JPH06297175A - Gap sensor for laser beam machine - Google Patents

Gap sensor for laser beam machine

Info

Publication number
JPH06297175A
JPH06297175A JP5113611A JP11361193A JPH06297175A JP H06297175 A JPH06297175 A JP H06297175A JP 5113611 A JP5113611 A JP 5113611A JP 11361193 A JP11361193 A JP 11361193A JP H06297175 A JPH06297175 A JP H06297175A
Authority
JP
Japan
Prior art keywords
laser beam
distance
processing
measuring
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5113611A
Other languages
Japanese (ja)
Inventor
Tetsuo Kiyofuji
哲生 清藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP5113611A priority Critical patent/JPH06297175A/en
Publication of JPH06297175A publication Critical patent/JPH06297175A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • B23K26/048Automatically focusing the laser beam by controlling the distance between laser head and workpiece

Abstract

PURPOSE:To make a distance measurement position and a work position on a surface to be worked almost matching and to continuously control the gap of a laser beam working head with high accuracy. CONSTITUTION:A gap sensor for a laser beam machine, which is used for measuring an interval between a surface to be worked and a working head, arranged adjacent to the working head 1 from which a laser beam L1 for working radiates to the surface to be worked, provided so that it is relatively attachable and detachable to a surface to be worked 6, is provided. A laser beam irradiating device 4 for measuring a distance, from which a laser beam L2 for measuring a distance irradiates with a prescribed angle near a position to be irradiated by a laser beam for working on the surface to be worked, and a light receiving device 5 receiving a reflected light of a laser beam for measuring a distance from the surface to be worked, are provided. The wave length of the laser beam for measuring a distance, is made different from that of the laser beam for working. The light receiving device is equipped with a transmission wave length select filter 7 having a characteristic selectively transmitting only a laser beam for measuring a distance. Consequently, a measurable range is enlarged, and accuracy is improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば連続鋳造ロール
や圧延ロール等に用いる円筒状回転体の表面に微細な凹
凸や孔を形成するためのレーザ加工装置に於て、被加工
面とレーザ加工ヘッドとの間隔を測定するためのギャッ
プセンサに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for forming fine irregularities or holes on the surface of a cylindrical rotating body used for, for example, continuous casting rolls, rolling rolls, etc. The present invention relates to a gap sensor for measuring a distance from a processing head.

【0002】[0002]

【従来の技術】レーザ光により、円筒体の表面に微細な
凹凸を形成したり、微細な孔を穿ったりする技術が、既
に実用化されている(特開平2−11285号公報、特
開昭55−94790号公報など参照)。このようなレ
ーザ加工装置に於ける加工精度は、レーザ光の焦点距離
の精度に依存するので、集光レンズと被加工面との間隔
を、加工作業中は常に所定の範囲内に保つ必要がある。
2. Description of the Related Art A technique for forming fine irregularities on a surface of a cylindrical body or forming fine holes with a laser beam has already been put into practical use (Japanese Patent Laid-Open No. 11285/1990 and Japanese Patent Laid-Open No. 11285/1985). 55-94790, etc.). Since the processing accuracy in such a laser processing apparatus depends on the accuracy of the focal length of the laser light, it is necessary to always keep the distance between the condenser lens and the surface to be processed within a predetermined range during the processing operation. is there.

【0003】集光レンズと被加工面との間隔を一定に保
つ手法としては、集光レンズを内蔵した加工ヘッドに隣
接する位置に、例えば渦電流式の近接センサを設け、こ
の近接センサの出力に基づいてフィードバック制御を行
うことにより、加工ヘッドの被加工面に対するギャップ
制御を行うようにしたものが知られている。
As a method for keeping the distance between the condenser lens and the surface to be processed constant, for example, an eddy current type proximity sensor is provided at a position adjacent to the machining head having the condenser lens built therein, and the output of this proximity sensor is provided. It is known that the feedback control is performed based on the above to perform gap control with respect to the surface to be processed of the processing head.

【0004】[0004]

【発明が解決しようとする課題】しかるに、上記形式の
ギャップセンサを加工ヘッドと同一位置に設けることは
実質的に不可能であることから、ギャップ測定が行われ
るポイントと実際に加工が行われるポイントとの間にず
れが生じてしまうため、あるいは、ギャップセンサの感
度特性に基因してセンサの感応部を被測定面に正対させ
ないと所要の信号を得ることができないことから、被測
定面に対向するセンサの感応部の面積が不十分になるロ
ールの軸方向端部や比較的小さな曲率の曲面などに於て
は、加工ヘッドと被加工面とのギャップ測定精度が低下
するため、所期の加工精度が得られなくなる領域が生じ
ることを余儀なくされていた。
However, since it is virtually impossible to provide the gap sensor of the above-mentioned type at the same position as the machining head, the point at which the gap measurement is performed and the point at which the machining is actually performed. Between the sensor and the sensor, or because the sensitive part of the sensor does not face the surface to be measured due to the sensitivity characteristics of the gap sensor, the required signal cannot be obtained. The accuracy of the gap measurement between the machining head and the surface to be machined is reduced at the end of the roll in the axial direction where the area of the sensitive area of the sensor is insufficient, or on a curved surface with a relatively small curvature. However, there was an unavoidable need for a region in which the processing accuracy of (1) could not be obtained.

