TWI739508B - Test device with level adjustment module - Google Patents

Abstract

The present invention relates to a test device with a level adjustment module, which includes a test head, a test interface and a prober. The test interface includes an upper substrate, a lower substrate, and a horizontal adjustment module. The upper substrate is connected to the test head with a plurality of tensile springs. The horizontal adjustment module includes a plurality of driving components. Each driving component is respectively connected to the upper substrate and the lower substrate, and includes a driving motor and a universal joint to adjust the distance in different positions between the upper substrate and the lower substrate. The prober carries a test interface and has a probe card that is connected with the lower substrate. As such, the present invention can adjust the probe height of a specific area of the probe card, so that the overall needle tip level reaches the required test specification to maintain the test quality of the prober.

Description

Test equipment with level adjustment module

The present invention relates to a test equipment with a level adjustment module, in particular to a test equipment with a level adjustment module that provides precise alignment.

Please refer to Figure 13, which is a three-dimensional view of a conventional test equipment with a level adjustment module. The figure shows a test equipment 91 with a level adjustment module. The contact substrate 92 with a plurality of contactors 93 is mounted on the probe card 96 via a supporting frame 95 and a conductive elastic body 94. The support frame 95 for supporting the contact substrate 92 is connected to the probe card 96 by screws 952 and nuts 951.

On the bottom surface of the contact substrate 92, the electrode 921 provided near the screw 952 is connected to the support frame 95, and the semiconductor wafer 900 to be tested is placed on a chuck 90. The gap sensor 901 on the semiconductor wafer 900 is connected to the input terminal 981 of the gap measuring instrument 98. The gap sensor 901 is also an electrode and is arranged at a position opposite to the electrode 921 to obtain the capacitance value between the gap sensor 901 and the electrode 921.

Among them, the conventional level adjustment module is an automatic system for adjusting the distance between the contact substrate 92 and the semiconductor wafer 900 or the reference plate, which includes a control signal from a controller 97 to rotate the nut 951 The motor 99. The controller 97 generates a control signal by calculating the measurement gap from the gap measuring instrument 98, so it can adjust the tip of the contactor 93 through the motor 99 and test the semiconductor wafer 900 meter. The distance between the surface or the reference board, that is, the level adjustment module can adjust the distance between the contact substrate 92 and the semiconductor wafer 900, so that all the contactors 93 on the contact substrate 92 are contacted at substantially the same time with substantially the same pressure The surface of the semiconductor wafer 900.

However, the conventional horizontal adjustment mechanism mainly only includes the combination of the motor 99, the screw 952, and the nut 951. Therefore, it can only adjust the pitch in the height direction of each position of the horizontal adjustment mechanism, which is a single degree of freedom change. When a horizontal displacement difference or a tilt angle change occurs between the substrate 92 and the semiconductor wafer 900, the level adjustment mechanism with a single degree of freedom can no longer meet the demand, and there is still great room for improvement.

This is the reason for the inventor. Based on the spirit of active invention, he eagerly thought of a test equipment with a level adjustment module that can solve the above-mentioned problems. After several researches and experiments, the present invention was finally completed.

The main purpose of the present invention is to provide a test equipment with a level adjustment module. By setting the level adjustment module, the distance between the upper substrate and the lower substrate can be changed so that the level of the probe card can be further adjusted. Keep the level of each position in the best condition to avoid the doubt that the probe card is tilted and the probe is damaged due to overpressure.

In order to achieve the above objective, the test equipment with a level adjustment module of the present invention includes a test head, a test interface, and a needle tester. The test interface includes an upper substrate, a lower substrate and a level adjustment module. The upper substrate is connected to the test head with a plurality of tension springs to maintain the test interface at a high position to ensure that the test interface does not collide with the needle test mechanism due to the overturning and positioning of the test head. The level adjustment module includes a plurality of driving components. Each driving component is respectively connected to the upper substrate and the lower substrate, and includes a driving motor and a universal joint to adjust the distance between the upper substrate and the lower substrate at different positions, thereby changing Probe card relative measurement The level of the test head. The probe tester carries the test interface and has a probe card that can be overlapped with the lower substrate to test the quality of the wafer.

With the above design, through the combination of the drive motor and the universal joint, the lower substrate can be ejected and driven to perform independent lifting actions on each axis, thereby adjusting the height of the probe in a specific area of the probe card, so that the overall needle tip level reaches the required level The test specification maintains the test quality of the needle tester.

The above-mentioned test equipment with a level adjustment module may further include a buckle mechanism, the buckle mechanism includes a buckle motor, a sliding part with a guide groove element, and a fixing part with a guide post element, a buckle motor It is arranged on the upper base plate and can drive the sliding part to act. The fixing part is arranged on the probe measuring machine. The guide post element can slide in the guide groove element and drive the upper base plate so that the upper base plate can surely overlap and fix the probe card. In this way, in conjunction with a pull-down stroke generated by the tension spring, the upper substrate can be adaptively floated to overlap the mechanism of the needle measuring machine, ensuring that the probes of the probe card can be accurately aligned.

