JP2011000804A - Irregular pattern forming method, method of manufacturing information recording medium, and resin material curing treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To evade an irregular pattern forming face from being contaminated or flawed.SOLUTION: At least one of an irradiation level of an energy line, a kind of the irradiation energy line, and a kind of an applying material 17 is made different on an A-face 10a and a B-face 10b, so as to make curing rates of the material 17 different on the A-face 10a and the B-face 10b, when forming an A2 irregular pattern 50a and a B2 irregular pattern 50b inverted in irregular position pattern relations to irregular patterns 40a, 40b on the both materials 17, by executing stamper bonding treatment for applying the energy line cured type resin material 17, for bonding an A-stamper 30A formed with the A1 irregular patterns 40a onto the A-face 10a, and for bonding a B-stamper 30A formed with the B1 irregular patterns 40b onto the B-face 10a, resin material curing treatment for curing the material 17 with irradiation of the energy line, and stamper separation treatment for separating the stampers 30A, 30B from the material 17.

Description

  The present invention relates to a concavo-convex pattern forming method for forming a concavo-convex pattern on the A and B surfaces of a substrate, an information recording medium manufacturing method for manufacturing an information recording medium using the formed concavo-convex pattern, and a resin when forming the concavo-convex pattern. The present invention relates to a resin material curing processing apparatus for curing a material.

  For example, Japanese Patent Laid-Open No. 2005-153091 discloses a transfer device that transfers a concave / convex pattern of a stamper to one surface of a substrate by pressing the stamper on a substrate having a polystyrene resin film formed on a silicon wafer and then peeling the stamper. (Method: Method for forming concave / convex pattern). This transfer apparatus includes an alignment unit and a pressure unit for pressing the stamper against the substrate, a peeling unit for peeling the stamper from the substrate, and the like. In the transfer process of the concavo-convex pattern using this transfer device, first, the stamper and the substrate that are brought into close contact with each other by the alignment unit are transported to the pressure unit and heated to a predetermined temperature in the vacuum chamber. The substrate and stamper are pressurized (pressed). Subsequently, after the pressurized substrate and stamper are cooled, the substrate and stamper in that state are transported to the peeling unit and set between the suction stage and the suction head.

  Next, the substrate is fixed to the suction stage so that the back surface (the surface opposite to the surface attached to the stamper) of the substrate is sucked, and the tip of the peeling wedge disposed on the suction stage is fixed to the substrate. Insert at the interface with the stamper. Subsequently, the head support plate is lowered to bring the suction head into contact with the back surface of the stamper (the surface opposite to the surface attached to the substrate). The stamper is fixed to the head (head support plate), and the tip of the peeling wedge disposed on the head support plate is inserted into the interface between the substrate and the stamper. In this state, the stamper fixed to the head support plate is peeled from the substrate fixed to the suction stage by tilting the head support plate about 1 to 10 degrees with respect to the suction stage. Thereby, the uneven pattern of the stamper is transferred to the substrate, and a series of transfer processes is completed.

Japanese Patent Laying-Open No. 2005-153091 (pages 11-13, FIG. 6)

  However, the conventional transfer apparatus has the following problems. That is, in the conventional transfer apparatus, when the stamper is peeled off from the substrate, the substrate is fixed to the suction stage so as to suck the back surface of the substrate, and the suction head (head support plate) is fixed so as to suck the back surface of the stamper. In the state in which the stamper is fixed to (3), a configuration is adopted in which the stamper is separated from the substrate by separating the suction stage and the suction head from each other. On the other hand, the applicant has developed a patterned medium (discrete track medium) in which a servo pattern and a data track pattern are formed on both the front and back surfaces of a base material by a concavo-convex pattern. When the stamper is peeled from the intermediate body using an apparatus that adopts the same configuration as the stamper peeling unit in the transfer device described above during the production of the patterned medium (when the uneven pattern is formed), the formation of the uneven pattern in the intermediate body Oil or dust adheres to the surface (the surface to which the concave / convex pattern of the stamper is transferred) (hereinafter, this state is also referred to as “dirt”), or the intermediate falls and scratches the surface on which the concave / convex pattern is formed. The problem that occurs occurs.

  Specifically, when manufacturing the patterned medium, first, for example, an ultraviolet curable resin material 17 is applied to the A surface 10a and the B surface 10b of the intermediate 10x (see FIG. 5) for manufacturing the patterned medium. After that, the resin material 17 is cured by irradiating the resin material 17 with ultraviolet rays in a state where the stampers 30A and 30B (see FIG. 5) for forming the uneven pattern are pressed against the A surface 10a and the B surface 10b, respectively. Next, the stamper 30A is peeled from the A surface 10a of the intermediate 10x using a stamper peeling device 8 (see FIG. 6) provided with stamper holding portions 72a and 72b having a plurality of suction pads 82. At this time, as shown in FIG. 6, the stamper 30A is first held by the stamper holding portion 72a so that the back surface (the lower surface in the figure) of the stamper 30A is sucked by each suction pad 82, and each suction pad 82 The stamper 30B is held by the stamper holding portion 72b so that the back surface (the upper surface in the figure) of the stamper 30B is attracted by 82. Next, as an example, the stamper holding portion 72b is moved (raised) in the direction of arrow B with respect to the stamper holding portion 72a.

  At this time, since the back surfaces of the stampers 30A and 30B are sucked and held by the plurality of suction pads 82, the force in the direction to be peeled off from the intermediate 10x is applied to the entire area of both stampers 30A and 30B. Join. Accordingly, as shown by the solid line in FIG. 15, the intermediate body 10x is kept in close contact with the stamper 30B, and the stamper 30A is peeled off from the intermediate body 10x, but the dotted line is shown in FIG. Thus, the intermediate body 10x may peel from the stamper 30B while the intermediate body 10x is in close contact with the stamper 30A. For this reason, when the series of steps is automated, the stamper 30A is stacked at a predetermined processing completion position assuming that the separation from the intermediate 10x is completed, even though the intermediate 10x is actually in close contact. At this time, there is a possibility that the surface on which the concave / convex pattern is formed in the intermediate 10x that is in close contact with the stamper 30A may be soiled or scratched. In addition, as indicated by a broken line in the drawing, both of the stampers 30A and 30B may be peeled off from the intermediate body 10x. In such a state, the intermediate body 10x peeled off from both the stampers 30A and 30B is removed from the stamper peeling device. As a result, the surface of the concavo-convex pattern is soiled or scratched.

  The present invention has been made in view of such a problem, and a concavo-convex pattern forming method, a resin material curing treatment apparatus, and a concavo-convex pattern formed, which can avoid a situation in which dirt and scratches are formed on the surface where the concavo-convex pattern is formed. It is a main object to provide an information recording medium manufacturing method for manufacturing an information recording medium using the above.

  In order to achieve the above object, the uneven pattern forming method according to the present invention applies an energy ray curable resin material to the A-side and B-side of a base material and an A stamper on which the A1 uneven pattern is formed on the A-side. A stamper attaching process for attaching the B stamper on which the B1 uneven pattern is formed to the B surface, and a resin material curing process for irradiating the A surface and the B surface with energy rays to cure the resin material; And performing a stamper peeling process for peeling the A stamper from the resin material cured on the A surface and peeling the B stamper from the resin material cured on the B surface, and curing on the A surface. An A2 concavo-convex pattern in which the positional relationship between the A1 concavo-convex pattern and the concavo-convex pattern is reversed is formed on the A surface while Before forming the B2 concavo-convex pattern in which the concavo-convex positional relationship with the B1 concavo-convex pattern is reversed on the B surface on the resin material cured on the B surface, before the stamper peeling treatment of the resin material cured on the A surface The amount of irradiation of the energy beam to the resin material during the resin material curing treatment, the resin so that the curing rate of the resin material cured on the B surface is different from that before the stamper peeling treatment At least one of the type of the energy beam irradiated to the resin material at the time of the material curing process and the type of the resin material applied at the time of the stamper affixing process is made different on the A side and the B side. An A2 uneven pattern and the B2 uneven pattern are formed.

  In addition, the process of “different types of energy rays irradiated to the resin material” is “irradiating energy rays having different spectrums in wavelength regions including wavelength components contributing to the curing reaction of the resin material”. Means processing.

  In this case, the concavo-convex pattern forming method according to the present invention includes at least one of the irradiation time of the energy beam, the irradiation power of the energy beam, and the distance between the irradiation source of the energy beam and the substrate. The amount of irradiation with the energy rays is made different between the A surface and the B surface by making the A surface and the B surface different.

  Moreover, the uneven | corrugated pattern formation method which concerns on this invention makes the type of the said energy ray different in the said A surface and the said B surface, and makes the kind of the said energy beam different in the said A surface and the said B surface.

  Moreover, the uneven | corrugated pattern formation method which concerns on this invention is apply | coated at the time of the said stamper sticking process using the said resin material from which at least one of the kind of the polymerization initiator to contain and content of the said polymerization initiator differs. The type of the resin material is made different between the A side and the B side.

  Furthermore, the uneven | corrugated pattern formation method which concerns on this invention irradiates the said energy beam at least to the said resin material with the said low cure rate after the said stamper peeling process.

  In addition, the information recording medium manufacturing method according to the present invention manufactures an information recording medium using the A2 uneven pattern and the B2 uneven pattern formed by any of the above uneven pattern forming methods.

  In the resin material curing treatment apparatus according to the present invention, the energy ray curable resin material is applied to the A surface and the B surface, the A stamper is attached to the A surface, and the B stamper is applied to the B surface. A resin material curing processing apparatus that performs a resin material curing process that cures the resin material by irradiating the pasted base material with an energy beam, comprising an A irradiation source and irradiating the A surface with the energy beam A irradiation device, and a B irradiation device that includes a B irradiation source and irradiates the B surface with the energy beam, and both irradiation devices have a cure rate of the resin material cured on the A surface and the The distance A between the A irradiation source and the A surface during the resin material curing process, and the resin material curing process so that the curing rate of the resin material cured on the B surface is different. The distance B between the B irradiation source and the B surface is disposed in a different state, and the amount of irradiation of the energy rays with respect to the resin material during the resin material curing process is determined by the A surface and the B surface. The energy rays are irradiated in a different manner on the B surface.

  In the resin material curing treatment apparatus according to the present invention, the energy ray curable resin material is applied to the A surface and the B surface, the A stamper is attached to the A surface, and the B stamper is applied to the B surface. A resin material curing processing apparatus that performs a resin material curing process that cures the resin material by irradiating the pasted base material with an energy beam, comprising an A irradiation source and irradiating the A surface with the energy beam A irradiation device, and a B irradiation device that includes a B irradiation source and irradiates the B surface with the energy beam, and both irradiation devices have a cure rate of the resin material cured on the A surface and the The A irradiation source and the B irradiation source are configured with different types of irradiation sources so that the curing rate of the resin material cured on the B surface is different, and the resin material is cured during the resin material curing treatment. Te, the kind of the energy beam to be irradiated is different in the A surface and the B surface is irradiated with the energy rays to the resin material.

  In this case, the “irradiation sources of different types” include “energy ray sources that emit energy rays having different spectrums in the wavelength region including wavelength components that contribute to the curing reaction of the resin material, and are of different types. In addition to the “irradiation source configured to irradiate the resin material to the resin material”, “energy beam source that radiates energy rays of the same kind of spectrum and filter that makes the spectrum of the emitted energy rays different. This includes an “irradiation source configured to irradiate resin materials with different types of energy rays by changing the spectrum of energy rays radiated from the energy ray source with a filter”.

  In the concavo-convex pattern forming method according to the present invention, the curing rate of the resin material cured on the A surface of the substrate (the resin material between the A surface of the substrate and the A stamper) before the stamper peeling treatment, Energy rays for the resin material during the resin material curing process so that the curing rate of the resin material cured on the B surface (resin material between the B surface of the base material and the B stamper) before the stamper peeling process is different. And at least one of the type of energy beam irradiated to the resin material during the resin material curing process and the type of resin material applied during the stamper pasting process on the A and B sides, Resin cured on the B side while forming an A2 concavo-convex pattern that reverses the concavo-convex positional relationship with the A1 concavo-convex pattern of the A stamper on the resin material cured on the surface B1 convex pattern and unevenness positional relationship B stamper to form a B2 convex pattern reversed to charge.