【0005】他方、特開昭61−105416号には、
距離測定用レーザ光のスポットを対象面に照射し、散乱
光の中心位置を位置検出素子上に求めることにより、距
離を測定する方法が提案されている。しかしながらこの
方法は、加工用レーザ光や加工面から発せられる光の影
響を受けると距離測定が不可能となる。そこで実際に
は、加工用レーザ光のパルス間で距離計測を行うものと
している。ところが、このようにすると、距離の計測は
可能となるが、被加工面上の距離測定位置が離散的とな
るために連続的な形状変化が検出できなかったり、加工
用レーザパルスの周波数を高くできないという問題が生
じる。
On the other hand, Japanese Patent Laid-Open No. 61-105416 discloses that
A method has been proposed in which a distance is measured by irradiating a target surface with a spot of distance measuring laser light and determining the center position of scattered light on a position detection element. However, this method cannot measure the distance under the influence of the laser light for processing and the light emitted from the processing surface. Therefore, in practice, the distance is measured between the pulses of the processing laser light. However, this makes it possible to measure the distance, but since the distance measurement positions on the surface to be processed are discrete, continuous shape changes cannot be detected, or the frequency of the laser pulse for processing is increased. The problem arises that you can't.

【0006】本発明は、このような従来技術の不都合を
解消すべく案出されたものであり、その主な目的は、被
加工面上の距離測定位置と加工位置とを概ね等しくし、
レーザ加工ヘッドのギャップ制御が連続的にかつ高精度
に制御可能となるように改良されたレーザ加工装置用ギ
ャップセンサを提供することにある。
The present invention has been devised in order to eliminate such disadvantages of the prior art, and its main purpose is to make the distance measuring position and the processing position on the surface to be processed substantially equal,
An object of the present invention is to provide a gap sensor for a laser processing apparatus, which is improved so that the gap control of a laser processing head can be controlled continuously and with high accuracy.

【0007】[0007]

【課題を解決するための手段】このような目的は、本発
明によれば、被加工面と相対接離可能なように設けられ
て前記被加工面に対して加工用レーザ光を照射する加工
ヘッドに隣接配置され、前記被加工面と前記加工ヘッド
との間隔を測定するためのレーザ加工装置用ギャップセ
ンサの構成を、前記被加工面に於ける前記加工用レーザ
の照射位置近傍に所定角度をもって距離測定用レーザ光
を照射する距離測定用レーザ照射装置及び前記距離測定
用レーザ光の被加工面からの反射光を受感する受光装置
を有すると共に、前記距離測定用レーザ光の波長を前記
加工用レーザ光の波長と異なるものとし、かつ前記距離
測定用レーザのみを選択的に透過させる特性を有する透
過波長選択フィルタを前記受光装置に設けるものとする
ことによって達成される。
According to the present invention, such a purpose is to provide a processing laser which is provided so as to be able to come into contact with and separate from a surface to be processed, and irradiates the processing surface with a laser beam for processing. A gap sensor for a laser processing device, which is arranged adjacent to the head and measures the distance between the surface to be processed and the processing head, is provided with a predetermined angle near the irradiation position of the processing laser on the surface to be processed. With a distance measuring laser irradiation device for irradiating a distance measuring laser light and a light receiving device for sensing reflected light from the surface to be processed of the distance measuring laser light, the wavelength of the distance measuring laser light is Achieved by providing the light receiving device with a transmission wavelength selection filter having a characteristic different from the wavelength of the processing laser beam and having a characteristic of selectively transmitting only the distance measuring laser. It is.

【0008】[0008]

【作用】このような構成によれば、加工用レーザ光と距
離測定用レーザ光とを概ね同一のポイントに照射できる
ので、ギャップ測定位置と加工位置との間のずれを実質
的に無視し得る程度のものとすることができる。これに
加えて、レーザ光の光点をもってギャップ測定が行える
ことから測定面の面積が微小で済むため、測定可能領域
が拡大される。
According to this structure, the processing laser beam and the distance measuring laser beam can be applied to substantially the same point, so that the deviation between the gap measuring position and the processing position can be substantially ignored. It can be of a degree. In addition to this, since the gap measurement can be performed using the light spot of the laser light, the area of the measurement surface can be small, and the measurable region is expanded.

