200937411 九、發明說明 【發明所屬之技術領域】 本發明，例如，係有關於用以如同光碟之記錄層一般 而在基板上之樹脂處形成凹凸的技術，特別是，係有關於 用以將被形成在壓模上之凹凸轉印至樹脂處的轉印裝置及 轉印方法。 0 【先前技術】 在CD或是DVD等之光碟片中，係有藉由被稱爲凹 坑之突起而被記錄有資訊者。在此種光碟片之製造工程中 ，在基板之表面處形成凹坑之作業，係成爲不可或缺。凹 坑列之形成，係藉由下述之方法而進行：將被形成有對應 於凹坑之凹凸的壓模作爲模具，並將凹凸轉印至基板處， 而後，於該表面上形成反射膜。 而，壓模所致之凹凸的轉印，例如，係藉由在基板上 Q 塗佈樹脂，並將該樹脂推壓抵接於壓模之凹凸面上，再使 該樹脂硬化，而進行之。硬化後，藉由將壓模從基板而剝 * 離，在基板上係成爲殘留有微小之凹凸。在此種壓模中， 係存在有軟壓模與金屬壓模。軟壓模，係藉由與基板相同 之材質、例如藉由聚碳酸酯而被製造，並在從基板上而被 剝離之後被作廢棄。金屬壓模，係爲金屬製，而能夠以1 枚來進行數萬枚之轉印。 然而，對於上述一般之經由凹凸面上的反射膜而被製 造之記錄層，係有必要以當在碟片上被照設有在資訊之讀 -4- 200937411 寫中所使用之雷射時能安定地被形成點（spot )的方式， 而設爲沒有彎曲或是歪斜的平坦者。故而，在此種碟片中 ，對於被形成有Η凸前所被塗佈之樹脂的膜厚，係希望能 夠盡可能的成爲均一。 在此種對於基板上之樹脂的塗佈中，係有使用將滴下 至基板上之樹脂藉由使基板作旋轉而以離心力來將其展延 * 的旋轉塗佈之情況。但是，當經由旋轉塗佈來將樹脂作塗 @ 佈的情況時，由於離心力，相對於基板之內週部，外週部 的膜厚係會變厚（例如，ΙΟμιη左右），而在基板全體上 將膜厚均一化一事，係爲困難。 爲了對此作對應，係提案有··將預先所製造之紫外線 硬化型樹脂製之薄膜貼合於基板上，並在藉由壓模而將凹 凸作了轉印後，照射紫外線而使其硬化，並打穿爲碟片形 狀的技術（參考專利文獻1 )。若藉由此種技術，則能夠 防止由於離心力所致之樹脂膜厚不均一的問題。 〇 [專利文獻1 ]日本特開2002-288894號公報 【發明內容】 [發明所欲解決之課題] 然而’當如同上述一般而使用紫外線硬化行薄膜的情 況時，由於在打穿後於碟片側會殘留有殘鬚等，因此係有 發生製品不良的可能性。又，由於有必要進行將長度長且 寬幅廣之薄膜搬送至對基板之貼合位置的作業、或是將附 有黏著膜之薄膜作剝離的作業，因此，係成爲需要複雜的 -5- 200937411 機構。而，一般所被使用之薄膜，由於相較於旋轉塗佈用 之樹脂係爲高價，因此，亦有使製品成本變高的問題。 進而，由於對聆光碟片之大容量化的需求，係亦製造 有將在樹脂上形成有反射膜之記錄層作複數重疊而多層化 了的製品。但是，當藉由上述一般之薄膜來實現此種用以 進行多層化之樹脂層的形成的情況時，係有必要將對於基 ' 板之薄膜的貼附反覆進行複數次，而使裝置更加的複雜化 U 。又，由於所使用之薄膜係增大，因此係成爲增加成本。 其次，在壓模所致之轉印中，當將壓模作剝離時，會 有發生癒著等而使凹坑破損或是變形的可能性。對於此， 在使用有薄膜的情況中，係可想見，在一部份處所發生之 變形的影響，會波及連續面的廣範圍。 爲了對此作對應，係可考慮在壓模之表面上，進行使 樹脂等容易被剝離之表面處理。但是，由於壓模係爲進行 大量之轉印者，因此，此種表面處理之耐久性係成爲問題 〇 。若是在使用軟壓模的情況時，則由於係成爲僅限於一次 之用後即丟，因此，就算是在材質本身使用剝離性良好者 ，或是進行了表面處理，耐久性亦不會變成問題。但是， 在每一次中被用後即丟的軟壓模，從成本或是環保的觀點 來看，係並不理想。因此，係以採用具有耐久性且能夠反 覆作使用的壓模爲理想。 本發明，係爲了解決上述一般之先前技術的問題點而 被提案者，其主要之目的，係在於提供一種：能夠藉由簡 易之構造，來將均一之樹脂塗佈或是記錄面之多層化以低 -6- 200937411 成本來有效率地進行的轉印裝置及轉印方法。 又，本發明之其他目的’係在於提供一種：低成本且 具有耐久性，且在轉印_至樹脂後壓模係易於剝離的轉印裝 置及轉印方法。 [用以解決課題之手段] 爲了達成上述目的，本發明之轉印裝置，其特徵爲， @ 具備有：塗佈部’係進行在基板上塗佈樹脂之處理；和硬 化部，係進行使樹脂硬化之處理；和轉印部，係進行在基 板上之樹脂處轉印壓模（stamper )的凹凸之處理；和剝 離部，係進行從基板上之樹脂處而將壓模剝離之處理；和 成膜部，係進行在被轉印有凹凸之樹脂處形成反射膜之處 理；和搬送部，係搬送基板；和控制部，係爲了製造所期 望之形態的基板，而對於前述塗佈部、前述硬化部、前述 轉印部、前述剝離部以及前述成膜部中的處理之有無、處 〇 理之順序以及處理之次數，還有前述搬送部所致之基板的 搬送路徑作控制。 其他形態之轉印方法，其特徵爲，包含有：塗佈工程 ，係進行在基板上塗佈樹脂之塗佈處理；和硬化工程，係 進行使樹脂硬化之處理；和轉印工程，係在基板上之樹脂 處轉印壓模的凹凸；和剝離工程，係進行從基板上之樹脂 處而將壓模剝離之處理；和成膜工程，係進行在被轉印有 凹凸之樹脂處形成反射膜之處理；和搬送工程’係搬送基 板，爲了製造所期望之形態的基板，而對於前述塗佈工程 200937411 、前述硬化工程、前述轉印工程、前述剝離工程以及前述 成膜工程的處理之有無、處理之順序以及處理之次數，還 有在前述搬送工程中之基恭的搬送路徑作適宜選擇。 另外，作爲其他之形態，亦可考慮有：進行在被轉印 有凹凸之樹脂上形成記錄膜之處理的成膜部或者是成膜工 程。 ' 在以上一般之發明中，由於係可一面經由搬送部來將 U 基板作搬送，一面對於樹脂之塗佈、對樹脂之凹凸的轉印 、樹脂之硬化、壓模之剝離等的處理作適宜選擇而進行， 因此，係能夠將由塗佈之反覆進行所致之樹脂的均一化或 是記錄面之多層化有效率地來進行。又，對於對相異種類 之基板之轉印，亦能夠容易地作對應。 其他之形態，係以前述硬化部係至少包含有2個之使 樹脂硬化的工程一事爲特徵。 在上述一般之形態中，藉由並不使被塗佈之樹脂即刻 0 被硬化，而分成複數次來使其硬化，能夠達成樹脂之膜厚 的均一化。 * 其他之形態，係以前述塗佈部係至少包含有2個之將 樹脂作塗佈的工程一事爲特徵。 在上述一般之形態中，藉由將樹脂分成複數次來作塗 佈，能夠實現樹脂之膜厚的均一化與厚度之調整、多層化 〇 其他之形態，係以至少包含有2個之藉由前述轉印部 以及前述剝離部而將壓模之凹凸面與樹脂接觸分離的工程 -8- 200937411 一事爲特徵。 在上述一般之形態中，藉由將壓模所致之轉印、反射 膜之形成以複數次來進行，能夠實現多層化。 其他之形態，係以前述成膜部係至少包含有2個之形 成反射膜的工程一事爲特徵。 在上述一般之形態中，藉由將反射膜之形成以複數次 _ 來進行，能夠實現多層化。 φ 其他之形態，係以前述成膜部係至少包含有2個之形 成記錄膜的工程一事爲特徵。 在上述一般之形態中，藉由將記錄膜之形成以複數次 來進行，能夠實現多層化。 其他之形態，係以下述內容爲特徵：前述塗佈部’係 包含有：塗佈對於樹脂以及金屬而密著度係爲高之樹脂的 工程；和塗佈對於樹脂其密著度爲高，而對於金屬其密著 度爲低之樹脂的工程。 φ 其他之形態，係以下述內容爲特徵：前述塗佈部，係 包含有：在接觸於壓模的凹凸面之側，塗佈密著度爲低之 " 樹脂的工程。 在上述一般之形態中，藉由將基板以及反射膜側之樹 脂設爲相對於樹脂以及金屬而密著度爲高，並將壓模側之 樹脂設爲相對於金屬而密著度爲低，能夠在防止基板與樹 脂之剝離的同時，確實地進行從壓模之剝離。又，係成爲 能夠在壓模中採用可反覆使用之金屬材料，而能夠在確保 剝離性的同時亦確保耐久性。 -9- 200937411 其他之形態，係以下述內容爲特徵：前述塗佈部’係 包含有：將黏度爲高之樹脂塗佈得較厚的工程；和將黏度 爲低之樹脂塗佈得較薄的工程： 在上述一般之形態中，藉由使用相異黏度之樹脂’在 能夠確保均一之膜厚的同時，亦可以藉由黏度爲高之樹脂 來對厚度作確保。 ' 其他之形態，係以下述內容爲特徵：係具備有：以對 U 於同一之基板而進行複數次之塗佈的方式，來使基板在前 述塗佈部處作循環之循環手段。 在上述一般之形態中，藉由設置多數之用以塗佈樹脂 的裝置，能夠將樹脂分成複數次來作塗佈，而能夠實現樹 脂之膜厚的均一化與厚度之調整、多層化。 [發明之效果] 如同上述所說明一般，若藉由本發明，則能夠提洪一 Q 種：能夠藉由簡易之構造，來將均一之樹脂塗佈或是記錄 面之多層化以低成本來有效率地進行的轉印裝置及轉印方 法。 【實施方式】 以下’針對本發明之實施型態（以下，稱爲實施形態 )，參考圖面而具體作說明。 [實施形態之構成] -10- 200937411 首先，針對在本實施形態中所使用之轉印裝置（以下 ，稱爲本裝置）之構成，參考圖1、圖3〜圖13而作說明。 另外，本裝置，係爲構成光碟片之製造裝置的一部份者， 關於被配設在本裝置之上流工程處所配置之基板的成形裝 置、被配設在本裝置之下流工程處的基板之貼合裝置、還 有在各裝置間將基板作授受之機構等，係可適用週知之各 種技術，故省略其說明。 亦即是，本裝置，係如圖1所示一般，具備有：在光 碟片用之基板P上形成反射膜之成膜部1、和在基板P上 將轉印用之樹脂作塗佈之塗佈部2、和用以在被塗佈於基 板P上之樹脂處，將壓模S之凹凸作推壓並使樹脂硬化的 轉印部3。 成膜部1，係具備有藉由濺鍍來形成反射膜之第1濺鍍 裝置12A以及第2濺鍍裝置12B。第1濺鍍裝置12A以及第2 濺鏟裝置12B，係將被設置在真空容器內之特定的堆積物 之標靶作爲陰極並作偏壓，並藉由對於此而使氬（Ar)等 之放電用氣體的離子衝突，來將構成標靶之材料以原子狀 、分子狀或是羣集狀而敲出，並在被處理物上作爲薄膜而 堆積者。於此，準備了 2個的濺鍍裝置之原因，係爲了製 造記錄層爲多層之碟片，例如，可考慮將第1濺鑛裝置 12A作爲全反射膜用，並將第2濺鍍裝置12B作爲半透過 (半反射膜）用。 又，成膜部1，係亦具備有將基板P投入、搬出之功 能。亦即是，成膜部1，係在藉由未圖示之驅動機構而在 -11 - 200937411 水平方向上旋轉之臂11的端部處’將基板p作把持（或是 吸著），藉由此，而能夠將基板p作搬送。從前一工程中 所被投入之基板P，係在臂Η之端部處被把持，並被遞交 至塗佈部2處。又，臂11 ’係接受在轉印部3中而於樹脂處 被轉印有凹凸後之基板Ρ，並搬出至下一工程處。當在被 轉印有凹凸後之基板Ρ處進行成膜的情況時，臂1 1，係將 ' 基板Ρ遞交至上述之第1濺鏟裝置12Α、第2濺鎪裝置12Β ❹處。 另外，在被投入之基板ρ中，係存在有特別未被形成 有凹凸面之平坦的平坦基板、和在前工程中以被形成有對 應於記錄面之凹凸的方式而被成型了的凹凸基板（並沒有 全反射膜）、和在被形成有凹凸的同時亦被形成有全反射 膜之成膜基板。於以下之圖3、4中，係展示平坦基板，於 圖5〜13中，係展示凹凸基板或者是成膜基板，但是，在 各裝置中之處理動作係爲相同。 0 塗佈部2，係具備有：藉由未圖示之驅動機構而在水 平方向上旋轉之臂21、和在基板Ρ上將樹脂作旋轉塗佈之 ' 第1塗佈裝置22Α以及第2塗佈裝置22Β。臂21，係將從臂 11所被遞交而來之基板Ρ把持（或者是吸著）在端部處， 並載置於第1塗佈裝置22Α或者是第2塗佈裝置22Β處，而 將旋轉塗佈後之基板Ρ遞交至轉印部3處。另外，臂21之 端部’係以將旋轉塗佈後之基板Ρ作反轉並遞交至轉印部 3處的方式’而被構成爲可進行旋轉。 第1塗佈裝置22Α，係爲如圖3以及圖5所示一般，在 -12- 200937411 被載置於旋轉台23之基板P上，將從未圖示之供給裝置所 供給之樹脂R1經由滴下裝置來作滴下，並使旋轉台23作 高速旋轉’藉由此，而以離心力來將樹脂在基板P上作展 延的裝置。圖中，24’係爲使旋轉台23作旋轉之驅動源。 又’第1塗佈裝置22 A，係具備有：對於基板p上之 樹脂R1 ’而照射紫外線（UV )之照射裝置25 (硬化裝置 )。照射裝置25，係藉由在基板P之中心孔的周圍以點狀 @ 來照射紫外線，而使其產生部分性之硬化的裝置，並以將 從光源而來之紫外線經由光纖來作導引的方式而被構成。 於光源處，係亦可使用紫外線LED，並構成爲可對照射強 度作調整。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a technique for forming concavities and convexities on a resin on a substrate as in the case of a recording layer of an optical disc, and in particular, A transfer device and a transfer method for transferring the unevenness on the stamper to the resin. 0 [Prior Art] In an optical disc such as a CD or a DVD, there is a person who has recorded information by a projection called a pit. In the manufacturing process of such an optical disc, the operation of forming pits on the surface of the substrate is indispensable. The formation of the pit train is performed by using a stamper formed with irregularities corresponding to the pits as a mold, and transferring the unevenness to the substrate, and then forming a reflective film on the surface. . Further, the transfer of the unevenness due to the stamper is performed by, for example, applying a resin to the substrate Q, pressing the resin against the uneven surface of the stamper, and hardening the resin. . After the hardening, the stamper is peeled off from the substrate, and minute irregularities remain on the substrate. In such a stamper, there are a soft stamper and a metal stamper. The soft stamper is made of the same material as the substrate, for example, made of polycarbonate, and is discarded after being peeled off from the substrate. The metal stamper is made of metal, and can transfer tens of thousands of pieces in one piece. However, it is necessary for the above-described recording layer to be manufactured through the reflective film on the uneven surface to be used when the laser used in the reading of the information is read on the disc -4-200937411. It is settled in a stable manner, and is set as a flat person without bending or skewing. Therefore, in such a disc, it is desirable that the film thickness of the resin to be applied before the formation of the concavities is uniform as much as possible. In the application of the resin on the substrate, there is a case where the resin dropped onto the substrate is spin-coated by stretching the substrate by centrifugal force. However, when the resin is coated with a cloth by spin coating, the film thickness of the outer peripheral portion is thicker (for example, about ΙΟμηη) with respect to the inner peripheral portion of the substrate due to the centrifugal force, and is on the entire substrate. It is difficult to uniformize the film thickness. In order to cope with this, it is proposed to bond a film made of a UV-curable resin produced in advance to a substrate, transfer the unevenness by a stamper, and then harden it by irradiating ultraviolet rays. And the technique of punching into the shape of the disc (refer to Patent Document 1). According to this technique, the problem of uneven thickness of the resin film due to centrifugal force can be prevented. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2002-288894 [Draft of the Invention] [Problems to be Solved by the Invention] However, when the film is cured by ultraviolet rays as in the above, it is used in the case of the disk after the puncture. There are residuals and the like remaining on the side, so there is a possibility that the product is defective. Further, since it is necessary to carry out the operation of transporting the film having a long length and a wide width to the bonding position to the substrate, or the operation of peeling off the film with the adhesive film, it is necessary to be complicated. 