TW200942809A - Substrate surface inspection apparatus and method - Google Patents

Substrate surface inspection apparatus and method

Info

Publication number
TW200942809A
TW200942809A TW097146750A TW97146750A TW200942809A TW 200942809 A TW200942809 A TW 200942809A TW 097146750 A TW097146750 A TW 097146750A TW 97146750 A TW97146750 A TW 97146750A TW 200942809 A TW200942809 A TW 200942809A
Authority
TW
Taiwan
Prior art keywords
substrate
supports
relative position
imaging
inspection apparatus
Prior art date
Application number
TW097146750A
Other languages
English (en)
Inventor
Hiroshi Wakaba
Yoshinori Hayashi
Koichi Miyazono
Yoko Ono
Hideki Mori
Shozo Kawasaki
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200942809A publication Critical patent/TW200942809A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
TW097146750A 2007-12-03 2008-12-02 Substrate surface inspection apparatus and method TW200942809A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007311983A JP5128920B2 (ja) 2007-12-03 2007-12-03 基板表面検査装置及び基板表面検査方法

Publications (1)

Publication Number Publication Date
TW200942809A true TW200942809A (en) 2009-10-16

Family

ID=40717570

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097146750A TW200942809A (en) 2007-12-03 2008-12-02 Substrate surface inspection apparatus and method

Country Status (7)

Country Link
US (1) US8508246B2 (zh)
JP (1) JP5128920B2 (zh)
KR (1) KR101140989B1 (zh)
CN (1) CN101883979B (zh)
DE (1) DE112008003262B4 (zh)
TW (1) TW200942809A (zh)
WO (1) WO2009072389A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101227706B1 (ko) * 2008-10-14 2013-01-29 시바우라 메카트로닉스 가부시키가이샤 화상 처리 방법, 화상 처리 장치 및 이 화상 처리 장치를 이용한 표면 검사 장치
CN101929846B (zh) * 2009-06-18 2012-05-30 中芯国际集成电路制造(上海)有限公司 扫描晶圆表面图像的方法
JP6004517B2 (ja) * 2011-04-19 2016-10-12 芝浦メカトロニクス株式会社 基板検査装置、基板検査方法及び該基板検査装置の調整方法
JP5791101B2 (ja) * 2011-05-16 2015-10-07 芝浦メカトロニクス株式会社 貼り合せ板状体検査装置及び方法
WO2013002179A1 (ja) * 2011-06-27 2013-01-03 株式会社ニコン パターンの評価方法、パターン評価装置、および半導体装置の製造方法
JP5753516B2 (ja) * 2011-11-28 2015-07-22 東京エレクトロン株式会社 基板撮像装置及び基板撮像方法
JP5482958B1 (ja) * 2013-11-25 2014-05-07 富士ゼロックス株式会社 検査装置
JP6423767B2 (ja) * 2015-08-19 2018-11-14 シャープ株式会社 太陽光発電装置の監視装置および太陽光発電装置の監視方法
US11138722B2 (en) * 2018-12-21 2021-10-05 Kla-Tencor Corporation Differential imaging for single-path optical wafer inspection
TWI707130B (zh) * 2019-12-31 2020-10-11 由田新技股份有限公司 移載裝置、光學檢測設備及光學檢測方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08105937A (ja) * 1994-10-06 1996-04-23 Advantest Corp デバイス・テスタ用オートハンドラ及びその装置のデバイス測定方法
JP3744176B2 (ja) 1998-01-30 2006-02-08 株式会社Ｓｕｍｃｏ 半導体ウェーハの検査方法およびその装置
JPH11330798A (ja) * 1998-05-19 1999-11-30 Fuji Mach Mfg Co Ltd 電気部品装着方法およびシステム
KR20040039372A (ko) * 2001-09-21 2004-05-10 올림푸스 가부시키가이샤 결함 검사 장치
CN1932646B (zh) * 2005-09-14 2011-11-30 东海商事株式会社 曝光装置
JP2007147441A (ja) 2005-11-28 2007-06-14 Nikon Corp 検査装置
JP4878907B2 (ja) * 2006-05-08 2012-02-15 三菱電機株式会社 画像検査装置およびこの画像検査装置を用いた画像検査方法

Also Published As

Publication number Publication date
DE112008003262B4 (de) 2013-05-16
KR101140989B1 (ko) 2012-05-02
WO2009072389A1 (ja) 2009-06-11
CN101883979A (zh) 2010-11-10
DE112008003262T5 (de) 2010-09-16
US8508246B2 (en) 2013-08-13
JP2009133797A (ja) 2009-06-18
CN101883979B (zh) 2012-07-04
JP5128920B2 (ja) 2013-01-23
KR20100072079A (ko) 2010-06-29
US20100310152A1 (en) 2010-12-09

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