JP4679664B2 - Transfer device - Google Patents

Description

  The present invention relates to a technique for forming irregularities on a resin on a substrate, such as a recording layer of an optical disc, and more particularly to a transfer device for transferring irregularities formed on a stamper to a resin.

  Some optical discs such as CDs and DVDs have information recorded by projections called pits. In such an optical disk manufacturing process, it is essential to form pits on the surface of the substrate. Such a pit row is formed by using a stamper having irregularities corresponding to the pits as a mold, transferring the irregularities to the substrate, and then forming a reflective film on the surface.

  The unevenness transfer by the stamper is performed, for example, by applying a resin to the substrate, pressing the resin against the uneven surface of the stamper, and curing the resin. After curing, peeling the substrate from the stamper leaves minute irregularities on the substrate. Such stampers include a soft stamper that is made of the same material as the substrate, for example, polycarbonate, and is discarded after being peeled from the substrate, and a metal stamper that is made of metal and transfers tens of thousands of sheets in one piece. .

JP-A-2005-243114

  By the way, when the substrate coated with the resin is pressed against the stamper, the position of the unevenness of the stamper needs to exactly match the recording area on the substrate. In order to cope with this, in general, a common center pin is inserted into the center hole of the substrate and the stamper to position both of them (see Patent Document 1).

  However, in order to smoothly insert the center pin into the center hole of the substrate and the stamper, a certain gap is required between the center hole and the center pin. For this reason, even if the center hole of the substrate and the stamper is inserted into the center pin, there is a possibility that a slight deviation occurs between them. Even if one of the substrate and the stamper is fixed, the other is displaced due to the gap between the center pin and the center hole.

  The present invention has been proposed to solve the above-described problems of the prior art, and an object of the present invention is to provide a transfer apparatus capable of transferring the unevenness of the stamper to an accurate position of the substrate. .

To achieve the above object, the present invention is, resin contacting the surface of the stamper on the substrate, by curing the resin, in the transfer apparatus for transferring unevenness on the resin, irregularities in the stamper A pressing plate that holds the surface opposite to the surface; a support that supports the surface of the substrate opposite to the resin; a contact position where the resin on the substrate and the stamper contact; and a resin on the substrate The stamper held by the pressing plate in parallel with the contact surface in a state in which the resin and the stamper are in contact with the drive mechanism that moves the pressing plate between the stamper and the separation position where the stamper peels a by moving in the direction, and positioning means to align the relative position of the substrate and the stamper, after positioning by the positioning means, the hardness of the resin It characterized by having a a curing means for. The pressing plate holds the surface of the substrate opposite to the resin, the support base supports the surface of the stamper opposite to the uneven surface, and the positioning means is the stamper supported by the support base. A mode in which the relative positions of the substrate and the stamper are aligned by moving the substrate in a direction parallel to the contact surface is also an aspect of the present invention.

In the invention as described above, the positioning means moves the stamper in a direction parallel to the contact surface, thereby enabling relative alignment of the center of the substrate and the stamper, etc. Unevenness can be transferred.
In particular, since there is no relative movement between the substrate and the stamper after alignment, accurate positioning is possible.
Moreover, the holding of the stamper, the positioning of the stamper to the substrate, the pressing of the stamper to the substrate, curing the resin, the release of the stamper, it is possible to perform in Ichi箇plant can be simplified structure and process.

Another aspect is the curing means is transmitted through said substrate, characterized in that provided in the irradiation allows a position of the electromagnetic waves to the resin.

In the above embodiments, the resin can be cured by irradiating electromagnetic waves from the substrate side after pressing the stamper against the resin of the substrate.

The press plate, the support base, and the positioning means are provided on a turntable that moves the substrate and the stamper by rotation.

  In the aspect as described above, the stamper can be positioned with respect to the substrate, the stamper unevenness can be transferred to the resin, and the resin can be cured while the substrate and the stamper are moved according to the rotation of the turntable.

  Another aspect is characterized by having fixing means for fixing at least one of the substrate and the stamper when the stamper is peeled from the cured resin.

