioned process finishing position E closes focus function during end, above-mentioned Laser Processing when storing this switching of the closing focusing position of optical system 4, be in the state that Laser Processing is remained in the focusing position of having stored with optical system 4, then, allow focus function switching mechanism 35 close the mechanism of focus function.
Focusing position retentive control mechanism 39 is following structures specifically during end.Promptly, when being that process finishing position E closes focus function, detect focusing position when switching to this and closing by above-mentioned position-detection sensor 25, be stored in and detect in the focusing position storing mechanism 36, Laser Processing is remained in the position that is stored in the detection focusing position storing mechanism 36 with the focusing position of optical system 4 by above-mentioned focusing position retentive control mechanism 37.
In addition, focusing position retentive control mechanism 39 is for also can not necessarily adopting above-mentioned position-detection sensor 25, detecting focusing position storing mechanism 36 during end, such as, in the time of can being that also E place, process finishing position closes focus function, only fixed laser is processed the focusing position with optical system 4.
Effect to said structure describes below.In the present example, substrate 1 is described for the occasion of solar panel.In the device of the line processing of carrying out solar cell,, must in same substrate 1, carry out the processing of the line a more than 100 as shown in Figure 3.For this reason, according to can a plurality of modes of processing side by side loading a plurality of Laser Processings optical system 4.Owing to each Laser Processing with the focal length of optical system 4 at ordinary times relatively the surface of substrate 1 keep necessarily, so on corresponding optical system 4, the autofocus mechanism 7 that loading is described in conjunction with Fig. 4.
Line processing is as shown in Figure 12, reduce the coincidence part of laser range of exposures L as much as possible, process for the variation that reduces coincidence part, must be as shown in Figure 5,, substrate 1 is processed under the state of constant speed movement with the relatively moving of optical system 4 in relative Laser Processing.In addition, in order further to shorten the process time of ruling, in recent years, the translational speed that requires substrate 1 is the processing very at a high speed of 2000mm/s.
Autofocus mechanism 7 detects the surface location of the substrate 1 of the object that constitutes focusing, according to Laser Processing is moved with camera lens 4a with the whole or processing of optical system 4, will keep certain mode effect with the distance of substrate surface at ordinary times.But,,, necessarily require to have at least walk help distance (acceleration distance) in order to carry out Laser Processing at state with the 2000mm/s constant speed as above-mentioned.As shown in Figure 5, when walk help, the Laser Processing bundle is contacted with substrate surface.So substrate 1 reaches 2000mm/s, can only when arriving edge of substrate with optical system 4, Laser Processing make autofocus mechanism 7 motions.In this occasion, in the control of the switching of merely carrying out focus function in the past, as shown in Figure 6, arrive the moment of the end of substrate 1 with optical system 4 in Laser Processing, the occasion that difference of focus in the early stage is big, in order to follow this situation, focus in moment, necessarily require the autofocus mechanism of very high performance.If the focusing poor performance, then the focusing before spended time, tracking range shown in Figure 6 is elongated.Between this tracking range, form the processing of the state that does not have focusing, can't dwindle the line width.
In this form of implementation, in order to solve above-mentioned problem, in the driving mechanism of autofocus mechanism 7, be provided with and detect the position-detection sensor 25 of processing with the position of camera lens 4a, focusing position retentive control mechanism 37 is set, thus, processing can be remained in detected position with camera lens 4a.This focusing position retentive control mechanism 37 is set, and implements the application method of focusing automatically, even, still realize the processing of focusing from the end of substrate 1 by the low-down autofocus mechanism 7 of price.
In the laser patterning device of this form of implementation, in the end of substrate 1, with the mode that the difference of focus of optical system 4 diminishes, focus in the edge of substrate position in advance according to Laser Processing as processing starting position S, can remain on the state of this focusing position of maintenance.
Adopt Fig. 7 that the method for focusing is described.Fig. 7 (A) is the home position of optical head 5 of drawing device, according to 1 end is that the mode of constant speed begins to quicken from this position to substrate.In Fig. 7 (B),, carry out actual line processing from this position in the edge of substrate position.In this form of implementation, by the control of focusing position controlling organization 38 before the beginning of Fig. 1, be positioned at the mode flying optical head 5 of this edge of substrate position in advance with optical system 4 according to Laser Processing, once focus.The processing that constitutes focusing position is stored in the position of camera lens 4a detects in the focusing position storing mechanism 36, by the focusing position of focusing position retentive control mechanism 37 these storages of maintenance.Then, as Fig. 7 (C), turn back to the home position once more.