200937411 Institution. Further, since the film which is generally used is expensive compared to the resin for spin coating, there is also a problem that the cost of the product is increased. Further, in order to increase the capacity of the optical disc, a recording layer in which a reflective film is formed on the resin is laminated and multi-layered. However, when the above-mentioned general film is used to realize the formation of the resin layer for multilayering, it is necessary to carry out the attaching of the film for the base plate a plurality of times to make the device more complicated. Complicated U. Moreover, since the film system to be used is increased, it is an increase in cost. Next, in the transfer by the stamper, when the stamper is peeled off, there is a possibility that the pit is broken or deformed. In this case, in the case where a film is used, it is conceivable that the influence of the deformation occurring in one portion affects a wide range of the continuous surface. In order to cope with this, it is conceivable to perform surface treatment for easily peeling off the resin or the like on the surface of the stamper. However, since the stamper is a large number of transferers, the durability of such surface treatment is a problem. If the soft stamper is used, it will be lost only after it is used once. Therefore, even if the material itself is used for good peelability or surface treatment, durability will not become a problem. . However, the soft stamper that is lost after being used in each time is not ideal from the viewpoint of cost or environmental protection. Therefore, it is desirable to use a stamper which is durable and can be used in reverse. The present invention has been made in order to solve the above problems of the prior art, and its main object is to provide a uniform resin coating or a multilayered recording surface by a simple structure. A transfer device and a transfer method which are efficiently carried out at a cost of -6-200937411. Further, another object of the present invention is to provide a transfer device and a transfer method which are low in cost and durable, and which are easily peeled off after transfer-to-resin. [Means for Solving the Problem] In order to achieve the above object, a transfer device according to the present invention is characterized in that: the coating portion is configured to perform a process of applying a resin on a substrate; and the curing portion is configured to a process of curing the resin; and a transfer portion for performing a process of transferring irregularities of a stamper on a resin on the substrate; and a peeling portion for performing a process of peeling the stamper from the resin on the substrate; And a film forming unit that performs a process of forming a reflecting film on a resin to which unevenness is transferred; and a conveying unit that transports the substrate; and a control unit that manufactures the substrate in a desired form for the coating unit The presence or absence of the treatment in the hardened portion, the transfer portion, the peeling portion, and the film forming portion, the order of processing, and the number of times of processing, and the transfer path of the substrate by the transfer unit are controlled. A transfer method of another form, comprising: a coating process for performing a coating process of coating a resin on a substrate; and a curing process of performing a process of hardening the resin; and a transfer process, The unevenness of the transfer stamper at the resin on the substrate; and the peeling process is a process of peeling the stamper from the resin on the substrate; and the film forming process is to form a reflection at the resin to which the unevenness is transferred The processing of the film; and the transfer of the substrate to the substrate, and the processing of the coating process 200937411, the hardening process, the transfer process, the peeling process, and the film forming process described above are performed in order to produce a substrate of a desired form. The order of processing, the number of times of processing, and the transfer route of the base in the above-mentioned transport project are appropriately selected. Further, as another form, a film forming portion or a film forming process for performing a process of forming a recording film on a resin to which unevenness is transferred may be considered. In the above general invention, the U substrate can be transported through the transfer unit, and the resin can be applied to the application of the resin, the transfer of the unevenness of the resin, the curing of the resin, and the peeling of the stamper. Since it is selected, it is possible to efficiently carry out the homogenization of the resin by the coating and the multilayering of the recording surface. Further, it is also possible to easily correspond to the transfer of the substrates of the different types. In another aspect, the hardened portion is characterized in that at least two projects for hardening the resin are characterized. In the above-described general form, the resin to be coated is not hardened, but is hardened in a plurality of times, and the film thickness of the resin can be made uniform. * Other forms are characterized by the fact that the coating portion contains at least two processes for coating a resin. In the above-described general form, by coating the resin into a plurality of times, it is possible to achieve uniformity of the film thickness of the resin, adjustment of the thickness, and multilayer formation, and at least two of them are used. The transfer portion and the peeling portion are characterized in that the uneven surface of the stamper is in contact with the resin in the process of separation - 8 - 200937411. In the above-described general form, the formation of the transfer and the reflection film by the stamper can be performed in plural times, and multilayering can be realized. In another aspect, the film forming portion is characterized in that at least two of them form a reflecting film. In the above general aspect, the formation of the reflective film is performed in plural times, and multilayering can be realized. The other form of φ is characterized by the fact that the film forming portion includes at least two recording films. In the above general embodiment, the formation of the recording film can be performed in plural times, thereby achieving multilayer formation. The other aspect is characterized in that the coating portion 'includes a process of applying a resin having a high degree of adhesion to a resin and a metal; and the coating has a high degree of adhesion to the resin. For the engineering of metal with low adhesion. The other form of the φ is characterized in that the coating portion includes a resin having a low adhesion to the side of the uneven surface that is in contact with the stamper. In the above-described general form, the resin on the substrate and the reflective film side has a high adhesion to the resin and the metal, and the resin on the stamper side has a low adhesion to the metal. It is possible to surely perform peeling from the stamp while preventing peeling of the substrate and the resin. Further, it is possible to employ a metal material that can be used repeatedly in the stamper, and it is possible to ensure the durability while ensuring the peelability. -9- 200937411 Other forms are characterized in that the coating portion 'includes a project in which a resin having a high viscosity is coated thickly; and a resin having a low viscosity is coated thinly. Engineering: In the above general form, by using a resin of a different viscosity, it is possible to ensure a uniform film thickness, and it is also possible to secure the thickness by a resin having a high viscosity. The other aspect is characterized by the following means: a method of circulating a substrate at a coating portion as described above by applying a plurality of times to a substrate of the same U. In the above-described general embodiment, by providing a plurality of devices for coating a resin, it is possible to apply the resin in a plurality of times, and it is possible to achieve uniformity of the film thickness of the resin, thickness adjustment, and multilayer formation. [Effects of the Invention] As described above, according to the present invention, it is possible to provide a variety of Q types: a uniform resin coating or a multilayering of a recording surface can be realized at a low cost by a simple structure. A transfer device and a transfer method that are efficiently performed. [Embodiment] Hereinafter, an embodiment of the present invention (hereinafter referred to as an embodiment) will be specifically described with reference to the drawings. [Configuration of the embodiment] -10-200937411 First, the configuration of the transfer device (hereinafter referred to as the present device) used in the present embodiment will be described with reference to Figs. 1 and 3 to 13 . In addition, the present device is a part of a manufacturing apparatus that constitutes an optical disk, and is a forming device that is disposed on a substrate disposed in a flow engineering portion of the device, and a substrate that is disposed at a downstream engineering of the device. The bonding apparatus and the mechanism for transferring and receiving the substrate between the respective devices can be applied to various known techniques, and the description thereof will be omitted. In other words, the apparatus is generally provided with a film forming portion 1 for forming a reflective film on a substrate P for an optical disk, and a resin for transfer on the substrate P. The coating portion 2 and the transfer portion 3 for pressing the unevenness of the stamper S on the resin applied to the substrate P to cure the resin. The film formation portion 1 is provided with a first sputtering device 12A and a second sputtering device 12B which form a reflection film by sputtering. The first sputtering device 12A and the second sputtering device 12B bias the target of a specific deposit placed in the vacuum container as a cathode, and thereby argon (Ar) or the like is used. The ions of the discharge gas collide, and the materials constituting the target are knocked out in an atomic, molecular or cluster form, and are deposited as a film on the object to be processed. Here, the reason why two sputtering apparatuses are prepared is to manufacture a disk in which the recording layer is a plurality of layers. For example, it is conceivable to use the first sputtering apparatus 12A as a total reflection film, and to