TW200951446A - Probe unit - Google Patents

Probe unit

Info

Publication number
TW200951446A
TW200951446A TW098103566A TW98103566A TW200951446A TW 200951446 A TW200951446 A TW 200951446A TW 098103566 A TW098103566 A TW 098103566A TW 98103566 A TW98103566 A TW 98103566A TW 200951446 A TW200951446 A TW 200951446A
Authority
TW
Taiwan
Prior art keywords
movable base
probe unit
move
guided
elastic deformation
Prior art date
Application number
TW098103566A
Other languages
English (en)
Chinese (zh)
Inventor
Ryo Ujike
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Publication of TW200951446A publication Critical patent/TW200951446A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Measuring Leads Or Probes (AREA)
  • Liquid Crystal (AREA)
  • Tests Of Electronic Circuits (AREA)
TW098103566A 2008-02-05 2009-02-04 Probe unit TW200951446A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008025048A JP2009186262A (ja) 2008-02-05 2008-02-05 プローブユニット

Publications (1)

Publication Number Publication Date
TW200951446A true TW200951446A (en) 2009-12-16

Family

ID=41069661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103566A TW200951446A (en) 2008-02-05 2009-02-04 Probe unit

Country Status (3)

Country Link
JP (1) JP2009186262A (ko)
KR (1) KR20090086037A (ko)
TW (1) TW200951446A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614548B (zh) * 2013-10-28 2018-02-11 高雄晶傑達光電科技股份有限公司 點燈測試裝置
TWI739508B (zh) * 2020-07-09 2021-09-11 京元電子股份有限公司 具水平調整模組之測試設備

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103472601B (zh) * 2013-09-02 2016-06-15 京东方科技集团股份有限公司 一种检测设备及检测方法
KR102593612B1 (ko) * 2016-06-02 2023-10-26 주식회사 탑 엔지니어링 프로브 장치
JP2020118682A (ja) * 2019-01-23 2020-08-06 日置電機株式会社 信号処理ユニットおよび測定装置
WO2020153163A1 (ja) * 2019-01-23 2020-07-30 日置電機株式会社 信号処理ユニットおよび測定装置
JP7271283B2 (ja) * 2019-04-16 2023-05-11 株式会社日本マイクロニクス 検査用接続装置
CN110187151A (zh) * 2019-06-21 2019-08-30 东莞市沃德精密机械有限公司 无线充电装置的线圈排线测试设备
KR102141535B1 (ko) * 2020-03-03 2020-08-05 장용철 멀티 플라잉 프로브 테스터
KR102136689B1 (ko) * 2020-03-03 2020-07-22 장용철 탈부착이 가능한 프로브 베이스를 구비하는 플라잉 프로브 테스터

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614548B (zh) * 2013-10-28 2018-02-11 高雄晶傑達光電科技股份有限公司 點燈測試裝置
TWI739508B (zh) * 2020-07-09 2021-09-11 京元電子股份有限公司 具水平調整模組之測試設備

Also Published As

Publication number Publication date
KR20090086037A (ko) 2009-08-10
JP2009186262A (ja) 2009-08-20

Similar Documents

Publication Publication Date Title
TW200951446A (en) Probe unit
CN202057556U (zh) 弯曲腐蚀疲劳试验仪
TW200710317A (en) Flanged sleeve guide
ATE557453T1 (de) Koaxialstecker
TW200732669A (en) Probe block and probe assembly including the same
TW200951323A (en) Rope end fixing device
TW200717947A (en) Electrical connector
MY153526A (en) A self-stabilizing support assembly for an item of furniture
CN102841277A (zh) 变压器测试工装
KR101295333B1 (ko) 굽힘 변형 측정을 위한 치구
CN202083719U (zh) 太阳能el测试探针组件软接触装置
MY153162A (en) Closing spring assembly of switching mechanism for air circuit breaker
CN204203267U (zh) 一种耐压测试治具中的线圈放置结构
CN202126484U (zh) 一种pcb板测试工装
CN207866621U (zh) 一种用于巴西法测试岩石抗拉强度的定位夹具
CN105258941A (zh) 按键寿命试验装置
WO2012011685A3 (ko) 멀티 스팽글 안내 장치 및 스팽글 공급 장치
MY146742A (en) Acceleration device for testing electronic components
CN102636735B (zh) 集成电路高压大电流测试装置
ATE519123T1 (de) Kontaktstift für einen prüfkopf mit vertikalen prüfnadeln mit verbesserter schrubb-bewegung
MY138796A (en) Single ended flange probe
CN203758391U (zh) 一种具有止动装置的单边导轨结构线纹尺检定装置
CN107198324B (zh) 一种粉笔支座
CN204028147U (zh) 一种小电路板磁场环境测试夹具
CN204882278U (zh) 提高金属工件适用性的硬度测试机构