The lower substrate can be connected to a probe card with a carrier board, and the carrier board has a plurality of spring pin connectors. In this way, the probe card can be electrically connected to the lower substrate through a plurality of spring pin connectors on the carrier board, thereby providing a transmission path for electrical signals.

The above-mentioned driving assembly may further include a connecting block and a horizontal sliding member connecting the driving motor and the connecting block. Thereby, through the arrangement of the horizontal sliding member, the degree of freedom of horizontal movement of the lower substrate can be effectively increased, and structural damage of the lower substrate during the fine adjustment process can be avoided.

The above-mentioned connecting block can be provided with a stop cylinder, and a stop piston which can protrude to abut against the driving motor can be accommodated in the connecting block. In this way, when the drive motor completes the level adjustment of the probe card, the stop cylinder will protrude the stop piston to interfere with the drive motor, so that the drive motor and the connecting block are locked in position to prevent the lower base plate from shifting due to external force or vibration. , Which in turn causes the needle point of the probe head to shift.

The above-mentioned level adjustment module may include four driving components, including a first driving component, a second driving component, a third driving component, and a fourth driving component. Wherein, the first drive assembly, the second drive assembly and the fourth drive assembly may further include a connecting block and a horizontal sliding member connecting the driving motor and the connecting block, respectively. As a result, since only the third drive assembly of the present invention is not equipped with a connecting block and a horizontal sliding member, the third drive assembly can be used as a reference axis to fine-tune other sets of drive assemblies to achieve the horizontal adjustment of the probe card.

The above-mentioned needle detector may further include an image sensor. In this way, the probe measuring machine can first measure the height of the probe through the image sensor as a basis for subsequent adjustment of the probe card level, which is convenient for fine-tuning to the required level and height position, and further improves the test yield.

The above summary and the following detailed description are exemplary in nature to further illustrate the scope of patent application of the present invention. The other objectives and advantages of the present invention will be described in the following description and drawings.

1: test equipment

2: Test head

3: Test interface

31: Upper substrate

32: Lower substrate

33: Horizontal adjustment module

33a: The first drive component

33a’: The first drive assembly

33b: second drive assembly

33c: third drive assembly

33d: Fourth drive assembly

331: drive motor

332: Universal joint

333: link block

334: Horizontal sliding parts

334a: Slider

334b: Slide rail

335: stop cylinder

336: Stop Piston

4: Needle testing machine

41: Probe card

5: Extension spring

6: Deduction mechanism

61: buckle motor

62: Slider

621: Guide Trough Element

63: fixed parts

631: guide column element

64: Slide rail assembly

7: Carrier board

71: Spring pin connector

90: chuck

900: Semiconductor wafer

901: Gap Sensor

91: test equipment

92: contact substrate

921: Electrode

93: Contactor

94: conductive elastomer

95: Support frame

951: Nut

952: screw

96: Probe card

97: Controller

98: Gap measuring instrument

981: Input

99: Motor

Fig. 1 is a perspective view of a test equipment with a level adjustment module according to a preferred embodiment of the present invention.

2 is a schematic diagram of the structure of a test equipment with a level adjustment module according to a preferred embodiment of the present invention.

FIG. 3 is a schematic diagram of a test interface level adjustment process of a preferred embodiment of the present invention.

Fig. 4 is a schematic diagram of the buckle mechanism of a preferred embodiment of the present invention before buckling.

Fig. 5 is a schematic diagram of the buckle mechanism of a preferred embodiment of the present invention after buckling.

Fig. 6 is a top view of a test equipment with a level adjustment module according to a preferred embodiment of the present invention.

Fig. 7 is a cross-sectional view of a third driving assembly of a preferred embodiment of the present invention.

Fig. 8 is a cross-sectional view of the first driving assembly of a preferred embodiment of the present invention.

Fig. 9 is a cross-sectional view of the second driving assembly of a preferred embodiment of the present invention.

Fig. 10 is a cross-sectional view of a fourth driving assembly of a preferred embodiment of the present invention.

Figures 11 and 12 are cross-sectional working diagrams of a drive assembly with a stop cylinder according to another preferred embodiment of the present invention.

Figure 13 is a perspective view of a conventional test equipment with a level adjustment module.

Please refer to FIG. 1 and FIG. 2, which are respectively a three-dimensional view and a schematic structural diagram of a test device with a level adjustment module according to a preferred embodiment of the present invention. The figure shows a test device 1 with a level adjustment module, which mainly includes a test head 2, a test interface 3, and a needle tester 4. The test device 1 accurately laps the test head 2 on the test interface 3 After the needle tester 4 is installed, subsequent test operations can be performed on the wafer.

