TW200951446A - Probe unit - Google Patents

Probe unit

Info

Publication number
TW200951446A
TW200951446A TW098103566A TW98103566A TW200951446A TW 200951446 A TW200951446 A TW 200951446A TW 098103566 A TW098103566 A TW 098103566A TW 98103566 A TW98103566 A TW 98103566A TW 200951446 A TW200951446 A TW 200951446A
Authority
TW
Taiwan
Prior art keywords
movable base
probe unit
move
guided
elastic deformation
Prior art date
Application number
TW098103566A
Other languages
Chinese (zh)
Inventor
Ryo Ujike
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Publication of TW200951446A publication Critical patent/TW200951446A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Liquid Crystal (AREA)

Abstract

The present invention provides a probe unit for setting maximum of displacement and contact forces generated by elastic deformation in contact terminals of the probe unit during conduction inspection on the test body so as to easily increase overdrive amount. Probe group 11 is installed at the front end of a support block 12, a movable base 15 is used as the load block of upper block 13 in order to withstand a specific load increase. By way of through holes 17a and 17b for latching use, fastening shaft 21a and 21b, or coil spring 22a and 22b, the movable base 15 can move up and down to latch up with respect to a fixed base 16 that is used as substrate of the probe unit. Also, when guided by guiding mechanisms of guide holes 20a and 20b, guide pins 23a and 23b, and guide sleeve tube 24, the movable base 15 can be guided to move up and down. Here, the movable base 15 will move upwardly as the contact terminals exceed a specific contact force and undergo elastic deformation.
TW098103566A 2008-02-05 2009-02-04 Probe unit TW200951446A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008025048A JP2009186262A (en) 2008-02-05 2008-02-05 Probe unit

Publications (1)

Publication Number Publication Date
TW200951446A true TW200951446A (en) 2009-12-16

Family

ID=41069661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103566A TW200951446A (en) 2008-02-05 2009-02-04 Probe unit

Country Status (3)

Country Link
JP (1) JP2009186262A (en)
KR (1) KR20090086037A (en)
TW (1) TW200951446A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614548B (en) * 2013-10-28 2018-02-11 高雄晶傑達光電科技股份有限公司 Light inspection device
TWI739508B (en) * 2020-07-09 2021-09-11 京元電子股份有限公司 Test device with level adjustment module

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103472601B (en) * 2013-09-02 2016-06-15 京东方科技集团股份有限公司 A kind of detection equipment and detection method
KR102593612B1 (en) * 2016-06-02 2023-10-26 주식회사 탑 엔지니어링 Probe device
WO2020153163A1 (en) * 2019-01-23 2020-07-30 日置電機株式会社 Signal processing unit and measurement device
JP2020118682A (en) * 2019-01-23 2020-08-06 日置電機株式会社 Signal processing unit and measuring device
JP7271283B2 (en) * 2019-04-16 2023-05-11 株式会社日本マイクロニクス Inspection connection device
CN110187151A (en) * 2019-06-21 2019-08-30 东莞市沃德精密机械有限公司 The coil row line testing device of wireless charging device
KR102141535B1 (en) * 2020-03-03 2020-08-05 장용철 Multi flying probe tester
KR102136689B1 (en) * 2020-03-03 2020-07-22 장용철 Flying probe tester

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614548B (en) * 2013-10-28 2018-02-11 高雄晶傑達光電科技股份有限公司 Light inspection device
TWI739508B (en) * 2020-07-09 2021-09-11 京元電子股份有限公司 Test device with level adjustment module

Also Published As

Publication number Publication date
KR20090086037A (en) 2009-08-10
JP2009186262A (en) 2009-08-20

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