TW200939372A - Method and device for wire bonding - Google Patents

Method and device for wire bonding Download PDF

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Publication number
TW200939372A
TW200939372A TW097146529A TW97146529A TW200939372A TW 200939372 A TW200939372 A TW 200939372A TW 097146529 A TW097146529 A TW 097146529A TW 97146529 A TW97146529 A TW 97146529A TW 200939372 A TW200939372 A TW 200939372A
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Taiwan
Prior art keywords
bonding
wire
plasma
pad
bonding wire
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TW097146529A
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English (en)
Inventor
Ernst Wandke
Christoph Laumen
Pang Ling Hiew
Boon Ann Tan
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Linde Ag
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Application filed by Linde Ag filed Critical Linde Ag
Publication of TW200939372A publication Critical patent/TW200939372A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/34—Contacts characterised by the manner in which co-operating contacts engage by abutting with provision for adjusting position of contact relative to its co-operating contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
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    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8501—Cleaning, e.g. oxide removal step, desmearing
    • H01L2224/85013—Plasma cleaning
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    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85043—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a flame torch, e.g. hydrogen torch
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    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Plasma Technology (AREA)

Description

200939372 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於藉助一含銅接合線進行打線接合 之裝置，該用於打線結合之裝置囊括一用於該接合線之引 導器及一用於熔杷一接合線之一經提供用於—至一接合墊 之連接之部分之裝置，其中以如下方式體現該用於該接合 線之引導器，該接合線之該已熔化部分在一接合室中與一 接合墊接觸。此外，本發明係關於一種用於打線接合之方 ❹ 法。 【先前技術】 已知許多用於打線接合之方法及裝置。打線接合表示一 種連接方法，藉助於該方法電氣工程組件（特定而言，微 電子組件或非電子（微）組件）具有電連接及/或使用極細的 線（所謂的接合線）連接至一晶片。 該等已知方法在很大程度上使用金線或一金合金作為接 合線。此外’使用鋁線且亦銅線。 響 然而’在過去’使用銅線或含銅接合線已顯示出似乎係 由附著至其之氧化物引起之困難。通常，銅至少稍微地被 氧化。一含銅接合線之導電性及一接合連接之接頭強度因 存在氧化物而減小。 文件U.S. 6,234,376揭示一種用於使用一保護性氣體進行 打線接合之方法及裝置，該保護性氣體減小一氧化物之形 成且因此使得能夠使用銅或鋁線作為接合線》 【發明内容】 135211.doc -6 - 200939372 此外，術語含銅接合線係包括純銅線以及包括至少 的銅含量之線合金。本發明之—目標係提供_種用於藉助 一含銅接合線進行打線接合之經改良裝置及經改良方法。 所提出之目標根據該裝置因提供至少一個電漿噴嘴而解 決，在該至少-個電时嘴之幫訂…電討作用於接 合線之該部分*/或接合衫/或接合室（其提㈣於至該接 合墊之連接）上。 ❻
因存在電漿，因此有利地發生接合線及接合墊表面之還 原及活化。清潔該連接方法電毁作用於其上之夥伴且活化 其表面。有利地，此回應於藉助一根據本發明之裝置打線 接合而導致尤其良好結果。存在電漿可因此減小該接合線 之經提供用於至接合墊之連接及/或接合墊及/或接合室之 部分（該接合線之已嫁化部分）之可用氧化物，且因此可在 ，大程度上防止其再生，且因此可達成—幾乎無氧化物之 高品質及可靠性之連接。 較佳地，以如下方式安裝電漿喷嘴，電漿作用於該接合 線之經提制於至接合塾之連接之已耗部分上。根據本 發明之-有利發展，以如下方式安裝電漿喷嘴，電衆另外 或另-選擇為作用於接合塾上。本發明之一尤其有利實施 例提供整個接合室’因& ’電漿作用於該接合線之該至少 ㈣化部分及接合塾及（若可適用）該裝置（例如，用於炫化 之裝置)之鄰近部分上’且該電漿以如下方式分佈，該等 組件至少部分地由電漿環繞。 尤其有利地’ 可分別將該電漿喷嘴之定向及/或定位調 135211.doc 200939372 整及選擇成目的引導，以使得一離開該電漿噴嘴之電聚嘴 流到達一作為目標之先前所選區域。已分別提及該裝置之 尤其有利區域及組件。電漿噴嘴可體現為一噴嘴對。亦已 證明一具有複數個（例如，3、4、5)彼此接近之噴嘴（如所 謂的噴嘴批）之實施例在某些情形下有利。尤其有利地， 該（等）電漿噴嘴亦可囊括複數個用於擴展該電漿噴流之遞 送埠》
