TW200940668A - Circuit member connecting adhesive and semiconductor device - Google Patents
Circuit member connecting adhesive and semiconductor device Download PDFInfo
- Publication number
- TW200940668A TW200940668A TW097146985A TW97146985A TW200940668A TW 200940668 A TW200940668 A TW 200940668A TW 097146985 A TW097146985 A TW 097146985A TW 97146985 A TW97146985 A TW 97146985A TW 200940668 A TW200940668 A TW 200940668A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit member
- member connecting
- semiconductor device
- connecting adhesive
- resin
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- H01L2224/73101—Location prior to the connecting process on the same surface
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- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007312215 | 2007-12-03 |
Publications (1)
Publication Number | Publication Date |
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TW200940668A true TW200940668A (en) | 2009-10-01 |
Family
ID=40717675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097146985A TW200940668A (en) | 2007-12-03 | 2008-12-03 | Circuit member connecting adhesive and semiconductor device |
Country Status (3)
Country | Link |
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JP (1) | JP5263158B2 (zh) |
TW (1) | TW200940668A (zh) |
WO (1) | WO2009072497A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5510646B2 (ja) * | 2010-03-18 | 2014-06-04 | スタンレー電気株式会社 | 車両用灯具 |
CN111480218B (zh) * | 2017-12-18 | 2023-07-21 | 株式会社力森诺科 | 半导体装置、半导体装置的制造方法和粘接剂 |
KR102185773B1 (ko) * | 2020-07-08 | 2020-12-02 | 주식회사 정석케미칼 | 차선 도색 성능 향상을 위한 속경화 수용성 노면표지용 도료 조성물 및 노면 시공방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2644717B2 (ja) * | 1983-12-06 | 1997-08-25 | 松下電器産業株式会社 | シート状異方導電性接着剤 |
JP3516379B2 (ja) * | 1996-12-10 | 2004-04-05 | 住友ベークライト株式会社 | 異方導電フィルム |
JPH11100562A (ja) * | 1997-09-26 | 1999-04-13 | Sumitomo Bakelite Co Ltd | 多層プリント配線板用層間絶縁接着剤及び銅箔 |
JP3358574B2 (ja) * | 1999-01-28 | 2002-12-24 | ソニーケミカル株式会社 | 異方性導電性接着剤 |
JP4097379B2 (ja) * | 1999-01-29 | 2008-06-11 | 松下電器産業株式会社 | 電子部品の実装方法及びその装置 |
JP3417354B2 (ja) * | 1999-08-19 | 2003-06-16 | ソニーケミカル株式会社 | 接着材料及び回路接続方法 |
JP2001126541A (ja) * | 1999-10-28 | 2001-05-11 | Sumitomo Bakelite Co Ltd | 異方導電フィルム及び電気・電子部品 |
-
2008
- 2008-12-02 WO PCT/JP2008/071897 patent/WO2009072497A1/ja active Application Filing
- 2008-12-02 JP JP2009523890A patent/JP5263158B2/ja not_active Expired - Fee Related
- 2008-12-03 TW TW097146985A patent/TW200940668A/zh unknown
Also Published As
Publication number | Publication date |
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WO2009072497A1 (ja) | 2009-06-11 |
JP5263158B2 (ja) | 2013-08-14 |
JPWO2009072497A1 (ja) | 2011-04-21 |
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