  Therefore, according to the concavo-convex pattern forming method according to the present invention, the curing rate of the resin material layer formed on the side of the surface where the stamper is to be peeled off first (for example, the A surface) is determined. In the example, the stamper to be peeled later (in this example, the B stamper) should be peeled off first in the stamper peeling treatment by lowering the curing rate of the resin material layer formed on the B surface) side. The A stamper and the B stamper can be peeled from the base material in a desired order without causing a situation of peeling from the base material prior to the stamper (in this example, the A stamper). Thereby, according to this uneven | corrugated pattern formation method, at the time of a stamper peeling process, a base material has adhered to the A stamper which should be peeled first, it is conveyed to the process completion position with A stamper, and is piled up. Since it is possible to avoid a situation in which both of the B stamper peel from the base material at the same time and the base material falls off, the situation where the surface of the A2 concavo-convex pattern and B2 concavo-convex pattern on the base material is soiled or damaged It can be avoided.

  Moreover, according to the uneven | corrugated pattern formation method which concerns on this invention, at least 1 of the irradiation time of energy rays, the irradiation power of energy rays, and the distance between the irradiation source of energy rays and a base material is A surface and Curing rate of the layer of the resin material formed on the side of the surface on which the stamper is to be peeled first (for example, the A surface) by making the irradiation amount of the energy beam different on the A surface and the B surface. The first effect is that it can be surely and easily made lower than the curing rate of the layer of the resin material to be formed on the side (the B surface in this example) on which the stamper is to be peeled later. . Thereby, according to this uneven | corrugated pattern formation method, the stamper (A stamper in this example) which should be peeled first is reliably peeled off before the stamper (B stamper in this example) which should be peeled later. Therefore, it is possible to achieve the second effect that it is possible to reliably avoid a situation in which the surface of the A2 concavo-convex pattern and the B2 concavo-convex pattern formed on the base material is soiled or scratched.

  Moreover, according to the uneven | corrugated pattern formation method which concerns on this invention, the above-mentioned unevenness | corrugation is made by making the kind of energy ray different in A surface and B surface, and making the kind of energy beam different in A surface and B surface. Similar to the pattern forming method, the first and second effects described above can be achieved.

  Moreover, according to the uneven | corrugated pattern formation method which concerns on this invention, the resin apply | coated at the time of a stamper sticking process using the resin material from which at least one of the kind of contained polymerization initiator and content of a polymerization initiator differs By making the types of materials different between the A surface and the B surface, the first effect and the second effect described above can be achieved in the same manner as in the method for forming an uneven pattern.

  Furthermore, according to the method for forming a concavo-convex pattern according to the present invention, after the stamper peeling treatment, at least a resin material having a low curing rate is irradiated with an energy ray, whereby the stamper is peeled first (for example, an A surface). A2 unevenness having a sufficient curing rate capable of suitably performing an etching process on both the resin material layer on the side and the resin material layer on the side from which the stamper was peeled later (B surface in this example) A pattern and a B2 uneven pattern can be obtained.

  Moreover, according to the information recording medium manufacturing method according to the present invention, by manufacturing the information recording medium using the A2 uneven pattern and the B2 uneven pattern formed by any of the above uneven pattern forming methods, dirt or Since the A2 concavo-convex pattern and the B2 concavo-convex pattern are formed with high accuracy without causing scratches, the concavo-convex pattern can be formed with high accuracy on the information recording medium corresponding to the A2 concavo-convex pattern and B2 concavo-convex pattern. it can.

  Moreover, according to the resin material curing treatment apparatus according to the present invention, the curing rate of the resin material cured on the A surface (the resin material between the A surface and the A stamper of the base material) and the B surface is cured. The distance A between the A irradiation source and the A surface during the resin material curing process, and the resin material so that the curing rate of the resin material (resin material between the B surface of the base material and the B stamper) is different. The A irradiation apparatus and the B irradiation apparatus are disposed in a state where the distance B between the B irradiation source and the B surface at the time of the curing process is different from each other, and the energy beam irradiation to the resin material is performed at the time of the resin material curing process. By performing a resin material curing process that cures the resin material by irradiating energy rays with different amounts on the A surface and the B surface, the stamper should be peeled first (for example, the A surface). Resin material to be formed By setting the curing rate of the layer of this material lower than the curing rate of the layer of the resin material to be formed on the side of the surface to which the stamper is to be peeled later (B surface in this example), The A stamper and the B stamper are peeled from the base material in a desired order without causing a situation where the stamper is to be peeled off before the stamper (A stamper in this example) to be peeled first. Can do. Thereby, according to this resin material hardening processing apparatus, at the time of the stamper peeling process, the base material is stuck to the A stamper to be peeled first, and the A stamper is transported to the processing completion position and stacked. And the B stamper can be peeled off from the base material at the same time, and the base material can be prevented from falling off, so that the surface of the A2 uneven pattern and B2 uneven pattern on the base material is prevented from becoming dirty or scratched. can do.

  Moreover, according to the resin material curing treatment apparatus according to the present invention, the curing rate of the resin material cured on the A surface (the resin material between the A surface and the A stamper of the base material) and the B surface are cured. The types of the A irradiation source of the A irradiation device and the B irradiation source of the B irradiation device are different from each other so that the curing rate of the resin material (the resin material between the B surface of the base material and the B stamper) is different. A resin material that cures the resin material by irradiating the energy beam with different types of energy rays on the A surface and B surface during the resin material curing process. By executing the curing process, the same effects as those of the resin material curing apparatus can be obtained.

1 is a configuration diagram showing a configuration of a magnetic recording medium manufacturing system 1. FIG. It is a block diagram which shows the structure of the ultraviolet irradiation device. 3 is a configuration diagram showing a configuration of a stamper peeling apparatus 8. FIG. 1 is a cross-sectional view of a magnetic disk 10. FIG. 2 is a cross-sectional view of an intermediate 10x and stampers 30A and 30B for manufacturing a magnetic disk 10. FIG. It is sectional drawing of the stamper peeling apparatus 8, the intermediate body 10x, and stamper 30A, 30B of the state which hold | maintained the stamper 30A by the stamper holding | maintenance part 72a, and hold | maintained the stamper 30B by the stamper holding | maintenance part 72b. It is sectional drawing of the stamper peeling apparatus 8, the intermediate body 10x, and stamper 30A, 30B of the state which peeled the stamper 30A from the intermediate body 10x by separating the stamper holding part 72b with respect to the stamper holding part 72a. It is the top view which looked at the intermediate body holding | maintenance part 73 of the stamper peeling apparatus 8 from the lower side (A surface 10a side in the intermediate body 10x). 7 is a cross-sectional view of the stamper peeling device 8, the intermediate body 10x, and the stamper 30B in a state where the stamper 30B is held by the stamper holding part 72b and the intermediate body 10x is held by the intermediate body holding part 73. FIG. It is sectional drawing of the stamper peeling apparatus 8, the intermediate body 10x, and the stamper 30B in the state which the peeling of the stamper 30B from the intermediate body 10x was completed. It is explanatory drawing for demonstrating the relationship between the hardening rate of the layer of the resin material of each sample of Examples 1-7, and the peeling result of a stamper. It is explanatory drawing for demonstrating the relationship between the hardening rate of the layer of the resin material of each sample of Comparative Examples 1-7, and the peeling result of a stamper. FIG. 13 is an explanatory diagram for explaining a method of calculating a “curing rate” in FIGS. It is a block diagram which shows the structure of the peeling resistance measuring apparatus 8z. It is sectional drawing of the stamper peeling apparatus 8, the intermediate body 10x, and stamper 30A, 30B in the state which spaced apart the stamper holding part 72b with respect to the stamper holding part 72a.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an uneven pattern forming method, an information recording medium manufacturing method, and a resin material curing processing apparatus according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the magnetic recording medium manufacturing system 1 will be described with reference to the drawings.

  A magnetic recording medium manufacturing system 1 shown in FIG. 1 is a manufacturing system configured to be able to manufacture the magnetic disk 10 (an example of an information recording medium) shown in FIG. 4, and includes a mask pattern forming system 2 and an etching apparatus 3. ing. In this case, the magnetic disk 10 is a discrete track medium (an example of a patterned medium) that is housed in a housing together with a control device, a magnetic head, a motor, and the like (not shown) to form a hard disk drive (recording / reproducing device). Thus, the intermediate body 10x and the stampers 30A and 30B shown in FIG. 5 are used. As shown in FIG. 4, the magnetic disk 10 includes a soft magnetic layer 12, an intermediate layer 13, and a magnetic layer 14 formed in this order on the A surface 11a and the B surface 11b of the glass substrate 11, respectively. The recording data can be recorded by the vertical recording method. In each drawing referred to in this specification, the ratio of the thickness of each layer is shown as a ratio different from the actual ratio in order to facilitate understanding of the present invention.

In this magnetic disk 10, as an example, a plurality of convex portions 21 whose projecting end portions are formed of a magnetic material (magnetic layer 14) and concave portions 22 between adjacent convex portions 21 are formed, and a data track pattern or Concave and convex patterns 20a and 20b constituting the servo pattern are formed. Further, a nonmagnetic material 15 such as SiO ₂ , C (carbon), Si, Ge, a nonmagnetic metal material and a resin material is embedded in each concave portion 22 of the concavo-convex pattern 20a, 20b. Both front and back sides are flattened. Further, in the magnetic disk 10, the surface of the nonmagnetic material 15 embedded in each concave portion 22 (embedded between adjacent convex portions 21 and 21) and the magnetic layer 14 (convex portion 21) is covered. Thus, the protective layer 16 (DLC film) is formed of diamond-like carbon (DLC) or the like. Further, the surface of the protective layer 16 is coated with a lubricant (for example, a fluorine-based lubricant) for avoiding damage to both the magnetic head and the magnetic disk 10.

  Further, an intermediate 10x (an example of a “base material”) for manufacturing the magnetic disk 10 includes a soft magnetic layer 12, an intermediate layer 13, and a magnetic layer 14 on the A side of the glass substrate 11, as shown in FIG. 11a and B surface 11b are formed in this order, respectively, so that the diameter is about 48 mm and the overall thickness is about 0.6 mm. Further, as shown in FIG. 8, a central hole H is formed at the center of the intermediate body 10x for inserting the rotation shaft of the motor in the completed state.

  The glass substrate 11 is formed in a disk shape by polishing the surface of a glass plate. In addition, the board | substrate used for the intermediate body 10x (magnetic disk 10) is not limited to a glass substrate, The base material formed in disk shape with various nonmagnetic materials, such as aluminum and a ceramic, can be used. The soft magnetic layer 12 is formed into a thin film having a thickness of about 30 nm to 200 nm by sputtering a soft magnetic material such as a CoFeNb alloy. The intermediate layer 13 is a layer that functions as an underlayer for forming the magnetic layer 14, and has a thickness of about 20 to 40 nm by sputtering an intermediate layer forming material such as Ru, Cr, and CoCr nonmagnetic alloy. It is formed as a thin film. The magnetic layer 14 is a layer constituting the concavo-convex patterns 20a and 20b (the tip end side of the convex portion 21) described above, and an etching process is performed on a layer having a thickness of about 10 to 30 nm formed by sputtering a CoCrPt alloy, for example. The recesses 22 having a depth reaching the intermediate layer 13 are formed.

  As will be described later, the intermediate 10x is formed by applying the resin material 17, attaching the stampers 30A and 30B, irradiating the layer of the resin material 17 with ultraviolet rays (curing treatment of the layer of the resin material 17), and the stamper 30A. , 30B are peeled in this order, and as shown by broken lines in FIG. 5, the concave / convex pattern 50a (mask pattern: “A2 concave / convex pattern”) for forming the concave portions 22 in the magnetic layer 14 An example) and a mask layer (a layer of the resin material 17) on which the uneven pattern 50b (mask pattern: an example of “B2 uneven pattern”) is formed are formed. In this case, the layer of the resin material 17 is formed in a thin film shape having a thickness of about 10 nm to 80 nm by an ultraviolet curable resin material (an example of “energy ray curable resin material”: for example, an acrylic resin).

