200947645 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種液晶顯示器’尤其涉及半導體晶片、液晶面板、液晶 模組、及其連接方法與連接檢查方法。 【先前技術】 近年’液晶顯示器(liquid crystal display, LCD)已發展成為具有輕重量、 薄尺寸以及低功耗的特點。此外，由於液晶新材料的發展以及良好的像素 技術’ LCD的影像品質已大幅地改進。因此，LCD的應用已增加。 © 一般說來’用於顯示外部輸入視訊信號的液晶模組(liquid crystal module, LCM)包括：液晶面板’其中液晶注入二玻璃基板之間；偏光板，提供於液 晶面板的上下表面，用於偏極化光束；以及背光單元，具有光源和導光板， - 光源和導光板用於將持續的光束提供給液晶面板。LCD包括用於LCM的 驅動單元和系統外殼以及LCM。 驅動單元包括：視訊信號處理器，用於處理外部輸入視訊信號以輸出 複合同步信號；控制器，用於劃分由視訊信號處理器所輸出的複合同步信 號為水平和垂直同步信號，並依據模式選擇信號控制信號的時序；以及半 導體晶片，包括閘極和源極驅動器’用於依據控制器的輸出信號來依次應 q 用液晶面板的閘極和源極線。 . 在製造LCM之前，液晶面板和LCM的半導體晶片之間的連接需要檢 查。因此’可避免LC1V[製造過程中缺陷的連接。 【發明内容】 本發明提供了一種包括附接檢查墊的半導體晶片。 本發明還提供包括附接檢查墊的液晶面板。 本發明還提供包括附接檢查墊的液晶模組。 本發明還提供用於液晶模組的連接檢查方法。 本發明還提供用於液晶模組的連接方法。 依據本發_—個特點’提供有-種半導體晶片，包括：至少二個或 4 200947645 以上的第一附接檢查墊，用於檢查液晶面板的連接；以及導電薄膜，在第 一附接檢查墊之間連接。 依據本發明的另一個特點，提供有一種液晶面板’包括：至少二個或 以上的第二附接檢查墊，用於檢查半導體晶片的連接；以及導電薄膜，在 第二附接檢查墊之間連接。 在本發明的上述特點中，半導體晶片可以一玻璃覆晶封裝(Chip0nthe Glass，COG)或薄膜覆晶封裝(Chip 〇η Hlm，c〇F)的方式附接至液晶面 板。此外’導電薄膜可由導電金屬所組成並具有預定的電阻。 ❹ ❹ 依據本發明的另一特點，提供有一種液晶模組，包括：半導體晶片， 包括至少二個或以上的第一附接檢查墊，以及導電薄膜，在第一附接檢查 塾之間連接；以及液晶面板’包括第二附接檢查塾，附接至第—附接檢查 墊，以及玻璃上接線，連接至第二附接檢查墊。 依，本發明的另-特點，提供有—種雜液晶模⑽連接檢査方法， 包括在藉由將半導體晶片附接至液晶面板來製造—液晶模組之前，透過玻 璃上接線^檢查半導體晶片和液晶面板之間附接的步驟，該等玻璃上接線 連接至第—附接檢查塾’該等第二附接檢查墊連接至第—附接檢查塾。 ® 上述特點中’檢查半導體晶片和液晶面板之間附接的步 nil=檢—連接至每個第二附接檢查墊的第—和第二玻璃上接線之間 旦、’，該等第二附接檢查墊與第一附接檢査墊對連接。 成的上述特點中’檢查半導體晶片和液晶面板之間附接的步 ·施加不同電壓至連接至每健等第二附接檢査塾的第一 ; Ϊ ’該等第二附接檢查墊連接至第—附接檢查塾對；以及 測量該等第-和第二麵上接線的電流。 括·^據㈣-㈣點，提供有—種麟液晶歡之連接方法，包 ϊί:墊片的第一附接檢查墊與液晶面板的一些第二附 附接檢查塾.利用2導體晶片的第—附接檢查塾與液晶面板的其餘第二 體晶片之一些該等第<晶=:相同上接線對連接附接至第-半導 附接檢查塾。 檢查塾’以及第二半導體晶片的其他該等第二 法可ί 特Γ ’x辨導體晶片可_至液晶面板，該連接方 ,n個半導體晶#的鱗第-嶋檢査麵接至液 5 200947645 •===附接檢查墊;以及利用液晶面板的該等相同玻璃上接線 以及利用洛曰、第—至第k(1<k<x)半導體晶片之該等第二附接檢查墊， 乂及利用液日曰面板的該等不同玻璃上接線對連接附接至該等第 半導體晶片之該等第二附接檢查墊。 在本發明的上述特點中，χ個半導體晶片可附接至液晶面板，以及該連 接方法可進一步包括步驟：將該等η個半導體晶片的第-附接檢查墊附接 至液晶面板的第二附接檢查塾；以及利用該等相同的 接至所有該料導體晶片之第二附接檢錢。 ❹ 依據本發明，由於半導體晶片和液晶面板之間的連接在製造[CM之前 執行’所以可避免製造出存在缺陷連接的LCM。 可理解的是，以上概述和以下詳細描述都具有示例性和解釋性，並意 圖對本發明實施例提供進一步的解釋說明。 【實施方式】 將參考用於說明本發明示例性實施例的所附圖式，為了獲得對本發明 的充分理解、其優勢以及透過實施本發明所達到的目的。 以下，本發明將參考所附圖式和示例性實施例對本發明作出詳細說 明，但本發明並不限制於此。類似的圖式符號代表類似的元件。 第1圖為說明依據本發明實施例之半導體晶片的示意圖。參考第1圖’ Φ 半導體晶片10包括附接檢查墊11和12以及在附接檢查墊11和12之間所 連接的導電薄膜13。半導禮晶片1〇的附接檢查墊11和12與液晶面板的附 接檢查墊連接，以便檢查半導體晶片和液晶面板之間的連接。半導體晶片 1〇可為附接至液晶面板的COG型或COF型。導電薄膜13可為具有預定電 阻的金屬。 為了闞明本發明’形成於半導體晶片上的附接檢查墊表示為第一附接 檢查墊’而形成於液晶面板上的附接檢查塾表示為第二附接檢查墊。 第2圖至第4圖為說明第1圖的半導體晶片1〇中幾種附接檢查墊的示 意圖。第2圖說明附接檢查墊對和連接其間的導電薄膜13。第3圖說明三 個附接檢查墊11、12和14以及連接其間的導電薄膜13和15。第4圖說明 η個附接檢查墊11、12、…、14和16以及導電薄膜13、15、·..和17。 6 200947645 - 以這種方式，包括η個附接檢查墊的第一附接檢查墊對僅形成在每個 半導體晶片的二連接部分處。此外，m個第一附接檢查墊對可形成在所有 半導體晶片上面。 此外，m個附接檢查墊可為短路，以便具有相同的電壓。η個附接檢查 墊可與由導電金屬所製成的導電薄膜連接。此外，導電薄膜還可由電阻材 料所製成。 第5圖和第6圖為解釋液晶面板和第1圖中的半導體晶片1〇之間檢查 連接的方法。較佳地，半導體晶片和液晶面板之間檢查連接的方法在透過 將半導體晶片附接至液晶面板而製造LCM之前執行，從而可不製造出具有 缺陷連接的液晶模組。 © 在第5圖中所示的液晶模組30中，半導體晶片1〇附接至液晶面板2〇。 半導體晶片10的附接檢查墊11和12與導電薄膜13連接。液晶面板20的 附接檢查墊(圖中未示)配置於半導體晶片1〇的附接檢查墊η和12下面。 液晶面板20的附接檢査墊(圖中未示)與第一和第二玻璃上接線玻璃 上接線)21和22連接。 半導體晶片10和液晶面板20之間的檢查連接的方法可透過在第一玻 璃上接線21和第二玻璃上接線22之間檢查短路而執行。 此外’半導體晶片10和液晶面板20之間檢查連接的方法可透過在第 一和第二玻璃上接線21和22上施加不同的電壓、並測量第一和第二玻璃 Q 上接線21和22的電流來執行。 、在第6圖中所示的液晶模組30中，半導體晶片1〇附接至液晶面板2〇。 半導體晶片10的附接檢查墊U、12和14與導電薄膜13和15連接。液晶 面板20的附接檢查墊(圖中未示)配置於半導體晶片1〇的附接檢查墊η、ΐ2 和14的下面。液晶面板2〇的附接檢查墊(圖中未示)與第一至第三玻璃上接 線21、22和23連接。液晶面板的附接檢查墊數量與半導體晶片的附接檢 查墊相同，液晶面板的第一至第三玻璃上接線數量也與半導體晶片的附接 檢查墊的玻璃上接線相同。 