use the second sputtering apparatus 12B. Used as a semi-transmissive (semi-reflective film). Further, the film forming portion 1 is also provided with a function of loading and unloading the substrate P. In other words, the film forming unit 1 holds the substrate p (or sucks) at the end of the arm 11 that is rotated in the horizontal direction of -11 - 200937411 by a driving mechanism (not shown). Thereby, the substrate p can be transported. The substrate P that has been input from the previous project is held at the end of the arm sill and delivered to the coating portion 2. Further, the arm 11' receives the substrate 转印 which has been transferred to the resin in the transfer portion 3, and is carried out to the next project. When film formation is performed on the substrate 被 where the unevenness is transferred, the arm 117 delivers the 'substrate Ρ to the first shovel device 12 Α and the second splatter 12 Β. In addition, in the substrate ρ to be placed, there is a flat substrate which is not particularly formed with a concave-convex surface, and a concave-convex substrate which is formed to have irregularities corresponding to the recording surface in the prior art. (There is no total reflection film), and a film formation substrate in which a total reflection film is formed while irregularities are formed. In Figs. 3 and 4 below, a flat substrate is shown. In Figs. 5 to 13, a concave-convex substrate or a film-forming substrate is shown. However, the processing operations in the respective devices are the same. The application unit 2 includes an arm 21 that is rotated in the horizontal direction by a drive mechanism (not shown), and a first coating device 22 that rotates the resin on the substrate Α and a second The coating device 22 is. The arm 21 is held (or sucked) at the end by the substrate which is fed from the arm 11 and placed on the first coating device 22 or the second coating device 22, but The spin-coated substrate Ρ is delivered to the transfer portion 3. Further, the end portion of the arm 21 is configured to be rotatable in such a manner that the spin-coated substrate is reversed and delivered to the transfer portion 3. As shown in FIG. 3 and FIG. 5, the first coating device 22 is placed on the substrate P of the turntable 23 at -12-200937411, and the resin R1 supplied from a supply device (not shown) is passed through The dropping device is used to drip and the rotating table 23 is rotated at a high speed, whereby the resin is stretched on the substrate P by centrifugal force. In the figure, 24' is a drive source for rotating the rotary table 23. Further, the first coating device 22A is provided with an irradiation device 25 (curing device) that irradiates ultraviolet rays (UV) with respect to the resin R1' on the substrate p. The illuminating device 25 is a device for partially curing by irradiating ultraviolet rays in a dot shape around the center hole of the substrate P, and guiding the ultraviolet rays from the light source via the optical fiber. It is constructed in a way. At the light source, an ultraviolet LED can also be used and configured to adjust the intensity of the illumination.
第2塗佈裝置22B，係爲如圖4以及圖6所示一般，在被 載置於旋轉台23之基板P (已將樹脂R1作了展延）上， 將從未圖示之供給裝置所供給之樹脂R2經由滴下裝置來 作滴下，並使旋轉台23作高速旋轉，藉由此，而以離心力 Q 來將樹脂R2在樹脂R1上作展延的裝置。圖中，24，係爲 使旋轉台23作旋轉之驅動源。另外，在第2塗佈裝置22B 處，係被設置有：用以對於基板P上之樹脂R2的全面而 照射紫外線之照射裝置2 6 (硬化裝置）。但是，係亦能夠 構成爲亦可進行部分照射。例如，當將樹脂R之塗佈以及 部分性的硬化作反覆進行的情況時，在第2塗佈裝置22B 處，亦能夠產生以點照射所致之硬化部份’而成爲有效率 〇 另外，藉由第1塗佈裝置22A所展延之樹脂R1、和藉 -13- 200937411 由第2塗佈裝置22B所展延之樹脂R2，係如下述一般而有 所不同。亦即是，在本實施形態中，由於係亦想定有將反 射膜設爲多層的情形，因此，作爲成爲棊底側之樹脂R1 ，例如，係以使用對於構成基板P或是凹凸面之聚碳酸酯 等的樹脂或是構成反射膜之Ag等的金屬間之密著度爲高 者爲理想。另一方面，作爲成爲轉印側之樹脂R2，係以 使用對於樹脂之密著度爲高，而對於壓模S等之金屬的密 0 著度爲低且易於剝離者爲理想。 另外，當將樹脂R1與樹脂R2設爲相異之樹脂的情況 時，亦會有彼此間之黏度相異的情況。於此種情況，由於 若是僅有黏度低之樹脂，則係易於流動而難以確保厚度， 因此，係以使黏度爲高而易於確保厚度之樹脂成爲較厚的 方式來作塗佈爲理想。例如，當樹脂R1之黏度爲高，而 樹脂R2之黏度爲低的情況時，係以使第1塗佈裝置22A所 致之樹脂R1的塗佈厚度成爲較厚（例如，20μ左右）、 Ρ 而第2塗佈裝置22Β所致之樹脂R2的塗佈厚度成爲較薄（ 例如，5μ左右）的方式來作設定。其結果，亦能夠對相 較於柔軟之樹脂R1而爲更硬的樹脂R2之脆弱作補強，且 均一性亦爲良好。 轉印部3’係爲在經由使大口徑之旋轉台31作旋轉而 使基板Ρ作移動的同時，進行基板Ρ與壓模S之定位、對 樹脂R(R1以及R2)之壓模S的推壓、樹脂之硬化、基 板P之搬出的裝置。與各工程相對應之基板P的位置，係 成爲定位位置3A、第1推壓位置3B、第2推壓位置3C、搬 -14- 200937411 出位置3D。另外，旋轉台31，係經由未圖示之驅動機構 ，而配合於上述一般之各位置來作間歇旋轉。 在旋轉台31之上，係如圖7所示一般，被支持有支持 座狀之基底31a。在基底31a之中心處，係被設置有可經 由未圖示之驅動機構而作升降的銷31b。在銷31b之前端 處，係如圖8所示一般，被載置有經由塗佈部2之臂21而被 ' 搬送來，並以使樹脂R成爲下方的方式而被作了反轉後的 φ 基板P之中心孔。 又，在基底31a之上，係被設置有定位裝置32。此定 位裝置32，係具備有支持台32a、驅動機構32b以及CCD 攝像機32c。支持台32a，係爲壓模S所被載置之台。支持 台3 2a之壓模S的載置面，係成爲磁石，並以使鎳等之金 屬製的壓模S被作吸著保持的方式而被構成。另外，在支 持台32a處，係被設置有將壓模S之周圍作把持的把持具 ，而在磁石所致之吸著的同時，防止壓模S之偏移。 〇 驅動機構32b，係如圖9所示一般，對於銷31b上之基 板P，而將支持台32a上之壓模S作定位的機構。此驅動 機構32b，係藉由對於壓電（piezo )元件之通電，而能夠 將支持台32a在與基板P和壓模S間之接觸面平行的水平 方向（X-Y軸方向）上作移動。CCD攝像機32c，係爲對 於爲了進行定位而被附加在基板P以及壓模S上之對位記 號作檢測之手段。驅動機構3 2b之控制，係藉由下述一般 而進行：將基板P以及壓模S之對位記號，藉由CCD攝 像機32c而檢測出來，並以使雙方之中心相一致的方式， -15- 200937411 來使控制裝置對於對壓電元件之通電作控制。 在第1推壓位置3B以及第2推壓位置3C處，係如圖10 所示一般，分別被配設有第1推壓裝置33A、第_2推壓裝置 33B (當並不對兩者作區別的情況時，係稱爲推壓裝置33 )。推壓裝置33，係具備有將基板P作推壓之推壓板33a 、和將其周圍之空間作密閉之真空處理室33b。推壓板33a ' ，係被設置爲可經由未圖示之驅動機構來作升降，並藉由 φ 作下降而將基板P推壓附著於壓模S上。真空處理室3 3b ，係被設置爲可經由未圖示之驅動機構來作升降，並藉由 作下降而將基底3 1 a上之空間作密閉。在此真空處理室 33b處，係被連接有未圖示之真空源，而能夠使內部之密 閉空間成爲真空。 當將記錄層設爲多層的情況時，係有必要因應於各層 而準備凹凸相異之壓模S。相異之壓模S’係可構成爲對 於定位裝置32而從未圖示之供給裝置來選擇性地作供給（ Q 交換），亦可在被設置於旋轉台31上之複數的定位裝置32 處，分別準備相異之壓模S。藉由此’就算是在設爲3層 以上的情況時，亦成爲可進行對應於此之壓模3所致的轉 印。將基板P推壓附著於此種壓模S上之第1推壓裝置 33A、第2推壓裝置33B，係可不依存於壓模S之異同而僅 使用其中之一方，亦可設爲相互進行相異之壓模S所致的 轉印，而亦可設爲同時並行性地進行對於2個的基板P的 轉印。 進而，在推壓裝置33處，係如圖1 1所示一般’被配設 -16- 200937411 有照射裝置34。推壓板33a’係藉由可透過紫外線之材質 而被形成，照射裝置34’係爲藉由從被推壓附著於壓模s 處的基板P之上來照射紫外線，而使被轉印有凹凸之樹脂 R硬化的手段（硬化裝置）。硬化後之基板P，係如圖13 所示一般，藉由使銷31b上升，而能夠從壓模S而剝離（ 剝離部）。 另外’照射裝置3 4 ’係如同下述一般，以進行脈衝照 @ 射的方式而被設定。例如，一般而言，作爲用以使樹脂R 硬化之照射，係以100mW〜500mW/cm2的低輸出，來連續 地在2秒間作一次照射。相對於此，在本實施形態中，係 以lOOW/cm2之高輸出，來在1秒間進行15次（i次爲！〜數 //秒）的脈衝照射。 上述之臂11、21 ;旋轉台31，係作爲將基板P搬送至 各部處之搬送部而起作用。特別是，當並不將被投入之基 板P搬出而使其循環並反覆進行所期望之處理的情況時， 〇 臂11、21;旋轉台31，係作爲循環手段而起作用。而後， 在成膜部1、塗佈部2、轉印部3處之各驅動機構的動作之 有無以及動作之時機等，係經由控制裝置而被作控制。此 控制裝置，例如，係爲藉由以專用之電子電路或是特定之 程式來動作的電腦等而實現之。故而，藉由於以下所說明 之程序來對本裝置之動作作控制的電腦程式以及記錄有此 之記錄媒體，係亦爲本發明之其中一種形態。 [實施形態之作用] -17- 200937411 對於經由如同上述一般之本裝置而在基板p上之樹脂 處轉印壓模S之凹凸並形成反射膜之程序，根據圖2之流 程圖，來參考圖1、圖3〜13而作說明。 _ [對於平坦基板之轉印] 首先，對於將凹凸轉印至不具有凹凸之平坦基板上的 ' 情況時之程序作說明。亦即是，如圖1中所示一般，在前 @ 一工程中而被成型之平坦的基板P，係被投入至成膜部1 處（步驟20 1)。在此基板P處，由於係並不存在有凹凸 (步驟202 )，因此，係從成膜部1之臂1 1而被遞交至塗佈 部2之臂21處，臂21，係將基板P載置於第1塗佈裝置22A 之旋轉台23上（步驟207)。於此，在基板P上經由旋轉 塗佈而使樹脂R1被展延（步驟208)。 亦即是，如圖3中所示一般，在基板P之中心孔的周 圍處，滴下並塗佈紫外線硬化型的樹脂，並藉由將旋轉台 〇 23作高速旋轉，而使樹脂R1被展延。例如，係將塗佈壓 設爲0.2Mpa，將塗佈時間設爲0.6sec。將此經由例如 lOOOOrpm之高速旋轉，而在1.4秒之間而甩開。 接下來，以不使接著劑流動的方式來將基板P作旋轉 (例如，1 2 0 r p m〜3 0 0 r p m )，並在中心孔之周圍處，經 由照射裝置25，來點狀的照射紫外線。藉由此，在展延後 的樹脂R1上，而形成有被環狀地硬化之部分（硬化部份 X)(步驟209 )。此時’在UV光強度爲強之部分雖然係 爲完全硬化，但是’隨著朝向外週前進，受到樹脂之氧阻 -18- 200937411 礙的影響，會成爲表面並不會固化而內部係固化，同時， 隨著更朝向外週，連內部亦變得不會硬化。 接下來，臂21，係如圖4所示一般，將基板P載置在 第2塗佈裝置22B之旋轉台23上，（步驟210)，並在被形 成有硬化部份X之基板P的樹脂R1上，再度將紫外線硬 化型之樹脂R2作滴下塗佈，並藉由使旋轉台23作高速旋 ' 轉，而使樹脂R2被展延（步驟211)。例如，將塗佈壓設 φ 爲0.2MPa，將塗佈時間設爲0.6秒，並經由4000rpm之高 速旋轉，而在0.5秒之間而甩開。 而後，使用照射裝置2 6，對基板P之全面照射紫外線 (步驟212)。此照射，係爲以不會使樹脂R2之塗佈形狀 崩潰的程度來將其作了假硬化者。例如，與通常之正式硬 化的情況時之條件作比較，可考慮以相同之強度而進行約 一半之照射時間的照射。 另一方面’如圖7中所示一般，在定位裝置32處，係 〇 經由CCD攝像機32c而檢測出壓模s之對位記號。而後 ，爲了對於基板P而形成第1層之記錄層（步驟213)，如 圖8中所示一般，將被塗佈有樹脂R(R1以及R2)之基板 P，經由臂21來作反轉，並載置在定位裝置32之銷31b上 (步驟214)。此時’基板P之對位記號，係經由CCD攝 像機3 2 c而被檢測出來。進而，如圖9中所示一般，定位 裝置3 2之驅動機構3 2b ’係根據所檢測出之對位記號，而 以使壓模S之中心成爲與基板P之中心一致的方式，來將 支持台32a作移動並進行定位（步驟215)。 -19- 200937411The second coating device 22B is generally provided as a supply device (not shown) on the substrate P (which has been stretched by the resin R1) placed on the turntable 23 as shown in Figs. 4 and 6 . The supplied resin R2 is dropped by a dropping device, and the rotary table 23 is rotated at a high speed, whereby the resin R2 is stretched on the resin R1 by the centrifugal force Q. In the figure, 24 is a drive source for rotating the rotary table 23. Further, in the second coating device 22B, an irradiation device 26 (curing device) for irradiating ultraviolet rays to the entire resin R2 on the substrate P is provided. However, the system can also be configured to perform partial illumination. For example, when the application of the resin R and the partial hardening are repeated, the second coating device 22B can also produce a hardened portion due to spot irradiation, and becomes efficient. The resin R1 stretched by the first coating device 22A and the resin R2 stretched by the second coating device 22B by the borrowing of the first coating device 22B are generally different as follows. In other words, in the present embodiment, the reflection film is formed in a plurality of layers. Therefore, as the resin R1 serving as the bottom side, for example, the composition P or the uneven surface is used. It is preferable that the resin such as carbonate or the metal such as Ag constituting the reflective film has a high degree of adhesion. On the other hand, the resin R2 to be the transfer side is preferably one having a high degree of adhesion to the resin, and a low degree of adhesion to the metal such as the stamper S and being easily peeled off. Further, when the resin R1 and the resin R2 are made of a different resin, the viscosity may be different from each other. In this case, since only a resin having a low viscosity is easy to flow and it is difficult to secure the thickness, it is preferable to apply a resin having a high viscosity and a thickness which is easy to ensure a thick thickness. For example, when the viscosity of the resin R1 is high and the viscosity of the resin R2 is low, the coating thickness of the resin R1 by the first coating device 22A is made thick (for example, about 20 μ), Ρ On the other hand, the coating thickness of the resin R2 by the second coating device 22 is set to be thin (for example, about 5 μ). As a result, it is possible to reinforce the fragility of the resin