In the above aspect, when the stamper and the resin are peeled off by the pressing plate , one of the substrate and the stamper is fixed by the fixing means, so that incomplete peeling can be prevented.

In another aspect, the fixing means is provided so as to be movable independently of the pressing plate or the support base, and has a pin for pressing a central hole of the substrate.
In the above aspect, when the stamper and the resin are peeled off, the substrate is fixed by the pins, so that incomplete peeling can be prevented.

  Another aspect has a sealing means for sealing the surrounding space so that the surrounding space can be evacuated when the stamper is brought into contact with the resin, and the movable portion of the positioning means is sealed by the sealing means. It is provided outside the space.

  In the above aspect, since the movable part of the positioning means is disposed outside the sealed space that becomes a vacuum, it is not necessary to use an expensive vacuum for the lubricating oil or the like.

  Another aspect is characterized by comprising detection means for detecting the positions of the substrate and the stamper, and control means for controlling the positioning means based on the position detected by the detection means.

  In the above aspect, based on the position detection of a board | substrate and a stamper, both can be positioned correctly.

  As described above, according to the present invention, it is possible to provide a transfer device capable of transferring the unevenness of the stamper to an accurate position of the substrate.

It is a simplified lineblock diagram showing a 1st embodiment of the present invention. It is a flowchart which shows the transfer process by embodiment of FIG. It is a longitudinal cross-sectional view which shows the positioning device in embodiment of FIG. It is a longitudinal cross-sectional view which shows the position detection of the board | substrate in embodiment of FIG. It is a longitudinal cross-sectional view which shows the positioning process in embodiment of FIG. It is a longitudinal cross-sectional view which shows the press apparatus in embodiment of FIG. It is a longitudinal cross-sectional view which shows the press process in embodiment of FIG. It is a longitudinal cross-sectional view which shows the ultraviolet irradiation process in embodiment of FIG. It is a longitudinal cross-sectional view which shows the peeling process in embodiment of FIG. It is a simplified block diagram which shows the 2nd Embodiment of this invention. 11 is a flowchart showing a transfer process according to the embodiment of FIG. It is a longitudinal cross-sectional view which shows the press apparatus in embodiment of FIG. It is a longitudinal cross-sectional view which shows the position detection of the board | substrate in embodiment of FIG. It is a longitudinal cross-sectional view which shows the positioning process in embodiment of FIG. It is a longitudinal cross-sectional view which shows the press process in embodiment of FIG. It is a longitudinal cross-sectional view which shows the peeling process in embodiment of FIG. It is a longitudinal cross-sectional view which shows the carrying-out process in embodiment of FIG. It is a simplified block diagram which shows other embodiment of this invention. It is a simplified block diagram which shows other embodiment of this invention. It is a longitudinal cross-sectional view which shows the position detection process of other embodiment of this invention. It is a longitudinal cross-sectional view which shows the position detection process of other embodiment of this invention. It is a longitudinal cross-sectional view which shows the position detection process and positioning process of other embodiment of this invention. It is a longitudinal cross-sectional view which shows the position detection process and positioning process of other embodiment of this invention. It is a longitudinal cross-sectional view which shows the positioning process of other embodiment of this invention. It is a longitudinal cross-sectional view which shows the positioning process of other embodiment of this invention. It is a longitudinal cross-sectional view which shows the positioning process of other embodiment of this invention. It is a longitudinal cross-sectional view which shows the ultraviolet irradiation process of other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Conveyance part 2 ... Application | coating part 3 ... Transfer part 3A ... Positioning position 3B ... Pressing position 3C ... Curing position 3D ... Unloading position 11 ... Arm 21 ... Arm 22 ... Spin coating device 31 ... Turntable 31a ... Base 31b, 33c ... Pin 32, 33d ... Positioning device 32a ... Supporting base 32b ... Drive mechanism 32c ... CCD camera 33 ... Pressing device 33a ... Pressing plate 33b ... Vacuum chamber 34 ... Ultraviolet irradiation device 35 ... Mounting table 35a ... Flat plate P ... Substrate R ... Resin S ... Stampa

Next, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.
[ First Reference Example ]
[Constitution]
First, the configuration of a first reference example of a transfer apparatus (hereinafter referred to as the present apparatus) which is a premise of the embodiment will be described with reference to FIGS. 1 and 3 to 9. The apparatus constitutes a part of an optical disk manufacturing apparatus. A substrate molding apparatus disposed in an upstream process of the apparatus, and a reflection film forming apparatus disposed in a downstream process of the apparatus. Any known technique can be applied to the substrate bonding apparatus, the mechanism for transferring the substrate between the apparatuses, and the description thereof is omitted.

