TW200940216A - A method for making composite sputtering targets and the targets made in accordance with the method - Google Patents

A method for making composite sputtering targets and the targets made in accordance with the method Download PDF

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Publication number
TW200940216A
TW200940216A TW098104770A TW98104770A TW200940216A TW 200940216 A TW200940216 A TW 200940216A TW 098104770 A TW098104770 A TW 098104770A TW 98104770 A TW98104770 A TW 98104770A TW 200940216 A TW200940216 A TW 200940216A
Authority
TW
Taiwan
Prior art keywords
composite
sputter
bottom plate
sputtering
plunger
Prior art date
Application number
TW098104770A
Other languages
English (en)
Chinese (zh)
Inventor
Scott Campbell
Original Assignee
Sci Engineered Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/319,754 external-priority patent/US20100178525A1/en
Application filed by Sci Engineered Materials Inc filed Critical Sci Engineered Materials Inc
Publication of TW200940216A publication Critical patent/TW200940216A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/0466Alloys based on noble metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/04Alloys based on a platinum group metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • B22F2003/145Both compacting and sintering simultaneously by warm compacting, below debindering temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F2003/247Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10Processes characterised by the sequence of their steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
TW098104770A 2008-03-20 2009-02-13 A method for making composite sputtering targets and the targets made in accordance with the method TW200940216A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7012508P 2008-03-20 2008-03-20
US12/319,754 US20100178525A1 (en) 2009-01-12 2009-01-12 Method for making composite sputtering targets and the tartets made in accordance with the method

Publications (1)

Publication Number Publication Date
TW200940216A true TW200940216A (en) 2009-10-01

Family

ID=41091197

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098104770A TW200940216A (en) 2008-03-20 2009-02-13 A method for making composite sputtering targets and the targets made in accordance with the method

Country Status (4)

Country Link
EP (1) EP2268434A1 (de)
JP (1) JP2011517730A (de)
TW (1) TW200940216A (de)
WO (1) WO2009117043A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102332893B1 (ko) * 2015-03-19 2021-12-01 엘티메탈 주식회사 원소재 저감을 위한 이종금속 접합형 귀금속 스퍼터링 타겟의 제조방법 및 이로부터 제조된 귀금속 스퍼터링 타겟
KR102263238B1 (ko) * 2015-03-20 2021-06-10 엘티메탈 주식회사 스퍼터링 타겟용 소결체, 이를 포함하는 스퍼터링 타겟 및 그 제조방법
CN104894525B (zh) * 2015-06-24 2017-07-04 沈阳东创贵金属材料有限公司 一种用于真空磁控溅射铂铑合金靶材及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397050A (en) * 1993-10-27 1995-03-14 Tosoh Smd, Inc. Method of bonding tungsten titanium sputter targets to titanium plates and target assemblies produced thereby
US5863398A (en) * 1996-10-11 1999-01-26 Johnson Matthey Electonics, Inc. Hot pressed and sintered sputtering target assemblies and method for making same
US6042706A (en) * 1997-01-14 2000-03-28 Applied Materials, Inc. Ionized PVD source to produce uniform low-particle deposition
US5963778A (en) * 1997-02-13 1999-10-05 Tosoh Smd, Inc. Method for producing near net shape planar sputtering targets and an intermediate therefor
US6042777A (en) * 1999-08-03 2000-03-28 Sony Corporation Manufacturing of high density intermetallic sputter targets
US6596131B1 (en) * 2000-10-30 2003-07-22 Honeywell International Inc. Carbon fiber and copper support for physical vapor deposition target assembly and method of forming
US7175802B2 (en) * 2001-09-17 2007-02-13 Heraeus, Inc. Refurbishing spent sputtering targets
US7431195B2 (en) * 2003-09-26 2008-10-07 Praxair S.T. Technology, Inc. Method for centering a sputter target onto a backing plate and the assembly thereof
US20070012557A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc Low voltage sputtering for large area substrates

Also Published As

Publication number Publication date
JP2011517730A (ja) 2011-06-16
WO2009117043A1 (en) 2009-09-24
EP2268434A1 (de) 2011-01-05

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