  The stamper 30A corresponds to the A stamper, and is formed into a disk shape having a diameter of about 80 mm and a thickness of about 0.6 mm, for example, by a resin material having optical transparency. As shown in FIG. 5, the stamper 30A includes a plurality of convex portions 41 corresponding to the concave portions 22 of the concave / convex pattern 20a and a plurality of concave portions 42 corresponding to the convex portions 21 of the concave / convex pattern 20a. A concavo-convex pattern 40a (an example of “A1 concavo-convex pattern”) is formed that is formed and reverses the concavo-convex positional relationship with the concavo-convex pattern 20a. Further, the stamper 30B corresponds to a B stamper, and is formed in a disk shape having a diameter of about 80 mm and a thickness of about 0.6 mm, for example, by a light-transmitting resin material in the same manner as the stamper 30A. Yes. The stamper 30B has a plurality of convex portions 41 corresponding to the concave portions 22 of the concave / convex pattern 20b in the magnetic disk 10 and a plurality of concave portions 42 corresponding to the convex portions 21 of the concave / convex pattern 20b. Is formed with a concavo-convex pattern 40b (an example of “B1 concavo-convex pattern”) in which the concavo-convex positional relationship is reversed. In this case, the stampers 30A and 30B are formed by injection molding using a metal stamper manufactured according to a known manufacturing method as an example. In addition, since the manufacturing method of a metal stamper and the manufacturing method of the resin stamper (stamper 30A, 30B) by injection molding are well-known, the description is abbreviate | omitted.

  On the other hand, the mask pattern forming system 2 is a system for forming the above-described concavo-convex patterns 50a and 50b (mask patterns for etching processing) on the A surface 10a and the B surface 10b of the intermediate 10x by nanoimprinting (imprint processing). As shown in FIG. 1, the apparatus includes a resin material coating device 5, a stamper sticking device 6, an ultraviolet irradiation device 7, and a stamper peeling device 8. The resin material coating device 5 is a device that executes a “stamper pasting process” in combination with the stamper pasting device 6, and as an example, the resin material is applied to the A surface 10a and the B surface 10b of the intermediate 10x by a spin coating method. 17 is applied. The stamper affixing device 6 affixes the stamper 30A to the A surface 10a of the intermediate 10x that has been applied with the resin material 17 by the resin material applicator 5, and affixes the stamper 30B to the B surface 10b.

  The ultraviolet irradiation device 7 is an example of a “resin material curing device”, and the intermediate body 10x after the attachment of the stampers 30A and 30B is completed (in the following description, the intermediate body 10x and the stampers 30A and 30B are integrated). The layer of the resin material 17 is cured by the ultraviolet rays transmitted through the stampers 30A and 30B by irradiating the laminated body 100 (also referred to as the laminate 100) with ultraviolet rays (an example of “energy rays”). Execution). Specifically, as illustrated in FIG. 2, the ultraviolet irradiation device 7 includes a transport device 61, light sources 62 a and 62 b, and a control unit 63.

  The transport device 61 transports the laminated body 100 to the irradiation position of the ultraviolet rays Ba and Bb by the light sources 62a and 62b according to the control of the control unit 63. The light source 62 a corresponds to “A irradiation source”, and in the ultraviolet irradiation device 7, as an example, an intermediate body in the stacked body 100 that includes a high-pressure mercury lamp and is transported to the irradiation processing position by the transport device 61. The light containing ultraviolet rays Ba (hereinafter referred to as “light containing ultraviolet rays Ba”) that passes through the stamper 30A through the 10 × A surface 10a (the layer of the resin material 17 applied to the A surface 10a) is simply “ultraviolet rays Ba”. (Also called). The light source 62b corresponds to “B irradiation source”, is configured to include a high-pressure mercury lamp in the same manner as the light source 62a described above, and the intermediate body 10x in the stacked body 100 transported to the irradiation processing position by the transport device 61. Light including ultraviolet Bb that is transmitted through the stamper 30B with respect to the B surface 10b (the layer of the resin material 17 applied to the B surface 10b) (hereinafter, “light including ultraviolet Bb” is also simply referred to as “ultraviolet Bb”). ).

  In this case, the ultraviolet irradiating device 7 is configured such that the “A irradiating device” and the “B irradiating device” are integrally configured so that both surfaces of the laminate 100 can be irradiated with the ultraviolet rays Ba and Bb simultaneously. Has been. Moreover, in this ultraviolet irradiation device 7, distance La between the laminated body 100 conveyed to the irradiation processing position and the light source 62a (distance between the A surface 10a of the intermediate body 10x in the laminated body 100 and the light source 62a: " Distance A ") is a distance Lb between the laminate 100 and the light source 62b conveyed to the irradiation processing position (a distance between the B surface 10b of the intermediate 10x in the laminate 100 and the light source 62b:" distance B "). The light sources 62a and 62b are attached so as to be longer than. Specifically, in this ultraviolet irradiation device 7, as an example, the light sources 62a and 62b are arranged so that the distance La is 90 mm and the distance Lb is 60 mm (“distance A and distance B”). Are arranged in different states from each other ”. As a result, when the ultraviolet rays Ba and Bb are irradiated for the same time from the light sources 62a and 62b lit at the same output toward the A surface 10a and the B surface 10b as will be described later, they are applied to the B surface 10b. The amount of ultraviolet light Ba applied to the layer of the resin material 17 applied to the A surface 10a is smaller than the amount of ultraviolet light Bb applied to the resin material 17 layer. The control unit 63 controls transport of the stacked body 100 by the transport device 61 and lighting / extinguishing of the light sources 62a and 62b.

  The stamper peeling apparatus 8 performs a stamper peeling process for peeling the stampers 30A and 30B from the intermediate 10x. As shown in FIG. 3, the stamper peeling apparatus 8 includes a moving mechanism 71, stamper holding parts 72 a and 72 b, an intermediate body holding part 73, and a control part 74. The moving mechanism 71 is held by the stamper holding portion 72a from the A surface 10a of the intermediate body 10x attached to the stamper 30B by separating the stamper holding portion 72b from the stamper holding portion 72a according to the control of the control portion 74. The stamper 30A is peeled off. In the following description, the one from which the stamper 30A has been peeled off (one in which the stamper 30B is attached to the B surface 10b and the intermediate body 10x and the stamper 30B are integrated) is also referred to as a laminated body 100a. Further, the moving mechanism 71 separates the stamper holding part 72b from the intermediate body holding part 73 according to the control of the control part 74, so that the moving mechanism 71 moves away from the B surface 10b of the intermediate body 10x held by the intermediate body holding part 73. The stamper 30B is peeled off.

  As shown in FIGS. 6 and 7, the stamper holding portions 72a and 72b are provided with a plurality of suction pads 82 on the base portion 81, and are in contact with the back surfaces of the stampers 30A and 30B (stampers 30A and 30B). The stampers 30A and 30B are held by adsorbing the back surface of 30B. Each suction pad 82 is connected to an air pump (not shown), and is configured to suck the stampers 30A and 30B when the air pump is operated. As shown in FIG. 8, the intermediate body holding portion 73 is configured to be able to hold the intermediate body 10x so as to be sandwiched when the stamper 30B is peeled from the intermediate body 10x of the stacked body 100a. Specifically, the intermediate body holding portion 73 is for four holdings for holding the intermediate body 10x in contact with the outer peripheral surface of the intermediate body 10x (an example of a surface along the thickness direction of the intermediate body 10x) at four points. A claw portion 92, and a moving mechanism (actuator or the like: not shown) that moves the holding claw portion 92 in the direction of arrow A (direction toward the center portion (center hole H) of the intermediate body 10x) and the opposite direction. It has. In this case, as shown in FIG. 8, the contact surface 92a of each holding claw portion 92 is curved so as to have an arc shape in plan view in accordance with the outer shape of the intermediate body 10x.

  The control unit 74 generally controls the stamper peeling apparatus 8. Specifically, the control unit 74 controls the air pump to cause the stamper holding portions 72a and 72b to hold (adsorb) the stampers 30A and 30B, and also controls the moving mechanism 71 as shown in FIG. Then, the stamper holding part 72b is moved to peel the stamper 30A from the intermediate 10x. Further, the control unit 74 controls the moving mechanism of the intermediate body holding portion 73 to move the holding claw portion 92 to hold the intermediate body 10x, and also controls the moving mechanism 71 as shown in FIG. Then, the stamper 30B is peeled from the intermediate body 10x by moving the stamper holding portion 72b. In this case, in this stamper peeling apparatus 8, the control unit 74 uses the contact surface 92a of each holding claw portion 92 (the surface in contact with the intermediate body 10x) to be a predetermined fixed contact with the outer peripheral surface of the intermediate body 10x. A configuration is adopted in which the amount of movement of each holding claw portion 92 by the above-described moving mechanism is adjusted so that the contact pressure is constant by contact with pressure.

  On the other hand, the etching apparatus 3 is an intermediate 10x in which the stampers 30A and 30B have been peeled off by the stamper peeling apparatus 8 (intermediate 10x in which concave and convex patterns 50a and 50b as mask patterns are formed on both layers of the resin material 17). By performing an oxygen plasma treatment on the mask pattern, the resin material (residue) remaining on the bottom surface of each recess in the mask pattern is removed, and the surface of the magnetic layer 14 is exposed from the resin material 17 on the bottom surface of the recess in the mask pattern. Then, by performing an etching process on the intermediate 10x from which the removal of the residue has been completed, the concave and convex patterns 20a and 20b are formed on both the magnetic layers 14, respectively. Note that the magnetic recording medium manufacturing system 1 is actually an apparatus that forms a layer of the nonmagnetic material 15 on the intermediate 10x in which the concavo-convex patterns 20a and 20b are formed on the magnetic layer 14 by the etching apparatus 3, and the nonmagnetic material 15 Although various devices such as a device for flattening the surface of the intermediate body 10x by etching and a device for forming the protective layer 16 are provided, these are not shown.

  Next, a method of manufacturing the magnetic disk 10 by the magnetic recording medium manufacturing system 1 will be described mainly focusing on the mask pattern (uneven pattern 50a, 50b) forming process by the mask pattern forming system 2.

  When the magnetic disk 10 is manufactured, first, the mask pattern forming system 2 uses the A surface 10a (the layer of the resin material 17 formed on the A surface 10a) and the B surface 10b (the resin material 17 formed on the B surface 10b) of the intermediate 10x. The concavo-convex patterns 40a and 40b of the stampers 30A and 30B are transferred to the layer) to form mask patterns for the etching process (concavo-convex patterns 50a and 50b: see FIG. 5). It is assumed that the production of the intermediate 10x and the stampers 30A and 30B has already been completed.

  When forming this mask pattern, first, a stamper pasting process is performed in which the stampers 30A and 30B are pasted on the A surface 10a and the B surface 10b of the intermediate 10x using the resin material coating device 5 and the stamper pasting device 6, respectively. . Specifically, as shown by a one-dot chain line in FIG. 5, the resin material 17 is spin-coated on the A surface 10 a and the B surface 10 b of the intermediate 10 x by the resin material coating apparatus 5. Next, the stampers 30 </ b> A and 30 </ b> B are attached to the intermediate body 10 x by the stamper attaching device 6. At this time, as an example, the stamper affixing device 6 adsorbs the back surface of the stamper 30A to hold the stamper 30A, and forms the concave / convex pattern 40a on the layer of the resin material 17 applied to the A surface 10a of the intermediate 10x The stamper 30A is attached to the intermediate 10x so as to be in close contact with each other. Further, the stamper attaching device 6 holds the stamper 30B by adsorbing the back surface of the stamper 30B, and makes the formation surface of the concavo-convex pattern 40b closely contact the layer of the resin material 17 applied to the B surface 10b of the intermediate 10x. Then, the stamper 30B is attached to the intermediate 10x. As a result, the intermediate 10x and the stampers 30A and 30B are brought into close contact with the layer of the resin material 17 interposed therebetween, and the stamper attaching process is completed.