  That is, as shown in FIG. 1, the apparatus includes a transport unit 1 for loading and unloading a substrate P for an optical disc, a coating unit 2 for coating a transfer resin on the substrate P, and a substrate P. A transfer portion 3 for pressing and curing the unevenness of the stamper S to the resin applied thereon is provided.

  The transport unit 1 is means for transporting the substrate P by gripping (or adsorbing) the substrate P to the end of the arm 11 that rotates in the horizontal direction by a drive mechanism (not shown). The substrate P put in from the previous process is held by the end of the arm 11 and transferred to the coating unit 2. Further, the arm 11 receives the substrate P on which the unevenness is transferred to the resin in the transfer unit 3 and carries it out to the next process.

  The coating unit 2 includes an arm 21 that rotates in a horizontal direction by a driving mechanism (not shown), and a spin coating device 22 that spin-coats resin on the substrate P. The arm 21 holds (or adsorbs) the substrate P delivered from the arm 11 at the end, places the substrate P on the spin coating device 22, and delivers the substrate P after spin coating to the transfer unit 3. Note that the end portion of the arm 21 is configured to be rotatable so that the substrate P after spin coating is reversed and passed to the transfer unit 3.

  The spin coating device 22 drops resin supplied from a supply device onto a substrate P placed on a turntable (not shown) by a dropping device, and rotates the turntable at a high speed, whereby the resin is applied onto the substrate P by centrifugal force. It is a device that spreads.

  The transfer unit 3 moves the substrate P by rotating the large-diameter turntable 31, and also positions the substrate P and the stamper S, presses the stamper S against the resin, cures the resin, and unloads the substrate P. It is a device to perform. The position of the substrate P corresponding to each process is a positioning position 3A, a pressing position 3B, a curing position 3C, and a carry-out position 3D. In addition, the turntable 31 rotates intermittently according to each position as described above by a driving mechanism (not shown).

  As shown in FIG. 3, a susceptor-like base 31 a is supported on the turntable 31. At the center of the base 31a, a pin 31b is provided so as to be moved up and down by a driving mechanism (not shown). As shown in FIG. 4, the center hole of the substrate P which is conveyed by the arm 21 of the coating unit 2 and is inverted so that the resin R is placed on the tip of the pin 31 b is placed (first holding). means).

  A positioning device 32 is provided on the base 31a. The positioning device 32 includes a support base 32a, a drive mechanism 32b, and a CCD camera 32c. The support table 32a is a table on which the stamper S is placed. The mounting surface of the stamper S of the support base 32a is a magnet, and is configured to attract and hold a metal stamper S such as nickel (second holding means). In addition, the support stand 32a is provided with a gripping tool for gripping the periphery of the stamper S, and prevents the stamper S from being displaced (fixing means) while being attracted by a magnet.

  As shown in FIG. 5, the drive mechanism 32b is a mechanism for positioning the stamper S on the support base 32a with respect to the substrate P on the pin 31b. The drive mechanism 32b can move the support base 32a in a horizontal direction (XY axis direction) parallel to the contact surface between the substrate P and the stamper S by energizing a piezoelectric element such as a piezoelectric element. The CCD camera 32c is means for detecting alignment marks attached to the substrate P and the stamper S for positioning. The drive mechanism 32b is controlled by detecting the alignment marks of the substrate P and the stamper S with the CCD camera 32c, and the control device controls the energization to the piezoelectric element so that the centers of both coincide.

