TW200951412A - Apparatus including heating source reflective filter for pyrometry - Google Patents

Apparatus including heating source reflective filter for pyrometry

Info

Publication number
TW200951412A
TW200951412A TW098110200A TW98110200A TW200951412A TW 200951412 A TW200951412 A TW 200951412A TW 098110200 A TW098110200 A TW 098110200A TW 98110200 A TW98110200 A TW 98110200A TW 200951412 A TW200951412 A TW 200951412A
Authority
TW
Taiwan
Prior art keywords
pyrometry
range
radiation
apparatus including
heating source
Prior art date
Application number
TW098110200A
Other languages
English (en)
Other versions
TWI434031B (zh
Inventor
Joseph M Ranish
Aaron M Hunter
Blake R Koelmel
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200951412A publication Critical patent/TW200951412A/zh
Application granted granted Critical
Publication of TWI434031B publication Critical patent/TWI434031B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Radiation Pyrometers (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Chemical Vapour Deposition (AREA)
TW098110200A 2008-04-09 2009-03-27 用於處理基板之系統及量測該基板溫度之方法 TWI434031B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/100,179 US8283607B2 (en) 2008-04-09 2008-04-09 Apparatus including heating source reflective filter for pyrometry

Publications (2)

Publication Number Publication Date
TW200951412A true TW200951412A (en) 2009-12-16
TWI434031B TWI434031B (zh) 2014-04-11

Family

ID=41162526

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098110200A TWI434031B (zh) 2008-04-09 2009-03-27 用於處理基板之系統及量測該基板溫度之方法

Country Status (7)

Country Link
US (1) US8283607B2 (zh)
EP (1) EP2279519B1 (zh)
JP (2) JP2011520247A (zh)
KR (1) KR101624217B1 (zh)
CN (1) CN101999161B (zh)
TW (1) TWI434031B (zh)
WO (1) WO2009126529A2 (zh)

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TWI559021B (zh) * 2011-08-16 2016-11-21 應用材料股份有限公司 用於在腔室內感測基板之方法及裝置

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US9536762B2 (en) 2010-05-28 2017-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for thermal mapping and thermal process control
US9449858B2 (en) * 2010-08-09 2016-09-20 Applied Materials, Inc. Transparent reflector plate for rapid thermal processing chamber
CN103229277A (zh) * 2010-11-30 2013-07-31 应用材料公司 用于在uv腔室中调节晶圆处理轮廓的方法及装置
JP5725584B2 (ja) * 2011-08-02 2015-05-27 有限会社ワイ・システムズ 半導体層の温度測定方法および温度測定装置
DE102011116243B4 (de) * 2011-10-17 2014-04-17 Centrotherm Photovoltaics Ag Vorrichtung zum Bestimmen der Temperatur eines Substrats
US9200965B2 (en) * 2012-06-26 2015-12-01 Veeco Instruments Inc. Temperature control for GaN based materials
JP2014011256A (ja) * 2012-06-28 2014-01-20 Dainippon Screen Mfg Co Ltd 熱処理方法および熱処理装置
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CN104704626B (zh) 2012-10-24 2017-12-05 应用材料公司 用于快速热处理的最小接触边缘环
US9786529B2 (en) 2013-03-11 2017-10-10 Applied Materials, Inc. Pyrometry filter for thermal process chamber
CN105144355B (zh) * 2013-05-01 2018-02-06 应用材料公司 用于在晶片处理系统内进行低温测量的设备与方法
SG11201508512PA (en) * 2013-05-23 2015-12-30 Applied Materials Inc A coated liner assembly for a semiconductor processing chamber
CN105765706B (zh) * 2013-11-12 2019-10-25 应用材料公司 高温计的背景消除
KR101560377B1 (ko) * 2013-12-27 2015-11-25 삼성디스플레이 주식회사 광 조사 장치
US10727093B2 (en) * 2014-05-23 2020-07-28 Applied Materials, Inc. Light pipe window structure for low pressure thermal processes
US10437153B2 (en) * 2014-10-23 2019-10-08 SCREEN Holdings Co., Ltd. Heat treatment method and heat treatment apparatus
CN106158622B (zh) * 2014-11-12 2020-07-24 台湾积体电路制造股份有限公司 用于热映射和热工艺控制的方法和装置
JP2018537662A (ja) * 2016-09-20 2018-12-20 ルマセンス テクノロジーズ ホールディングズ， インク． 温度プローブ
US10281335B2 (en) 2017-05-26 2019-05-07 Applied Materials, Inc. Pulsed radiation sources for transmission pyrometry
US10845249B2 (en) 2017-05-26 2020-11-24 Applied Materials, Inc. Continuous spectra transmission pyrometry
SG10201705708YA (en) 2017-05-26 2018-12-28 Applied Materials Inc Detector for low temperature transmission pyrometry
US10571337B2 (en) 2017-05-26 2020-02-25 Applied Materials, Inc. Thermal cooling member with low temperature control
EP3495790B1 (en) * 2017-12-05 2024-06-12 Laser Systems & Solutions of Europe Apparatus and method for measuring the surface temperature of a substrate
KR20240007688A (ko) * 2018-06-26 2024-01-16 어플라이드 머티어리얼스, 인코포레이티드 온도를 측정하기 위한 방법 및 장치
US20200064198A1 (en) * 2018-08-22 2020-02-27 Mattson Technology, Inc. Systems And Methods For Thermal Processing And Temperature Measurement Of A Workpiece At Low Temperatures
GB201902220D0 (en) 2019-02-18 2019-04-03 Nicoventures Trading Ltd Aerosol provision systems
US11699603B2 (en) 2019-03-14 2023-07-11 Beijing E-Town Semiconductor Technology, Co., Ltd Thermal processing system with temperature non-uniformity control
US11543296B2 (en) * 2019-05-31 2023-01-03 Applied Materials, Inc. Method and apparatus for calibration of substrate temperature using pyrometer
US20230069444A1 (en) * 2021-08-31 2023-03-02 Applied Materials, Inc. Systems, methods, and apparatus for correcting thermal processing of substrates

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559021B (zh) * 2011-08-16 2016-11-21 應用材料股份有限公司 用於在腔室內感測基板之方法及裝置
TWI610083B (zh) * 2011-08-16 2018-01-01 應用材料股份有限公司 用於在腔室內感測基板之方法及裝置

Also Published As

Publication number Publication date
KR101624217B1 (ko) 2016-05-25
EP2279519B1 (en) 2013-05-22
EP2279519A2 (en) 2011-02-02
US8283607B2 (en) 2012-10-09
JP2016139813A (ja) 2016-08-04
WO2009126529A2 (en) 2009-10-15
JP6286463B2 (ja) 2018-02-28
US20090255921A1 (en) 2009-10-15
CN101999161B (zh) 2013-03-27
WO2009126529A3 (en) 2009-12-17
CN101999161A (zh) 2011-03-30
JP2011520247A (ja) 2011-07-14
KR20110004433A (ko) 2011-01-13
EP2279519A4 (en) 2011-07-06
TWI434031B (zh) 2014-04-11

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