在實施例中，半導體晶片1〇和液晶面板2〇之間的檢查連接方法可透 過施加不同電壓在第一玻璃上接線(上接線)2丨和第三玻璃上接線(下接 線)23、並測量第二玻璃上接線(中接線)22的電流來執行。 200947645 ' 第7圖至第9圖為用於解釋液晶面板和第1圖的半導體晶片ι〇之間的 各種連接方法的示意圖。液晶模組的連接方法，將半導體晶片附接至液晶 面板，包括：將半導體晶片的第一附接檢查塾附接至液晶面板的第二附接 檢查墊的步驟’·以及利用液晶面板上的玻璃上接線對來連接液晶面板的第 二附接檢查墊(第一附接檢查墊與之附接)的步驟。 第7圖說明二個半導體晶片10和40利用相同玻璃上接線對連接的情 況，其中第一和第二半導體晶片10和40附接在液晶面板2〇上。第一半導 體晶片10的第一附接檢查塾11和12與導電薄骐13連接，並且第二半導 體晶片40的第一附接檢查墊41和42與導電薄臈43連接。液晶面板20的 第二附接檢查塾(圖中未示)配置於第一和第二半導體晶片10和40的第一附 ° 接檢査墊11、12、41和42下面。液晶面板20的第二附接檢查墊(圖中未示） - 在第—半導體晶片1G的第—附接檢查塾11下面，而且液晶面板20的第二 附接檢查墊(圖中未示)在第二半導體晶片4〇的第一附接檢查墊41下面，並 與液晶面板20的第一玻璃上接線51(面板paD-Α)連接。液晶面板20的第 二附接檢查墊(圖中未示)在第一半導體晶片1〇的第一附接檢查墊12下面， 並且液晶面板20的第二附接檢查墊(圖中未示)在第二半導體晶片4〇的第一 =檢錄42下面’並·晶面板2G的第二玻璃上麟52(面板pAD B) 第8圖說明三個半導體晶片1〇、6〇和7〇彻相同的玻璃上接線對連 e接讀況。儘管所齡的三辨導體“丨0、6()和70在實_中利用相 同的玻璃上接線對連接’但三_上離)半導體晶片可糊相關玻璃上 接線對來連接。 液晶模組的連接方法，將x個半導體晶片附接至液晶面板，包括：將x 個半導體晶片的第-附接檢查塾與液晶面板對應的第二附接檢查塾附接的 步驟；利用第-玻璃上接線對連接液晶面板的第二附接檢查塾(第一至第k 半導體晶片（1<k<x)的第-附接檢查墊與之附接)的步驟，以及第二玻璃 上接線對連接液晶面板的第二附接檢查墊(第(k+1)至第x半導體晶片的第一 附接檢查塾與之附接)的步驟，其令第一和第二玻璃上接線對彼此不同。 在複數個半導體晶細接至液晶面板的配置t 述實施射儀不_玻璃上接線對連接，但—些半導體^可利用= 200947645 的玻璃上接線對來連接，而其餘利用不同的玻璃上接線對來連接。 參考第8圖，第一半導體晶片10的第一附接檢查墊11和12與導電薄 膜13連接；第二半導體晶片60的第一附接檢查塾61和62與導電薄族63 連接；以及第三半導體晶片70的第一附接檢查墊71和72與導電薄膜73 連接。液晶面板的第二附接檢查塾(圖中未示)配置於第一至第三半導體晶片 10、60和70的第一附接檢查墊11、Π、61、62、71和72下面。液晶面板 20的第二附接檢查塾(圖中未示)在第一半導體晶片10的第一附接檢查墊^ 下面’液晶面板20的第二附接檢查墊(圖中未示)在第二半導體晶片6〇的第 一附接檢查墊61下面，並且液晶面板20的第二附接檢查墊(圖中未示)在第 二半導體晶片70的第一附接檢查墊71下面，以上第二附接檢查墊與液晶 ❿ 面板2〇的第一玻璃上接線81(面板PAD-A)連接。液晶面板2〇的第二附接 • 檢查墊(圖中未示)在第一半導體晶片1〇的第一附接檢查墊12的下面，液晶 面板20的第二附接檢查墊(圖中未示)在第二半導體晶片60的第一附接檢查 塾62的下面’以及液晶面板2〇的第二附接檢查塾(圖中未示)在第三半導體 晶片70的第一附接檢查墊72的下面，以上第二附接檢查墊與液晶面板2〇 的第二玻璃上接線82(面板PAD-B)連接。 第9圖說明所有半導體晶片與相同的玻璃上接線對連接的情況。半導 體晶片10、10a、10b和l〇c的第一附接檢查墊^和12與導電薄膜13連接。 液晶面板的第二附接檢查墊(圖中未示)配置於半導體晶片1〇、1〇a、1〇b和 〇 1〇c的第一附接檢查塾11和12的下面。配置於半導體晶片10、i〇a、10b 和l〇c的第一附接檢查墊u下面的液晶面板的第二附接檢查墊(圖中未示） 與液晶面板20的第一玻璃上接線91(面板PAD_A)連接。配置於半導體晶片 1〇、l〇a、10b和l〇c的第-附接檢查整12下面的液晶面板的第二附接檢查 墊(圖中未示)與液晶面板2〇的第二玻璃上接線92(面板pAD B)連接。 以上所述僅為用以解釋本發明之較佳實施例，並非企圖據以對本發明 作任何形式上之闕，是以，凡有在相同之發明職下所作有關本發明之 任何修飾或變更，皆仍應包括在本發明意圖保護之範疇。 200947645 f圖式簡單說明】 所附圖式其供關於本發明實施例的進__步理解 :之書二部:釋說；r的實施例並且•同^^ 面 · 固， 第1 第2 圖為說明依據本發明實施例之半導體晶片的示意圖； 圖至第4圖為朗第！圖的半導體晶片中幾種附接檢查塾的示意 第5圖和第6圖為用於轉液晶面板和第！圖的半導體晶片之間連接 檢查方法的示意圖；以及BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display, particularly to a semiconductor wafer, a liquid crystal panel, a liquid crystal module, a connection method thereof, and a connection inspection method. [Prior Art] In recent years, liquid crystal displays (LCDs) have been developed to have the characteristics of light weight, thin size, and low power consumption. In addition, the image quality of LCDs has been greatly improved due to the development of new liquid crystal materials and good pixel technology. Therefore, the application of LCD has increased. © generally speaking, a liquid crystal module (LCM) for displaying an external input video signal includes: a liquid crystal panel in which a liquid crystal is injected between two glass substrates; and a polarizing plate provided on the upper and lower surfaces of the liquid crystal panel for a polarized beam; and a backlight unit having a light source and a light guide plate, - a light source and a light guide plate for supplying a continuous light beam to the liquid crystal panel. The LCD includes a drive unit and system housing for the LCM and an LCM. The