❹ 可能建立以下電漿組分對本發明尤其有利：氫氣、氬氣 及其混合物以及氫氣與氮氣混合物亦連同另—氬氣添加 物。 較佳地，電漿在大氣壓力下產生。此具有並非絕對需要 一其中產生電漿之特定室之優點。然而，亦可（例如）回應 於一少於10 mbar之壓力體現一低壓電漿。 尤其有利地，電漿噴嘴之定向因此體現為可調節，因此 以使得-離開該電漿喷嘴之電衆喷流到達—作為目標之先 前所選區域》 根據本發明之另一有利實施例，電漿喷嘴安裝於其中接 合線離開引導器之區域中。例如，電漿噴流因此指向該接 合線。較佳地，該電漿喷流以直角定向於該接合線之縱 轴。 根據本發明之另—有利實施例，提供—第二電衆喷嘴。 較佳地’此第一電漿噴嘴以如下方式定向，其作用於一不 同於該第一電毁噴嘴之區域上。在替代實施例中，該第二 電聚噴嘴可感測對相同區域之一允入或可作用於一直接鄰 135211.doc 200939372 接區域上，以便在這樣做時經允入區域增加。 該電漿噴嘴連接至一電漿產生單元，例如，該電漿產生 單70又連接至一氣體供應，其中該電漿產生單元囊括至少 兩個電極，其間可實現放電，在其幫助下，在經由該氣體 供應供應之製程氣體中產生一電漿。 根據本發明之一尤其較佳實施例，該第二電衆喷嘴指向 肩接合墊，特定以直角到達該接合墊。所述電漿積極效應 係藉助此實施例以一尤其不同方式達成。 0 本發明一般而言適於打線接纟，且特定而言適於球形接 合且亦適於楔形接合。 本文中將首先詳細闡述本發明之一適於球形接合之實施 例作為一實例··當進行球形接合時，一用於打線接合之裝 置具有一用於接合線之引導器，該引導器體現為毛細管且 囊括一毛細管頭，接合線引導通過該毛細管頭。此外，該 裝置囊括一用於接收一氣氛之|，其囊括_第一及第二開 口，其中該兩個開口可沿一橫向於該管之軸之方向在彼此 頂邛上對準，且其中至少該毛細管頭之尖端可引導通過該 #開口。此外，提供一用於熔化接合線之自該毛細管頭之 尖端突出之端部之裝置，以使得該接合線之此端部以一球 形方式形成並可藉由通過至少該毛細管頭之該尖端而與一 接合墊接觸。 在此實例之上下文中，當電漿噴嘴平行於該管之軸安裝 在該管中時尤其有利的。在替代實施例中，該電浆嘴嘴可 安裝成相對於該管之軸傾斜。特定而言其可以如下方式 \352U.doc •9· 200939372 傾斜，離開該電裂噴嘴之電漿喷流之噴流方向面向接合 塾°根據—尤其較佳發展，可以如下方式體現及安裝該電 漿嘴嘴’ Μ喷流仙於其上之彼—區域包括該接合線之 a ρ及用於;^化該接合線之自該毛細管頭之尖端突出之端 部之裝置之火焰放電°稍後將閣述用於熔化該接合線之裝 置之有利實施例。 作為另實例，將詳細闡述本發明之一適於楔形接合一 :施例作為另一實例：當進行楔形接合時接合線亦藉助 一毛細管或藉助-接合楔引導。然而，對於本實施例不 提供接合線之-球形、已溶化端部。而是，使該接合線在 任一可選位置處熔化且然後使其與接合墊接觸。 對於許多應用而言’ 一球形及楔形接合結合尤其有利， 其中一第一連接體現為球形接合且一第二連接體現為楔形 接合。 較佳地，用於接合線之引導器體現為可移動，特定而言 體現為可垂直及/或水平移動。 已證明許多裝置適於熔化本發明之接合線。將挑選出兩 種可能性且下文對其進行更詳細闡述。 作為一種用於熔化接合線之裝置，提供一囊括一電極之 EFO裝置（電媳火裝置），該EF〇裝置以其達成—電弧放電 之方式安裝。 在替代實施例中’-富氫氫氧氣火焰可充當—用於溶化 接合線之裝置，其以如下方式體現，其加熱及熔化接合線 之經提供用於-至接合塾之連接之部分。纟—球形接合之 135211.doc -10· 200939372 it形下# 口線之端部藉此將以一球形發生形變。 較佳地’―產電漿生單元可用於產生自電㈣嘴逸出之 電漿。較佳地’該電漿產生單元囊括以下組件：_用 聚產生之氣體供應，其在所有情形下與一: 氮氣及/或氮氣之容器接觸1可適用，則-混合單元Ϊ 有利地用於預混一期穿知人仏 月望組σ物。較佳地，製程氣體經由 體供應之流人係特定而言藉助扼流加以利 ❹
地，提供:每小時小於3立方米之總通過量。面有= 電漿產生單兀藉此連接至該電漿喷嘴且另一方面連接至該 氣體供應，其中該電漿產生單元囊括至少兩個電極 產生放電且在一經由該氣體供應提供之製程氣體中產生一 電漿。 根據本發明之-極有利發展，以一高達細t之電浆、田 度為目標。已證明介於自8〇至⑽範圍内之一溫度尤其 有利。 、 參考該方法，所提出之目標因使用至少—個電漿喷嘴而 解決，在該至少-個電㈣嘴之幫助下，—電㈣用於接 合線之經提供用於該至接合墊之連接及/或接合 合室之部分上。 ’以一例示性方 對於熔化接合線以及對於產生電漿而言 式參考本實施例之已描述的可能性。 較佳地，以一目標定向方式調節離開電漿喷嘴之一電漿
喷流，以使得該電漿作用於作A »·叩％ 馮目铋之一預先所選區域 上0 135211.doc -11 · ❹
如，支撐件7可體現為-印刷電路板7。在接合期間藉助細 線（接合線2)連接之接合墊4位於兩個組件（微晶片9及支撐 件7)上。 200939372 驟本=!適於球形接合且適於横形接合方法及方法步 =本發月亦可用於裝配接合方法中， 括球形接合及楔形接合之方法步驟。 f_下囊 =明囊括許多優點，例如將在本文中再次提及之連接 可靠性及恆定品質之增加。 【實施方式】 詳言之’圖1顯示-用於一含鋼接合線2之引導器！及一 用於炫化—接合線2之—經提供用於—至微晶片9之連接之 部分之裝置3。微晶片9將連接至—支推件7作為基座。例 以如下方式體現用於接合線2之引導器〗，接合線2之已 熔化部分在一接合室5中與一接合墊4接觸。根據本發明， 提供一電漿喷嘴0，在其幫助下，電漿作用於接合線2之經 &供用於至微晶片9之接合塾4之之連接部分上。此處，電 聚喷嘴6囊括複數個用於擴展電漿喷流之遞送埠8。引導器 1體現為能夠垂直移動且可降低以將該接合線連接至接合 塾4 〇 【圖式簡單說明】 上文已藉助隨附圖式中所圖解說明之例示性實施例更詳 細地界定本發明及本發明之其他實施例，其中： 圖1係一根據本發明之用於打線接合之裝置。 【主要元件符號說明】 135211.doc -12· 200939372 1 2 3 4 5 6 . 7 8 Φ 9 引導器 接合線 裝置 接合墊 接合室 電漿噴嘴 支撐件 遞送埠 微晶片
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Claims (1)

