CN206301842U - A kind of long-term durability luminous diode - Google Patents

A kind of long-term durability luminous diode Download PDF

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Publication number
CN206301842U
CN206301842U CN201621468398.2U CN201621468398U CN206301842U CN 206301842 U CN206301842 U CN 206301842U CN 201621468398 U CN201621468398 U CN 201621468398U CN 206301842 U CN206301842 U CN 206301842U
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CN
China
Prior art keywords
circuit board
radiating fin
radiating
film layer
luminescence chip
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621468398.2U
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Chinese (zh)
Inventor
王焕东
陈红英
王威
王焕忠
李娟�
王鸿宇
王海宇
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Guangdong Hui Xin Electronic Technology Co., Ltd.
Original Assignee
Dongguan Hui Hui Electronic Technology Co Ltd
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Priority to CN201621468398.2U priority Critical patent/CN206301842U/en
Application granted granted Critical
Publication of CN206301842U publication Critical patent/CN206301842U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model is related to diode field, specifically related to a kind of long-term durability luminous diode, including circuit board, the luminescence chip that is connected to circuit board, be arranged on luminescence chip electrode, connection electrode and circuit board gold thread, packaging body outside luminescence chip is covered at, also including being arranged at radiating subassembly of the circuit board away from luminescence chip side;The circuit board includes insulation board, the high heat conductivity metal heat sink piece positioned at insulation board length direction two sides, and the gold thread is electrically connected with to form loop with two high heat conductivity metal heat sink pieces respectively;The radiating subassembly includes the cooling base for being connected to circuit board and conducting strip, several radiating fins being installed on cooling base, also including being arranged at several radiating fins of radiating fin length direction, has gap between two neighboring radiating fin.The utility model good heat dissipation effect, energy consumption are low, luminosity is big, long service life.