driving unit comprises: a video signal processor for processing the external input video signal to output the composite synchronization signal; and a controller for dividing the composite synchronization signal output by the video signal processor into horizontal and vertical synchronization signals, and selecting according to the mode The timing of the signal control signal; and the semiconductor wafer, including the gate and source driver 'for sequentially using the gate and source lines of the liquid crystal panel according to the output signal of the controller. The connection between the LCD panel and the semiconductor wafer of the LCM needs to be checked before the LCM is fabricated. Therefore, LC1V can be avoided [defective connection in the manufacturing process. SUMMARY OF THE INVENTION The present invention provides a semiconductor wafer including an attached inspection pad. The present invention also provides a liquid crystal panel including an attached inspection pad. The present invention also provides a liquid crystal module including an attached inspection pad. The present invention also provides a connection inspection method for a liquid crystal module. The present invention also provides a connection method for a liquid crystal module. Provided with a semiconductor wafer according to the present invention, comprising: at least two or four first attached inspection pads of 200947645 or more for checking the connection of the liquid crystal panel; and the conductive film, in the first attachment inspection Connect between the pads. According to another feature of the present invention, there is provided a liquid crystal panel 'comprising: at least two or more second attachment inspection pads for inspecting a connection of a semiconductor wafer; and a conductive film between the second attachment inspection pads connection. In the above feature of the present invention, the semiconductor wafer may be attached to the liquid crystal panel in a manner of a chip-on-glass (COG) or a film flip-chip package (Chip Hη Hlm, c〇F). Further, the conductive film may be composed of a conductive metal and have a predetermined electrical resistance. According to another feature of the present invention, there is provided a liquid crystal module comprising: a semiconductor wafer comprising at least two or more first attachment inspection pads, and a conductive film connected between the first attachment inspections And the liquid crystal panel 'includes a second attachment inspection cassette, attached to the first attachment inspection pad, and a glass upper connection to the second attachment inspection pad. According to another feature of the present invention, there is provided a method for detecting a connection of a liquid crystal mold (10), comprising: inspecting a semiconductor wafer through a wiring on the glass before manufacturing the liquid crystal module by attaching the semiconductor wafer to the liquid crystal panel; A step of attaching between the liquid crystal panels, the glass-on wires are connected to the first-attachment inspection cassette, and the second attachment inspection pads are connected to the first-attachment inspection cassette. ® In the above characteristics, 'Check the connection between the