R2 which is harder than the soft resin R1, and the uniformity is also good. The transfer portion 3' is configured to move the substrate by rotating the large-diameter rotary table 31, and to position the substrate Ρ and the stamper S, and to apply the stamper S to the resin R (R1 and R2). A device that pushes, hardens the resin, and carries out the substrate P. The position of the substrate P corresponding to each project is the positioning position 3A, the first pressing position 3B, the second pressing position 3C, and the moving -14-200937411 out position 3D. Further, the turntable 31 is intermittently rotated in accordance with the above-described general positions via a drive mechanism (not shown). Above the rotary table 31, as shown in Fig. 7, a base 31a supporting the seat is supported. At the center of the base 31a, a pin 31b which can be raised and lowered by a drive mechanism (not shown) is provided. In the front end of the pin 31b, as shown in Fig. 8, the arm 21 of the application unit 2 is placed and transported, and the resin R is reversed. φ The center hole of the substrate P. Further, on the base 31a, a positioning device 32 is provided. The positioning device 32 is provided with a support base 32a, a drive mechanism 32b, and a CCD camera 32c. The support table 32a is a table on which the stamper S is placed. The mounting surface of the stamper S of the support table 32a is made of a magnet, and is configured such that a stamper S made of metal such as nickel is sucked and held. Further, at the support table 32a, a gripper for holding the periphery of the stamper S is provided, and the shift of the stamper S is prevented while the magnet is attracted by the magnet. The drive mechanism 32b is a mechanism for positioning the stamper S on the support table 32a for the base plate P on the pin 31b as shown in Fig. 9. This driving mechanism 32b is capable of moving the support table 32a in the horizontal direction (X-Y-axis direction) parallel to the contact surface between the substrate P and the stamper S by energization of the piezo element. The CCD camera 32c is a means for detecting alignment marks attached to the substrate P and the stamper S for positioning. The control of the driving mechanism 3 2b is performed by generally arranging the alignment marks of the substrate P and the stamper S by the CCD camera 32c so that the centers of the two sides coincide with each other, -15 - 200937411 to enable the control unit to control the energization of the piezoelectric element. At the first pressing position 3B and the second pressing position 3C, as shown in FIG. 10, the first pressing device 33A and the second pressing device 33B are respectively disposed (when not both) In the case of a difference, it is called a pressing device 33). The pressing device 33 is provided with a pressing plate 33a for pressing the substrate P and a vacuum processing chamber 33b for sealing the space around the substrate P. The pressing plate 33a' is provided so as to be lifted and lowered by a driving mechanism (not shown), and the substrate P is pressed and attached to the stamper S by φ. The vacuum processing chamber 33b is provided so as to be lifted and lowered by a driving mechanism (not shown), and the space on the base 31a is sealed by lowering. In the vacuum processing chamber 33b, a vacuum source (not shown) is connected, and the internal sealed space can be made into a vacuum. When the recording layer is formed in a plurality of layers, it is necessary to prepare a stamper S having a different unevenness in accordance with each layer. The different stamper S' may be configured to be selectively supplied (Q exchange) to the positioning device 32 from a supply device (not shown), or may be provided in a plurality of positioning devices 32 provided on the rotary table 31. Prepare different stampers S separately. In this case, even when it is set to three or more layers, the transfer can be performed by the stamper 3 corresponding thereto. The first pressing device 33A and the second pressing device 33B which are attached to the stamper S by pressing the substrate P can be used only by one of them without depending on the difference between the stampers S. The transfer by the different stamper S may be performed by simultaneously transferring the two substrates P in parallel. Further, at the pressing device 33, as shown in Fig. 11, a illuminating device 34 is generally disposed -16-200937411. The pressing plate 33a' is formed by a material that is permeable to ultraviolet rays, and the irradiation device 34' is irradiated with ultraviolet rays by being pressed from the substrate P adhered to the stamper s, thereby causing the unevenness to be transferred. Resin R hardening means (hardening device). The hardened substrate P is generally peeled off from the stamper S by the rising of the pin 31b as shown in Fig. 13 (peeling portion). Further, the 'irradiation device 34' is set as follows in order to perform pulse irradiation. For example, in general, as the irradiation for curing the resin R, the irradiation is performed continuously for 2 seconds at a low output of 100 mW to 500 mW/cm2. On the other hand, in the present embodiment, the pulse is irradiated 15 times (i times to ~ several seconds) in one second at a high output of 100 W/cm2. The above-described arms 11, 21 and the rotary table 31 function as a conveying portion for conveying the substrate P to each portion. In particular, when the substrate P to be loaded is not carried out and circulated and the desired processing is repeated, the arms 11 and 21 and the rotary table 31 function as a circulation means. Then, the presence or absence of the operation of each of the driving mechanisms at the film forming portion 1, the coating portion 2, and the transfer portion 3, and the timing of the operation are controlled by the control device. The control device is realized, for example, by a computer or the like that operates by a dedicated electronic circuit or a specific program. Therefore, a computer program for controlling the operation of the apparatus and a recording medium recorded thereon by the procedure described below are also one of the forms of the present invention. [Function of the Embodiment] -17- 200937411 A procedure for transferring the unevenness of the stamper S on the resin on the substrate p by the apparatus as described above and forming a reflective film, according to the flowchart of FIG. 1, as shown in Figures 3 to 13. _ [Transfer for flat substrate] First, a procedure for transferring the unevenness to the case of the flat substrate having no unevenness will be described. That is, as shown in Fig. 1, in general, the flat substrate P molded in the first project is placed in the film forming portion 1 (step 20 1). At this substrate P, since there is no unevenness (step 202), it is delivered from the arm 11 of the film forming portion 1 to the arm 21 of the coating portion 2, and the arm 21 is the substrate P. It is placed on the rotary table 23 of the first coating device 22A (step 207). Here, the resin R1 is stretched on the substrate P via spin coating (step 208). That is, as shown in FIG. 3, generally, a UV-curable resin is dropped and applied around the center hole of the substrate P, and the resin R1 is exhibited by rotating the rotary table 23 at a high speed. Delay. For example, the coating pressure is set to 0.2 MPa, and the coating time is set to 0.6 sec. This is rotated at a high speed of, for example, 100 rpm, and is opened between 1.4 seconds. Next, the substrate P is rotated (for example, 1 2 0 rpm to 300 rpm) so that the adhesive does not flow, and the ultraviolet rays are spot-shaped by the irradiation device 25 around the center hole. . Thereby, a portion (hardened portion X) which is hardened in an annular shape is formed on the stretched resin R1 (step 209). At this time, the part where the intensity of the UV light is strong is completely hardened, but as it progresses toward the outer periphery, it is affected by the oxygen resistance of the resin, and the internal surface is not cured. At the same time, as it goes further toward the periphery, the interior will not harden. Next, the arm 21 is placed on the rotary table 23 of the second coating device 22B as shown in FIG. 4 (step 210), and is formed on the substrate P on which the hardened portion X is formed. On the resin R1, the ultraviolet curable resin R2 is again dripped, and the resin R2 is stretched by rotating the turntable 23 at a high speed (step 211). For example, the coating pressure is set to 0.2 MPa, the coating time is set to 0.6 second, and the rotation is performed at a high speed of 4000 rpm, and is opened between 0.5 seconds. Then, the entire surface of the substrate P is irradiated with ultraviolet rays using the irradiation device 26 (step 212). This irradiation is performed by pseudo-hardening to such an extent that the coating shape of the resin R2 does not collapse. For example, in comparison with the conditions in the case of the usual hardening, it is conceivable to perform irradiation for about half of the irradiation time with the same intensity. On the other hand, as shown in Fig. 7, at the positioning device 32, the alignment mark of the stamper s is detected via the CCD camera 32c. Then, in order to form the recording layer of the first layer with respect to the substrate P (step 213), as shown in FIG. 8, the substrate P coated with the resin R (R1 and R2) is inverted by the arm 21 as usual. And placed on the pin 31b of the positioning device 32 (step 214). At this time, the alignment mark of the substrate P is detected by the CCD camera 3 2 c. Further, as shown in FIG. 9, generally, the driving mechanism 32b' of the positioning device 32 is based on the detected alignment mark so that the center of the stamper S is aligned with the center of the substrate P. The support station 32a moves and performs positioning (step 215). -19- 200937411