Description

A kind of long-term durability luminous diode
Technical field
The utility model is related to diode field, more particularly to a kind of long-term durability luminous diode.
Background technology
With developing rapidly for science and technology, light emitting diode (LED) conduct lighting source of new generation, because it has volume Small, long lifespan, colour rendering are good, many advantages of efficient energy-saving and environmental protection, progressively replace conventional light source.It is luminous at present Diode is in automobile interior exterior light, display backlight, outdoor landscape illumination, portable system flash lamp, projector light source, advertisement The fields such as lamp box, torch, traffic lights are all widely used.
Light emitting diode is one kind of semiconductor diode, electric energy can be changed into luminous energy.Light emitting diode with it is common Diode is equally made up of a PN junction, it may have unilateral conduction.After forward voltage is added to light emitting diode, from P Area is injected into the hole in N areas and the electronics in P areas is injected into by N areas, in a few micrometers near PN junction respectively with the electronics and P in N areas The hole-recombination in area, produces the fluorescence of spontaneous radiation.
With the progressively popularization of light emitting diode, its defect also has attracted increasing attention, although light-emitting diodes pipe There is long service life, but on the one hand cause internal temperature due to producing substantial amounts of heat during LED operation Degree is raised, and influences the luminous intensity of diode chip for backlight unit, also results in epoxy resin encapsulating material flavescence, embrittlement, causes diode Service life shortens.On the other hand, because the circuit board of diode is non-high heat conductive body, its thermal conductivity coefficient is low, heat dispersion is poor, A large amount of heat energy that the light fixture of particularly more several LED cluster formula encapsulation compositions is produced cannot be dredged and excluded in time, Junction temperature of light emitting diode rising is directly resulted in, hot polymerization effect and thermal resistance are excessive, cause light emitting diode service life short and light decay Phenomenon, and therefore improve energy consumption.
Utility model content
To solve the above problems, the utility model provides a kind of good heat dissipation effect, energy consumption is low, luminosity is big, use the longevity Order long-term durability luminous diode long.
The technical scheme that the utility model is used is:A kind of long-term durability luminous diode, including circuit board, it is connected to electricity The gold thread of the luminescence chip of road plate, the electrode being arranged on luminescence chip, connection electrode and circuit board, cover at outside luminescence chip The packaging body in portion, also including being arranged at radiating subassembly of the circuit board away from luminescence chip side;The circuit board include insulation board, Positioned at the high heat conductivity metal heat sink piece of insulation board length direction two sides, the gold thread respectively with two high heat conductivity metal heat sinks Piece is electrically connected with to form loop;The radiating subassembly is including being connected to the cooling base of circuit board and conducting strip, being installed on radiating Several radiating fins on pedestal, it is two neighboring also including being arranged at several radiating fins of radiating fin length direction There is gap between radiating fin.
To being further improved to for above-mentioned technical proposal, the both sides of the radiating fin in the middle of cooling base are equipped with scattered Hot fin, and the radiating fin of both sides alternating inclinations are outwards arranged in radiating fin both sides successively;Positioned at cooling base both sides The equal side of radiating fin is provided with radiating fin.
To being further improved to for above-mentioned technical proposal, the radiating fin and radiating fin setting at an acute angle.
To being further improved to for above-mentioned technical proposal, the packaging body includes substrate layer, low refraction successively from inside to outside Rate monomer film layer, fluorescent adhesive layer and high refractive index monomers film layer;The high refractive index monomers film layer is away from fluorescent adhesive layer side Surface is provided with the roughening structure with high refractive index monomers film layer one;The roughening structure is height refractive index monomer film surface Array of protrusions.
To being further improved to for above-mentioned technical proposal, the low-refraction monomer film layer is methyl class layer of silica gel, described High refractive index monomers film layer is phenyl class layer of silica gel.
To being further improved to for above-mentioned technical proposal, the fluorescent adhesive layer and low-refraction monomer film layer and high index of refraction The faying face of monomer film layer is plane.
The beneficial effects of the utility model are:
1st, on the one hand, circuit board of the present utility model includes that insulation board, the height positioned at insulation board length direction two sides are led Thermal conductive metallic is heat sink piece, and metal heat sink piece heat-conductive characteristic is good, and heat dissipation channel is unimpeded, thermal resistance is small, in time by the heat of luminescence chip Amount is conducted so that light emitting diode knot heats up slowly, prevents luminescence chip from producing light decay because temperature is too high, and extending it makes With the life-span, luminosity is big, reducing energy consumption.Second aspect, is provided with radiating subassembly, the heat of high heat conductivity metal heat sink piece conduction Conducted into external environment through radiating subassembly, further prevent luminescence chip temperature high, be conducive to extending of the present utility model making Use the life-span.The third aspect, radiating subassembly is including being connected to the cooling base of circuit board and conducting strip, being installed on cooling base Several radiating fins, also including being arranged at several radiating fins of radiating fin length direction, two neighboring radiating fin Between there is gap, the setting of radiating fin and radiating fin increases area of dissipation, accelerates the heat friendship of heat and the external world Change, radiating efficiency is high, be conducive to extending the service life of light emitting diode.
2nd, the both sides of the radiating fin in the middle of cooling base are equipped with radiating fin, and both sides radiating fin successively Alternating inclinations are outwards arranged in radiating fin both sides;The equal side of radiating fin positioned at cooling base both sides is provided with radiating fin. Radiating fin alternating inclinations are outwards arranged in radiating fin both sides, are easy to air lateral flow, the air of lateral flow and longitudinal direction Increase the mobility and irregularity of Laminar Flow with meeting for vertical direction air, so as to disturb and destruction Laminar Flow, raising The coefficient of heat transfer, so as to improve radiating efficiency, prevents temperature too high and produces loss to luminescence chip, is further conducive to extending this reality With new service life.
3rd, radiating fin and radiating fin setting at an acute angle.It is more convenient for increasing the lateral flow of air, improves the coefficient of heat transfer, Radiating efficiency is improved, is further conducive to extending service life of the present utility model.
4th, packaging body includes substrate layer, low-refraction monomer film layer, fluorescent adhesive layer and high index of refraction list successively from inside to outside Body film layer;The high refractive index monomers film layer is provided with and high refractive index monomers film layer one away from the surface of fluorescent adhesive layer side Roughening structure;The roughening structure is the array of protrusions of height refractive index monomer film surface.Packaging body is provided with two refracting layers, Refracting layer refractive index near luminescence chip is small, and the refracting layer refractive index away from luminescence chip is big, and this structure reduces luminous core Refringence between piece and air, reduces the loss amount of full transmitting, allows more light through outside packaging body directive, improves Luminosity of the present utility model, and fluorescent adhesive layer is away from luminescence chip, away from pyrotoxin, so as to reduce declining for fluorescent material Subtract, be further conducive to extending service life of the present utility model.