Line in reality adds man-hour, begins from the home position of Fig. 8 (A) to quicken, and is in the state that arrives process velocity before the substrate.Then, in the moment of the edge of substrate position (A position) that arrives Fig. 8 (B), start autofocus mechanism 7.With above-mentioned such, the state of focusing in the edge of substrate position keeps this autofocus mechanism 7, thus, does not almost have the focus deviation in advance, can carry out high-grade processing from the moment that focusing starts.
Then, the control of focusing position retentive control mechanism 39 in the moment that arrives as another edge of substrate (B position) of processing end, is closed focus function during end by Fig. 1.The focusing position of autofocus mechanism 7 that will be when the switching of closing is stored in and detects in the focusing position storing mechanism 36, by focusing position retentive control mechanism 37, remains on the focusing position of this location.Then, slow down, arrive the position of Fig. 8 (D), 1 time line machines.
For line processing, owing to, on substrate 1, must carry out hundreds of processing according to certain scribe line pitch as above-mentioned, thus carry out reciprocal processing, so that shorten process time.So quicken this position from Fig. 8 (D), begins processing from the B position.In this occasion, start focusing automatically in Laser Processing with the moment that optical system arrives the B position, process.Autofocus mechanism 7 is stored in the state that automatic focus function is closed in the B position as aforesaid, keeps this position, thus, move by the width of scribe line pitch, still along substrate, this displacement does not have big difference of focus for number mm, can process under the state of focusing at once.
Figure 10 represents an also form of implementation of the present invention.This form of implementation is at Fig. 1～above-mentioned form of implementation shown in Figure 9, to be arranged at the position of the end of leaving substrate 1 by the calibration console 29 that focusing sensor 23 is detected, the height of the processing starting position S of the apparent height of this calibration console 29 and edge of substrate is basic identical.
In the occasion of this form of implementation, focus by above-mentioned calibration console 29, keep this focusing position, when optical head 5 arrives edge of substrate, start the automatic focus function of autofocus mechanism 7.According to this mode, adding the difference of focus of man-hour when edge of substrate (Fig. 8, A position) starts focusing automatically in line can reduce according to the mode identical with method shown in Figure 7.In this occasion,, will laser optical system do not move to edge of substrate and focus as the method for Fig. 7.For this reason, fabrication cycles improves.
In addition, occasion in this form of implementation, focusing position controlling organization 38 carries out in focusing position retentive control mechanism 37 before the beginning of Fig. 1: focus at calibration console 29, the detected value of this focusing position is stored in the detection focusing position storing mechanism 36, focusing position is stored in the control of the position of this storage.The effect of the scheme of other of the form of implementation of Figure 10 is identical with the 1st form of implementation of describing in conjunction with Fig. 1 waits.
According to these forms of implementation, as above-mentioned, adopt the storage of the position of autofocus mechanism 7 to keep function, initially focus at edge of substrate, storage keeps focusing position when the automatic focusing of processing end is closed, start/close automatic focusing at processing starting position S and process finishing position E, thus, realize the high-quality processing of autofocus state at the substrate Zone Full.Like this, can keep laser beam in the surface of substrate 1 equably, the processing that narrows down of the width of can ruling can reduce width, thus, also can reduce scribe line pitch.
Claims (16)
1. laser patterning device, it adopts laser that the film that is formed on the substrate is carried out rectangular-shaped disjunction processing, it is characterized in that this device comprises:
Substrate locking stage, this substrate locking stage is placed aforesaid substrate; Optical head, this optical head and the Laser Processing optical system of having established a plurality of processing of irradiating laser respectively bundles; The optical head relative moving mechanism, this optical head relative moving mechanism relatively moves aforesaid substrate fixed station and optical head, and moving direction is along two the perpendicular direction of principal axis on the machined surface of aforesaid substrate; Machining control mechanism, above-mentioned machining control mechanism controls: the path that above-mentioned optical head is moved by this optical head relative moving mechanism relative to aforesaid substrate, and on this path, carry out the beginning of irradiation of the laser that above-mentioned optical head takes place and the processing starting position and the process finishing position of the substrate that stops respectively
In above-mentioned optical head, has autofocus mechanism in above-mentioned each Laser Processing on optical system, this mechanism makes this Laser Processing consistent with the focal length of optical system with above-mentioned Laser Processing with the distance between the machined surface of optical system and aforesaid substrate, the focus function controlling organization is set, this mechanism starts the focus function of the automatic focus function of conduct of this autofocus mechanism in the processing starting position of aforesaid substrate, finish this focus function in the process finishing position of substrate.