接下來，經由旋轉台31之旋轉，而將基板P與壓模S 移動至推壓位置3B處（步驟216)。在推壓位置3B處， 如圖10中所示一般，使第1推壓裝置33A之真空處理室33b 下降，並將基底3 1 a上之空間密閉（步驟2 1 7 )。而後， 使真空源作動，並對真空處理室33b內作真空抽氣（步驟 218)。進而，如圖11中所示一般，經由使推壓板33a下 ' 降，而將基板P朝下方壓下。藉由此，銷31b係與基板P φ —同地下降，而基板P之樹脂R係被推壓附著於壓模S 之凹凸面上（步驟219)。 進而，經由以照射裝置3 4來從基板P之上方而照射紫 外線，而將樹脂R完全的硬化（步驟220 )。此時，藉由 如同上述一般而進行脈衝照射，瞬間之照射功率係變高， 而在使硬化速度增快的同時，亦使基板P不會被加熱。而 後，如圖12中所示一般，開放至大氣中，並使真空處理室 33b以及推壓板33a上升（步驟221)。 〇 進而，經由旋轉台31之旋轉，而將基板P與壓模s移 動至搬出位置3D處（步驟222 )。在搬出位置3D處，係 % 如圖13所示一般，藉由使銷31b上升，而能夠將基板P從 壓模S而剝離（步驟223 )。此時，壓模S，由於係經由 以磁石所致之吸著與把持具所致之把持而被固定，因此， 能夠僅使基板P上升，而將樹脂R從壓模S來剝離。藉 由此，而製作附加有具備凹凸之樹脂R的基板P。而後， 在並不進行成膜的情況時（步驟224 )，成膜部1之臂U， 係將基板P搬出至下一工程（步驟228)。 -20- 200937411 [對凹凸基板之成膜] 接下來，針對對於在前一工程中以形成對應於記錄面 之凹凸的方式而被作了成型之凹凸基板（無全反射膜）， 來形成全反射膜之程序作說明。另外，在此凹凸基板處， 係不僅是包含有從前一工程而被搬入至成膜部1之凹凸基 ' 板的情況，而亦包含有使在如同上述一般而被塗佈的樹脂 Φ 處轉印有凹凸之基板作循環的情況。 亦即是，成膜部1之臂11，係將從前一工程而被搬入 (步驟201)之身爲被形成有凹凸的基板P (步驟2 02 )但 並未被形成有反射膜者（步驟203 )，移動至第1濺鍍裝置 12A (步驟204)。在第1濺鍍裝置12A處，係於基板P之 凹凸上藉由濺鍍來形成全反射膜（步驟205 )。在並不進 行下一個記錄層之形成或是對表面作保護的頂覆蓋層之形 成的情況時（步驟206 )，成膜部1之臂1 1，係將基板P搬 φ 出至下一工程（步驟228 )。 [成膜基板之多層化] 接下來，針對將在被形成有凹凸的同時亦被形成有全 反射膜（第1層）之成膜基板進行多層化的程序作說明。 另外，在此成膜基板處，係不僅是包含有從前一工程而被 搬入至成膜部1之凹凸基板的情況，而亦包含有使在如同 上述一般而於凹凸處被濺鍍有全反射膜之基板作循環的情 況。 -21 - 200937411 亦即是，成膜部1之臂11，係將從前一工程而被搬入 (步驟201 )之身爲被形成有凹凸的基板P (步驟202 )且 亦被形成有反射膜者（步驟2 03 )，遞交至塗佈部2之臂21 處。臂21，係將基板P載置於第1塗佈裝置2 2A之旋轉台 23上（步驟207 )。而後，如圖5以及圖6中所示一般，與 圖3以及圖4相同的而被塗佈樹脂（步驟208〜212)，並在 第1推壓裝置33A(或是第2推壓裝置33B)處，經由下一 φ 層用之壓模S而被轉印有凹凸（步驟213〜223 )。 接下來，爲了在轉印後之凹凸處成膜第2層（步驟224 ' 225)，成膜部1之臂11，係將基板P移動至第2濺鍍裝 置12B處（步驟226)。在第2濺鑛裝置12B處，係於被轉 印之凹凸上藉由濺鍍來形成半透過膜（步驟227 )。在並 不進行下一層之轉印或者是頂覆蓋層之形成的情況時（步 驟206 )，成膜部1之臂11，係將基板P搬出至下一工程（ 步驟228 )。 〇 又，當進行對第2層作保護之頂覆蓋層之形成的情況 時（步驟206 )，成膜部1之臂11，係將基板P遞交給塗佈 部2之臂21，而臂21，係將基板P載置於第1塗佈裝置22A 之旋轉台23上，並與上述同樣的，將樹脂R作塗佈（步驟 207〜212)。此時，對於樹脂R2之紫外線照射，係以使 其完全硬化之強度來進行。而後，成膜部1之臂11，係將 基板P搬出至下一工程（步驟213、228)。 進而，當對第3層以後作形成的情況時（步驟206 )， 係如同上述一般，進行樹脂R之塗佈（步驟2 07〜213)， -22- 200937411 並在作了定位後（步驟2 1 4、2 1 5 )，進行轉印以及成膜（ 步驟216〜227)。藉由反覆進行以上處理，而實現了多層 化，在最終層或是頂覆蓋層之形成後（步驟206 )’成膜 部1之臂1 1，係將基板P搬出至下一工程（步驟228 )。 [實施形態之效果] ' 若藉由上述一般之本實施形態，則由於係可對於基板 P之搬送、對基板P之樹脂R的塗佈、對樹脂R之壓模S 的凹凸之推壓附著、樹脂R之硬化、壓模S之從樹脂R 的剝離之類的處理之有無以及處理之次數，作適宜選擇而 進行，因此，係能夠將由塗佈之反覆進行所致之樹脂R的 均一化或是記錄面之多層化有效率地來進行。特別是，由 於係可將基板P在轉印裝置內作循環，因此，並不需要在 搬送路徑上將進行相同之處理的裝置作多數之配置，而能 夠經由少數裝置之構成，來實現樹脂R之均一化、記錄面 φ 之多層化。 又，係可藉由相同之裝置，來容易地對對於平坦基板 、凹凸基板、成膜基板等之相異種類的基板P之轉印作對 應。亦即是，如同在上述之實施形態中所例示一般，並不 需要對於所有之基板P而使其經過所有的在裝置內所準備 之工程。在將基板投入後之工程中，藉由對預先被設定在 控制裝置中之工程作適宜選擇並使基板經由該些工程，在 一個的裝置中，能夠製作相異層積數、相異壓模S所致之 製品。例如，當層積數係爲一層即可的情況時，則可考慮 -23- 200937411 僅使用上述之實施形態中的推壓裝置之其中一方和濺鍍裝 置之其中一方。 又，藉由在第1塗佈裝置22A所致之樹脂R1的塗佈後 ，並不立即進行硬化，而是進行以點照射所致之中心孔的 周圍之硬化部份X的形成、在樹脂R2之塗佈後的短時間 照射所致之假硬化、並進而進行脈衝照射所致之完全硬化 ' ，而以複數次來作硬化，能夠達成樹脂R之膜厚的均一化 © 特別是，硬化部份X之形成，由於係對旋轉塗佈所 致之樹脂R1以及R2的流動作抑制，因此，對於因離心力 所產生之膜厚的不均一之改善係有所幫助。又，最終之硬 化，由於係經由瞬間強度爲高之脈衝照射來進行，因此， 相較於以低強度所致之連續照射，硬化速度係爲快，且亦 能防止因基板P之加熱所致的變形。由於亦能縮短照射時 間，因此，亦對所需要之時間的縮短有所幫助。 〇 又，由於與基板P或是反射膜相接觸之樹脂R1，其 對於樹脂以及金屬之密著度係爲高，而與壓模S相接觸之 樹脂R2，其對於金屬之密著度係爲低，因此，能夠在防 止樹脂R1以及R2之剝離的同時，而確實地進行從壓模s 之剝離。又，係成爲能夠在壓模S中採用可反覆使用之金 屬材料，而能夠在確保剝離性的同時亦確保耐久性。而， 由於能夠經由黏度爲高之樹脂R1來確保厚度，故係容易 形成厚膜。 進而，由於藉由以定位裝置32來將基板以及壓模S在 -24- 200937411 與接觸面平行之方向上作移動，而成爲能夠進行相互之中 心等的定位，因此，能夠在基板p之正確的位置處將凹凸 作轉印。特別是，藉由以C CD攝像機3 2 c來對於基板P 以及壓模S之定位用對位記號作檢測，能夠將兩者正確地 作定位。 ' [其他實施形態] Q 本發明，係並不被限定爲上述一般之實施型態。例如 ，可對係使各裝置之何者來動作並進行處理、或是將基板 以何種之路徑來作搬送或是循環等作自由的設定。又，在 上述之實施形態中所展示之數値，係爲例示，本發明，係 並不被限定爲此些之數値。進而，關於將在複數之硬化裝 置處的各別之照射強度、照射範圍、照射時間等設定爲何 種之程度一事，亦爲自由。 又，亦可構成爲如圖14〜圖16中所示一般，將壓模S G 經由定位裝置33d而保持在推壓板33a側（上側），並將 基板P載置在旋轉台3 1側（下側）之載置台35處，而在第 ' 1推壓位置3B以及第2推壓位置3C處來分別進行定位的構 成。Next, the substrate P and the stamper S are moved to the pressing position 3B via the rotation of the turntable 31 (step 216). At the pressing position 3B, as shown in Fig. 10, the vacuum processing chamber 33b of the first pressing device 33A is lowered, and the space on the base 31a is sealed (step 2 17). Thereafter, the vacuum source is actuated and vacuum evacuation is performed in the vacuum processing chamber 33b (step 218). Further, as shown in Fig. 11, generally, the substrate P is pressed downward by lowering the pressing plate 33a. Thereby, the pin 31b is lowered in the same manner as the substrate Pφ, and the resin R of the substrate P is pressed and adhered to the uneven surface of the stamper S (step 219). Further, the ultraviolet rays are irradiated from above the substrate P by the irradiation device 34, and the resin R is completely cured (step 220). At this time, by performing pulse irradiation as described above, the instantaneous irradiation power is increased, and the hardening speed is increased, and the substrate P is not heated. Then, as shown in Fig. 12, it is normally opened to the atmosphere, and the vacuum processing chamber 33b and the pressing plate 33a are raised (step 221). Further, the substrate P and the stamper s are moved to the carry-out position 3D via the rotation of the turntable 31 (step 222). At the carry-out position 3D, as shown in Fig. 13, generally, the substrate P can be peeled off from the stamper S by raising the pin 31b (step 223). At this time, since the stamper S is fixed by the suction by the magnet and the grip by the gripper, the resin P can be peeled off from the stamper S by merely raising the substrate P. Thus, the substrate P to which the resin R having irregularities is added is produced. Then, when the film formation is not performed (step 224), the arm U of the film forming unit 1 carries the substrate P out to the next process (step 228). -20-200937411 [Film formation on the uneven substrate] Next, a concave-convex substrate (without total reflection film) formed in such a manner as to form irregularities corresponding to the recording surface in the previous process is formed. The procedure of the reflective film is explained. In addition, the uneven substrate includes not only the uneven base plate which is carried into the film forming portion 1 from the previous process, but also includes the resin Φ which is coated as described above. The case where the substrate with the unevenness is printed is circulated. In other words, the arm 11 of the film forming unit 1 is carried by the previous process (step 201) as the substrate P on which the unevenness is formed (step 209), but the reflective film is not formed (step) 203), moving to the first sputtering apparatus 12A (step 204). At the first sputtering apparatus 12A, a total reflection film is formed by sputtering on the unevenness of the substrate P (step 205). In the case where the formation of the next recording layer or the formation of the top cover layer for protecting the surface is not performed (step 206), the arm 11 of the film forming portion 1 carries the substrate P to the next project. (Step 228). [Multilayering of film-forming substrate] Next, a procedure for multilayering a film-forming substrate on which a total reflection film (first layer) is formed while forming irregularities will be described. Further, in the film formation substrate, not only the uneven substrate which is carried into the film formation portion 1 from the previous process but also the total reflection at the uneven portion as described above is included. The case where the substrate of the film is circulated. -21 - 200937411 That is, the arm 11 of the film forming portion 1 is carried by the previous process (step 201), and the substrate P on which the unevenness is formed (step 202) is also formed with a reflective film. (Step 2 03), delivered to the arm 21 of the coating section 2. The arm 21 mounts the substrate P on the rotary table 23 of the first coating device 2 2A (step 207). Then, as shown in FIGS. 5 and 6, generally, the resin is applied in the same manner as in FIGS. 3 and 4 (steps 208 to 212), and the first pressing device 33A (or the second pressing device 33B). At the same time, the unevenness is transferred via the stamper S for the next φ layer (steps 213 to 223). Next, in order to form the second layer at the unevenness after the transfer (step 224 '225), the arm 11 of the film forming portion 1 moves the substrate P to the second sputtering device 12B (step 226). At the second sputtering apparatus 12B, a semi-permeable membrane is formed by sputtering on the unevenness of the transfer (step 227). When the transfer of the next layer or the formation of the top cover layer is not performed (step 206), the arm 11 of the film forming portion 1 carries the substrate P out to the next process (step 228). Further, when the formation of the top cover layer for protecting the second layer is performed (step 206), the arm 11 of the film forming portion 1 delivers the substrate P to the arm 21 of the coating portion 2, and the arm 21 The substrate P is placed on the turntable 23 of the first coating device 22A, and the resin R is applied in the same manner as described above (steps 207 to 212). At this time, the ultraviolet ray irradiation of the resin R2 is performed with the strength to completely harden it. Then, the arm 11 of the film forming unit 1 carries the substrate P out to the next process (steps 213 and 228). Further, when the third layer is formed later (step 206), the coating of the resin R (steps 2 07 to 213), -22 to 200937411 is performed as in the above, and after positioning (step 2) 1 4, 2 1 5), transfer and film formation (steps 216 to 227). By performing the above processing in turn, multi-layering is realized. After the formation of the final layer or the top cladding layer (step 206), the arm 11 of the film forming portion 1 