5th, it is roughened the setting of structure, the anaclasis that can be sent luminescence chip is gone out, reduces the full transmitting of emergent light, enters one Step is conducive to improving luminous flux, improves luminosity of the present utility model.
6th, low-refraction monomer film layer is methyl class layer of silica gel, and the high refractive index monomers film layer is phenyl class layer of silica gel. Methyl class silica gel heat-resisting ability is strong, elasticity is high, good reliability, and its resistance to elevated temperatures reduces deformation, and elasticity can be buffered well To most of stress of luminescence chip, the probability of the phenomenon generation of gold thread break or loose contact is reduced, so as to improve hair The reliability and service life of optical diode;Phenyl class silica gel hardness is high, and moisture-inhibiting oxygen transmission rate is low, can be to light emitting diode Internal structure plays a very good protection, and is further conducive to extending the service life of light emitting diode.
7th, the faying face of fluorescent adhesive layer and low-refraction monomer film layer and high refractive index monomers film layer is plane, is conducive to Fluorescent material is uniformly distributed, it is ensured that light uniform, is further conducive to improving luminosity.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of circuit board of the present utility model;
Fig. 3 is the structural representation of radiating subassembly of the present utility model;
Fig. 4 is the structural representation of packaging body of the present utility model.
Specific embodiment
The utility model is further described below in conjunction with accompanying drawing.
As shown in figure 1, being structural representation of the present utility model.
A kind of long-term durability luminous diode 100, including circuit board 110, be connected to the luminescence chip 120 of circuit board 110, set The gold thread 140 of the electrode 130, connection electrode 130 and circuit board 110 that are placed on luminescence chip 120, cover at luminescence chip 120 Outside packaging body 150, also including being arranged at radiating subassembly 160 of the circuit board 110 away from the side of luminescence chip 120.
As shown in Fig. 2 being the structural representation of circuit board of the present utility model.
Circuit board 110 includes insulation board 111, the high heat conductivity metal heat sink positioned at the length direction two sides of insulation board 111 Piece 112, the gold thread 140 is electrically connected with two high heat conductivity metal heat sink piece 112 forms loop respectively.
As shown in figure 3, being the structural representation of radiating subassembly of the present utility model.
Radiating subassembly 160 is including being connected to the cooling base 161 of circuit board 110 and conducting strip, being installed on cooling base 161 On several radiating fins 162, it is adjacent also including being arranged at several radiating fins 163 of the length direction of radiating fin 162 There is gap between two radiating fins 163.
The both sides of the radiating fin 162 in the middle of cooling base 161 are equipped with radiating fin 163, and both sides radiating Alternating inclinations are outwards arranged in the both sides of radiating fin 162 to fin 163 successively;Positioned at the radiating fin 162 on the both sides of cooling base 161 Equal side is provided with radiating fin 163.The alternating inclinations of radiating fin 163 are outwards arranged in the both sides of radiating fin 162, are easy to air horizontal To flowing, air and the longitudinal direction and meeting for vertical direction air of lateral flow increase the mobility and irregularity of Laminar Flow, So as to disturb and destroy Laminar Flow, the coefficient of heat transfer is improved, so as to improve radiating efficiency, prevent temperature too high to luminescence chip 120 produce loss, are further conducive to extending service life of the present utility model.
Radiating fin 163 and the setting at an acute angle of radiating fin 162.It is more convenient for increasing the lateral flow of air, improves heat exchange Coefficient, improves radiating efficiency, is further conducive to extending service life of the present utility model.
As shown in figure 4, being the structural representation of packaging body of the present utility model.
Packaging body 150 includes substrate layer 151, low-refraction monomer film layer 152, the and of fluorescent adhesive layer 153 successively from inside to outside High refractive index monomers film layer 154;The high refractive index monomers film layer 154 is provided with and height away from the surface of the side of fluorescent adhesive layer 153 The roughening structure 155 of the one of refractive index monomer film layer 154;The roughening structure 155 is the surface of height refractive index monomer film layer 152 Array of protrusions.Packaging body 150 is provided with two refracting layers, and the refracting layer refractive index near luminescence chip 120 is small, away from luminous core The refracting layer refractive index of piece 120 is big, and this structure reduces the refringence between luminescence chip 120 and air, reduces full hair The loss amount penetrated, allows more light through outside the directive of packaging body 150, improves luminosity of the present utility model, and fluorescence Glue-line 153, away from pyrotoxin, so as to reduce the decay of fluorescent material, is further conducive to extending this reality away from luminescence chip 120 With new service life.
It is roughened the setting of structure 155, the anaclasis that luminescence chip 120 sends can be gone out, reduces the full transmitting of emergent light, Further be conducive to improving luminous flux, improve luminosity of the present utility model.
Low-refraction monomer film layer 152 is methyl class layer of silica gel, and the high refractive index monomers film layer 154 is phenyl class silica gel Layer.Methyl class silica gel heat-resisting ability is strong, elasticity is high, good reliability, and its resistance to elevated temperatures reduces deformation, and elasticity can be delayed well Rush to most of stress of luminescence chip 120, reduce gold thread 140 break or loose contact the probability that occurs of phenomenon so that Improve the reliability and service life of light emitting diode 100;Phenyl class silica gel hardness is high, and moisture-inhibiting oxygen transmission rate is low, can be right The internal structure of light emitting diode 100 plays a very good protection, and is further conducive to extending the use of light emitting diode 100 Life-span.
Fluorescent adhesive layer 153 is flat with the faying face of low-refraction monomer film layer 152 and high refractive index monomers film layer 154 Face, is conducive to being uniformly distributed for fluorescent material, it is ensured that light uniform, is further conducive to improving luminosity.
On the one hand, circuit board of the present utility model 110 is including insulation board 111, positioned at the length direction two sides of insulation board 111 High heat conductivity metal heat sink piece 112, the heat-conductive characteristic of metal heat sink piece 112 is good, and heat dissipation channel is unimpeded, thermal resistance is small, in time will The heat of luminescence chip 120 is conducted so that the knot of light emitting diode 100 heats up slowly, prevents luminescence chip 120 due to temperature mistake It is high and produce light decay, extend its service life, luminosity is big, reducing energy consumption.Second aspect, is provided with radiating subassembly 160, and height is led Thermal conductive metallic is heat sink, and a heat for 112 conduction is conducted into external environment through radiating subassembly 160, further prevents luminescence chip 120 temperature are high, are conducive to extending service life of the present utility model.The third aspect, radiating subassembly 160 includes being connected to circuit board 110 and cooling base 161, several radiating fins 162 for being installed on cooling base 161 of conducting strip, also including being arranged at Several radiating fins 163 of the length direction of radiating fin 162, have gap, heat radiating fin between two neighboring radiating fin 163 The setting of piece 162 and radiating fin 163, increases area of dissipation, accelerates the heat exchange of heat and the external world, and radiating efficiency is high, Be conducive to extending the service life of light emitting diode 100.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed, But therefore can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that common for this area For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (6)