2. laser patterning device according to claim 1, it is characterized in that in above-mentioned autofocus mechanism, position-detection sensor being set, it detects as the focusing position of above-mentioned Laser Processing with the position of the focusing direction of optical system, and the detection focusing position storing mechanism of the output of the above-mentioned position-detection sensor of storage is set in above-mentioned focus function controlling organization; Focusing position retentive control mechanism, this mechanism be in the closed condition of above-mentioned focus function, and above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism with the above-mentioned focusing position of optical system.
3. laser patterning device according to claim 1, it is characterized in that in above-mentioned focus function controlling organization, being provided with the preceding focusing position controlling organization of beginning, the location of instruction of this mechanism's storage focusing position, the location of instruction of this focusing position is to be positioned at the position of the above-mentioned Laser Processing of above-mentioned processing starting position with the focusing direction of optical system, above-mentioned Laser Processing arrives above-mentioned processing starting position with optical system before, with the above-mentioned Laser Processing location of instruction of the above-mentioned focusing position of optical system as above-mentioned storage, keep this position, when the processing starting position of aforesaid substrate started above-mentioned focus function, above-mentioned Laser Processing began focus function with optical system from the state that is positioned at the above-mentioned location of instruction.
4. laser patterning device according to claim 3, it is characterized in that, in above-mentioned autofocus mechanism, be provided with and detect the position-detection sensor of above-mentioned Laser Processing with the above-mentioned focusing position of optical system, in above-mentioned focus function controlling organization, be provided with: the detection focusing position storing mechanism of storing the output of above-mentioned position-detection sensor; Focusing position retentive control mechanism, this mechanism be in the closed condition of above-mentioned focus function, and above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism with the above-mentioned focusing position of optical system;
The foreprocess gauge that the focusing position controlling organization carries out being formed by following action in above-mentioned machining control mechanism before the above-mentioned beginning circulates, this action refers in above-mentioned relatively optical head relative moving mechanism, before the relatively moving of the optical head of the processing usefulness of reality, above-mentioned optical head is moved to processing starting position on the substrate from the home position of the end that breaks away from substrate, after moving, this turns back to above-mentioned home position, and will be by in this foreprocess gauge circulation, the focusing position that above-mentioned position-detection sensor when optical head arrives the processing starting position detects is stored in the above-mentioned detection focusing position storing mechanism, by above-mentioned focusing position retentive control mechanism, above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism with the above-mentioned focusing position of optical system.
5. laser patterning device according to claim 1, it is characterized in that, focusing position retentive control mechanism when finishing is set in above-mentioned focus function controlling organization, when this mechanism closes focus function in above-mentioned process finishing position, the above-mentioned Laser Processing of the conduct of storage when switching that this is closed is with the focusing position of the position of the focusing direction of optical system, as above-mentioned Laser Processing is remained in the state of the focusing position of having stored with optical system, close focus function.
6. laser patterning device according to claim 5, it is characterized in that, in above-mentioned autofocus mechanism, be provided with and detect the position-detection sensor of above-mentioned Laser Processing, the detection focusing position storing mechanism of the output of the above-mentioned position-detection sensor of storage is set in above-mentioned focus function controlling organization with the above-mentioned focusing position of optical system; Focusing position retentive control mechanism, this mechanism be in the closed condition of above-mentioned focus function, and above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism with the above-mentioned focusing position of optical system;
When focusing position retentive control portion closes focus function in above-mentioned process finishing position during above-mentioned end, detect this by above-mentioned position-detection sensor and close preceding focusing position, it is stored in the above-mentioned detection focusing position storing mechanism, above-mentioned Laser Processing is remained in the position that is stored in the above-mentioned detection focusing position storing mechanism with the above-mentioned focusing position of optical system by above-mentioned focusing position retentive control mechanism.
7. laser patterning device according to claim 1, it is characterized in that, Focusing mechanism is set the position is set changes mechanism, this mechanism can make the above-mentioned relatively Laser Processing optical system of above-mentioned autofocus mechanism, can change the installation site in Laser Processing with the front and back of optical system and direction.
8. laser patterning device according to claim 1, it is characterized in that, in above-mentioned autofocus mechanism, detect above-mentioned Laser Processing with optical system apart from the above-mentioned relatively Laser Processing of the focusing sensor of the focal length of the machined surface of aforesaid substrate with optical system and establish, setting can be adjusted the also sensing station guiding mechanism of column distance of this focusing sensor and above-mentioned processing usefulness optical system.