carries the substrate P out to the next project (step 228). ). [Effects of the Embodiments] By the above-described general embodiment, the substrate P can be transported, the resin R of the substrate P can be applied, and the unevenness of the stamper S of the resin R can be adhered. The presence or absence of the treatment such as the hardening of the resin R and the peeling of the stamper S from the resin R and the number of times of the treatment are appropriately selected. Therefore, the resin R can be uniformized by the coating. Or the multi-layering of the recording surface can be carried out efficiently. In particular, since the substrate P can be circulated in the transfer device, it is not necessary to arrange a plurality of devices for performing the same processing on the transport path, and the resin R can be realized by a small number of devices. The homogenization and the multiplication of the recording surface φ. Further, it is possible to easily cope with the transfer of the substrate P of a different type such as a flat substrate, a concave-convex substrate, or a film-forming substrate by the same apparatus. That is, as exemplified in the above embodiments, it is not necessary for all of the substrates P to pass through all the processes prepared in the apparatus. In the process of putting the substrate into operation, by appropriately selecting the project previously set in the control device and passing the substrate through the processes, the number of different layers and the different stampers can be produced in one device. Products caused by S. For example, when the number of layers is one layer, it is conceivable that only one of the pressing devices and the sputtering device in the above-described embodiment can be used in -23-200937411. In addition, after the application of the resin R1 by the first coating device 22A, the curing is not performed immediately, but the formation of the hardened portion X around the center hole by the spot irradiation is performed, and the resin is formed. The pseudo-hardening due to short-time irradiation after application of R2, and further complete hardening by pulse irradiation, and hardening in plural times, can achieve uniformity of film thickness of resin R © in particular, hardening The formation of the portion X is suppressed by the flow of the resins R1 and R2 due to the spin coating, and therefore, it is helpful to improve the unevenness of the film thickness due to the centrifugal force. Further, since the final hardening is performed by pulse irradiation having a high instantaneous intensity, the curing speed is fast compared to the continuous irradiation with low strength, and the heating of the substrate P can be prevented. The deformation. Since the irradiation time can also be shortened, it also contributes to the shortening of the required time. Further, since the resin R1 which is in contact with the substrate P or the reflective film has a high degree of adhesion to the resin and the metal, and the resin R2 which is in contact with the stamper S, the adhesion to the metal is Since it is low, peeling of the resin R1 and R2 can be prevented, and peeling from the stamper s can be performed reliably. Further, it is possible to employ a metal material that can be used repeatedly in the stamper S, and it is possible to ensure durability while ensuring peelability. Further, since the thickness can be ensured by the resin R1 having a high viscosity, it is easy to form a thick film. Further, since the substrate and the stamper S are moved in the direction parallel to the contact surface by the positioning device 32 in the direction parallel to the contact surface, the positioning of the substrate and the like can be performed. Therefore, the substrate p can be correctly positioned. The bump is transferred at the position. In particular, by using the C CD camera 3 2 c to detect the alignment of the substrate P and the stamper S, it is possible to correctly position the two. [Other Embodiments] Q The present invention is not limited to the above-described general embodiment. For example, it is possible to freely set which of the devices is operated and processed, or which substrate is to be transported or looped. Further, the number of the embodiments shown in the above embodiments is merely illustrative, and the present invention is not limited thereto. Further, it is also free to set the respective irradiation intensity, irradiation range, irradiation time, and the like at a plurality of hardening devices. Further, as shown in FIGS. 14 to 16, the stamper SG may be held on the side of the pressing plate 33a (upper side) via the positioning device 33d, and the substrate P may be placed on the side of the rotating table 31 (under) The mounting table 35 of the side is configured to be positioned at the first pressing position 3B and the second pressing position 3C, respectively.
另外，於圖15中，33b係爲真空處理室、33c係爲在 壓模S之剝離時將基板P作壓抑之銷33c、34係爲紫外線 之照射裝置、35a係爲石英等之透過紫外線的平板、35a 係爲檢測出壓模S以及基板P之對位記號的CCD攝像機 。在此種構成中，由於係可將壓模s之保持、對於基板P -25- 200937411 之壓模s的定位、對於基板P之壓模S的推壓附著、樹脂 R之硬化、以及壓模S之剝離藉由一處之裝置來進行’因 此，係可將構造以及工程簡略化。 又，樹脂之塗佈次數，對於1層係並不限定爲2次。亦 可對於1層而塗佈1次，而亦可對於1層而塗佈3次以上。如 此這般，藉由對塗佈之次數作控制’成爲能夠控制膜厚。 ' 例如，如圖1中之點線箭頭所示一般’在塗佈部2處，亦可 @ 藉由並不將基板P遞交給轉印部3而使其作循環’而反覆 進行多數次之塗佈，來進行樹脂R之膜厚的均一化、厚膜 化。此時，臂2 1係作爲循環手段而起作用。 塗佈裝置、推壓裝置（轉印裝置）、成膜裝置之各別 的數量，係並不被限定爲2台，而亦可爲1台’亦可爲3台 以上。例如，當對於凹凸基板並不將記錄層設爲3層，而 只要設爲2層且進行全反射膜1次半反射膜1次之濺鍍即可 的情況時，係亦可如圖17所示一般，僅具備第1推壓裝置 Q 3 3 A。如同在此圖1 7中所例示一般，亦可將照射裝置3 4設 爲相異之位置。當僅有1層，且並不進行對於基板p之直 接濺鍍，而僅對轉印後之樹脂R進行濺鍍的情況時，亦可 如圖18所示一般，僅具備1台之濺鍍裝置12。進而，當使 記錄層之形成在下一工程中來進行的情況時，則並沒有在 轉印裝置中設置濺鍍裝置的需要。又，如圖19中所示一般 ，係能夠以可在最上層之記錄層的上方進而塗佈樹脂而進 ί了碟片之表面的頂覆蓋的方式，來在塗佈部2處追加照射 裝置3 4。 -26- 200937411 又，若是如圖20、圖21中所示一般，在轉印部3之旋 轉台3 1上’設置複數之定位裝置3 2，則由於係能夠對於複 數之基板P’同時並行地進行定位、轉印、硬化、搬出之 作業’因此，係成爲能夠有效率地作量產。於此情況，係 可設爲在複數之位置的每一處，對1個的基板P作處理（ 圖20) ’亦可設爲能夠對複數之基板p作處理（圖21)。 又’亦可將該些作組合。針對塗佈裝置或是濺鍍裝置，亦 〇 可藉由在每一位置處作設置，來成爲能夠對於複數之基板 P而同時並行地進行處理。如上述一般，藉由因應於基板 P來對所經由之工程作改變，能夠將相異層積數、相異壓 模s所致之製品製造，同時並行地來進行。 作爲準備複數之壓模S的方法，係亦可具備將數種類 或者是將預備之壓模S作選擇性的供給之供給裝置。圖22 ’係爲設置有將壓模S供給至轉印部3處之壓模站4者的其 中一例。壓模站4，係具備有：經由未圖示之驅動機構來 Ο 作間歇旋轉的分度站（index station) 41、和一面經由未 圖示之驅動機構來旋轉一面從分度站41而接收壓模S，並 在供給位置3E處來遞交給轉印部3之定位裝置32的臂42。In addition, in Fig. 15, 33b is a vacuum processing chamber, 33c is an ultraviolet irradiation device in which the pins 33c and 34 which suppress the substrate P when the die S is peeled off, and 35a is a quartz which transmits ultraviolet rays. The flat plate and the 35a are CCD cameras that detect the alignment marks of the stamper S and the substrate P. In such a configuration, the holding of the stamper s, the positioning of the stamper s for the substrate P -25 - 200937411, the adhesion of the stamper S to the substrate P, the hardening of the resin R, and the stamper are possible. The stripping of S is performed by a single device. Therefore, the structure and engineering can be simplified. Further, the number of times of application of the resin is not limited to two for one layer. It may be applied once for one layer, or may be applied three times or more for one layer. In this way, by controlling the number of coatings, it is possible to control the film thickness. For example, as indicated by the dotted arrow in Fig. 1, generally, at the coating portion 2, @ may be repeated by repeating the substrate P without being delivered to the transfer portion 3 By coating, the film thickness of the resin R is uniformized and thickened. At this time, the arm 2 1 functions as a circulation means. The number of each of the coating device, the pressing device (transfer device), and the film forming device is not limited to two, and may be one or three or more. For example, when the recording layer is not formed into three layers for the uneven substrate, and the sputtering is performed once for the total reflection film primary semi-reflective film, it may be as shown in FIG. Generally, only the first pressing device Q 3 3 A is provided. As exemplified in Fig. 17, the illumination device 34 can also be set to a different position. When there is only one layer and the direct sputtering of the substrate p is not performed, and only the resin R after the transfer is sputtered, as shown in FIG. 18, only one sputtering may be provided. Device 12. Further, when the formation of the recording layer is performed in the next process, there is no need to provide a sputtering device in the transfer device. Moreover, as shown in FIG. 19, in general, it is possible to apply an irradiation device to the coating portion 2 so that the resin can be applied over the recording layer of the uppermost layer and the top surface of the surface of the disk is covered. 3 4. -26- 200937411 Further, if a plurality of positioning devices 3 2 are provided on the rotary table 3 1 of the transfer unit 3 as shown in Figs. 20 and 21, it is possible to simultaneously parallel the plurality of substrates P'. The positioning, transfer, hardening, and unloading operations are performed on the ground. Therefore, mass production can be performed efficiently. In this case, it is possible to treat one substrate P at each of the plurality of positions (Fig. 20). It is also possible to process a plurality of substrates p (Fig. 21). Also, these may be combined. For the coating device or the sputtering device, it is also possible to perform processing in parallel for a plurality of substrates P by being disposed at each position. As described above, by changing the engineering to be passed in accordance with the substrate P, it is possible to manufacture the products by the number of different layers and the different stamper s, and to perform them in parallel. As a method of preparing a plurality of stampers S, there may be provided a supply device that supplies a plurality of types or a supply of the prepared stamper S selectively. Fig. 22' is an example of a person who is provided with a stamper station 4 that supplies the stamper S to the transfer portion 3. The stamper station 4 is provided with an index station 41 that intermittently rotates via a drive mechanism (not shown), and receives an index station 41 from the indexing station 41 while rotating via a drive mechanism (not shown). The stamper S is delivered to the arm 42 of the positioning device 32 of the transfer portion 3 at the supply position 3E.