1. a kind of long-term durability luminous diode, it is characterised in that:Including circuit board, it is connected to the luminescence chip of circuit board, sets Gold thread in the electrode on luminescence chip, connection electrode and circuit board, packaging body outside luminescence chip is covered at, also including setting It is placed in radiating subassembly of the circuit board away from luminescence chip side;The circuit board is including insulation board, positioned at insulation board length direction The high heat conductivity metal heat sink piece of two sides, the gold thread is electrically connected with to be formed back with two high heat conductivity metal heat sink pieces respectively Road;The radiating subassembly include being connected to the cooling base of circuit board and conducting strip, be installed on cooling base several dissipate Hot fin, also including being arranged at several radiating fins of radiating fin length direction, has between two neighboring radiating fin Gap.
2. a kind of long-term durability luminous diode according to claim 1, it is characterised in that:Dissipating in the middle of cooling base The both sides of hot fin are equipped with radiating fin, and the radiating fin of both sides alternating inclinations are outwards arranged in radiating fin two successively Side;The equal side of radiating fin positioned at cooling base both sides is provided with radiating fin.
3. a kind of long-term durability luminous diode according to claim 2, it is characterised in that:The radiating fin and heat radiating fin Piece setting at an acute angle.
4. a kind of long-term durability luminous diode according to claim 3, it is characterised in that:The packaging body from inside to outside according to It is secondary including substrate layer, low-refraction monomer film layer, fluorescent adhesive layer and high refractive index monomers film layer;The high refractive index monomers film layer The roughening structure with high refractive index monomers film layer one is provided with away from the surface of fluorescent adhesive layer side;The roughening structure is height The array of protrusions of refractive index monomer film surface.
5. a kind of long-term durability luminous diode according to claim 4, it is characterised in that:The low-refraction monomer film layer It is methyl class layer of silica gel, the high refractive index monomers film layer is phenyl class layer of silica gel.
6. a kind of long-term durability luminous diode according to claim 5, it is characterised in that:The fluorescent adhesive layer and low refraction The faying face of rate monomer film layer and high refractive index monomers film layer is plane.
CN201621468398.2U 2016-12-29 2016-12-29 A kind of long-term durability luminous diode Expired - Fee Related CN206301842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621468398.2U CN206301842U (en) 2016-12-29 2016-12-29 A kind of long-term durability luminous diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621468398.2U CN206301842U (en) 2016-12-29 2016-12-29 A kind of long-term durability luminous diode

Publications (1)

Publication Number Publication Date
CN206301842U true CN206301842U (en) 2017-07-04

Family

ID=59205734

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621468398.2U Expired - Fee Related CN206301842U (en) 2016-12-29 2016-12-29 A kind of long-term durability luminous diode

Country Status (1)

Country Link
CN (1) CN206301842U (en)

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GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 523000 1203, C District, Tianan Digital City, 1 Golden Road, Nancheng street, Dongguan, Guangdong, 1

Patentee after: Guangdong Hui Xin Electronic Technology Co., Ltd.

Address before: 523000 1203, C District, Tianan Digital City, 1 Golden Road, Nancheng street, Dongguan, Guangdong, 1

Patentee before: Dongguan Hui Hui Electronic Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170704

Termination date: 20201229