  Next, an ultraviolet irradiation process is performed on the intermediate 10x on which the stampers 30A and 30B have been attached, whereby a layer of the resin material 17 between the intermediate 10x and the stamper 30A (resin applied to the A surface 10a). The layer of the material 17) and the layer of the resin material 17 between the intermediate 10x and the stamper 30B (the layer of the resin material 17 applied to the B surface 10b) are cured (execution of the resin material curing process). Specifically, the ultraviolet irradiation process (resin material curing process) is started in a state where the intermediate 10x on which the stampers 30A and 30B have been attached is set on the transport device 61 of the ultraviolet irradiation apparatus 7. At this time, the control unit 63 controls the conveying device 61 to expose the intermediate 10x to the irradiation processing position (the A surface 10a of the intermediate 10x faces the light source 62a, and the B surface 10b of the intermediate 10x faces the light source 62b. To the position where you want to move. In addition, the control unit 63 controls the light sources 62a and 62b to irradiate the intermediate 10x with ultraviolet rays Ba and Bb. At this time, since the stampers 30A and 30B are formed of a light-transmitting material, the ultraviolet light Ba emitted from the light source 62a passes through the stamper 30A and is between the A surface 10a of the intermediate 10x and the stamper 30A. The layer of the resin material 17 is irradiated, and the ultraviolet ray Bb emitted from the light source 62b passes through the stamper 30B and is irradiated to the layer of the resin material 17 between the B surface 10b of the intermediate 10x and the stamper 30B. .

  Further, as described above, in the ultraviolet irradiation device 7, the distance La between the A surface 10a and the light source 62a in the intermediate body 10x arranged at the irradiation processing position is set to be the B surface 10b and the light source 62b. Light sources 62a and 62b are attached so as to be longer than the distance Lb between them (so that the distance Lb is shorter than the distance La). Accordingly, when the intermediate body 10x is irradiated with the ultraviolet rays Ba and Bb from the light sources 62a and 62b that are turned on with the same output for the same time, the layer of the resin material 17 between the A surface 10a and the stamper 30A is applied. The amount of ultraviolet rays Ba (which is received by the layer of the resin material 17 between the A surface 10a and the stamper 30A) (hereinafter also referred to as “irradiation amount”) is applied to the B surface 10b and the stamper 30B. The amount of the ultraviolet ray Bb applied to the layer of the resin material 17 therebetween is smaller. Therefore, in the layer of the resin material 17 between the A surface 10a and the stamper 30A and the layer of the resin material 17 between the B surface 10b and the stamper 30B, a polymerization reaction corresponding to the irradiation amount of the ultraviolet rays Ba and Bb occurs. As a result, the resin material 17 layer between the A surface 10a and the stamper 30A has a lower curing rate than the resin material 17 layer between the B surface 10b and the stamper 30B. Is cured.

  As a result, the layer of the resin material 17 is cured in a state where each convex portion 41 of the uneven pattern 40a in the stamper 30A is pressed into the layer of the resin material 17 on the A surface 10a of the intermediate 10x, and the uneven pattern 40b in the stamper 30B. The layer of the resin material 17 is cured in a state where the convex portions 41 are pressed into the layer of the resin material 17 on the B surface 10b of the intermediate body 10x, and the stamper 30A, 30B is integrated with the intermediate body 10x to form the laminate 100. Manufactured. Thus, the ultraviolet irradiation process (resin material curing process) is completed.

  Next, a stamper peeling process for peeling the stampers 30A and 30B from the intermediate body 10x of the laminate 100 is performed. Specifically, when instructed to start processing, the control unit 74 attaches each suction pad 82 in the stamper holding unit 72a to the back surface of the stamper 30A in the stacked body 100 (A surface 10a of the intermediate 10x). The stamper 30A is attracted to each suction pad 82 (the stamper 30A is held) by controlling the air pump. Further, the control unit 74 controls the moving mechanism 71 to move the stamper holding unit 72b toward the stacked body 100 held by the stamper holding unit 72a (down in this example), and each of the stamper holding units 72b The suction pad 82 is brought into contact with the back surface of the stamper 30B in the laminated body 100 (the surface opposite to the surface attached to the B surface 10b of the intermediate body 10x), and the air pump is controlled to control the stamper 30B to each suction pad 82. (Stamper 30B is held). As a result, as shown in FIG. 6, the holding of the stampers 30A and 30B by the stamper holding portions 72a and 72b is completed. Regarding the holding order of the stampers 30A and 30B, the stamper 30A may be held by the stamper holding portion 72a after the stamper 30B is held by the stamper holding portion 72b.

  Subsequently, the control unit 74 controls the moving mechanism 71 to move the stamper holding unit 72b in the direction indicated by the arrow B (the stamper holding unit 72a) while maintaining the state in which the stampers 30A and 30B are held by the stamper holding units 72a and 72b. The stamper holding portion 72b is raised). In this case, at the time of the resin material curing process performed in the previous step of the stamper peeling process, the irradiation amount of the ultraviolet rays Ba to the layer of the resin material 17 on the A surface 10a side in the intermediate 10x is changed to the layer of the resin material 17 on the B surface 10b side. By setting the amount to be smaller than the irradiation amount of the ultraviolet ray Bb, the curing rate of the layer of the resin material 17 on the A surface 10a side is lower than the curing rate of the layer of the resin material 17 on the B surface 10b side. Therefore, when a force for separating the stampers 30A and 30B is applied to the laminate 100 at the same time, as shown in FIG. 7, the stamper is removed from the layer of the resin material 17 on the B surface 10b side having a high curing rate. The stamper 30A is peeled off from the layer of the resin material 17 on the side of the A surface 10a having a low curing rate without peeling off the 30B. Thereby, the peeling process of the stamper 30A from the intermediate 10x (laminated body 100) in a state of being attached to the stamper 30B is completed. The stamper 30A that has been peeled off from the stacked body 100 (intermediate body 10x) is transported from the holding position by the stamper holding portion 72a to the processing completion position by a transport mechanism (not shown).

  Next, the control unit 74 controls the moving mechanism 71 while maintaining the state in which the stamper holding unit 72b holds the stamper 30B (laminated body 100a), and moves the stamper holding unit 72b to above the intermediate body holding unit 73. Move. At this time, each holding claw portion 92 of the intermediate body holding portion 73 is moved to a position indicated by a broken line in FIG. Subsequently, the control unit 74 controls the moving mechanism 71 to lower the stamper holding unit 72 to a position where the contact surface 92a of each holding claw unit 92 and the outer peripheral surface of the intermediate body 10x face each other. Next, the control unit 74 controls each moving mechanism in the intermediate body holding unit 73 so that each holding claw portion 92 approaches the direction of the arrow A shown in FIG. (Direction). At this time, as shown in FIG. 9, the contact surface 92a of each holding claw portion 92 has a predetermined contact pressure with respect to the outer peripheral surface of the intermediate body 10x (the surface along the thickness direction of the intermediate body 10x). The intermediate body 10x is held so as to be held between the holding claws 92. Thereby, holding | maintenance of the intermediate body 10x by the intermediate body holding | maintenance part 73 is completed. In this case, since the intermediate body holding portion 73 holds the intermediate body 10x without touching the A surface 10a, a situation in which the A surface 10a of the intermediate body 10x is contaminated or damaged during the subsequent peeling process is avoided.

  Next, the control unit 74 controls the moving mechanism 71 to move the stamper holding part 72b in the direction of arrow B shown in FIG. 9 (direction away from the intermediate body holding part 73) (raises the stamper holding part 72b). . At this time, as the stamper 30B held by the stamper holding part 72b moves in the direction of the arrow B, the stamper 30B peels off from the intermediate 10x held by the intermediate holding part 73. Thereby, as shown in FIG. 10, the peeling process of the stamper 30B from the intermediate 10x is completed. The stamper 30 </ b> B that has been peeled off from the intermediate body 10 x is transported to the processing completion position by the moving mechanism 71.

  In the state in which the separation treatment of the stampers 30A and 30B is completed, a mask pattern (intermediate body) in which the concave / convex positional relationship with the concave / convex pattern 40a (an example of “A1 concave / convex pattern”) of the stamper 30A is reversed on the A surface 10a of the intermediate body 10x. An uneven pattern for etching for etching the magnetic layer 14 on the A surface 10a side in 10x: an example of “A2 uneven pattern” is formed, and the uneven pattern of the stamper 30B is formed on the B surface 10b of the intermediate 10x. 40b (an example of “B1 concavo-convex pattern”) and a mask pattern in which the concavo-convex positional relationship is reversed (concave pattern for etching treatment for etching the magnetic layer 14 on the B surface 10b side in the intermediate 10x: “B2 concavo-convex pattern”) Example) is formed. Specifically, as shown in FIG. 5, a plurality of concave portions 52 corresponding to the respective convex portions 41 of the concave / convex pattern 40a in the stamper 30A and a plurality of convex portions 51 corresponding to the respective concave portions 42 of the concave / convex pattern 40a are intermediate 10x. Are formed in the layer of the resin material 17 on the A surface 10a side, and the plurality of concave portions 52 corresponding to the convex portions 41 of the concave / convex pattern 40b and the plurality of convex portions corresponding to the concave portions 42 of the concave / convex pattern 40b in the stamper 30B. 51 is formed in the layer of the resin material 17 on the B surface 10b side in the intermediate 10x.

  Next, the intermediate 10x from which the stampers 30A and 30B have been peeled is transported to the irradiation processing position by the ultraviolet irradiation device 7, and as an example, the ultraviolet Ba is applied to the layer of the resin material 17 on the A surface 10a side of the intermediate 10x. Irradiate again. As a result, the curing rate is lower than that of the layer of the resin material 17 on the B surface 10b side because the amount of ultraviolet irradiation is smaller than that of the layer of the resin material 17 on the B surface 10b side. Further, the layer of the resin material 17 on the A surface 10a side is sufficiently cured. In addition, regarding the ultraviolet irradiation performed after the stamper peeling process, not only the resin material 17 layer on the A surface 10a side, but also the resin material 17 layer on the A surface 10a side and the B surface 10b side. You may perform with respect to both the layers of the resin material 17. FIG. The mask pattern (uneven pattern) forming process by the mask pattern forming system 2 is thus completed.

  Next, using the mask pattern formed by the mask pattern forming system 2, the etching apparatus 3 starts the etching process for the intermediate 10x. Specifically, first, by performing, for example, oxygen plasma treatment on the A surface 10a and the B surface 10b (the layers of both resin materials 17) of the intermediate 10x, the unevenness formed in the layers of both resin materials 17 The resin material 17 (residue) remaining on the bottom surface of each recess 52 in the patterns 50a and 50b (mask pattern) is removed, and the magnetic layer 14 is exposed from the layer of the resin material 17 on the bottom surface of the recess 52 in the uneven patterns 50a and 50b. Let

Next, etching is performed on both magnetic layers 14 using the layers of both resin materials 17 on which the concave and convex patterns 50a and 50b (mask patterns) are formed (the respective convex portions 51 in the concave and convex patterns 50a and 50b) as a mask. At this time, a plurality of concave portions 22 are formed in the magnetic layer 14 corresponding to the respective concave portions 52 in the concave and convex patterns 50a and 50b, and a plurality of convex portions corresponding to the respective convex portions 51 in the concave and convex patterns 50a and 50b. 21 is formed in the magnetic layer 14. Thereby, the data track pattern and the servo pattern are formed on the intermediate layer 13 (magnetic layer 14) by the concave and convex patterns 20a and 20b having the plurality of convex portions 21 and the plurality of concave portions 22. Subsequently, the layer of the resin material 17 remaining on each convex portion 21 is selectively removed by an etching process to expose the protruding end surface (the surface of the magnetic layer 14) of each convex portion 21. Next, by sputtering SiO ₂ as the nonmagnetic material 15, the formation surface of the concave and convex patterns 20 a and 20 b is covered with the nonmagnetic material 15 to form a layer (not shown) of the nonmagnetic material 15.

