200946858 九、發明說明： 【發明所屬之技術領域】 . 本發明涉及一種均熱板散熱裳置，尤係指一種 對諸如發光二極體之類之電子元件進行散熱之均 熱板散熱裝置。 【先前技術】 發光二極體光源作為一種新興之第三代光 ❹源，雖然現在還不能大規模取代傳统之白熾燈，但 係其具有工作壽命長、節能、環保等優點，而普遍 被市場所看好。而且’目前由發光二極體組成之模 組能產生大功率、高亮度之光源，完全可以取代 現有白熾燈實現室内外照明，亦將廣泛地、革命性 ，取代傳統t白熾燈等現有之光源，進而成為符合 卽能環保主題之主要光源。 然而，功率、亮度越大之發光二極體或其模組 ©產生之熱量越大，且在體積相對較小之發光二極體 燈具内難於散發出去。故，發光二極體尚存在較大 散熱技術瓶頸，此亦係目前大功率、高亮度發光二 極體燈具市場化最難突破之關鍵之處。目前業界通 用之散熱方案係在該燈具内設置一散熱器，此類散 熱器一般係由導熱性能良好之金屬材料製成，其具 有一底板和底板上形成之複數散熱鰭片。 然而對於一些大功率之發光二極體燈具，其發 熱量高’這種單純使用金屬材料製成之散熱器難於 200946858 滿足其散熱之需纟。但係、，如果在散熱器上設風扇 -以提高散熱效率，不僅會使照明設備產生β桑音，= 時亦會因為風扇之不穩定性使照明設備 ^ 穩定性受到影響。 〈奇命及 均熱板散熱結構由於具有大面積散熱之均溫 $欧彳Μ運用於到大功率之發光二極體燈具散 …、’以保證熱量能被及時帶走，採用此種 熱結構發光二極體燈具之二極體需 均、：： 散=構上，然而均熱板目前之結構並不能= 一要求，故需進一步改進。 【發明内容】 有鑒於此，有必要提供一種對發光二極體模組 :::均熱板散熱裝置，並能使發光二極體模組貼 汉於其上之均熱板散熱裝置。 φ & 種句熱板政熱裝置’包括一均熱板、貼設於 面之一散熱片組和貼置於均熱板頂面之 光二極體模組’該均熱板包括一第一板體及 i體結合之一第二板體，第一及第二板體共 "J 裝叹工作流體之腔室，複數固定柱安裝於 旅本f體上並位於腔室之外，複數固定件穿過該等 ^先二極體模組與該等固定柱配合。 均熱板上嵌置之固定柱加強均熱板之強度以提 穩固性，同時可以直接與固定件螺合以便於發 光一極體模組安裝於其上。 200946858 下面參…、附圖，結合實施例對本發明作進一步 之描述。 【實施方式】200946858 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink for heat sinking, and more particularly to a heat sink for heat dissipation of electronic components such as light-emitting diodes. [Prior Art] As a new generation of optical source, the light-emitting diode light source can not replace the traditional incandescent lamp on a large scale, but it has the advantages of long working life, energy saving and environmental protection. The place is optimistic. Moreover, the module currently composed of a light-emitting diode can generate a high-power, high-brightness light source, which can completely replace the existing incandescent lamp for indoor and outdoor illumination, and will also be widely and revolutionarily replaced with the existing light source such as the traditional t incandescent lamp. And then become the main source of light in line with the environmental protection theme. However, the larger the power and brightness of the light-emitting diode or its module, the greater the heat generated, and it is difficult to emit in a relatively small-sized light-emitting diode lamp. Therefore, the light-emitting diode still has a large heat-dissipation technology bottleneck, which is also the most difficult point for the current marketization of high-power, high-brightness light-emitting diode lamps. At present, the heat dissipation scheme commonly used in the industry is to provide a heat sink in the lamp. The heat sink is generally made of a metal material with good thermal conductivity, and has a plurality of heat dissipation fins formed on the bottom plate and the bottom plate. However, for some high-power LEDs, the heat generation is high. This kind of radiator made of metal material is difficult to meet the heat dissipation requirements of 200946858. However, if a fan is installed on the heat sink - to improve the heat dissipation efficiency, not only will the lighting device produce beta sang, but also the stability of the lighting device will be affected by the instability of the fan. <The odd-even and soaking plate heat-dissipating structure is due to the large-area heat-dissipating average temperature of the 彳Μ 彳Μ 彳Μ 到 到 到 到 到 到 到 到 到 到 到 到 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大The diodes of the illuminating diode lamps need to be::: scatter = structure, but the current structure of the slab is not a requirement, so further improvement is needed. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat-dissipating device for a light-emitting diode module ::: a heat-dissipating heat sink, and a light-emitting diode module. The φ & syllabic hot plate thermal device includes a heat equalizing plate, a heat sink sheet attached to the surface, and a light diode module attached to the top surface of the heat equalizing plate. The heat equalizing plate includes a first The second body of the plate body and the body is combined with the first plate and the second plate body. The first and second plates are combined with a working fluid chamber, and the plurality of fixed columns are mounted on the body of the travel body and located outside the chamber, plural The fixing member passes through the first diode modules and cooperates with the fixing posts. The fixing column embedded on the heat equalizing plate strengthens the strength of the heat equalizing plate to improve the solidity, and can be directly screwed with the fixing member to install the light emitting body module thereon. The present invention will be further described with reference to the accompanying drawings. [Embodiment]