In this embodiment, the test interface 3 is not only a simple interface panel, but mainly includes an upper substrate 31, a lower substrate 32, and a level adjustment module 33. The upper substrate 31 is connected to the test head 2 by a plurality of tension springs 5 to maintain the test interface 3 at a high position, and to ensure that the test interface 3 will not collide with the needle testing mechanism due to the overturning and positioning of the test head 2. Among them, the level adjustment module 33 of the present invention includes four sets of driving components (a first driving component 33a, a second driving component 33b, a third driving component 33c, and a fourth driving component 33d). Each driving assembly 33a, 33b, 33c, 33d is connected to the upper substrate 31 and the lower substrate 32, respectively, and includes a driving motor 331 and a universal joint 332 to adjust the distance between the upper substrate 31 and the lower substrate 32 at different positions , To achieve substantial level adjustment. In addition, the probe tester 4 carries the test interface 3 and has a probe card 41 that can be overlapped with the lower substrate 32. In this embodiment, the lower substrate 32 is connected to the probe card by a carrier board 7 41, and the carrier 7 has a plurality of spring pin connectors 71, so the probe card 41 can be electrically connected to the lower substrate 32 through the plurality of spring pin connectors 71 on the carrier 7 to provide a transmission path for electrical signals.

Please also refer to FIG. 3, which is a schematic diagram of a test interface level adjustment process of a preferred embodiment of the present invention. As shown in the figure, during the horizontal adjustment of the test interface 3, the horizontal angle difference θ between the lower base plate 32 and the drive motor 331 is driven by the universal joint 332 to connect components with different angles at both ends, which can be performed within a specific range. The fine adjustment of the lower substrate 32 level and the overall height position enables the test interface 3 and the probe card 41 to maintain precise needle tip level and the height position to press down to contact the wafer to precisely adjust the height position and level, thereby maintaining the test quality of the needle tester 4.

In addition, in order to ensure that the probes of the probe card 41 can be accurately aligned, the present invention first uses a buckle mechanism 6 to securely fix the test interface 3 on the probe tester 4, and then performs the subsequent level adjustment procedure. The buckle mechanism 6 includes a buckle motor 61, a sliding member 62, and a fixing member 63. The buckle motor 61 is disposed on the upper base plate 31 and can drive the sliding member 62 to move. The sliding member 62 has a guide groove element. 621. A sliding rail assembly 64 generates a lateral sliding displacement. The fixing member 63 has a guide post element 631, which is arranged on the needle measuring machine 4, wherein the guide post element 631 is slidable in the guide groove element 621 to cooperate with the pulling A pull-down stroke generated by the extension spring 5 enables the upper substrate 31 to float and lap on the needle measuring machine 4 adaptively, ensuring that the probes of the probe card 41 can be accurately aligned. Please refer to FIGS. 4 and 5, which are a schematic diagram of a deduction mechanism of a preferred embodiment of the present invention before and after deduction, respectively. As shown in FIG. 4, before the buckle mechanism 6 is buckled, the upper substrate 31 is only subjected to the pulling force of the tension spring 5, and is still floating in a high position. As shown in FIG. 5, after the buckle mechanism 6 is buckled, the upper substrate 31 is acted by the buckle mechanism 6 to produce a downward pull stroke. At this time, the guide post element 631 slides along the guide groove element 621 and ensures that the test head 2 It can be accurately lapped on the needle testing machine 4.

Please refer to FIGS. 6 to 10, which are respectively a top view of a test device with a level adjustment module according to a preferred embodiment of the present invention, a cross-sectional view of a third drive assembly of a preferred embodiment of the present invention, and A cross-sectional view of a first drive assembly, a second drive assembly, and a fourth drive assembly in a preferred embodiment of the present invention. As shown in FIG. 6, the level adjustment module 33 of the present invention includes four sets of driving components (a first driving component 33a, a second driving component 33b, a third driving component 33c, and a fourth driving component 33d). , As shown in FIG. 7, the third drive assembly 33c only includes a drive motor 331 and a universal joint 332, so it has the freedom of displacement in the height direction, and the third drive assembly 33c can be used as a reference axis to fine-tune other components; As shown in Figures 8 to 10, the first drive assembly 33a, the second drive assembly 33b, and the fourth drive assembly 33d have a drive motor 331 and a universal joint 332, respectively, and also include a connecting block 333 and a horizontal The sliding member 334, wherein the connecting block 333 is provided with a horizontal sliding member 334, and the horizontal sliding member 334 has a sliding block 334a and a sliding rail 334b. The sliding block 334a and the sliding rail 334b of the horizontal sliding member 334 are respectively connected to the driving motor 331 and connecting block 333. Therefore, the first drive assembly 33a, the second drive assembly 33b, and the fourth drive assembly 33d of the present invention can be provided with a height direction and a horizontal direction by the drive motor 331, the horizontal sliding member 334 and the universal joint 332. A total of 5 degrees of freedom (Degree of Freedom, DOF) such as translational degrees of freedom and two-axis rotation degrees of freedom, so that the test interface 3 can be accurately aligned with the probe card 41, so that the test device 1 can be in the best position. The test is carried out in a horizontal state to avoid overvoltage damage to the probe caused by the inclination of the probe card 41. In the adjustment process, the program can be used to limit the height difference within 2 mm to ensure that the mechanism is within the safe operation range.