  Subsequently, an ion beam etching process is performed on the layer of the nonmagnetic material 15 on the magnetic layer 14 (on each convex portion 21 and each concave portion 22). At this time, as an example, the ion beam etching process is continued until the protruding end face of each convex portion 21 is exposed from the nonmagnetic material 15. Thereby, the surface of the intermediate 10x is planarized. Next, a protective layer 16 is formed by forming a diamond-like carbon (DLC) thin film by CVD so as to cover the surface of the intermediate 10x. Thereafter, a fluorine-based lubricant is applied to the surface of the protective layer 16 so as to have an average thickness of, for example, about 2 nm, thereby completing the magnetic disk 10 as shown in FIG.

  As described above, in the uneven pattern forming method using the mask pattern forming system 2, the layer of the resin material 17 cured on the A surface 10a of the intermediate 10x (the resin material between the A surface 10a of the intermediate 10x and the stamper 30A). The layer of the resin material 17 between the B surface 10b of the intermediate body 10x and the stamper 30B (the layer of the resin material 17 between the B surface 10b of the intermediate body 10x and the stamper 30B). ), The amount of ultraviolet rays Ba and Bb applied to the layer of the resin material 17 during the resin material curing process, and the layer of the resin material 17 during the resin material curing process so that the curing rate before the stamper peeling treatment differs. At least one of the types of the ultraviolet rays Ba and Bb to be applied and the type of the resin material 17 to be applied during the stamper attaching process (in this example, the resin material The amount of ultraviolet rays Ba and Bb applied to the 17th layer is different between the A surface 10a and the B surface 10b, and the concave / convex pattern 40a of the stamper 30A is reversed to the concave / convex pattern 40a of the resin material 17 cured on the A surface 10a. In addition to forming the concavo-convex pattern 50a, the concavo-convex pattern 50b whose concavo-convex positional relationship is reversed with the concavo-convex pattern 40b of the stamper 30B is formed in the layer of the resin material 17 cured on the B surface 10b.

  Therefore, according to the concavo-convex pattern forming method using the mask pattern forming system 2, the layer of the resin material 17 formed on the side of the surface on which the stamper is to be peeled first (in this example, the A surface 10a on which the stamper 30A is attached) is formed. Is made lower than the curing rate of the layer of the resin material 17 to be formed on the side where the stamper is to be peeled later (in this example, the B surface 10b to which the stamper 30B is attached), thereby removing the stamper. In some cases, the stampers 30A and 30B can be peeled from the intermediate body 10x in a desired order without causing a situation in which the stamper 30B to be peeled later is peeled off from the intermediate body 10x before the stamper 30A to be peeled first. it can. Thereby, according to the uneven | corrugated pattern formation method by this mask pattern formation system 2, at the time of stamper peeling processing, it is conveyed to the processing completion position with stamper 30A with intermediate body 10x sticking to stamper 30A to be peeled first. Since it is possible to avoid the situation where both the stampers 30A and 30B are stacked or peel off from the intermediate body 10x at the same time and the intermediate body 10x falls off, the surface of the intermediate body 10x where the concave and convex patterns 50a and 50b are formed becomes dirty. It is possible to avoid a situation in which a damage is caused.

  Further, according to the uneven pattern forming method by the mask pattern forming system 2, the irradiation time of the ultraviolet rays Ba and Bb, the irradiation power of the ultraviolet rays Ba and Bb, and the irradiation sources (light sources 62a and 62b) and intermediates of the ultraviolet rays Ba and Bb At least one of the distances to 10x (in this example, the distances La and Lb between the light sources 62a and 62b and the intermediate 10x) are made different in the A plane 10a and the B plane 10b, and the ultraviolet rays Ba and Bb. The layer of the resin material 17 formed on the side of the surface to which the stamper is to be peeled first (in this example, the A surface 10a to which the stamper 30A is attached) is made different between the A surface 10a and the B surface 10b. The layer of the resin material 17 formed on the side of the surface on which the stamper is to be peeled later (in this example, the B surface 10b on which the stamper 30B is attached) It can be reliably and easily lower than the curing rate. Thereby, according to the uneven | corrugated pattern formation method by this mask pattern formation system 2, since stamper 30A which should be peeled first can be reliably peeled before stamper 30B which should be peeled later, in intermediate body 10x It is possible to reliably avoid a situation in which the surface on which the concave / convex patterns 50a and 50b are formed is soiled or scratched.

  Furthermore, according to the concave / convex pattern forming method using the mask pattern forming system 2, a layer of the resin material 17 having a low curing rate (in this example, the resin material 17 on the A surface 10a side in the intermediate 10x) is formed after the stamper peeling process. By irradiating the layer) with ultraviolet rays Ba, both the layer of the resin material 17 on the A surface 10a side from which the stamper 30A has been peeled first and the layer of the resin material 17 on the B surface 10b side from which the stamper 30B has been peeled off later are It is possible to obtain uneven patterns 50a and 50b (mask patterns) having a sufficient curing rate that can suitably perform the etching process.

  Further, according to the ultraviolet irradiation device 7 in the mask pattern forming system 2, the layer of the resin material 17 cured on the A surface 10a (the layer of the resin material 17 between the A surface 10a of the intermediate 10x and the stamper 30A). And the curing rate of the layer of the resin material 17 cured on the B surface 10b (the layer of the resin material 17 between the B surface 10b of the intermediate 10x and the stamper 30B) are different from each other. The light sources 62a and 62b are arranged in a state in which the distance La between the A irradiation source and the A surface 10a during the curing process is different from the distance Lb between the B irradiation source and the B surface 10b during the resin material curing process. And at the time of the resin material curing process, the amount of ultraviolet rays Ba and Bb applied to the layer of the resin material 17 is made different between the A surface 10a and the B surface 10b so that the ultraviolet rays Ba, By forming a resin material curing process that cures the layer of the resin material 17 by irradiating b, the stamper is formed on the side to be peeled first (in this example, the A surface 10a to which the stamper 30A is attached). The curing rate of the layer of the resin material 17 to be made is lower than the curing rate of the layer of the resin material 17 formed on the side of the surface where the stamper is to be peeled later (the B surface 10b to which the stamper 30B is attached) in this example. Thus, the stampers 30A and 30B can be peeled from the intermediate body 10x in a desired order without causing a situation in which the stamper 30B to be peeled later is peeled off from the intermediate body 10x before the stamper 30A to be peeled first. it can. Thereby, according to this ultraviolet irradiation device 7, at the time of the stamper peeling process by the stamper peeling device 8, the intermediate 10x is adhered to the stamper 30A to be peeled first, and is transported to the processing completion position together with the stamper 30A. Or both of the stampers 30A and 30B are peeled off from the intermediate body 10x at the same time and the intermediate body 10x is dropped off. It is possible to avoid a situation in which scratches occur.

  Further, according to the information recording medium manufacturing method by the magnetic recording medium manufacturing system 1, the magnetic disk 10 is manufactured by using the concave / convex pattern 50a and the concave / convex pattern 50b formed by the concave / convex pattern forming method by the mask pattern forming system 2. Since the concavo-convex patterns 50a and 50b are formed with high accuracy without causing dirt and scratches, the concavo-convex patterns 20a and 20b are formed with high accuracy on the magnetic disk 10 corresponding to the concavo-convex patterns 50a and 50b. be able to.

  Next, the amount of energy rays applied to the resin material during the resin material curing process, the type of energy rays irradiated to the resin material during the resin material curing process, the type of resin material applied during the stamper application process, and the stamper peeling process The relationship between the curing rate of the previous resin material and the peeling results of the A stamper and B stamper during the stamper peeling treatment will be described with reference to examples and comparative examples.

  When manufacturing the magnetic disk 10 described above, the light source is set such that the distance La between the A surface 10a of the intermediate 10x and the light source 62a is longer than the distance Lb between the B surface 10b of the intermediate 10x and the light source 62b. By performing the resin material curing process using the ultraviolet irradiation device 7 provided with 62a and 62b, the irradiation amount of the ultraviolet Ba with respect to the resin material 17 on the A surface 10a side becomes the ultraviolet Bb with respect to the resin material 17 on the B surface 10b side. The curing rate of the layer of the resin material 17 on the A surface 10a side at the time when the resin material curing process is completed (before the start of the stamper peeling process) by irradiating the ultraviolet rays Ba and Bb so as to be smaller than the irradiation amount of the B surface The curing rate of the layer of the resin material 17 on the 10b side is set to be lower. Thus, as described above, when the magnetic disk 10 is manufactured, when the stamper 30A is peeled off from the intermediate body 10x (laminated body 100) during the stamper peeling process, the stamper 30B is placed in the middle before the peeling of the stamper 30A is completed. The situation of peeling from the body 10x is avoided.

  On the other hand, the applicant applied the uneven pattern forming method (“the distance between the energy beam irradiation source and the base material” adopted in the above-described manufacturing method of the magnetic disk 10 on the A surface and the B surface to make “resin "Irradiation time of energy beam" as well as "irregularity pattern forming method of forming A2 unevenness pattern and B2 unevenness pattern by differentiating" irradiation amount of energy beam to resin material at the time of material curing process "on A surface and B surface" Alternatively, by changing the “irradiation power of energy rays” on the A and B surfaces, the “irradiation amount of energy rays to the resin material during the resin material curing process” is made different on the A and B surfaces, so that the A2 uneven pattern and B2 An uneven pattern forming method for forming an uneven pattern, The “irradiation pattern forming method for forming the A2 uneven pattern and the B2 uneven pattern by differentiating the types of energy rays to be irradiated” on the A surface and the B surface, and the “kind of the resin material applied during the stamper application process” Even when the A2 concavo-convex pattern and the concavo-convex pattern forming method for forming the B2 concavo-convex pattern are adopted on the B surface, the B stamper (the above-mentioned It has been found that the situation where the stamper 30B) is peeled off from the substrate (corresponding to the intermediate 10x) can be suitably avoided.

[Example 1]
A stamper pasting process, a resin material curing process, and a stamper peeling process were performed in this order to form a concavo-convex pattern as a mask pattern on the A and B surfaces of the substrate. In this case, a resin material containing an acrylic oligomer, an acrylic monomer, and a polymerization initiator was applied to the A side and B side of the base material during the stamper sticking process. In this case, “IRGACURE907” manufactured by Ciba Specialty Chemicals Co., Ltd. was used as the polymerization initiator, and the content thereof was 0. 0 for both the resin material applied to the A surface and the resin material applied to the B surface. 1 wt% (hereinafter, this resin material is also referred to as “resin A”). Further, during the resin material curing treatment, a high-pressure mercury lamp “UVL-5601H4-O” (hereinafter referred to as “lamp A”) manufactured by Ushio Electric Co., Ltd. is applied to both the A side and B side of the base material. It was used and irradiated with light containing ultraviolet rays (hereinafter, “irradiation of light containing ultraviolet rays” is also simply referred to as “irradiation of ultraviolet rays”). In this case, the distance between the lamp A that irradiates the A surface of the substrate with ultraviolet rays and the A surface of the substrate is 90 mm, and the lamp A that irradiates the substrate B with ultraviolet rays and the substrate A In a state where the distance to the B surface is 60 mm, both lamps A are turned on at an output of 5.6 kW, and both the A surface and the B surface are irradiated with ultraviolet rays for 1 second. The resin material on the side (layer of resin material between the A surface and the A stamper) and the resin material on the B surface side (layer of resin material between the B surface and the B stamper) were cured.

[Example 2]
At the time of the resin material curing process, the output of the lamp A for irradiating the A surface of the substrate with ultraviolet rays is 1.6 kW, and the output of the lamp A for irradiating the B surface of the substrate with ultraviolet rays is 5.6 kW. In addition, the distance between the lamp A that irradiates the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A that irradiates the substrate B with ultraviolet rays and the B surface of the substrate. Both distances between and were 90 mm. Other conditions were the same as those in [Example 1].