【0009】[0009]

【実施例】以下に添付の図面に示された具体的な実施例
に基づいて本発明の構成を詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described in detail below with reference to specific embodiments shown in the accompanying drawings.

【0010】図1は、本発明に基づき構成されたレーザ
加工装置用加工ヘッド1を示している。この加工ヘッド
1のレーザ照射ノズル2は、円錐形の内面を有し、その
内側に集光レンズ3が固定されている。
FIG. 1 shows a processing head 1 for a laser processing apparatus constructed according to the present invention. The laser irradiation nozzle 2 of the processing head 1 has a conical inner surface, and the condenser lens 3 is fixed inside the inner surface.

【0011】加工ヘッド1の側面には、距離測定用レー
ザ照射器4が一側に、その反射光を受感する受光器5が
他側に、それぞれ固定されている。
A distance measuring laser irradiator 4 is fixed to one side of the processing head 1, and a light receiver 5 for sensing the reflected light thereof is fixed to the other side.

【0012】この距離測定装置を含む加工ヘッド1のユ
ニットは、図示されていない例えばパルスモータを用い
た駆動装置にて駆動される位置調節テーブルに搭載され
ており、所定の設定ギャップ値と距離測定信号とを比較
演算することにより、被加工面6に対する適正ギャップ
を一定に保持するように制御される。
A unit of the processing head 1 including this distance measuring device is mounted on a position adjusting table driven by a driving device (not shown) using a pulse motor, for example, and measures a predetermined set gap value and distance. By performing a comparison calculation with the signal, it is controlled so that the proper gap with respect to the surface 6 to be processed is kept constant.

【0013】例えばYAGレーザ発振器から放射される
加工用レーザ光L1は、被加工面6に対して直角の光軸
をもって照射される。また距離測定用レーザ照射器4に
内蔵された例えば半導体レーザ発振器から放射される測
定用レーザ光L2は、投光レンズで細く絞られて被加工
面6に対して所定角度αをもって照射される。そして被
加工面6からの反射光は、受光器5に内蔵された結像レ
ンズで集光されて一次元センサに結像する。この一次元
センサ上の光像の位置から被加工面6の位置が判別され
る。
For example, the processing laser beam L1 emitted from the YAG laser oscillator is emitted with an optical axis perpendicular to the surface 6 to be processed. Further, the measuring laser light L2 emitted from, for example, a semiconductor laser oscillator built in the distance measuring laser irradiator 4 is narrowed down by a light projecting lens and is irradiated onto the surface 6 to be processed at a predetermined angle α. Then, the reflected light from the surface 6 to be processed is condensed by the imaging lens built in the light receiver 5 and forms an image on the one-dimensional sensor. The position of the work surface 6 is determined from the position of the optical image on the one-dimensional sensor.

【0014】ここで加工用レーザ光L1の反射成分が受
光器5に入射すると、距離測定に悪影響が及ぶので、加
工用レーザ光L1と距離測定用レーザ光L2との波長を
互いに異なるものとすると共に、距離測定用レーザ光L
2の波長は透過するが、加工用レーザ光L1の波長は透
過しない選択特性を有する透過波長選択フィルタ7を受
光器5に設けることにより、加工用レーザ光L1の反射
成分が距離測定に影響しないようにしてある。
If the reflected component of the processing laser beam L1 is incident on the light receiver 5, the distance measurement is adversely affected. Therefore, the wavelengths of the processing laser beam L1 and the distance measurement laser beam L2 are different from each other. Together with laser light L for distance measurement
By providing the light receiving device 5 with the transmission wavelength selection filter 7 having the selection characteristic that the wavelength of 2 is transmitted but the wavelength of the processing laser beam L1 is not transmitted, the reflection component of the processing laser beam L1 does not affect the distance measurement. Is done.

【0015】なお、加工用レーザ光L1と距離測定用レ
ーザ光L2とをそれぞれ適宜な周波数のパルスビームに
て被加工面6に照射し、両者の間に位相差を設けること
によっても加工用レーザ光L1の反射成分が距離測定に
影響しないようにすることができる。
The processing laser beam L1 and the distance measurement laser beam L2 are irradiated onto the surface 6 to be processed with a pulse beam having an appropriate frequency, and a phase difference is provided between the two. It is possible to prevent the reflected component of the light L1 from affecting the distance measurement.

【0016】[0016]

【発明の効果】このように本発明によれば、被加工面上
の距離測定位置と加工位置とを概ね等しくすることがで
き、しかも微小な光点をもって距離測定が行えるので、
レーザ加工ヘッドの定ギャップ制御をリアルタイムで実
行することが可能となる。従って、面倒な補正制御など
を必要とせずに、被加工物の全域に渡る高精度なレーザ
加工を施すことが可能となる。
As described above, according to the present invention, the distance measuring position and the processing position on the surface to be processed can be made substantially equal, and the distance can be measured with a minute light spot.
The constant gap control of the laser processing head can be executed in real time. Therefore, it is possible to perform highly accurate laser processing over the entire area of the workpiece without requiring complicated correction control.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のレーザ加工ヘッドの第1実施例を示す
模式的な断面図。
FIG. 1 is a schematic sectional view showing a first embodiment of a laser processing head of the present invention.