  As described above, since the center hole of the substrate P is placed on the upper end of the pin 31b, the diameter of the pin 31b is larger than the center hole of the substrate P. The stamper S is also formed with a center hole, and the pin 31b moves up and down through the center hole. Thus, the diameter of the central hole of the stamper S is larger than the diameter of the central hole of the substrate P so that the pin 31b having a diameter larger than that of the central hole of the substrate P can be moved up and down. The center hole diameter (inner diameter) of a normal optical disk substrate P is 15 mm, and the minimum diameter of the recording area is 23 mm. Therefore, for example, it is conceivable that the inner diameter of the stamper S is 22 mm and the diameter of the pin 31b is 17 mm. In this case, the diameter of the pin 31b may be in a range larger than 15 mm and smaller than 22 mm.

  As shown in FIGS. 6 and 7, a pressing device 33 is disposed at the pressing position 3B. The pressing device 33 includes a pressing plate 33a that presses the substrate P and a vacuum chamber 33b that seals the surrounding space. The pressing plate 33a is provided so as to be movable up and down by a driving mechanism (not shown), and presses the substrate P against the stamper S by descending. The vacuum chamber 33b is provided so as to be movable up and down by a drive mechanism (not shown), and is lowered to seal the space on the base 31a. A vacuum source (not shown) is connected to the vacuum chamber 33b, and the internal sealed space can be evacuated.

  As shown in FIG. 8, an ultraviolet irradiation device 34 is disposed at the curing position 3C. The ultraviolet irradiation device 34 is a means for curing the resin having the concavo-convex transferred thereon by irradiating the substrate P pressed against the stamper S with ultraviolet rays. As shown in FIG. 9, the cured substrate P can be peeled off from the stamper S by raising the pins 31b.

  The operation timing of each driving mechanism in the transport unit 1, the coating unit 2, and the transfer unit 3 is controlled by a control device. This control device can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. Therefore, a computer program for controlling the operation of the apparatus according to the procedure described below and a recording medium recording the computer program are also one aspect of the present invention.

[Action]
A procedure for transferring the unevenness of the stamper S to the resin on the substrate P by the apparatus as described above will be described with reference to FIGS. 1 and 3 to 9 according to the flowchart of FIG. That is, as shown in FIG. 1, the substrate P molded in the previous process is put into the transport unit 1 and transferred from the arm 11 to the arm 21 (step 201). Then, the arm 21 places the substrate P on the turntable of the spin coating device 22, and the resin is spread on the substrate P by spin coating (step 202).

  On the other hand, as shown in FIG. 3, in the positioning device 32, the alignment mark of the stamper S is detected by the CCD camera 32c (step 203). As shown in FIG. 4, the substrate P coated with the resin R is inverted by the arm 21 and placed on the pin 31b of the positioning device 32 (step 204). At this time, the alignment mark on the substrate P is detected by the CCD camera 32c (step 205). Further, as shown in FIG. 5, the drive mechanism 32 b of the positioning device 32 moves and positions the support base 32 a so that the center of the stamper S coincides with the center of the substrate P based on the detected alignment mark. (Step 206).

  Next, the substrate P and the stamper S are moved to the pressing position 3B by the rotation of the turntable 31 (step 207). In the pressing position 3B, as shown in FIG. 6, the vacuum chamber 33b is lowered to seal the space on the base 31a (step 208). Then, the vacuum source is operated to evacuate the vacuum chamber 33b (step 209). Further, as shown in FIG. 7, the substrate P is pushed downward by lowering the pressing plate 33a. As a result, the pin 31b is lowered together with the substrate P, and the resin R of the substrate P is pressed against the uneven surface of the stamper S (step 210).

  Thereafter, the atmosphere is released, the vacuum chamber 33b and the pressing plate 33a are raised (step 211), and the substrate P and the stamper S are moved to the curing position 3C by the rotation of the turntable 31 (step 212). In the curing position 3C, as shown in FIG. 8, the resin R is cured by irradiating ultraviolet rays from above the substrate P by the ultraviolet irradiation device 34 (step 213).