[Example 3]
At the time of the resin material curing process, the output of the lamp A for irradiating the A surface of the substrate with ultraviolet rays is 1.6 kW, and the output of the lamp A for irradiating the B surface of the substrate with ultraviolet rays is 5.6 kW. did. Other conditions were the same as those in [Example 1].

[Example 4]
During the resin material curing process, the distance between the lamp A for irradiating the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A and the substrate for irradiating ultraviolet rays to the B surface of the substrate Both of the distances from the B surface of the material are 90 mm, and the A surface of the base material is irradiated with ultraviolet rays for 1 second, and the B surface of the base material is irradiated with ultraviolet rays for 2 seconds. did. Other conditions were the same as those in [Example 1].

[Example 5]
At the time of the resin material curing treatment, the surface A of the base material is irradiated with ultraviolet rays using a metal halide lamp “UVL-5601M4-O” (hereinafter referred to as “lamp B”) manufactured by USHIO INC. In addition, the B surface of the base material was irradiated with ultraviolet rays using the lamp A (“an energy ray source that emits energy rays having different spectrums in wavelength regions including wavelength components that contribute to the curing reaction of the resin material” An example of a configuration having an A irradiation source and a B irradiation source configured to be capable of irradiating a resin material with energy rays of different types from each other) In this case, the A surface of the substrate is irradiated with ultraviolet rays Both the distance between the lamp B and the A surface of the substrate and the distance between the lamp A and the B surface of the substrate that irradiates the B surface of the substrate with ultraviolet rays were set to 60 mm. Other Matter was the same as in Example 1].

[Example 6]
The type of resin material applied to the A surface of the base material during the stamper application process was varied. Specifically, the amount of the polymerization initiator contained in the resin material applied to the A surface of the base material is 0.1 wt% (resin A is used as the resin material applied to the A surface) and applied to the B surface. The amount of the polymerization initiator to be included in the resin material (“IRGACURE907” manufactured by Ciba Specialty Chemicals Co., Ltd.) described above was 0.2 wt% (hereinafter, a resin material containing 0.2 wt% of the polymerization initiator) Also referred to as “resin B”). In addition, during the resin material curing process, the distance between the lamp A that irradiates the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A that irradiates the B surface of the substrate with ultraviolet rays. And the distance between the B surface of the substrate and 90 mm. The other conditions were the same as those in [Example 1] (an example of a method for differentiating the type of resin material applied at the time of the stamper attaching process between the A side and the B side, and the main component (base resin) Example of a method of applying resin materials having the same type of polymerization initiator but different contents of polymerization initiator).

[Example 7]
The type of resin material applied to the A surface of the base material during the stamper application process was varied. Specifically, “IRGACURE651” manufactured by Ciba Specialty Chemicals Co., Ltd. as a polymerization initiator is used as a resin material to be applied to the A-side of the base material to the same acrylic oligomer and acrylic monomer as in Example 1. A resin material containing 1 wt% (hereinafter, this resin material is also referred to as “resin C”) was used, and resin A was used as a resin material to be applied to the B surface of the substrate. The wavelength of the absorption peak of the polymerization initiator contained in the resin A is around 304 nm, whereas the wavelength of the absorption peak of the polymerization initiator contained in the resin B is around 340 nm. In addition, during the resin material curing process, the distance between the lamp A that irradiates the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A that irradiates the B surface of the substrate with ultraviolet rays. And the distance between the B surface of the substrate and 90 mm. The other conditions were the same as those in [Example 1] (an example of a method for differentiating the type of resin material applied at the time of the stamper attaching process between the A side and the B side, and the main component (base resin) Example of a method of applying a resin material having the same type and different polymerization initiator types (absorption peak wavelengths are different).

[Comparative Example 1]
During the resin material curing process, the distance between the lamp A for irradiating the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A and the substrate for irradiating ultraviolet rays to the B surface of the substrate Both distances between the B surface of the material were 90 mm. Other conditions were the same as those in [Example 1].

[Comparative Example 2]
During the resin material curing process, the distance between the lamp A for irradiating the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A and the substrate for irradiating ultraviolet rays to the B surface of the substrate Both distances between the B surface of the material were 60 mm. Other conditions were the same as those in [Example 1].

[Comparative Example 3]
During the resin material curing process, the distance between the lamp A for irradiating the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A and the substrate for irradiating ultraviolet rays to the B surface of the substrate Both the distances from the B surface of the material were 90 mm, and the outputs of both lamps A were 1.6 kW, respectively. Other conditions were the same as those in [Example 1].

[Comparative Example 4]
During the resin material curing process, the distance between the lamp A for irradiating the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A and the substrate for irradiating ultraviolet rays to the B surface of the substrate Both of the distances from the B surface of the material were 90 mm, and both the A surface and the B surface were irradiated with ultraviolet rays for 2 seconds. Other conditions were the same as those in [Example 1].

[Comparative Example 5]
During the resin material curing treatment, both the A surface and B surface of the substrate were irradiated with ultraviolet rays using the lamp B. In this case, the distance between the lamp B that irradiates the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp B that irradiates the substrate B with ultraviolet rays and the B surface of the substrate. Both distances between the two were 60 mm. Other conditions were the same as those in [Example 1].

[Comparative Example 6]
Resin B was used as the resin material applied to the A side of the base material and the resin material applied to the B side during the stamper pasting treatment. In addition, during the resin material curing process, the distance between the lamp A that irradiates the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A that irradiates the B surface of the substrate with ultraviolet rays. And the distance between the B surface of the substrate and 90 mm. Other conditions were the same as those in [Example 1].

[Comparative Example 7]
Resin C was used as the resin material applied to the A side of the substrate and the resin material applied to the B side during the stamper application process. In addition, during the resin material curing process, the distance between the lamp A that irradiates the A surface of the substrate with ultraviolet rays and the A surface of the substrate, and the lamp A that irradiates the B surface of the substrate with ultraviolet rays. And the distance between the B surface of the substrate and 90 mm. Other conditions were the same as those in [Example 1].

About said Examples 1-7 and Comparative Examples 1-7, the illumination intensity (mW / cm < ² >) of the lamp | ramp A (or lamp | ramp B) at the time of resin material hardening process, and the resin material layer at the time of resin material hardening process are irradiated UV light quantity (mJ / cm ² ), cure rate (%) of the resin material after the resin material curing treatment, peeling resistance (kgf) of the A stamper and B stamper during the stamper peeling treatment, and A to FIGS. 11 and 12 show the peeling results of whether or not the stamper has been peeled first.

The illuminance (mW / cm ² ) and the amount of light (mJ / cm ² ) were measured using “Micro Cure” manufactured by EIT. Furthermore, about hardening rate (%), resin is obtained by ATR method (total reflection method) using FT-IR (Fourier transform infrared spectrophotometer) (FTS-6000) manufactured by Bio-Rad (BIO-RAD). Absorbance measured by measuring the absorbance at the peak position due to the double bond that contributes to the polymerization of the material (as an example, the peak position due to in-plane bending vibration of vinyl group C—H: wave number = 1410 cm ⁻¹ ). It was calculated based on the residual ratio of the peak intensity before and after UV irradiation.

In this case, when measuring absorbance using this type of measuring apparatus, a certain amount of measurement error may occur each time the measurement process is performed. For this reason, as shown in FIG. 13, the absorbance of a single sample measured before the ultraviolet irradiation (broken line) and the absorbance measured after the ultraviolet irradiation (solid line) directly affect the curing reaction of the resin material. Absorbance peak position due to irrelevant bond (peak position where absorbance hardly changes in principle before and after UV irradiation: as an example, peak position due to “C═O” stretching vibration: wave number = The absorbance values at the peak position in the vicinity of 1730 cm ⁻¹ may be measured as different values. In addition, in the same figure, the measured value before and behind ultraviolet irradiation about the A surface in the sample of Example 1 is illustrated as an example. In this case, in this type of resin material, the peak position itself may slightly change before and after the ultraviolet irradiation (before and after the curing treatment). Specifically, in the sample of Example 1, for example, the peak position due to “C═O” stretching vibration before ultraviolet irradiation (before curing treatment) is 1728 cm ⁻¹ , whereas after the ultraviolet irradiation (curing treatment). The peak position resulting from “C═O” stretching vibration in the latter) is 1733 cm ⁻¹ .

Therefore, for the absorbance used to calculate the residual ratio of peak intensity, in order to eliminate the effects of measurement errors for each measurement process and the effects of changes in the peak position itself before and after UV irradiation (before and after the curing process), The value obtained by subtracting the background noise from the peak intensity (absorbance) in the vicinity of wave number = 1730 cm ⁻¹ in the measurement value obtained by the above, and the value obtained by subtracting the background noise from the peak intensity (absorbance) in the vicinity of wave number = 1410 cm ⁻¹ The value normalized based on was used. Specifically, the background from each measured process, peak "wavenumber = 1410 cm peak intensity at around ^-1 minus the background noise from the (absorbance)" in the vicinity "wave number = 1730 cm ^-1 intensity (absorbance) A value obtained by dividing by “a value obtained by subtracting noise” was calculated as “absorbance used for calculation of residual ratio of peak intensity”.

In addition, the above “remaining ratio of peak intensity” is the “peak intensity after irradiation with ultraviolet light (after curing treatment) (value at normalized“ wave number = 1410 cm ⁻¹ ”)” before “irradiation with ultraviolet light ( It was calculated by dividing by the peak intensity (before the curing treatment) (value in the vicinity of “wave number = 1410 cm ⁻¹ ” after normalization) ”. Furthermore, the curing rate (%) is a ratio that sets the curing rate before irradiation with ultraviolet rays (before the curing process) to 0%, and was calculated based on the formula “(1−residual ratio) × 100”. Specifically, for the A-plane in the sample of Example 1, the “peak intensity after ultraviolet irradiation” is “0.036999” and the “peak intensity before ultraviolet irradiation” is “0.318543”. Therefore, the “remaining ratio of peak intensity” is calculated as “0.036999 / 0.318543≈0.116151”. Therefore, the “curing rate (%)” of the A surface in the sample of Example 1 is calculated as “(1−0.116151) × 100≈88.4”.

  Moreover, about peeling resistance (kgf), it is the conditions similar to each condition of Examples 1-7 and Comparative Examples 1-7, and the layer of the resin material of the A surface side and B for each Example and each Comparative Example Samples for measuring the peel resistance each having a layer of the resin material on the surface side were manufactured, and each sample for measuring the peel resistance was measured using a peel resistance measuring device 8z shown in FIG. In this case, the peeling resistance measuring device 8z has, for example, the same configuration as the stamper holding portion 72b and the intermediate body holding portion 73 of the stamper peeling device 8 in the magnetic recording medium manufacturing system 1 (mask pattern forming system 2) described above. A configuration for holding a sample base material and a stamper is employed. Therefore, the same components as those of the stamper holding unit 72b and the intermediate body holding unit 73 in the stamper peeling apparatus 8 are denoted by the same reference numerals, and redundant description is omitted. In this peeling resistance measuring device 8z, the base material of each sample is held by the intermediate body holding portion 73, and the stamper of each sample is held by the stamper holding portion 72b. In this state, the base portion 81 of the stamper holding portion 72b A configuration is adopted in which the force gauge 87 is moved so as to be pulled by the moving mechanism 71z, whereby the peeling resistance (the pulling force required for peeling) is measured by the force gauge 87. In this case, the moving mechanism 71z includes a linear guide 86 that linearly moves the force gauge 87 and a motor 85 as a power source.

  Further, regarding the peeling results, 10 samples were manufactured for each example and each comparative example, and the stamper peeling process was performed on these samples. The number of samples peeled first and the number of samples peeled off simultaneously by both AB stampers were investigated. The investigation results are shown in FIGS.