請參閱圖1及2，太恭BB 久Z本發明—優選實施例中之均 熱板散熱裝置，用於料 對女裝在該發光二極體燈具内 之發光元件進行散埶。马·的办4 双…該均熱板散熱裝置包括一均 熱板10、排列於均熱板]n农Referring to Figures 1 and 2, the present invention, in a preferred embodiment, is a heat-dissipating heat sink for dimming a light-emitting element in a light-emitting diode lamp. Ma's office 4 pairs... The soaking plate heat sink includes a soaking plate 10, arranged in a soaking plate]
熱板10底面之複數散熱片2Ca plurality of heat sinks 2C on the bottom surface of the hot plate 10
和並排貼設於均執拓，n 1 热扳10頂面之複數發光二極體模 組30。 請特別參閱® 3及4,上述均熱板1〇呈矩形， 為一内封有卫作流體之相變化導熱殼體，其包括一 第一板體12、與第一板體12邊緣結合之一第二板 體14和夹置於第一及第二板體12、14之間之複數 固定柱16。該第一板體12上開設有複數穿孔HO, 所述穿孔120呈複數列排列，且每一列對應一發光 ❹二極體模組30。該第一板體12朝向發光二極體模 址30方向凸伸以形成一腔體（圖未標），腔體周緣 則形成有固定邊緣122,該固定邊緣ι22與第二板 體14之周緣緊密結合以形成封閉所述腔體，該固 定邊緣122上設置有一連通所述腔體之封口管 124’均熱板10之工作液體可通過封口管ι24注入 均熱板1〇之腔體内。該第二板體14 固定邊緣⑵均平行於該第一板體=開設 有與第一板體i2之穿孔12〇對應之複數穿孔 200946858 140。每一固定柱16呈扁圓柱狀，具有平坦之頂端 部和底端部以分別密封焊接在第一板體12底面和 第二板體14頂面。每一固定柱16開設有一沿其中 軸線上下貫通之螺孔160。該均熱板1 〇處於組裝 狀態時，第二板體14之邊緣與第一板體12之固定 邊緣122密封結合，固定柱16通過精密焊接等方 式結合於第一和第二板體12、14之間，且其螺孔 160分別與第一和第二板體12、14之穿孔120、140 對應連通。 上述散熱片組20包括複數相互平行間隔排列 之散熱片22，每一散熱片22均呈矩形，且在其上 *^緣垂直彎折延伸有折邊220，所有散熱片22排 列在一起時’它們之折邊220共同形成一貼設在均 熱板10底面上之平面。該等散熱片22垂直於均熱 板1 〇底面且與均熱板1 〇兩相對侧邊平行。 上述發光二極體模組30並排地貼設在該均埶 被10頂面上，每一發光二極體模組30包括一條形 電路板32和安裝在電路板32上之複數發光二極體 疋件34。所述發光二極體元件34排成兩列，並沿 電路板32之長度方向排列。該電路板32在兩列發 光二極體元件34之間開設一列透孔32〇。每一發 光二極體模組30之一列透孔320與均熱板1〇上之 列穿孔120、140及均熱板10内之固定柱16之 螺孔160對應，以供固定件1〇〇穿過一列透孔32〇 200946858 而與對應之—列螺孔16〇螺合 -組30固定到均熱板10了貝面上。發齐先^極體模 30與均熱板1〇之間可以鋪設導熱介質以】：模組 二極體模組3〇盥妁赦缸&间發光 卜4旅丄， 間之熱傳導率。 上述發光二極體燈具在使用時， 件34產生之熱量可由均熱板10直接極體元 佈到散熱：組20上，再由散熱片組2〇將熱】：分 d Γ ί氣中。上述均熱板1〇為相變化元件：Ϊ 以更及時有效地將熱量分佈到散熱片組^件，可 到周圍環琦中土 ΠΑ ' 、'、 Μ散發 J鬥圍展境中去’從而能提高散熱效 熱板Μ内設置之固定柱“不僅可以支樓;:和； 一：體12、14以提高均熱板1〇之穩固性，同時可 以直接與固定件1〇〇螺合以便掇 3〇安裝於其上。 赞九一極體模組 綜上所述，本發明符合發明專利要件，爰依法 ❹提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在妥依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1為發明均熱板散熱裴置一優選實施例之 立體組合圖。 圖2為圖1中均熱板散熱裝置之立體分解圖。 圖3為圖2中均熱板散熱裝置之進一步分解 10 200946858 圖。 圖4為圖3之倒置視圖。 【主要元件符號說明】 均 熱 板 10 穿 孔 120、 封 口 管 124 固 定 柱 16 ❹散 熱 片 組 20 折 邊 220 電 路 板 32 發 光 _ - 極骨 畫元件34 第一板體 12 140固定邊緣 122 第二板體 14 螺孔 160 散熱片 22 發光二極體模組 30 透孔 320 固定件 100 ❹ 11And a plurality of light-emitting diode modules 30 that are placed side by side on the top surface of the n 1 heat plate. Please refer to ® 3 and 4 for details. The above-mentioned heat-receiving plate has a rectangular shape and is a phase-change heat-conducting casing with a sealing fluid, which comprises a first plate body 12 and is combined with the edge of the first plate body 12. A second plate body 14 and a plurality of fixing posts 16 sandwiched between the first and second plates 12, 14. The first plate body 12 is provided with a plurality of perforations HO, and the perforations 120 are arranged in a plurality of columns, and each column corresponds to a light-emitting diode module 30. The first plate body 12 protrudes toward the light emitting diode module 30 to form a cavity (not labeled), and the periphery of the cavity is formed with a fixed edge 122, and the fixed edge ι 22 and the periphery of the second plate 14 Closely combined to form a closed cavity, the fixed edge 122 is provided with a sealing tube 124 communicating with the cavity. The working liquid of the heat equalizing plate 10 can be injected into the cavity of the heat equalizing plate through the sealing tube ι24. . The second plate body 14 has a fixed edge (2) parallel to the first plate body = a plurality of perforations 200946858 140 corresponding to the through holes 12 of the first plate body i2. Each of the fixing posts 16 has a flat cylindrical shape with a flat top end portion and a bottom end portion for sealingly welding the bottom surface of the first plate body 12 and the top surface of the second plate body 14, respectively. Each of the fixing posts 16 defines a screw hole 160 extending up and down along the central axis thereof. When the heat equalizing plate 1 is in the assembled state, the edge of the second plate body 14 is sealingly coupled with the fixed edge 122 of the first plate body 12, and the fixing post 16 is coupled to the first and second plate bodies 12 by precision welding or the like. Between the 14 and the screw holes 160 are respectively corresponding to the through holes 120, 140 of the first and second plates 12, 14. The heat sink group 20 includes a plurality of heat sinks 22 arranged in parallel with each other. Each heat sink 22 has a rectangular shape, and a flange 220 is vertically bent on the upper edge thereof, and all the heat sinks 22 are arranged together. Their flanges 220 together form a plane that is attached to the bottom surface of the heat equalizing plate 10. The fins 22 are perpendicular to the bottom surface of the soaking plate 1 and are parallel to the opposite sides of the soaking plate 1 . The LED modules 30 are mounted side by side on the top surface of the uniform quilt 10, and each LED module 30 includes a strip circuit board 32 and a plurality of LEDs mounted on the circuit board 32. Element 34. The light emitting diode elements 34 are arranged in two rows and arranged along the length of the circuit board 32. The circuit board 32 defines a row of through holes 32 between the two columns of light emitting diode elements 34. A row of through holes 320 of each of the light emitting diode modules 30 corresponds to the column holes 120 and 140 of the heat equalizing plate 1 and the screw holes 160 of the fixing column 16 in the heat equalizing plate 10 for the fixing member 1〇〇 Through a row of through holes 32〇200946858 and corresponding to the column screw holes 16〇-group 30 is fixed to the surface of the heat equalizing plate 10. The heat transfer medium can be laid between the first and second body dies 30 and the soaking plate 1 :: module diode module 3 〇盥妁赦 cylinder & luminescence 卜 4 travel, thermal conductivity between. When the above-mentioned light-emitting diode lamp is used, the heat generated by the piece 34 can be directly radiated by the heat-receiving plate 10 to the heat-dissipating group: the group 20, and then the heat-dissipating group 2 〇 热 ί ί gas. The above-mentioned soaking plate 1 is a phase change element: Ϊ to distribute heat to the heat sink group in a timely and effective manner, and to go to the surroundings of the ring 琦 中 , , , , , , , , , , , It can improve the fixing column of the heat-dissipating hot plate. "It can not only support the building;: and; one: the body 12, 14 can improve the stability of the heat-receiving plate, and can be directly screwed with the fixing member.掇3〇 is mounted thereon. 赞九一极体模块 In summary, the present invention meets the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention. Any equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. [Simplified Schematic] FIG. 1 is a preferred embodiment of the heat-dissipating heat sink of the invention. Fig. 2 is an exploded perspective view of the heat sink heat sink of Fig. 1. Fig. 3 is a further exploded view of the heat sink heat sink of Fig. 2. Fig. 4 is an inverted view of Fig. 3. [Main component symbol description] 10 perforation 120, sealing tube 124 fixing column 16 ❹ heat sink group 20 hem 220 circuit board 32 illuminating _ - polar bone drawing element 34 first plate body 12 140 fixed edge 122 second plate body 14 screw hole 160 heat sink 22 light Diode Module 30 Through Hole 320 Fixings 100 ❹ 11