  Further, the substrate P and the stamper S are moved to the carry-out position 3D by the rotation of the turntable 31 (step 214). At the carry-out position 3D, as shown in FIG. 9, the substrate P is separated from the stamper S by raising the pin 31b (step 215). At this time, since the stamper S is fixed by suction with a magnet and gripping with a gripping tool, only the substrate P can be raised and the resin R can be peeled from the stamper S. Thereby, the board | substrate P with the resin R which has an unevenness | corrugation is produced. And the board | substrate P is carried out to the following process with the arm 11 of the conveyance part 1 (step 216).

[effect]
According to the reference example as described above, since the positioning device 32 moves the substrate P and the stamper S in the direction parallel to the contact surface, the center of each other can be positioned. Unevenness can be transferred to the position. In particular, by detecting the alignment mark for positioning the substrate P and the stamper S with the CCD camera 32c, both can be accurately positioned.

  Further, the pin 31b can hold the substrate P before the stamper S is brought into contact with the resin R, and can also peel the substrate P from the stamper S after the resin R is cured, thereby simplifying the apparatus. . In particular, when the stamper S and the resin R are peeled off by the pin 31b, the stamper S is fixed by the magnet and the gripping tool, so that incomplete peeling can be prevented.

  Furthermore, the substrate P and the stamper S can be moved according to the rotation of the turntable 31, the stamper S can be positioned with respect to the substrate P, the unevenness of the stamper S can be transferred to the resin R, and the resin R can be cured.

[ Second Reference Example ]
[Constitution]
A second reference example of the present invention will be described with reference to FIGS. 10 and 12 to 17. This reference example has basically the same configuration as the first reference example . However, this reference example is different in that the stamper S is on the top and the substrate P is on the bottom, and the pressing position 3B can be positioned, transferred, and cured (see FIG. 10).

  That is, in this embodiment, as shown in FIG. 12, the mounting table 35 on which the substrate P on the turntable 31 is mounted has a flat plate 35a formed of a material that transmits ultraviolet rays such as quartz. Yes. The CCD camera 32c for detecting the alignment marks on the stamper S and the substrate P is disposed below the flat plate 35a.

On the other hand, the stamper S in the transfer unit 3 is configured to support the stamper S. The support surface of the stamper S in the pressing plate 33a is a magnet, and is configured so that the stamper S is attracted and held (second holding means). Note that the pressing plate 33a is provided with a gripping tool for gripping the periphery of the stamper S, and prevents the stamper S from being displaced together with attraction by a magnet (fixing means). Then, as shown in FIG. 14, the support surface of the stamper S in pressing plate 33a, by providing the positioning device 33d (as above driving mechanism 32 b), by the stamper S is moved in the horizontal direction, the substrate P The stamper S is configured to be positionable with respect to.

  In addition, a pin 33c is provided at the center of the pressing plate 33a so as to be lifted and lowered independently of the pressing plate 33a by a driving mechanism (not shown). As shown in FIG. 16, the pin 33 c is configured so that the tip can hold the center hole of the substrate P and prevent the substrate P from being displaced by being lowered (fixing means). Further, an ultraviolet irradiation device 34 is disposed below the mounting table 35 as shown in FIG. The ultraviolet rays from the ultraviolet irradiation device 34 pass through the flat plate 35 a and the substrate P and are irradiated to the resin R.

[Action]
The operation of the present embodiment as described above will be described with reference to FIGS. 10 and 12 to 17 according to the flowchart of FIG. In the present embodiment, positioning and transfer are performed in the pressing device 33 at the pressing position 3B, but the other steps are the same as those in the first embodiment, so the description is simplified. .

  First, as shown in FIG. 12, the alignment mark of the stamper S is detected by the CCD camera 32c in the pressing device 33 (step 1101). On the other hand, as shown in FIG. 13, the substrate P that is loaded from the previous process and coated with the resin R in the spin coating device 22 is placed on the flat plate 35 a of the mounting table 35 with the resin R facing up, By rotation, it moves to the pressing position 3B (steps 1102 to 1104). At this time, the alignment mark on the substrate P is detected by the CCD camera 32c (step 1105).