  As shown in FIG. 11, the sample of Example 1 in which the concavo-convex pattern was formed by the same method as the method of forming the concavo-convex patterns 50a and 50b at the time of manufacturing the magnetic disk 10 described above (“energy beam irradiation source and substrate and In an example in which a concavo-convex pattern is formed by a method in which the “distance between” is made different between the A surface and the B surface and the irradiation amount of energy rays is made different between the A surface and the B surface), the resin material layer on the B surface side is cured. While the rate was 93.4%, the curing rate of the A-side resin material layer was 88.4%, and the A-side resin material layer was more than the B-side resin material layer. The cure rate was low by 5.0%. As a result, the peel resistance when the A stamper is peeled from the A-side resin material layer is 0.9 kgf smaller than the peel resistance when the B stamper is peeled from the B-side resin material layer. As a result, in all 10 samples, the A stamper peeled before the B stamper.

  On the other hand, in the sample of Example 2 (an example in which the concavo-convex pattern was formed by a method in which the “irradiation power of the energy beam” is different between the A and B surfaces and the energy beam irradiation amount is different between the A and B surfaces) The distance between the A surface of the base material and the lamp A and the distance between the B surface of the base material and the lamp A at the time of the resin material curing process are set to 90 mm which are equal to each other. The output of the lamp A that irradiates ultraviolet rays onto the A surface of the base material is made smaller than the output of the lamp A that irradiates ultraviolet rays onto the B surface of the base material, so that the resin material layer on the A surface side is irradiated. The amount of ultraviolet light applied is smaller than the amount of ultraviolet light applied to the resin material layer on the B-side. For this reason, in the sample of Example 2, the curing rate of the resin material layer on the B surface side was 88.4%, whereas the curing rate of the resin material layer on the A surface side was 84.1%. The layer of the resin material on the A surface side was in a state where the curing rate was lower by 4.3% than the layer of the resin material on the B surface side. As a result, the peel resistance when the A stamper is peeled from the A surface side resin material layer is a value smaller by 0.6 kgf than the peel resistance when the B stamper is peeled from the B surface side resin material layer. As a result, in all 10 samples, the A stamper peeled before the B stamper.

  In addition, the sample of Example 3 (“Distance between energy beam irradiation source and substrate” and “Energy beam irradiation power” are both different on the A and B surfaces, and the amount of energy beam irradiation is set to A In the example in which the concavo-convex pattern is formed by a method of making the surface and the B surface different, the curing rate of the resin material layer on the B surface side is 93.4%, whereas the resin material layer on the A surface side is The curing rate was 84.1%, and the A-side resin material layer was lower by 9.3% than the B-side resin material layer. As a result, the peeling resistance when the A stamper is peeled from the A-side resin material layer is 1.5 kgf smaller than the peeling resistance when the B-stamper is peeled from the B-side resin material layer. As a result, in all 10 samples, the A stamper peeled before the B stamper.

  Further, in the sample of Example 4 (an example in which an uneven pattern was formed by a method in which the “irradiation time of energy rays” is different between the A and B surfaces and the amount of irradiation of energy rays is different between the A and B surfaces) When the resin material is cured, the amount of ultraviolet light applied to the A-side resin material layer is smaller than the amount of ultraviolet light applied to the B-side resin material layer (in this example, 1/2). It has become. For this reason, in the sample of Example 4, the curing rate of the resin material layer on the B surface side was 93.7%, whereas the curing rate of the resin material layer on the A surface side was 88.4%. The layer of the resin material on the A surface side had a lower curing rate by 5.3% than the layer of the resin material on the B surface side. As a result, the peel resistance when the A stamper is peeled from the A-side resin material layer is 1.0 kgf smaller than the peel resistance when the B stamper is peeled from the B-side resin material layer. As a result, in all 10 samples, the A stamper peeled before the B stamper.

  Furthermore, the sample of Example 5 (an example in which a concavo-convex pattern was formed by a method in which the types of energy rays to be irradiated are different on the A and B planes with different “types of energy beam irradiation sources” on the A and B planes ), The amount of ultraviolet light applied to the A-side resin material layer by the lamp B during the resin material curing process and the amount of ultraviolet light applied to the B-side resin material layer by the lamp A are approximately equal to each other. It is the same amount. In this case, in the sample of Example 5, the amount of light at the time of ultraviolet irradiation to the A surface and the B surface was almost the same, but the wavelength component of the light emitted from the lamp B and the wavelength of the light emitted from the lamp A Due to the difference from the components, the progress of the curing reaction of the resin material by the light emitted from the lamp B is slower than the progress of the curing reaction of the resin material by the light emitted from the lamp A. The curing rate of the resin material layer on the surface side is 93.4%, whereas the curing rate of the resin material layer on the A surface side is 86.8%, and the resin material layer on the A surface side is B The curing rate was 6.6% lower than that of the resin material layer on the surface side. As a result, the peeling resistance when the A stamper is peeled from the A-side resin material layer is 1.3 kgf smaller than the peeling resistance when the B stamper is peeled from the B-side resin material layer. As a result, in all 10 samples, the A stamper peeled before the B stamper.

  An energy ray source (for example, the “lamp A” described above) that radiates the same kind of energy rays is disposed on both the A surface and the B surface, and as an example, an energy ray source disposed on the A surface side and By disposing a filter that attenuates the wavelength component that contributes to the curing reaction of the resin material between the sample and the sample, A-type and B-type sides of the sample are irradiated with different types of energy rays (for example, ultraviolet rays). (Including an energy source that emits the same type of energy rays and a filter that varies the type of energy rays emitted, and by changing the spectrum of the energy rays emitted from the energy source by the filter, An example of a configuration having an A irradiation source and a B irradiation source configured to be able to irradiate different types of energy rays to a resin material). Even when an apparatus having such a configuration is used, the wavelength component contributing to the curing reaction of the resin material in the energy rays emitted from the A irradiation source (energy ray source and filter) on the A plane side is attenuated by the filter. Therefore, the progress of the curing reaction of the resin material on the B surface side is slower than the progress of the curing reaction of the resin material on the A surface side in the same manner as the sample of Example 5 above. The curing rate of this layer is lower than the curing rate of the layer of the resin material on the B surface side. As a result, the peeling resistance when peeling the A stamper from the A-side resin material layer is smaller than the peeling resistance when peeling the B stamper from the B-side resin material layer. The applicant has confirmed that the A stamper peels before the B stamper.

  In addition, the sample of Example 6 (the main component (base resin) is the same, the content of the polymerization initiator is different on the A side and the B side, and the type of the resin material applied during the stamper application process is the A side and In the example in which the uneven pattern is formed by a method of making the difference on the B surface), the amount of ultraviolet rays irradiated to the resin material layer on the A surface side and the resin material layer on the B surface side during the resin material curing treatment is However, in the sample of Example 6, the curing rate of the layer of the resin material (resin B) on the B side where the polymerization initiator content is large is 92.7%. On the other hand, the curing rate of the layer of the A-side resin material (resin A) with a low polymerization initiator content is 88.4%, and the A-side resin material layer is the B-side resin material. The curing rate was lower by 4.3% than the above layer. As a result, the peel resistance when the A stamper is peeled from the A surface side resin material layer is a value smaller by 0.6 kgf than the peel resistance when the B stamper is peeled from the B surface side resin material layer. As a result, in all 10 samples, the A stamper peeled before the B stamper.

  Further, the sample of Example 7 (the main component (base resin) is the same, the type of the polymerization initiator to be included is different on the A side and the B side, and the type of the resin material applied during the stamping process is A side. In the example in which the concavo-convex pattern is formed by different methods on the B surface and the B surface, the amount of ultraviolet light irradiated to the A surface side resin material layer and the B surface side resin material layer during the resin material curing treatment is A In the sample of Example 7, the curing rate of the layer of the resin material (resin A) on the B surface side was 88.4%, while the same amount was obtained on both the A surface and the B surface. The curing rate of the layer of the resin material on the side (resin C) is 83.2%, and the curing rate of the resin material layer on the A side is lower by 5.2% than the layer of the resin material on the B side. became. As a result, the peel resistance when the A stamper is peeled from the A-side resin material layer is 0.7 kgf smaller than the peel resistance when the B stamper is peeled from the B-side resin material layer. As a result, in all 10 samples, the A stamper peeled before the B stamper.

  On the other hand, as shown in FIG. 12, the kind of the lamp at the time of the resin material curing process, the lamp output, the distance between the lamp and the base material, and the kind of the resin material to be applied at the stamper attaching process (resin material In the samples of Comparative Examples 1 to 7 in which the concavo-convex pattern was formed so that the amount of the polymerization initiator contained in or the type of polymerization initiator) was equal to each other on both the A surface and the B surface, the resin material was cured The curing rate of the layers of both resin materials after the treatment and the peeling resistance of both AB stampers during the stamper peeling treatment were equal to each other on the A and B sides of the substrate. For this reason, as shown in the figure, in the samples of Comparative Examples 1 to 7, the A stamper peeled off the B stamper first in 4 to 6 of the 10 samples, and the 10 samples In 3-5 sheets of them, the B stamper peels earlier than the A stamper. In Comparative Examples 1 to 4, 6, both AB stampers are peeled from the substrate at the same time in several samples. Invited to fall. As described above, in the samples of Comparative Examples 1 to 7, variation occurred in the peeling result as to which of the AB both stampers was peeled first.

  As in Examples 1 to 4 above, the resin material cured on the A surface by making the irradiation amount of the energy beam to the resin material different during the resin material curing treatment on the A surface and the B surface is cured before the stamper peeling treatment. The method of differentiating the rate and the curing rate of the resin material cured on the B surface before the stamper peeling process, as in Example 5 above, is the type of energy rays applied to the resin material during the resin material curing process. A method of making the curing rate before the stamper peeling treatment of the resin material cured on the A surface different from the curing rate before the stamper peeling treatment of the resin material cured on the B surface by making the surface and the B surface different, or As in Examples 6 and 7 above, the type of resin material applied during the stamper application process (in this example, the content of the polymerization initiator or included) The type of initiator is different between the A side and the B side so that the curing rate of the resin material cured on the A side before the stamper peeling treatment and the curing rate of the resin material cured on the B side before the stamper peeling treatment By adopting the method of differentiating the above, it can be understood that the peeling resistance of the stamper during the stamper peeling treatment is different between the A side and the B side. In addition, it is understood that the stamper to be peeled first (A stamper in this example) can be peeled first because the peeling resistance of the stamper is different between the A surface and the B surface by the above methods. it can.

  Thus, the unevenness | corrugation in the sample of Example 1 and 3 which made the irradiation amount of an ultraviolet-ray differ in A surface and B surface by making the distance between an ultraviolet irradiation source and a base material differ in A surface and B surface Pattern forming method, method of forming concave / convex pattern in samples of Examples 2 and 3 in which the irradiation amount of ultraviolet rays is different between the A and B surfaces by making the irradiation power of the ultraviolet rays different between the A and B surfaces, and the irradiation time of the ultraviolet rays According to the method for forming a concavo-convex pattern in the sample of Example 4 in which the irradiation amount of ultraviolet rays is made different between the A surface and the B surface by making the A surface and the B surface different, the surface on which the stamper is to be peeled first (this example Then, the curing rate of the resin material layer to be formed on the A surface side is more accurate than the curing rate of the resin material layer to be formed on the surface (B surface in this example) to be peeled later. And it is possible to obtain the first effect that it is possible to easily lower. Thereby, according to the uneven | corrugated pattern formation method in the sample of this Example 1-4, since the stamper which should be peeled first can be reliably peeled ahead of the stamper which should be peeled later, the unevenness | corrugation in a base material It is possible to achieve a second effect that it is possible to reliably avoid a situation in which the pattern forming surface is soiled or scratched.

  Moreover, according to the uneven | corrugated pattern formation method in the sample of Example 5 which made the ultraviolet light type different in A surface and B surface by making the kind of ultraviolet irradiation source different in A surface and B surface, Example 1 The first effect and the second effect described above can be obtained in the same manner as in the method for forming a concavo-convex pattern in Sample No. 4.