semiconductor wafer and the LCD panel, nil=check—connected to the second and second glass-on-wires, and the second glass. The attached inspection pad is coupled to the first attachment inspection pad pair. In the above-mentioned features, 'inspecting the steps of attaching between the semiconductor wafer and the liquid crystal panel, applying a different voltage to the first connection to each of the second attachment inspection tips; Ϊ 'the second attachment inspection pads are connected to The first-attachment check is performed; and the currents of the wires on the first and second sides are measured. In addition, according to (4)-(4), there is a connection method for the lining LCD, which includes: the first attached inspection pad of the gasket and some second attachment inspection of the liquid crystal panel. The first-attachment check is performed with some of the remaining second body wafers of the liquid crystal panel, and the same upper wiring pair is attached to the first-semiconductor attachment check. Checking 塾' and other such second methods of the second semiconductor wafer can be used to identify the conductor wafer _ to the liquid crystal panel, the junction side, the n-th semiconductor wafer # 第 - 嶋 inspection surface is connected to the liquid 5 200947645 •=== attaching an inspection pad; and the same glass-on-line wiring using the liquid crystal panel and the second attachment inspection pads using the 曰, the first to the kth (1<k<x) semiconductor wafer, And attaching the second attachment test pads attached to the first semiconductor wafers by the different on-glass connection pairs of the liquid helium panel. In the above feature of the invention, one semiconductor wafer may be attached to the liquid crystal panel, and the connection method may further include the step of attaching the first attachment inspection pad of the n semiconductor wafers to the second of the liquid crystal panel Attaching inspections; and utilizing the same second attachment check to all of the conductor tracks. According to the present invention, since the connection between the semiconductor wafer and the liquid crystal panel is performed before the manufacture of [CM], it is possible to avoid the manufacture of the LCM having the defective connection. The above summary and the following detailed description are intended to be illustrative and The embodiments of the present invention are described with reference to the accompanying drawings, in which: FIG. In the following, the invention will be described in detail with reference to the drawings and exemplary embodiments, but the invention is not limited thereto. Similar drawing symbols represent similar elements. 1 is a schematic view showing a semiconductor wafer in accordance with an embodiment of the present invention. Referring to Fig. 1 ' Φ The semiconductor wafer 10 includes attached inspection pads 11 and 12 and a conductive film 13 connected between the attached inspection pads 11 and 12. The attachment inspection pads 11 and 12 of the semiconductor wafer 1 are connected to the attachment inspection pads of the liquid crystal panel to inspect the connection between the semiconductor wafer and the liquid crystal panel. The semiconductor wafer 1 can be a COG type