Next, as shown in FIG. 14, based on the detected alignment mark, the support surface of the stamper S on the pressing plate 33a is moved by the positioning device 33d so that the centers of the stamper S and the substrate P are aligned. (Step 1106). Then, as shown in FIG. 15, the vacuum chamber 33b is lowered to seal the space on the base 31a (step 1107). Further, the vacuum source is operated to evacuate the vacuum chamber 33b (step 1108).

  Next, the stamper S is pressed against the resin R on the substrate P by lowering the pressing plate 33a (step 1109). In this state, when the ultraviolet ray is irradiated from the ultraviolet ray irradiation device 34, the resin R is cured (step 1110).

  After the curing, as shown in FIG. 16, the pin 33c is lowered to press the substrate P (step 1111), the atmosphere is released, and the vacuum chamber 33b and the pressing plate 33a are raised to remove the stamper S from the substrate P. Strip (step 1112). Thereby, the board | substrate P with the resin R which has an unevenness | corrugation is produced. Then, as shown in FIG. 17, the pins 31 b are lifted to release the substrate P, and the turntable 31 is rotated to move the substrate P to the unloading position (step 1113). The substrate P is carried out to the next process (step 1114).

[effect]
According to the present embodiment as described above, the stamper S is held, the stamper S is positioned with respect to the substrate P, the stamper S is pressed against the substrate P, the resin R is cured, and the stamper S is peeled off by one pressing device 33. Since it can be performed, the structure and the process can be simplified.

  Further, when the stamper S and the resin R are peeled off by raising the pressing plate 33a, the stamper S and the substrate P are fixed by fixing means such as a magnet, a gripper, and a pin 33c, thereby preventing incomplete peeling. it can.

[ Embodiment ]
The embodiment of the present invention will be described based on the above reference example. For example, as shown in FIGS. 18 and 19, a plurality of positioning devices 32 are provided on the turntable 31 of the transfer unit 3, and positioning, transfer, curing, and carrying out are simultaneously performed on a plurality of substrates P. Therefore, efficient production becomes possible. In this case, one substrate P may be processed for each of a plurality of positions (FIG. 18), or a plurality of substrates P may be processed (FIG. 19). Moreover, you may combine them.

  Further, as shown in FIGS. 20 and 21, by detecting the alignment marks of the substrate P and the stamper S at the same time at the pressing location, it is possible to prevent displacement due to movement after detection and perform more accurate positioning. Can do. As described above, the detection by the CCD camera 32c as the detection means may be performed from above and below the apparatus, but as shown in FIG. 21, the space between the substrate P and the stamper S is provided so as to be removable. By configuring the CCD camera 32c to detect from between the substrate P and the stamper S, the alignment mark may be directly imaged to increase the recognition rate and improve the accuracy. Further, as shown in FIGS. 22 and 23, after the substrate P and the stamper S are pressure-bonded, the alignment mark may be detected and positioned so as to shift to the correct position. In this case, since there is no vertical movement after alignment, more accurate positioning can be performed.

  Further, as shown in FIG. 24, positioning may be performed by moving the base 31a and the pin 31b by the drive mechanism 32b. In this way, moving the base 31a and the pin 31b makes the load lighter than moving the mounting table 32a, so that positioning accuracy and moving speed can be improved. Furthermore, since the drive mechanism 32b is disposed outside the vacuum region, it is not necessary to use an expensive vacuum device for oil sliding.

  In addition, as shown in FIG. 25, the lowered pin 33c may be inserted into the center hole of the substrate P to perform the positioning operation. In this case, since the substrate P is fixed and positioned by the pins 33c, the alignment mark detection by the CCD camera 32c is only the stamper S, and the detection step is reduced. In addition, as shown in FIG. 26, in a state where the pin 33c is inserted into the center hole of the substrate P, the substrate P may be moved by the pin 33c and positioned with respect to the stamper S (the seal, guide, etc. are not shown). (Omitted).

  In addition, as shown in FIG. 27, the pressing plate 33a is made of a material that transmits ultraviolet rays, and an ultraviolet irradiation device 34 is provided in the vacuum chamber 33b, so that ultraviolet irradiation is performed in a vacuum to prevent oxygen inhibition. Is also possible.