  In addition, the uneven pattern in the sample of Example 7 in which the type of the polymerization initiator contained in the A side and the B side is made different so that the type of the resin material applied during the stamper attaching process is made different in the A side and the B side. Forming of the uneven pattern in the sample of Example 6 in which the type of resin material applied in the stamper application process is made different between the A side and the B side by making the formation method and the polymerization initiator content different on the A side and the B side. According to the method, the first effect and the second effect described above can be obtained in the same manner as in the method for forming a concavo-convex pattern in the samples of Examples 1 to 5.

  Moreover, according to the ultraviolet irradiation apparatus (resin material curing processing apparatus) used at the time of manufacture of the samples of Examples 1 and 3, the curing rate of the layer of the resin material cured on the A surface and the resin cured on the B surface The distance between the A irradiation source and the A surface during the resin material curing process (90 mm in this example) and the B irradiation source and B during the resin material curing process so that the curing rate of the material layer is different. The light source is disposed in a state in which the distance from the surface (60 mm in this example) is different from each other, and the amount of ultraviolet rays applied to the layer of the resin material during the resin material curing process is set on the A surface and the B surface. By performing a resin material curing process in which the layers of both resin materials are cured by irradiating ultraviolet rays in a different manner, the resin material formed on the side of the surface (in this example, the A surface) to be peeled first is removed. The cure rate of the layer, The stamper to be peeled later is earlier than the stamper to be peeled first by lowering the curing rate of the layer of the resin material formed on the side to be peeled off (the B surface in this example). Both stampers can be peeled from the base material in a desired order without causing a situation of peeling from the base material. Thereby, according to this ultraviolet irradiation device (resin material curing processing device), at the time of the stamper peeling process, the base material is stuck to the stamper to be peeled first, and it is conveyed and stacked together with the stamper to the processing completion position. Since it is possible to avoid the situation where both stampers are peeled off from the base material at the same time and the base material falls off, it is possible to avoid the situation where the surface of the base material where the uneven pattern is formed becomes dirty or scratched.

  In addition, according to the ultraviolet irradiation device (resin material curing processing device) used at the time of manufacturing the sample of Example 5, the curing rate of the resin material layer cured on the A surface and the resin material cured on the B surface The A irradiation source (lamp A) of the A irradiation device and the B irradiation source (lamp B) of the B irradiation device are configured with different types of irradiation sources so that the curing rate of the layer is different. During the resin material curing process, by performing the resin material curing process in which the type of ultraviolet rays irradiated to the resin material is different between the A surface and the B surface and the layers of both resin materials are cured by irradiating the ultraviolet rays. The same effects as those of the ultraviolet irradiation device (resin material curing processing device) used during the production of the samples of Examples 1 and 3 can be obtained.

  A light source 62a for irradiating the A surface 10a of the intermediate body 10x with the ultraviolet light Ba and a light source 62b for irradiating the B surface 10b of the intermediate body 10x with the ultraviolet light Bb are opposed to each other so that the A surface 10a and the B surface 10b. Although the example which performs the resin layer hardening process using the ultraviolet irradiation device 7 of the structure irradiated simultaneously with ultraviolet rays Ba and Bb was demonstrated, the structure of the resin material hardening process and the structure of the resin material hardening processing apparatus are as follows. It is not limited to this. For example, an A irradiation device that irradiates energy rays onto the A surface of the substrate and a B irradiation device that irradiates energy rays onto the B surface of the substrate are separately disposed (a light source 62a and a light source 62b). Using a resin material curing processing apparatus (arranged without facing each other) (apparatus corresponding to the ultraviolet irradiation apparatus 7 in the mask pattern forming system 2 described above: not shown) separately for the A plane and the B plane (time Energy rays can be irradiated at the time of shift (not at the same time). Specifically, as an example, the light source 62a and the light source 62b can be shifted from each other in the transport direction of the intermediate 10x.

  In this case, at the time of the resin layer curing process by the resin material curing processing apparatus in which the A irradiation apparatus and the B irradiation apparatus are separately arranged, the energy beam irradiation time is set to be different between the A plane and the B plane. In order to make the difference between the surface B and the surface B, the time for the base material to pass through the A irradiation device in a state where the irradiation sources of the A irradiation device and the B irradiation device are turned on (that is, the passing speed and the irradiation time) And the time for the base material to pass through the B irradiation apparatus (that is, the passage speed and the irradiation time) can be adopted. Further, in any of the resin material curing processing apparatus in which the A irradiation source and the B irradiation source are arranged to face each other and the resin material curing processing apparatus in which the A irradiation source and the B irradiation source are separately arranged, the irradiation time of the energy beam Energy beam between the A irradiation source and the substrate, and between the B irradiation source and the substrate, in order to make the irradiation amount of the energy beam different between the A surface and the B surface. By providing a restricting member such as a shutter that restricts the passage of light and controlling the opening and closing timing of the restricting member, the irradiation time of the energy beam on the A surface and the irradiation time of the energy beam on the B surface can be made different.

  Moreover, in the stamper peeling apparatus 8 in the mask pattern forming system 2 described above, when the stamper 30A is peeled off from the laminated body 100 (intermediate body 10x), the moving mechanism 71 and the stamper holding portions 72a and 72b are used. Adopting a configuration that uses the moving mechanism 71, the stamper holding portion 72b, and the intermediate body holding portion 73 when peeling the stamper 30B (a configuration that shares the moving mechanism 71 and the stamper holding portion 72b when peeling the stampers 30A and 30B). However, a configuration is employed in which a separate and independent stamper holding portion and moving mechanism (the stamper holding portion 72b and the moving mechanism 71 in the above example) are used during the peeling process of the stamper 30A and the peeling process of the stamper 30B. You can also

  Furthermore, although the example which uses the resin stamper (stamper 30A, 30B) formed with the resin material by injection molding using a metal stamper has been described, the configurations of the A stamper and the B stamper are not limited thereto. Specifically, it is only necessary to be able to transmit energy rays for curing the resin material applied to the base material. As an example, a stamper formed in a flat plate shape using quartz can be used as the A stamper and the B stamper. . Further, the method for manufacturing the magnetic disk 10 by etching the magnetic layer 14 using the concave / convex patterns 50a and 50b (mask pattern) formed by the mask pattern forming system 2 as a mask has been described. ) Is not limited to this. Specifically, as an example, a metal material layer for forming a metal mask is formed in advance between the intermediate 10x and the layer of the resin material 17, and the metal material layer is formed using the above-described concave / convex patterns 50a and 50b. An uneven pattern (metal mask pattern) is formed on the magnetic layer 14 (metal material layer) in the intermediate 10x by performing an etching process on the intermediate 10x, and an etching process using the metal mask pattern as a mask is performed. A magnetic disk similar to the magnetic disk 10 described above can also be manufactured.

  Furthermore, the base material, the A stamper, and the B stamper are not limited to those having a circular shape in plan view, and a concavo-convex pattern can be formed using base materials, A stamper, and B stamper in various plan view shapes. Moreover, the energy rays irradiated at the time of the resin material curing treatment are not limited to ultraviolet rays, and include electromagnetic waves such as radiation other than ultraviolet rays and particle beams such as electron beams. In addition, the concavo-convex pattern forming method, the information recording medium manufacturing method, and the resin material curing processing apparatus are not limited to the method and apparatus to be executed at the time of manufacturing the magnetic recording medium such as the magnetic disk 10, and the optical disk and The above-described method and apparatus can be applied when manufacturing magneto-optical disks and semiconductor elements.

DESCRIPTION OF SYMBOLS 1 Magnetic recording medium manufacturing system 2 Mask pattern formation system 3 Etching apparatus 5 Resin material coating apparatus 6 Stamper sticking apparatus 7 Ultraviolet irradiation apparatus 8 Stamper peeling apparatus 10 Magnetic disk 10a A surface 10b B surface 10x Intermediate body 11a A surface 11b B surface 17 Resin material 20a, 20b, 40a, 40b, 50a, 50b Uneven pattern 21, 41, 51 Convex part 22, 42, 52 Concave part 30A, 30B Stamper 61 Conveying device 62a, 62b Light source 63 Control part 71 Moving mechanism 72a, 72b Stamper holding Part 73 Intermediate body holding part 74 Control part 100, 100a Laminate Ba, Bb Ultraviolet ray La, Lb Distance

Claims (8)

  An energy ray curable resin material is applied to the A and B surfaces of the base material, and an A stamper with an A1 concavo-convex pattern is applied to the A surface, and a B stamper with a B1 concavo-convex pattern is applied to the B surface. A stamper affixing process to be applied to the surface, a resin material curing process for irradiating the A surface and the B surface with energy rays to cure the resin material, and the A stamper from the resin material cured on the A surface. A stamper peeling process is performed to peel off the B stamper from the resin material cured on the B surface and the A1 uneven pattern and the uneven positional relationship are reversed on the resin material cured on the A surface. The B1 uneven pattern is formed on the resin material which is formed on the A surface and cured on the B surface. When the B2 concavo-convex pattern in which the concavo-convex positional relationship is reversed is formed on the B surface, the curing rate of the resin material cured on the A surface before the stamper peeling treatment and the resin material cured on the B surface The amount of energy rays applied to the resin material during the resin material curing process, and the energy irradiated to the resin material during the resin material curing process so that the curing rate before the stamper peeling process is different Forming the concavo-convex pattern for forming the A2 concavo-convex pattern and the B2 concavo-convex pattern by differentiating at least one of the type of the line and the type of the resin material applied during the stamper attaching process on the A surface and the B surface Method.   At least one of the irradiation time of the energy beam, the irradiation power of the energy beam, and the distance between the irradiation source of the energy beam and the base material is made different in the A surface and the B surface. The uneven | corrugated pattern formation method of Claim 1 which makes the irradiation amount of a line differ in the said A surface and the said B surface.   The uneven | corrugated pattern formation method of Claim 1 or 2 which makes the kind of the said energy ray different in the said A surface and the said B surface, and makes the kind of the said energy ray different in the said A surface and the said B surface.   The types of the polymerization initiators to be applied and the types of the resin materials applied at the time of the stamper pasting treatment using the resin materials having at least one of the different contents of the polymerization initiators are the A side and the B The uneven | corrugated pattern formation method in any one of Claim 1 to 3 made to differ in a surface.   The uneven | corrugated pattern formation method in any one of Claim 1 to 4 which irradiates the said energy beam at least to the said resin material with the said low curing rate after the said stamper peeling process.   An information recording medium manufacturing method for manufacturing an information recording medium using the A2 uneven pattern and the B2 uneven pattern formed by the uneven pattern forming method according to claim 1. An energy ray curable resin material is applied to the A surface and the B surface, the A stamper is attached to the A surface, and the substrate on which the B stamper is attached to the B surface is irradiated with energy rays. A resin material curing processing apparatus that performs a resin material curing process for curing the resin material,
An A irradiation device that includes an A irradiation source and irradiates the energy beam onto the A surface, and a B irradiation device that includes a B irradiation source and irradiates the energy beam onto the B surface, The A irradiation source and the A surface during the resin material curing process so that the curing rate of the resin material cured on the A surface and the curing rate of the resin material cured on the B surface are different. And the distance B between the B irradiation source and the B surface at the time of the resin material curing process are arranged different from each other, and at the time of the resin material curing process, the resin The resin material hardening processing apparatus which irradiates the said energy ray by making the irradiation amount of the said energy ray with respect to material differ in the said A surface and the said B surface. An energy ray curable resin material is applied to the A surface and the B surface, the A stamper is attached to the A surface, and the substrate on which the B stamper is attached to the B surface is irradiated with energy rays. A resin material curing processing apparatus that performs a resin material curing process for curing the resin material,
An A irradiation device that includes an A irradiation source and irradiates the energy beam onto the A surface, and a B irradiation device that includes a B irradiation source and irradiates the energy beam onto the B surface, The A irradiation source and the B irradiation with different types of irradiation sources so that the curing rate of the resin material cured on the A surface and the curing rate of the resin material cured on the B surface are different. A resin material curing process in which a source is configured and the type of the energy beam irradiated on the resin material is different between the A surface and the B surface during the resin material curing process. apparatus.

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