  1. 200939372 十、申請專利範圍：
    1. 一種用於打線接合之裝置，其藉助—含銅接合線（2)進行 打線結合以將一組件（9)連接至一支樓件（7)，其中在所 有情形下在組件（9)上以及在支樓件⑺上提供至少—個 接合墊（4) ’該用於打線結合之裝置囊括一用於該接合線 之引導器（1)及-用於溶化一接合線⑺之一經提供用於 至該等接合墊（4)中之—者之連接之部分之裝置（3)， 其中以如下方式體現該用於該接合線（2)之引導器〇), 在所有情形下該接合線⑺之該已熔化部分在—接合室 (5)中與至少一個接合墊（4)接觸，其特徵在於：提^至 少一個電漿喷嘴（6)，在其幫助下，一電浆可作用於該接 合線（2)之該經提供用於該至該接合墊（4)之連接之部分 及/或該接合墊（4)及/或該接合室（5)上。 2，如明求項1之裝置，其特徵在於：該電漿噴嘴（6)之定向 可經調節以使得一離開該電漿喷嘴（6)之電漿喷流到達作 為一目標之一先前所選區域。 3. 如請求項！或2之裝置，其特徵在於：該電裂喷嘴（6)安裝 在該其中該接合線（2)離開該引導器（1)之區域中。 "" 4. 如請求項丨或2之裝置，其特徵在於：提供一第二電衆噴 5. 如明求項4之裝置，其特徵在於：該第二電漿喷嘴（6)指 向該接合墊（4)，特定而言以直角到達該接合墊（4)。曰 6. 種用於打線接合之方法，其藉助一含銅接合線（2)進行 打線接合以將一組件（9)連接至一支撐件（7)，其中在所 135211.doc 200939372 有情形下在組件（9)上以及在支採件⑺上提供至少一個 接合墊（4)，其中使用一引導器⑴使該接合線⑺與一用 於嫁化該接合線（2)之裝置⑺進行-有效連接，以使得 該接合線（2)之-經提供用於一至該等接合塾⑷中之一 者之連接之部㈣化且在所有情形下使該接合線⑺之該 已熔化部分在一接合室(5)中與至少-個接合墊(4)接 觸，其特徵在於··使用至少一個電漿噴嘴⑹，在其幫助 下’一電漿作用於該接合線⑺之該經提供用於該至該接 合塾（4)之連接之部分及/或該接合墊⑷及/或該接合室⑺ 7. 如請求項6之方法，其特徵在於：將一離開該電漿噴嘴 ⑹之電㈣流調節成目標定向以使得該電漿作用於一先 前所選區域上作為目標。 8. 如請求項6或7之方法，其特徵在於：使用一第二電漿喷 嘴（6)。 9·如請求項6或7之方法，其特徵在於：―離開該第二電浆 喷嘴⑹之電聚噴流指向該接合墊⑷，特定而言以直角 到達該接合墊（4)。 135211.doc -2-
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EP2065115B1 (de) 2011-02-23
US20090140029A1 (en) 2009-06-04
ATE499173T1 (de) 2011-03-15
CN101444872A (zh) 2009-06-03

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