在分度站41處，例如，係被載置有：被形成有第1層 之凹凸的壓模S1、和被形成有第2層之凹凸的壓模S2、和 此些之交換用或者是被形成有第3層之凹凸的壓模S3、和 預備之壓模SI’、S2’等。關於使用何者之壓模S，或是在 何種時機中來將壓模S投入或是作交換一事，係經由控制 裝置來作控制。另外，此例，係並非爲對本發明之壓模S -27- 200937411 的種類與數量作限定者。 例如，當在平坦基板上僅轉印第1層，在凹凸基板上 僅轉印第2層的情況時，則所使用之壓模s係亦可爲僅有 一種類。藉由準備複數之相同種類的壓模S並載置在旋轉 台31之相異的位置處，在第1推壓裝置33A、第2推壓裝置 3 3 B處，係可對於2枚之基板P而同時並行地轉印相同之 ， 凹凸。 φ 例如，圖22之旋轉台31，雖係將壓模S1、S2交互地 作載置者，但是，係可在每旋轉1 8 0 °時，將僅以壓模S 1所 致或者是僅以壓模S2所致之轉印，在第1推壓裝置33 A以 及第2推壓裝置33B處同時的進行。亦可在所有的位置處 載置相同之壓模S1或者是壓模S2，並在每旋轉45°時，將 僅以壓模S1所致或者是僅以壓模S2所致之轉印，在第1推 壓裝置33A以及第2推壓裝置33B處同時的進行。 又’在進行2層之轉印的情況時，係可考慮在旋轉台 3 1之相異的位置處，交互地或是以特定之間隔來將2種類 之壓模SI、S2作載置。例如，在圖22之旋轉台31處，可 在每旋轉9CT時，將經由壓模si而在第1推壓裝置33A以及 第2推壓裝置33B處同時進行轉印的處理，和經由壓模S2 而在第1推壓裝置33A以及第2推壓裝置33B處同時進行轉 印的處理，交互地作進行。亦可在每旋轉45。時，使第1推 壓裝置33A以及第2推壓裝置33B交互地動作並進行轉印 〇 又’當欲對2種之轉印圖案的其中一方作變更的情況 -28- 200937411 時，例如，係可考慮經由壓模站4，來將層 何一方與壓模S3來作交換。進而，當在危 、S2之中，產生有由於在其之全部或是一 損傷等的問題或是由於磨耗所致的使用壽 ，係可與預備之壓模SI’、S2’作交換。亦 產生有問題等之位置處的壓模S不被使用 ' ，來經由控制裝置而對旋轉台3 1、第1推, 第2推壓裝置3 3 B作控制（無視該當壓模 外，如上述一般，推壓裝置3 3，係亦可爲 以上。 又，亦可藉由在樹脂的旋轉塗佈時， 對樹脂作部分性加熱，而進行展延。例如 而使用點加熱器來將外週近旁加熱，由於 低，因此，係藉由以使基板作旋轉所產生 開，並成爲易於朝向外週溢出。又或是， φ 而揮發量係增大。因此，由於在外週處所 變薄，而能夠對其之厚度的增大作抑制， ，能夠將厚度均一化。另外，亦可同時地 ，來進行接著劑之加熱的輔助。 又彳於基板之樹脂的塗佈方法，係 被限定爲旋轉塗佈。樹脂之種類，係可適 將來所可利用之各種材質者。亦可適用如 之樹脂一般的經由從外部來照射廣義之電 或者是如同熱硬化型之樹脂一般的經由施 !模 S 1、S 2之任 3用中的壓模S1 部份出現缺陷、 命結束之情況時 可考慮：以僅使 在轉印中的方式 g裝置3 3 A以及 S而動作）。另 1台’亦可爲3台 使用加熱裝置來 ，藉由作爲熱源 樹脂的黏度係降 的離心力而被甩 係得到熱能量， 殘留之接著劑係 因此，全體而言 對外週吹出熱風 爲自由，而並不 用於現在又或是 同放射線硬化型 磁波而硬化者、 加溫度變化而硬 -29- 200937411 化者。 又’亦可藉由在壓模之表面上施加特定之處理，來降 低其與樹脂間之密著度，而使剝離變得容易。例如，若是 附加介電質膜，則剝離性係提升。作爲其中一例，係可考 慮有：膜厚20η左右’作爲介電質，採用Si〇2、siN、 ZnSSi〇2、ZnOGa2〇3 ’但是，係並不被限定於該些。又， 例如’若是附加如同Ti02等一般之光觸媒所致之膜，則 ❹ 係可得到由照射紫外線所致之自我清淨效果（self cleaning) 。 又’用以定位之驅動機構，亦並不被限定於由壓電元 件所致者。例如’亦可藉由以旋進螺絲所致的掃描機構來 實現之。檢測出基板或是壓模之位置的手段，亦並不被限 定於C C D攝像機’而可適用各種之感測器。亦可針對壓 模、基板而分別使用相異之檢測手段。針對定位手段，亦 並不被限定於特定構造者。例如，亦可爲藉由在基板之中 〇 心孔與壓模之中心孔處使共通之銷通過的單純之構造。另 外，壓模以及基板之剝離時的固定手段，亦並不被限定於 在上述之實施形態中所例示者。 又，在硬化部處之硬化’於上述之實施形態中，係以 下述一般之程序而進行：將真空處理室33b內作真空抽氣 ’將壓模S推壓附著於樹脂R上，紫外線照射所致之樹 脂R的硬化’大氣開放’將真空處理室33b以及推壓板 33a上升。但是’亦可在真空中將壓模S推壓附著於樹脂 R上，而後，先藉由大氣開放來作大氣加壓，之後再進行 -30- 200937411 紫外線照射所致之樹脂R的硬化。 如此這般，若是在硬化前施加大氣壓所致之加壓，則 能夠減低在樹脂R中所產生之氣泡（outgas )。又，在真 空中之紫外線照射時，由於減壓，從樹脂R中而產生氣泡 的可能性係爲高，但是，藉由在大氣中之紫外線照射，能 夠防止氣泡之產生。 ' 又，當在壓模所致之對於樹脂R的推壓附著時以及在 $ 紫外線照射時而將真空解除的情況中，係可導入大氣，亦 可導入惰性氣體。此時，真空處理室33b係維持被密閉的 狀態，並一直進行至紫外線所致之硬化以及壓模S之剝離 階段爲止。當導入惰性氣體的情況時，紫外線硬化時之氧 妨害係被防止。進而，當導入除電後之氣體的情況時，則 能夠防止在剝離時之由於帶電所致的垃圾之附著。 又，硬化部，係亦可配置爲不僅是在轉印時，而在壓 模S之剝離後亦使樹脂硬化。例如，在上述實施形態中， 〇 亦可在搬出位置3D處配置紫外線照射裝置，並使樹脂R 充分地硬化。藉由此，能夠防止未硬化之樹脂R從剝離後 之基板P而附著在臂11上，並使附著在臂11上之垃圾一同 落下至下一個的基板P處，並污染基板P。於此情況中， 亦同樣的，若是在搬出位置D處準備真空處理室並設爲 在減壓空間中照射紫外線，則能夠防止在樹脂R之硬化時 的外週端面之氧妨害。At the indexing station 41, for example, a stamper S1 in which the unevenness of the first layer is formed, a stamper S2 in which the unevenness of the second layer is formed, and the like are exchanged or The stamper S3 in which the unevenness of the third layer is formed, and the preliminary stampers SI', S2' and the like are formed. Regarding which stamper S is used, or at what timing to press or exchange the stamper S, it is controlled by the control device. In addition, this example is not intended to limit the type and number of stampers S-27-200937411 of the present invention. For example, when only the first layer is transferred on the flat substrate and only the second layer is transferred on the uneven substrate, the stamper s used may be one type. By preparing a plurality of the same types of stampers S and placing them on the different positions of the turntable 31, the first pressing device 33A and the second pressing device 3 3 B can be used for two substrates. P while transferring the same, unevenness in parallel. φ For example, the rotary table 31 of Fig. 22, although the stampers S1 and S2 are alternately placed as a loader, may be caused only by the stamper S 1 or only when it is rotated by 180 °. The transfer by the stamper S2 is simultaneously performed at the first pressing device 33 A and the second pressing device 33B. It is also possible to mount the same stamper S1 or the stamper S2 at all positions, and at each 45° rotation, the transfer will be caused only by the stamper S1 or only by the stamper S2. The first pressing device 33A and the second pressing device 33B are simultaneously performed. Further, in the case of performing transfer of two layers, it is conceivable to place two types of stampers SI and S2 alternately or at specific intervals at different positions of the turntable 31. For example, at the turntable 31 of Fig. 22, the transfer processing can be simultaneously performed at the first pressing device 33A and the second pressing device 33B via the stamper si every 9CT, and the stamper can be passed through the stamper. In S2, the transfer processing is simultaneously performed at the first pressing device 33A and the second pressing device 33B, and the process proceeds alternately. It can also be rotated at 45 per revolution. When the first pressing device 33A and the second pressing device 33B are operated alternately and the transfer is performed, and when one of the two types of transfer patterns is to be changed, -28-200937411, for example, It is conceivable to exchange one of the layers with the stamper S3 via the stamper station 4. Further, in the case of danger, S2, there is a problem of damage or the like due to all or one of the damages, or the service life due to wear can be exchanged with the prepared stampers SI', S2'. In addition, the stamper S at the position where the problem or the like is generated is not used, and the rotary table 3 1 , the first push, and the second pressing device 3 3 B are controlled via the control device (disregarding the press mold, such as In general, the pressing device 33 may be of the above. Further, the resin may be partially heated by the resin during spin coating, for example, by using a spot heater. The heating in the vicinity of the circumference is low, so that it is opened by the rotation of the substrate, and it is easy to overflow toward the outer circumference. Alternatively, the amount of volatilization is increased by φ. Therefore, since it is thinned at the outer periphery, Further, it is possible to suppress the increase in thickness, and it is possible to uniformize the thickness. Further, it is also possible to simultaneously assist in heating the adhesive. The method of applying the resin to the substrate is limited to rotation. The type of the resin is suitable for various materials that can be used in the future. It is also applicable to a general resin such as a resin which is irradiated from the outside or a resin which is like a thermosetting type. 1, S 2's 3 S1 stamper defects in part, may be considered at the end of the life of the case: such that only the transfer means in a manner g 3 3 A and S operated). In another one, it is also possible to use three heating devices to obtain heat energy by the centrifugal force of the viscosity of the heat source resin, and the residual adhesive is therefore free to blow hot air to the outside. It is not used for the current or the same as the radiation hardening type magnetic wave, and the temperature changes and hard -29-200937411. Further, it is also possible to reduce the adhesion between the resin and the resin by applying a specific treatment to the surface of the stamper, thereby facilitating the peeling. For example, in the case of an additional dielectric film, the peelability is improved. As an example, it is considered that the film thickness is about 20 η. As the dielectric material, Si〇2, siN, ZnSSi〇2, and ZnOGa2〇3' are used, but they are not limited thereto. Further, for example, if a film such as a general photocatalyst such as TiO 2 is added, the self-cleaning effect by the irradiation of ultraviolet rays can be obtained. Further, the driving mechanism for positioning is not limited to those caused by piezoelectric elements. For example, it can also be achieved by a scanning mechanism caused by screwing in the screw. The means for detecting the position of the substrate or the stamper is not limited to the C C D camera', and various sensors can be applied. Different detection means can also be used for the stamper and the substrate. The positioning means is also not limited to a specific constructor. For example, it may be a simple structure in which a common pin is passed through the center hole of the die and the center hole of the stamper in the substrate. Further, the fixing means at the time of peeling of the stamper and the substrate are not limited to those exemplified in the above embodiments. Further, the hardening at the hardened portion is performed in the above-described embodiment by the following general procedure: vacuum evacuation is performed in the vacuum processing chamber 33b, and the stamper S is pressed and adhered to the resin R, and ultraviolet irradiation is performed. The hardening of the resin R, 'opening of the atmosphere', raises the vacuum processing chamber 33b and the pressing plate 33a. However, the stamper S may be pressed against the resin R in a vacuum, and then atmospherically