9. laser patterning device according to claim 1 is characterized in that, the above-mentioned relatively Laser Processing of above-mentioned autofocus mechanism is arranged at the front side of line machine direction with optical system.
10. laser patterning device according to claim 1, it is characterized in that, Focusing mechanism is set the position is set changes mechanism automatically, its can with above-mentioned autofocus mechanism the above-mentioned relatively Laser Processing optical system in position is set, change to the front side and the rear side of line machine direction.
11. laser patterning device according to claim 1 is characterized in that, with the above-mentioned relatively Laser Processing optical system of above-mentioned autofocus mechanism, is arranged at two places, front and back of line machine direction.
12. laser patterning device according to claim 11, it is characterized in that, be provided with and select to use mechanism, this mechanism selects and uses above-mentioned autofocus mechanism, its above-mentioned relatively Laser Processing is arranged at the inside of autofocus mechanism at two places, front and back of line machine direction with optical system, and the machine direction of ruling relatively is arranged at above-mentioned Laser Processing the place ahead with optical system.
13. laser patterning device according to claim 1, it is characterized in that, above-mentioned autofocus mechanism comprises position-detection sensor, this position-detection sensor detects as the focusing position of above-mentioned Laser Processing with the position of the focusing direction of optical system, the calibration console that setting is detected by this position-detection sensor, the height of the processing starting position of the height of this calibration console and the machined surface of aforesaid substrate is basic identical.
14. laser patterning device according to claim 1 is characterized in that, the substrate that is formed with above-mentioned film is a solar panel.
15. a laser patterning method, it adopts any one the described laser patterning device in the claim 1～14, and the disjunction of carrying out that is formed at the rectangular shape of film on the substrate is processed.
16. a laser patterning method, it adopts laser, and the disjunction of carrying out that is formed at the rectangular shape of film on the substrate is processed, it is characterized in that,
Adopt the laser patterning device, this device has the substrate locking stage of placing aforesaid substrate; Optical head, wherein, according to Laser Processing optical system a plurality of and that established difference irradiating laser processing bundle; The optical head relative moving mechanism, it makes aforesaid substrate fixed station and optical head relatively move along two the perpendicular direction of principal axis on the machined surface of aforesaid substrate;
In above-mentioned optical head, has autofocus mechanism in above-mentioned each Laser Processing on optical system, this mechanism makes this Laser Processing consistent with the focal length of optical system with above-mentioned Laser Processing with the distance between the machined surface of optical system and aforesaid substrate, start the automatic focus function of this autofocus mechanism in the processing starting position of aforesaid substrate, finish this automatic focus function in the process finishing position of substrate.
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| JP2011-112229 | 2011-05-19 | ||
| JP2011112229A JP2012006077A (en) | 2010-05-26 | 2011-05-19 | Laser patterning device and laser patterning method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103847244A (en) * | 2012-11-30 | 2014-06-11 | Lts有限公司 | Method for controlling platform rack of patterned equipment by utilizing lasers |
| CN107180892A (en) * | 2017-04-20 | 2017-09-19 | 北京四方创能光电科技有限公司 | A kind of copper-indium-galliun-selenium film solar cell metal electrode process for exposing |
| CN112584961A (en) * | 2018-08-08 | 2021-03-30 | 罗杰斯德国有限公司 | Method for processing a cermet substrate, installation for carrying out the method and cermet substrate produced by means of the method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103847244A (en) * | 2012-11-30 | 2014-06-11 | Lts有限公司 | Method for controlling platform rack of patterned equipment by utilizing lasers |
| CN103847244B (en) * | 2012-11-30 | 2016-01-27 | Lts有限公司 | For controlling the method for the stand of laser patterning equipment |
| CN107180892A (en) * | 2017-04-20 | 2017-09-19 | 北京四方创能光电科技有限公司 | A kind of copper-indium-galliun-selenium film solar cell metal electrode process for exposing |
| CN107180892B (en) * | 2017-04-20 | 2019-07-23 | 北京四方创能光电科技有限公司 | A kind of copper-indium-galliun-selenium film solar cell metal electrode process for exposing |
| CN112584961A (en) * | 2018-08-08 | 2021-03-30 | 罗杰斯德国有限公司 | Method for processing a cermet substrate, installation for carrying out the method and cermet substrate produced by means of the method |
| CN112584961B (en) * | 2018-08-08 | 2023-02-10 | 罗杰斯德国有限公司 | Method for processing a cermet substrate, installation for carrying out the method and cermet substrate produced by means of the method |
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