TW200944562A - Metal-coated resin molded article, and process for production thereof - Google Patents

Metal-coated resin molded article, and process for production thereof Download PDF

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Publication number
TW200944562A
TW200944562A TW98109451A TW98109451A TW200944562A TW 200944562 A TW200944562 A TW 200944562A TW 98109451 A TW98109451 A TW 98109451A TW 98109451 A TW98109451 A TW 98109451A TW 200944562 A TW200944562 A TW 200944562A
Authority
TW
Taiwan
Prior art keywords
metal
liquid crystalline
crystalline polyester
substrate
mass
Prior art date
Application number
TW98109451A
Other languages
English (en)
Chinese (zh)
Inventor
Naoto Ikegawa
Satoshi Okamoto
Sadanobu Iwase
Original Assignee
Panasonic Elec Works Co Ltd
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd, Sumitomo Chemical Co filed Critical Panasonic Elec Works Co Ltd
Publication of TW200944562A publication Critical patent/TW200944562A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW98109451A 2008-03-25 2009-03-24 Metal-coated resin molded article, and process for production thereof TW200944562A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008078442A JP5005593B2 (ja) 2008-03-25 2008-03-25 金属被覆樹脂成形品及びその製造方法

Publications (1)

Publication Number Publication Date
TW200944562A true TW200944562A (en) 2009-11-01

Family

ID=41113453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98109451A TW200944562A (en) 2008-03-25 2009-03-24 Metal-coated resin molded article, and process for production thereof

Country Status (3)

Country Link
JP (1) JP5005593B2 (ja)
TW (1) TW200944562A (ja)
WO (1) WO2009119247A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102338614B1 (ko) * 2014-06-30 2021-12-13 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 방향족 폴리에스테르 함유 경화성 수지 조성물, 경화물, 전기·전자 부품 및 회로 기판
WO2022181374A1 (ja) * 2021-02-24 2022-09-01 富士フイルム株式会社 ポリマーフィルム、積層体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI991006A (fi) * 1999-05-03 2000-11-04 Optatech Oy Uudet nestekiteiset polymeerit
JP2002294039A (ja) * 2001-03-28 2002-10-09 Toray Ind Inc 液晶性樹脂組成物
JP2002294040A (ja) * 2001-03-28 2002-10-09 Toray Ind Inc 複合体用液晶性樹脂組成物及びその複合体
JP4302467B2 (ja) * 2002-12-27 2009-07-29 ポリプラスチックス株式会社 非晶質全芳香族ポリエステルアミド組成物
JP4783038B2 (ja) * 2004-03-10 2011-09-28 パナソニック電工株式会社 金属被覆樹脂成形品およびその製造方法

Also Published As

Publication number Publication date
JP5005593B2 (ja) 2012-08-22
JP2009227935A (ja) 2009-10-08
WO2009119247A1 (ja) 2009-10-01

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