or a COF type attached to a liquid crystal panel. The electroconductive thin film 13 may be a metal having a predetermined resistance. In order to clarify that the present invention, the attachment inspection pad formed on the semiconductor wafer is indicated as the first attachment inspection pad, and the attachment inspection 形成 formed on the liquid crystal panel is denoted as the second attachment inspection pad. Figs. 2 to 4 are views for explaining several kinds of attached inspection pads in the semiconductor wafer 1 of Fig. 1. Fig. 2 illustrates the attachment of the inspection pad pair and the conductive film 13 interposed therebetween. Fig. 3 illustrates three attached inspection pads 11, 12 and 14 and conductive films 13 and 15 interposed therebetween. Fig. 4 illustrates n attached inspection pads 11, 12, ..., 14 and 16 and conductive films 13, 15, ..., and 17. 6 200947645 - In this manner, a first attachment inspection pad pair including n attached inspection pads is formed only at the two connection portions of each semiconductor wafer. Additionally, m first attachment test pad pairs can be formed over all of the semiconductor wafers. In addition, the m attached inspection pads can be shorted to have the same voltage. The n attachment inspection pads may be connected to a conductive film made of a conductive metal. Further, the electroconductive film can also be made of a resistive material. Fig. 5 and Fig. 6 are views for explaining a method of inspecting the connection between the liquid crystal panel and the semiconductor wafer 1 in Fig. 1. Preferably, the method of inspecting the connection between the semiconductor wafer and the liquid crystal panel is performed before the LCM is fabricated by attaching the semiconductor wafer to the liquid crystal panel, so that the liquid crystal module having the defective connection can be manufactured. © In the liquid crystal module 30 shown in FIG. 5, the semiconductor wafer 1 is attached to the liquid crystal panel 2''. The attachment inspection pads 11 and 12 of the semiconductor wafer 10 are connected to the conductive film 13. An attachment inspection pad (not shown) of the liquid crystal panel 20 is disposed under the attachment inspection pads η and 12 of the semiconductor wafer 1A. An attachment inspection pad (not shown) of the liquid crystal panel 20 is connected to the first and second glass upper wiring glass wirings 21 and 22. The method of inspecting the connection between the semiconductor wafer 10 and the liquid crystal panel 20 can be performed by inspecting a short circuit between the first glass upper wiring 21 and the second glass upper wiring 22. Further, the method of inspecting the connection between the semiconductor wafer 10 and the liquid crystal panel 20 can be performed by applying different voltages on the first and second glass wirings 21 and 22, and measuring the wirings 21 and 22 on the first and second glass Q. Current is executed. In the liquid crystal module 30 shown in FIG. 6, the semiconductor wafer 1 is attached to the liquid crystal panel 2''. The attachment inspection pads U, 12, and 14 of the semiconductor wafer 10 are connected to the conductive films 13 and 15. An attachment inspection pad (not shown) of the liquid crystal