  Further, the method of applying the resin to the substrate is free and is not limited to spin coating. As the resin, any material that can be used at present or in the future can be used. It is also possible to apply a material that is cured by irradiating a broad electromagnetic wave from the outside, such as a radiation curable resin, or by applying a temperature change, such as a thermosetting resin.

  Further, the driving mechanism for positioning is not limited to that using a piezoelectric element. For example, it can be realized by a scanning mechanism using a feed screw. In the second embodiment, the positioning device 33d is provided on the pressing plate 33a. However, a driving mechanism that moves the pressing plate 33a in the horizontal direction or a driving mechanism that moves the pressing plate 33a in the horizontal direction together with the vacuum chamber 33b. By providing, you may comprise so that positioning of the stamper S hold | maintained at the press plate 33a can be performed.

  Also, the means for detecting the position of the substrate or stamper is not limited to the CCD camera, and various sensors can be applied. Different detection means may be used for the stamper and the substrate. The fixing means at the time of peeling off the stamper and the substrate is not limited to the one exemplified in the above embodiment.

  In addition, the object of the present invention is free in size, shape, material, number of recording layers, etc., and is not limited to existing standards such as CD and DVD, but can be applied to substrates of all standards to be adopted in the future. Is possible. Intermittent pits can be formed for a read-only storage medium, or continuous grooves can be formed for a recordable and rewritable storage medium. Furthermore, it is free to make the recording part convex or concave.

Claims (8)

In the transfer device for transferring the unevenness to the resin by bringing the uneven surface of the stamper into contact with the resin on the substrate and curing the resin,
A pressing plate that holds a surface opposite to the uneven surface of the stamper;
A support for supporting the surface of the substrate opposite to the resin;
A drive mechanism for moving the pressing plate between a contact position where the resin on the substrate and the stamper are in contact and a separation position where the stamper is peeled off from the resin on the substrate;
Positioning means for aligning the relative positions of the substrate and the stamper by moving the stamper held by the pressing plate in a direction parallel to the contact surface in a state where the resin and the stamper are in contact with each other.
A curing means for curing the resin after positioning by the positioning means;
A transfer device comprising: In the transfer device for transferring the unevenness to the resin by bringing the uneven surface of the stamper into contact with the resin on the substrate and curing the resin,
A pressing plate that holds the surface of the substrate opposite to the resin;
A support base for supporting a surface opposite to the uneven surface of the stamper;
A drive mechanism for moving the pressing plate between a contact position where the resin on the substrate and the stamper are in contact and a separation position where the stamper is peeled off from the resin on the substrate;
Positioning means for aligning the relative positions of the substrate and the stamper by moving the stamper supported by the support base in a direction parallel to the contact surface in a state where the resin and the stamper are in contact with each other;
A curing means for curing the resin after positioning by the positioning means;
A transfer device comprising: It said curing means is transmitted through said substrate transfer device according to claim 1 or claim 2 wherein, characterized in that provided in the irradiation allows a position of the electromagnetic waves to the resin. Said pressing plate, said support table and said positioning means, the transfer device according to claim 1 or claim 2 wherein, characterized in that provided in the turntable for moving the substrate and the stamper by rotation. Upon the release of the stamper from the cured the resin, the substrate and the transfer apparatus according to claim 1 or claim 2, wherein characterized in that it has a fixing means for fixing at least one of the stamper. 6. The transfer apparatus according to claim 5, wherein the fixing means includes a pin that is provided so as to be movable independently of the pressing plate or the support base and that presses a central hole of the substrate. When bringing the stamper into contact with the resin, it has a sealing means for sealing so that the surrounding space can be evacuated,
The movable part of the positioning means, the transfer device according to claim 1 or claim 2 wherein, characterized in that provided outside the space sealed by said sealing means. Detecting means for detecting positions of the substrate and the stamper;
Control means for controlling the positioning means based on the position detected by the detection means;
The transfer device of claim 1 or claim 2, wherein the having.

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