pressurized by opening the atmosphere, followed by hardening of the resin R by -30-200937411 ultraviolet irradiation. In this manner, if the pressurization due to the application of the atmospheric pressure before the hardening is performed, the bubbles (outgas) generated in the resin R can be reduced. Further, when ultraviolet rays are irradiated in the air, the possibility of generating bubbles from the resin R due to the pressure reduction is high, but the generation of bubbles can be prevented by ultraviolet irradiation in the atmosphere. Further, in the case where the pressing of the resin R by the stamper is adhered and the vacuum is released during the ultraviolet irradiation, the atmosphere may be introduced into the atmosphere, and an inert gas may be introduced. At this time, the vacuum processing chamber 33b is maintained in a sealed state, and is continued until the curing by the ultraviolet rays and the peeling step of the stamper S. When an inert gas is introduced, oxygen hindrance during ultraviolet curing is prevented. Further, when the gas after the de-energization is introduced, it is possible to prevent the adhesion of the garbage due to charging at the time of peeling. Further, the hardened portion may be disposed so that the resin is hardened not only at the time of transfer but also after the peeling of the stamper S. For example, in the above embodiment, the ultraviolet irradiation device may be disposed at the carry-out position 3D, and the resin R may be sufficiently cured. Thereby, the unhardened resin R can be prevented from adhering to the arm 11 from the peeled substrate P, and the garbage adhering to the arm 11 can be dropped together to the next substrate P, and the substrate P can be contaminated. In this case, in the same manner, when the vacuum processing chamber is prepared at the carry-out position D and the ultraviolet ray is irradiated in the decompression space, it is possible to prevent the oxygen leakage of the outer peripheral end surface during the curing of the resin R.
又，本發明之對象，其之大小、形狀、材質、記錄層 之數量等’係爲自由，並不被限定爲既存之CD或是DVD -31 - 200937411 等之規格’而可適用在於將來所被採用之所有規 中。亦可作爲再生專用之記憶媒體用而形成斷續 - 亦可作爲可追記、可覆寫之記憶媒體用而形成連 進而’將記錄部分設爲凸狀或是凹狀一事，亦爲 上述之群，例如，係可爲在如同DVD±R、 、DVD-RAM、BD-R、BD-RE — 般之可追記、可 憶媒體處所形成之溝構造。在形成此種群的情況 0 樹脂塗佈在基板處，並經由壓模而形成了凹凸之 經由濺鏟來形成記錄膜的必要。於此，所謂記錄 指由記錄材料（例如，有機色素、相變化材料等 記錄層本身的情形，亦有指將記錄層與其他層重 的情形。在上述所例示之記憶媒體的情況中，雖 要經過在記錄層上重疊反射層（例如，D V D ± R ) 層以介電層來挾持、更進而重疊反射層（例如， ，BD亦爲類似）、將記錄層以界面層與保護層 Q 進而重疊熱干涉層、反射層（例如DVD-RAM ) 程，但是，經過此種工程而被重疊後之複數層全 包含在記錄膜之槪念中。 作爲形成此種層之例子，在dvd±rw中， 爲單層的情況時，係經過有：在基板上塗佈樹脂 致之凹凸形成β濺鍍介電層Θ濺鏟記錄層β濺鍍 濺鍍反射層之工程。當多層之記錄層的情況時， 上述一般而形成了第1層之後，經過：塗佈樹脂 致之凹凸形成4與第1層相同之膜形成之工程。 格之基板 之凹坑， 續之群。 自由。 DVD土RW 覆寫的記 時，在將 後，係有 膜，係有 )所成之 疊後之物 然係有必 、將記錄 DVD土RW 來挾持、 之類的工 體，亦係 當記錄層 θ壓模所 介電層θ 係在如同 θ壓模所 -32- 200937411 本發明，係亦可適用在此種群之形成中，特別是，在 爲了形成記錄膜而有需要進行複數種之材料所致的複數次 一 之灑鍍的情況中，由於亦能夠準備複數台之濺鍍裝置來作 對應’因此，係成爲可進行有效率之製造。 【圖式簡單說明】 [圖π展示本發明之其中一種實施形態的簡略構成圖 ❹ [圖2]展示圖1之實施形態所致的轉印工程之流程圖。 [圖3]展示圖1之實施形態中的第1塗佈裝置之縱剖面 圖。 [圖4]展示圖1之實施形態中的第2塗佈裝置之縱剖面 圖。 [圖5]展示圖丨之實施形態中的第1塗佈裝置之縱剖面 圖。 〇 [圖6]展示圖1之實施形態中的第2塗佈裝置之縱剖面 圖。 « [圖7]展示圖1之實施形態中的定位裝置之縱剖面圖。 [圖8]展示圖1之實施形態中的基板之位置檢測的縱剖 面圖。 [圖9]展示圖1之實施形態中的定位工程之縱剖面圖。 [圖10]展示圖1之實施形態中的推壓裝置之縱剖面圖 〇 [圖11]展示圖〗之實施形態中的推壓硬化工程之縱剖 -33- 200937411 面圖。 [圖12]展示圖丨之實施形態中的推壓解除工程之縱剖 _面圖。 [圖1 3 ]展示圖1之實施形態中的剝離工程之縱剖面圖 〇 [圖14]展示本發明之其他實施形態的簡略構成圖。 [圖15]展示圖12之實施形態中的壓模之位置檢測的縱 Q 剖面圖。 [圖16]展示圖12之實施形態中的基板之位置檢測的縱 剖面圖。 [圖17]展示本發明之其他實施形態的簡略構成圖。 [圖18]展示本發明之其他實施形態的簡略構成圖。 [圖1 9]展示本發明之其他實施形態的簡略構成圖。 [圖20]展示本發明之其他實施形態的簡略構成圖。 [圖21]展示本發明之其他實施形態的簡略構成圖。 ^ [圖22]展示本發明之其他實施形態的簡略構成圖。 【主要元件符號說明】 1 :成膜部 2 :塗佈部 3 :轉印部 4 :壓模平台 3 A定位位置 3 B :第1推壓位置 -34- 200937411 3C :第2推壓位置 3 D :搬出位置 一 3E :供給位置 11、 21、 42 ：臂 12 :濺鍍裝置 12A :第1濺鍍裝置 ' 12B :第2濺鍍裝置 $ 22A :第1塗佈裝置 22B :第2塗佈裝置 23 、 31 :轉台 2 5、2 6、3 4 :照射裝置 3 1 a :基底 31b、 33c ：銷 3 2、3 3 d :定位裝置 3 2 a :支持台 〇 32b :驅動機構 32c : CCD攝像機 33 :推壓裝置 3 3 a :推壓板 33b:真空處理室 33A :第1推壓裝置 33B :第2推壓裝置 3 5 :載置台 41 :分度台（index table) -35 200937411 p :基 R、R1 S :壓 X :硬 R2 :樹脂 部份Further, the object of the present invention, the size, the shape, the material, the number of the recording layers, and the like are "free" and are not limited to the existing CD or the specifications of the DVD - 31 - 200937411 and the like, and may be applied in the future. All the rules adopted. It can also be used as a memory medium for reproduction. It can also be used as a recordable and rewritable memory medium to form a connection and then to make the recorded portion convex or concave. For example, it may be a trench structure formed in a recordable and memorable medium like DVD±R, DVD-RAM, BD-R, BD-RE. In the case of forming this population 0 The resin is applied to the substrate, and it is necessary to form a recording film via a shovel by forming a concavity and convexity via a stamper. Here, the recording refers to a case where a recording material (for example, a recording layer itself such as an organic dye or a phase change material) is also referred to as a case where the recording layer and the other layer are heavy. In the case of the memory medium exemplified above, To overlap the reflective layer (for example, BD is similar) by overlapping the reflective layer (for example, DVD ± R) on the recording layer, and then to form the recording layer with the interface layer and the protective layer Q. The thermal interference layer and the reflective layer (for example, a DVD-RAM) are overlapped, but the plurality of layers superposed by such a process are all contained in the memory film. As an example of forming such a layer, in dvd±rw In the case of a single layer, there is a process of coating a resin onto the substrate to form a β-sputtered dielectric layer, a splatter recording layer, a sputtering sputter reflective layer, and a multilayer recording layer. In the case where the first layer is formed as described above, the film is formed by the coating of the resin to form the same film as the first layer. The pits of the substrate are continued, and the group is continued. Overwriting time, in After that, there is a film, which is formed by the stacking of the material, and the recording of the DVD soil RW to hold the workpiece, etc., also when the recording layer θ is pressed by the dielectric layer θ Like the θ stamper-32-200937411, the present invention can also be applied to the formation of this population, in particular, in the case of a plurality of times of sputtering, in order to form a recording film. In this case, it is also possible to prepare a plurality of sputtering apparatuses for the corresponding ones. Therefore, it is possible to manufacture efficiently. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. π shows a simplified configuration of one embodiment of the present invention. [Fig. 2] A flow chart showing a transfer process caused by the embodiment of Fig. 1. Fig. 3 is a longitudinal sectional view showing a first coating device in the embodiment of Fig. 1. Fig. 4 is a longitudinal sectional view showing a second coating apparatus in the embodiment of Fig. 1. Fig. 5 is a longitudinal sectional view showing a first coating device in the embodiment of the drawing. Fig. 6 is a longitudinal sectional view showing a second coating apparatus in the embodiment of Fig. 1. « [ Fig. 7] A longitudinal sectional view showing a positioning device in the embodiment of Fig. 1. Fig. 8 is a vertical cross-sectional view showing the position detection of the substrate in the embodiment of Fig. 1. Fig. 9 is a longitudinal sectional view showing a positioning process in the embodiment of Fig. 1. Fig. 10 is a longitudinal sectional view showing a pressing device in the embodiment of Fig. 1. Fig. 11 is a longitudinal sectional view of a pressing hardening process in an embodiment of the drawing showing a drawing - 33 - 200937411. Fig. 12 is a longitudinal sectional view showing a pressing release process in the embodiment of the drawing. Fig. 13 is a longitudinal sectional view showing a peeling process in the embodiment of Fig. 1. Fig. 14 is a schematic structural view showing another embodiment of the present invention. Fig. 15 is a longitudinal Q sectional view showing the position detection of the stamper in the embodiment of Fig. 12; Fig. 16 is a longitudinal sectional view showing the position detection of the substrate in the embodiment of Fig. 12. Fig. 17 is a schematic block diagram showing another embodiment of the present invention. Fig. 18 is a schematic block diagram showing another embodiment of the present invention. Fig. 19 is a schematic block diagram showing another embodiment of the present invention. Fig. 20 is a schematic block diagram showing another embodiment of the present invention. Fig. 21 is a schematic block diagram showing another embodiment of the present invention. Fig. 22 is a schematic block diagram showing another embodiment of the present invention. [Description of main component symbols] 1 : Film forming portion 2 : Coating portion 3 : Transfer portion 4 : Die plate platform 3 A Positioning position 3 B : First pressing position - 34 - 200937411 3C : 2nd pushing position 3 D: carry-out position 3E: supply position 11, 21, 42: arm 12: sputtering device 12A: first sputtering device '12B: second sputtering device $22A: first coating device 22B: second coating Device 23, 31: turntable 2 5, 2 6 , 3 4 : irradiation device 3 1 a : base 31b, 33c: pin 3 2, 3 3 d : positioning device 3 2 a : support table 32b: drive mechanism 32c: CCD Camera 33: Pushing device 3 3 a : Pushing plate 33b: Vacuum processing chamber 33A: First pressing device 33B: Second pressing device 3 5: Mounting table 41: Index table -35 200937411 p : Base R, R1 S : Pressure X: Hard R2: Resin part
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