panel 20 is disposed under the attachment inspection pads η, ΐ 2 and 14 of the semiconductor wafer 1 . An attachment inspection pad (not shown) of the liquid crystal panel 2 is connected to the first to third glass upper wires 21, 22 and 23. The number of attached inspection pads of the liquid crystal panel is the same as that of the semiconductor wafer, and the number of wires on the first to third glass of the liquid crystal panel is also the same as that of the semiconductor wafer to which the inspection pads are attached. In an embodiment, the method of inspecting connection between the semiconductor wafer 1 and the liquid crystal panel 2 can be performed by applying different voltages on the first glass (upper wiring) 2丨 and the third glass wiring (lower wiring) 23, and The current of the second glass upper wiring (medium wiring) 22 is measured to be performed. 200947645' Fig. 7 to Fig. 9 are schematic views for explaining various connection methods between the liquid crystal panel and the semiconductor wafer 1 of Fig. 1. a method of connecting a liquid crystal module, the method of attaching a semiconductor wafer to a liquid crystal panel, comprising: attaching a first attachment inspection layer of the semiconductor wafer to a second attachment inspection pad of the liquid crystal panel, and using a liquid crystal panel A step of wiring the pair of glass to connect the second attachment inspection pad of the liquid crystal panel to which the first attachment inspection pad is attached. Fig. 7 illustrates the case where the two semiconductor wafers 10 and 40 are connected by the same pair of glass wirings, wherein the first and second semiconductor wafers 10 and 40 are attached to the liquid crystal panel 2''. The first attachment inspection pads 11 and 12 of the first semiconductor wafer 10 are connected to the conductive thin film 13, and the first attachment inspection pads 41 and 42 of the second semiconductor wafer 40 are connected to the conductive thin film 43. A second attachment inspection 塾 (not shown) of the liquid crystal panel 20 is disposed under the first attachment inspection pads 11, 12, 41 and 42 of the first and second semiconductor wafers 10 and 40. a second attachment inspection pad (not shown) of the liquid crystal panel 20 - under the first attachment inspection 塾 11 of the first semiconductor wafer 1G, and a second attachment inspection pad of the liquid crystal panel 20 (not shown) The first attachment inspection pad 41 of the second semiconductor wafer 4 is connected to the first glass upper wiring 51 (panel paD-Α) of the liquid crystal panel 20. A second attachment inspection pad (not shown) of the liquid crystal panel 20 is under the first attachment inspection pad 12 of the first semiconductor wafer 1 , and a second attachment inspection pad of the liquid crystal panel 20 (not shown) Next to the first = recording 42 of the second semiconductor wafer 4', the second glass top 52 of the crystal panel 2G (panel pAD B) Fig. 8 illustrates that the three semiconductor wafers 1 , 6 and 7 are identical. The wiring on the glass is connected to the e. Although the three-dimensional conductors of the ages "丨0,6() and 70 are connected in the real _ with the same glass-on-wire connection, but the