【符号の説明】[Explanation of symbols]

1 加工ヘッド 2 ノズル 3 集光レンズ 4 距離測定用レーザ照射器 5 受光器 6 被加工面 7 透過波長選択フィルタ L1 加工用レーザ光 L2 測定用レーザ光 1 Processing Head 2 Nozzle 3 Condenser Lens 4 Distance Measuring Laser Irradiator 5 Light Receiver 6 Worked Surface 7 Transmission Wavelength Selection Filter L1 Processing Laser Light L2 Measurement Laser Light

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 被加工面と相対接離可能なように設けら
れて前記被加工面に対して加工用レーザ光を照射する加
工ヘッドに隣接配置され、前記被加工面と前記加工ヘッ
ドとの間隔を測定するためのレーザ加工装置用ギャップ
センサであって、 前記被加工面に於ける前記加工用レーザ光の照射位置近
傍に所定角度をもって距離測定用レーザ光を照射する距
離測定用レーザ照射装置及び前記距離測定用レーザ光の
被加工面からの反射光を受感する受光装置を有すると共
に、 前記距離測定用レーザ光の波長が前記加工用レーザ光の
波長と異なるものとされ、かつ前記距離測定用レーザ光
のみを選択的に透過させる特性を有する透過波長選択フ
ィルタが前記受光装置に設けられることを特徴とするレ
ーザ加工装置用ギャップセンサ。
1. A processing head, which is provided so as to be able to come into contact with and separate from a surface to be processed and which irradiates a laser beam for processing onto the surface to be processed, and is arranged between the surface to be processed and the processing head. A laser processing device gap sensor for measuring an interval, the distance measuring laser irradiation device irradiating a distance measuring laser beam at a predetermined angle in the vicinity of an irradiation position of the processing laser beam on the surface to be processed. And having a light receiving device for sensing the reflected light from the surface of the distance measurement laser light to be processed, the wavelength of the distance measurement laser light is different from the wavelength of the processing laser light, and the distance A gap sensor for a laser processing apparatus, wherein a transmission wavelength selection filter having a characteristic of selectively transmitting only a measurement laser beam is provided in the light receiving device.
JP5113611A 1993-04-15 1993-04-15 Gap sensor for laser beam machine Withdrawn JPH06297175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5113611A JPH06297175A (en) 1993-04-15 1993-04-15 Gap sensor for laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5113611A JPH06297175A (en) 1993-04-15 1993-04-15 Gap sensor for laser beam machine

Publications (1)

Publication Number Publication Date
JPH06297175A true JPH06297175A (en) 1994-10-25

Family

ID=14616612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5113611A Withdrawn JPH06297175A (en) 1993-04-15 1993-04-15 Gap sensor for laser beam machine

Country Status (1)

Country Link
JP (1) JPH06297175A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7281319B1 (en) * 2004-04-30 2007-10-16 Daniel Allford Apparatus for manufacturing wire wound filter screens
KR20110010693A (en) * 2008-03-28 2011-02-07 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Autofocus method and apparatus for wafer scribing
CN107427959A (en) * 2015-03-03 2017-12-01 通快激光与系统工程有限公司 Initial spacing for Laser Processing occupies
CN112276339A (en) * 2020-10-19 2021-01-29 温州大学 Intelligent conformal laser scanning machining method and device for curved surface workpiece

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7281319B1 (en) * 2004-04-30 2007-10-16 Daniel Allford Apparatus for manufacturing wire wound filter screens
KR20110010693A (en) * 2008-03-28 2011-02-07 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Autofocus method and apparatus for wafer scribing
JP2011517428A (en) * 2008-03-28 2011-06-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Autofocus method and apparatus for wafer scribe
TWI447468B (en) * 2008-03-28 2014-08-01 Electro Scient Ind Inc Autofocus method and apparatus for wafer scribing
CN107427959A (en) * 2015-03-03 2017-12-01 通快激光与系统工程有限公司 Initial spacing for Laser Processing occupies
US10843292B2 (en) 2015-03-03 2020-11-24 Trumpf Laser- Und Systemtechnik Gmbh Initial distance approach for laser processing
CN112276339A (en) * 2020-10-19 2021-01-29 温州大学 Intelligent conformal laser scanning machining method and device for curved surface workpiece
CN112276339B (en) * 2020-10-19 2022-02-15 温州大学 Intelligent conformal laser scanning machining method and device for curved surface workpiece

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20000704