Please refer to FIGS. 11 and 12, which are respectively a cross-sectional view of a driving assembly with a stop cylinder according to another preferred embodiment of the present invention. As shown in the figure, in this embodiment, the first drive assembly 33a' (the second drive assembly and the fourth drive assembly are the same) in addition to the aforementioned drive motor 331, universal joint 332, connecting block 333 and horizontal sliding In addition to the piece 334, a stop cylinder 335 is provided in the connecting block 333, and a stop piston 336 that can protrude to abut against the drive motor 331 is arranged in the connecting block 333 to lock the individual positioning of each drive assembly for testing. Equipment 1 maintains the adjusted level state. As shown in FIG. 11, before the horizontal positioning of the test interface 3 is completed, the stop piston 336 does not protrude to abut the drive motor 331, so that the drive motor 331 can still be used. Push the lower base plate 32 for adjustment to maintain the adjustability of the structure; as shown in Figure 12, when the test interface 3 has been positioned horizontally, the stop piston 336 will protrude against the drive motor 331, so that the drive motor 331 can no longer be pushed down The base plate 32 is adjusted so that the driving motor 331 and the connecting block 333 are mutually locked to prevent the lower base plate 32 from deviating due to external force or vibration, which may cause the needle point of the probe head to deviate.

Finally, the present invention can add an image sensor to the needle measuring machine 4. In this embodiment, a CCD image sensor (not shown) is installed to measure the height of the probe through the image. After that, it is determined whether to adjust the level of the probe card 41 by the level adjustment module, to prevent the probe from being deformed due to the over-voltage of the probe, and to ensure good test quality.

The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in the present invention should be subject to the scope of the patent application, rather than being limited to the above-mentioned embodiments.

1: test equipment

2: Test head

3: Test interface

31: Upper substrate

32: Lower substrate

33: Horizontal adjustment module

33a: The first drive component

33b: second drive assembly

33c: third drive assembly

33d: Fourth drive assembly

4: Needle testing machine

5: Extension spring

6: Deduction mechanism

61: buckle motor

62: Slider

621: Guide Trough Element

63: fixed parts

631: guide column element

64: Slide rail assembly

Claims (9)

A test device with a level adjustment module includes: a test head; a test interface, including an upper substrate, a lower substrate, and a level adjustment module. The upper substrate is connected to the test head by a plurality of tension springs. The level adjustment module includes a plurality of drive components, each of which is respectively connected to the upper substrate and the lower substrate, and includes a drive motor and a universal joint for adjusting the distance between the upper substrate and the lower substrate at different positions ; And a needle tester, bearing the test interface, with a probe card that can be overlapped with the lower substrate. The test equipment with a level adjustment module according to claim 1, which further includes a buckle mechanism, the buckle mechanism including a buckle motor, a sliding member with a guide groove element, and a guide post element The fixed part, the buckle motor is arranged on the upper base plate and can drive the sliding part to act, the fixed part is arranged on the needle measuring machine, the guide post element can slide in the guide groove element and drive the The upper base plate enables the upper base plate to overlap and fix the probe card reliably. The test equipment with a level adjustment module according to claim 1, wherein the lower substrate is connected to the probe card by a carrier board, and the carrier board has a plurality of spring pin connectors. The test equipment with a level adjustment module according to claim 1, wherein the driving assembly further includes a connecting block and a horizontal sliding member connecting the driving motor and the connecting block. The test equipment with a level adjustment module according to claim 4, wherein the connecting block is provided with a stop cylinder, and a stop piston that can protrude to abut against the drive motor is arranged in the connecting block. The test device with a level adjustment module according to claim 1, wherein the level adjustment module includes four driving components, including a first driving component, a second driving component, a third driving component, and a first driving component. Four drive components. The test device with a level adjustment module according to claim 6, wherein the first drive assembly, the second drive assembly, and the fourth drive assembly further respectively include a connecting block and a connecting block and a connection between the drive motor and the connection The horizontal sliding piece of the block. The test equipment with a horizontal adjustment module according to claim 7, wherein the horizontal sliding member has a sliding block and a sliding rail, which are respectively connected to the driving motor and the connecting block. The test equipment with a level adjustment module according to claim 1, wherein the needle tester further includes an image sensor.

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