three-up) semiconductor wafers can be connected to the wiring pairs on the glass. a method of attaching x semiconductor wafers to a liquid crystal panel, comprising: a step of attaching a first attachment inspection 塾 of the x semiconductor wafers to a second attachment inspection 对应 corresponding to the liquid crystal panel; using the first glass The wiring is connected to the second attachment inspection port (the first to kth semiconductor wafer (1<k<x) of the first attachment inspection pad attached thereto) to the liquid crystal panel, and the second glass upper wiring pair is connected The second attachment inspection pad of the liquid crystal panel (the first attachment inspection of the (k+1)th to xth semiconductor wafers is attached thereto), which causes the first and second glass upper wiring pairs to be different from each other. In the configuration in which a plurality of semiconductor crystals are finely connected to the liquid crystal panel, the illuminating device is not connected to the glass, but some semiconductors can be connected by using the glass wiring pair of 200947645, and the rest are connected by different glass wiring. For the connection. Refer to Figure 8, the first semiconductor crystal The first attachment inspection pads 11 and 12 of the sheet 10 are connected to the conductive film 13; the first attachment inspection marks 61 and 62 of the second semiconductor wafer 60 are connected to the conductive thin group 63; and the first attachment of the third semiconductor wafer 70 The inspection pads 71 and 72 are connected to the conductive film 73. A second attachment inspection 塾 (not shown) of the liquid crystal panel is disposed on the first attachment inspection pads 11 of the first to third semiconductor wafers 10, 60 and 70, Π, 61, 62, 71, and 72. The second attachment inspection 塾 (not shown) of the liquid crystal panel 20 is under the first attachment inspection pad of the first semiconductor wafer 10, and the second attachment of the liquid crystal panel 20 An inspection pad (not shown) is under the first attachment inspection pad 61 of the second semiconductor wafer 6〇, and a second attachment inspection pad (not shown) of the liquid crystal panel 20 is on the second semiconductor wafer 70. Below the first attachment inspection pad 71, the above second attachment inspection pad is connected to the first glass upper wiring 81 (panel PAD-A) of the liquid crystal panel 2A. The second attachment of the liquid crystal panel 2 • the inspection pad ( The second attachment inspection of the liquid crystal panel 20 under the first attachment inspection pad 12 of the first semiconductor wafer 1 is not shown in the drawing. A pad (not shown) is under the first attachment inspection 塾 62 of the second semiconductor wafer 60 and a second attachment inspection 塾 (not shown) of the liquid crystal panel 2 is at the third semiconductor wafer 70 Below the first attachment inspection pad 72, the above second attachment inspection pad is connected to the second glass upper connection 82 (panel PAD-B) of the liquid crystal panel 2A. Figure 9 illustrates all semiconductor wafers and the same glass wiring. In the case of connection, the first attachment inspection pads and 12 of the semiconductor wafers 10, 10a, 10b, and 10c are connected to the conductive film 13. The second attachment inspection pad (not shown) of the liquid crystal panel is disposed in the semiconductor The first attachments of the wafers 1〇, 1〇a, 1〇b, and 〇1〇c are inspected below the 塾11 and 12. A second attachment inspection pad (not shown) of the liquid crystal panel disposed under the first attachment inspection pad u of the semiconductor wafer 10, i〇a, 10b, and 10c is connected to the first glass of the liquid crystal panel 20 91 (panel PAD_A) connection. a second attachment inspection pad (not shown) of the liquid crystal panel disposed under the first attachment-inspection 12 of the semiconductor wafers 1A, 10a, 10b, and 10c, and a second glass of the liquid crystal panel 2 The upper wiring 92 (panel pAD B) is connected. The above description is only for the purpose of explaining the preferred embodiments of the present invention, and is not intended to be in any way to the present invention. They should all be included in the scope of the invention as intended. 200947645 f Schematic description of the drawings] The drawings are for understanding of the embodiment of the present invention: the second part of the book: the explanation; the embodiment of r and the same as ^^ surface solid, the first 2nd BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings illustrate a schematic diagram of a semiconductor wafer in accordance with an embodiment of the present invention; Illustrations of Several Attachment Checks in the Semiconductor Wafer of the Figure Figures 5 and 6 show the use of the liquid crystal panel and the first! Schematic diagram of the connection between the semiconductor wafers of the figure;
第7圖至第9圖為用於解釋液晶面板和第j圖的半導體晶片之間的各 種連接方法的示意圖。 〇 【主要元件符號說明】 10 半導體晶片 10a 半導體晶片 10b 半導體晶片 10c 半導鱧晶片 11 附接檢查墊 12 附接檢查墊 13 導電薄膜 14 附接檢查墊 15 導電薄膜 16 附接檢查墊 17 導電薄膜 20 液晶面板 21 第一玻璃上接線 22 第二玻璃上接線 23 第三玻璃上接線 30 液晶模組 40 半導體晶片 200947645 - 41第一附接檢查墊 42 第一附接檢查墊 43 導電薄膜 51第一玻璃上接線 52第二玻璃上接線 60半導體晶片 61第一附接檢查墊 62 第一附接檢查墊 63 導電薄膜 70半導體晶片 ❹ 71第一附接檢查墊 72第一附接檢查墊 73 導電薄膜 - 81第一玻璃上接線 82 第二玻璃上接線 - 91第一玻璃上接線 92 第二玻璃上接線Fig. 7 through Fig. 9 are schematic views for explaining various connection methods between the liquid crystal panel and the semiconductor wafer of Fig. j. 〇 [Main component symbol description] 10 semiconductor wafer 10a semiconductor wafer 10b semiconductor wafer 10c semi-conductive wafer 11 attached inspection pad 12 attached inspection pad 13 conductive film 14 attached inspection pad 15 conductive film 16 attached inspection pad 17 conductive film 20 liquid crystal panel 21 first glass upper wiring 22 second glass upper wiring 23 third glass upper wiring 30 liquid crystal module 40 semiconductor wafer 200947645 - 41 first attachment inspection pad 42 first attachment inspection pad 43 conductive film 51 first Glass-on-line wiring 52 second glass-on wiring 60 semiconductor wafer 61 first attachment inspection pad 62 first attachment inspection pad 63 conductive film 70 semiconductor wafer cassette 71 first attachment inspection pad 72 first attachment inspection pad 73 conductive film - 81 first glass upper wiring 82 second glass upper wiring - 91 first glass upper wiring 92 second glass upper wiring
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